ST72324(J,K)x Datasheet by STMicroelectronics

April 2008 Rev. 5 1/164

ST72324Jx ST72324Kx

5V RANGE 8-BIT MCU WITH 8 TO 32K FLASH,

10-BIT ADC, 4 TIMERS, SPI, SCI INTERFACE

NOT FOR NEW DESIGN

■Memories

– 8 to 32K dual voltage High Density Flash (HD-

Flash) with read-out protection capability. In-

Application Programming and In-Circuit Pro-

gramming for HDFlash devices

– 384 to 1K bytes RAM

– HDFlash endurance: 100 cycles, data reten-

tion: 20 years at 55°C

■Clock, Reset And Supply Management

– Enhanced low voltage supervisor (LVD) for

main supply with programmable reset thresh-

olds and auxiliary voltage detector (AVD) with

interrupt capability

– Clock sources: crystal/ceramic resonator os-

cillators, internal RC oscillator, clock security

system and bypass for external clock

– PLL for 2x frequency multiplication

– Four Power Saving Modes: Halt, Active-Halt,

Wait and Slow

■Interrupt Management

– Nested interrupt controller

– 10 interrupt vectors plus TRAP and RESET

– 9/6 external interrupt lines (on 4 vectors)

■Up to 32 I/O Ports

– 32/24 multifunctional bidirectional I/O lines

– 22/17 alternate function lines

– 12/10 high sink outputs

■4 Timers

– Main Clock Controller with: Real time base,

Beep and Clock-out capabilities

– Configurable watchdog timer

– 16-bit Timer A with: 1 input capture, 1 output

compare, external clock input, PWM and

pulse generator modes

– 16-bit Timer B with: 2 input captures, 2 output

compares, PWM and pulse generator modes

■2 Communication Interfaces

– SPI synchronous serial interface

– SCI asynchronous serial interface

■1 Analog Peripheral (low current coupling)

– 10-bit ADC with up to 12 robust input ports

■Instruction Set

– 8-bit Data Manipulation

– 63 Basic Instructions

– 17 main Addressing Modes

– 8 x 8 Unsigned Multiply Instruction

■Development Tools

– Full hardware/software development package

– In-Circuit Testing capability

Device Summary

TQFP44

10 x 10

SDIP42

600 mil

SDIP32

400 mil

TQFP32

7 x 7

Features ST72324J6

ST72324K61

ST72324J4

ST72324K41

ST72324J2

ST72324JK21

Program memory -

bytes Flash 32K Flash 16K Flash 8K

RAM (stack) - bytes 1024 (256) 512 (256) 384 (256)

Voltage Range 3.8V to 5.5V

Temp. Range up to -40°C to +125°C

Packages SDIP42, TQFP44 10x10,SDIP32, TQFP32 7x7

1For new designs in standard and industrial applications, use ST72324B(J/K) order codes, refer to separate datasheet

Table of Contents

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1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.3 STRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.3.1 Read-out Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.4 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4.5 ICP (IN-CIRCUIT PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.6 IAP (IN-APPLICATION PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.7 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.7.1 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.3 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.1 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.2 MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.3 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.3.2 Asynchronous External RESET pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.3.3 External Power-On RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6.3.4 Internal Low Voltage Detector (LVD) RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6.3.5 Internal Watchdog RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6.4 SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

6.4.1 Low Voltage Detector (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

6.4.2 Auxiliary Voltage Detector (AVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

6.4.3 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

6.4.4 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

7.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

7.2 MASKING AND PROCESSING FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

7.3 INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

7.4 CONCURRENT & NESTED MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

7.5 INTERRUPT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

7.6 EXTERNAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.6.1 I/O Port Interrupt Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7.7 EXTERNAL INTERRUPT CONTROL REGISTER (EICR) . . . . . . . . . . . . . . . . . . . . . . . 38

8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.2 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.3 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

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8.4 ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

8.4.1 ACTIVE-HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

8.4.2 HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.2.1 Input Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.2.2 Output Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.2.3 Alternate Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

9.4 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

9.5 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

9.5.1 I/O Port Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

10 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

10.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

10.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

10.1.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

10.1.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

10.1.4 How to Program the Watchdog Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

10.1.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

10.1.6 Hardware Watchdog Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

10.1.7 Using Halt Mode with the WDG (WDGHALT option) . . . . . . . . . . . . . . . . . . . . . . . 54

10.1.8 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

10.1.9 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

10.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK AND BEEPER (MCC/RTC) . 56

10.2.1 Programmable CPU Clock Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

10.2.2 Clock-out Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

10.2.3 Real Time Clock Timer (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

10.2.4 Beeper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

10.2.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

10.2.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

10.2.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

10.3 16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

10.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

10.3.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

10.3.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

10.3.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

10.3.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

10.3.6 Summary of Timer modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

10.3.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

10.4 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

10.4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

10.4.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

10.4.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

10.4.4 Clock Phase and Clock Polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

10.4.5 Error Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

10.4.6 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

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10.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

10.4.8 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

10.5 SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

10.5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

10.5.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

10.5.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

10.5.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

10.5.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

10.5.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

10.5.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

10.6 10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

10.6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

10.6.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

10.6.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

10.6.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

10.6.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

10.6.6 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

11 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

11.1 CPU ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

11.1.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

11.1.2 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

11.1.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

11.1.4 Indexed (No Offset, Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

11.1.5 Indirect (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

11.1.6 Indirect Indexed (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

11.1.7 Relative mode (Direct, Indirect) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

11.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

12 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

12.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

12.1.1 Minimum and Maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

12.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

12.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

12.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

12.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

12.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

12.2.1 Voltage Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

12.2.2 Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

12.2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

12.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

12.3.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

12.4 LVD/AVD CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

12.4.1 Operating Conditions with Low Voltage Detector (LVD) . . . . . . . . . . . . . . . . . . . . 119

12.4.2 Auxiliary Voltage Detector (AVD) Thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

12.5 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

12.5.1 CURRENT CONSUMPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

12.5.2 Supply and Clock Managers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122

12.5.3 On-Chip Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

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12.6 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

12.6.1 General Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

12.6.2 External Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

12.6.3 Crystal and Ceramic Resonator Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

12.6.4 RC Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

12.6.5 PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

12.7 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

12.7.1 RAM and Hardware Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

12.7.2 FLASH Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

12.8 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

12.8.1 Functional EMS (Electro Magnetic Susceptibility) . . . . . . . . . . . . . . . . . . . . . . . . 130

12.8.2 Electro Magnetic Interference (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

12.8.3 Absolute Maximum Ratings (Electrical Sensitivity) . . . . . . . . . . . . . . . . . . . . . . . . 132

12.9 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

12.9.1 General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

12.9.2 Output Driving Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

12.10 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

12.10.1Asynchronous RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

12.10.2ICCSEL/VPP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

12.11 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

12.11.116-Bit Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

12.12 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 140

12.12.1SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

12.13 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

12.13.1Analog Power Supply and Reference Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

12.13.2General PCB Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

12.13.3ADC Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

13 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

13.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

13.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

13.3 SOLDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149

14 ST72324 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . 150

14.1 FLASH OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

14.2 FLASH DEVICE ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

14.3 SILICON IDENTIFICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154

14.4 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155

14.4.1 Socket and Emulator Adapter Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156

14.5 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

15 KNOWN LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

15.1 ALL DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

15.1.1 External RC option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

15.1.2 CSS Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

15.1.3 Safe Connection of OSC1/OSC2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

15.1.4 Unexpected Reset Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

15.1.5 Clearing active interrupts outside interrupt routine . . . . . . . . . . . . . . . . . . . . . . . . 159

15.1.6 External Interrupt Missed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

Table of Contents

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15.1.7 16-bit Timer PWM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

15.1.8 SCI Wrong Break duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

15.2 FLASH DEVICES ONLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

15.2.1 Internal RC Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

16 IMPORTANT NOTES ON ST72F324B FLASH DEVICES: . . . . . . . . . . . . . . . . . . . . . . . . . . 162

16.1 RESET PIN LOGIC LEVELS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

16.2 WAKE-UP FROM ACTIVE HALT MODE USING EXTERNAL INTERRUPTS . . . . . . . 162

16.3 PLL JITTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

16.4 ACTIVE HALT POWER CONSUMPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

16.5 TIMER A REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

17 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163

To obtain the most recent version of this datasheet,

please check at www.st.com>products>technical literature>datasheet.

Please also pay special attention to the Section “KNOWN LIMITATIONS” on page 159.

Z 3 3 3

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1 INTRODUCTION

The ST72324 devices are members of the ST7 mi-

crocontroller family designed for the 5V operating

range.

– The 32-pin devices are designed for mid-range

applications

– The 42/44-pin devices target the same range of

applications requiring more than 24 I/O ports.

For a description of the differences between

ST72324 and ST72324B devices refer to Section

14.2 on page 152

All devices are based on a common industry-

standard 8-bit core, featuring an enhanced instruc-

tion set and are available with FLASH program

memory.

Under software control, all devices can be placed

in WAIT, SLOW, ACTIVE-HALT or HALT mode,

reducing power consumption when the application

is in idle or stand-by state.

The enhanced instruction set and addressing

modes of the ST7 offer both power and flexibility to

software developers, enabling the design of highly

efficient and compact application code. In addition

to standard 8-bit data management, all ST7 micro-

controllers feature true bit manipulation, 8x8 un-

signed multiplication and indirect addressing

modes.

Figure 1. Device Block Diagram

8-BIT CORE

ALU

ADDRESS AND DATA BUS

OSC1

VPP

CONTROL

PROGRAM

(8K - 32K Bytes)

VDD

RESET

PORT F

PF7:6,4,2:0

TIMER A

BEEP

PORT A

RAM

(384 - 1024 Bytes)

PORT C

10-BIT ADC

VAREF

VSSA

PORT B PB4:0

PORT E

PE1:0

(2 bits)

SCI

TIMER B

PA7:3

(5 bits on J devices)

PORT D

PD5:0 SPI

PC7:0

(8 bits)

VSS

WATCHDOG

OSC

LVD

OSC2

MEMORY

MCC/RTC/BEEP

(4 bits on K devices)

(5 bits on J devices)

(3 bits on K devices)

(6 bits on J devices)

(2 bits on K devices)

(6 bits on J devices)

(5 bits on K devices)

23:32:232222323 {\ U D ) C :::::::::::::::

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2 PIN DESCRIPTION

Figure 2. 42-Pin SDIP and 44-Pin TQFP Package Pinouts

MCO / AIN8 / PF0

BEEP / (HS) PF1

(HS) PF2

OCMP1_A / AIN10 / PF4

ICAP1_A / (HS) PF6

EXTCLK_A / (HS) PF7

VDD_0

VSS_0

AIN5 / PD5

VAREF

VSSA

44 43 42 41 40 39 38 37 36 35 34

12 13 14 15 16 17 18 19 20 21 22

ei2

ei3

ei0

ei1

PB3

(HS) PB4

AIN0 / PD0

AIN1 / PD1

AIN2 / PD2

AIN3 / PD3

AIN4 / PD4

RDI / PE1

PB0

PB1

PB2

PC6 / SCK / ICCCLK

PC5 / MOSI / AIN14

PC4 / MISO / ICCDATA

PC3 (HS) / ICAP1_B

PC2 (HS) / ICAP2_B

PC1 / OCMP1_B / AIN13

PC0 / OCMP2_B / AIN12

VSS_1

VDD_1

PA3 (HS)

PC7 / SS / AIN15

VSS_2

RESET

VPP / ICCSEL

PA7 (HS)

PA6 (HS)

PA5 (HS)

PA4 (HS)

PE0 / TDO

VDD_2

OSC1

OSC2

(HS) PB4

AIN0 / PD0

AIN12 / OCMP2_B / PC0

EXTCLK_A / (HS) PF7

ICAP1_A / (HS) PF6

AIN10 / OCMP1_A / PF4

(HS) PF2

BEEP / (HS) PF1

MCO / AIN8 / PF0

AIN5 / PD5

AIN4 / PD4

AIN3 / PD3

AIN2 / PD2

AIN1 / PD1

VSSA

VAREF

PB3

PB2

PA4 (HS)

PA5 (HS)

PA6 (HS)

PA7 (HS)

VPP / ICCSEL

RESET

VSS_2

VDD_2

PE0 / TDO

PE1 / RDI

PB0

PB1

OSC1

OSC2

ei3

ei0

ei2

ei1

AIN14 / MOSI / PC5

ICCDATA / MISO / PC4

ICAP1_B / (HS) PC3

ICAP2_B/ (HS) PC2

AIN13 / OCMP1_B / PC1 26

22 PC6 / SCK / ICCCLK

PC7 / SS / AIN15

PA3 (HS)

VDD_1

VSS_1

eix associated external interrupt vector

(HS) 20mA high sink capability

jjjjjjjjjjjjjjj: (\ ( \I/ \l/ EECEECEEEEEEECEE

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PIN DESCRIPTION (Cont’d)

Figure 3. 32-Pin SDIP Package Pinout

Figure 4. 32-Pin TQFP 7x7 Package Pinout

(HS) PB4

AIN0 / PD0

AIN14 / MOSI / PC5

ICCDATA/ MISO / PC4

ICAP1_B / (HS) PC3

ICAP2_B / (HS) PC2

AIN13 / OCMP1_B / PC1

AIN12 / OCMP2_B / PC0

EXTCLK_A / (HS) PF7

BEEP / (HS) PF1

MCO / AIN8 / PF0

VSSA

VAREF

AIN1 / PD1

ICAP1_A / (HS) PF6

OCMP1_A / AIN10 / PF4

PB3

PB0

PC6 / SCK / ICCCLK

PC7 / SS / AIN15

PA3 (HS)

PA4 (HS)

PA6 (HS)

PA7 (HS)

VPP / ICCSEL

OSC2

OSC1

VDD_2

PE0 / TDO

PE1 / RDI

VSS_2

RESET

ei0

ei3 ei2

ei1

eix associated external interrupt vector

(HS) 20mA high sink capability

ICCDATA / MISO / PC4

AIN14 / MOSI / PC5

ICCCLK / SCK / PC6

AIN15 / SS / PC7

(HS) PA3

AIN13 / OCMP1_B / PC1

ICAP2_B / (HS) PC2

ICAP1_B / (HS) PC3

32 31 30 29 28 27 26 2524

9 10111213141516

ei1

ei3

ei0

OCMP1_A / AIN10 / PF4

ICAP1_A / (HS) PF6

EXTCLK_A / (HS) PF7

AIN12 / OCMP2_B / PC0

VAREF

VSSA

MCO / AIN8 / PF0

BEEP / (HS) PF1

VPP / ICCSEL

PA7 (HS)

PA6 (HS)

PA4 (HS)

OSC1

OSC2

VSS_2

RESET

PB0

PE1 / RDI

PE0 / TDO

VDD_2

PD1 / AIN1

PD0 / AIN0

PB4 (HS)

PB3

ei2

eix associated external interrupt vector

(HS) 20mA high sink capability

ST72324Jx ST72324Kx

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PIN DESCRIPTION (Cont’d)

For external pin connection guidelines, refer to See “ELECTRICAL CHARACTERISTICS” on page 116.

Legend / Abbreviations for Table 1:

Type: I = input, O = output, S = supply

Input level: A = Dedicated analog input

In/Output level: C = CMOS 0.3VDD/0.7VDD

CT= CMOS 0.3VDD/0.7VDD with input trigger

Output level: HS = 20mA high sink (on N-buffer only)

Port and control configuration:

– Input: float = floating, wpu = weak pull-up, int = interrupt 1), ana = analog ports

– Output: OD = open drain 2), PP = push-pull

Refer to “I/O PORTS” on page 45 for more details on the software configuration of the I/O ports.

The RESET configuration of each pin is shown in bold. This configuration is valid as long as the device is

in reset state.

Table 1. Device Pin Description

Pin n°

Pin Name

Type

Level Port Main

function

(after

reset)

Alternate Function

TQFP44

SDIP42

TQFP32

SDIP32

Input

Output

Input Output

float

wpu

int

ana

6 1 30 1 PB4 (HS) I/O CTHS Xei3 X X Port B4

7 2 31 2 PD0/AIN0 I/O CTXX X X X Port D0 ADC Analog Input 0

8 3 32 3 PD1/AIN1 I/O CTXX X X X Port D1 ADC Analog Input 1

9 4 PD2/AIN2 I/O CTXX X X X Port D2 ADC Analog Input 2

10 5 PD3/AIN3 I/O CTXX X X X Port D3 ADC Analog Input 3

11 6 PD4/AIN4 I/O CTXX X X X Port D4 ADC Analog Input 4

12 7 PD5/AIN5 I/O CTXX X X X Port D5 ADC Analog Input 5

13 8 1 4 VAREF S Analog Reference Voltage for ADC

14 9 2 5 VSSA S Analog Ground Voltage

15 10 3 6 PF0/MCO/AIN8 I/O CTXei1 X X X Port F0 Main clock

out (fCPU)

ADC Analog

Input 8

16 11 4 7 PF1 (HS)/BEEP I/O CTHS Xei1 X X Port F1 Beep signal output

17 12 PF2 (HS) I/O CTHS Xei1 X X Port F2

18 13 5 8 PF4/OCMP1_A/

AIN10 I/O CTXXXXXPort F4

Timer A Out-

put Com-

pare 1

ADC Analog

Input 10

19 14 6 9 PF6 (HS)/ICAP1_A I/O CTHS XX X X Port F6 Timer A Input Capture 1

20 15 7 10 PF7 (HS)/

EXTCLK_A I/O CTHS XXXXPort F7

Timer A External Clock

Source

21 VDD_0 S Digital Main Supply Voltage

22 VSS_0 S Digital Ground Voltage

23 16 8 11 PC0/OCMP2_B/

AIN12 I/O CTXXXXXPort C0

Timer B Out-

put Com-

pare 2

ADC Analog

Input 12

£1

ST72324Jx ST72324Kx

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Notes:

1. In the interrupt input column, “eiX” defines the associated external interrupt vector. If the weak pull-up

24 17 9 12 PC1/OCMP1_B/

AIN13 I/O CTXXXXXPort C1

Timer B Out-

put Com-

pare 1

ADC Analog

Input 13

25 18 10 13 PC2 (HS)/ICAP2_B I/O CTHS XX X X Port C2 Timer B Input Capture 2

26 19 11 14 PC3 (HS)/ICAP1_B I/O CTHS XX X X Port C3 Timer B Input Capture 1

27 20 12 15 PC4/MISO/ICCDA-

TA I/O CTXXXXPort C4

SPI Master

In / Slave

Out Data

ICC Data In-

put

28 21 13 16 PC5/MOSI/AIN14 I/O CTXXXXXPort C5

SPI Master

Out / Slave

In Data

ADC Analog

Input 14

29 22 14 17 PC6/SCK/ICCCLK I/O CTXXXXPort C6

SPI Serial

Clock

ICC Clock

Output

30 23 15 18 PC7/SS/AIN15 I/O CTXXXXXPort C7

SPI Slave

Select (ac-

tive low)

ADC Analog

Input 15

31 24 16 19 PA3 (HS) I/O CTHS Xei0 X X Port A3

32 25 VDD_1 S Digital Main Supply Voltage

33 26 VSS_1 S Digital Ground Voltage

34 27 17 20 PA4 (HS) I/O CTHS XXXXPort A4

35 28 PA5 (HS) I/O CTHS XXXXPort A5

36 29 18 21 PA6 (HS) I/O CTHS XTPort A6 1)

37 30 19 22 PA7 (HS) I/O CTHS XTPort A7 1)

38 31 20 23 VPP /ICCSEL I

Must be tied low. In the flash pro-

gramming mode, this pin acts as the

programming voltage input VPP. See

Section 12.10.2 for more details.

39 32 21 24 RESET I/O CTTop priority non maskable interrupt.

40 33 22 25 VSS_2 S Digital Ground Voltage

41 34 23 26 OSC2 O Resonator oscillator inverter output

42 35 24 27 OSC1 I External clock input or Resonator os-

cillator inverter input

43 36 25 28 VDD_2 S Digital Main Supply Voltage

44 37 26 29 PE0/TDO I/O CTXX X X Port E0 SCI Transmit Data Out

1 382730 PE1/RDI I/O C

TXX X X Port E1 SCI Receive Data In

2 392831 PB0 I/OC

TXei2 X X Port B0

Caution: Negative current

injection not allowed on this

pin5)

3 40 PB1 I/O CTXei2 X X Port B1

4 41 PB2 I/O CTXei2 X X Port B2

5 422932 PB3 I/O C

TXei2 X X Port B3

Pin n°

Pin Name

Type

Level Port Main

function

(after

reset)

Alternate Function

TQFP44

SDIP42

TQFP32

SDIP32

Input

Output

Input Output

float

wpu

int

ana

ST72324Jx ST72324Kx

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column (wpu) is merged with the interrupt column (int), then the I/O configuration is pull-up interrupt input,

else the configuration is floating interrupt input.

2. In the open drain output column, “T” defines a true open drain I/O (P-Buffer and protection diode to VDD

are not implemented). See See “I/O PORTS” on page 45. and Section 12.9 I/O PORT PIN CHARACTER-

ISTICS for more details.

3. OSC1 and OSC2 pins connect a crystal/ceramic resonator, or an external source to the on-chip oscil-

lator; see Section 1 INTRODUCTION and Section 12.6 CLOCK AND TIMING CHARACTERISTICS for

more details.

4. On the chip, each I/O port has 8 pads. Pads that are not bonded to external pins are in input pull-up con-

figuration after reset. The configuration of these pads must be kept at reset state to avoid added current

consumption.

5. For details refer to Section 12.9.1 on page 133

£1

ST72324Jx ST72324Kx

13/164

3 REGISTER & MEMORY MAP

As shown in Figure 5, the MCU is capable of ad-

dressing 64K bytes of memories and I/O registers.

The available memory locations consist of 128

bytes of register locations, up to 1024 bytes of

RAM and up to 32 Kbytes of user program memo-

ry. The RAM space includes up to 256 bytes for

the stack from 0100h to 01FFh.

The highest address bytes contain the user reset

and interrupt vectors.

IMPORTANT: Memory locations marked as “Re-

served” must never be accessed. Accessing a re-

served area can have unpredictable effects on the

device.

Figure 5. Memory Map

0000h

RAM

Program Memory

(32K, 16K or 8K)

Interrupt & Reset Vectors

HW Registers

0080h

007Fh

7FFFh

(see Table 2)

8000h

FFDFh

FFE0h

FFFFh (see Table 8)

0480h Reserved

047Fh

Short Addressing

RAM (zero page)

256 Bytes Stack

16-bit Addressing

RAM

0100h

01FFh

027Fh

0080h

0200h

00FFh

32 KBytes

8000h

FFFFh

(1024,

or 047Fh

16 KBytes

C000h

512 or 384 Bytes)

8 Kbytes

E000h

ST72324Jx ST72324Kx

14/164

Table 2. Hardware Register Map

Address Block Register

Label Register Name Reset

Status Remarks

0000h

0001h

0002h

Port A 2) PADR

PADDR

PAOR

Port A Data Register

Port A Data Direction Register

Port A Option Register

00h1)

00h

R/W

0003h

0004h

0005h

Port B 2) PBDR

PBDDR

PBOR

Port B Data Register

Port B Data Direction Register

Port B Option Register

00h1)

00h

R/W

0006h

0007h

0008h

Port C

PCDR

PCDDR

PCOR

Port C Data Register

Port C Data Direction Register

Port C Option Register

00h1)

00h

R/W

0009h

000Ah

000Bh

Port D 2) PDADR

PDDDR

PDOR

Port D Data Register

Port D Data Direction Register

Port D Option Register

00h1)

00h

R/W

000Ch

000Dh

000Eh

Port E 2) PEDR

PEDDR

PEOR

Port E Data Register

Port E Data Direction Register

Port E Option Register

00h1)

00h

R/W

R/W2)

000Fh

0010h

0011h

Port F 2) PFDR

PFDDR

PFOR

Port F Data Register

Port F Data Direction Register

Port F Option Register

00h1)

00h

R/W

0012h

0020h

Reserved Area (15 Bytes)

0021h

0022h

0023h

SPI

SPIDR

SPICR

SPICSR

SPI Data I/O Register

SPI Control Register

SPI Control/Status Register

xxh

0xh

00h

R/W

0024h

0025h

0026h

0027h ITC

ISPR0

ISPR1

ISPR2

ISPR3

Interrupt Software Priority Register 0

Interrupt Software Priority Register 1

Interrupt Software Priority Register 2

Interrupt Software Priority Register 3

FFh

R/W

0028h EICR External Interrupt Control Register 00h R/W

0029h FLASH FCSR Flash Control/Status Register 00h R/W

002Ah WATCHDOG WDGCR Watchdog Control Register 7Fh R/W

002Bh SI SICSR System Integrity Control Status Register xxh R/W

002Ch

002Dh MCC MCCSR

MCCBCR

Main Clock Control / Status Register

Main Clock Controller: Beep Control Register

00h

R/W

002Eh

0030h

Reserved Area (3 Bytes)

£1

ST72324Jx ST72324Kx

15/164

0031h

0032h

0033h

0034h

0035h

0036h

0037h

0038h

0039h

003Ah

003Bh

003Ch

003Dh

003Eh

003Fh

TIMER A

TACR2

TACR1

TACSR

TAIC1HR

TAIC1LR

TAOC1HR

TAOC1LR

TACHR

TACLR

TAACHR

TAACLR

TAIC2HR

TAIC2LR

TAOC2HR

TAOC2LR

Timer A Control Register 2

Timer A Control Register 1

Timer A Control/Status Register3)4)

Timer A Input Capture 1 High Register

Timer A Input Capture 1 Low Register

Timer A Output Compare 1 High Register

Timer A Output Compare 1 Low Register

Timer A Counter High Register

Timer A Counter Low Register

Timer A Alternate Counter High Register

Timer A Alternate Counter Low Register

Timer A Input Capture 2 High Register3)

Timer A Input Capture 2 Low Register3)

Timer A Output Compare 2 High Register4)

Timer A Output Compare 2 Low Register4)

00h

xxxx x0xxb

xxh

80h

00h

FFh

FCh

FFh

FCh

xxh

80h

00h

R/W

Read Only

R/W

Read Only

R/W

0040h Reserved Area (1 Byte)

0041h

0042h

0043h

0044h

0045h

0046h

0047h

0048h

0049h

004Ah

004Bh

004Ch

004Dh

004Eh

004Fh

TIMER B

TBCR2

TBCR1

TBCSR

TBIC1HR

TBIC1LR

TBOC1HR

TBOC1LR

TBCHR

TBCLR

TBACHR

TBACLR

TBIC2HR

TBIC2LR

TBOC2HR

TBOC2LR

Timer B Control Register 2

Timer B Control Register 1

Timer B Control/Status Register

Timer B Input Capture 1 High Register

Timer B Input Capture 1 Low Register

Timer B Output Compare 1 High Register

Timer B Output Compare 1 Low Register

Timer B Counter High Register

Timer B Counter Low Register

Timer B Alternate Counter High Register

Timer B Alternate Counter Low Register

Timer B Input Capture 2 High Register

Timer B Input Capture 2 Low Register

Timer B Output Compare 2 High Register

Timer B Output Compare 2 Low Register

00h

xxxx x0xxb

xxh

80h

00h

FFh

FCh

FFh

FCh

xxh

80h

00h

R/W

Read Only

R/W

Read Only

R/W

0050h

0051h

0052h

0053h

0054h

0055h

0056h

0057h

SCI

SCISR

SCIDR

SCIBRR

SCICR1

SCICR2

SCIERPR

SCIETPR

SCI Status Register

SCI Data Register

SCI Baud Rate Register

SCI Control Register 1

SCI Control Register 2

SCI Extended Receive Prescaler Register

Reserved area

SCI Extended Transmit Prescaler Register

C0h

xxh

00h

x000 0000h

00h

---

00h

Read Only

R/W

0058h

006Fh

Reserved Area (24 Bytes)

0070h

0071h

0072h

ADC

ADCCSR

ADCDRH

ADCDRL

Control/Status Register

Data High Register

Data Low Register

00h

R/W

Read Only

0073h

007Fh Reserved Area (13 Bytes)

Address Block Register

Label Register Name Reset

Status Remarks

ST72324Jx ST72324Kx

16/164

Legend: x=undefined, R/W=read/write

Notes:

1. The contents of the I/O port DR registers are readable only in output configuration. In input configura-

tion, the values of the I/O pins are returned instead of the DR register contents.

2. The bits associated with unavailable pins must always keep their reset value.

3. The Timer A Input Capture 2 pin is not available (not bonded).

– In Flash devices:

The TAIC2HR and TAIC2LR registers are not present. Bit 5 of the TACSR register (ICF2) is forced

by hardware to 0. Consequently, the corresponding interrupt cannot be used.

4. The Timer A Output Compare 2 pin is not available (not bonded).

– The TAOC2HR and TAOC2LR Registers are write only, reading them will return undefined values.

Bit 4 of the TACSR register (OCF2) is forced by hardware to 0. Consequently, the corresponding in-

terrupt cannot be used.

Caution: The TAIC2HR and TAIC2LR registers and the ICF2 and OCF2 flags are not present in Flash de-

vices but are present in the emulator. For compatibility with the emulator, it is recommended to perform a

dummy access (read or write) to the TAIC2LR and TAOC2LR registers to clear the interrupt flags.

8K ”G G G 16K GGGGG £1 ++

ST72324Jx ST72324Kx

17/164

4 FLASH PROGRAM MEMORY

4.1 Introduction

The ST7 dual voltage High Density Flash

(HDFlash) is a non-volatile memory that can be

electrically erased as a single block or by individu-

al sectors and programmed on a Byte-by-Byte ba-

sis using an external VPP supply.

The HDFlash devices can be programmed and

erased off-board (plugged in a programming tool)

or on-board using ICP (In-Circuit Programming) or

IAP (In-Application Programming).

The array matrix organisation allows each sector

to be erased and reprogrammed without affecting

other sectors.

4.2 Main Features

■Three Flash programming modes:

– Insertion in a programming tool. In this mode,

all sectors including option bytes can be pro-

grammed or erased.

– ICP (In-Circuit Programming). In this mode, all

sectors including option bytes can be pro-

grammed or erased without removing the de-

vice from the application board.

– IAP (In-Application Programming) In this

mode, all sectors except Sector 0, can be pro-

grammed or erased without removing the de-

vice from the application board and while the

application is running.

■ICT (In-Circuit Testing) for downloading and

executing user application test patterns in RAM

■Read-out protection

■Register Access Security System (RASS) to

prevent accidental programming or erasing

4.3 Structure

The Flash memory is organised in sectors and can

be used for both code and data storage.

Depending on the overall Flash memory size in the

microcontroller device, there are up to three user

sectors (see Table 3). Each of these sectors can

be erased independently to avoid unnecessary

erasing of the whole Flash memory when only a

partial erasing is required.

The first two sectors have a fixed size of 4 Kbytes

(see Figure 6). They are mapped in the upper part

of the ST7 addressing space so the reset and in-

terrupt vectors are located in Sector 0 (F000h-

FFFFh).

Table 3. Sectors available in Flash devices

4.3.1 Read-out Protection

Read-out protection, when selected, provides a

protection against Program Memory content ex-

traction and against write access to Flash memo-

ry. Even if no protection can be considered as to-

tally unbreakable, the feature provides a very high

level of protection for a general purpose microcon-

troller.

In flash devices, this protection is removed by re-

programming the option. In this case, the entire

program memory is first automatically erased.

Read-out protection selection depends on the de-

vice type:

– In Flash devices it is enabled and removed

through the FMP_R bit in the option byte.

– In ROM devices it is enabled by mask option

specified in the Option List.

Figure 6. Memory Map and Sector Address

Flash Size (bytes) Available Sectors

4K Sector 0

8K Sectors 0,1

> 8K Sectors 0,1, 2

4 Kbytes

2Kbytes

SECTOR 1

SECTOR 0

16 Kbytes

SECTOR 2

8K 16K 32K 60K FLASH

FFFFh

EFFFh

DFFFh

3FFFh

7FFFh

1000h

24 Kbytes

MEMORY SIZE

8Kbytes 40 Kbytes 52 Kbytes

9FFFh

BFFFh

D7FFh

4K 10K 24K 48K

C sessxo

ST72324Jx ST72324Kx

18/164

FLASH PROGRAM MEMORY (Cont’d)

4.4 ICC Interface

ICC needs a minimum of 4 and up to 6 pins to be

connected to the programming tool (see Figure 7).

These pins are:

– RESET: device reset

–V

SS: device power supply ground

– ICCCLK: ICC output serial clock pin

– ICCDATA: ICC input/output serial data pin

– ICCSEL/VPP: programming voltage

– OSC1(or OSCIN): main clock input for exter-

nal source (optional)

–V

DD: application board power supply (option-

al, see Figure 7, Note 3)

Figure 7. Typical ICC Interface

Notes:

1. If the ICCCLK or ICCDATA pins are only used

as outputs in the application, no signal isolation is

necessary. As soon as the Programming Tool is

plugged to the board, even if an ICC session is not

in progress, the ICCCLK and ICCDATA pins are

not available for the application. If they are used as

inputs by the application, isolation such as a serial

resistor has to implemented in case another de-

vice forces the signal. Refer to the Programming

Tool documentation for recommended resistor val-

ues.

2. During the ICC session, the programming tool

must control the RESET pin. This can lead to con-

flicts between the programming tool and the appli-

cation reset circuit if it drives more than 5mA at

high level (push pull output or pull-up resistor<1K).

A schottky diode can be used to isolate the appli-

cation RESET circuit in this case. When using a

classical RC network with R>1K or a reset man-

agement IC with open drain output and pull-up re-

sistor>1K, no additional components are needed.

In all cases the user must ensure that no external

reset is generated by the application during the

ICC session.

3. The use of Pin 7 of the ICC connector depends

on the Programming Tool architecture. This pin

must be connected when using most ST Program-

ming Tools (it is used to monitor the application

power supply). Please refer to the Programming

Tool manual.

4. Pin 9 has to be connected to the OSC1 or OS-

CIN pin of the ST7 when the clock is not available

in the application or if the selected clock option is

not programmed in the option byte. ST7 devices

with multi-oscillator capability need to have OSC2

grounded in this case.

ICC CONNECTOR

ICCDATA

ICCCLK

RESET

VDD

HE10 CONNECTOR TYPE

APPLICATION

POWER SUPPLY

246810

975 3

PROGRAMMING TOOL

ICC CONNECTOR

APPLICATION BOARD

ICC Cable

(See Note 3)

10kΩ

VSS

ICCSEL/VPP

ST7

CL2 CL1

OSC1

OSC2

OPTIONAL

See Note 1

See Note 2

APPLICATION

RESET SOURCE

APPLICATION

I/O

(See Note 4)

IN SOME CASES

£1

ST72324Jx ST72324Kx

19/164

FLASH PROGRAM MEMORY (Cont’d)

4.5 ICP (In-Circuit Programming)

To perform ICP the microcontroller must be

switched to ICC (In-Circuit Communication) mode

by an external controller or programming tool.

Depending on the ICP code downloaded in RAM,

Flash memory programming can be fully custom-

ized (number of bytes to program, program loca-

tions, or selection serial communication interface

for downloading).

When using an STMicroelectronics or third-party

programming tool that supports ICP and the spe-

cific microcontroller device, the user needs only to

implement the ICP hardware interface on the ap-

plication board (see Figure 7). For more details on

the pin locations, refer to the device pinout de-

scription.

4.6 IAP (In-Application Programming)

This mode uses a BootLoader program previously

stored in Sector 0 by the user (in ICP mode or by

plugging the device in a programming tool).

This mode is fully controlled by user software. This

allows it to be adapted to the user application, (us-

er-defined strategy for entering programming

mode, choice of communications protocol used to

fetch the data to be stored, etc.). For example, it is

possible to download code from the SPI, SCI, USB

or CAN interface and program it in the Flash. IAP

mode can be used to program any of the Flash

sectors except Sector 0, which is write/erase pro-

tected to allow recovery in case errors occur dur-

ing the programming operation.

4.7 Related Documentation

For details on Flash programming and ICC proto-

col, refer to the ST7 Flash Programming Refer-

ence Manual and to the ST7 ICC Protocol Refer-

ence Manual.

4.7.1 Register Description

FLASH CONTROL/STATUS REGISTER (FCSR)

Read/Write

Reset Value: 0000 0000 (00h)

This register is reserved for use by Programming

Tool software. It controls the Flash programming

and erasing operations.

Table 4. Flash Control/Status Register Address and Reset Value

00000000

Address

(Hex.)

Label 76543210

0029h FCSR

Reset Value00000000

ST72324Jx ST72324Kx

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5 CENTRAL PROCESSING UNIT

5.1 INTRODUCTION

This CPU has a full 8-bit architecture and contains

six internal registers allowing efficient 8-bit data

manipulation.

5.2 MAIN FEATURES

■Enable executing 63 basic instructions

■Fast 8-bit by 8-bit multiply

■17 main addressing modes (with indirect

addressing mode)

■Two 8-bit index registers

■16-bit stack pointer

■Low power HALT and WAIT modes

■Priority maskable hardware interrupts

■Non-maskable software/hardware interrupts

5.3 CPU REGISTERS

The 6 CPU registers shown in Figure 8 are not

present in the memory mapping and are accessed

by specific instructions.

Accumulator (A)

The Accumulator is an 8-bit general purpose reg-

ister used to hold operands and the results of the

arithmetic and logic calculations and to manipulate

data.

Index Registers (X and Y)

These 8-bit registers are used to create effective

addresses or as temporary storage areas for data

manipulation. (The Cross-Assembler generates a

precede instruction (PRE) to indicate that the fol-

lowing instruction refers to the Y register.)

The Y register is not affected by the interrupt auto-

matic procedures.

Program Counter (PC)

The program counter is a 16-bit register containing

the address of the next instruction to be executed

by the CPU. It is made of two 8-bit registers PCL

(Program Counter Low which is the LSB) and PCH

(Program Counter High which is the MSB).

Figure 8. CPU Registers

ACCUMULATOR

X INDEX REGISTER

Y INDEX REGISTER

STACK POINTER

CONDITION CODE REGISTER

PROGRAM COUNTER

1C1I1HI0NZ

RESET VALUE = RESET VECTOR @ FFFEh-FFFFh

15 8

PCH PCL

15 870

RESET VALUE = STACK HIGHER ADDRESS

RESET VALUE = 1X11X1XX

RESET VALUE = XXh

X = Undefined Value

£1

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CENTRAL PROCESSING UNIT (Cont’d)

Condition Code Register (CC)

Read/Write

Reset Value: 111x1xxx

The 8-bit Condition Code register contains the in-

terrupt masks and four flags representative of the

result of the instruction just executed. This register

can also be handled by the PUSH and POP in-

structions.

These bits can be individually tested and/or con-

trolled by specific instructions.

Arithmetic Management Bits

Bit 4 = H Half carry.

This bit is set by hardware when a carry occurs be-

tween bits 3 and 4 of the ALU during an ADD or

ADC instructions. It is reset by hardware during

the same instructions.

0: No half carry has occurred.

1: A half carry has occurred.

This bit is tested using the JRH or JRNH instruc-

tion. The H bit is useful in BCD arithmetic subrou-

tines.

Bit 2 = N Negative.

This bit is set and cleared by hardware. It is repre-

sentative of the result sign of the last arithmetic,

logical or data manipulation. It’s a copy of the re-

sult 7th bit.

0: The result of the last operation is positive or null.

1: The result of the last operation is negative

(i.e. the most significant bit is a logic 1).

This bit is accessed by the JRMI and JRPL instruc-

tions.

Bit 1 = Z Zero.

This bit is set and cleared by hardware. This bit in-

dicates that the result of the last arithmetic, logical

or data manipulation is zero.

0: The result of the last operation is different from

zero.

1: The result of the last operation is zero.

This bit is accessed by the JREQ and JRNE test

instructions.

Bit 0 = C Carry/borrow.

This bit is set and cleared by hardware and soft-

ware. It indicates an overflow or an underflow has

occurred during the last arithmetic operation.

0: No overflow or underflow has occurred.

1: An overflow or underflow has occurred.

This bit is driven by the SCF and RCF instructions

and tested by the JRC and JRNC instructions. It is

also affected by the “bit test and branch”, shift and

rotate instructions.

Interrupt Management Bits

Bit 5,3 = I1, I0 Interrupt

The combination of the I1 and I0 bits gives the cur-

rent interrupt software priority.

These two bits are set/cleared by hardware when

entering in interrupt. The loaded value is given by

the corresponding bits in the interrupt software pri-

ority registers (IxSPR). They can be also set/

cleared by software with the RIM, SIM, IRET,

HALT, WFI and PUSH/POP instructions.

See the interrupt management chapter for more

details.

11I1HI0NZ

Interrupt Software Priority I1 I0

Level 0 (main) 1 0

Level 1 0 1

Level 2 0 0

Level 3 (= interrupt disable) 1 1

ST72324Jx ST72324Kx

22/164

CENTRAL PROCESSING UNIT (Cont’d)

Stack Pointer (SP)

Read/Write

Reset Value: 01 FFh

The Stack Pointer is a 16-bit register which is al-

ways pointing to the next free location in the stack.

It is then decremented after data has been pushed

onto the stack and incremented before data is

popped from the stack (see Figure 9).

Since the stack is 256 bytes deep, the 8 most sig-

nificant bits are forced by hardware. Following an

MCU Reset, or after a Reset Stack Pointer instruc-

tion (RSP), the Stack Pointer contains its reset val-

ue (the SP7 to SP0 bits are set) which is the stack

higher address.

The least significant byte of the Stack Pointer

(called S) can be directly accessed by a LD in-

struction.

Note: When the lower limit is exceeded, the Stack

Pointer wraps around to the stack upper limit, with-

out indicating the stack overflow. The previously

stored information is then overwritten and there-

fore lost. The stack also wraps in case of an under-

flow.

The stack is used to save the return address dur-

ing a subroutine call and the CPU context during

an interrupt. The user may also directly manipulate

the stack by means of the PUSH and POP instruc-

tions. In the case of an interrupt, the PCL is stored

at the first location pointed to by the SP. Then the

other registers are stored in the next locations as

shown in Figure 9.

– When an interrupt is received, the SP is decre-

mented and the context is pushed on the stack.

– On return from interrupt, the SP is incremented

and the context is popped from the stack.

A subroutine call occupies two locations and an in-

terrupt five locations in the stack area.

Figure 9. Stack Manipulation Example

15 8

00000001

SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0

PCH

PCL

PCH

PCL

PCH

PCL

PCH

PCL

PCH

PCL

CALL

Subroutine Interrupt

Event

PUSH Y POP Y IRET RET

or RSP

@ 01FFh

@ 0100h

Stack Higher Address = 01FFh

Stack Lower Address = 0100h

SET0

ST72324Jx ST72324Kx

23/164

6 SUPPLY, RESET AND CLOCK MANAGEMENT

The device includes a range of utility features for

securing the application in critical situations (for

example in case of a power brown-out), and re-

ducing the number of external components. An

overview is shown in Figure 11.

For more details, refer to dedicated parametric

section.

Main features

■Optional PLL for multiplying the frequency by 2

(not to be used with internal RC oscillator in

order to respect the max. operating frequency)

■Reset Sequence Manager (RSM)

■Multi-Oscillator Clock Management (MO)

– 5 Crystal/Ceramic resonator oscillators

– 1 Internal RC oscillator

■System Integrity Management (SI)

– Main supply Low voltage detection (LVD)

– Auxiliary Voltage detector (AVD) with interrupt

capability for monitoring the main supply

6.1 PHASE LOCKED LOOP

If the clock frequency input to the PLL is in the

range 2 to 4 MHz, the PLL can be used to multiply

the frequency by two to obtain an fOSC2 of 4 to 8

MHz. The PLL is enabled by option byte. If the PLL

is disabled, then fOSC2 = fOSC/2.

Caution: The PLL is not recommended for appli-

cations where timing accuracy is required.

Caution: The PLL must not be used with the inter-

nal RC oscillator.

Figure 10. PLL Block Diagram

Figure 11. Clock, Reset and Supply Block Diagram

PLL OPTION BIT

PLL x 2

fOSC2

/ 2

fOSC

LOW VOLTAGE

DETECTOR

(LVD)

fOSC2

AUXILIARY VOLTAGE

DETECTOR

(AVD)

MULTI-

OSCILLATOR

(MO)

OSC1

RESET

VSS

VDD

RESET SEQUENCE

MANAGER

(RSM)

OSC2 MAIN CLOCK

AVD Interrupt Request

CONTROLLER

PLL

SYSTEM INTEGRITY MANAGEMENT

WATCHDOG

SICSR TIMER (WDG)

WITH REALTIME

CLOCK (MCC/RTC)

AVD AVD LVD

WDG

fOSC

(option)

fCPU

w; :i i

ST72324Jx ST72324Kx

24/164

6.2 MULTI-OSCILLATOR (MO)

The main clock of the ST7 can be generated by

three different source types coming from the multi-

oscillator block:

■an external source

■4 crystal or ceramic resonator oscillators

■an internal high frequency RC oscillator

Each oscillator is optimized for a given frequency

range in terms of consumption and is selectable

through the option byte. The associated hardware

configurations are shown in Table 5. Refer to the

electrical characteristics section for more details.

Caution: The OSC1 and/or OSC2 pins must not

be left unconnected. For the purposes of Failure

Mode and Effect Analysis, it should be noted that if

the OSC1 and/or OSC2 pins are left unconnected,

the ST7 main oscillator may start and, in this con-

figuration, could generate an fOSC clock frequency

in excess of the allowed maximum (>16MHz.),

putting the ST7 in an unsafe/undefined state. The

product behaviour must therefore be considered

undefined when the OSC pins are left unconnect-

ed.

External Clock Source

In this external clock mode, a clock signal (square,

sinus or triangle) with ~50% duty cycle has to drive

the OSC1 pin while the OSC2 pin is tied to ground.

Crystal/Ceramic Oscillators

This family of oscillators has the advantage of pro-

ducing a very accurate rate on the main clock of

the ST7. The selection within a list of 4 oscillators

with different frequency ranges has to be done by

option byte in order to reduce consumption (refer

to Section 14.1 on page 150 for more details on

the frequency ranges). In this mode of the multi-

oscillator, the resonator and the load capacitors

have to be placed as close as possible to the oscil-

lator pins in order to minimize output distortion and

start-up stabilization time. The loading capaci-

tance values must be adjusted according to the

selected oscillator.

These oscillators are not stopped during the

RESET phase to avoid losing time in the oscillator

start-up phase.

Internal RC Oscillator

This oscillator allows a low cost solution for the

main clock of the ST7 using only an internal resis-

tor and capacitor. Internal RC oscillator mode has

the drawback of a lower frequency accuracy and

should not be used in applications that require ac-

curate timing.

In this mode, the two oscillator pins have to be tied

to ground.

In order not to exceed the max. operating frequen-

cy, the internal RC oscillator must not be used with

the PLL.

Table 5. ST7 Clock Sources

Hardware Configuration

External ClockCrystal/Ceramic ResonatorsInternal RC Oscillator

OSC1 OSC2

EXTERNAL

ST7

SOURCE

OSC1 OSC2

LOAD

CAPACITORS

ST7

CL2

CL1

OSC1 OSC2

ST7

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6.3 RESET SEQUENCE MANAGER (RSM)

6.3.1 Introduction

The reset sequence manager includes three RE-

SET sources as shown in Figure 13:

■External RESET source pulse

■Internal LVD RESET (Low Voltage Detection)

■Internal WATCHDOG RESET

These sources act on the RESET pin and it is al-

ways kept low during the delay phase.

The RESET service routine vector is fixed at ad-

dresses FFFEh-FFFFh in the ST7 memory map.

The basic RESET sequence consists of 3 phases

as shown in Figure 12:

■Active Phase depending on the RESET source

■256 or 4096 CPU clock cycle delay (selected by

option byte)

■RESET vector fetch

The 256 or 4096 CPU clock cycle delay allows the

oscillator to stabilise and ensures that recovery

has taken place from the Reset state. The shorter

or longer clock cycle delay should be selected by

option byte to correspond to the stabilization time

of the external oscillator used in the application.

The RESET vector fetch phase duration is 2 clock

cycles.

Figure 12. RESET Sequence Phases

6.3.2 Asynchronous External RESET pin

The RESET pin is both an input and an open-drain

output with integrated RON weak pull-up resistor.

This pull-up has no fixed value but varies in ac-

cordance with the input voltage. It can be pulled

low by external circuitry to reset the device. See

Electrical Characteristic section for more details.

A RESET signal originating from an external

source must have a duration of at least th(RSTL)in in

order to be recognized (see Figure 14). This de-

tection is asynchronous and therefore the MCU

can enter reset state even in HALT mode.

Figure 13. Reset Block Diagram

RESET

Active Phase INTERNAL RESET

256 or 4096 CLOCK CYCLES

FETCH

VECTOR

RESET

RON

VDD

WATCHDOG RESET

LVD RESET

INTERNAL

RESET

PULSE

GENERATOR

Filter

ded by a gfromxh ASE

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RESET SEQUENCE MANAGER (Cont’d)

The RESET pin is an asynchronous signal which

plays a major role in EMS performance. In a noisy

environment, it is recommended to follow the

guidelines mentioned in the electrical characteris-

tics section.

6.3.3 External Power-On RESET

If the LVD is disabled by option byte, to start up the

microcontroller correctly, the user must ensure by

means of an external reset circuit that the reset

signal is held low until VDD is over the minimum

level specified for the selected fOSC frequency.

A proper reset signal for a slow rising VDD supply

can generally be provided by an external RC net-

work connected to the RESET pin.

6.3.4 Internal Low Voltage Detector (LVD)

RESET

Two different RESET sequences caused by the in-

ternal LVD circuitry can be distinguished:

■Power-On RESET

■Voltage Drop RESET

The device RESET pin acts as an output that is

pulled low when VDD<VIT+ (rising edge) or

VDD<VIT- (falling edge) as shown in Figure 14.

The LVD filters spikes on VDD larger than tg(VDD) to

avoid parasitic resets.

6.3.5 Internal Watchdog RESET

The RESET sequence generated by a internal

Watchdog counter overflow is shown in Figure 14.

Starting from the Watchdog counter underflow, the

device RESET pin acts as an output that is pulled

low during at least tw(RSTL)out.

Figure 14. RESET Sequences

VDD

RUN

RESET PIN

EXTERNAL

WATCHDOG

ACTIVE PHASE

VIT+(LVD)

VIT-(LVD)

th(RSTL)in

RUN

WATCHDOG UNDERFLOW

tw(RSTL)out

RUN RUN

RESET

SOURCE

EXTERNAL

RESET

LVD

RESET

WATCHDOG

RESET

INTERNAL RESET (256 or 4096 TCPU)

VECTOR FETCH

ACTIVE

PHASE

ACTIVE

PHASE

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6.4 SYSTEM INTEGRITY MANAGEMENT (SI)

The System Integrity Management block contains

the Low Voltage Detector (LVD) and Auxiliary Volt-

age Detector (AVD) functions. It is managed by

the SICSR register.

6.4.1 Low Voltage Detector (LVD)

The Low Voltage Detector function (LVD) gener-

ates a static reset when the VDD supply voltage is

below a VIT- reference value. This means that it

secures the power-up as well as the power-down

keeping the ST7 in reset.

The VIT- reference value for a voltage drop is lower

than the VIT+ reference value for power-on in order

to avoid a parasitic reset when the MCU starts run-

ning and sinks current on the supply (hysteresis).

The LVD Reset circuitry generates a reset when

VDD is below:

–V

IT+ when VDD is rising

–V

IT- when VDD is falling

The LVD function is illustrated in Figure 15.

The voltage threshold can be configured by option

byte to be low, medium or high.

Provided the minimum VDD value (guaranteed for

the oscillator frequency) is above VIT-, the MCU

can only be in two modes:

– under full software control

– in static safe reset

In these conditions, secure operation is always en-

sured for the application without the need for ex-

ternal reset hardware.

During a Low Voltage Detector Reset, the RESET

pin is held low, thus permitting the MCU to reset

other devices.

Notes:

The LVD allows the device to be used without any

external RESET circuitry.

If the medium or low thresholds are selected, the

detection may occur outside the specified operat-

ing voltage range. Below 3.8V, device operation is

not guaranteed.

The LVD is an optional function which can be se-

lected by option byte.

It is recommended to make sure that the VDD sup-

ply voltage rises monotonously when the device is

exiting from Reset, to ensure the application func-

tions properly.

Figure 15. Low Voltage Detector vs Reset

VDD

VIT+

RESET

VIT-

Vhys

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SYSTEM INTEGRITY MANAGEMENT (Cont’d)

6.4.2 Auxiliary Voltage Detector (AVD)

The Voltage Detector function (AVD) is based on

an analog comparison between a VIT-(AVD) and

VIT+(AVD) reference value and the VDD main sup-

ply. The VIT- reference value for falling voltage is

lower than the VIT+ reference value for rising volt-

age in order to avoid parasitic detection (hystere-

sis).

The output of the AVD comparator is directly read-

able by the application software through a real

time status bit (AVDF) in the SICSR register. This

bit is read only.

Caution: The AVD function is active only if the

LVD is enabled through the option byte (see Sec-

tion 14.1 on page 150).

6.4.2.1 Monitoring the VDD Main Supply

The AVD voltage threshold value is relative to the

selected LVD threshold configured by option byte

(see

If the AVD interrupt is enabled, an interrupt is gen-

erated when the voltage crosses the VIT+(AVD) or

VIT-(AVD) threshold (AVDF bit toggles).

In the case of a drop in voltage, the AVD interrupt

acts as an early warning, allowing software to shut

down safely before the LVD resets the microcon-

troller. See Figure 16.

The interrupt on the rising edge is used to inform

the application that the VDD warning state is over.

If the voltage rise time trv is less than 256 or 4096

CPU cycles (depending on the reset delay select-

ed by option byte), no AVD interrupt will be gener-

ated when VIT+(AVD) is reached.

If trv is greater than 256 or 4096 cycles then:

– If the AVD interrupt is enabled before the

VIT+(AVD) threshold is reached, then 2 AVD inter-

rupts will be received: the first when the AVDIE

bit is set, and the second when the threshold is

reached.

– If the AVD interrupt is enabled after the VIT+(AVD)

threshold is reached then only one AVD interrupt

will occur.

Figure 16. Using the AVD to Monitor VDD

VDD

VIT+(AVD)

VIT-(AVD)

AVDF bit 0 0RESET VALUE

IF AVDIE bit = 1

Vhyst

AVD INTERRUPT

REQUEST

INTERRUPT PROCESS INTERRUPT PROCESS

VIT+(LVD)

VIT-(LVD)

LVD RESET

Early Warning Interrupt

(Power has dropped, MCU not

not yet in reset)

trv VOLTAGE RISE TIME

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SYSTEM INTEGRITY MANAGEMENT (Cont’d)

6.4.3 Low Power Modes

6.4.3.1 Interrupts

The AVD interrupt event generates an interrupt if

the AVDIE bit is set and the interrupt mask in the

CC register is reset (RIM instruction).

Mode Description

WAIT No effect on SI. AVD interrupt causes the

device to exit from Wait mode.

HALT The CRSR register is frozen.

Interrupt Event Event

Flag

Enable

Control

Bit

Exit

from

Wait

Exit

from

Halt

AVD event AVDF AVDIE Yes No

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SYSTEM INTEGRITY MANAGEMENT (Cont’d)

6.4.4 Register Description

SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR)

Read/Write

Reset Value: 000x 000x (00h)

Bit 7 = Reserved, must be kept cleared.

Bit 6 = AVDIE Voltage Detector interrupt enable

This bit is set and cleared by software. It enables

an interrupt to be generated when the AVDF flag

changes (toggles). The pending interrupt informa-

tion is automatically cleared when software enters

the AVD interrupt routine.

0: AVD interrupt disabled

1: AVD interrupt enabled

Bit 5 = AVDF Voltage Detector flag

This read-only bit is set and cleared by hardware.

If the AVDIE bit is set, an interrupt request is gen-

erated when the AVDF bit changes value. Refer to

Figure 16 and to Section 6.4.2.1 for additional de-

tails.

0: VDD over VIT+(AVD) threshold

1: VDD under VIT-(AVD) threshold

Bit 4 = LVDRF LVD reset flag

This bit indicates that the last Reset was generat-

ed by the LVD block. It is set by hardware (LVD re-

set) and cleared by software (writing zero). See

WDGRF flag description for more details. When

the LVD is disabled by OPTION BYTE, the LVDRF

bit value is undefined.

Bits 3:1 = Reserved, must be kept cleared.

Bit 0 = WDGRF Watchdog reset flag

This bit indicates that the last Reset was generat-

ed by the Watchdog peripheral. It is set by hard-

ware (watchdog reset) and cleared by software

(writing zero) or an LVD Reset (to ensure a stable

cleared state of the WDGRF flag when CPU

starts).

Combined with the LVDRF flag information, the

flag description is given by the following table.

Application notes

The LVDRF flag is not cleared when another RE-

SET type occurs (external or watchdog), the

LVDRF flag remains set to keep trace of the origi-

nal failure.

In this case, a watchdog reset can be detected by

software while an external reset can not.

CAUTION: When the LVD is not activated with the

associated option byte, the WDGRF flag can not

be used in the application.

0AVD

AVD

LVD

RF 000

WDG

RESET Sources LVDRF WDGRF

External RESET pin 0 0

Watchdog 0 1

LVD 1 X

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7 INTERRUPTS

7.1 INTRODUCTION

The ST7 enhanced interrupt management pro-

vides the following features:

■Hardware interrupts

■Software interrupt (TRAP)

■Nested or concurrent interrupt management

with flexible interrupt priority and level

management:

– Up to 4 software programmable nesting levels

– Up to 16 interrupt vectors fixed by hardware

– 2 non maskable events: RESET, TRAP

This interrupt management is based on:

– Bit 5 and bit 3 of the CPU CC register (I1:0),

– Interrupt software priority registers (ISPRx),

– Fixed interrupt vector addresses located at the

high addresses of the memory map (FFE0h to

FFFFh) sorted by hardware priority order.

This enhanced interrupt controller guarantees full

upward compatibility with the standard (not nest-

ed) ST7 interrupt controller.

7.2 MASKING AND PROCESSING FLOW

The interrupt masking is managed by the I1 and I0

bits of the CC register and the ISPRx registers

which give the interrupt software priority level of

each interrupt vector (see Table 6). The process-

ing flow is shown in Figure 17

When an interrupt request has to be serviced:

– Normal processing is suspended at the end of

the current instruction execution.

– The PC, X, A and CC registers are saved onto

the stack.

– I1 and I0 bits of CC register are set according to

the corresponding values in the ISPRx registers

of the serviced interrupt vector.

– The PC is then loaded with the interrupt vector of

the interrupt to service and the first instruction of

the interrupt service routine is fetched (refer to

“Interrupt Mapping” table for vector addresses).

The interrupt service routine should end with the

IRET instruction which causes the contents of the

saved registers to be recovered from the stack.

Note: As a consequence of the IRET instruction,

the I1 and I0 bits will be restored from the stack

and the program in the previous level will resume.

Table 6. Interrupt Software Priority Levels

Figure 17. Interrupt Processing Flowchart

Interrupt software priority Level I1 I0

Level 0 (main) Low

High

Level 1 0 1

Level 2 0 0

Level 3 (= interrupt disable) 1 1

“IRET”

RESTORE PC, X, A, CC

STACK PC, X, A, CC

LOAD I1:0 FROM INTERRUPT SW REG.

FETCH NEXT

RESET TRAP

PENDING

INSTRUCTION

I1:0

FROM STACK

LOAD PC FROM INTERRUPT VECTOR

Interrupt has the same or a

lower software priority

THE INTERRUPT

STAYS PENDING

than current one

Interrupt has a higher

software priority

than current one

EXECUTE

INSTRUCTION

INTERRUPT

SOFTWARE

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INTERRUPTS (Cont’d)

Servicing Pending Interrupts

As several interrupts can be pending at the same

time, the interrupt to be taken into account is deter-

mined by the following two-step process:

– the highest software priority interrupt is serviced,

– if several interrupts have the same software pri-

ority then the interrupt with the highest hardware

priority is serviced first.

Figure 18 describes this decision process.

Figure 18. Priority Decision Process

When an interrupt request is not serviced immedi-

ately, it is latched and then processed when its

software priority combined with the hardware pri-

ority becomes the highest one.

Note 1: The hardware priority is exclusive while

the software one is not. This allows the previous

process to succeed with only one interrupt.

Note 2: RESET and TRAP can be considered as

having the highest software priority in the decision

process.

Different Interrupt Vector Sources

Two interrupt source types are managed by the

ST7 interrupt controller: the non-maskable type

(RESET,TRAP) and the maskable type (external

or from internal peripherals).

Non-Maskable Sources

These sources are processed regardless of the

state of the I1 and I0 bits of the CC register (see

Figure 17). After stacking the PC, X, A and CC

registers (except for RESET), the corresponding

vector is loaded in the PC register and the I1 and

I0 bits of the CC are set to disable interrupts (level

3). These sources allow the processor to exit

HALT mode.

■TRAP (Non Maskable Software Interrupt)

This software interrupt is serviced when the TRAP

instruction is executed. It will be serviced accord-

ing to the flowchart in Figure 17.

■RESET

The RESET source has the highest priority in the

ST7. This means that the first current routine has

the highest software priority (level 3) and the high-

est hardware priority.

See the RESET chapter for more details.

Maskable Sources

Maskable interrupt vector sources can be serviced

if the corresponding interrupt is enabled and if its

own interrupt software priority (in ISPRx registers)

is higher than the one currently being serviced (I1

and I0 in CC register). If any of these two condi-

tions is false, the interrupt is latched and thus re-

mains pending.

■External Interrupts

External interrupts allow the processor to exit from

HALT low power mode. External interrupt sensitiv-

ity is software selectable through the External In-

terrupt Control register (EICR).

External interrupt triggered on edge will be latched

and the interrupt request automatically cleared

upon entering the interrupt service routine.

If several input pins of a group connected to the

same interrupt line are selected simultaneously,

these will be logically ORed.

■Peripheral Interrupts

Usually the peripheral interrupts cause the MCU to

exit from HALT mode except those mentioned in

the “Interrupt Mapping” table. A peripheral inter-

rupt occurs when a specific flag is set in the pe-

ripheral status registers and if the corresponding

enable bit is set in the peripheral control register.

The general sequence for clearing an interrupt is

based on an access to the status register followed

by a read or write to an associated register.

Note: The clearing sequence resets the internal

latch. A pending interrupt (i.e. waiting for being

serviced) will therefore be lost if the clear se-

quence is executed.

PENDING

SOFTWARE Different

INTERRUPTS

Same

HIGHEST HARDWARE

PRIORITY SERVICED

PRIORITY

HIGHEST SOFTWARE

PRIORITY SERVICED

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INTERRUPTS (Cont’d)

7.3 INTERRUPTS AND LOW POWER MODES

All interrupts allow the processor to exit the WAIT

low power mode. On the contrary, only external

and other specified interrupts allow the processor

to exit from the HALT modes (see column “Exit

from HALT” in “Interrupt Mapping” table). When

several pending interrupts are present while exit-

ing HALT mode, the first one serviced can only be

an interrupt with exit from HALT mode capability

and it is selected through the same decision proc-

ess shown in Figure 18.

Note: If an interrupt, that is not able to Exit from

HALT mode, is pending with the highest priority

when exiting HALT mode, this interrupt is serviced

after the first one serviced.

7.4 CONCURRENT & NESTED MANAGEMENT

The following Figure 19 and Figure 20 show two

different interrupt management modes. The first is

called concurrent mode and does not allow an in-

terrupt to be interrupted, unlike the nested mode in

Figure 20. The interrupt hardware priority is given

in this order from the lowest to the highest: MAIN,

IT4, IT3, IT2, IT1, IT0. The software priority is giv-

en for each interrupt.

Warning: A stack overflow may occur without no-

tifying the software of the failure.

Figure 19. Concurrent Interrupt Management

Figure 20. Nested Interrupt Management

MAIN

IT4

IT2

IT1

TRAP

IT1

MAIN

IT0

HARDWARE PRIORITY

SOFTWARE

3/0

11 / 10

RIM

IT2

IT1

IT4

TRAP

IT3

IT0

IT3

PRIORITY

LEVEL

USED STACK = 10 BYTES

MAIN

IT2

TRAP

MAIN

IT0

IT2

IT1

IT4

TRAP

IT3

IT0

HARDWARE PRIORITY

3/0

RIM

IT1

IT4 IT4

IT1

IT2

IT3

I1 I0

11 / 10 10

SOFTWARE

PRIORITY

LEVEL

USED STACK = 20 BYTES

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INTERRUPTS (Cont’d)

7.5 INTERRUPT REGISTER DESCRIPTION

CPU CC REGISTER INTERRUPT BITS

Read/Write

Reset Value: 111x 1010 (xAh)

Bit 5, 3 = I1, I0 Software Interrupt Priority

These two bits indicate the current interrupt soft-

ware priority.

These two bits are set/cleared by hardware when

entering in interrupt. The loaded value is given by

the corresponding bits in the interrupt software pri-

ority registers (ISPRx).

They can be also set/cleared by software with the

RIM, SIM, HALT, WFI, IRET and PUSH/POP in-

structions (see “Interrupt Dedicated Instruction

Set” table).

*Note: TRAP and RESET events can interrupt a

level 3 program.

INTERRUPT SOFTWARE PRIORITY REGIS-

TERS (ISPRX)

Read/Write (bit 7:4 of ISPR3 are read only)

Reset Value: 1111 1111 (FFh)

These four registers contain the interrupt software

priority of each interrupt vector.

– Each interrupt vector (except RESET and TRAP)

has corresponding bits in these registers where

its own software priority is stored. This corre-

spondance is shown in the following table.

– Each I1_x and I0_x bit value in the ISPRx regis-

ters has the same meaning as the I1 and I0 bits

in the CC register.

– Level 0 can not be written (I1_x=1, I0_x=0). In

this case, the previously stored value is kept. (ex-

ample: previous=CFh, write=64h, result=44h)

The RESET, and TRAP vectors have no software

priorities. When one is serviced, the I1 and I0 bits

of the CC register are both set.

Caution: If the I1_x and I0_x bits are modified

while the interrupt x is executed the following be-

haviour has to be considered: If the interrupt x is

still pending (new interrupt or flag not cleared) and

the new software priority is higher than the previ-

ous one, the interrupt x is re-entered. Otherwise,

the software priority stays unchanged up to the

next interrupt request (after the IRET of the inter-

rupt x).

11I1 HI0 NZC

Interrupt Software Priority Level I1 I0

Level 0 (main) Low

High

Level 1 0 1

Level 2 0 0

Level 3 (= interrupt disable*) 1 1

ISPR0 I1_3 I0_3 I1_2 I0_2 I1_1 I0_1 I1_0 I0_0

ISPR1 I1_7 I0_7 I1_6 I0_6 I1_5 I0_5 I1_4 I0_4

ISPR2 I1_11 I0_11 I1_10 I0_10 I1_9 I0_9 I1_8 I0_8

ISPR3 1 1 1 1 I1_13 I0_13 I1_12 I0_12

Vector address ISPRx bits

FFFBh-FFFAh I1_0 and I0_0 bits*

FFF9h-FFF8h I1_1 and I0_1 bits

... ...

FFE1h-FFE0h I1_13 and I0_13 bits

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INTERRUPTS (Cont’d)

Table 7. Dedicated Interrupt Instruction Set

Note: During the execution of an interrupt routine, the HALT, POPCC, RIM, SIM and WFI instructions change the current

software priority up to the next IRET instruction or one of the previously mentioned instructions.

Instruction New Description Function/Example I1 H I0 N Z C

HALT Entering Halt mode 1 0

IRET Interrupt routine return Pop CC, A, X, PC I1 H I0 N Z C

JRM Jump if I1:0=11 (level 3) I1:0=11?

JRNM Jump if I1:0<>11 I1:0<>11?

POP CC Pop CC from the Stack Mem => CC I1 H I0 N Z C

RIM Enable interrupt (level 0 set) Load 10 in I1:0 of CC 1 0

SIM Disable interrupt (level 3 set) Load 11 in I1:0 of CC 1 1

TRAP Software trap Software NMI 1 1

WFI Wait for interrupt 1 0

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INTERRUPTS (Cont’d)

Table 8. Interrupt Mapping

Notes:

1. In Flash devices only a RESET or MCC/RTC interrupt can be used to wake-up from Active Halt mode.

7.6 EXTERNAL INTERRUPTS

7.6.1 I/O Port Interrupt Sensitivity

The external interrupt sensitivity is controlled by

the IPA, IPB and ISxx bits of the EICR register

(Figure 21). This control allows to have up to 4 fully

independent external interrupt source sensitivities.

Each external interrupt source can be generated

on four (or five) different events on the pin:

■Falling edge

■Rising edge

■Falling and rising edge

■Falling edge and low level

■Rising edge and high level (only for ei0 and ei2)

To guarantee correct functionality, the sensitivity

bits in the EICR register can be modified only

when the I1 and I0 bits of the CC register are both

set to 1 (level 3). This means that interrupts must

be disabled before changing sensitivity.

The pending interrupts are cleared by writing a dif-

ferent value in the ISx[1:0], IPA or IPB bits of the

EICR.

N° Source

Block Description Register

Label

Priority

Order

Exit

from

HALT/

ACTIVE

HALT1)

Address

Vector

RESET Reset N/A yes FFFEh-FFFFh

TRAP Software interrupt no FFFCh-FFFDh

0 Not used FFFAh-FFFBh

1 MCC/RTC Main clock controller time base interrupt MCCSR Higher

Priority

yes FFF8h-FFF9h

2 ei0 External interrupt port A3..0

N/A

yes FFF6h-FFF7h

3 ei1 External interrupt port F2..0 yes FFF4h-FFF5h

4 ei2 External interrupt port B3..0 yes FFF2h-FFF3h

5 ei3 External interrupt port B7..4 yes FFF0h-FFF1h

6 Not used FFEEh-FFEFh

7 SPI SPI peripheral interrupts SPICSR yes FFECh-FFEDh

8 TIMER A TIMER A peripheral interrupts TASR no FFEAh-FFEBh

9 TIMER B TIMER B peripheral interrupts TBSR no FFE8h-FFE9h

10 SCI SCI Peripheral interrupts SCISR Lower

Priority

no FFE6h-FFE7h

11 AVD Auxiliary Voltage detector interrupt SICSR no FFE4h-FFE5h

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Figure 21. External Interrupt Control bits

IS10 IS11

EICR

SENSITIVITY

CONTROL

PBOR.3

PBDDR.3

IPB BIT

PB3 ei2 INTERRUPT SOURCE

PORT B [3:0] INTERRUPTS

PB3

PB2

PB1

PB0

IS10 IS11

EICR

SENSITIVITY

CONTROL

PBOR.4

PBDDR.4

PB4

ei3 INTERRUPT SOURCE

PORT B4 INTERRUPT

IS20 IS21

EICR

SENSITIVITY

CONTROL

PAOR.3

PADDR.3

IPA BIT

PA3 ei0 INTERRUPT SOURCE

PORT A3 INTERRUPT

IS20 IS21

EICR

SENSITIVITY

CONTROL

PFOR.2

PFDDR.2

PF2 ei1 INTERRUPT SOURCE

PORT F [2:0] INTERRUPTS

PF2

PF1

PF0

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INTERRUPTS (Cont’d)

7.7 EXTERNAL INTERRUPT CONTROL REGISTER (EICR)

Read/Write

Reset Value: 0000 0000 (00h)

Bit 7:6 = IS1[1:0] ei2 and ei3 sensitivity

The interrupt sensitivity, defined using the IS1[1:0]

bits, is applied to the following external interrupts:

- ei2 (port B3..0)

- ei3 (port B4)

These 2 bits can be written only when I1 and I0 of

the CC register are both set to 1 (level 3).

Bit 5 = IPB Interrupt polarity for port B

This bit is used to invert the sensitivity of the port B

[3:0] external interrupts. It can be set and cleared

by software only when I1 and I0 of the CC register

are both set to 1 (level 3).

0: No sensitivity inversion

1: Sensitivity inversion

Bit 4:3 = IS2[1:0] ei0 and ei1 sensitivity

The interrupt sensitivity, defined using the IS2[1:0]

bits, is applied to the following external interrupts:

- ei0 (port A3..0)

- ei1 (port F2..0)

These 2 bits can be written only when I1 and I0 of

the CC register are both set to 1 (level 3).

Bit 2 = IPA Interrupt polarity for port A

This bit is used to invert the sensitivity of the port A

[3:0] external interrupts. It can be set and cleared

by software only when I1 and I0 of the CC register

are both set to 1 (level 3).

0: No sensitivity inversion

1: Sensitivity inversion

Bits 1:0 = Reserved, must always be kept cleared.

IS11 IS10 IPB IS21 IS20 IPA 0 0

IS11 IS10

External Interrupt Sensitivity

IPB bit =0 IPB bit =1

00 Falling edge &

low level

Rising edge

& high level

0 1 Rising edge only Falling edge only

1 0 Falling edge only Rising edge only

1 1 Rising and falling edge

IS11 IS10 External Interrupt Sensitivity

0 0 Falling edge & low level

0 1 Rising edge only

1 0 Falling edge only

1 1 Rising and falling edge

IS21 IS20

External Interrupt Sensitivity

IPA bit =0 IPA bit =1

00 Falling edge &

low level

Rising edge

& high level

0 1 Rising edge only Falling edge only

1 0 Falling edge only Rising edge only

1 1 Rising and falling edge

IS21 IS20 External Interrupt Sensitivity

0 0 Falling edge & low level

0 1 Rising edge only

1 0 Falling edge only

1 1 Rising and falling edge

£1

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INTERRUPTS (Cont’d)

Table 9. Nested Interrupts Register Map and Reset Values

Address

(Hex.)

Label 76543210

0024h ISPR0

Reset Value

ei1 ei0 MCC + SI

I1_3

I0_3

I1_2

I0_2

I1_1

I0_1

111

0025h ISPR1

Reset Value

SPI ei3 ei2

I1_7

I0_7

I1_6

I0_6

I1_5

I0_5

I1_4

I0_4

0026h ISPR2

Reset Value

AVD SCI TIMER B TIMER A

I1_11

I0_11

I1_10

I0_10

I1_9

I0_9

I1_8

I0_8

0027h ISPR3

Reset Value1111

I1_13

I0_13

I1_12

I0_12

0028h EICR

Reset Value

IS11

IS10

IPB

IS21

IS20

IPA

000

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8 POWER SAVING MODES

8.1 INTRODUCTION

To give a large measure of flexibility to the applica-

tion in terms of power consumption, four main

power saving modes are implemented in the ST7

(see Figure 22): SLOW, WAIT (SLOW WAIT), AC-

TIVE HALT and HALT.

After a RESET the normal operating mode is se-

lected by default (RUN mode). This mode drives

the device (CPU and embedded peripherals) by

means of a master clock which is based on the

main oscillator frequency divided or multiplied by 2

(fOSC2).

From RUN mode, the different power saving

modes may be selected by setting the relevant

instruction whose action depends on the oscillator

status.

Figure 22. Power Saving Mode Transitions

8.2 SLOW MODE

This mode has two targets:

– To reduce power consumption by decreasing the

internal clock in the device,

– To adapt the internal clock frequency (fCPU) to

the available supply voltage.

SLOW mode is controlled by three bits in the

MCCSR register: the SMS bit which enables or

disables Slow mode and two CPx bits which select

the internal slow frequency (fCPU).

In this mode, the master clock frequency (fOSC2)

can be divided by 2, 4, 8 or 16. The CPU and pe-

ripherals are clocked at this lower frequency

(fCPU).

Note: SLOW-WAIT mode is activated when enter-

ing the WAIT mode while the device is already in

SLOW mode.

Figure 23. SLOW Mode Clock Transitions

POWER CONSUMPTION

WAIT

SLOW

RUN

ACTIVE HALT

High

Low

SLOW WAIT

HALT

00 01

SMS

CP1:0

fCPU

NEW SLOW

NORMAL RUN MODE

MCCSR

FREQUENCY

REQUEST

fOSC2

fOSC2/2 fOSC2/4 fOSC2

£1

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POWER SAVING MODES (Cont’d)

8.3 WAIT MODE

WAIT mode places the MCU in a low power con-

sumption mode by stopping the CPU.

This power saving mode is selected by calling the

‘WFI’ instruction.

All peripherals remain active. During WAIT mode,

the I[1:0] bits of the CC register are forced to ‘10’,

to enable all interrupts. All other registers and

memory remain unchanged. The MCU remains in

WAIT mode until an interrupt or RESET occurs,

whereupon the Program Counter branches to the

starting address of the interrupt or Reset service

routine.

The MCU will remain in WAIT mode until a Reset

or an Interrupt occurs, causing it to wake up.

Refer to Figure 24.

Figure 24. WAIT Mode Flow-chart

Note:

1. Before servicing an interrupt, the CC register is

pushed on the stack. The I[1:0] bits of the CC reg-

ister are set to the current software priority level of

the interrupt routine and recovered when the CC

WFI INSTRUCTION

RESET

INTERRUPT

CPU

OSCILLATOR

PERIPHERALS

I[1:0] BITS

OFF

FETCH RESET VECTOR

OR SERVICE INTERRUPT

CPU

OSCILLATOR

PERIPHERALS

I[1:0] BITS

OFF

CPU

OSCILLATOR

PERIPHERALS

I[1:0] BITS

XX 1)

256 OR 4096 CPU CLOCK

CYCLE DELAY

ST72324Jx ST72324Kx

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POWER SAVING MODES (Cont’d)

8.4 ACTIVE-HALT AND HALT MODES

ACTIVE-HALT and HALT modes are the two low-

est power consumption modes of the MCU. They

are both entered by executing the ‘HALT’ instruc-

tion. The decision to enter either in ACTIVE-HALT

or HALT mode is given by the MCC/RTC interrupt

enable flag (OIE bit in MCCSR register).

8.4.1 ACTIVE-HALT MODE

ACTIVE-HALT mode is the lowest power con-

sumption mode of the MCU with a real time clock

available. It is entered by executing the ‘HALT’ in-

struction when the OIE bit of the Main Clock Con-

troller Status register (MCCSR) is set (see Section

10.2 on page 56 for more details on the MCCSR

The MCU can exit ACTIVE-HALT mode on recep-

tion of either an MCC/RTC interrupt, a specific in-

terrupt (see Table 8, “Interrupt Mapping,” on

page 36) or a RESET. When exiting ACTIVE-

HALT mode by means of an interrupt, no 256 or

4096 CPU cycle delay occurs. The CPU resumes

operation by servicing the interrupt or by fetching

the reset vector which woke it up (see Figure 26).

When entering ACTIVE-HALT mode, the I[1:0] bits

in the CC register are forced to ‘10b’ to enable in-

terrupts. Therefore, if an interrupt is pending, the

MCU wakes up immediately.

In ACTIVE-HALT mode, only the main oscillator

and its associated counter (MCC/RTC) are run-

ning to keep a wake-up time base. All other periph-

erals are not clocked except those which get their

clock supply from another clock generator (such

as external or auxiliary oscillator).

The safeguard against staying locked in ACTIVE-

HALT mode is provided by the oscillator interrupt.

Note: As soon as the interrupt capability of one of

the oscillators is selected (MCCSR.OIE bit set),

entering ACTIVE-HALT mode while the Watchdog

is active does not generate a RESET.

This means that the device cannot spend more

than a defined delay in this power saving mode.

CAUTION: When exiting ACTIVE-HALT mode fol-

lowing an interrupt, OIE bit of MCCSR register

must not be cleared before tDELAY after the inter-

rupt occurs (tDELAY = 256 or 4096 tCPU delay de-

pending on option byte). Otherwise, the ST7 en-

ters HALT mode for the remaining tDELAY period.

Figure 25. ACTIVE-HALT Timing Overview

Figure 26. ACTIVE-HALT Mode Flow-chart

Notes:

1. This delay occurs only if the MCU exits ACTIVE-

HALT mode by means of a RESET.

2. Peripheral clocked with an external clock source

can still be active.

3. Only the MCC/RTC interrupt and some specific

interrupts can exit the MCU from ACTIVE-HALT

mode (such as external interrupt). Refer to

Table 8, “Interrupt Mapping,” on page 36 for more

details.

4. Before servicing an interrupt, the CC register is

pushed on the stack. The I[1:0] bits of the CC reg-

ister are set to the current software priority level of

the interrupt routine and restored when the CC

MCCSR

OIE bit

Power Saving Mode entered when HALT

instruction is executed

0 HALT mode

1 ACTIVE-HALT mode

HALTRUN RUN

256 OR 4096 CPU

CYCLE DELAY 1)

RESET

INTERRUPT

HALT

INSTRUCTION FETCH

VECTOR

ACTIVE

[MCCSR.OIE=1]

HALT INSTRUCTION

RESET

INTERRUPT 3) Y

CPU

OSCILLATOR

PERIPHERALS 2)

I[1:0] BITS

OFF

FETCH RESET VECTOR

OR SERVICE INTERRUPT

CPU

OSCILLATOR

PERIPHERALS

I[1:0] BITS

OFF

XX 4)

CPU

OSCILLATOR

PERIPHERALS

I[1:0] BITS

XX 4)

256OR4096CPUCLOCK

CYCLE DELAY

(MCCSR.OIE=1)

HALT INSTRUCTION (MCCSR.O|E=0) ENABLE £1

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POWER SAVING MODES (Cont’d)

8.4.2 HALT MODE

The HALT mode is the lowest power consumption

mode of the MCU. It is entered by executing the

‘HALT’ instruction when the OIE bit of the Main

Clock Controller Status register (MCCSR) is

cleared (see Section 10.2 on page 56 for more de-

tails on the MCCSR register).

The MCU can exit HALT mode on reception of ei-

ther a specific interrupt (see Table 8, “Interrupt

Mapping,” on page 36) or a RESET. When exiting

HALT mode by means of a RESET or an interrupt,

the oscillator is immediately turned on and the 256

or 4096 CPU cycle delay is used to stabilize the

oscillator. After the start up delay, the CPU

resumes operation by servicing the interrupt or by

fetching the reset vector which woke it up (see Fig-

ure 28).

When entering HALT mode, the I[1:0] bits in the

CC register are forced to ‘10b’to enable interrupts.

Therefore, if an interrupt is pending, the MCU

wakes up immediately.

In HALT mode, the main oscillator is turned off

causing all internal processing to be stopped, in-

cluding the operation of the on-chip peripherals.

All peripherals are not clocked except the ones

which get their clock supply from another clock

generator (such as an external or auxiliary oscilla-

tor).

The compatibility of Watchdog operation with

HALT mode is configured by the “WDGHALT” op-

tion bit of the option byte. The HALT instruction

when executed while the Watchdog system is en-

abled, can generate a Watchdog RESET (see

Section 14.1 on page 150) for more details.

Figure 27. HALT Timing Overview

Figure 28. HALT Mode Flow-chart

Notes:

1. WDGHALT is an option bit. See option byte sec-

tion for more details.

2. Peripheral clocked with an external clock source

can still be active.

3. Only some specific interrupts can exit the MCU

from HALT mode (such as external interrupt). Re-

fer to Table 8, “Interrupt Mapping,” on page 36 for

more details.

4. Before servicing an interrupt, the CC register is

pushed on the stack. The I[1:0] bits of the CC reg-

ister are set to the current software priority level of

the interrupt routine and recovered when the CC

HALTRUN RUN

256 OR 4096 CPU

CYCLE DELAY

RESET

INTERRUPT

HALT

INSTRUCTION FETCH

VECTOR

[MCCSR.OIE=0]

HALT INSTRUCTION

RESET

INTERRUPT 3)

CPU

OSCILLATOR

PERIPHERALS 2)

I[1:0] BITS

OFF

FETCH RESET VECTOR

OR SERVICE INTERRUPT

CPU

OSCILLATOR

PERIPHERALS

I[1:0] BITS

OFF

XX 4)

CPU

OSCILLATOR

PERIPHERALS

I[1:0] BITS

XX 4)

256 OR 4096 CPU CLOCK

DELAY

WATCHDOG

ENABLE

DISABLE

WDGHALT 1) 0

WATCHDOG

RESET

(MCCSR.OIE=0)

CYCLE

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POWER SAVING MODES (Cont’d)

8.4.2.1 Halt Mode Recommendations

– Make sure that an external event is available to

wake up the microcontroller from Halt mode.

– When using an external interrupt to wake up the

microcontroller, reinitialize the corresponding I/O

as “Input Pull-up with Interrupt” before executing

the HALT instruction. The main reason for this is

that the I/O may be wrongly configured due to ex-

ternal interference or by an unforeseen logical

condition.

– For the same reason, reinitialize the level sensi-

tiveness of each external interrupt as a precau-

tionary measure.

– The opcode for the HALT instruction is 0x8E. To

avoid an unexpected HALT instruction due to a

program counter failure, it is advised to clear all

occurrences of the data value 0x8E from memo-

ry. For example, avoid defining a constant in

ROM with the value 0x8E.

– As the HALT instruction clears the interrupt mask

in the CC register to allow interrupts, the user

may choose to clear all pending interrupt bits be-

fore executing the HALT instruction. This avoids

entering other peripheral interrupt routines after

executing the external interrupt routine corre-

sponding to the wake-up event (reset or external

interrupt).

£1

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9 I/O PORTS

9.1 INTRODUCTION

The I/O ports offer different functional modes:

– transfer of data through digital inputs and outputs

and for specific pins:

– external interrupt generation

– alternate signal input/output for the on-chip pe-

ripherals.

An I/O port contains up to 8 pins. Each pin can be

programmed independently as digital input (with or

without interrupt generation) or digital output.

9.2 FUNCTIONAL DESCRIPTION

Each port has 2 main registers:

– Data Register (DR)

– Data Direction Register (DDR)

and one optional register:

– Option Register (OR)

Each I/O pin may be programmed using the corre-

sponding register bits in the DDR and OR regis-

ters: bit X corresponding to pin X of the port. The

same correspondence is used for the DR register.

The following description takes into account the

OR register, (for specific ports which do not pro-

vide this register refer to the I/O Port Implementa-

tion section). The generic I/O block diagram is

shown in Figure 29

9.2.1 Input Modes

The input configuration is selected by clearing the

corresponding DDR register bit.

In this case, reading the DR register returns the

digital value applied to the external I/O pin.

Different input modes can be selected by software

through the OR register.

Notes:

1. Writing the DR register modifies the latch value

but does not affect the pin status.

2. When switching from input to output mode, the

DR register has to be written first to drive the cor-

rect level on the pin as soon as the port is config-

ured as an output.

3. Do not use read/modify/write instructions (BSET

or BRES) to modify the DR register

External interrupt function

When an I/O is configured as Input with Interrupt,

an event on this I/O can generate an external inter-

rupt request to the CPU.

Each pin can independently generate an interrupt

request. The interrupt sensitivity is independently

programmable using the sensitivity bits in the

EICR register.

Each external interrupt vector is linked to a dedi-

cated group of I/O port pins (see pinout description

and interrupt section). If several input pins are se-

lected simultaneously as interrupt sources, these

are first detected according to the sensitivity bits in

the EICR register and then logically ORed.

The external interrupts are hardware interrupts,

which means that the request latch (not accessible

directly by the application) is automatically cleared

when the corresponding interrupt vector is

fetched. To clear an unwanted pending interrupt

by software, the sensitivity bits in the EICR register

must be modified.

9.2.2 Output Modes

The output configuration is selected by setting the

corresponding DDR register bit. In this case, writ-

ing the DR register applies this digital value to the

I/O pin through the latch. Then reading the DR reg-

ister returns the previously stored value.

Two different output modes can be selected by

software through the OR register: Output push-pull

and open-drain.

DR register value and output pin status:

9.2.3 Alternate Functions

When an on-chip peripheral is configured to use a

pin, the alternate function is automatically select-

ed. This alternate function takes priority over the

standard I/O programming.

When the signal is coming from an on-chip periph-

eral, the I/O pin is automatically configured in out-

put mode (push-pull or open drain according to the

peripheral).

When the signal is going to an on-chip peripheral,

the I/O pin must be configured in input mode. In

this case, the pin state is also digitally readable by

addressing the DR register.

Note: Input pull-up configuration can cause unex-

pected value at the input of the alternate peripheral

input. When an on-chip peripheral use a pin as in-

put and output, this pin has to be configured in in-

put floating mode.

DR Push-pull Open-drain

SS Vss

DD Floating

331: ,.

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I/O PORTS (Cont’d)

Figure 29. I/O Port General Block Diagram

Table 10. I/O Port Mode Options

Legend: NI - not implemented

Off - implemented not activated

On - implemented and activated

Note: The diode to VDD is not implemented in the

true open drain pads. A local protection between

the pad and VSS is implemented to protect the de-

vice against positive stress.

Configuration Mode Pull-Up P-Buffer Diodes

to VDD to VSS

Input Floating with/without Interrupt Off Off

On On

Pull-up with/without Interrupt On

Output

Push-pull Off On

Open Drain (logic level) Off

True Open Drain NI NI NI (see note)

DDR

DATA BUS

PAD

VDD

ALTERNATE

ENABLE

ALTERNATE

OUTPUT 1

OR SEL

DDR SEL

DR SEL

PULL-UP

CONDITION

P-BUFFER

(see table below)

N-BUFFER

PULL-UP

(see table below)

ANALOG

INPUT

If implemented

ALTERNATE

INPUT

VDD

DIODES

(see table below)

EXTERNAL

SOURCE (eix)

INTERRUPT

CMOS

SCHMITT

TRIGGER

ACCESS

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I/O PORTS (Cont’d)

Table 11. I/O Port Configurations

Notes:

1. When the I/O port is in input configuration and the associated alternate function is enabled as an output,

reading the DR register will read the alternate function output status.

2. When the I/O port is in output configuration and the associated alternate function is enabled as an input,

the alternate function reads the pin status given by the DR register content.

Hardware Configuration

INPUT 1)

OPEN-DRAIN OUTPUT 2)

PUSH-PULL OUTPUT 2)

CONDITION

PAD

VDD

RPU

EXTERNAL INTERRUPT

DATA BUS

PULL-UP

INTERRUPT

DR REGISTER ACCESS

SOURCE (eix)

CONDITION

ALTERNATE INPUT

NOT IMPLEMENTED IN

TRUE OPEN DRAIN

I/O PORTS

ANALOG INPUT

PAD

RPU

DATA BUS

DR REGISTER ACCESS

R/W

VDD

ALTERNATEALTERNATE

ENABLE OUTPUT

NOT IMPLEMENTED IN

TRUE OPEN DRAIN

I/O PORTS

PAD

RPU

DATA BUS

DR REGISTER ACCESS

R/W

VDD

ALTERNATEALTERNATE

ENABLE OUTPUT

NOT IMPLEMENTED IN

TRUE OPEN DRAIN

I/O PORTS

OHOHOHO E]

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I/O PORTS (Cont’d)

CAUTION: The alternate function must not be ac-

tivated as long as the pin is configured as input

with interrupt, in order to avoid generating spurious

interrupts.

Analog alternate function

When the pin is used as an ADC input, the I/O

must be configured as floating input. The analog

multiplexer (controlled by the ADC registers)

switches the analog voltage present on the select-

ed pin to the common analog rail which is connect-

ed to the ADC input.

It is recommended not to change the voltage level

or loading on any port pin while conversion is in

progress. Furthermore it is recommended not to

have clocking pins located close to a selected an-

alog pin.

WARNING: The analog input voltage level must

be within the limits stated in the absolute maxi-

mum ratings.

9.3 I/O PORT IMPLEMENTATION

The hardware implementation on each I/O port de-

pends on the settings in the DDR and OR registers

and specific feature of the I/O port such as ADC In-

put or true open drain.

Switching these I/O ports from one state to anoth-

er should be done in a sequence that prevents un-

wanted side effects. Recommended safe transi-

tions are illustrated in Figure 30 Other transitions

are potentially risky and should be avoided, since

they are likely to present unwanted side-effects

such as spurious interrupt generation.

Figure 30. Interrupt I/O Port State Transitions

9.4 LOW POWER MODES

9.5 INTERRUPTS

The external interrupt event generates an interrupt

if the corresponding configuration is selected with

DDR and OR registers and the interrupt mask in

the CC register is not active (RIM instruction).

Mode Description

WAIT No effect on I/O ports. External interrupts

cause the device to exit from WAIT mode.

HALT No effect on I/O ports. External interrupts

cause the device to exit from HALT mode.

Interrupt Event Event

Flag

Enable

Control

Bit

Exit

from

Wait

Exit

from

Halt

External interrupt on

selected external

event

-DDRx

ORx Yes Yes

floating/pull-up

interrupt

INPUT

floating

(reset state)

INPUT

open-drain

OUTPUT

push-pull

OUTPUT

XX = DDR, OR

£1

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I/O PORTS (Cont’d)

9.5.1 I/O Port Implementation

The I/O port register configurations are summa-

rised as follows.

Standard Ports

PA5:4, PC7:0, PD5:0,

PE1:0, PF7:6, 4

Interrupt Ports

PB4, PB2:0, PF1:0 (with pull-up)

PA3, PB3, PF2 (without pull-up)

True Open Drain Ports

PA7:6

Table 12. Port Configuration

MODE DDR OR

floating input 0 0

pull-up input 0 1

open drain output 1 0

push-pull output 1 1

MODE DDR OR

floating input 0 0

pull-up interrupt input 0 1

open drain output 1 0

push-pull output 1 1

MODE DDR OR

floating input 0 0

floating interrupt input 0 1

open drain output 1 0

push-pull output 1 1

MODE DDR

floating input 0

open drain (high sink ports) 1

Port Pin name Input Output

OR = 0 OR = 1 OR = 0 OR = 1

Port A

PA7:6 floating true open-drain

PA5:4 floating pull-up open drain push-pull

PA3 floating floating interrupt open drain push-pull

Port B PB3 floating floating interrupt open drain push-pull

PB4, PB2:0 floating pull-up interrupt open drain push-pull

Port C PC7:0 floating pull-up open drain push-pull

Port D PD5:0 floating pull-up open drain push-pull

Port E PE1:0 floating pull-up open drain push-pull

Port F

PF7:6, 4 floating pull-up open drain push-pull

PF2 floating floating interrupt open drain push-pull

PF1:0 floating pull-up interrupt open drain push-pull

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I/O PORTS (Cont’d)

Table 13. I/O Port Register Map and Reset Values

Address

(Hex.)

Label 76543210

Reset Value

of all I/O port registers 00000000

0000h PADR

MSB LSB0001h PADDR

0002h PAOR

0003h PBDR

MSB LSB0004h PBDDR

0005h PBOR

0006h PCDR

MSB LSB0007h PCDDR

0008h PCOR

0009h PDDR

MSB LSB000Ah PDDDR

000Bh PDOR

000Ch PEDR

MSB LSB000Dh PEDDR

000Eh PEOR

000Fh PFDR

MSB LSB0010h PFDDR

0011h PFOR

iiiiiiiiii

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10 ON-CHIP PERIPHERALS

10.1 WATCHDOG TIMER (WDG)

10.1.1 Introduction

The Watchdog timer is used to detect the occur-

rence of a software fault, usually generated by ex-

ternal interference or by unforeseen logical condi-

tions, which causes the application program to

abandon its normal sequence. The Watchdog cir-

cuit generates an MCU reset on expiry of a pro-

grammed time period, unless the program refresh-

es the counter’s contents before the T6 bit be-

comes cleared.

10.1.2 Main Features

■Programmable free-running downcounter

■Programmable reset

■Reset (if watchdog activated) when the T6 bit

reaches zero

■Optional reset on HALT instruction

(configurable by option byte)

■Hardware Watchdog selectable by option byte

10.1.3 Functional Description

The counter value stored in the Watchdog Control

every 16384 fOSC2 cycles (approx.), and the

length of the timeout period can be programmed

by the user in 64 increments.

If the watchdog is activated (the WDGA bit is set)

and when the 7-bit timer (bits T[6:0]) rolls over

from 40h to 3Fh (T6 becomes cleared), it initiates

a reset cycle pulling low the reset pin for typically

500ns.

The application program must write in the

WDGCR register at regular intervals during normal

operation to prevent an MCU reset. This down-

counter is free-running: it counts down even if the

watchdog is disabled. The value to be stored in the

WDGCR register must be between FFh and C0h:

– The WDGA bit is set (watchdog enabled)

– The T6 bit is set to prevent generating an imme-

diate reset

– The T[5:0] bits contain the number of increments

which represents the time delay before the

watchdog produces a reset (see Figure 32. Ap-

proximate Timeout Duration). The timing varies

between a minimum and a maximum value due

to the unknown status of the prescaler when writ-

ing to the WDGCR register (see Figure 33).

Following a reset, the watchdog is disabled. Once

activated it cannot be disabled, except by a reset.

The T6 bit can be used to generate a software re-

set (the WDGA bit is set and the T6 bit is cleared).

If the watchdog is activated, the HALT instruction

will generate a Reset.

Figure 31. Watchdog Block Diagram

RESET

WDGA

6-BIT DOWNCOUNTER (CNT)

fOSC2

T6 T0

WDG PRESCALER

WATCHDOG CONTROL REGISTER (WDGCR)

DIV 4

12-BIT MCC

RTC COUNTER

MSB LSB

DIV 64

MCC/RTC

TB[1:0] bits

(MCCSR

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WATCHDOG TIMER (Cont’d)

10.1.4 How to Program the Watchdog Timeout

Figure 32 shows the linear relationship between

the 6-bit value to be loaded in the Watchdog Coun-

ter (CNT) and the resulting timeout duration in mil-

liseconds. This can be used for a quick calculation

without taking the timing variations into account. If

more precision is needed, use the formulae in Fig-

ure 33.

Caution: When writing to the WDGCR register, al-

ways write 1 in the T6 bit to avoid generating an

immediate reset.

Figure 32. Approximate Timeout Duration

CNT Value (hex.)

Watchdog timeout (ms) @ 8 MHz. fOSC2

128

1.5 65

503418 82 98 114

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WATCHDOG TIMER (Cont’d)

Figure 33. Exact Timeout Duration (tmin and tmax)

WHERE:

tmin0 = (LSB + 128) x 64 x tOSC2

tmax0 = 16384 x tOSC2

tOSC2 = 125ns if fOSC2=8 MHz

CNT = Value of T[5:0] bits in the WDGCR register (6 bits)

MSB and LSB are values from the table below depending on the timebase selected by the TB[1:0] bits

in the MCCSR register

To calculate the minimum Watchdog Timeout (tmin):

IF THEN

ELSE

To calculate the maximum Watchdog Timeout (tmax):

IF THEN

ELSE

Note: In the above formulae, division results must be rounded down to the next integer value.

Example:

With 2ms timeout selected in MCCSR register

TB1 Bit

(MCCSR Reg.)

TB0 Bit

(MCCSR Reg.)

Selected MCCSR

Timebase MSB LSB

0 0 2ms 4 59

0 1 4ms 8 53

1 0 10ms 20 35

1 1 25ms 49 54

Value of T[5:0] Bits in

WDGCR Register (Hex.)

Min. Watchdog

Timeout (ms)

tmin

Max. Watchdog

Timeout (ms)

tmax

00 1.496 2.048

3F 128 128.552

CNT MSB

-------------

<tmin tmin0 16384 CNT tosc2

××+=

tmin tmin0 16384 CNT 4CNT

MSB

-----------------

–

⎝⎠

⎛⎞

×192 LSB+()64 4CNT

MSB

-----------------

××+tosc2

×+=

CNT MSB

-------------

≤tmax tmax0 16384 CNT tosc2

××+=

tmax tmax0 16384 CNT 4CNT

MSB

-----------------

–

⎝⎠

⎛⎞

×192 LSB+()64 4CNT

MSB

-----------------

××+tosc2

×+=

ST72324Jx ST72324Kx

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WATCHDOG TIMER (Cont’d)

10.1.5 Low Power Modes

10.1.6 Hardware Watchdog Option

If Hardware Watchdog is selected by option byte,

the watchdog is always active and the WDGA bit in

the WDGCR is not used. Refer to the Option Byte

description.

10.1.7 Using Halt Mode with the WDG

(WDGHALT option)

The following recommendation applies if Halt

mode is used when the watchdog is enabled.

– Before executing the HALT instruction, refresh

the WDG counter, to avoid an unexpected WDG

reset immediately after waking up the microcon-

troller.

10.1.8 Interrupts

None.

10.1.9 Register Description

CONTROL REGISTER (WDGCR)

Read/Write

Reset Value: 0111 1111 (7Fh)

Bit 7 = WDGA Activation bit.

This bit is set by software and only cleared by

hardware after a reset. When WDGA = 1, the

watchdog can generate a reset.

0: Watchdog disabled

1: Watchdog enabled

Note: This bit is not used if the hardware watch-

dog option is enabled by option byte.

Bit 6:0 = T[6:0] 7-bit counter (MSB to LSB).

These bits contain the value of the watchdog

counter. It is decremented every 16384 fOSC2 cy-

cles (approx.). A reset is produced when it rolls

over from 40h to 3Fh (T6 becomes cleared).

Mode Description

SLOW No effect on Watchdog.

WAIT No effect on Watchdog.

HALT

OIE bit in

MCCSR

WDGHALT bit

in Option

Byte

No Watchdog reset is generated. The MCU enters Halt mode. The Watch-

dog counter is decremented once and then stops counting and is no longer

able to generate a watchdog reset until the MCU receives an external inter-

rupt or a reset.

If an external interrupt is received, the Watchdog restarts counting after 256

or 4096 CPU clocks. If a reset is generated, the Watchdog is disabled (reset

state) unless Hardware Watchdog is selected by option byte. For applica-

tion recommendations see Section 10.1.7 below.

0 1 A reset is generated.

No reset is generated. The MCU enters Active Halt mode. The Watchdog

counter is not decremented. It stop counting. When the MCU receives an

oscillator interrupt or external interrupt, the Watchdog restarts counting im-

mediately. When the MCU receives a reset the Watchdog restarts counting

after 256 or 4096 CPU clocks.

WDGA T6 T5 T4 T3 T2 T1 T0

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Table 14. Watchdog Timer Register Map and Reset Values

Address

(Hex.)

Label 76543210

002Ah WDGCR

Reset Value

WDGA

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10.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK AND BEEPER (MCC/RTC)

The Main Clock Controller consists of three differ-

ent functions:

■a programmable CPU clock prescaler

■a clock-out signal to supply external devices

■a real time clock timer with interrupt capability

Each function can be used independently and si-

multaneously.

10.2.1 Programmable CPU Clock Prescaler

The programmable CPU clock prescaler supplies

the clock for the ST7 CPU and its internal periph-

erals. It manages SLOW power saving mode (See

Section 8.2 SLOW MODE for more details).

The prescaler selects the fCPU main clock frequen-

cy and is controlled by three bits in the MCCSR

10.2.2 Clock-out Capability

The clock-out capability is an alternate function of

an I/O port pin that outputs the fCPU clock to drive

external devices. It is controlled by the MCO bit in

the MCCSR register.

CAUTION: When selected, the clock out pin sus-

pends the clock during ACTIVE-HALT mode.

10.2.3 Real Time Clock Timer (RTC)

The counter of the real time clock timer allows an

interrupt to be generated based on an accurate

real time clock. Four different time bases depend-

ing directly on fOSC2 are available. The whole

functionality is controlled by four bits of the MCC-

SR register: TB[1:0], OIE and OIF.

When the RTC interrupt is enabled (OIE bit set),

the ST7 enters ACTIVE-HALT mode when the

HALT instruction is executed. See Section 8.4 AC-

TIVE-HALT AND HALT MODES for more details.

10.2.4 Beeper

The beep function is controlled by the MCCBCR

on the BEEP pin (I/O port alternate function).

Figure 34. Main Clock Controller (MCC/RTC) Block Diagram

DIV 2, 4, 8, 16

MCC/RTC INTERRUPT

SMSCP1 CP0 TB1 TB0 OIE OIF

CPU CLOCK

MCCSR

12-BIT MCC RTC

COUNTER

TO CPU AND

PERIPHERALS

fOSC2

fCPU

MCO

BC1 BC0

MCCBCR

BEEP

SELECTION

BEEP SIGNAL

WATCHDOG

TIMER

DIV 64

£1

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MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Cont’d)

10.2.5 Low Power Modes

10.2.6 Interrupts

The MCC/RTC interrupt event generates an inter-

rupt if the OIE bit of the MCCSR register is set and

the interrupt mask in the CC register is not active

(RIM instruction).

Note:

The MCC/RTC interrupt wakes up the MCU from

ACTIVE-HALT mode, not from HALT mode.

10.2.7 Register Description

MCC CONTROL/STATUS REGISTER (MCCSR)

Read/Write

Reset Value: 0000 0000 (00h)

Bit 7 = MCO Main clock out selection

This bit enables the MCO alternate function on the

PF0 I/O port. It is set and cleared by software.

0: MCO alternate function disabled (I/O pin free for

general-purpose I/O)

1: MCO alternate function enabled (fCPU on I/O

port)

Note: To reduce power consumption, the MCO

function is not active in ACTIVE-HALT mode.

Bit 6:5 = CP[1:0] CPU clock prescaler

These bits select the CPU clock prescaler which is

applied in the different slow modes. Their action is

conditioned by the setting of the SMS bit. These

two bits are set and cleared by software

Bit 4 = SMS Slow mode select

This bit is set and cleared by software.

0: Normal mode. fCPU = fOSC2

1: Slow mode. fCPU is given by CP1, CP0

See Section 8.2 SLOW MODE and Section 10.2

MAIN CLOCK CONTROLLER WITH REAL TIME

CLOCK AND BEEPER (MCC/RTC) for more de-

tails.

Bit 3:2 = TB[1:0] Time base control

These bits select the programmable divider time

base. They are set and cleared by software.

A modification of the time base is taken into ac-

count at the end of the current period (previously

set) to avoid an unwanted time shift. This allows to

use this time base as a real time clock.

Bit 1 = OIE Oscillator interrupt enable

This bit set and cleared by software.

0: Oscillator interrupt disabled

1: Oscillator interrupt enabled

This interrupt can be used to exit from ACTIVE-

HALT mode.

When this bit is set, calling the ST7 software HALT

instruction enters the ACTIVE-HALT power saving

mode.

Mode Description

WAIT

No effect on MCC/RTC peripheral.

MCC/RTC interrupt cause the device to exit

from WAIT mode.

ACTIVE-

HALT

No effect on MCC/RTC counter (OIE bit is

set), the registers are frozen.

MCC/RTC interrupt cause the device to exit

from ACTIVE-HALT mode.

HALT

MCC/RTC counter and registers are frozen.

MCC/RTC operation resumes when the

MCU is woken up by an interrupt with “exit

from HALT” capability.

Interrupt Event Event

Flag

Enable

Control

Bit

Exit

from

Wait

Exit

from

Halt

Time base overflow

event OIF OIE Yes No 1)

MCO CP1 CP0 SMS TB1 TB0 OIE OIF

fCPU in SLOW mode CP1 CP0

fOSC2 / 2 0 0

fOSC2 / 4 0 1

fOSC2 / 8 1 0

fOSC2 / 16 1 1

Counter

Prescaler

Time Base

TB1 TB0

fOSC2 =4MHz fOSC2=8MHz

16000 4ms 2ms 0 0

32000 8ms 4ms 0 1

80000 20ms 10ms 1 0

200000 50ms 25ms 1 1

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MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Cont’d)

Bit 0 = OIF Oscillator interrupt flag

This bit is set by hardware and cleared by software

reading the MCCSR register. It indicates when set

that the main oscillator has reached the selected

elapsed time (TB1:0).

0: Timeout not reached

1: Timeout reached

CAUTION: The BRES and BSET instructions

must not be used on the MCCSR register to avoid

unintentionally clearing the OIF bit.

MCC BEEP CONTROL REGISTER (MCCBCR)

Read/Write

Reset Value: 0000 0000 (00h)

Bit 7:2 = Reserved, must be kept cleared.

Bit 1:0 = BC[1:0] Beep control

These 2 bits select the PF1 pin beep capability.

The beep output signal is available in ACTIVE-

HALT mode but has to be disabled to reduce the

consumption.

Table 15. Main Clock Controller Register Map and Reset Values

000000BC1BC0

BC1 BC0 Beep mode with fOSC2=8MHz

00 Off

01 ~2-KHz Output

Beep signal

~50% duty cycle

10 ~1-KHz

1 1 ~500-Hz

Address

(Hex.)

Label 76543210

002Bh SICSR

Reset Value 0

AVDIE

AVDF

LVDRF

x000

WDGRF

002Ch MCCSR

Reset Value

MCO

CP1

CP0

SMS

TB1

TB0

OIE

OIF

002Dh MCCBCR

Reset Value000000

BC1

BC0

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10.3 16-BIT TIMER

10.3.1 Introduction

The timer consists of a 16-bit free-running counter

driven by a programmable prescaler.

It may be used for a variety of purposes, including

pulse length measurement of up to two input sig-

nals (input capture) or generation of up to two out-

put waveforms (output compare and PWM).

Pulse lengths and waveform periods can be mod-

ulated from a few microseconds to several milli-

seconds using the timer prescaler and the CPU

clock prescaler.

Some ST7 devices have two on-chip 16-bit timers.

They are completely independent, and do not

share any resources. They are synchronized after

a MCU reset as long as the timer clock frequen-

cies are not modified.

This description covers one or two 16-bit timers. In

ST7 devices with two timers, register names are

prefixed with TA (Timer A) or TB (Timer B).

10.3.2 Main Features

■Programmable prescaler: fCPU divided by 2, 4 or 8.

■Overflow status flag and maskable interrupt

■External clock input (must be at least 4 times

slower than the CPU clock speed) with the choice

of active edge

■1 or 2 Output Compare functions each with:

– 2 dedicated 16-bit registers

– 2 dedicated programmable signals

– 2 dedicated status flags

– 1 dedicated maskable interrupt

■1 or 2 Input Capture functions each with:

– 2 dedicated 16-bit registers

– 2 dedicated active edge selection signals

– 2 dedicated status flags

– 1 dedicated maskable interrupt

■Pulse width modulation mode (PWM)

■One pulse mode

■Reduced Power Mode

■5 alternate functions on I/O ports (ICAP1, ICAP2,

OCMP1, OCMP2, EXTCLK)*

The Block Diagram is shown in Figure 35.

*Note: Some timer pins may not be available (not

bonded) in some ST7 devices. Refer to the device

pin out description.

When reading an input signal on a non-bonded

pin, the value will always be ‘1’.

10.3.3 Functional Description

10.3.3.1 Counter

The main block of the Programmable Timer is a

16-bit free running upcounter and its associated

16-bit registers. The 16-bit registers are made up

of two 8-bit registers called high & low.

Counter Register (CR):

– Counter High Register (CHR) is the most sig-

nificant byte (MS Byte).

– Counter Low Register (CLR) is the least sig-

nificant byte (LS Byte).

Alternate Counter Register (ACR)

– Alternate Counter High Register (ACHR) is

the most significant byte (MS Byte).

– Alternate Counter Low Register (ACLR) is the

least significant byte (LS Byte).

These two read-only 16-bit registers contain the

same value but with the difference that reading the

ACLR register does not clear the TOF bit (Timer

overflow flag), located in the Status register, (SR),

(see note at the end of paragraph titled 16-bit read

sequence).

Writing in the CLR register or ACLR register resets

the free running counter to the FFFCh value.

Both counters have a reset value of FFFCh (this is

the only value which is reloaded in the 16-bit tim-

er). The reset value of both counters is also

FFFCh in One Pulse mode and PWM mode.

The timer clock depends on the clock control bits

of the CR2 register, as illustrated in Table 16 Clock

Control Bits. The value in the counter register re-

peats every 131072, 262144 or 524288 CPU clock

cycles depending on the CC[1:0] bits.

The timer frequency can be fCPU/2, fCPU/4, fCPU/8

or an external frequency.

Caution: In Flash devices, Timer A functionality

has the following restrictions:

– TAOC2HR and TAOC2LR registers are write

only

– Input Capture 2 is not implemented

– The corresponding interrupts cannot be used

(ICF2, OCF2 forced by hardware to zero)

LATCH 1

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16-BIT TIMER (Cont’d)

Figure 35. Timer Block Diagram

MCU-PERIPHERAL INTERFACE

COUNTER

ALTERNATE

OUTPUT

COMPARE

OUTPUT COMPARE EDGE DETECT

OVERFLOW

DETECT

CIRCUIT

1/2

1/4

1/8

8-bit

buffer

ST7 INTERNAL BUS

LATCH1 OCMP1

ICAP1

EXTCLK

fCPU

TIMER INTERRUPT

ICF2ICF1 TIMD 00

OCF2OCF1 TOF

PWMOC1E EXEDG

IEDG2CC0CC1

OC2E OPMFOLV2ICIE OLVL1IEDG1OLVL2FOLV1OCIE TOIE

ICAP2

LATCH2 OCMP2

8 low

8 high

16 16

(Control Register 1) CR1 (Control Register 2) CR2

(Control/Status Register)

8 8 8

88 8

high

low

high

low

EXEDG

TIMER INTERNAL BUS

CIRCUIT1

EDGE DETECT

CIRCUIT2

CIRCUIT

OUTPUT

COMPARE

INPUT

CAPTURE

INPUT

CAPTURE

CC[1:0]

COUNTER

Note: If IC, OC and TO interrupt requests have separate vectors

then the last OR is not present (See device Interrupt Vector Table)

(See note)

CSR

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16-BIT TIMER (Cont’d)

16-bit read sequence: (from either the Counter

The user must read the MS Byte first, then the LS

Byte value is buffered automatically.

This buffered value remains unchanged until the

16-bit read sequence is completed, even if the

user reads the MS Byte several times.

After a complete reading sequence, if only the

CLR register or ACLR register are read, they re-

turn the LS Byte of the count value at the time of

the read.

Whatever the timer mode used (input capture, out-

put compare, one pulse mode or PWM mode) an

overflow occurs when the counter rolls over from

FFFFh to 0000h then:

– The TOF bit of the SR register is set.

– A timer interrupt is generated if:

– TOIE bit of the CR1 register is set and

– I bit of the CC register is cleared.

If one of these conditions is false, the interrupt re-

mains pending to be issued as soon as they are

both true.

Clearing the overflow interrupt request is done in

two steps:

1. Reading the SR register while the TOF bit is set.

2. An access (read or write) to the CLR register.

Notes: The TOF bit is not cleared by accesses to

ACLR register. The advantage of accessing the

ACLR register rather than the CLR register is that

it allows simultaneous use of the overflow function

and reading the free running counter at random

times (for example, to measure elapsed time) with-

out the risk of clearing the TOF bit erroneously.

The timer is not affected by WAIT mode.

In HALT mode, the counter stops counting until the

mode is exited. Counting then resumes from the

previous count (MCU awakened by an interrupt) or

from the reset count (MCU awakened by a Reset).

10.3.3.2 External Clock

The external clock (where available) is selected if

CC0=1 and CC1=1 in the CR2 register.

The status of the EXEDG bit in the CR2 register

determines the type of level transition on the exter-

nal clock pin EXTCLK that will trigger the free run-

ning counter.

The counter is synchronized with the falling edge

of the internal CPU clock.

A minimum of four falling edges of the CPU clock

must occur between two consecutive active edges

of the external clock; thus the external clock fre-

quency must be less than a quarter of the CPU

clock frequency.

is buffered

Read

At t0

Read Returns the buffered

LS Byte value at t0

At t0 +∆t

Other

instructions

Beginning of the sequence

Sequence completed

LS Byte

MS Byte

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16-BIT TIMER (Cont’d)

Figure 36. Counter Timing Diagram, internal clock divided by 2

Figure 37. Counter Timing Diagram, internal clock divided by 4

Figure 38. Counter Timing Diagram, internal clock divided by 8

Note: The MCU is in reset state when the internal reset signal is high, when it is low the MCU is running.

CPU CLOCK

FFFD FFFE FFFF 0000 0001 0002 0003

INTERNAL RESET

TIMER CLOCK

COUNTER REGISTER

TIMER OVERFLOW FLAG (TOF)

FFFC FFFD 0000 0001

CPU CLOCK

INTERNAL RESET

TIMER CLOCK

COUNTER REGISTER

TIMER OVERFLOW FLAG (TOF)

CPU CLOCK

INTERNAL RESET

TIMER CLOCK

COUNTER REGISTER

TIMER OVERFLOW FLAG (TOF)

FFFC FFFD 0000

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16-BIT TIMER (Cont’d)

10.3.3.3 Input Capture

In this section, the index, i, may be 1 or 2 because

there are 2 input capture functions in the 16-bit

timer.

The two 16-bit input capture registers (IC1R and

IC2R) are used to latch the value of the free run-

ning counter after a transition is detected on the

ICAPi pin (see figure 5).

ICiR register is a read-only register.

The active transition is software programmable

through the IEDGi bit of Control Registers (CRi).

Timing resolution is one count of the free running

counter: (fCPU/CC[1:0]).

Procedure:

To use the input capture function select the follow-

ing in the CR2 register:

– Select the timer clock (CC[1:0]) (see Table 16

Clock Control Bits).

– Select the edge of the active transition on the

ICAP2 pin with the IEDG2 bit (the ICAP2 pin

must be configured as floating input or input with

pull-up without interrupt if this configuration is

available).

And select the following in the CR1 register:

– Set the ICIE bit to generate an interrupt after an

input capture coming from either the ICAP1 pin

or the ICAP2 pin

– Select the edge of the active transition on the

ICAP1 pin with the IEDG1 bit (the ICAP1pin must

be configured as floating input or input with pull-

up without interrupt if this configuration is availa-

ble).

When an input capture occurs:

– ICFi bit is set.

– The ICiR register contains the value of the free

running counter on the active transition on the

ICAPi pin (see Figure 40).

– A timer interrupt is generated if the ICIE bit is set

and the I bit is cleared in the CC register. Other-

wise, the interrupt remains pending until both

conditions become true.

Clearing the Input Capture interrupt request (i.e.

clearing the ICFi bit) is done in two steps:

1. Reading the SR register while the ICFi bit is set.

2. An access (read or write) to the ICiLR register.

Notes:

1. After reading the ICiHR register, transfer of

input capture data is inhibited and ICFi will

never be set until the ICiLR register is also

read.

2. The ICiR register contains the free running

counter value which corresponds to the most

recent input capture.

3. The 2 input capture functions can be used

together even if the timer also uses the 2 output

compare functions.

4. In One pulse Mode and PWM mode only Input

Capture 2 can be used.

5. The alternate inputs (ICAP1 & ICAP2) are

always directly connected to the timer. So any

transitions on these pins activates the input

capture function.

Moreover if one of the ICAPi pins is configured

as an input and the second one as an output,

an interrupt can be generated if the user tog-

gles the output pin and if the ICIE bit is set.

This can be avoided if the input capture func-

tion i is disabled by reading the ICiHR (see note

1).

6. The TOF bit can be used with interrupt genera-

tion in order to measure events that go beyond

the timer range (FFFFh).

7. In Flash devices, the ICAP2 registers

(TAIC2HR, TAIC2LR) are not available on

Timer A. The corresponding interrupts cannot

be used (ICF2 is forced by hardware to 0).

MS Byte LS Byte

ICiR ICiHR ICiLR

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16-BIT TIMER (Cont’d)

Figure 39. Input Capture Block Diagram

Figure 40. Input Capture Timing Diagram

ICIE

CC0

CC1

16-BIT FREE RUNNING

COUNTER

IEDG1

(Control Register 1) CR1

(Control Register 2) CR2

ICF2ICF1 000

(Status Register) SR

IEDG2

ICAP1

ICAP2

EDGE DETECT

CIRCUIT2

16-BIT

IC1R Register

IC2R Register

EDGE DETECT

CIRCUIT1

FF01 FF02 FF03

FF03

TIMER CLOCK

COUNTER REGISTER

ICAPi PIN

ICAPi FLAG

ICAPi REGISTER

Note: The rising edge is the active edge.

£1

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16-BIT TIMER (Cont’d)

10.3.3.4 Output Compare

In this section, the index, i, may be 1 or 2 because

there are 2 output compare functions in the 16-bit

timer.

This function can be used to control an output

waveform or indicate when a period of time has

elapsed.

When a match is found between the Output Com-

pare register and the free running counter, the out-

put compare function:

– Assigns pins with a programmable value if the

OCiE bit is set

– Sets a flag in the status register

– Generates an interrupt if enabled

Two 16-bit registers Output Compare Register 1

(OC1R) and Output Compare Register 2 (OC2R)

contain the value to be compared to the counter

These registers are readable and writable and are

not affected by the timer hardware. A reset event

changes the OCiR value to 8000h.

Timing resolution is one count of the free running

counter: (fCPU/CC[1:0]).

Procedure:

To use the output compare function, select the fol-

lowing in the CR2 register:

– Set the OCiE bit if an output is needed then the

OCMPi pin is dedicated to the output compare i

signal.

– Select the timer clock (CC[1:0]) (see Table 16

Clock Control Bits).

And select the following in the CR1 register:

– Select the OLVLi bit to applied to the OCMPi pins

after the match occurs.

– Set the OCIE bit to generate an interrupt if it is

needed.

When a match is found between OCRi register

and CR register:

– OCFi bit is set.

– The OCMPi pin takes OLVLi bit value (OCMPi

pin latch is forced low during reset).

– A timer interrupt is generated if the OCIE bit is

set in the CR1 register and the I bit is cleared in

the CC register (CC).

The OCiR register value required for a specific tim-

ing application can be calculated using the follow-

ing formula:

Where:

∆t = Output compare period (in seconds)

fCPU = CPU clock frequency (in hertz)

PRESC = Timer prescaler factor (2, 4 or 8 de-

pending on CC[1:0] bits, see Table 16

Clock Control Bits)

If the timer clock is an external clock, the formula

is:

Where:

∆t = Output compare period (in seconds)

fEXT = External timer clock frequency (in hertz)

Clearing the output compare interrupt request (i.e.

clearing the OCFi bit) is done by:

1. Reading the SR register while the OCFi bit is

set.

2. An access (read or write) to the OCiLR register.

The following procedure is recommended to pre-

vent the OCFi bit from being set between the time

it is read and the write to the OCiR register:

– Write to the OCiHR register (further compares

are inhibited).

– Read the SR register (first step of the clearance

of the OCFi bit, which may be already set).

– Write to the OCiLR register (enables the output

compare function and clears the OCFi bit).

MS Byte LS Byte

OCiROCiHR OCiLR

∆ OCiR = ∆t * fCPU

PRESC

∆ OCiR = ∆t * fEXT

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16-BIT TIMER (Cont’d)

Notes:

1. After a processor write cycle to the OCiHR reg-

ister, the output compare function is inhibited

until the OCiLR register is also written.

2. If the OCiE bit is not set, the OCMPi pin is a

general I/O port and the OLVLi bit will not

appear when a match is found but an interrupt

could be generated if the OCIE bit is set.

3. When the timer clock is fCPU/2, OCFi and

OCMPi are set while the counter value equals

the OCiR register value (see Figure 42 on page

67). This behaviour is the same in OPM or

PWM mode.

When the timer clock is fCPU/4, fCPU/8 or in

external clock mode, OCFi and OCMPi are set

while the counter value equals the OCiR regis-

ter value plus 1 (see Figure 43 on page 67).

4. The output compare functions can be used both

for generating external events on the OCMPi

pins even if the input capture mode is also

used.

5. The value in the 16-bit OCiR register and the

OLVi bit should be changed after each suc-

cessful comparison in order to control an output

waveform or establish a new elapsed timeout.

6. In Flash devices, the TAOC2HR, TAOC2LR

registers are “write only” in Timer A. The corre-

sponding event cannot be generated (OCF2 is

forced by hardware to 0).

Forced Compare Output capability

When the FOLVi bit is set by software, the OLVLi

bit is copied to the OCMPi pin. The OLVi bit has to

be toggled in order to toggle the OCMPi pin when

it is enabled (OCiE bit=1). The OCFi bit is then not

set by hardware, and thus no interrupt request is

generated.

The FOLVLi bits have no effect in both one pulse

mode and PWM mode.

Figure 41. Output Compare Block Diagram

OUTPUT COMPARE

16-bit

CIRCUIT

OC1R Register

16 BIT FREE RUNNING

COUNTER OC1E CC0CC1

OC2E

OLVL1OLVL2OCIE

(Control Register 1) CR1

(Control Register 2) CR2

000OCF2OCF1

(Status Register) SR

16-bit

OCMP1

OCMP2

Latch

OC2R Register

FOLV2 FOLV1

TIMER fCPU WWW M —l— J TIMER fCPU LL —l—|_ —l— —li £1

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16-BIT TIMER (Cont’d)

Figure 42. Output Compare Timing Diagram, fTIMER =fCPU/2

Figure 43. Output Compare Timing Diagram, fTIMER =fCPU/4

INTERNAL CPU CLOCK

TIMER CLOCK

COUNTER REGISTER

OUTPUT COMPARE REGISTER i (OCRi)

OUTPUT COMPARE FLAG i (OCFi)

OCMPi PIN (OLVLi=1)

2ED3

2ED0 2ED1 2ED2 2ED3 2ED42ECF

INTERNAL CPU CLOCK

TIMER CLOCK

COUNTER REGISTER

OUTPUT COMPARE REGISTER i (OCRi)

COMPARE REGISTER i LATCH

2ED3

2ED0 2ED1 2ED2 2ED3 2ED42ECF

OCMPi PIN (OLVLi=1)

OUTPUT COMPARE FLAG i (OCFi)

‘7

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16-BIT TIMER (Cont’d)

10.3.3.5 One Pulse Mode

One Pulse mode enables the generation of a

pulse when an external event occurs. This mode is

selected via the OPM bit in the CR2 register.

The one pulse mode uses the Input Capture1

function and the Output Compare1 function.

Procedure:

To use one pulse mode:

1. Load the OC1R register with the value corre-

sponding to the length of the pulse (see the for-

mula in the opposite column).

2. Select the following in the CR1 register:

– Using the OLVL1 bit, select the level to be ap-

plied to the OCMP1 pin after the pulse.

– Using the OLVL2 bit, select the level to be ap-

plied to the OCMP1 pin during the pulse.

– Select the edge of the active transition on the

ICAP1 pin with the IEDG1 bit (the ICAP1 pin

must be configured as floating input).

3. Select the following in the CR2 register:

– Set the OC1E bit, the OCMP1 pin is then ded-

icated to the Output Compare 1 function.

– Set the OPM bit.

– Select the timer clock CC[1:0] (see Table 16

Clock Control Bits).

Then, on a valid event on the ICAP1 pin, the coun-

ter is initialized to FFFCh and OLVL2 bit is loaded

on the OCMP1 pin, the ICF1 bit is set and the val-

ue FFFDh is loaded in the IC1R register.

Because the ICF1 bit is set when an active edge

occurs, an interrupt can be generated if the ICIE

bit is set.

Clearing the Input Capture interrupt request (i.e.

clearing the ICFi bit) is done in two steps:

1. Reading the SR register while the ICFi bit is set.

2. An access (read or write) to the ICiLR register.

The OC1R register value required for a specific

timing application can be calculated using the fol-

lowing formula:

Where:

t = Pulse period (in seconds)

fCPU = CPU clock frequency (in hertz)

PRESC = Timer prescaler factor (2, 4 or 8 depend-

ing on the CC[1:0] bits, see Table 16

Clock Control Bits)

If the timer clock is an external clock the formula is:

Where:

t = Pulse period (in seconds)

fEXT = External timer clock frequency (in hertz)

When the value of the counter is equal to the value

of the contents of the OC1R register, the OLVL1

bit is output on the OCMP1 pin, (See Figure 44).

Notes:

1. The OCF1 bit cannot be set by hardware in one

pulse mode but the OCF2 bit can generate an

Output Compare interrupt.

2. When the Pulse Width Modulation (PWM) and

One Pulse Mode (OPM) bits are both set, the

PWM mode is the only active one.

3. If OLVL1=OLVL2 a continuous signal will be

seen on the OCMP1 pin.

4. The ICAP1 pin can not be used to perform input

capture. The ICAP2 pin can be used to perform

input capture (ICF2 can be set and IC2R can be

loaded) but the user must take care that the

counter is reset each time a valid edge occurs

on the ICAP1 pin and ICF1 can also generates

interrupt if ICIE is set.

5. When one pulse mode is used OC1R is dedi-

cated to this mode. Nevertheless OC2R and

OCF2 can be used to indicate a period of time

has been elapsed but cannot generate an out-

put waveform because the level OLVL2 is dedi-

cated to the one pulse mode.

6. In Flash devices, Timer A OCF2 bit is forced by

hardware to 0.

event occurs

Counter

= OC1R OCMP1 = OLVL1

When

on ICAP1

One pulse mode cycle

OCMP1 = OLVL2

Counter is reset

to FFFCh

ICF1 bit is set

ICR1 = Counter

OCiR Value = t * fCPU

PRESC

- 5

OCiR = t * fEXT -5

2X XF XF X: :X X 1X 2X X34E2X J lLA £1

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16-BIT TIMER (Cont’d)

Figure 44. One Pulse Mode Timing Example

Figure 45. Pulse Width Modulation Mode Timing Example with 2 Output Compare Functions

COUNTER FFFC FFFD FFFE 2ED0 2ED1 2ED2

2ED3

FFFC FFFD

OLVL2 OLVL2OLVL1

ICAP1

OCMP1 compare1

Note: IEDG1=1, OC1R=2ED0h, OLVL1=0, OLVL2=1

01F8

01F8 2ED3

IC1R

COUNTER 34E2 34E2 FFFC

OLVL2 OLVL2

OLVL1

OCMP1

compare2 compare1 compare2

Note: OC1R=2ED0h, OC2R=34E2, OLVL1=0, OLVL2= 1

FFFC FFFD FFFE 2ED0 2ED1 2ED2

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16-BIT TIMER (Cont’d)

10.3.3.6 Pulse Width Modulation Mode

Pulse Width Modulation (PWM) mode enables the

generation of a signal with a frequency and pulse

length determined by the value of the OC1R and

OC2R registers.

Pulse Width Modulation mode uses the complete

Output Compare 1 function plus the OC2R regis-

ter, and so this functionality can not be used when

PWM mode is activated.

In PWM mode, double buffering is implemented on

the output compare registers. Any new values writ-

ten in the OC1R and OC2R registers are taken

into account only at the end of the PWM period

(OC2) to avoid spikes on the PWM output pin

(OCMP1).

Procedure

To use pulse width modulation mode:

1. Load the OC2R register with the value corre-

sponding to the period of the signal using the

formula in the opposite column.

2. Load the OC1R register with the value corre-

sponding to the period of the pulse if (OLVL1=0

and OLVL2=1) using the formula in the oppo-

site column.

3. Select the following in the CR1 register:

– Using the OLVL1 bit, select the level to be ap-

plied to the OCMP1 pin after a successful

comparison with the OC1R register.

– Using the OLVL2 bit, select the level to be ap-

plied to the OCMP1 pin after a successful

comparison with the OC2R register.

4. Select the following in the CR2 register:

– Set OC1E bit: the OCMP1 pin is then dedicat-

ed to the output compare 1 function.

– Set the PWM bit.

– Select the timer clock (CC[1:0]) (see Table 16

Clock Control Bits).

If OLVL1=1 and OLVL2=0 the length of the posi-

tive pulse is the difference between the OC2R and

OC1R registers.

If OLVL1=OLVL2 a continuous signal will be seen

on the OCMP1 pin.

The OCiR register value required for a specific tim-

ing application can be calculated using the follow-

ing formula:

Where:

t = Signal or pulse period (in seconds)

fCPU = CPU clock frequency (in hertz)

PRESC = Timer prescaler factor (2, 4 or 8 depend-

ing on CC[1:0] bits, see Table 16)

If the timer clock is an external clock the formula is:

Where:

t = Signal or pulse period (in seconds)

fEXT = External timer clock frequency (in hertz)

The Output Compare 2 event causes the counter

to be initialized to FFFCh (See Figure 45)

Notes:

1. After a write instruction to the OCiHR register,

the output compare function is inhibited until the

OCiLR register is also written.

2. The OCF1 and OCF2 bits cannot be set by

hardware in PWM mode therefore the Output

Compare interrupt is inhibited.

3. The ICF1 bit is set by hardware when the coun-

ter reaches the OC2R value and can produce a

timer interrupt if the ICIE bit is set and the I bit is

cleared.

4. In PWM mode the ICAP1 pin can not be used

to perform input capture because it is discon-

nected to the timer. The ICAP2 pin can be used

to perform input capture (ICF2 can be set and

IC2R can be loaded) but the user must take

care that the counter is reset each period and

ICF1 can also generates interrupt if ICIE is set.

5. When the Pulse Width Modulation (PWM) and

One Pulse Mode (OPM) bits are both set, the

PWM mode is the only active one.

6. In Flash devices, the TAOC2HR, TAOC2LR

registers in Timer A are “write only”. A read

operation returns an undefined value.

7. In Flash devices, the ICAP2 registers

(TAIC2HR, TAIC2LR) are not available in Timer A.

The ICF2 bit is forced by hardware to 0.

Counter

OCMP1 = OLVL2

Counter

= OC2R

OCMP1 = OLVL1

When

= OC1R

Pulse Width Modulation cycle

Counter is reset

to FFFCh

ICF1 bit is set

OCiR Value = t * fCPU

PRESC

- 5

OCiR = t * fEXT -5

£1

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16-BIT TIMER (Cont’d)

10.3.4 Low Power Modes

10.3.5 Interrupts

Note: The 16-bit Timer interrupt events are connected to the same interrupt vector (see Interrupts chap-

ter). These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt

mask in the CC register is reset (RIM instruction).

* In Flash devices, the ICF2 and OCF2 bits are forced by hardware to 0 in Timer A, hence there is no in-

terrupt event for these flags.

10.3.6 Summary of Timer modes

1) See note 4 in Section 10.3.3.5 One Pulse Mode

2) See note 5 and 6 in Section 10.3.3.5 One Pulse Mode

3) See note 4 in Section 10.3.3.6 Pulse Width Modulation Mode

4) In Flash devices, the TAOC2HR, TAOC2LR registers are write only in Timer A. Output Compare 2

event cannot be generated, OCF2 is forced by hardware to 0.

5) In Flash devices, Input Capture 2 is not implemented in Timer A. ICF2 bit is forced by hardware to 0.

Mode Description

WAIT No effect on 16-bit Timer.

Timer interrupts cause the device to exit from WAIT mode.

HALT

16-bit Timer registers are frozen.

In HALT mode, the counter stops counting until Halt mode is exited. Counting resumes from the previous

count when the MCU is woken up by an interrupt with “exit from HALT mode” capability or from the counter

reset value when the MCU is woken up by a RESET.

If an input capture event occurs on the ICAPi pin, the input capture detection circuitry is armed. Consequent-

ly, when the MCU is woken up by an interrupt with “exit from HALT mode” capability, the ICFi bit is set, and

the counter value present when exiting from HALT mode is captured into the ICiR register.

Interrupt Event Event

Flag

Enable

Control

Bit

Exit

from

Wait

Exit

from

Halt

Input Capture 1 event/Counter reset in PWM mode ICF1 ICIE Yes No

Input Capture 2 event ICF2*Yes No

Output Compare 1 event (not available in PWM mode) OCF1 OCIE Yes No

Output Compare 2 event (not available in PWM mode) OCF2*Yes No

Timer Overflow event TOF TOIE Yes No

MODES TIMER RESOURCES

Input Capture 1 Input Capture 2 Output Compare 1 Output Compare 2

Input Capture (1 and/or 2) Yes Yes2)5) Yes Yes4)

Output Compare (1 and/or 2) Yes Yes5) Yes Yes4)

One Pulse Mode No Not

Recommended1)5) No Partially 2)

PWM Mode No Not

Recommended3)5) No No

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16-BIT TIMER (Cont’d)

10.3.7 Register Description

Each Timer is associated with three control and

status registers, and with six pairs of data registers

(16-bit values) relating to the two input captures,

the two output compares, the counter and the al-

ternate counter.

CONTROL REGISTER 1 (CR1)

Read/Write

Reset Value: 0000 0000 (00h)

Bit 7 = ICIE Input Capture Interrupt Enable.

0: Interrupt is inhibited.

1: A timer interrupt is generated whenever the

ICF1 or ICF2 bit of the SR register is set.

Bit 6 = OCIE Output Compare Interrupt Enable.

0: Interrupt is inhibited.

1: A timer interrupt is generated whenever the

OCF1 or OCF2 bit of the SR register is set.

Bit 5 = TOIE Timer Overflow Interrupt Enable.

0: Interrupt is inhibited.

1: A timer interrupt is enabled whenever the TOF

bit of the SR register is set.

Bit 4 = FOLV2 Forced Output Compare 2.

This bit is set and cleared by software.

0: No effect on the OCMP2 pin.

1: Forces the OLVL2 bit to be copied to the

OCMP2 pin, if the OC2E bit is set and even if

there is no successful comparison.

Bit 3 = FOLV1 Forced Output Compare 1.

This bit is set and cleared by software.

0: No effect on the OCMP1 pin.

1: Forces OLVL1 to be copied to the OCMP1 pin, if

the OC1E bit is set and even if there is no suc-

cessful comparison.

Bit 2 = OLVL2 Output Level 2.

This bit is copied to the OCMP2 pin whenever a

successful comparison occurs with the OC2R reg-

ister and OCxE is set in the CR2 register. This val-

ue is copied to the OCMP1 pin in One Pulse Mode

and Pulse Width Modulation mode.

Bit 1 = IEDG1 Input Edge 1.

This bit determines which type of level transition

on the ICAP1 pin will trigger the capture.

0: A falling edge triggers the capture.

1: A rising edge triggers the capture.

Bit 0 = OLVL1 Output Level 1.

The OLVL1 bit is copied to the OCMP1 pin when-

ever a successful comparison occurs with the

OC1R register and the OC1E bit is set in the CR2

ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1

£1

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16-BIT TIMER (Cont’d)

CONTROL REGISTER 2 (CR2)

Read/Write

Reset Value: 0000 0000 (00h)

Bit 7 = OC1E Output Compare 1 Pin Enable.

This bit is used only to output the signal from the

timer on the OCMP1 pin (OLV1 in Output Com-

pare mode, both OLV1 and OLV2 in PWM and

one-pulse mode). Whatever the value of the OC1E

bit, the Output Compare 1 function of the timer re-

mains active.

0: OCMP1 pin alternate function disabled (I/O pin

free for general-purpose I/O).

1: OCMP1 pin alternate function enabled.

Bit 6 = OC2E Output Compare 2 Pin Enable.

This bit is used only to output the signal from the

timer on the OCMP2 pin (OLV2 in Output Com-

pare mode). Whatever the value of the OC2E bit,

the Output Compare 2 function of the timer re-

mains active.

0: OCMP2 pin alternate function disabled (I/O pin

free for general-purpose I/O).

1: OCMP2 pin alternate function enabled.

Note: In Flash devices, this bit is not available for

Timer A. It must be kept at its reset value.

Bit 5 = OPM One Pulse Mode.

0: One Pulse Mode is not active.

1: One Pulse Mode is active, the ICAP1 pin can be

used to trigger one pulse on the OCMP1 pin; the

active transition is given by the IEDG1 bit. The

length of the generated pulse depends on the

contents of the OC1R register.

Bit 4 = PWM Pulse Width Modulation.

0: PWM mode is not active.

1: PWM mode is active, the OCMP1 pin outputs a

programmable cyclic signal; the length of the

pulse depends on the value of OC1R register;

the period depends on the value of OC2R regis-

ter.

Bit 3, 2 = CC[1:0] Clock Control.

The timer clock mode depends on these bits:

Table 16. Clock Control Bits

Note: If the external clock pin is not available, pro-

gramming the external clock configuration stops

the counter.

Bit 1 = IEDG2 Input Edge 2.

This bit determines which type of level transition

on the ICAP2 pin will trigger the capture.

0: A falling edge triggers the capture.

1: A rising edge triggers the capture.

Bit 0 = EXEDG External Clock Edge.

This bit determines which type of level transition

on the external clock pin EXTCLK will trigger the

counter register.

0: A falling edge triggers the counter register.

1: A rising edge triggers the counter register.

OC1E OC2E OPM PWM CC1 CC0 IEDG2 EXEDG

Timer Clock CC1 CC0

fCPU / 4 0 0

fCPU / 2 0 1

fCPU / 8 1 0

External Clock (where

available) 11

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16-BIT TIMER (Cont’d)

CONTROL/STATUS REGISTER (CSR)

Read Only (except bit 2 R/W)

Reset Value: xxxx x0xx (xxh)

Bit 7 = ICF1 Input Capture Flag 1.

0: No input capture (reset value).

1: An input capture has occurred on the ICAP1 pin

or the counter has reached the OC2R value in

PWM mode. To clear this bit, first read the SR

IC1R (IC1LR) register.

Bit 6 = OCF1 Output Compare Flag 1.

0: No match (reset value).

1: The content of the free running counter has

matched the content of the OC1R register. To

clear this bit, first read the SR register, then read

or write the low byte of the OC1R (OC1LR) reg-

ister.

Bit 5 = TOF Timer Overflow Flag.

0: No timer overflow (reset value).

1: The free running counter rolled over from FFFFh

to 0000h. To clear this bit, first read the SR reg-

ister, then read or write the low byte of the CR

(CLR) register.

Note: Reading or writing the ACLR register does

not clear TOF.

Bit 4 = ICF2 Input Capture Flag 2.

0: No input capture (reset value).

1: An input capture has occurred on the ICAP2

pin. To clear this bit, first read the SR register,

then read or write the low byte of the IC2R

(IC2LR) register.

Note: In Flash devices, this bit is not available for

Timer A and is forced by hardware to 0.

Bit 3 = OCF2 Output Compare Flag 2.

0: No match (reset value).

1: The content of the free running counter has

matched the content of the OC2R register. To

clear this bit, first read the SR register, then read

or write the low byte of the OC2R (OC2LR) reg-

ister.

Note: In Flash devices, this bit is not available for

Timer A and is forced by hardware to 0.

Bit 2 = TIMD Timer disable.

This bit is set and cleared by software. When set, it

freezes the timer prescaler and counter and disa-

bled the output functions (OCMP1 and OCMP2

pins) to reduce power consumption. Access to the

timer registers is still available, allowing the timer

configuration to be changed, or the counter reset,

while it is disabled.

0: Timer enabled

1: Timer prescaler, counter and outputs disabled

Bits 1:0 = Reserved, must be kept cleared.

ICF1 OCF1 TOF ICF2 OCF2 TIMD 0 0

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16-BIT TIMER (Cont’d)

INPUT CAPTURE 1 HIGH REGISTER (IC1HR)

Read Only

Reset Value: Undefined

This is an 8-bit read only register that contains the

high part of the counter value (transferred by the

input capture 1 event).

INPUT CAPTURE 1 LOW REGISTER (IC1LR)

Read Only

Reset Value: Undefined

This is an 8-bit read only register that contains the

low part of the counter value (transferred by the in-

put capture 1 event).

OUTPUT COMPARE 1 HIGH REGISTER

(OC1HR)

Read/Write

Reset Value: 1000 0000 (80h)

This is an 8-bit register that contains the high part

of the value to be compared to the CHR register.

OUTPUT COMPARE 1 LOW REGISTER

(OC1LR)

Read/Write

Reset Value: 0000 0000 (00h)

This is an 8-bit register that contains the low part of

the value to be compared to the CLR register.

MSB LSB

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16-BIT TIMER (Cont’d)

OUTPUT COMPARE 2 HIGH REGISTER

(OC2HR)

Read/Write

Reset Value: 1000 0000 (80h)

This is an 8-bit register that contains the high part

of the value to be compared to the CHR register.

Note: In Flash devices, the Timer A OC2HR regis-

ter is write-only.

OUTPUT COMPARE 2 LOW REGISTER

(OC2LR)

Read/Write

Reset Value: 0000 0000 (00h)

This is an 8-bit register that contains the low part of

the value to be compared to the CLR register.

Note: In Flash devices, the Timer A OC2LR regis-

ter is write-only.

COUNTER HIGH REGISTER (CHR)

Read Only

Reset Value: 1111 1111 (FFh)

This is an 8-bit register that contains the high part

of the counter value.

COUNTER LOW REGISTER (CLR)

Read Only

Reset Value: 1111 1100 (FCh)

This is an 8-bit register that contains the low part of

the counter value. A write to this register resets the

counter. An access to this register after accessing

the CSR register clears the TOF bit.

MSB LSB

£1

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ALTERNATE COUNTER HIGH REGISTER

(ACHR)

Read Only

Reset Value: 1111 1111 (FFh)

This is an 8-bit register that contains the high part

of the counter value.

ALTERNATE COUNTER LOW REGISTER

(ACLR)

Read Only

Reset Value: 1111 1100 (FCh)

This is an 8-bit register that contains the low part of

the counter value. A write to this register resets the

counter. An access to this register after an access

to CSR register does not clear the TOF bit in the

CSR register.

INPUT CAPTURE 2 HIGH REGISTER (IC2HR)

Read Only

Reset Value: Undefined

This is an 8-bit read only register that contains the

high part of the counter value (transferred by the

Input Capture 2 event).

Note: In Flash devices, this register is not imple-

mented for Timer A.

INPUT CAPTURE 2 LOW REGISTER (IC2LR)

Read Only

Reset Value: Undefined

This is an 8-bit read only register that contains the

low part of the counter value (transferred by the In-

put Capture 2 event).

Note: In Flash devices, this register is not imple-

mented for Timer A.

MSB LSB

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16-BIT TIMER (Cont’d)

Table 17. 16-Bit Timer Register Map and Reset Values

1 In Flash devices, these bits are not used in Timer A and must be kept cleared.

2 In Flash devices, these bits are forced by hardware to 0 in Timer A

3 In Flash devices, the TAOC2HR and TAOC2LR Registers are write only, reading them will return unde-

fined values

4 In Flash devices, the TAIC2HR and TAIC2LR registers are not present.

Address

(Hex.)

Label 76543210

Timer A: 32

Timer B: 42

CR1

Reset Value

ICIE

OCIE

TOIE

FOLV21

FOLV1

OLVL2

IEDG1

OLVL1

Timer A: 31

Timer B: 41

CR2

Reset Value

OC1E

OC2E1

OPM

PWM

CC1

CC0

IEDG21

EXEDG

Timer A: 33

Timer B: 43

CSR

Reset Value

ICF1

OCF1

TOF

ICF22

OCF22

TIMD

Timer A: 34

Timer B: 44

IC1HR

Reset Value

MSB

xxxxxxx

LSB

Timer A: 35

Timer B: 45

IC1LR

Reset Value

MSB

xxxxxxx

LSB

Timer A: 36

Timer B: 46

OC1HR

Reset Value

MSB

1000000

LSB

Timer A: 37

Timer B: 47

OC1LR

Reset Value

MSB

0000000

LSB

Timer A: 3E3

Timer B: 4E

OC2HR

Reset Value

MSB

1000000

LSB

Timer A: 3F3

Timer B: 4F

OC2LR

Reset Value

MSB

0000000

LSB

Timer A: 38

Timer B: 48

CHR

Reset Value

MSB

1111111

LSB

Timer A: 39

Timer B: 49

CLR

Reset Value

MSB

1111110

LSB

Timer A: 3A

Timer B: 4A

ACHR

Reset Value

MSB

1111111

LSB

Timer A: 3B

Timer B: 4B

ACLR

Reset Value

MSB

1111110

LSB

Timer A: 3C4

Timer B: 4C

IC2HR

Reset Value

MSB

xxxxxxx

LSB

Timer A: 3D4

Timer B: 4D

IC2LR

Reset Value

MSB

xxxxxxx

LSB

jAﬂ‘ﬁﬁi f f

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10.4 SERIAL PERIPHERAL INTERFACE (SPI)

10.4.1 Introduction

The Serial Peripheral Interface (SPI) allows full-

duplex, synchronous, serial communication with

external devices. An SPI system may consist of a

master and one or more slaves however the SPI

interface can not be a master in a multi-master

system.

10.4.2 Main Features

■Full duplex synchronous transfers (on 3 lines)

■Simplex synchronous transfers (on 2 lines)

■Master or slave operation

■Six master mode frequencies (fCPU/4 max.)

■fCPU/2 max. slave mode frequency (see note)

■SS Management by software or hardware

■Programmable clock polarity and phase

■End of transfer interrupt flag

■Write collision, Master Mode Fault and Overrun

flags

Note: In slave mode, continuous transmission is

not possible at maximum frequency due to the

software overhead for clearing status flags and to

initiate the next transmission sequence.

10.4.3 General Description

Figure 46 shows the serial peripheral interface

(SPI) block diagram. There are 3 registers:

– SPI Control Register (SPICR)

– SPI Control/Status Register (SPICSR)

– SPI Data Register (SPIDR)

The SPI is connected to external devices through

4 pins:

– MISO: Master In / Slave Out data

– MOSI: Master Out / Slave In data

– SCK: Serial Clock out by SPI masters and in-

put by SPI slaves

Figure 46. Serial Peripheral Interface Block Diagram

SPIDR

Read Buffer

8-Bit Shift Register

Write

Read

Data/Address Bus

SPI

SPIE SPE MSTR CPHA SPR0

SPR1

CPOL

SERIAL CLOCK

GENERATOR

MOSI

MISO

SCK

CONTROL

STATE

SPICR

SPICSR

Interrupt

request

MASTER

CONTROL

SPR2

SPIF WCOL MODF 0

OVR SSISSMSOD

SOD

bit SS 1

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SERIAL PERIPHERAL INTERFACE (Cont’d)

–SS

: Slave select:

This input signal acts as a ‘chip select’ to let

the SPI master communicate with slaves indi-

vidually and to avoid contention on the data

lines. Slave SS inputs can be driven by stand-

ard I/O ports on the master MCU.

10.4.3.1 Functional Description

A basic example of interconnections between a

single master and a single slave is illustrated in

Figure 47.

The MOSI pins are connected together and the

MISO pins are connected together. In this way

data is transferred serially between master and

slave (most significant bit first).

The communication is always initiated by the mas-

ter. When the master device transmits data to a

slave device via MOSI pin, the slave device re-

sponds by sending data to the master device via

the MISO pin. This implies full duplex communica-

tion with both data out and data in synchronized

with the same clock signal (which is provided by

the master device via the SCK pin).

To use a single data line, the MISO and MOSI pins

must be connected at each node (in this case only

simplex communication is possible).

Four possible data/clock timing relationships may

be chosen (see Figure 50) but master and slave

must be programmed with the same timing mode.

Figure 47. Single Master/ Single Slave Application

8-BIT SHIFT REGISTER

SPI

CLOCK

GENERATOR

8-BIT SHIFT REGISTER

MISO

MOSI MOSI

MISO

SCK SCK

SLAVE

MASTER

SS SS

+5V

MSBit LSBit MSBit LSBit

Not used if SS is managed

by software

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SERIAL PERIPHERAL INTERFACE (Cont’d)

10.4.3.2 Slave Select Management

As an alternative to using the SS pin to control the

Slave Select signal, the application can choose to

manage the Slave Select signal by software. This

is configured by the SSM bit in the SPICSR regis-

ter (see Figure 49)

In software management, the external SS pin is

free for other application uses and the internal SS

signal level is driven by writing to the SSI bit in the

SPICSR register.

In Master mode:

–SS

internal must be held high continuously

In Slave Mode:

There are two cases depending on the data/clock

timing relationship (see Figure 48):

If CPHA=1 (data latched on 2nd clock edge):

–SS

internal must be held low during the entire

transmission. This implies that in single slave

applications the SS pin either can be tied to

VSS, or made free for standard I/O by manag-

ing the SS function by software (SSM= 1 and

SSI=0 in the in the SPICSR register)

If CPHA=0 (data latched on 1st clock edge):

–SS

internal must be held low during byte

transmission and pulled high between each

byte to allow the slave to write to the shift reg-

ister. If SS is not pulled high, a Write Collision

error will occur when the slave writes to the

shift register (see Section 10.4.5.3).

Figure 48. Generic SS Timing Diagram

Figure 49. Hardware/Software Slave Select Management

MOSI/MISO

Master SS

Slave SS

(if CPHA=0)

Slave SS

(if CPHA=1)

Byte 1 Byte 2 Byte 3

SS internal

SSM bit

SSI bit

SS external pin

Sek Mm Eﬂ 3 m m

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SERIAL PERIPHERAL INTERFACE (Cont’d)

10.4.3.3 Master Mode Operation

In master mode, the serial clock is output on the

SCK pin. The clock frequency, polarity and phase

are configured by software (refer to the description

of the SPICSR register).

Note: The idle state of SCK must correspond to

the polarity selected in the SPICSR register (by

pulling up SCK if CPOL=1 or pulling down SCK if

CPOL=0).

To operate the SPI in master mode, perform the

following steps in order (if the SPICSR register is

not written first, the SPICR register setting (MSTR

bit) may be not taken into account):

1. Write to the SPICR register:

– Select the clock frequency by configuring the

SPR[2:0] bits.

– Select the clock polarity and clock phase by

configuring the CPOL and CPHA bits. Figure

50 shows the four possible configurations.

Note: The slave must have the same CPOL

and CPHA settings as the master.

2. Write to the SPICSR register:

– Either set the SSM bit and set the SSI bit or

clear the SSM bit and tie the SS pin high for

the complete byte transmit sequence.

3. Write to the SPICR register:

– Set the MSTR and SPE bits

Note: MSTR and SPE bits remain set only if

SS is high).

The transmit sequence begins when software

writes a byte in the SPIDR register.

10.4.3.4 Master Mode Transmit Sequence

When software writes to the SPIDR register, the

data byte is loaded into the 8-bit shift register and

then shifted out serially to the MOSI pin most sig-

nificant bit first.

When data transfer is complete:

– The SPIF bit is set by hardware

– An interrupt request is generated if the SPIE

bit is set and the interrupt mask in the CCR

Clearing the SPIF bit is performed by the following

software sequence:

1. An access to the SPICSR register while the

SPIF bit is set

2. A read to the SPIDR register.

Note: While the SPIF bit is set, all writes to the

SPIDR register are inhibited until the SPICSR reg-

ister is read.

10.4.3.5 Slave Mode Operation

In slave mode, the serial clock is received on the

SCK pin from the master device.

To operate the SPI in slave mode:

1. Write to the SPICSR register to perform the fol-

lowing actions:

– Select the clock polarity and clock phase by

configuring the CPOL and CPHA bits (see

Figure 50).

Note: The slave must have the same CPOL

and CPHA settings as the master.

– Manage the SS pin as described in Section

10.4.3.2 and Figure 48. If CPHA=1 SS must

be held low continuously. If CPHA=0 SS must

be held low during byte transmission and

pulled up between each byte to let the slave

write in the shift register.

2. Write to the SPICR register to clear the MSTR

bit and set the SPE bit to enable the SPI I/O

functions.

10.4.3.6 Slave Mode Transmit Sequence

When software writes to the SPIDR register, the

data byte is loaded into the 8-bit shift register and

then shifted out serially to the MISO pin most sig-

nificant bit first.

The transmit sequence begins when the slave de-

vice receives the clock signal and the most signifi-

cant bit of the data on its MOSI pin.

When data transfer is complete:

– The SPIF bit is set by hardware

– An interrupt request is generated if SPIE bit is

set and interrupt mask in the CCR register is

cleared.

Clearing the SPIF bit is performed by the following

software sequence:

1. An access to the SPICSR register while the

SPIF bit is set.

2. A write or a read to the SPIDR register.

Notes: While the SPIF bit is set, all writes to the

SPIDR register are inhibited until the SPICSR reg-

ister is read.

The SPIF bit can be cleared during a second

transmission; however, it must be cleared before

the second SPIF bit in order to prevent an Overrun

condition (see Section 10.4.5.2).

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SERIAL PERIPHERAL INTERFACE (Cont’d)

10.4.4 Clock Phase and Clock Polarity

Four possible timing relationships may be chosen

by software, using the CPOL and CPHA bits (See

Figure 50).

Note: The idle state of SCK must correspond to

the polarity selected in the SPICSR register (by

pulling up SCK if CPOL=1 or pulling down SCK if

CPOL=0).

The combination of the CPOL clock polarity and

CPHA (clock phase) bits selects the data capture

clock edge

Figure 50, shows an SPI transfer with the four

combinations of the CPHA and CPOL bits. The di-

agram may be interpreted as a master or slave

timing diagram where the SCK pin, the MISO pin,

the MOSI pin are directly connected between the

master and the slave device.

Note: If CPOL is changed at the communication

byte boundaries, the SPI must be disabled by re-

setting the SPE bit.

Figure 50. Data Clock Timing Diagram

SCK

MSBit Bit 6 Bit 5 Bit 4 Bit3 Bit 2 Bit 1 LSBit

MSBit Bit 6 Bit 5 Bit 4 Bit3Bit 2Bit 1LSBit

MISO

(from master)

MOSI

(from slave)

(to slave)

CAPTURE STROBE

CPHA =1

MSBit Bit 6 Bit 5 Bit 4 Bit3 Bit 2 Bit 1 LSBit

MISO

(from master)

MOSI

(to slave)

CAPTURE STROBE

CPHA =0

Note:

This figure should not be used as a replacement for parametric information.

Refer to the Electrical Characteristics chapter.

(from slave)

(CPOL = 1)

SCK

(CPOL = 0)

SCK

(CPOL = 1)

SCK

(CPOL = 0)

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SERIAL PERIPHERAL INTERFACE (Cont’d)

10.4.5 Error Flags

10.4.5.1 Master Mode Fault (MODF)

Master mode fault occurs when the master device

has its SS pin pulled low.

When a Master mode fault occurs:

– The MODF bit is set and an SPI interrupt re-

quest is generated if the SPIE bit is set.

– The SPE bit is reset. This blocks all output

from the device and disables the SPI periph-

eral.

– The MSTR bit is reset, thus forcing the device

into slave mode.

Clearing the MODF bit is done through a software

sequence:

1. A read access to the SPICSR register while the

MODF bit is set.

2. A write to the SPICR register.

Notes: To avoid any conflicts in an application

with multiple slaves, the SS pin must be pulled

high during the MODF bit clearing sequence. The

SPE and MSTR bits may be restored to their orig-

inal state during or after this clearing sequence.

Hardware does not allow the user to set the SPE

and MSTR bits while the MODF bit is set except in

the MODF bit clearing sequence.

10.4.5.2 Overrun Condition (OVR)

An overrun condition occurs, when the master de-

vice has sent a data byte and the slave device has

not cleared the SPIF bit issued from the previously

transmitted byte.

When an Overrun occurs:

– The OVR bit is set and an interrupt request is

generated if the SPIE bit is set.

In this case, the receiver buffer contains the byte

sent after the SPIF bit was last cleared. A read to

the SPIDR register returns this byte. All other

bytes are lost.

The OVR bit is cleared by reading the SPICSR

10.4.5.3 Write Collision Error (WCOL)

A write collision occurs when the software tries to

write to the SPIDR register while a data transfer is

taking place with an external device. When this

happens, the transfer continues uninterrupted;

and the software write will be unsuccessful.

Write collisions can occur both in master and slave

mode. See also Section 10.4.3.2 Slave Select

Management.

Note: a “read collision” will never occur since the

received data byte is placed in a buffer in which

access is always synchronous with the MCU oper-

ation.

The WCOL bit in the SPICSR register is set if a

write collision occurs.

No SPI interrupt is generated when the WCOL bit

is set (the WCOL bit is a status flag only).

Clearing the WCOL bit is done through a software

sequence (see Figure 51).

Figure 51. Clearing the WCOL bit (Write Collision Flag) Software Sequence

Clearing sequence after SPIF = 1 (end of a data byte transfer)

1st Step Read SPICSR

Read SPIDR

2nd Step SPIF =0

WCOL=0

Clearing sequence before SPIF = 1 (during a data byte transfer)

1st Step

2nd Step WCOL=0

Read SPICSR

Read SPIDR

Note: Writing to the SPIDR regis-

ter instead of reading it does not

reset the WCOL bit

RESULT

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SERIAL PERIPHERAL INTERFACE (Cont’d)

10.4.5.4 Single Master Systems

A typical single master system may be configured,

using an MCU as the master and four MCUs as

slaves (see Figure 52).

The master device selects the individual slave de-

vices by using four pins of a parallel port to control

the four SS pins of the slave devices.

The SS pins are pulled high during reset since the

master device ports will be forced to be inputs at

that time, thus disabling the slave devices.

Note: To prevent a bus conflict on the MISO line

the master allows only one active slave device

during a transmission.

For more security, the slave device may respond

to the master with the received data byte. Then the

master will receive the previous byte back from the

slave device if all MISO and MOSI pins are con-

nected and the slave has not written to its SPIDR

Other transmission security methods can use

ports for handshake lines or data bytes with com-

mand fields.

Figure 52. Single Master / Multiple Slave Configuration

MISO

MOSI

MOSI MOSI MOSIMISO MISO MISOMISO

SS SS SS SS

SCK SCK

SCK

Ports

Slave

MCU

Slave

MCU

Slave

MCU

Slave

MCU

Master

MCU

Hi“

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SERIAL PERIPHERAL INTERFACE (Cont’d)

10.4.6 Low Power Modes

10.4.6.1 Using the SPI to wakeup the MCU from

Halt mode

In slave configuration, the SPI is able to wakeup

the ST7 device from HALT mode through a SPIF

interrupt. The data received is subsequently read

from the SPIDR register when the software is run-

ning (interrupt vector fetch). If multiple data trans-

fers have been performed before software clears

the SPIF bit, then the OVR bit is set by hardware.

Note: When waking up from Halt mode, if the SPI

remains in Slave mode, it is recommended to per-

form an extra communications cycle to bring the

SPI from Halt mode state to normal state. If the

SPI exits from Slave mode, it returns to normal

state immediately.

Caution: The SPI can wake up the ST7 from Halt

mode only if the Slave Select signal (external SS

pin or the SSI bit in the SPICSR register) is low

when the ST7 enters Halt mode. So if Slave selec-

tion is configured as external (see Section

10.4.3.2), make sure the master drives a low level

on the SS pin when the slave enters Halt mode.

10.4.7 Interrupts

Note: The SPI interrupt events are connected to

the same interrupt vector (see Interrupts chapter).

They generate an interrupt if the corresponding

Enable Control Bit is set and the interrupt mask in

Mode Description

WAIT

No effect on SPI.

SPI interrupt events cause the device to exit

from WAIT mode.

HALT

SPI registers are frozen.

In HALT mode, the SPI is inactive. SPI oper-

ation resumes when the MCU is woken up by

an interrupt with “exit from HALT mode” ca-

pability. The data received is subsequently

read from the SPIDR register when the soft-

ware is running (interrupt vector fetching). If

several data are received before the wake-

up event, then an overrun error is generated.

This error can be detected after the fetch of

the interrupt routine that woke up the device.

Interrupt Event Event

Flag

Enable

Control

Bit

Exit

from

Wait

Exit

from

Halt

SPI End of Transfer

Event SPIF

SPIE

Yes Yes

Master Mode Fault

Event MODF Yes No

Overrun Error OVR Yes No

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SERIAL PERIPHERAL INTERFACE (Cont’d)

10.4.8 Register Description

CONTROL REGISTER (SPICR)

Read/Write

Reset Value: 0000 xxxx (0xh)

Bit 7 = SPIE Serial Peripheral Interrupt Enable.

This bit is set and cleared by software.

0: Interrupt is inhibited

1: An SPI interrupt is generated whenever

SPIF=1, MODF=1 or OVR=1 in the SPICSR

Bit 6 = SPE Serial Peripheral Output Enable.

This bit is set and cleared by software. It is also

cleared by hardware when, in master mode, SS=0

(see Section 10.4.5.1 Master Mode Fault

(MODF)). The SPE bit is cleared by reset, so the

SPI peripheral is not initially connected to the ex-

ternal pins.

0: I/O pins free for general purpose I/O

1: SPI I/O pin alternate functions enabled

Bit 5 = SPR2 Divider Enable.

This bit is set and cleared by software and is

cleared by reset. It is used with the SPR[1:0] bits to

set the baud rate. Refer to Table 18 SPI Master

mode SCK Frequency.

0: Divider by 2 enabled

1: Divider by 2 disabled

Note: This bit has no effect in slave mode.

Bit 4 = MSTR Master Mode.

This bit is set and cleared by software. It is also

cleared by hardware when, in master mode, SS=0

(see Section 10.4.5.1 Master Mode Fault

(MODF)).

0: Slave mode

1: Master mode. The function of the SCK pin

changes from an input to an output and the func-

tions of the MISO and MOSI pins are reversed.

Bit 3 = CPOL Clock Polarity.

This bit is set and cleared by software. This bit de-

termines the idle state of the serial Clock. The

CPOL bit affects both the master and slave

modes.

0: SCK pin has a low level idle state

1: SCK pin has a high level idle state

Note: If CPOL is changed at the communication

byte boundaries, the SPI must be disabled by re-

setting the SPE bit.

Bit 2 = CPHA Clock Phase.

This bit is set and cleared by software.

0: The first clock transition is the first data capture

edge.

1: The second clock transition is the first capture

edge.

Note: The slave must have the same CPOL and

CPHA settings as the master.

Bits 1:0 = SPR[1:0] Serial Clock Frequency.

These bits are set and cleared by software. Used

with the SPR2 bit, they select the baud rate of the

SPI serial clock SCK output by the SPI in master

mode.

Note: These 2 bits have no effect in slave mode.

Table 18. SPI Master mode SCK Frequency

SPIE SPE SPR2 MSTR CPOL CPHA SPR1 SPR0

Serial Clock SPR2 SPR1 SPR0

fCPU/4 1 0 0

fCPU/8 0 0 0

fCPU/16 0 0 1

fCPU/32 1 1 0

fCPU/64 0 1 0

fCPU/128 0 1 1

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SERIAL PERIPHERAL INTERFACE (Cont’d)

CONTROL/STATUS REGISTER (SPICSR)

Read/Write (some bits Read Only)

Reset Value: 0000 0000 (00h)

Bit 7 = SPIF Serial Peripheral Data Transfer Flag

(Read only).

This bit is set by hardware when a transfer has

been completed. An interrupt is generated if

SPIE=1 in the SPICR register. It is cleared by a

software sequence (an access to the SPICSR

SPIDR register).

0: Data transfer is in progress or the flag has been

cleared.

1: Data transfer between the device and an exter-

nal device has been completed.

Note: While the SPIF bit is set, all writes to the

SPIDR register are inhibited until the SPICSR reg-

ister is read.

Bit 6 = WCOL Write Collision status (Read only).

This bit is set by hardware when a write to the

SPIDR register is done during a transmit se-

quence. It is cleared by a software sequence (see

Figure 51).

0: No write collision occurred

1: A write collision has been detected

Bit 5 = OVR SPI Overrun error (Read only).

This bit is set by hardware when the byte currently

being received in the shift register is ready to be

transferred into the SPIDR register while SPIF = 1

(See Section 10.4.5.2). An interrupt is generated if

SPIE = 1 in SPICR register. The OVR bit is cleared

by software reading the SPICSR register.

0: No overrun error

1: Overrun error detected

Bit 4 = MODF Mode Fault flag (Read only).

This bit is set by hardware when the SS pin is

pulled low in master mode (see Section 10.4.5.1

Master Mode Fault (MODF)). An SPI interrupt can

be generated if SPIE=1 in the SPICSR register.

This bit is cleared by a software sequence (An ac-

cess to the SPICR register while MODF=1 fol-

lowed by a write to the SPICR register).

0: No master mode fault detected

1: A fault in master mode has been detected

Bit 3 = Reserved, must be kept cleared.

Bit 2 = SOD SPI Output Disable.

This bit is set and cleared by software. When set, it

disables the alternate function of the SPI output

(MOSI in master mode / MISO in slave mode)

0: SPI output enabled (if SPE=1)

1: SPI output disabled

Bit 1 = SSM SS Management.

This bit is set and cleared by software. When set, it

disables the alternate function of the SPI SS pin

and uses the SSI bit value instead. See Section

10.4.3.2 Slave Select Management.

0: Hardware management (SS managed by exter-

nal pin)

1: Software management (internal SS signal con-

trolled by SSI bit. External SS pin free for gener-

al-purpose I/O)

Bit 0 = SSI SS Internal Mode.

This bit is set and cleared by software. It acts as a

‘chip select’ by controlling the level of the SS slave

select signal when the SSM bit is set.

0: Slave selected

1: Slave deselected

DATA I/O REGISTER (SPIDR)

Read/Write

Reset Value: Undefined

The SPIDR register is used to transmit and receive

data on the serial bus. In a master device, a write

to this register will initiate transmission/reception

of another byte.

Notes: During the last clock cycle the SPIF bit is

set, a copy of the received data byte in the shift

the serial peripheral data I/O register, the buffer is

actually being read.

While the SPIF bit is set, all writes to the SPIDR

read.

Warning: A write to the SPIDR register places

data directly into the shift register for transmission.

A read to the SPIDR register returns the value lo-

cated in the buffer and not the content of the shift

SPIF WCOL OVR MODF - SOD SSM SSI

D7 D6 D5 D4 D3 D2 D1 D0

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SERIAL PERIPHERAL INTERFACE (Cont’d)

Table 19. SPI Register Map and Reset Values

Address

(Hex.)

Label 76543210

0021h SPIDR

Reset Value

MSB

xxxxxxx

LSB

0022h SPICR

Reset Value

SPIE

SPE

SPR2

MSTR

CPOL

CPHA

SPR1

SPR0

0023h SPICSR

Reset Value

SPIF

WCOL

MODF

SOD

SSM

SSI

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10.5 SERIAL COMMUNICATIONS INTERFACE (SCI)

10.5.1 Introduction

The Serial Communications Interface (SCI) offers

a flexible means of full-duplex data exchange with

external equipment requiring an industry standard

NRZ asynchronous serial data format. The SCI of-

fers a very wide range of baud rates using two

baud rate generator systems.

10.5.2 Main Features

■Full duplex, asynchronous communications

■NRZ standard format (Mark/Space)

■Dual baud rate generator systems

■Independently programmable transmit and

receive baud rates up to 500K baud

■Programmable data word length (8 or 9 bits)

■Receive buffer full, Transmit buffer empty and

End of Transmission flags

■Two receiver wake-up modes:

– Address bit (MSB)

– Idle line

■Muting function for multiprocessor configurations

■Separate enable bits for Transmitter and

Receiver

■Four error detection flags:

– Overrun error

– Noise error

– Frame error

– Parity error

■Five interrupt sources with flags:

– Transmit data register empty

– Transmission complete

– Receive data register full

– Idle line received

– Overrun error detected

■Parity control:

– Transmits parity bit

– Checks parity of received data byte

■Reduced power consumption mode

10.5.3 General Description

The interface is externally connected to another

device by two pins (see Figure 2.):

– TDO: Transmit Data Output. When the transmit-

ter and the receiver are disabled, the output pin

returns to its I/O port configuration. When the

transmitter and/or the receiver are enabled and

nothing is to be transmitted, the TDO pin is at

high level.

– RDI: Receive Data Input is the serial data input.

Oversampling techniques are used for data re-

covery by discriminating between valid incoming

data and noise.

Through these pins, serial data is transmitted and

received as frames comprising:

– An Idle Line prior to transmission or reception

– A start bit

– A data word (8 or 9 bits) least significant bit first

– A Stop bit indicating that the frame is complete

This interface uses two types of baud rate generator:

– A conventional type for commonly-used baud

rates

– An extended type with a prescaler offering a very

wide range of baud rates even with non-standard

oscillator frequencies

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

Figure 53. SCI Block Diagram

WAKE

UNIT

RECEIVER

CONTROL

TRANSMIT

CONTROL

TDRE TC RDRF IDLE OR NF FE PE

SCI

CONTROL

INTERRUPT

CR1

R8 T8 SCID M WAKE PCE PS PIE

Received Data Register (RDR)

Received Shift Register

Read

Transmit Data Register (TDR)

Transmit Shift Register

Write

RDI

TDO

(DATA REGISTER) DR

TRANSMITTER

CLOCK

RECEIVER

CLOCK

RECEIVER RATE

TRANSMITTER RATE

BRR

SCP1

fCPU

CONTROL

SCP0 SCT2 SCT1 SCT0 SCR2 SCR1SCR0

/PR

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CONVENTIONAL BAUD RATE GENERATOR

SBKRWURETEILIERIETCIETIE

CR2

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

10.5.4 Functional Description

The block diagram of the Serial Control Interface,

is shown in Figure 1. It contains six dedicated reg-

isters:

– Two control registers (SCICR1 & SCICR2)

– A status register (SCISR)

– A baud rate register (SCIBRR)

– An extended prescaler receiver register (SCIER-

PR)

– An extended prescaler transmitter register (SCI-

ETPR)

Refer to the register descriptions in Section 0.1.7

for the definitions of each bit.

10.5.4.1 Serial Data Format

Word length may be selected as being either 8 or 9

bits by programming the M bit in the SCICR1 reg-

ister (see Figure 1.).

The TDO pin is in low state during the start bit.

The TDO pin is in high state during the stop bit.

An Idle character is interpreted as an entire frame

of “1”s followed by the start bit of the next frame

which contains data.

A Break character is interpreted on receiving “0”s

for some multiple of the frame period. At the end of

the last break frame the transmitter inserts an ex-

tra “1” bit to acknowledge the start bit.

Transmission and reception are driven by their

own baud rate generator.

Figure 54. Word Length Programming

Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8

Start

Bit Stop

Bit

Start

Bit

Idle Frame

Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7

Start

Bit Stop

Bit

Start

Bit

Start

Bit

Idle Frame Start

Bit

9-bit Word length (M bit is set)

8-bit Word length (M bit is reset)

Possible

Parity

Bit

Possible

Parity

Bit

Break Frame Start

Bit

Extra

‘1’

Data Frame

Break Frame Start

Bit

Extra

‘1’

Data Frame

Next Data Frame

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

10.5.4.2 Transmitter

The transmitter can send data words of either 8 or

9 bits depending on the M bit status. When the M

bit is set, word length is 9 bits and the 9th bit (the

MSB) has to be stored in the T8 bit in the SCICR1

Character Transmission

During an SCI transmission, data shifts out least

significant bit first on the TDO pin. In this mode,

the SCIDR register consists of a buffer (TDR) be-

tween the internal bus and the transmit shift regis-

ter (see Figure 1.).

Procedure

– Select the M bit to define the word length.

– Select the desired baud rate using the SCIBRR

and the SCIETPR registers.

– Set the TE bit to assign the TDO pin to the alter-

nate function and to send a idle frame as first

transmission.

– Access the SCISR register and write the data to

send in the SCIDR register (this sequence clears

the TDRE bit). Repeat this sequence for each

data to be transmitted.

Clearing the TDRE bit is always performed by the

following software sequence:

1. An access to the SCISR register

2. A write to the SCIDR register

The TDRE bit is set by hardware and it indicates:

– The TDR register is empty.

– The data transfer is beginning.

– The next data can be written in the SCIDR regis-

ter without overwriting the previous data.

This flag generates an interrupt if the TIE bit is set

and the I bit is cleared in the CCR register.

When a transmission is taking place, a write in-

struction to the SCIDR register stores the data in

the TDR register and which is copied in the shift

When no transmission is taking place, a write in-

struction to the SCIDR register places the data di-

rectly in the shift register, the data transmission

starts, and the TDRE bit is immediately set.

When a frame transmission is complete (after the

stop bit) the TC bit is set and an interrupt is gener-

ated if the TCIE is set and the I bit is cleared in the

CCR register.

Clearing the TC bit is performed by the following

software sequence:

1. An access to the SCISR register

2. A write to the SCIDR register

Note: The TDRE and TC bits are cleared by the

same software sequence.

Break Characters

Setting the SBK bit loads the shift register with a

break character. The break frame length depends

on the M bit (see Figure 2.).

As long as the SBK bit is set, the SCI send break

frames to the TDO pin. After clearing this bit by

software the SCI insert a logic 1 bit at the end of

the last break frame to guarantee the recognition

of the start bit of the next frame.

Idle Characters

Setting the TE bit drives the SCI to send an idle

frame before the first data frame.

Clearing and then setting the TE bit during a trans-

mission sends an idle frame after the current word.

Note: Resetting and setting the TE bit causes the

data in the TDR register to be lost. Therefore the

best time to toggle the TE bit is when the TDRE bit

is set, that is, before writing the next byte in the

SCIDR.

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

10.5.4.3 Receiver

The SCI can receive data words of either 8 or 9

bits. When the M bit is set, word length is 9 bits

and the MSB is stored in the R8 bit in the SCICR1

Character reception

During a SCI reception, data shifts in least signifi-

cant bit first through the RDI pin. In this mode, the

SCIDR register consists or a buffer (RDR) be-

tween the internal bus and the received shift regis-

ter (see Figure 1.).

Procedure

– Select the M bit to define the word length.

– Select the desired baud rate using the SCIBRR

and the SCIERPR registers.

– Set the RE bit, this enables the receiver which

begins searching for a start bit.

When a character is received:

– The RDRF bit is set. It indicates that the content

of the shift register is transferred to the RDR.

– An interrupt is generated if the RIE bit is set and

the I bit is cleared in the CCR register.

– The error flags can be set if a frame error, noise

or an overrun error has been detected during re-

ception.

Clearing the RDRF bit is performed by the following

software sequence done by:

1. An access to the SCISR register

2. A read to the SCIDR register.

The RDRF bit must be cleared before the end of the

reception of the next character to avoid an overrun

error.

Break Character

When a break character is received, the SCI han-

dles it as a framing error.

Idle Character

When a idle frame is detected, there is the same

procedure as a data received character plus an in-

terrupt if the ILIE bit is set and the I bit is cleared in

the CCR register.

Overrun Error

An overrun error occurs when a character is re-

ceived when RDRF has not been reset. Data can

not be transferred from the shift register to the

RDR register as long as the RDRF bit is not

cleared.

When an overrun error occurs:

– The OR bit is set.

– The RDR content is not lost.

– The shift register is overwritten.

– An interrupt is generated if the RIE bit is set and

the I bit is cleared in the CCR register.

The OR bit is reset by an access to the SCISR reg-

ister followed by a SCIDR register read operation.

Noise Error

Oversampling techniques are used for data recov-

ery by discriminating between valid incoming data

and noise. Normal data bits are considered valid if

three consecutive samples (8th, 9th, 10th) have

the same bit value, otherwise the NF flag is set. In

the case of start bit detection, the NF flag is set on

the basis of an algorithm combining both valid

edge detection and three samples (8th, 9th, 10th).

Therefore, to prevent the NF flag getting set during

start bit reception, there should be a valid edge de-

tection as well as three valid samples.

When noise is detected in a frame:

– The NF flag is set at the rising edge of the RDRF

bit.

– Data is transferred from the Shift register to the

SCIDR register.

– No interrupt is generated. However this bit rises

at the same time as the RDRF bit which itself

generates an interrupt.

The NF flag is reset by a SCISR register read op-

eration followed by a SCIDR register read opera-

tion.

During reception, if a false start bit is detected (e.g.

8th, 9th, 10th samples are 011,101,110), the

frame is discarded and the receiving sequence is

not started for this frame. There is no RDRF bit set

for this frame and the NF flag is set internally (not

accessible to the user). This NF flag is accessible

along with the RDRF bit when a next valid frame is

received.

Note: If the application Start Bit is not long enough

to match the above requirements, then the NF

Flag may get set due to the short Start Bit. In this

case, the NF flag may be ignored by the applica-

tion software when the first valid byte is received.

See also Section 0.1.4.10 .

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

Figure 55. SCI Baud Rate and Extended Prescaler Block Diagram

TRANSMITTER

RECEIVER

SCIETPR

SCIERPR

EXTENDED PRESCALER RECEIVER RATE CONTROL

EXTENDED PRESCALER TRANSMITTER RATE CONTROL

EXTENDED PRESCALER

CLOCK

RECEIVER RATE

TRANSMITTER RATE

SCIBRR

SCP1

fCPU

CONTROL

SCP0 SCT2 SCT1 SCT0 SCR2 SCR1SCR0

/PR

/16

CONVENTIONAL BAUD RATE GENERATOR

EXTENDED RECEIVER PRESCALER REGISTER

EXTENDED TRANSMITTER PRESCALER REGISTER

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

Framing Error

A framing error is detected when:

– The stop bit is not recognized on reception at the

expected time, following either a de-synchroni-

zation or excessive noise.

– A break is received.

When the framing error is detected:

– the FE bit is set by hardware

– Data is transferred from the Shift register to the

SCIDR register.

– No interrupt is generated. However this bit rises

at the same time as the RDRF bit which itself

generates an interrupt.

The FE bit is reset by a SCISR register read oper-

ation followed by a SCIDR register read operation.

10.5.4.4 Conventional Baud Rate Generation

The baud rate for the receiver and transmitter (Rx

and Tx) are set independently and calculated as

follows:

with:

PR = 1, 3, 4 or 13 (see SCP[1:0] bits)

TR = 1, 2, 4, 8, 16, 32, 64,128

(see SCT[2:0] bits)

RR = 1, 2, 4, 8, 16, 32, 64,128

(see SCR[2:0] bits)

All these bits are in the SCIBRR register.

Example: If fCPU is 8 MHz (normal mode) and if

PR = 13 and TR = RR = 1, the transmit and re-

ceive baud rates are 38400 baud.

Note: The baud rate registers MUST NOT be

changed while the transmitter or the receiver is en-

abled.

10.5.4.5 Extended Baud Rate Generation

The extended prescaler option gives a very fine

tuning on the baud rate, using a 255 value prescal-

er, whereas the conventional Baud Rate Genera-

tor retains industry standard software compatibili-

ty.

The extended baud rate generator block diagram

is described in the Figure 3.

The output clock rate sent to the transmitter or to

the receiver is the output from the 16 divider divid-

ed by a factor ranging from 1 to 255 set in the SCI-

ERPR or the SCIETPR register.

Note: the extended prescaler is activated by set-

ting the SCIETPR or SCIERPR register to a value

other than zero. The baud rates are calculated as

follows:

with:

ETPR = 1,..,255 (see SCIETPR register)

ERPR = 1,.. 255 (see SCIERPR register)

10.5.4.6 Receiver Muting and Wake-up Feature

In multiprocessor configurations it is often desira-

ble that only the intended message recipient

should actively receive the full message contents,

thus reducing redundant SCI service overhead for

all non addressed receivers.

The non addressed devices may be placed in

sleep mode by means of the muting function.

Setting the RWU bit by software puts the SCI in

sleep mode:

All the reception status bits can not be set.

All the receive interrupts are inhibited.

A muted receiver may be awakened by one of the

following two ways:

– by Idle Line detection if the WAKE bit is reset,

– by Address Mark detection if the WAKE bit is set.

Receiver wakes-up by Idle Line detection when

the Receive line has recognized an Idle Frame.

Then the RWU bit is reset by hardware but the

IDLE bit is not set.

Receiver wakes-up by Address Mark detection

when it received a “1” as the most significant bit of

a word, thus indicating that the message is an ad-

dress. The reception of this particular word wakes

up the receiver, resets the RWU bit and sets the

RDRF bit, which allows the receiver to receive this

word normally and to use it as an address word.

CAUTION: In Mute mode, do not write to the

SCICR2 register. If the SCI is in Mute mode during

the read operation (RWU = 1) and a address mark

wake up event occurs (RWU is reset) before the

write operation, the RWU bit is set again by this

write operation. Consequently the address byte is

lost and the SCI is not woken up from Mute mode.

Tx =

(16*PR)*TR

fCPU Rx =

(16*PR)*RR

fCPU

Tx =

16*ETPR*(PR*TR)

fCPU Rx =

16*ERPR*(PR*RR)

fCPU

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

10.5.4.7 Parity Control

Parity control (generation of parity bit in transmis-

sion and parity checking in reception) can be ena-

bled by setting the PCE bit in the SCICR1 register.

Depending on the frame length defined by the M

bit, the possible SCI frame formats are as listed in

Table 1.

Table 20. Frame Formats

Legend: SB = Start Bit, STB = Stop Bit,

PB = Parity Bit

Note: In case of wake up by an address mark, the

MSB bit of the data is taken into account and not

the parity bit

Even parity: the parity bit is calculated to obtain

an even number of “1s” inside the frame made of

the 7 or 8 LSB bits (depending on whether M is

equal to 0 or 1) and the parity bit.

Example: data = 00110101; 4 bits set => parity bit

is 0 if even parity is selected (PS bit = 0).

Odd parity: the parity bit is calculated to obtain an

odd number of “1s” inside the frame made of the 7

or 8 LSB bits (depending on whether M is equal to

0 or 1) and the parity bit.

Example: data = 00110101; 4 bits set => parity bit

is 1 if odd parity is selected (PS bit = 1).

Transmission mode: If the PCE bit is set then the

MSB bit of the data written in the data register is

not transmitted but is changed by the parity bit.

Reception mode: If the PCE bit is set then the in-

terface checks if the received data byte has an

even number of “1s” if even parity is selected

(PS = 0) or an odd number of “1s” if odd parity is

selected (PS = 1). If the parity check fails, the PE

flag is set in the SCISR register and an interrupt is

generated if PIE is set in the SCICR1 register.

10.5.4.8 SCI Clock Tolerance

During reception, each bit is sampled 16 times.

The majority of the 8th, 9th and 10th samples is

considered as the bit value. For a valid bit detec-

tion, all the three samples should have the same

value otherwise the noise flag (NF) is set. For ex-

ample: If the 8th, 9th and 10th samples are 0, 1

and 1 respectively, then the bit value is “1”, but the

Noise Flag bit is set because the three samples

values are not the same.

Consequently, the bit length must be long enough

so that the 8th, 9th and 10th samples have the de-

sired bit value. This means the clock frequency

should not vary more than 6/16 (37.5%) within one

bit. The sampling clock is resynchronized at each

start bit, so that when receiving 10 bits (one start

bit, 1 data byte, 1 stop bit), the clock deviation

must not exceed 3.75%.

Note: The internal sampling clock of the microcon-

troller samples the pin value on every falling edge.

Therefore, the internal sampling clock and the time

the application expects the sampling to take place

may be out of sync. For example: If the baud rate

is 15.625 Kbaud (bit length is 64µs), then the 8th,

9th and 10th samples are at 28µs, 32µs and 36µs

respectively (the first sample starting ideally at

0µs). But if the falling edge of the internal clock oc-

curs just before the pin value changes, the sam-

ples would then be out of sync by ~4us. This

means the entire bit length must be at least 40µs

(36µs for the 10th sample + 4µs for synchroniza-

tion with the internal sampling clock).

M bit PCE bit SCI frame

0 0 | SB | 8 bit data | STB |

0 1 | SB | 7-bit data | PB | STB |

1 0 | SB | 9-bit data | STB |

1 1 | SB | 8-bit data PB | STB |

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

10.5.4.9 Clock Deviation Causes

The causes which contribute to the total deviation

are:

–D

TRA: Deviation due to transmitter error (Local

oscillator error of the transmitter or the trans-

mitter is transmitting at a different baud rate).

–D

QUANT: Error due to the baud rate quantiza-

tion of the receiver.

–D

REC: Deviation of the local oscillator of the

receiver: This deviation can occur during the

reception of one complete SCI message as-

suming that the deviation has been compen-

sated at the beginning of the message.

–D

TCL: Deviation due to the transmission line

(generally due to the transceivers)

All the deviations of the system should be added

and compared to the SCI clock tolerance:

DTRA + DQUANT + DREC + DTCL < 3.75%

10.5.4.10 Noise Error Causes

See also description of Noise error in Section

0.1.4.3 .

Start bit

The noise flag (NF) is set during start bit reception

if one of the following conditions occurs:

1. A valid falling edge is not detected. A falling

edge is considered to be valid if the 3 consecu-

tive samples before the falling edge occurs are

detected as '1' and, after the falling edge

occurs, during the sampling of the 16 samples,

if one of the samples numbered 3, 5 or 7 is

detected as a “1”.

2. During sampling of the 16 samples, if one of the

samples numbered 8, 9 or 10 is detected as a

“1”.

Therefore, a valid Start Bit must satisfy both the

above conditions to prevent the Noise Flag getting

set.

Data Bits

The noise flag (NF) is set during normal data bit re-

ception if the following condition occurs:

– During the sampling of 16 samples, if all three

samples numbered 8, 9 and10 are not the same.

The majority of the 8th, 9th and 10th samples is

considered as the bit value.

Therefore, a valid Data Bit must have samples 8, 9

and 10 at the same value to prevent the Noise

Flag getting set.

Figure 56. Bit Sampling in Reception Mode

RDI LINE

Sample

clock 1234567891011

12 13 14 15 16

sampled values

One bit time

6/16

7/16 7/16

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

10.5.5 Low Power Modes 10.5.6 Interrupts

The SCI interrupt events are connected to the

same interrupt vector.

These events generate an interrupt if the corre-

sponding Enable Control Bit is set and the inter-

rupt mask in the CC register is reset (RIM instruc-

tion).

Mode Description

WAIT

No effect on SCI.

SCI interrupts cause the device to exit from

Wait mode.

HALT

SCI registers are frozen.

In Halt mode, the SCI stops transmitting/re-

ceiving until Halt mode is exited.

Interrupt Event Event

Flag

Enable

Control

Bit

Exit

from

Wait

Exit

from

Halt

Transmit Data Register

Empty TDRE TIE Yes No

Transmission Com-

plete TC TCIE Yes No

Received Data Ready

to be Read RDRF

RIE

Yes No

Overrun Error Detect-

ed OR Yes No

Idle Line Detected IDLE ILIE Yes No

Parity Error PE PIE Yes No

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

10.5.7 Register Description

STATUS REGISTER (SCISR)

Read Only

Reset Value: 1100 0000 (C0h)

Bit 7 = TDRE Transmit data register empty.

This bit is set by hardware when the content of the

TDR register has been transferred into the shift

in the SCICR2 register. It is cleared by a software

sequence (an access to the SCISR register fol-

lowed by a write to the SCIDR register).

0: Data is not transferred to the shift register

1: Data is transferred to the shift register

Note: Data is not transferred to the shift register

unless the TDRE bit is cleared.

Bit 6 = TC Transmission complete.

This bit is set by hardware when transmission of a

frame containing Data is complete. An interrupt is

generated if TCIE = 1 in the SCICR2 register. It is

cleared by a software sequence (an access to the

SCISR register followed by a write to the SCIDR

0: Transmission is not complete

1: Transmission is complete

Note: TC is not set after the transmission of a Pre-

amble or a Break.

Bit 5 = RDRF Received data ready flag.

This bit is set by hardware when the content of the

RDR register has been transferred to the SCIDR

SCICR2 register. It is cleared by a software se-

quence (an access to the SCISR register followed

by a read to the SCIDR register).

0: Data is not received

1: Received data is ready to be read

Bit 4 = IDLE Idle line detect.

This bit is set by hardware when a Idle Line is de-

tected. An interrupt is generated if the ILIE = 1 in

the SCICR2 register. It is cleared by a software se-

quence (an access to the SCISR register followed

by a read to the SCIDR register).

0: No Idle Line is detected

1: Idle Line is detected

Note: The IDLE bit is not set again until the RDRF

bit has been set itself (that is, a new idle line oc-

curs).

Bit 3 = OR Overrun error.

This bit is set by hardware when the word currently

being received in the shift register is ready to be

transferred into the RDR register while RDRF = 1.

An interrupt is generated if RIE = 1 in the SCICR2

access to the SCISR register followed by a read to

the SCIDR register).

0: No Overrun error

1: Overrun error is detected

Note: When this bit is set RDR register content is

not lost but the shift register is overwritten.

Bit 2 = NF Noise flag.

This bit is set by hardware when noise is detected

on a received frame. It is cleared by a software se-

quence (an access to the SCISR register followed

by a read to the SCIDR register).

0: No noise is detected

1: Noise is detected

Note: This bit does not generate interrupt as it ap-

pears at the same time as the RDRF bit which it-

self generates an interrupt.

Bit 1 = FE Framing error.

This bit is set by hardware when a de-synchroniza-

tion, excessive noise or a break character is de-

tected. It is cleared by a software sequence (an

access to the SCISR register followed by a read to

the SCIDR register).

0: No Framing error is detected

1: Framing error or break character is detected

Note: This bit does not generate interrupt as it ap-

pears at the same time as the RDRF bit which it-

self generates an interrupt. If the word currently

being transferred causes both frame error and

overrun error, it will be transferred and only the OR

bit will be set.

Bit 0 = PE Parity error.

This bit is set by hardware when a parity error oc-

curs in receiver mode. It is cleared by a software

sequence (a read to the status register followed by

an access to the SCIDR data register). An inter-

rupt is generated if PIE = 1 in the SCICR1 register.

0: No parity error

1: Parity error

TDRE TC RDRF IDLE OR NF FE PE

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

CONTROL REGISTER 1 (SCICR1)

Read/Write

Reset Value: x000 0000 (x0h)

Bit 7 = R8 Receive data bit 8.

This bit is used to store the 9th bit of the received

word when M = 1.

Bit 6 = T8 Transmit data bit 8.

This bit is used to store the 9th bit of the transmit-

ted word when M = 1.

Bit 5 = SCID Disabled for low power consumption

When this bit is set the SCI prescalers and outputs

are stopped and the end of the current byte trans-

fer in order to reduce power consumption.This bit

is set and cleared by software.

0: SCI enabled

1: SCI prescaler and outputs disabled

Bit 4 = M Word length.

This bit determines the word length. It is set or

cleared by software.

0: 1 Start bit, 8 Data bits, 1 Stop bit

1: 1 Start bit, 9 Data bits, 1 Stop bit

Note: The M bit must not be modified during a data

transfer (both transmission and reception).

Bit 3 = WAKE Wake-Up method.

This bit determines the SCI Wake-Up method, it is

set or cleared by software.

0: Idle Line

1: Address Mark

Bit 2 = PCE Parity control enable.

This bit selects the hardware parity control (gener-

ation and detection). When the parity control is en-

abled, the computed parity is inserted at the MSB

position (9th bit if M = 1; 8th bit if M = 0) and parity

is checked on the received data. This bit is set and

cleared by software. Once it is set, PCE is active

after the current byte (in reception and in transmis-

sion).

0: Parity control disabled

1: Parity control enabled

Bit 1 = PS Parity selection.

This bit selects the odd or even parity when the

parity generation/detection is enabled (PCE bit

set). It is set and cleared by software. The parity is

selected after the current byte.

0: Even parity

1: Odd parity

Bit 0 = PIE Parity interrupt enable.

This bit enables the interrupt capability of the hard-

ware parity control when a parity error is detected

(PE bit set). It is set and cleared by software.

0: Parity error interrupt disabled

1: Parity error interrupt enabled.

R8 T8 SCID M WAKE PCE PS PIE

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

CONTROL REGISTER 2 (SCICR2)

Read/Write

Reset Value: 0000 0000 (00h)

Bit 7 = TIE Transmitter interrupt enable.

This bit is set and cleared by software.

0: Interrupt is inhibited

1: An SCI interrupt is generated whenever

TDRE=1 in the SCISR register

Bit 6 = TCIE Transmission complete interrupt ena-

ble

This bit is set and cleared by software.

0: Interrupt is inhibited

1: An SCI interrupt is generated whenever TC=1 in

the SCISR register

Bit 5 = RIE Receiver interrupt enable.

This bit is set and cleared by software.

0: Interrupt is inhibited

1: An SCI interrupt is generated whenever OR=1

or RDRF=1 in the SCISR register

Bit 4 = ILIE Idle line interrupt enable.

This bit is set and cleared by software.

0: Interrupt is inhibited

1: An SCI interrupt is generated whenever IDLE=1

in the SCISR register.

Bit 3 = TE Transmitter enable.

This bit enables the transmitter. It is set and

cleared by software.

0: Transmitter is disabled

1: Transmitter is enabled

Notes:

– During transmission, a “0” pulse on the TE bit

(“0” followed by “1”) sends a preamble (idle line)

after the current word.

– When TE is set there is a 1 bit-time delay before

the transmission starts.

CAUTION: The TDO pin is free for general pur-

pose I/O only when the TE and RE bits are both

cleared (or if TE is never set).

Bit 2 = RE Receiver enable.

This bit enables the receiver. It is set and cleared

by software.

0: Receiver is disabled

1: Receiver is enabled and begins searching for a

start bit

Bit 1 = RWU Receiver wake-up.

This bit determines if the SCI is in mute mode or

not. It is set and cleared by software and can be

cleared by hardware when a wake-up sequence is

recognized.

0: Receiver in Active mode

1: Receiver in Mute mode

Note: Before selecting Mute mode (setting the

RWU bit), the SCI must receive some data first,

otherwise it cannot function in Mute mode with

wake-up by idle line detection.

Bit 0 = SBK Send break.

This bit set is used to send break characters. It is

set and cleared by software.

0: No break character is transmitted

1: Break characters are transmitted

Note: If the SBK bit is set to “1” and then to “0”, the

transmitter sends a BREAK word at the end of the

current word.

TIE TCIE RIE ILIE TE RE RWU SBK

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

DATA REGISTER (SCIDR)

Read/Write

Reset Value: Undefined

Contains the Received or Transmitted data char-

acter, depending on whether it is read from or writ-

ten to.

The Data register performs a double function (read

and write) since it is composed of two registers,

one for transmission (TDR) and one for reception

(RDR).

The TDR register provides the parallel interface

between the internal bus and the output shift reg-

ister (see Figure 1.).

The RDR register provides the parallel interface

between the input shift register and the internal

bus (see Figure 1.).

BAUD RATE REGISTER (SCIBRR)

Read/Write

Reset Value: 0000 0000 (00h)

Bits 7:6 = SCP[1:0] First SCI Prescaler

These 2 prescaling bits allow several standard

clock division ranges:

Bits 5:3 = SCT[2:0] SCI Transmitter rate divisor

These 3 bits, in conjunction with the SCP1 & SCP0

bits define the total division applied to the bus

clock to yield the transmit rate clock in convention-

al Baud Rate Generator mode.

Bits 2:0 = SCR[2:0] SCI Receiver rate divisor.

These 3 bits, in conjunction with the SCP[1:0] bits

define the total division applied to the bus clock to

yield the receive rate clock in conventional Baud

Rate Generator mode.

DR7 DR6 DR5 DR4 DR3 DR2 DR1 DR0

SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1 SCR0

PR Prescaling factor SCP1 SCP0

100

301

410

13 1 1

TR dividing factor SCT2 SCT1 SCT0

1000

2001

4010

8011

16 1 0 0

32 1 0 1

64 1 1 0

128 1 1 1

RR Dividing factor SCR2 SCR1 SCR0

1000

2001

4010

8011

16 1 0 0

32 1 0 1

64 1 1 0

128 1 1 1

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SERIAL COMMUNICATIONS INTERFACE (Cont’d)

EXTENDED RECEIVE PRESCALER DIVISION

Read/Write

Reset Value: 0000 0000 (00h)

Allows setting of the Extended Prescaler rate divi-

sion factor for the receive circuit.

Bits 7:0 = ERPR[7:0] 8-bit Extended Receive

Prescaler Register.

The extended Baud Rate Generator is activated

when a value different from 00h is stored in this

from the 16 divider (see Figure 3.) is divided by the

binary factor set in the SCIERPR register (in the

range 1 to 255).

The extended baud rate generator is not used af-

ter a reset.

EXTENDED TRANSMIT PRESCALER DIVISION

Read/Write

Reset Value:0000 0000 (00h)

Allows setting of the External Prescaler rate divi-

sion factor for the transmit circuit.

Bits 7:0 = ETPR[7:0] 8-bit Extended Transmit

Prescaler Register.

The extended Baud Rate Generator is activated

when a value different from 00h is stored in this

from the 16 divider (see Figure 3.) is divided by the

binary factor set in the SCIETPR register (in the

range 1 to 255).

The extended baud rate generator is not used af-

ter a reset.

Table 21. Baudrate Selection

ERPR

7ERPR

6ERPR

5ERPR

4ERPR

3ERPR

2ERPR

1ERPR

ETPR

7ETPR

6ETPR

5ETPR

4ETPR

3ETPR

2ETPR

1ETPR

Symbol Parameter

Conditions

Standard Baud

Rate Unit

fCPU

Accuracy vs

Standard Prescaler

fTx

fRx

Communication frequency 8 MHz

~0.16%

Conventional Mode

TR (or RR)=128, PR=13

TR (or RR)= 32, PR=13

TR (or RR)= 16, PR=13

TR (or RR)= 8, PR=13

TR (or RR)= 4, PR=13

TR (or RR)= 16, PR= 3

TR (or RR)= 2, PR=13

TR (or RR)= 1, PR=13

300

1200

2400

4800

9600

10400

19200

38400

~300.48

~1201.92

~2403.84

~4807.69

~9615.38

~10416.67

~19230.77

~38461.54

~0.79%

Extended Mode

ETPR (or ERPR) = 35,

TR (or RR)= 1, PR=1

14400 ~14285.71

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SERIAL COMMUNICATION INTERFACE (Cont’d)

Table 22. SCI Register Map and Reset Values

Address

(Hex.)

Label 76543210

0050h SCISR

Reset Value

TDRE

RDRF

IDLE

0051h SCIDR

Reset Value

MSB

xxxxxxx

LSB

0052h SCIBRR

Reset Value

SCP1

SCP0

SCT2

SCT1

SCT0

SCR2

SCR1

SCR0

0053h SCICR1

Reset Value

SCID

WAKE

PCE

PIE

0054h SCICR2

Reset Value

TIE

TCIE

RIE

ILIE

RWU

SBK

0055h SCIERPR

Reset Value

MSB

0000000

LSB

0057h SCIPETPR

Reset Value

MSB

0000000

LSB

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10.6 10-BIT A/D CONVERTER (ADC)

10.6.1 Introduction

The on-chip Analog to Digital Converter (ADC) pe-

ripheral is a 10-bit, successive approximation con-

verter with internal sample and hold circuitry. This

peripheral has up to 16 multiplexed analog input

channels (refer to device pin out description) that

allow the peripheral to convert the analog voltage

levels from up to 16 different sources.

The result of the conversion is stored in a 10-bit

Data Register. The A/D converter is controlled

through a Control/Status Register.

10.6.2 Main Features

■10-bit conversion

■Up to 16 channels with multiplexed input

■Linear successive approximation

■Data register (DR) which contains the results

■Conversion complete status flag

■On/off bit (to reduce consumption)

The block diagram is shown in Figure 57.

Figure 57. ADC Block Diagram

CH2 CH1EOC SPEED ADON 0 CH0 ADCCSR

AIN0

AIN1 ANALOG TO DIGITAL

CONVERTER

AINx

ANALOG

MUX

D4 D3D5D9 D8 D7 D6 D2

ADCDRH

DIV 4 fADC

fCPU

D1 D0

ADCDRL

00 0000

CH3

DIV 2

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10-BIT A/D CONVERTER (ADC) (Cont’d)

10.6.3 Functional Description

The conversion is monotonic, meaning that the re-

sult never decreases if the analog input does not

and never increases if the analog input does not.

If the input voltage (VAIN) is greater than VAREF

(high-level voltage reference) then the conversion

result is FFh in the ADCDRH register and 03h in

the ADCDRL register (without overflow indication).

If the input voltage (VAIN) is lower than VSSA (low-

level voltage reference) then the conversion result

in the ADCDRH and ADCDRL registers is 00 00h.

The A/D converter is linear and the digital result of

the conversion is stored in the ADCDRH and AD-

CDRL registers. The accuracy of the conversion is

described in the Electrical Characteristics Section.

RAIN is the maximum recommended impedance

for an analog input signal. If the impedance is too

high, this will result in a loss of accuracy due to

leakage and sampling not being completed in the

alloted time.

10.6.3.1 A/D Converter Configuration

The analog input ports must be configured as in-

put, no pull-up, no interrupt. Refer to the «I/O

ports» chapter. Using these pins as analog inputs

does not affect the ability of the port to be read as

a logic input.

In the ADCCSR register:

– Select the CS[3:0] bits to assign the analog

channel to convert.

10.6.3.2 Starting the Conversion

In the ADCCSR register:

– Set the ADON bit to enable the A/D converter

and to start the conversion. From this time on,

the ADC performs a continuous conversion of

the selected channel.

When a conversion is complete:

– The EOC bit is set by hardware.

– The result is in the ADCDR registers.

A read to the ADCDRH resets the EOC bit.

To read the 10 bits, perform the following steps:

1. Poll the EOC bit

2. Read the ADCDRL register

3. Read the ADCDRH register. This clears EOC

automatically.

Note: The data is not latched, so both the low and

the high data register must be read before the next

conversion is complete, so it is recommended to

disable interrupts while reading the conversion re-

sult.

To read only 8 bits, perform the following steps:

1. Poll the EOC bit

2. Read the ADCDRH register. This clears EOC

automatically.

10.6.3.3 Changing the conversion channel

The application can change channels during con-

version. When software modifies the CH[3:0] bits

in the ADCCSR register, the current conversion is

stopped, the EOC bit is cleared, and the A/D con-

verter starts converting the newly selected chan-

nel.

10.6.4 Low Power Modes

Note: The A/D converter may be disabled by re-

setting the ADON bit. This feature allows reduced

power consumption when no conversion is need-

ed.

10.6.5 Interrupts

None.

Mode Description

WAIT No effect on A/D Converter

HALT

A/D Converter disabled.

After wakeup from Halt mode, the A/D

Converter requires a stabilization time

tSTAB (see Electrical Characteristics)

before accurate conversions can be

performed.

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10-BIT A/D CONVERTER (ADC) (Cont’d)

10.6.6 Register Description

CONTROL/STATUS REGISTER (ADCCSR)

Read/Write (Except bit 7 read only)

Reset Value: 0000 0000 (00h)

Bit 7 = EOC End of Conversion

This bit is set by hardware. It is cleared by hard-

ware when software reads the ADCDRH register

or writes to any bit of the ADCCSR register.

0: Conversion is not complete

1: Conversion complete

Bit 6 = SPEED ADC clock selection

This bit is set and cleared by software.

0: fADC = fCPU/4

1: fADC = fCPU/2

Bit 5 = ADON A/D Converter on

This bit is set and cleared by software.

0: Disable ADC and stop conversion

1: Enable ADC and start conversion

Bit 4 = Reserved. Must be kept cleared.

Bit 3:0 = CH[3:0] Channel Selection

These bits are set and cleared by software. They

select the analog input to convert.

*The number of channels is device dependent. Refer to

the device pinout description.

DATA REGISTER (ADCDRH)

Read Only

Reset Value: 0000 0000 (00h)

Bit 7:0 = D[9:2] MSB of Converted Analog Value

DATA REGISTER (ADCDRL)

Read Only

Reset Value: 0000 0000 (00h)

Bit 7:2 = Reserved. Forced by hardware to 0.

Bit 1:0 = D[1:0] LSB of Converted Analog Value

EOC SPEED ADON 0 CH3 CH2 CH1 CH0

Channel Pin* CH3 CH2 CH1 CH0

AIN0 0 0 0 0

AIN1 0 0 0 1

AIN2 0 0 1 0

AIN3 0 0 1 1

AIN4 0 1 0 0

AIN5 0 1 0 1

AIN6 0 1 1 0

AIN7 0 1 1 1

AIN8 1 0 0 0

AIN9 1 0 0 1

AIN10 1 0 1 0

AIN11 1 0 1 1

AIN12 1 1 0 0

AIN13 1 1 0 1

AIN14 1 1 1 0

AIN15 1 1 1 1

D9 D8 D7 D6 D5 D4 D3 D2

000000D1D0

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10-BIT A/D CONVERTER (Cont’d)

Table 23. ADC Register Map and Reset Values

Address

(Hex.)

Label 76543210

0070h ADCCSR

Reset Value

EOC

SPEED

ADON

CH3

CH2

CH1

CH0

0071h ADCDRH

Reset Value

0072h ADCDRL

Reset Value000000

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11 INSTRUCTION SET

11.1 CPU ADDRESSING MODES

The CPU features 17 different addressing modes

which can be classified in 7 main groups:

The CPU Instruction set is designed to minimize

the number of bytes required per instruction: To do

so, most of the addressing modes may be subdi-

vided in two sub-modes called long and short:

– Long addressing mode is more powerful be-

cause it can use the full 64 Kbyte address space,

however it uses more bytes and more CPU cy-

cles.

– Short addressing mode is less powerful because

it can generally only access page zero (0000h -

00FFh range), but the instruction size is more

compact, and faster. All memory to memory in-

structions use short addressing modes only

(CLR, CPL, NEG, BSET, BRES, BTJT, BTJF,

INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP)

The ST7 Assembler optimizes the use of long and

short addressing modes.

Table 24. CPU Addressing Mode Overview

Addressing Mode Example

Inherent nop

Immediate ld A,#$55

Direct ld A,$55

Indexed ld A,($55,X)

Indirect ld A,([$55],X)

Relative jrne loop

Bit operation bset byte,#5

Mode Syntax Destination

Pointer

Address

(Hex.)

Pointer Size

(Hex.)

Length

(Bytes)

Inherent nop + 0

Immediate ld A,#$55 + 1

Short Direct ld A,$10 00..FF + 1

Long Direct ld A,$1000 0000..FFFF + 2

No Offset Direct Indexed ld A,(X) 00..FF + 0

Short Direct Indexed ld A,($10,X) 00..1FE + 1

Long Direct Indexed ld A,($1000,X) 0000..FFFF + 2

Short Indirect ld A,[$10] 00..FF 00..FF byte + 2

Long Indirect ld A,[$10.w] 0000..FFFF 00..FF word + 2

Short Indirect Indexed ld A,([$10],X) 00..1FE 00..FF byte + 2

Long Indirect Indexed ld A,([$10.w],X) 0000..FFFF 00..FF word + 2

Relative Direct jrne loop PC+/-127 + 1

Relative Indirect jrne [$10] PC+/-127 00..FF byte + 2

Bit Direct bset $10,#7 00..FF + 1

Bit Indirect bset [$10],#7 00..FF 00..FF byte + 2

Bit Direct Relative btjt $10,#7,skip 00..FF + 2

Bit Indirect Relative btjt [$10],#7,skip 00..FF 00..FF byte + 3

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INSTRUCTION SET OVERVIEW (Cont’d)

11.1.1 Inherent

All Inherent instructions consist of a single byte.

The opcode fully specifies all the required informa-

tion for the CPU to process the operation.

11.1.2 Immediate

Immediate instructions have two bytes, the first

byte contains the opcode, the second byte con-

tains the operand value.

11.1.3 Direct

In Direct instructions, the operands are referenced

by their memory address.

The direct addressing mode consists of two sub-

modes:

Direct (short)

The address is a byte, thus requires only one byte

after the opcode, but only allows 00 - FF address-

ing space.

Direct (long)

The address is a word, thus allowing 64 Kbyte ad-

dressing space, but requires 2 bytes after the op-

code.

11.1.4 Indexed (No Offset, Short, Long)

In this mode, the operand is referenced by its

memory address, which is defined by the unsigned

addition of an index register (X or Y) with an offset.

The indirect addressing mode consists of three

sub-modes:

Indexed (No Offset)

There is no offset, (no extra byte after the opcode),

and allows 00 - FF addressing space.

Indexed (Short)

The offset is a byte, thus requires only one byte af-

ter the opcode and allows 00 - 1FE addressing

space.

Indexed (long)

The offset is a word, thus allowing 64 Kbyte ad-

dressing space and requires 2 bytes after the op-

code.

11.1.5 Indirect (Short, Long)

The required data byte to do the operation is found

by its memory address, located in memory (point-

er).

The pointer address follows the opcode. The indi-

rect addressing mode consists of two sub-modes:

Indirect (short)

The pointer address is a byte, the pointer size is a

byte, thus allowing 00 - FF addressing space, and

requires 1 byte after the opcode.

Indirect (long)

The pointer address is a byte, the pointer size is a

word, thus allowing 64 Kbyte addressing space,

and requires 1 byte after the opcode.

Inherent Instruction Function

NOP No operation

TRAP S/W Interrupt

WFI Wait For Interrupt (Low Pow-

er Mode)

HALT Halt Oscillator (Lowest Power

Mode)

RET Sub-routine Return

IRET Interrupt Sub-routine Return

SIM Set Interrupt Mask (level 3)

RIM Reset Interrupt Mask (level 0)

SCF Set Carry Flag

RCF Reset Carry Flag

RSP Reset Stack Pointer

LD Load

CLR Clear

PUSH/POP Push/Pop to/from the stack

INC/DEC Increment/Decrement

TNZ Test Negative or Zero

CPL, NEG 1 or 2 Complement

MUL Byte Multiplication

SLL, SRL, SRA, RLC,

RRC Shift and Rotate Operations

SWAP Swap Nibbles

Immediate Instruction Function

LD Load

CP Compare

BCP Bit Compare

AND, OR, XOR Logical Operations

ADC, ADD, SUB, SBC Arithmetic Operations

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INSTRUCTION SET OVERVIEW (Cont’d)

11.1.6 Indirect Indexed (Short, Long)

This is a combination of indirect and short indexed

addressing modes. The operand is referenced by

its memory address, which is defined by the un-

signed addition of an index register value (X or Y)

with a pointer value located in memory. The point-

er address follows the opcode.

The indirect indexed addressing mode consists of

two sub-modes:

Indirect Indexed (Short)

The pointer address is a byte, the pointer size is a

byte, thus allowing 00 - 1FE addressing space,

and requires 1 byte after the opcode.

Indirect Indexed (Long)

The pointer address is a byte, the pointer size is a

word, thus allowing 64 Kbyte addressing space,

and requires 1 byte after the opcode.

Table 25. Instructions Supporting Direct,

Indexed, Indirect and Indirect Indexed

Addressing Modes

11.1.7 Relative mode (Direct, Indirect)

This addressing mode is used to modify the PC

it.

The relative addressing mode consists of two sub-

modes:

Relative (Direct)

The offset is following the opcode.

Relative (Indirect)

The offset is defined in memory, which address

follows the opcode.

Long and Short

Instructions Function

LD Load

CP Compare

AND, OR, XOR Logical Operations

ADC, ADD, SUB, SBC Arithmetic Additions/Sub-

stractions operations

BCP Bit Compare

Short Instructions

Only Function

CLR Clear

INC, DEC Increment/Decrement

TNZ Test Negative or Zero

CPL, NEG 1 or 2 Complement

BSET, BRES Bit Operations

BTJT, BTJF Bit Test and Jump Opera-

tions

SLL, SRL, SRA, RLC,

RRC

Shift and Rotate Opera-

tions

SWAP Swap Nibbles

CALL, JP Call or Jump subroutine

Available Relative

Direct/Indirect

Instructions

Function

JRxx Conditional Jump

CALLR Call Relative

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INSTRUCTION SET OVERVIEW (Cont’d)

11.2 INSTRUCTION GROUPS

The ST7 family devices use an Instruction Set

consisting of 63 instructions. The instructions may be subdivided into 13 main groups as illustrated in

the following table:

Using a pre-byte

The instructions are described with one to four op-

codes.

In order to extend the number of available op-

codes for an 8-bit CPU (256 opcodes), three differ-

ent prebyte opcodes are defined. These prebytes

modify the meaning of the instruction they pre-

cede.

The whole instruction becomes:

PC-2 End of previous instruction

PC-1 Prebyte

PC opcode

PC+1 Additional word (0 to 2) according

to the number of bytes required to compute the ef-

fective address

These prebytes enable instruction in Y as well as

indirect addressing modes to be implemented.

They precede the opcode of the instruction in X or

the instruction using direct addressing mode. The

prebytes are:

PDY 90 Replace an X based instruction

using immediate, direct, indexed, or inherent ad-

dressing mode by a Y one.

PIX 92 Replace an instruction using di-

rect, direct bit, or direct relative addressing mode

to an instruction using the corresponding indirect

addressing mode.

It also changes an instruction using X indexed ad-

dressing mode to an instruction using indirect X in-

dexed addressing mode.

PIY 91 Replace an instruction using X in-

direct indexed addressing mode by a Y one.

Load and Transfer LD CLR

Stack operation PUSH POP RSP

Increment/Decrement INC DEC

Compare and Tests CP TNZ BCP

Logical operations AND OR XOR CPL NEG

Bit Operation BSET BRES

Conditional Bit Test and Branch BTJT BTJF

Arithmetic operations ADC ADD SUB SBC MUL

Shift and Rotates SLL SRL SRA RLC RRC SWAP SLA

Unconditional Jump or Call JRA JRT JRF JP CALL CALLR NOP RET

Conditional Branch JRxx

Interruption management TRAP WFI HALT IRET

Condition Code Flag modification SIM RIM SCF RCF

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INSTRUCTION SET OVERVIEW (Cont’d)

Mnemo Description Function/Example Dst Src I1 H I0 N Z C

ADC Add with Carry A = A + M + C A M H N Z C

ADD Addition A = A + M A M H N Z C

AND Logical And A = A . M A M N Z

BCP Bit compare A, Memory tst (A . M) A M N Z

BRES Bit Reset bres Byte, #3 M

BSET Bit Set bset Byte, #3 M

BTJF Jump if bit is false (0) btjf Byte, #3, Jmp1 M C

BTJT Jump if bit is true (1) btjt Byte, #3, Jmp1 M C

CALL Call subroutine

CALLR Call subroutine relative

CLR Clear reg, M 0 1

CP Arithmetic Compare tst(Reg - M) reg M N Z C

CPL One Complement A = FFH-A reg, M N Z 1

DEC Decrement dec Y reg, M N Z

HALT Halt 1 0

IRET Interrupt routine return Pop CC, A, X, PC I1 H I0 N Z C

INC Increment inc X reg, M N Z

JP Absolute Jump jp [TBL.w]

JRA Jump relative always

JRT Jump relative

JRF Never jump jrf *

JRIH Jump if ext. INT pin = 1 (ext. INT pin high)

JRIL Jump if ext. INT pin = 0 (ext. INT pin low)

JRH Jump if H = 1 H = 1?

JRNH Jump if H = 0 H = 0?

JRM Jump if I1:0 = 11 I1:0 = 11?

JRNM Jump if I1:0 <> 11 I1:0 <> 11?

JRMI Jump if N = 1 (minus) N = 1?

JRPL Jump if N = 0 (plus) N = 0?

JREQ Jump if Z = 1 (equal) Z = 1?

JRNE Jump if Z = 0 (not equal) Z = 0?

JRC Jump if C = 1 C = 1?

JRNC Jump if C = 0 C = 0?

JRULT Jump if C = 1 Unsigned <

JRUGE Jump if C = 0 Jmp if unsigned >=

JRUGT Jump if (C + Z = 0) Unsigned >

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INSTRUCTION SET OVERVIEW (Cont’d)

Mnemo Description Function/Example Dst Src I1 H I0 N Z C

JRULE Jump if (C + Z = 1) Unsigned <=

LD Load dst <= src reg, M M, reg N Z

MUL Multiply X,A = X * A A, X, Y X, Y, A 0 0

NEG Negate (2's compl) neg $10 reg, M N Z C

NOP No Operation

OR OR operation A = A + M A M N Z

POP Pop from the Stack pop reg reg M

pop CC CC M I1 H I0 N Z C

PUSH Push onto the Stack push Y M reg, CC

RCF Reset carry flag C = 0 0

RET Subroutine Return

RIM Enable Interrupts I1:0 = 10 (level 0) 1 0

RLC Rotate left true C C <= A <= C reg, M N Z C

RRC Rotate right true C C => A => C reg, M N Z C

RSP Reset Stack Pointer S = Max allowed

SBC Substract with Carry A = A - M - C A M N Z C

SCF Set carry flag C = 1 1

SIM Disable Interrupts I1:0 = 11 (level 3) 1 1

SLA Shift left Arithmetic C <= A <= 0 reg, M N Z C

SLL Shift left Logic C <= A <= 0 reg, M N Z C

SRL Shift right Logic 0 => A => C reg, M 0 Z C

SRA Shift right Arithmetic A7 => A => C reg, M N Z C

SUB Substraction A = A - M A M N Z C

SWAP SWAP nibbles A7-A4 <=> A3-A0 reg, M N Z

TNZ Test for Neg & Zero tnz lbl1 N Z

TRAP S/W trap S/W interrupt 1 1

WFI Wait for Interrupt 1 0

XOR Exclusive OR A = A XOR M A M N Z

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12 ELECTRICAL CHARACTERISTICS

12.1 PARAMETER CONDITIONS

Unless otherwise specified, all voltages are re-

ferred to VSS.

12.1.1 Minimum and Maximum values

Unless otherwise specified the minimum and max-

imum values are guaranteed in the worst condi-

tions of ambient temperature, supply voltage and

frequencies by tests in production on 100% of the

devices with an ambient temperature at TA=25°C

and TA=TAmax (given by the selected temperature

range).

Data based on characterization results, design

simulation and/or technology characteristics are

indicated in the table footnotes and are not tested

in production. Based on characterization, the min-

imum and maximum values refer to sample tests

and represent the mean value plus or minus three

times the standard deviation (mean±3Σ).

12.1.2 Typical values

Unless otherwise specified, typical data are based

on TA=25°C, VDD=5V. They are given only as de-

sign guidelines and are not tested.

12.1.3 Typical curves

Unless otherwise specified, all typical curves are

given only as design guidelines and are not tested.

12.1.4 Loading capacitor

The loading conditions used for pin parameter

measurement are shown in Figure 58.

Figure 58. Pin loading conditions

12.1.5 Pin input voltage

The input voltage measurement on a pin of the de-

vice is described in Figure 59.

Figure 59. Pin input voltage

ST7 PIN

VIN

ST7 PIN

To guar £1

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12.2 ABSOLUTE MAXIMUM RATINGS

Stresses above those listed as “absolute maxi-

mum ratings” may cause permanent damage to

the device. This is a stress rating only and func-

tional operation of the device under these condi-

tions is not implied. Exposure to maximum rating

conditions for extended periods may affect device

reliability.

12.2.1 Voltage Characteristics

12.2.2 Current Characteristics

Notes:

1. Directly connecting the RESET and I/O pins to VDD or VSS could damage the device if an unintentional internal reset

is generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter).

To guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7kΩ for

RESET, 10kΩ for I/Os). For the same reason, unused I/O pins must not be directly tied to VDD or VSS.

2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be

respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN>VDD

while a negative injection is induced by VIN<VSS. For true open-drain pads, there is no positive injection current, and the

corresponding VIN maximum must always be respected

3. All power (VDD) and ground (VSS) lines must always be connected to the external supply.

4. Negative injection disturbs the analog performance of the device. See note in “ADC Accuracy” on page 145.

For best reliability, it is recommended to avoid negative injection of more than 1.6mA.

5. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the positive

and negative injected currents (instantaneous values). These results are based on characterisation with ΣIINJ(PIN) maxi-

mum current injection on four I/O port pins of the device.

6. True open drain I/O port pins do not accept positive injection.

Symbol Ratings Maximum value Unit

VDD - VSS Supply voltage 6.5

VPP - VSS Programming Voltage 13

VIN 1) & 2) Input Voltage on true open drain pin VSS-0.3 to 6.5

Input voltage on any other pin VSS-0.3 to VDD+0.3

|∆VDDx| and |∆VSSx| Variations between different digital power pins 50 mV

|VSSA - VSSx| Variations between digital and analog ground pins 50

VESD(HBM) Electro-static discharge voltage (Human Body Model) see Section 12.8.3 on page 132

VESD(MM) Electro-static discharge voltage (Machine Model)

Symbol Ratings Maximum value Unit

IVDD Total current into VDD power lines

(source) 3)

32-pin devices 75 mA

44-pin devices 150

IVSS Total current out of VSS ground lines

(sink) 3)

32-pin devices 75 mA

44-pin devices 150

IIO

Output current sunk by any standard I/O and control pin 25

Output current sunk by any high sink I/O pin 50

Output current source by any I/Os and control pin - 25

IINJ(PIN) 2) & 4)

Injected current on VPP pin ± 5

Injected current on RESET pin ± 5

Injected current on OSC1 and OSC2 pins ± 5

Injected current on Flash device pin PB0 +5

Injected current on any other pin 5) & 6) ± 5

ΣIINJ(PIN) 2) Total injected current (sum of all I/O and control pins) 5) ± 25

7cm

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12.2.3 Thermal Characteristics

12.3 OPERATING CONDITIONS

12.3.1 Operating Conditions

Figure 60. fCPU Max Versus VDD

Note: Some temperature ranges are only available with a specific package and memory size. Refer to Or-

dering Information.

Warning: Do not connect 12V to VPP before VDD is powered on, as this may damage the device.

Symbol Ratings Value Unit

TSTG Storage temperature range -65 to +150 °C

TJMaximum junction temperature (see Section 13.2 THERMAL CHARACTERISTICS)

Symbol Parameter Conditions Min Max Unit

fCPU Internal clock frequency 0 8 MHz

VDD

Operating voltage (except Flash Write/

Erase) 3.8 5.5 V

Operating Voltage for Flash Write/Erase VPP = 11.4 to 12.6V 4.5 5.5

TAAmbient temperature range

1 Suffix Version 0 70

°C

5 Suffix Version -10 85

6 Suffix Versions -40 85

7 Suffix Versions -40 105

3 Suffix Version -40 125

fCPU [MHz]

SUPPLY VOLTAGE [V]

3.5 4.0 4.5 5.5

FUNCTIONALITY

GUARANTEED

IN THIS AREA

NOT GUARANTEED

IN THIS AREA

3.8

(UNLESS

OTHERWISE

SPECIFIED

IN THE TABLES

OF PARAMETRIC

DATA)

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OPERATING CONDITIONS (Cont’d)

12.4 LVD/AVD CHARACTERISTICS

12.4.1 Operating Conditions with Low Voltage Detector (LVD)

Subject to general operating conditions for TA

Notes:

1. Data based on characterization results, not tested in production.

2. If the medium or low thresholds are selected, the detection may occur outside the specified operating voltage range.

12.4.2 Auxiliary Voltage Detector (AVD) Thresholds

Subject to general operating conditions for TA

1. Data based on characterization results not tested in production.

Symbol Parameter Conditions Min Typ Max Unit

VIT+(LVD) Reset release threshold

(VDD rise)

VD level = High in option byte 4.0 1) 4.2 4.5

VD level = Med. in option byte2) 3.55 1) 3.75 4.01)

VD level = Low in option byte2) 2.95 1) 3.15 3.351)

VIT-(LVD) Reset generation threshold

(VDD fall)

VD level = High in option byte 3.8 4.0 4.25 1)

VD level = Med. in option byte2) 3.351) 3.55 3.751)

VD level = Low in option byte2) 2.81) 3.0 3.15 1)

Vhys(LVD) LVD voltage threshold hysteresis 1) VIT+(LVD)-VIT-(LVD) 150 200 250 mV

VtPOR VDD rise time 1) 6µs/V 100ms/V

tg(VDD) Filtered glitch delay on VDD 1) Not detected by the LVD 40 ns

Symbol Parameter Conditions Min Typ Max Unit

VIT+(AVD) 1⇒0 AVDF flag toggle threshold

(VDD rise)

VD level = High in option byte 4.4 1) 4.6 4.9

VD level = Med. in option byte

VD level = Low in option byte

3.95 1)

3.4 1) 4.15

3.6

4.41)

3.81)

VIT-(AVD) 0⇒1 AVDF flag toggle threshold

(VDD fall)

VD level = High in option byte 4.2 4.4 4.65 1)

VD level = Med. in option byte

VD level = Low in option byte

3.751)

3.21) 4.0

3.4

4.2 1)

3.6 1)

Vhys(AVD) AVD voltage threshold hysteresis VIT+(AVD)-VIT-(AVD) 200 mV

∆VIT- Voltage drop between AVD flag set

and LVD reset activated VIT-(AVD)-VIT-(LVD) 450 mV

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12.5 SUPPLY CURRENT CHARACTERISTICS

The following current consumption specified for the ST7 functional operating modes over temperature

range does not take into account the clock source current consumption. To get the total device consump-

tion, the two current values must be added (except for HALT mode for which the clock is stopped).

12.5.1 CURRENT CONSUMPTION

Notes:

1. Data based on characterization results, tested in production at VDD max. and fCPU max.

2. Measurements are done in the following conditions:

- Program executed from RAM, CPU running with RAM access. The increase in consumption when executing from Flash

is 50%.

- All I/O pins in input mode with a static value at VDD or VSS (no load)

- All peripherals in reset state.

- LVD disabled.

- Clock input (OSC1) driven by external square wave.

- In SLOW and SLOW WAIT mode, fCPU is based on fOSC divided by 32.

To obtain the total current consumption of the device, add the clock source (Section 12.6.3) and the peripheral power

consumption (Section 12.5.3).

3. All I/O pins in push-pull 0 mode (when applicable) with a static value at VDD or VSS (no load), LVD disabled. Data based

on characterization results, tested in production at VDD max. and fCPU max.

4. Data based on characterisation results, not tested in production. All I/O pins in push-pull 0 mode (when applicable) with

a static value at VDD or VSS (no load); clock input (OSC1) driven by external square wave, LVD disabled. To obtain

the total current consumption of the device, add the clock source consumption (Section 12.6.3).

Symbol Parameter Conditions Flash Devices Unit

Typ Max

IDD

Supply current in RUN mode 2)

fOSC=2MHz, fCPU=1MHz

fOSC=4MHz, fCPU=2MHz

fOSC=8MHz, fCPU=4MHz

fOSC=16MHz, fCPU=8MHz

1.3

2.0

3.6

7.1

3.0

5.0

8.0

15.0

Supply current in SLOW mode 2)

fOSC=2MHz, fCPU=62.5kHz

fOSC=4MHz, fCPU=125kHz

fOSC=8MHz, fCPU=250kHz

fOSC=16MHz, fCPU=500kHz

600

700

800

1100

2700

3000

3600

4000

µA

Supply current in WAIT mode 2)

fOSC=2MHz, fCPU=1MHz

fOSC=4MHz, fCPU=2MHz

fOSC=8MHz, fCPU=4MHz

fOSC=16MHz, fCPU=8MHz

1.0

1.5

2.5

4.5

3.0

4.0

5.0

7.0

Supply current in SLOW WAIT mode 2)

fOSC=2MHz, fCPU=62.5kHz

fOSC=4MHz, fCPU=125kHz

fOSC=8MHz, fCPU=250kHz

fOSC=16MHz, fCPU=500kHz

580

650

770

1050

1200

1300

1800

2000

µA

Supply current in HALT mode 3) -40°C≤TA≤+85°C <1 10

µA

-40°C≤TA≤+125°C <1 50

IDD Supply current in ACTIVE-HALT mode 4)

fOSC=2MHz

fOSC=4MHz

fOSC=8MHz

fOSC =16MHz

160

325

650

No max.

guaran-

teed

:I/ :: ::

ST72324Jx ST72324Kx

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SUPPLY CURRENT CHARACTERISTICS (Cont’d)

12.5.1.1 Power Consumption vs fCPU: Flash Devices

Figure 61. Typical IDD in RUN mode

Figure 62. Typical IDD in SLOW mode

Figure 63. Typical IDD in WAIT mode

Figure 64. Typ. IDD in SLOW-WAIT mode

4 4.4 4.8 5.2 5.5

Vdd (V)

Idd (mA)

8MHz

4MHz

2MHz

1MHz

0.00

0.20

0.40

0.60

0.80

1.00

1.20

4 4.4 4.8 5.2 5.5

Vdd (V)

Idd (mA)

500kHz

250kHz

125kHz

62.5kHz

4 4.4 4.8 5.2 5.5

Vdd (V)

Idd (mA)

8MHz

4MHz

2MHz

1MHz

0.00

0.20

0.40

0.60

0.80

1.00

1.20

4 4.4 4.8 5.2 5.5

Vdd (V)

Idd (mA)

500kHz

250kHz

125kHz

62.5kHz

ST72324Jx ST72324Kx

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SUPPLY CURRENT CHARACTERISTICS (Cont’d)

12.5.2 Supply and Clock Managers

The previous current consumption specified for the ST7 functional operating modes over temperature

range does not take into account the clock source current consumption. To get the total device consump-

tion, the two current values must be added (except for HALT mode).

Notes:

1. Data based on characterization results done with the external components specified in Section 12.6.3, not tested in

production.

2. As the oscillator is based on a current source, the consumption does not depend on the voltage.

Symbol Parameter Conditions Typ Max Unit

IDD(RCINT) Supply current of internal RC oscillator 625

µA

IDD(RES) Supply current of resonator oscillator 1) & 2) see Section

12.6.3 on page

125

IDD(PLL) PLL supply current VDD= 5V 360 µA

IDD(LVD) LVD supply current VDD= 5V 150 300

£1

ST72324Jx ST72324Kx

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SUPPLY CURRENT CHARACTERISTICS (Cont’d)

12.5.3 On-Chip Peripherals

TA = 25°C fCPU=4MHz.

Notes:

1. Data based on a differential IDD measurement between reset configuration (timer counter running at fCPU/4) and timer

counter stopped (only TIMD bit set). Data valid for one timer.

2. Data based on a differential IDD measurement between reset configuration (SPI disabled) and a permanent SPI master

communication at maximum speed (data sent equal to 55h). This measurement includes the pad toggling consump-

tion.

3. Data based on a differential IDD measurement between SCI low power state (SCID=1) and a permanent SCI data trans-

mit sequence.

4. Data based on a differential IDD measurement between reset configuration and continuous A/D conversions.

Symbol Parameter Conditions Typ Unit

IDD(TIM) 16-bit Timer supply current 1) VDD=5.0V 50

µA

IDD(SPI) SPI supply current 2) VDD=5.0V 400

IDD(SCI) SCI supply current 3) VDD=5.0V 400

IDD(ADC) ADC supply current when converting 4) VDD=5.0V 400

ST72324Jx ST72324Kx

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12.6 CLOCK AND TIMING CHARACTERISTICS

Subject to general operating conditions for VDD, fCPU, and TA.

12.6.1 General Timings

12.6.2 External Clock Source

Figure 65. Typical Application with an External Clock Source

Notes:

1. Data based on typical application software.

2. Time measured between interrupt event and interrupt vector fetch. ∆tc(INST) is the number of tCPU cycles needed to finish

the current instruction execution.

3. Data based on design simulation and/or technology characteristics, not tested in production.

Symbol Parameter Conditions Min Typ 1) Max Unit

tc(INST) Instruction cycle time 2312t

CPU

fCPU=8MHz 250 375 1500 ns

tv(IT) Interrupt reaction time 2)

tv(IT) = ∆tc(INST) + 10

10 22 tCPU

fCPU=8MHz 1.25 2.75 µs

Symbol Parameter Conditions Min Typ Max Unit

VOSC1H OSC1 input pin high level voltage

see Figure 65

VDD-1 VDD V

VOSC1L OSC1 input pin low level voltage VSS VSS+1

tw(OSC1H)

tw(OSC1L) OSC1 high or low time 3) 5

tr(OSC1)

tf(OSC1) OSC1 rise or fall time 3) 15

ILOSC1 Input leakage current VSS≤VIN≤VDD ±1 µA

OSC1

OSC2

fOSC

EXTERNAL

ST72XXX

CLOCK SOURCE

Not connected internally

VOSC1L

VOSC1H

tr(OSC1) tf(OSC1) tw(OSC1H) tw(OSC1L)

90%

10%

ST72324Jx ST72324Kx

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CLOCK AND TIMING CHARACTERISTICS (Cont’d)

12.6.3 Crystal and Ceramic Resonator Oscillators

The ST7 internal clock can be supplied with four

different Crystal/Ceramic resonator oscillators. All

the information given in this paragraph are based

on characterization results with specified typical

external components. In the application, the reso-

nator and the load capacitors have to be placed as

close as possible to the oscillator pins in order to

minimize output distortion and start-up stabiliza-

tion time. Refer to the crystal/ceramic resonator

manufacturer for more details (frequency, pack-

age, accuracy...).

Figure 66. Typical Application with a Crystal or Ceramic Resonator

Notes:

1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small RS value.

Refer to crystal/ceramic resonator manufacturer for more details.

2. Data based on characterisation results, not tested in production.

Symbol Parameter Conditions Min Max Unit

fOSC Oscillator Frequency 1)

LP: Low power oscillator

MP: Medium power oscillator

MS: Medium speed oscillator

HS: High speed oscillator

MHz

RFFeedback resistor2) 20 40 kΩ

CL1

CL2

Recommended load capacitance ver-

sus equivalent serial resistance of the

crystal or ceramic resonator (RS)

RS=200ΩLP oscillator

RS=200ΩMP oscillator

RS=200ΩMS oscillator

RS=100ΩHS oscillator

Symbol Parameter Conditions Typ Max Unit

i2OSC2 driving current

VIN=VSS LP oscillator

MP oscillator

MS oscillator

HS oscillator

160

310

610

150

250

460

910

µA

OSC2

OSC1

fOSC

CL1

CL2

ST72XXX

RESONATOR

WHEN RESONATOR WITH

INTEGRATED CAPACITORS

ST72324Jx ST72324Kx

126/164

CLOCK AND TIMING CHARACTERISTICS (Cont’d)

Notes:

1. Resonator characteristics given by the ceramic resonator manufacturer.

2. tSU(OSC) is the typical oscillator start-up time measured between VDD=2.8V and the fetch of the first instruction (with a

quick VDD ramp-up from 0 to 5V (<50µs).

3. Resonators all have different characteristics. Contact the manufacturer to obtain the appropriate values of external

components and to verify oscillator performance.

4. 3rd overtone resonators require specific validation by the resonator manufacturer.

Oscil. Typical Ceramic Resonators (information for guidance only) CL1

[pF]

CL2

[pF]

tSU(osc)

[ms] 2)

Reference3) Freq. Characteristic 1)

Ceramic

MURATA

CSA2.00MG 2MHz ∆fOSC=[±0.5%tolerance,±0.3%∆Ta,±0.3%aging,±x.x%correl]22 22 4

MP CSA4.00MG 4MHz ∆fOSC=[±0.5%tolerance,±0.3%∆Ta,±0.3%aging,±x.x%correl]22 22 2

MS CSA8.00MTZ 8MHz ∆fOSC=[±0.5%tolerance,±0.5%∆Ta,±0.3%aging,±x.x%correl]33 33 1

HS CSA16.00MXZ0404) 16MHz ∆fOSC=[±0.5%tolerance,±0.3%∆Ta,±0.3%aging,±x.x%correl]33 33 0.7

OSCIHCINT) A + + \\ £1

ST72324Jx ST72324Kx

127/164

CLOCK CHARACTERISTICS (Cont’d)

12.6.4 RC Oscillators

Figure 67. Typical fOSC(RCINT) vs TANote: To reduce disturbance to the RC oscillator,

it is recommended to place decoupling capacitors

between VDD and VSS as shown in Figure 86

Symbol Parameter Conditions Min Typ Max Unit

fOSC (RCINT)

Internal RC oscillator frequency

See Figure 67 TA=25°C, VDD=5V 23.55.6MHz

3.2

3.4

3.6

3.8

-45 0 25 70 130

TA(°C)

fOSC(RCINT) (MHz)

Vdd = 5V

Vdd = 5.5V

H+

ST72324Jx ST72324Kx

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CLOCK CHARACTERISTICS (Cont’d)

12.6.5 PLL Characteristics

Note:

1. Data characterized but not tested.

The user must take the PLL jitter into account in the application (for example in serial communication or

sampling of high frequency signals). The PLL jitter is a periodic effect, which is integrated over several

CPU cycles. Therefore the longer the period of the application signal, the less it will be impacted by the

PLL jitter.

Figure 68 shows the PLL jitter integrated on application signals in the range 125kHz to 2MHz. At frequen-

cies of less than 125KHz, the jitter is negligible.

Figure 68. Integrated PLL Jitter vs signal frequency1

Note 1: Measurement conditions: fCPU = 8MHz.

Symbol Parameter Conditions Min Typ Max Unit

fOSC PLL input frequency range 2 4 MHz

∆ fCPU/ fCPU Instantaneous PLL jitter 1)

Flash ST72F324,

fOSC = 4 MHz. 1.0 2.5

Flash ST72F324,

fOSC = 2 MHz. 2.5 4.0

0.2

0.4

0.6

0.8

1.2

4 MHz 2 MHz 1 MHz 500 kHz 250 kHz 125 kHz

Application Frequency

+/-Jitter (%)

FLASH typ

ROM max

ROM typ

£1

ST72324Jx ST72324Kx

129/164

12.7 MEMORY CHARACTERISTICS

12.7.1 RAM and Hardware Registers

12.7.2 FLASH Memory

Notes:

1. Minimum VDD supply voltage without losing data stored in RAM (in HALT mode or under RESET) or in hardware reg-

isters (only in HALT mode). Not tested in production.

2. Data based on characterization results, not tested in production.

3. VPP must be applied only during the programming or erasing operation and not permanently for reliability reasons.

4. Data based on simulation results, not tested in production.

Symbol Parameter Conditions Min Typ Max Unit

VRM Data retention mode 1) HALT mode (or RESET) 1.6 V

DUAL VOLTAGE HDFLASH MEMORY

Symbol Parameter Conditions Min 2) Typ Max 2) Unit

fCPU Operating frequency Read mode 0 8 MHz

Write / Erase mode 1 8

VPP Programming voltage 3) 4.5V ≤ VDD ≤ 5.5V 11.4 12.6 V

IDD Supply current4) Write / Erase 0 mA

IPP VPP current4) Read (VPP=12V) 200 µA

Write / Erase 30 mA

tVPP Internal VPP stabilization time 10 µs

tRET Data retention TA=55°C 20 years

NRW Write erase cycles TA=25°C 100 cycles

TPROG

TERASE

Programming or erasing tempera-

ture range -40 25 85 °C

ST72324Jx ST72324Kx

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12.8 EMC CHARACTERISTICS

Susceptibility tests are performed on a sample ba-

sis during product characterization.

12.8.1 Functional EMS (Electro Magnetic

Susceptibility)

Based on a simple running application on the

product (toggling 2 LEDs through I/O ports), the

product is stressed by two electro magnetic events

until a failure occurs (indicated by the LEDs).

■ESD: Electro-Static Discharge (positive and

negative) is applied on all pins of the device until

a functional disturbance occurs. This test

conforms with the IEC 1000-4-2 standard.

■FTB: A Burst of Fast Transient voltage (positive

and negative) is applied to VDD and VSS through

a 100pF capacitor, until a functional disturbance

occurs. This test conforms with the IEC 1000-4-

4 standard.

A device reset allows normal operations to be re-

sumed. The test results are given in the table be-

low based on the EMS levels and classes defined

in application note AN1709.

12.8.1.1 Designing hardened software to avoid

noise problems

EMC characterization and optimization are per-

formed at component level with a typical applica-

tion environment and simplified MCU software. It

should be noted that good EMC performance is

highly dependent on the user application and the

software in particular.

Therefore it is recommended that the user applies

EMC software optimization and prequalification

tests in relation with the EMC level requested for

his application.

Software recommendations:

The software flowchart must include the manage-

ment of runaway conditions such as:

– Corrupted program counter

– Unexpected reset

– Critical Data corruption (control registers...)

Prequalification trials:

Most of the common failures (unexpected reset

and program counter corruption) can be repro-

duced by manually forcing a low state on the RE-

SET pin or the Oscillator pins for 1 second.

To complete these trials, ESD stress can be ap-

plied directly on the device, over the range of

specification values. When unexpected behaviour

is detected, the software can be hardened to pre-

vent unrecoverable errors occurring (see applica-

tion note AN1015)

Symbol Parameter Conditions Level/

Class

VFESD Voltage limits to be applied on any I/O pin to induce a

functional disturbance

8 or 16K Flash device, VDD=5V,

TA=+25°C, fOSC=8MHz conforms to IEC

1000-4-2

VFFTB

Fast transient voltage burst limits to be applied

through 100pF on VDD and VDD pins to induce a func-

tional disturbance

VDD=5V, TA=+25°C, fOSC=8MHz

conforms to IEC 1000-4-4 4A

£1

ST72324Jx ST72324Kx

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EMC CHARACTERISTICS (Cont’d)

12.8.2 Electro Magnetic Interference (EMI)

Based on a simple application running on the

product (toggling 2 LEDs through the I/O ports),

the product is monitored in terms of emission. This

emission test is in line with the norm SAE J 1752/

3 which specifies the board and the loading of

each pin.

Notes:

1. Data based on characterization results, not tested in production.

2. Refer to Application Note AN1709 for data on other package types.

Symbol Parameter Conditions Device/ Package Monitored

Frequency Band

Max vs. [fOSC/fCPU]Unit

8/4MHz 16/8MHz

SEMI Peak level

VDD=5V,

TA=+25°C

conforming to

SAE J 1752/3

8/16K Flash/

TQFP44

0.1MHz to 30MHz 12 18

dBµV30MHz to 130MHz 19 25

130MHz to 1GHz 15 22

SAE EMI Level 3 3.5 -

32K Flash/TQFP44

0.1MHz to 30MHz 20 21

dBµV30MHz to 130MHz 26 31

130MHz to 1GHz 22 28

SAE EMI Level 3.5 4.0 -

Flash/TQFP32

0.1MHz to 30MHz 25 27

dBµV30MHz to 130MHz 30 36

130MHz to 1GHz 18 23

SAE EMI Level 3.0 3.5 -

ST72324Jx ST72324Kx

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EMC CHARACTERISTICS (Cont’d)

12.8.3 Absolute Maximum Ratings (Electrical

Sensitivity)

Based on three different tests (ESD, LU and DLU)

using specific measurement methods, the product

is stressed in order to determine its performance in

terms of electrical sensitivity. For more details, re-

fer to the application note AN1181.

12.8.3.1 Electro-Static Discharge (ESD)

Electro-Static Discharges (a positive then a nega-

tive pulse separated by 1 second) are applied to

the pins of each sample according to each pin

combination. The sample size depends on the

number of supply pins in the device (3 parts*(n+1)

supply pin). Two models can be simulated: Human

Body Model and Machine Model. This test con-

forms to the JESD22-A114A/A115A standard.

Absolute Maximum Ratings

Notes:

1. Data based on characterization results, not tested in production.

12.8.3.2 Static and Dynamic Latch-Up

■LU: 3 complementary static tests are required

on 10 parts to assess the latch-up performance.

A supply overvoltage (applied to each power

supply pin) and a current injection (applied to

each input, output and configurable I/O pin) are

performed on each sample. This test conforms

to the EIA/JESD 78 IC latch-up standard. For

more details, refer to the application note

AN1181.

■DLU: Electro-Static Discharges (one positive

then one negative test) are applied to each pin

of 3 samples when the micro is running to

assess the latch-up performance in dynamic

mode. Power supplies are set to the typical

values, the oscillator is connected as near as

possible to the pins of the micro and the

component is put in reset mode. This test

conforms to the IEC1000-4-2 and SAEJ1752/3

standards. For more details, refer to the

application note AN1181.

Electrical Sensitivities

Notes:

1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC spec-

ifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the

JEDEC criteria (international standard).

Symbol Ratings Conditions Maximum value 1) Unit

VESD(HBM) Electro-static discharge voltage

(Human Body Model) TA=+25°C 2000

VVESD(MM) Electro-static discharge voltage

(Machine Model) TA=+25°C 200

VESD(CD) Electro-static discharge voltage

(Charged Device Model) TA=+25°C 250

Symbol Parameter Conditions Class 1)

LU Static latch-up class

TA=+25°C

TA=+85°C

TA=+125°C

DLU Dynamic latch-up class VDD=5.5V, fOSC=4MHz, TA=+25°C A

£1

ST72324Jx ST72324Kx

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12.9 I/O PORT PIN CHARACTERISTICS

12.9.1 General Characteristics

Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified.

Notes:

1. Data based on characterization results, not tested in production.

2. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.

3. When the current limitation is not possible, the VIN maximum must be respected, otherwise refer to IINJ(PIN) specifica-

tion. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. Refer to Section 12.2.2

on page 117 for more details.

4. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for

example and leaving the I/O unconnected on the board or an external pull-up or pull-down resistor (see Figure 69). Data

based on design simulation and/or technology characteristics, not tested in production.

5. The RPU pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics de-

scribed in Figure 70).

6. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external

interrupt source.

Figure 69. Unused I/O Pins configured as input Figure 70. Typical IPU vs. VDD with VIN=VSS

Symbol Parameter Conditions Min Typ Max Unit

VIL Input low level voltage (standard voltage

devices)1) 0.3xVDD V

VIH Input high level voltage 1) 0.7xVDD V

Vhys Schmitt trigger voltage hysteresis 2) 0.7

IINJ(PIN)3) Injected Current on Flash device pin PB0

VDD=5V

0+4

Injected Current on other I/O pins ±4

ΣIINJ(PIN)3) Total injected current (sum of all I/O and

control pins) ±25

Ilkg Input leakage current VSS ≤ VIN ≤ VDD ±1

µA

ISStatic current consumption induced by each

floating input pin Floating input mode4) 200

RPU Weak pull-up equivalent resistor 5) VIN=VSS VDD=5V 50 120 250 kΩ

CIO I/O pin capacitance 5 pF

tf(IO)out Output high to low level fall time 1) CL=50pF

Between 10% and

90%

tr(IO)out Output low to high level rise time 1) 25

tw(IT)in External interrupt pulse time 6) 1t

CPU

10kΩ

UNUSED I/O PORT

ST7XXX

10kΩUNUSED I/O PORT

ST7XXX

VDD

Note: I/O can be left unconnected if it is configured as output

greater EMC robustness and lower cost.

(0 or 1) by the software. This has the advantage of

22.533.544.555.56

Vdd(V)

Ipu(uA)

Ta=140°C

Ta=95°C

Ta=25°C

Ta=-45°C

ST72324Jx ST72324Kx

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I/O PORT PIN CHARACTERISTICS (Cont’d)

12.9.2 Output Driving Current

Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.

Figure 71. Typical VOL at VDD=5V (std. ports)

Figure 72. Typ. VOL at VDD=5V (high-sink ports)

Figure 73. Typical VOH at VDD=5V

Notes:

1. The IIO current sunk must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of IIO

(I/O ports and control pins) must not exceed IVSS.

2. The IIO current sourced must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of

IIO (I/O ports and control pins) must not exceed IVDD. True open drain I/O pins do not have VOH.

Symbol Parameter Conditions Min Max Unit

VOL 1)

Output low level voltage for a standard I/O pin

when 8 pins are sunk at same time

(see Figure 71)

VDD=5V

IIO=+5mA 1.2

IIO=+2mA 0.5

Output low level voltage for a high sink I/O pin

when 4 pins are sunk at same time

(see Figure 72 and Figure 74)

IIO=+20mA,TA≤85°C

TA>85°C

1.3

1.5

IIO=+8mA 0.6

VOH 2) Output high level voltage for an I/O pin

when 4 pins are sourced at same time

(see Figure 73 and Figure 76)

IIO=-5mA, TA≤85°C

TA>85°C VDD-1.4

VDD-1.6

IIO=-2mA VDD-0.7

0.2

0.4

0.6

0.8

1.2

0 0.005 0.01 0.015

Iio (A )

Vol (V) at Vdd=5V

Ta=14 0°C "

Ta=95 °C

Ta=25 °C

Ta=-45°C

51015

IIO (mA)

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

0 0.010.020.03

Iio

(

)

Vol(V) at Vdd=5V

Ta= 140°C

Ta= 95°C

Ta= 25 °C

Ta=-45°C

10 20 30

IIO (mA)

2.5

3.5

4.5

5.5

-0.01 -0.008 -0.006 -0.004 -0.002 0

Ii o

(

)

Vdd-Voh (V) at Vdd=5V

Vdd=5V 140°C min

Vdd=5v 95°C m in

Vdd=5v 25°C m in

Vdd=5v -45°C m in

-10 -8 -6 -4 -2 0

IIO (mA)

«swine/v.9 uEWEmeanS .53. m5? 3%??? gu

ST72324Jx ST72324Kx

135/164

I/O PORT PIN CHARACTERISTICS (Cont’d)

Figure 74. Typical VOL vs. VDD (std. ports)

Figure 75. Typical VOL vs. VDD (high-sink ports)

Figure 76. Typical VOH vs. VDD

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

22.533.544.555.56

Vdd(V)

Vol(V) at Iio=5m

Ta=-45°C

Ta=25°C

Ta=95°C

Ta=140°C

0.05

0.1

0.15

0.2

0.25

0.3

0.35

0.4

0.45

22.533.544.555.56

Vdd(V)

Vol(V) at Iio=2m

Ta=-45°C

Ta=25°C

Ta=95°C

Ta=140°

0.1

0.2

0.3

0.4

0.5

0.6

22.533.544.555.56

Vdd(V)

Vol(V) at Iio=8m

Ta= 140°C

Ta=9 5° C

Ta=25°C

Ta=-45°C

0.2

0.4

0.6

0.8

1.2

1.4

1.6

2 2.5 3 3.5 4 4.5 5 5.5 6

Vdd(V)

Vol(V) at Iio=20m

Ta= 140°C

Ta=95°C

Ta=25°C

Ta=-45°C

22.533.544.555.56

Vdd

(

)

Vdd-Voh(V) at Iio=-5m

Ta=-45°C

Ta=25°C

Ta=95°C

Ta=140°C

2.5

3.5

4.5

5.5

22.533.544.555.56

Vdd(V)

Vdd-Voh(V) at Iio=-2m

Ta=-45°C

Ta=25°C

Ta=95°C

Ta=140°C

ST72324Jx ST72324Kx

136/164

12.10 CONTROL PIN CHARACTERISTICS

12.10.1 Asynchronous RESET Pin

Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.

Notes:

1. Data based on characterization results, not tested in production.

2. Hysteresis voltage between Schmitt trigger switching levels.

3. The IIO current sunk must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of IIO

(I/O ports and control pins) must not exceed IVSS.

4. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on

the RESET pin with a duration below th(RSTL)in can be ignored.

5. The reset network (the resistor and two capacitors) protects the device against parasitic resets, especially in noisy en-

vironments.

6. Data guaranteed by design, not tested in production.

Symbol Parameter Conditions Min Typ Max Unit

Vhys Schmitt trigger voltage hysteresis 2) 2.5 V

VIL Input low level voltage 1) 0.16xVDD V

VIH Input high level voltage 1) 0.85xVDD

VOL Output low level voltage 3) VDD=5V IIO=+2mA 0.2 0.5 V

IIO Driving current on RESET pin 2 mA

RON Weak pull-up equivalent resistor VDD=5V 20 30 120 kΩ

tw(RSTL)out Generated reset pulse duration Internal reset sources 20 30 426) µs

th(RSTL)in External reset pulse hold time 4) 2.5 µs

tg(RSTL)in Filtered glitch duration 5) 200 ns

ST72324Jx ST72324Kx

137/164

CONTROL PIN CHARACTERISTICS (Cont’d)

Figure 77. RESET pin protection when LVD is enabled.1)2)3)4)5)6)7)

Figure 78. RESET pin protection when LVD is disabled.1)2)3)4)

1. The reset network protects the device against parasitic resets.

2. The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the device

can be damaged when the ST7 generates an internal reset (LVD or watchdog).

3. Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go below

the VIL max. level specified in Section 12.10.1. Otherwise the reset will not be taken into account internally.

4. Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must ensure

that the current sunk on the RESET pin (by an external pull-up for example) is less than the absolute maximum value

specified for IINJ(RESET) in Section 12.2.2 on page 117.

5. When the LVD is enabled, it is mandatory not to connect a pull-up resistor. A 10nF pull-down capacitor is recommended

to filter noise on the reset line.

6. In case a capacitive power supply is used, it is recommended to connect a1MΩ pull-down resistor to the RESET pin

to discharge any residual voltage induced by this capacitive power supply (this will add 5µA to the power consumption of

the MCU).

7. Tips when using the LVD:

– 1. Check that all recommendations related to ICCCLK and reset circuit have been applied (see notes above)

– 2. Check that the power supply is properly decoupled (100nF + 10µF close to the MCU). Refer to AN1709. If this

cannot be done, it is recommended to put a 100nF + 1MΩ pull-down on the RESET pin.

– 3. The capacitors connected on the RESET pin and also the power supply are key to avoiding any start-up margin-

ality. In most cases, steps 1 and 2 above are sufficient for a robust solution. Otherwise: replace 10nF pull-down on

the RESET pin with a 5µF to 20µF capacitor.”

0.01µF

ST72XXX

PULSE

GENERATOR

Filter

RON

VDD

WATCHDOG

LVD RESET

INTERNAL

RESET

EXTERNAL

Recommended

1MΩ

Optional

(note 6)

0.01µF

VDD

0.01µF

EXTERNAL

RESET

CIRCUIT

USER

VDD

4.7kΩ

Required

Recommended ST72XXX

PULSE

GENERATOR

Filter

RON

VDD

WATCHDOG

INTERNAL

RESET

ST72324Jx ST72324Kx

138/164

CONTROL PIN CHARACTERISTICS (Cont’d)

12.10.2 ICCSEL/VPP Pin

Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.

Figure 79. Two typical Applications with ICCSEL/VPP Pin 2)

Notes:

1. Data based on design simulation and/or technology characteristics, not tested in production.

2. When ICC mode is not required by the application ICCSEL/VPP pin must be tied to VSS.

Symbol Parameter Conditions Min Max Unit

VIL Input low level voltage 1) VSS 0.2 V

VIH Input high level voltage 1) VDD-0.1 12.6

ILInput leakage current VIN=VSS ±1 µA

ICCSEL/VPP

ST72XXX 10kΩ

PROGRAMMING

TOOL

VPP

ST72XXX

£1

ST72324Jx ST72324Kx

139/164

12.11 TIMER PERIPHERAL CHARACTERISTICS

Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified.

Refer to I/O port characteristics for more details on the input/output alternate function characteristics (out-

put compare, input capture, external clock, PWM output...).

Data based on design simulation and/or characterisation results, not tested in production.

12.11.1 16-Bit Timer

Symbol Parameter Conditions Min Typ Max Unit

tw(ICAP)in Input capture pulse time 1 tCPU

tres(PWM) PWM resolution time 2t

CPU

fCPU=8MHz 250 ns

fEXT Timer external clock frequency 0 fCPU/4 MHz

fPWM PWM repetition rate 0 fCPU/4 MHz

ResPWM PWM resolution 16 bit

on. R

ST72324Jx ST72324Kx

140/164

12.12 COMMUNICATION INTERFACE CHARACTERISTICS

12.12.1 SPI - Serial Peripheral Interface

Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified. Data based on

design simulation and/or characterisation results, not tested in production.

When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave

mode) has its alternate function capability released. In this case, the pin status depends on the I/O port

configuration. Refer to I/O port characteristics for more details on the input/output alternate function char-

acteristics (SS, SCK, MOSI, MISO).

Figure 80. SPI Slave Timing Diagram with CPHA=0 1)

Notes:

1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.

Symbol Parameter Conditions Min Max Unit

fSCK

1/tc(SCK) SPI clock frequency

Master

fCPU=8MHz

fCPU/128

0.0625

fCPU/4

2MHz

Slave

fCPU=8MHz 0fCPU/2

tr(SCK)

tf(SCK) SPI clock rise and fall time see I/O port pin description

tsu(SS)SS setup time Slave 120

th(SS)SS hold time Slave 120

tw(SCKH)

tw(SCKL) SCK high and low time Master

Slave

100

tsu(MI)

tsu(SI) Data input setup time Master

Slave

100

th(MI)

th(SI) Data input hold time Master

Slave

100

ta(SO) Data output access time Slave 0 120

tdis(SO) Data output disable time Slave 240

tv(SO) Data output valid time Slave (after enable edge) 90

th(SO) Data output hold time 0

tv(MO) Data output valid time Master (before capture edge) 0.25 tCPU

th(MO) Data output hold time 0.25

SS INPUT

SCK INPUT

CPHA=0

MOSI INPUT

MISO OUTPUT

CPHA=0

tc(SCK)

tw(SCKH)

tw(SCKL) tr(SCK)

tf(SCK)

tv(SO)

ta(SO)

tsu(SI) th(SI)

MSB OUT

MSB IN

BIT6 OUT

LSB IN

LSB OUT

seenote2

CPOL=0

CPOL=1

tsu(SS)th(SS)

tdis(SO)

th(SO)

see

note 2

BIT1 IN

£1

ST72324Jx ST72324Kx

141/164

COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)

Figure 81. SPI Slave Timing Diagram with CPHA=11)

Figure 82. SPI Master Timing Diagram 1)

Notes:

1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.

2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has

its alternate function capability released. In this case, the pin status depends of the I/O port configuration.

SS INPUT

SCK INPUT

CPHA=1

MOSI INPUT

MISO OUTPUT

CPHA=1

tw(SCKH)

tw(SCKL) tr(SCK)

tf(SCK)

ta(SO)

tsu(SI) th(SI)

MSB OUT BIT6 OUT LSB OUT

see

CPOL=0

CPOL=1

tsu(SS)th(SS)

tdis(SO)

th(SO)

see

note 2note 2

tc(SCK)

tv(SO)

MSB IN LSB IN

BIT1 IN

SS INPUT

SCK INPUT

CPHA=0

MOSI OUTPUT

MISO INPUT

CPHA=0

CPHA=1

tc(SCK)

tw(SCKH)

tw(SCKL)

th(MI)

tsu(MI)

tv(MO) th(MO)

MSB IN

MSB OUT

BIT6 IN

BIT6 OUT LSB OUT

LSB IN

seenote2 seenote2

CPOL=0

CPOL=1

CPOL=0

CPOL=1

tr(SCK)

tf(SCK)

ST72324Jx ST72324Kx

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12.13 10-BIT ADC CHARACTERISTICS

Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.

Notes:

1. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10kΩ). Data

based on characterization results, not tested in production.

2.For Flash devices: injecting negative current on any of the analog input pins significantly reduces the accuracy of any

conversion being performed on any analog input. Analog pins of ST72F324 devices can be protected against negative

injection by adding a Schottky diode (pin to ground). Injecting negative current on digital input pins degrades ADC accu-

racy especially if performed on a pin close to the analog input pins. Any positive injection current within the limits specified

for IINJ(PIN) and ΣIINJ(PIN) in Section 12.9 does not affect the ADC accuracy.

Symbol Parameter Conditions Min Typ Max Unit

fADC ADC clock frequency 0.4 2 MHz

VAREF Analog reference voltage 0.7*VDD ≤VAREF ≤VDD 3.8 VDD V

VAIN Conversion voltage range 1) VSSA VAREF

Ilkg Positive input leakage current for analog

input2)

-40°C≤TA≤+85°C ±250 nA

+85°C≤TA≤+125°C ±1 µA

RAIN External input impedance see

Figure 83

and

Figure

842)3)4)

kΩ

CAIN External capacitor on analog input pF

fAIN Variation freq. of analog input signal Hz

CADC Internal sample and hold capacitor 12 pF

tADC Conversion time (Sample+Hold)

fCPU=8MHz, SPEED=0 fADC=2MHz 7.5 µs

tADC - No of sample capacitor loading cycles

- No. of Hold conversion cycles

11 1/fADC

AIN fADC AIN AIN AIN values. £1

ST72324Jx ST72324Kx

143/164

ADC CHARACTERISTICS (Cont’d)

Figure 83. RAIN max. vs fADC with CAIN=0pF1) Figure 84. Recommended CAIN & RAIN values.2)

Figure 85. Typical A/D Converter Application

Notes:

1. CPARASITIC represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad ca-

pacitance (3pF). A high CPARASITIC value will downgrade conversion accuracy. To remedy this, fADC should be reduced.

2. This graph shows that depending on the input signal variation (fAIN), CAIN can be increased for stabilization time and

decreased to allow the use of a larger serial resistor (RAIN).

0103070

CPARASITIC (pF)

Max. RAIN (Kohm)

2 MHz

1 MHz

0.1

100

1000

0.01 0.1 1 10

fAIN(KHz)

Max. RAIN (Kohm)

Cain 10 nF

Cain 22 nF

Cain 47 nF

AINx

ST72XXX

VDD

±1µA

0.6V

0.6V CADC

12pF

VAIN

RAIN 10-Bit A/D

Conversion

2kΩ(max)

CAIN

ST72324Jx ST72324Kx

144/164

ADC CHARACTERISTICS (Cont’d)

12.13.1 Analog Power Supply and Reference

Pins

Depending on the MCU pin count, the package

may feature separate VAREF and VSSA analog

power supply pins. These pins supply power to the

A/D converter cell and function as the high and low

reference voltages for the conversion. In some

packages, VAREF and VSSA pins are not available

(refer to Section 2 on page 8). In this case the an-

alog supply and reference pads are internally

bonded to the VDD and VSS pins.

Separation of the digital and analog power pins al-

low board designers to improve A/D performance.

Conversion accuracy can be impacted by voltage

drops and noise in the event of heavily loaded or

badly decoupled power supply lines (see Section

12.13.2 General PCB Design Guidelines).

12.13.2 General PCB Design Guidelines

To obtain best results, some general design and

layout rules should be followed when designing

the application PCB to shield the noise-sensitive,

analog physical interface from noise-generating

CMOS logic signals.

– Use separate digital and analog planes. The an-

alog ground plane should be connected to the

digital ground plane via a single point on the

PCB.

– Filter power to the analog power planes. It is rec-

ommended to connect capacitors, with good high

frequency characteristics, between the power

and ground lines, placing 0.1µF and optionally, if

needed 10pF capacitors as close as possible to

the ST7 power supply pins and a 1 to 10µF ca-

pacitor close to the power source (see Figure

86).

– The analog and digital power supplies should be

connected in a star network. Do not use a resis-

tor, as VAREF is used as a reference voltage by

the A/D converter and any resistance would

cause a voltage drop and a loss of accuracy.

– Properly place components and route the signal

traces on the PCB to shield the analog inputs.

Analog signals paths should run over the analog

ground plane and be as short as possible. Isolate

analog signals from digital signals that may

switch while the analog inputs are being sampled

by the A/D converter. Do not toggle digital out-

puts on the same I/O port as the A/D input being

converted.

Figure 86. Power Supply Filtering

VSS

VDD

ST72XXX

VAREF

VSSA

POWER

SUPPLY

SOURCE

ST7

DIGITAL NOISE

FILTERING

EXTERNAL

NOISE

FILTERING

1 to 10µF0.1µF

0.1µF

£1

ST72324Jx ST72324Kx

145/164

10-BIT ADC CHARACTERISTICS (Cont’d)

12.13.3 ADC Accuracy

Conditions: VDD=5V 1)

Notes:

1. ADC Accuracy vs. Negative Injection Current: Injecting negative current may reduce the accuracy of the conversion

being performed on another analog input.

Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in Section 12.9 does not affect the ADC

accuracy.

2. Data based on characterization results, monitored in production to guarantee 99.73% within ± max value from -40°C

to 125°C (± 3σ distribution limits).

Figure 87. ADC Accuracy Characteristics

Symbol Parameter Conditions Flash Devices Unit

Typ Max2)

|ET| Total unadjusted error 1) 46

LSB

|EO| Offset error 1) 35

|EG| Gain Error 1) 0.5 4.5

|ED|Differential linearity error

1) CPU in run mode @ fADC 2 MHz. 1.5 4.5

|EL| Integral linearity error 1) CPU in run mode @ fADC 2 MHz. 1.5 4.5

1LSB

IDEAL

1LSBIDEAL

VAREF VSSA

–

1024

--------------------------------------------=

Vin (LSBIDEAL)

(1) Example of an actual transfer curve

(2) The ideal transfer curve

(3) End point correlation line

ET=Total Unadjusted Error: maximum deviation

between the actual and the ideal transfer curves.

EO=Offset Error: deviation between the first actual

transition and the first ideal one.

EG=Gain Error: deviation between the last ideal

transition and the last actual one.

ED=Differential Linearity Error: maximum deviation

between actual steps and the ideal one.

EL=Integral Linearity Error: maximum deviation

between any actual transition and the end point

correlation line.

Digital Result ADCDR

1023

1022

1021

1234567 1021 1022 1023 1024

(1)

(2)

(3)

VAREF

VSSA

HHHHHHHHHHH C HHHHHHHHHHH HHHHHHHHHHH HHHHHHH H HHHHHHHH O HHHHHHH Hgggﬁ

ST72324Jx ST72324Kx

146/164

13 PACKAGE CHARACTERISTICS

13.1 PACKAGE MECHANICAL DATA

Figure 88. 44-Pin Thin Quad Flat Package

Figure 89. 32-Pin Thin Quad Flat Package

Dim. mm inches

Min Typ Max Min Typ Max

A 1.60 0.063

A1 0.05 0.15 0.002 0.006

A2 1.35 1.40 1.45 0.053 0.055 0.057

b0.30 0.37 0.45 0.012 0.015 0.018

C0.09 0.20 0.004 0.000 0.008

D 12.00 0.472

D1 10.00 0.394

E 12.00 0.472

E1 10.00 0.394

e0.80 0.031

θ0° 3.5° 7° 0° 3.5° 7°

L0.45 0.60 0.75 0.018 0.024 0.030

L1 1.00 0.039

Number of Pins

N44

Dim. mm inches

Min Typ Max Min Typ Max

A 1.60 0.063

A1 0.05 0.15 0.002 0.006

A2 1.35 1.40 1.45 0.053 0.055 0.057

b0.30 0.37 0.45 0.012 0.015 0.018

C0.09 0.20 0.004 0.008

D 9.00 0.354

D1 7.00 0.276

E 9.00 0.354

E1 7.00 0.276

e0.80 0.031

θ0° 3.5° 7° 0° 3.5° 7°

L0.45 0.60 0.75 0.018 0.024 0.030

L1 1.00 0.039

Number of Pins

N32

nnnnnnnnnnnnﬂnnnnnnnﬂ UUUUUUUUUUUUUUUUUUUUU

ST72324Jx ST72324Kx

147/164

PACKAGE MECHANICAL DATA (Cont’d)

Figure 90. 42-Pin Plastic Dual In-Line Package, Shrink 600-mil Width

Figure 91. 32-Pin Plastic Dual In-Line Package, Shrink 400-mil Width

Dim. mm inches

Min Typ Max Min Typ Max

A5.08 0.200

A1 0.51 0.020

A2 3.05 3.81 4.57 0.120 0.150 0.180

b0.38 0.46 0.56 0.015 0.018 0.022

b2 0.89 1.02 1.14 0.035 0.040 0.045

c0.23 0.25 0.38 0.009 0.010 0.015

D36.58 36.83 37.08 1.440 1.450 1.460

E15.24 16.00 0.600 0.630

E1 12.70 13.72 14.48 0.500 0.540 0.570

e1.78 0.070

eA 15.24 0.600

eB 18.54 0.730

eC 1.52 0.000 0.060

L2.54 3.30 3.56 0.100 0.130 0.140

Number of Pins

N42

0.015

GAGE PLANE

A1 c

Dim. mm inches

Min Typ Max Min Typ Max

A3.56 3.76 5.08 0.140 0.148 0.200

A1 0.51 0.020

A2 3.05 3.56 4.57 0.120 0.140 0.180

b0.36 0.46 0.58 0.014 0.018 0.023

b1 0.76 1.02 1.40 0.030 0.040 0.055

C0.20 0.25 0.36 0.008 0.010 0.014

D27.43 28.45 1.080 1.100 1.120

E9.91 10.41 11.05 0.390 0.410 0.435

E1 7.62 8.89 9.40 0.300 0.350 0.370

e1.78 0.070

eA 10.16 0.400

eB 12.70 0.500

eC 1.40 0.055

L2.54 3.05 3.81 0.100 0.120 0.150

Number of Pins

N32

b2 be

LE1

EeC

ST72324Jx ST72324Kx

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13.2 THERMAL CHARACTERISTICS

Notes:

1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)

and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

Symbol Ratings Value Unit

RthJA

Package thermal resistance (junction to ambient)

TQFP44 10x10

TQFP32 7x7

SDIP42 600mil

SDIP32 200mil

°C/W

PDPower dissipation 1) 500 mW

TJmax Maximum junction temperature 2) 150 °C

£1

ST72324Jx ST72324Kx

149/164

13.3 SOLDERING INFORMATION

In order to meet environmental requirements, ST

offers these devices in ECOPACK® packages.

These packages have a lead-free second level in-

terconnect. The category of second level intercon-

nect is marked on the package and on the inner

box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to solder-

ing conditions are also marked on the inner box la-

bel.

ECOPACK is an ST trademark. ECOPACK®

specifications are available at www.st.com.

ST72324Jx ST72324Kx

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14 ST72324 DEVICE CONFIGURATION AND ORDERING INFORMATION

14.1 FLASH OPTION BYTES

The option bytes allows the hardware configura-

tion of the microcontroller to be selected. They

have no address in the memory map and can be

accessed only in programming mode (for example

using a standard ST7 programming tool). The de-

fault content of the FLASH is fixed to FFh. To pro-

gram directly the FLASH devices using ICP,

FLASH devices are shipped to customers with the

internal RC clock source.

OPTION BYTE 0

OPT7= WDG HALT Watchdog reset on HALT

This option bit determines if a RESET is generated

when entering HALT mode while the Watchdog is

active.

0: No Reset generation when entering Halt mode

1: Reset generation when entering Halt mode

OPT6= WDG SW Hardware or software watchdog

This option bit selects the watchdog type.

0: Hardware (watchdog always enabled)

1: Software (watchdog to be enabled by software)

OPT5 = Reserved, must be kept at default value.

OPT4:3= VD[1:0] Voltage detection

These option bits enable the voltage detection

block (LVD, and AVD) with a selected threshold for

the LVD and AVD.

Caution: If the medium or low thresholds are se-

lected, the detection may occur outside the speci-

fied operating voltage range. Below 3.8V, device

operation is not guaranteed. For details on the

AVD and LVD threshold levels refer to Section

12.4.1 on page 119

OPT2:1 = Reserved, must be kept at default value.

OPT0= FMP_R Flash memory read-out protection

Read-out protection, when selected, provides a

protection against Program Memory content ex-

traction and against write access to Flash memo-

ry.

Erasing the option bytes when the FMP_R option

is selected causes the whole user memory to be

erased first, and the device can be reprogrammed.

Refer to Section 7.3.1 on page 37 and the ST7

Flash Programming Reference Manual for more

details.

0: Read-out protection enabled

1: Read-out protection disabled

STATIC OPTION BYTE 0

STATIC OPTION BYTE 1

WDG

Reserved

FMP_R

PKG1

RSTC

OSCTYPE OSCRANGE

PLLOFF

HALT

10 10210

Default111001111 1 101 1 1 1

Selected Low Voltage Detector VD1 VD0

LVD and AVD Off 1 1

Lowest Voltage Threshold (VDD~3V) 1 0

Medium Voltage Threshold (VDD~3.5V) 0 1

Highest Voltage Threshold (VDD~4V) 0 0

£1

ST72324Jx ST72324Kx

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ST72324 DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)

OPTION BYTE 1

OPT7= PKG1 Pin package selection bit

This option bit selects the package.

Note: On the chip, each I/O port has 8 pads. Pads

that are not bonded to external pins are in input

pull-up configuration after reset. The configuration

of these pads must be kept at reset state to avoid

added current consumption.

OPT6 = RSTC RESET clock cycle selection

This option bit selects the number of CPU cycles

applied during the RESET phase and when exiting

HALT mode. For resonator oscillators, it is advised

to select 4096 due to the long crystal stabilization

time.

0: Reset phase with 4096 CPU cycles

1: Reset phase with 256 CPU cycles

OPT5:4 = OSCTYPE[1:0] Oscillator Type

These option bits select the ST7 main clock

source type.

OPT3:1 = OSCRANGE[2:0] Oscillator range

When the resonator oscillator type is selected,

these option bits select the resonator oscillator

current source corresponding to the frequency

range of the used resonator. Otherwise, these bits

are used to select the normal operating frequency

range.

OPT0 = PLL OFF PLL activation

This option bit activates the PLL which allows mul-

tiplication by two of the main input clock frequency.

The PLL must not be used with the internal RC os-

cillator. The PLL is guaranteed only with an input

frequency between 2 and 4MHz.

0: PLL x2 enabled

1: PLL x2 disabled

CAUTION: the PLL can be enabled only if the

“OSC RANGE” (OPT3:1) bits are configured to

“MP - 2~4MHz”. Otherwise, the device functionali-

ty is not guaranteed.

Version Selected Package PKG1

J TQFP44 / SDIP42 1

K TQFP32 / SDIP32 0

Clock Source OSCTYPE

Resonator Oscillator 0 0

Reserved 0 1

Internal RC Oscillator 1 0

External Source 1 1

Typ. Freq. Range OSCRANGE

210

LP 1~2MHz 0 0 0

MP 2~4MHz 0 0 1

MS 4~8MHz 0 1 0

HS 8~16MHz 0 1 1

ST72324Jx ST72324Kx

152/164

DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)

14.2 FLASH DEVICE ORDERING INFORMATiON

With the objective of continuous improvement, ST

is developing new ST72F324B devices and is

transferring the production to higher capacity fabs.

Refer to the following tables for guidance on order-

ing.

Standard and Industrial Versions

■For new designs the ST72F324B devices from

to the separate ST72324B datasheet.

■For for running production orders select the

devices from Table 26

£1

ST72324Jx ST72324Kx

153/164

DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont’d)

Table 26. Standard and Industrial ST72F324 Flash Order Codes

Part Number Package Flash Memory (KBytes) Temp. Range

ST72F324K2B5

SDIP32

-10°C +85°C

ST72F324K4B5 16

ST72F324K6B5 32

ST72F324J6B5 SDIP42 32

ST72F324K6T5

TQFP32

32 -10°C +85°C

ST72F324K2T6 8

-40°C +85°CST72F324K4T6 16

ST72F324K6T6 32

ST72F324K2T3 8

-40°C +125°CST72F324K4T3 16

ST72F324K6T3 32

ST72F324J6T5

TQFP44

32 -10°C +85°C

ST72F324J2T6 8

-40°C +85°CST72F324J4T6 16

ST72F324J6T6 32

ST72F324J2T3 8

-40°C +125°CST72F324J4T3 16

ST72F324J6T3 32

ST72324Jx ST72324Kx

154/164

14.3 SILICON IDENTIFICATION

The various ST72F324, ST72F324B and

ST72324B devices are identifiable both by the last

letter of the Trace code marked on the device

package and by the last 3 digits of the Internal

Sales Type printed on the box label.

Table 27. Silicon Identification (Standard and Industrial Versions)

Device Status Fab Memory Trace Code

marked on device

Internal Sales Types

on box label

ST72F324xxxx

Current production Phoenix 8K to 32K

Flash

“xxxxxxxxx1” 72F324xxxx$x7

End of production

Dec. 2005 Rousset “xxxxxxxxxW” 72F324xxxx$x5

ST72F324Bxxxx

Current production.

Recommended for

new designs

Rousset 8K/16K Flash “xxxxxxxxxB” 72F324Bxxxx$x4

ST72324Bxxxx Current production Phoenix 32K ROM “xxxxxxxxxA” 72324Bxxxx$x1

8K/16K ROM “xxxxxxxxxB” 72324Bxxxx$x3

£1

ST72324Jx ST72324Kx

155/164

14.4 DEVELOPMENT TOOLS

STMicroelectronics offers a range of hardware

and software development tools for the ST7 micro-

controller family. Full details of tools available for

the ST7 from third party manufacturers can be ob-

tain from the STMicroelectronics Internet site:

➟ http//:mcu.st.com.

Tools from these manufacturers include C compli-

ers, emulators and gang programmers.

Emulators

Two types of emulators are available from ST for

the ST72324 family:

■ST7 DVP3 entry-level emulator offers a flexible

and modular debugging and programming

solution. SDIP42 & SDIP32 probes/adapters

are included, other packages need a specific

connection kit (refer to Table 28)

■ST7 EMU3 high-end emulator is delivered with

everything (probes, TEB, adapters etc.) needed

to start emulating the ST72324 family. To

configure it to emulate other ST7 subfamily

devices, the active probe for the ST7EMU3 can

be changed and the ST7EMU3 probe is

designed for easy interchange of TEBs (Target

Emulation Board). See Table 28.

In-circuit Debugging Kit

Two configurations are available from ST:

■STXF521-IND/USB: Low-cost In-Circuit

Debugging kit from Softec Microsystems.

Includes STX-InDART/USB board (USB port)

and a specific demo board for ST72521

(TQFP64)

■STxF-INDART

Flash Programming tools

■ST7-STICK ST7 In-circuit Communication Kit, a

complete software/hardware package for

programming ST7 Flash devices. It connects to

a host PC parallel port and to the target board or

socket board via ST7 ICC connector.

■ICC Socket Boards provide an easy to use and

flexible means of programming ST7 Flash

devices. They can be connected to any tool that

supports the ST7 ICC interface, such as ST7

EMU3, ST7-DVP3, inDART, ST7-STICK, or

many third-party development tools.

Evaluation board

■ST7232x-EVAL with ICC connector for

programming capability. Provides direct

connection to ST7-DVP3 emulator. Supplied

with daughter boards (core module) for

ST72F321, ST72F324 & ST72F521 (the

ST72F321 & ST72F324 chips are not included)

Table 28. STMicroelectronics Development Tools

Note 1: Add suffix /EU, /UK, /US for the power supply of your region.

Supported

Products

Emulation Programming

ST7 DVP3 Series ST7 EMU3 series

ICC Socket Board

Emulator Connection kit Emulator Active Probe &

T.E.B.

ST72324BJ,

ST72F324J,

ST72F324BJ

ST7MDT20-DVP3 ST7MDT20-T44/

DVP ST7MDT20J-

EMU3 ST7MDT20J-TEB ST7SB20J/xx1

ST72324BK,

ST72F324K,

ST72F324BK

ST7MDT20-DVP3 ST7MDT20-T32/

DVP

ST72324Jx ST72324Kx

156/164

14.4.1 Socket and Emulator Adapter

Information

For information on the type of socket that is sup-

plied with the emulator, refer to the suggested list

of sockets in Table 29.

Note: Before designing the board layout, it is rec-

ommended to check the overall dimensions of the

socket as they may be greater than the dimen-

sions of the device.

For footprint and other mechanical information

about these sockets and adapters, refer to the

manufacturer’s datasheet (www.yamaichi.de for

TQFP44 10 x 10 and www.ironwoodelectron-

ics.com for TQFP32 7 x 7).

Table 29. Suggested List of Socket Types

Device Socket (supplied with

ST7MDT20J-EMU3)

Emulator Adapter (supplied with

ST7MDT20J-EMU3)

TQFP32 7 X 7 IRONWOOD SF-QFE32SA-L-01 IRONWOOD SK-UGA06/32A-01

TQFP44 10 X10 YAMAICHI IC149-044-*52-*5 YAMAICHI ICP-044-5

£1

ST72324Jx ST72324Kx

157/164

14.5 ST7 APPLICATION NOTES

Table 30. ST7 Application Notes

IDENTIFICATION DESCRIPTION

APPLICATION EXAMPLES

AN1658 SERIAL NUMBERING IMPLEMENTATION

AN1720 MANAGING THE READ-OUT PROTECTION IN FLASH MICROCONTROLLERS

AN1755 A HIGH RESOLUTION/PRECISION THERMOMETER USING ST7 AND NE555

EXAMPLE DRIVERS

AN 969 SCI COMMUNICATION BETWEEN ST7 AND PC

AN 970 SPI COMMUNICATION BETWEEN ST7 AND EEPROM

AN 972 ST7 SOFTWARE SPI MASTER COMMUNICATION

AN 973 SCI SOFTWARE COMMUNICATION WITH A PC USING ST72251 16-BIT TIMER

AN 974 REAL TIME CLOCK WITH ST7 TIMER OUTPUT COMPARE

AN 976 DRIVING A BUZZER THROUGH ST7 TIMER PWM FUNCTION

AN 979 DRIVING AN ANALOG KEYBOARD WITH THE ST7 ADC

AN 980 ST7 KEYPAD DECODING TECHNIQUES, IMPLEMENTING WAKE-UP ON KEYSTROKE

AN1041 USING ST7 PWM SIGNAL TO GENERATE ANALOG OUTPUT (SINUSOÏD)

AN1044 MULTIPLE INTERRUPT SOURCES MANAGEMENT FOR ST7 MCUS

AN1046 UART EMULATION SOFTWARE

AN1047 MANAGING RECEPTION ERRORS WITH THE ST7 SCI PERIPHERALS

AN1048 ST7 SOFTWARE LCD DRIVER

AN1078 PWM DUTY CYCLE SWITCH IMPLEMENTING TRUE 0% & 100% DUTY CYCLE

AN1445 EMULATED 16 BIT SLAVE SPI

AN1504 STARTING A PWM SIGNAL DIRECTLY AT HIGH LEVEL USING THE ST7 16-BIT TIMER

GENERAL PURPOSE

AN1476 LOW COST POWER SUPPLY FOR HOME APPLIANCES

AN1709 EMC DESIGN FOR ST MICROCONTROLLERS

AN1752 ST72324 QUICK REFERENCE NOTE

PRODUCT EVALUATION

AN 910 PERFORMANCE BENCHMARKING

AN 990 ST7 BENEFITS VERSUS INDUSTRY STANDARD

AN1150 BENCHMARK ST72 VS PC16

AN1151 PERFORMANCE COMPARISON BETWEEN ST72254 & PC16F876

AN1278 LIN (LOCAL INTERCONNECT NETWORK) SOLUTIONS

PRODUCT MIGRATION

AN1131 MIGRATING APPLICATIONS FROM ST72511/311/214/124 TO ST72521/321/324

AN2197 GUIDELINES FOR MIGRATING ST72F324 & ST72F321 APPLICATIONS TO ST72F324B,

ST72F321B OR ST72F325

PRODUCT OPTIMIZATION

AN 982 USING ST7 WITH CERAMIC RESONATOR

AN1014 HOW TO MINIMIZE THE ST7 POWER CONSUMPTION

AN1015 SOFTWARE TECHNIQUES FOR IMPROVING MICROCONTROLLER EMC PERFORMANCE

AN1070 ST7 CHECKSUM SELF-CHECKING CAPABILITY

AN1181 ELECTROSTATIC DISCHARGE SENSITIVE MEASUREMENT

AN1502 EMULATED DATA EEPROM WITH ST7 HDFLASH MEMORY

AN1530 ACCURATE TIMEBASE FOR LOW-COST ST7 APPLICATIONS WITH INTERNAL RC OSCILLA-

TOR

AN1636 UNDERSTANDING AND MINIMIZING ADC CONVERSION ERRORS

PROGRAMMING AND TOOLS

ST72324Jx ST72324Kx

158/164

AN 978 ST7 VISUAL DEVELOP SOFTWARE KEY DEBUGGING FEATURES

AN 983 KEY FEATURES OF THE COSMIC ST7 C-COMPILER PACKAGE

AN 985 EXECUTING CODE IN ST7 RAM

AN 986 USING THE INDIRECT ADDRESSING MODE WITH ST7

AN 987 ST7 SERIAL TEST CONTROLLER PROGRAMMING

AN 988 STARTING WITH ST7 ASSEMBLY TOOL CHAIN

AN 989 GETTING STARTED WITH THE ST7 HIWARE C TOOLCHAIN

AN1039 ST7 MATH UTILITY ROUTINES

AN1064 WRITING OPTIMIZED HIWARE C LANGUAGE FOR ST7

AN1106 TRANSLATING ASSEMBLY CODE FROM HC05 TO ST7

AN1446 USING THE ST72521 EMULATOR TO DEBUG A ST72324 TARGET APPLICATION

AN1478 PORTING AN ST7 PANTA PROJECT TO CODEWARRIOR IDE

AN1575 ON-BOARD PROGRAMMING METHODS FOR XFLASH AND HDFLASH ST7 MCUS

AN1576 IN-APPLICATION PROGRAMMING (IAP) DRIVERS FOR ST7 HDFLASH OR XFLASH MCUS

AN1635 ST7 CUSTOMER ROM CODE RELEASE INFORMATION

AN1754 DATA LOGGING PROGRAM FOR TESTING ST7 APPLICATIONS VIA ICC

AN1796 FIELD UPDATES FOR FLASH BASED ST7 APPLICATIONS USING A PC COMM PORT

SYSTEM OPTIMIZATION

AN1711 SOFTWARE TECHNIQUES FOR COMPENSATING ST7 ADC ERRORS

Table 30. ST7 Application Notes

IDENTIFICATION DESCRIPTION

£1

ST72324Jx ST72324Kx

159/164

15 KNOWN LIMITATIONS

15.1 ALL DEVICES

15.1.1 External RC option

The External RC clock source option described in

previous datasheet revisions is no longer support-

ed and has been removed from this specification.

15.1.2 CSS Function

The Clock Security System function has been re-

moved from the datasheet.

15.1.3 Safe Connection of OSC1/OSC2 Pins

The OSC1 and/or OSC2 pins must not be left un-

connected otherwise the ST7 main oscillator may

start and, in this configuration, could generate an

fOSC clock frequency in excess of the allowed

maximum (>16MHz.), putting the ST7 in an un-

safe/undefined state. Refer to Section 6.2 on page

24.

15.1.4 Unexpected Reset Fetch

If an interrupt request occurs while a “POP CC” in-

struction is executed, the interrupt controller does

not recognise the source of the interrupt and, by

default, passes the RESET vector address to the

CPU.

Workaround

To solve this issue, a “POP CC” instruction must

always be preceded by a “SIM” instruction.

15.1.5 Clearing active interrupts outside

interrupt routine

When an active interrupt request occurs at the

same time as the related flag is being cleared, an

unwanted reset may occur.

Note: clearing the related interrupt mask will not

generate an unwanted reset

Concurrent interrupt context

The symptom does not occur when the interrupts

are handled normally, i.e.

when:

– The interrupt flag is cleared within its own inter-

rupt routine

– The interrupt flag is cleared within any interrupt

routine

– The interrupt flag is cleared in any part of the

code while this interrupt is disabled

If these conditions are not met, the symptom can

be avoided by implementing the following se-

quence:

Perform SIM and RIM operation before and after

resetting an active interrupt request.

Example:

SIM

reset interrupt flag

RIM

Nested interrupt context:

The symptom does not occur when the interrupts

are handled normally, i.e.

when:

– The interrupt flag is cleared within its own inter-

rupt routine

– The interrupt flag is cleared within any interrupt

routine with higher or identical priority level

– The interrupt flag is cleared in any part of the

code while this interrupt is disabled

If these conditions are not met, the symptom can

be avoided by implementing the following se-

quence:

PUSH CC

SIM

reset interrupt flag

POP CC

15.1.6 External Interrupt Missed

To avoid any risk of generating a parasitic inter-

rupt, the edge detector is automatically disabled

for one clock cycle during an access to either DDR

and OR. Any input signal edge during this period

will not be detected and will not generate an inter-

rupt.

This case can typically occur if the application re-

freshes the port configuration registers at intervals

during runtime.

Workaround

The workaround is based on software checking

the level on the interrupt pin before and after writ-

ing to the PxOR or PxDDR registers. If there is a

level change (depending on the sensitivity pro-

grammed for this pin) the interrupt routine is in-

voked using the call instruction with three extra

PUSH instructions before executing the interrupt

routine (this is to make the call compatible with the

IRET instruction at the end of the interrupt service

routine).

But detection of the level change does ensure that

edge occurs during the critical 1 cycle duration and

the interrupt has been missed. This may lead to

occurrence of same interrupt twice (one hardware

and another with software call).

ST72324Jx ST72324Kx

160/164

KNOWN LIMITATIONS (Cont’d)

To avoid this, a semaphore is set to '1' before

checking the level change. The semaphore is

changed to level '0' inside the interrupt routine.

When a level change is detected, the semaphore

status is checked and if it is '1' this means that the

last interrupt has been missed. In this case, the in-

terrupt routine is invoked with the call instruction.

There is another possible case, that is, if writing to

PxOR or PxDDR is done with global interrupts dis-

abled (interrupt mask bit set). In this case, the

semaphore is changed to '1' when the level

change is detected. Detecting a missed interrupt is

done after the global interrupts are enabled (inter-

rupt mask bit reset) and by checking the status of

the semaphore. If it is '1' this means that the last

interrupt was missed and the interrupt routine is in-

voked with the call instruction.

To implement the workaround, the following soft-

ware sequence is to be followed for writing into the

PxOR/PxDDR registers. The example is for Port

PF1 with falling edge interrupt sensitivity. The soft-

ware sequence is given for both cases (global in-

terrupt disabled/enabled).

Case 1: Writing to PxOR or PxDDR with Global In-

terrupts Enabled:

LD A,#01

LD sema,A ; set the semaphore to '1'

LD A,PFDR

AND A,#02

LD X,A ; store the level before writing to

PxOR/PxDDR

LD A,#$90

LD PFDDR,A ; Write to PFDDR

LD A,#$ff

LD PFOR,A ; Write to PFOR

LD A,PFDR

AND A,#02

LD Y,A ; store the level after writing to

PxOR/PxDDR

LD A,X ; check for falling edge

cp A,#02

jrne OUT

TNZ Y

jrne OUT

LD A,sema ; check the semaphore status if

edge is detected

CP A,#01

jrne OUT

call call_routine; call the interrupt routine

OUT:LD A,#00

LD sema,A

.call_routine ; entry to call_routine

PUSH A

PUSH X

PUSH CC

.ext1_rt ; entry to interrupt routine

LD A,#00

LD sema,A

IRET

Case 2: Writing to PxOR or PxDDR with Global In-

terrupts Disabled:

SIM ; set the interrupt mask

LD A,PFDR

AND A,#$02

LD X,A ; store the level before writing to

PxOR/PxDDR

LD A,#$90

LD PFDDR,A ; Write into PFDDR

LD A,#$ff

LD PFOR,A ; Write to PFOR

LD A,PFDR

AND A,#$02

LD Y,A ; store the level after writing to

PxOR/PxDDR

LD A,X ; check for falling edge

cp A,#$02

jrne OUT

TNZ Y

jrne OUT

LD A,#$01

LD sema,A ; set the semaphore to '1' if edge is

detected

RIM ; reset the interrupt mask

LD A,sema ; check the semaphore status

CP A,#$01

jrne OUT

call call_routine; call the interrupt routine

RIM

OUT: RIM

£1

ST72324Jx ST72324Kx

161/164

JP while_loop

.call_routine ; entry to call_routine

PUSH A

PUSH X

PUSH CC

.ext1_rt ; entry to interrupt routine

LD A,#$00

LD sema,A

IRET

15.1.7 16-bit Timer PWM Mode

In PWM mode, the first PWM pulse is missed after

writing the value FFFCh in the OC1R register

(OC1HR, OC1LR). It leads to either full or no PWM

during a period, depending on the OLVL1 and

OLVL2 settings.

15.1.8 SCI Wrong Break duration

Description

A single break character is sent by setting and re-

setting the SBK bit in the SCICR2 register. In

some cases, the break character may have a long-

er duration than expected:

- 20 bits instead of 10 bits if M=0

- 22 bits instead of 11 bits if M=1.

In the same way, as long as the SBK bit is set,

break characters are sent to the TDO pin. This

may lead to generate one break more than expect-

ed.

Occurrence

The occurrence of the problem is random and pro-

portional to the baudrate. With a transmit frequen-

cy of 19200 baud (fCPU=8MHz and SCI-

BRR=0xC9), the wrong break duration occurrence

is around 1%.

Workaround

If this wrong duration is not compliant with the

communication protocol in the application, soft-

ware can request that an Idle line be generated

before the break character. In this case, the break

duration is always correct assuming the applica-

tion is not doing anything between the idle and the

break. This can be ensured by temporarily disa-

bling interrupts.

The exact sequence is:

- Disable interrupts

- Reset and Set TE (IDLE request)

- Set and Reset SBK (Break Request)

- Re-enable interrupts

15.2 FLASH DEVICES ONLY

15.2.1 Internal RC Operation

In ST72F324J and ST72F324K devices, the inter-

nal RC oscillator is not supported if the LVD is dis-

abled.

ST72324Jx ST72324Kx

162/164

16 IMPORTANT NOTES ON ST72F324B FLASH DEVICES:

With the objective of continuous improvement, ST

has developed new ST72F324B devices. These

devices are fully compatible with all ROM features

and provide an improved price/performance ratio

compared to the ST72F324 flash devices.

A summary of the technical improvements is given

below.

Refer to separate ST72324B datasheet for the or-

dering information and full specifications.

16.1 Reset Pin Logic levels

In ST72F324B Flash devices, the VIH/VIL levels for

the reset pin are the same as specified for ROM

devices

16.2 Wake-Up from Active Halt mode using

external interrupts

In ST72F324B Flash devices, any external inter-

rupt that capable of waking-up the MCU from Halt

mode can also wake-up the MCU from Active Halt

mode. Consequently note 1 below Table 8 on

page 36 does not apply to ‘B’ devices.

16.3 PLL Jitter

In ST72F324B Flash devices, PLL clock accuracy

is improved and the jitter is the same as specified

for ROM devices

16.4 Active Halt Power Consumption

In ST72F324B Flash devices, the power con-

sumption in Active Halt mode is specified as

230µA max. See Table 12.5.1 on page 120 for test

conditions.

16.5 Timer A Registers

In ST72F324B Flash devices, all Timer A registers

are present and their functionality is the same as

described for ROM devices in the ST72324B da-

tasheet.

£1

ST72324Jx ST72324Kx

163/164

17 REVISION HISTORY

Table 31. Revision History

Date Revision Description of Changes

05-May-2004 2.0

Merged ST72F324 Flash with ST72324B ROM datasheet.

Vt POR max modified in Section 12.4 on page 119

Added Figure 78 on page 137

Modified VAREF min in “10-BIT ADC CHARACTERISTICS” on page 142

Modified I INJ for PB0 in Section 12.9

Added “Clearing active interrupts outside interrupt routine” on page 159

Modified “32K ROM DEVICES ONLY” on page 164

30-Mar-2005 3

Removed Clock Security System (CSS) throughout document

Added notes on ST72F324B 8K/16K Flash devices in Table 1 and Table 27

Corrected MCO description in Table 1 and Section 10.2

Modified VtPOR in Section 12.4 on page 119

Static current consumption modified in Section 12.9 on page 133

Updated footnote and Figure 77 and Figure 78 on page 137

Modified Soldering information in Section 13.3

Updated Section 14 on page 150

Added Table 27

Modified Figure 7 and note 4 in “FLASH PROGRAM MEMORY” on page 17

Added limitation on ICC entry mode with 39 pulses to “KNOWN LIMITATIONS” on

page 159

Added Section 16 on page 162 for ST72F324B 8K/16K Flash devices

Modified “Internal Sales Types on box label” in Table 29

08-Nov-2005 4 Removed information on ST72F324B and ROM devices (now in separate datasheet)

04-Apr-2008 5

Changed status to “Not for new design”

Added “External interrupt missed” in “KNOWN LIMITATIONS” on page 159

Removed information on automotive versions (now in separate datasheet)

ST72324Jx ST72324Kx

164/164

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ST72F324J6TA

IC MCU 8BIT 32KB FLASH 44LQFP

ST72F324J6TAE

IC MCU 8BIT 32KB FLASH 44LQFP

ST72F324J6TATR

IC MCU 8BIT 32KB FLASH 44LQFP

ST72F324J6TC

IC MCU 8BIT 32KB FLASH 44LQFP

ST72F324J6TC/TR

IC MCU 8BIT 8KB FLASH 32SDIP

ST72F324K2B6

IC MCU 8BIT 8KB FLASH 32LQFP

ST72F324K2T6TR

IC MCU 8BIT 8KB FLASH 32LQFP

ST72F324K2TA

IC MCU 8BIT 8KB FLASH 32LQFP

ST72F324K2TAE

IC MCU 8BIT 8KB FLASH 32LQFP

ST72F324K2TATR

IC MCU 8BIT 8KB FLASH 32LQFP

ST72F324K2TC