C Series, High Q Datasheet by TDK Corporation

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@TDK MULTILAYER CERAMIC CHIP CAPACITORS
I
Issue date: April 2011
TDK MLCC
US Catalog
Version B11
C Series
High Q Capacitors
Type: C0603 [EIA CC0201]
@TDK IIIULTILAYEEI CERAMIC CHIP CAPACITORS
R
REMINDERS
Please read before using this product
SAFETY REMINDERS
TDK MLCC US Catalog Version B11Page 148
REMINDERS
1. If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other
damage, you must contact our company’s sales window.
2. We may modify products or discontinue production of a product listed in this catalog without prior
notification.
3. We provide “Delivery Specification” that explain precautions for the specifications and safety of each
product listed in this catalog. We strongly recommend that you exchange these delivery specifications
with customers that use one of these products.
4. If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according
to the “Foreign Exchange and Foreign Trade Control Law”. In such cases, it is necessary to acquire export
permission in harmony with this law.
5. Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from
our company.
6. We are not responsible for problems that occur related to the intellectual property rights or other rights of
our company or a third party when you use a product listed in this catalog. We do not grant license of
these rights.
7. This catalog only applies to products purchased through our company or one of our company’s official
agencies. This catalog does not apply to products that are purchased through other third parties.
@TDK IIIULTILAI’ECI CERAMIC CHIP CAPACITORS
TDK MLCC US Catalog Version B11Page 149
C Series
High Q Capacitors
Type: C0603
Available Through Distribution Only*
Higher Q factor than standard capacitors
High stability ith respect to tie teperature
freuency and voltage
cellent attenuation
High self-resonant freuency
Loer poer dissipationless energy absorption
Capacitance range of 0.2pF to 15pF
Available in standard and tight tolerance
Please contact TDK for Q values
A
Applications
High-freuency applications
PA modules
Cellular communication, Bluetooth
Cable/satellite TV
GPS/satellite radio
Filter networks/matching networks
RF amplifiers/Low noise amplifiers
VCOs, TCXOs, etc.
DC blocking circuits
Features
Shape &
Dimensions
Dimensions in mm
Part Number
Construction
Series Name C0603 C0G 1E 150 J T XXXX
Dimensions L x W (mm)
Temperature Characteristic
Rated Voltage (DC)
Nominal Capacitance (pF)
Capacitance Tolerance
Packaging Style
Internal Codes
L Body Length
W Body Width
T Body Height
B Terminal Width
Case Code Length Width
C0603 0.60 ± 0.03 0.30 ± 0.03
Temperature
Characteristics
Capacitance
Change
Temperature
Range
C0G 0±30 ppm/ºC -55 to +125ºC
Voltage Code Voltage (DC)
1E 25V
The capacitance is expressed in three digit codes and in units of pico
Farads (pF). The first and second digits identify the first and second
significant figures of the capacitance. The third digit identifies the
multiplier. R designates a decimal point.
Capacitance Code Capacitance
0R5 0.5pF
010 1pF
102 1,000pF (1nF)
105 1,000,000pF (1μF)
Tolerance Code Tolerance
W± 0.05 pF
B± 0.10 pF
C± 0.25 pF
D± 0.50 pF
E± 0.20 pF
G±2%
J±5%
Packaging Code Style
T Tape & Reel
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
L Body Length
W Body Width
T Body Height
B Terminal Width
@TDK IIIULTILAYEEI CERAMIC CHIP CAPACITORS
TDK MLCC US Catalog Version B11Page 150
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
C
Capacitance
Range Chart
C0603 [EIA CC0201]
Capacitance Range Chart
Temperature Characteristics: C0G (0 ± 30ppm/ºC)
Rated Voltage: 25V(1E)
0.30 mm
Standard Thickness
CCapacitance
(
(pF)
Cap
Code
Temperature
Characteristics
Tolerance
W
(±
0.05)
B
(
±
0.10pF)
C
(
±
0.25pF)
D
(
±
0.50pF)
E
(
±
0.20pF)
G
(±2%)
J
(±5%)
0.2 0R2 -55 to 125ºC,
0±30 ppm/ºC
0.3 0R3
0.4 0R4
0.5 0R5
0.6 0R6
0.7 0R7
0.8 0R8
0.9 0R9
1 010
1.1 1R1
1.2 1R2
1.3 1R3
1.5 1R5
1.6 1R6
1.8 1R8
2 020
2.2 2R2
2.4 2R4
2.7 2R7
3 030
3.3 3R3
3.6 3R6
3.9 3R9
4 040
4.3 4R3
4.7 4R7
5 050
5.1 5R1
5.6 5R6
6 060
6.2 6R2
6.8 6R8
7 070
7.5 7R5
8 080
8.2 8R2
9 090
9.1 9R1
10 100
11 110
12 120
13 130
15 150
16 160
18 180
20 200
S R O .H mm P A C P H C Flu M A R E C DV WC \T‘ A H. U U M 228 AAAAAAA 6 .
TDK MLCC US Catalog Version B11Page 151
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C
Capacitance
Range Table
C0603 [EIA CC0201]
TDK Part Number
(
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C0603C0G1E0R2WTQ C0G 25V
0.2
± 0.05pF 0.30 ± 0.03
C0603C0G1E0R2BTQ C0G 25V
0.2
± 0.10pF 0.30 ± 0.03
C0603C0G1E0R3WTQ C0G 25V
0.3
± 0.05pF 0.30 ± 0.03
C0603C0G1E0R3BTQ C0G 25V
0.3
± 0.10pF 0.30 ± 0.03
C0603C0G1E0R4WTQ C0G 25V
0.4
± 0.05pF 0.30 ± 0.03
C0603C0G1E0R4BTQ C0G 25V
0.4
± 0.10pF 0.30 ± 0.03
C0603C0G1E0R5WTQ C0G 25V
0.5
± 0.05pF 0.30 ± 0.03
C0603C0G1E0R5BTQ C0G 25V
0.5
± 0.10pF 0.30 ± 0.03
C0603C0G1E0R6WTQ C0G 25V
0.6
± 0.05pF 0.30 ± 0.03
C0603C0G1E0R6BTQ C0G 25V
0.6
± 0.10pF 0.30 ± 0.03
C0603C0G1E0R7WTQ C0G 25V
0.7
± 0.05pF 0.30 ± 0.03
C0603C0G1E0R8WTQ C0G 25V
0.7
± 0.05pF 0.30 ± 0.03
C0603C0G1E0R7BTQ C0G 25V
0.7
± 0.10pF 0.30 ± 0.03
C0603C0G1E0R8BTQ C0G 25V
0.8
± 0.10pF 0.30 ± 0.03
C0603C0G1E0R9WTQ C0G 25V
0.9
± 0.05pF 0.30 ± 0.03
C0603C0G1E0R9BTQ C0G 25V
0.9
± 0.10pF 0.30 ± 0.03
C0603C0G1E010BTQ C0G 25V
1.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E010CTQ C0G 25V
1.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E1R1BTQ C0G 25V
1.1
± 0.10pF 0.30 ± 0.03
C0603C0G1E1R1CTQ C0G 25V
1.1
± 0.25pF 0.30 ± 0.03
C0603C0G1E1R2BTQ C0G 25V
1.2
± 0.10pF 0.30 ± 0.03
C0603C0G1E1R2CTQ C0G 25V
1.2
± 0.25pF 0.30 ± 0.03
C0603C0G1E1R3BTQ C0G 25V
1.3
± 0.10pF 0.30 ± 0.03
C0603C0G1E1R3CTQ C0G 25V
1.3
± 0.25pF 0.30 ± 0.03
C0603C0G1E1R5BTQ C0G 25V
1.5
± 0.10pF 0.30 ± 0.03
C0603C0G1E1R5CTQ C0G 25V
1.5
± 0.25pF 0.30 ± 0.03
C0603C0G1E1R6BTQ C0G 25V
1.6
± 0.10pF 0.30 ± 0.03
C0603C0G1E1R6CTQ C0G 25V
1.6
± 0.25pF 0.30 ± 0.03
C0603C0G1E1R8BTQ C0G 25V
1.8
± 0.10pF 0.30 ± 0.03
C0603C0G1E1R8CTQ C0G 25V
1.8
± 0.25pF 0.30 ± 0.03
C0603C0G1E020BTQ C0G 25V
2.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E020CTQ C0G 25V
2.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E2R2BTX C0G 25V
2.2
± 0.10pF 0.30 ± 0.03
C0603C0G1E2R2CTX C0G 25V
2.2
± 0.25pF 0.30 ± 0.03
C0603C0G1E2R4BTX C0G 25V
2.4
± 0.10pF 0.30 ± 0.03
C0603C0G1E2R4CTX C0G 25V
2.4
± 0.25pF 0.30 ± 0.03
C0603C0G1E2R7BTX C0G 25V
2.7
± 0.10pF 0.30 ± 0.03
C0603C0G1E2R7CTX C0G 25V
2.7
± 0.25pF 0.30 ± 0.03
C0603C0G1E030BTX C0G 25V
3.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E030CTX C0G 25V
3.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E3R3BTX C0G 25V
3.3
± 0.10pF 0.30 ± 0.03
C0603C0G1E3R3CTX C0G 25V
3.3
± 0.25pF 0.30 ± 0.03
C0603C0G1E3R6BTX C0G 25V
3.6
± 0.10pF 0.30 ± 0.03
C0603C0G1E3R6CTX C0G 25V
3.6
± 0.25pF 0.30 ± 0.03
Class 1 (Temperature Compensating)
Temperature Characteristics: C0G (-55 to 125ºC, 0±30 ppm/ºC)
{EASTDK IIIULTILAYEEI CERAMIC CHIP CAPACITORS mccmmmmccmmAAccuuuuccmm ACCNNCCm 1o 11 11 12 12 13 13 16 16
TDK MLCC US Catalog Version B11Page 152
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C
Capacitance
Range Table
C0603 [EIA CC0201]
TDK Part Number
(
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C0603C0G1E3R9BTX C0G 25V
3.9
± 0.10pF 0.30 ± 0.03
C0603C0G1E3R9CTX C0G 25V
3.9
± 0.25pF 0.30 ± 0.03
C0603C0G1E040BTX C0G 25V
4.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E040CTX C0G 25V
4.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E4R3BTX C0G 25V
4.3
± 0.10pF 0.30 ± 0.03
C0603C0G1E4R3CTX C0G 25V
4.3
± 0.25pF 0.30 ± 0.03
C0603C0G1E4R7BTX C0G 25V
4.7
± 0.10pF 0.30 ± 0.03
C0603C0G1E4R7CTX C0G 25V
4.7
± 0.25pF 0.30 ± 0.03
C0603C0G1E050BTX C0G 25V
5.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E050CTX C0G 25V
5.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E5R1BTX C0G 25V
5.1
± 0.10pF 0.30 ± 0.03
C0603C0G1E5R1CTX C0G 25V
5.1
± 0.25pF 0.30 ± 0.03
C0603C0G1E5R6BTX C0G 25V
5.6
± 0.10pF 0.30 ± 0.03
C0603C0G1E5R6CTX C0G 25V
5.6
± 0.25pF 0.30 ± 0.03
C0603C0G1E060BTX C0G 25V
6.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E060CTX C0G 25V
6.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E6R2BTX C0G 25V
6.2
± 0.10pF 0.30 ± 0.03
C0603C0G1E6R2CTX C0G 25V
6.2
± 0.25pF 0.30 ± 0.03
C0603C0G1E6R8BTX C0G 25V
6.8
± 0.10pF 0.30 ± 0.03
C0603C0G1E6R8CTX C0G 25V
6.8
± 0.25pF 0.30 ± 0.03
C0603C0G1E070BTX C0G 25V
7.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E070CTX C0G 25V
7.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E7R5BTX C0G 25V
7.5
± 0.10pF 0.30 ± 0.03
C0603C0G1E7R5CTX C0G 25V
7.5
± 0.25pF 0.30 ± 0.03
C0603C0G1E080BTX C0G 25V
8.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E080CTX C0G 25V
8.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E8R2BTX C0G 25V
8.2
± 0.10pF 0.30 ± 0.03
C0603C0G1E8R2CTX C0G 25V
8.2
± 0.25pF 0.30 ± 0.03
C0603C0G1E090BTX C0G 25V
9.0
± 0.10pF 0.30 ± 0.03
C0603C0G1E090CTX C0G 25V
9.0
± 0.25pF 0.30 ± 0.03
C0603C0G1E9R1BTX C0G 25V
9.1
± 0.10pF 0.30 ± 0.03
C0603C0G1E9R1CTX C0G 25V
9.1
± 0.25pF 0.30 ± 0.03
C0603C0G1E100ETX C0G 25V
10
± 0.20pF 0.30 ± 0.03
C0603C0G1E100DTX C0G 25V
10
± 0.50pF 0.30 ± 0.03
C0603C0G1E110GTX C0G 25V
11
± 2% 0.30 ± 0.03
C0603C0G1E110JTX C0G 25V
11
± 5% 0.30 ± 0.03
C0603C0G1E120GTX C0G 25V
12
± 2% 0.30 ± 0.03
C0603C0G1E120JTX C0G 25V
12
± 5% 0.30 ± 0.03
C0603C0G1E130GTX C0G 25V
13
± 2% 0.30 ± 0.03
C0603C0G1E130JTX C0G 25V
13
± 5% 0.30 ± 0.03
C0603C0G1E150GTX C0G 25V
15
± 2% 0.30 ± 0.03
C0603C0G1E150JTX C0G 25V
15
± 5% 0.30 ± 0.03
C0603C0G1E160GTX C0G 25V
16
± 2% 0.30 ± 0.03
C0603C0G1E160JTX C0G 25V
16
± 5% 0.30 ± 0.03
Class 1 (Temperature Compensating)
Temperature Characteristics: C0G (-55 to 125ºC, 0±30 ppm/ºC)
{EASTDK IIIULTILAYEEI CERAMIC CHIP CAPACITORS 18 18 20 20
TDK MLCC US Catalog Version B11Page 153
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C
Capacitance
Range Table
C0603 [EIA CC0201]
TDK Part Number
(
(Ordering Code)
Temperature
Characteristics
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
C0603C0G1E180GTX C0G 25V
18
± 2% 0.30 ± 0.03
C0603C0G1E180JTX C0G 25V
18
± 5% 0.30 ± 0.03
C0603C0G1E200GTX C0G 25V
20
± 2% 0.30 ± 0.03
C0603C0G1E200JTX C0G 25V
20
± 5% 0.30 ± 0.03
Class 1 (Temperature Compensating)
Temperature Characteristics: C0G (-55 to 125ºC, 0±30 ppm/ºC)
yvaDK IIIULIILAYEEI CERAMIC CHIP CAPACITORS
TDK MLCC US Catalog Version B11Page 154
G
General
Specifications
C0603 Series – High Q Capacitors
No. Item Performance Test or Inspection Method
1 External
Appearance
No defects which may affect
performance.
Inspect with magnifying glass (10).
2 Insulation
Resistance
10,000Mmin. Apply rated voltage for 60s.
3 Voltage Proof Withstand test voltage without
insulation breakdown or other damage.
Above DC voltage shall be applied for 1 to 5s. Charge /
discharge current shall not exceed 50mA.
4 Capacitance Within the specified tolerance.
5Q
(Class 1)
C : Rated capacitance (pF)
See No.4 in this table for measuring condition.
6 Temperature
Characteristics
of Capacitance
(Class 1) Capacitance drift
Within r0.2% or r0.05pF, whichever
larger.
Temperature coefficient shall be calculated based on
values at 25ºC and 85ºC temperature.
Measuring temperature below 20ºC shall be -10ºC and
-25ºC.
7 Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Reflow solder the capacitor on P.C. board (shown in
Appendix 1) and apply a pushing force of 2N for
10r1s.
8 Bending No mechanical damage. Reflow solder the capacitor on P.C. board (shown in
Appendix 2) and bend it for 1mm.
Class Apply voltage
Class 1 3 rated voltage
Class Measuring
Frequency Measuring voltage
Class 1 1MHz±10% 0.5 - 5 Vrms
Rated Capacitance Q
C 30pF 1,000 min.
C < 30pF 400 + 20C min.
T.C. Temperature Coefficient
C0G 0 r30 ppm/ºC
Pushing force
P.C. board
Capacitor
1
20
50 F
R230
45 45
Unit: mm
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yvaDK IIIULIILAYEEI CERAMIC CHIP CAPACITORS I /
TDK MLCC US Catalog Version B11Page 155
G
General
Specifications
C0603 Series – High Q Capacitors
No. Item Performance Test or Inspection Method
9 Solderability New solder to cover over 75% of
termination.
25% may have pinholes or rough spots
but not concentrated in one spot.
Ceramic surface of A sections shall not
be exposed due to melting or shifting of
termination material.
Completely soak both terminations in solder at
235r5ºC for 2r0.5s.
Solder: H63A (JIS Z 3282)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
10 Resistance to solder heat Completely soak both terminations in solder at
260㫧5ºC for 5㫧1s.
Preheating condition
Temp.: 150㫧10ºC
Time : 1 to 2min.
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
Solder: H63A (JIS Z 3282)
Leave the capacitor in ambient conditions for 6 to 24h
before measurement.
External
appearance
No cracks are allowed and terminations
shall be covered at least 60% with new
solder.
Capacitance
Q (Class 1)
C : Rated capacitance (pF)
Insulation
Resistance
Meet the initial spec.
Voltage
Proof
No insulation breakdown or other
damage.
11 Vibration Reflow solder the capacitor on P.C. board (shown in
Appendix 1) before testing.
Vibrate the capacitor with amplitude of 1.5mm P-P
sweeping the freuencies from 10Hz to 55Hz and back
to 10Hz after 1min.
Repeat this for 2h each in 3 perpendicular directions.
External
appearance
No mechanical damage.
Capacitance
Q (Class 1)
C : Rated capacitance (pF)
A section
Characteristics Change from the
value before test
Class 1 C0G Capacitance drift within
r2.5% or r0.25pF,
whichever larger.
Rated Capacitance Q
C 30pF 1,000 min.
C < 30pF 400 + 20C min.
Characteristics Change from the
value before test
Class 1 C0G Capacitance drift within
r2.5% or r0.25pF,
whichever larger.
Rated Capacitance Q
C 30pF 1,000 min.
C < 30pF 400+20C min.
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yvaDK IIIULIILAYER CERAMIC CHIP CAPACITORS
TDK MLCC US Catalog Version B11Page 156
G
General
Specifications
C0603 Series – High Q Capacitors
No. Item Performance Test or Inspection Method
12 Temperature cycle Reflow solder the capacitors on a P.C. board (shown in
Appendix 1) before testing.
Expose the capacitor in the conditions in step 1
through step 4, and repeat 5 times consecutively.
Leave the capacitor in ambient conditions for 6 to 24h
before measurement.
External
appearance
No mechanical damage.
Capacitance
Q (Class 1)
C : Rated capacitance (pF)
Insulation
Resistance
Meet the initial spec.
Voltage
Proof
No insulation breakdown or other
damage.
13 Moisture Resistance (Steady State) Reflow solder the capacitor on P.C. board (shown in
Appendix 1) before testing.
Leave at temperature 40㫧2ºC, 90 to 95%RH for 500
+24,0h.
Leave the capacitor in ambient condition for 6 to 24h
before measurement.
External
appearance
No mechanical damage.
Capacitance
Q (Class 1)
C : Rated capacitance (pF)
Insulation
Resistance
1,000Mmin.
Characteristics Change from the
value before test
Class 1 C0G Capacitance drift within
r2.5% or r0.25pF,
whichever larger.
Rated Capacitance Q
C 30pF 1,000 min.
C < 30pF 400 + 20C min.
Step Temperature (ºC) Time (min.)
1 Min. operating temp. r330 ±3
2 Reference Temp. 2 – 5
3 Max. operating temp. r230 ±2
4 Reference Temp. 2 - 5
Characteristics Change from the
value before test
Class 1 C0G Capacitance drift within
r5% or r0.5pF,
whichever larger.
Rated Capacitance Q
C 30pF 350 min.
10pF C < 30pF 275 + 5/2C min.
C < 10pF 200 + 10C min.
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
yvaDK IIIULIILAYER CERAMIC CHIP CAPACITORS
TDK MLCC US Catalog Version B11Page 157
G
General
Specifications
C0603 Series – High Q Capacitors
No. Item Performance Test or Inspection Method
14 Moisture Resistance Reflow solder the capacitors on P.C. board (shown in
Appendix 1) before testing.
Apply the rated voltage at temperature 40r2ºC and 90
to 95%RH for 500 +24,0h.
Charge/discharge current shall not exceed 50mA.
Leave the capacitor in ambient conditions for 6 to 24h
before measurement.
Use this measurement for initial value.
External
appearance
No mechanical damage.
Capacitance
Q (Class 1)
C : Rated capacitance (pF)
Insulation
Resistance
500Mmin.
15 Life Reflow solder the capacitor on P.C. board (shown in
Appendix 1) before testing.
Apply 2x rated voltage at 125㫧2ºC for 1,000 +48, 0h.
Charge/discharge current shall not exceed 50mA.
Leave the capacitors in ambient condition for 6 to 24h
before measurement.
Use this measurement for initial value.
External
appearance
No mechanical damage.
Capacitance
Q (Class 1)
C : Rated capacitance (pF)
Insulation
Resistance
1,000Mmin.
Characteristics Change from the
value before test
Class 1 C0G Capacitance drift within
r7.5% or r0.75pF,
whichever larger.
Rated Capacitance Q
C 30pF 200 min.
C < 30pF 100 + 10/3C min.
Characteristics Change from the
value before test
Class 1 C0G Capacitance drift within
r3% or r0.3pF,
whichever larger.
Rated Capacitance Q
C 30pF 350 min.
10pF C < 30pF 275 + 5/2C min.
C < 10pF 200 + 10C min.
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
yvaDK IIIULIILAYER CERAMIC CHIP CAPACITORS DD
TDK MLCC US Catalog Version B11Page 158
G
General
Specifications
C0603 Series – High Q Capacitors
Appendix - 1a
P.C. Board for reliability test
Applied for C0603, C1005, C1608, C2012, C3216
Appendix - 2a
P.C. Board for bending test
Applied for C0603, C1005
100 mm
Solder Resist Copper
b
a
c
40 mm
1.0 mm
c
a
b
Solder resist
b
100 mm
Copper
40 mm
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix - 2 0.8mm
Appendix - 1 1.6mm
Copper ( thickness 0.035mm )
Solder resist
Case Code Dimensions (mm)
JIS EIA a b c
C0603 CC0201 0.3 0.8 0.3
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
{EASTDK IIIULTILAYEEI CERAMIC CHIP CAPACITORS \\ I<—>I<->I<—>I FFFFF I<—>IIHI
TDK MLCC US Catalog Version B11Page 159
S
Soldering
Information
C0603 Series – High Q Capacitors
Reflow Soldering Unit: mm
Type
Symbol
C0603
[CC0201]
A 0.25 ~ 0.35
B0.2 ~ 0.3
C 0.25 ~ 0.35
¬ Recommended Soldering Land Pattern ¬ Recommended Soldering Profile
A
B
C
Chip capacitor Solder land
Solder resist
Excessive
solder
Higher tensile
force on the chip
capacitor may
cause cracking.
Adeuate
solder
Insufficient
solder
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
¬ Recommended Solder Amount
Recommended soldering duration
Temp./
Dura.
Solder
Reflow Soldering
Peak temp
(°C) Duration
(sec.)
Sn-Pb Solder 230 max. 20 max.
Lead-Free Solder 260 max. 10 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Preheating Condition
Soldering Temp. (ºC)
Reflow soldering T 150
Manual soldering T 150
Maximum amount
Minimum amount
Reflow Soldering Manual soldering
(Solder iron)
T
Preheating
3sec. (As short as possible)
0
300
Temp (ºC)
Temp (ºC)
0
T
Soldering Natural
cooling
Preheating
Peak
Temp
Over 60 sec.
Peak Temp time
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
{EASTDK IIIULTILAYEEI CERAMIC CHIP CAPACITORS
TDK MLCC US Catalog Version B11Page 160
P
Packaging
Information
C0603 Series – High Q Capacitors
¬ C
Carrier Tape Configuration
¬ C
Chip Quantity Per Reel and Structure of Reel
¬ P
Peel Back Force (Top Tape)
Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
The missing of components shall be less than
0.1%
Components shall not stick to the cover tape.
The cover tape shall not protrude beyond the
edges of the carrier tape and shall not cover the
sprocket holes.
Paper carrier tape
Pitch hole
Top cover tape
Bottom cover tape
(Bottom cover tape is not always applied)
Paper Carrier Tape & Reel
Case Code Chip
Thickness
(mm)
Taping
Material
Chip quantity (pcs.)
JIS EIA ijPP´UHHO
C0603 CC0201 0.30 Paper 15,000
Carrier tape
Top cover tape
Direction & angle of pull
0.05 – 0.7 N
0~15
q
Bottom cover tape (Paper carrier tape)
Direction of pull force
Drawing direction Leader
400mm min
Bulk
160mm min.
Chips Bulk
160mm min
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
@TDK IIIULTILAI’ECI CERAMIC CHIP CAPACITORS
TDK MLCC US Catalog Version B11Page 161
Ad
dditional
Information
C0603 Series – High Q Capacitors
¬ S
Shape & Dimensions
TDK Corporation established internal product environmental
assurance standards that include the six hazardous
substances banned by the EU RoHS Directive1enforced on
July 1, 2006 along with additional substances independently
banned by TDK and has successfully completed making
general purpose electronic components conform to the
RoHS Directive2.
L
B
G
BW
T
Terminal electrode
Ceramic dielectric
Internal electrode
3
4
5
12
No. NAME MATERIAL
Class 1
(1) Ceramic Dielectric CaZrO3
(2) Internal Electrode Nickel (Ni)
(3)
Termination
Copper (Cu)
(4) Nickel (Ni)
(5) Tin (Sn)
¬ I
Inside Structure & Material System
Case Code Dimensions (mm)
JIS EIA L W T B G
C0603 CC0201 0.60 0.30 0.30 0.15 0.20 min.
¬ E
Environmental Information
1. Abbreviation for Restriction on Hazardous
Substances, which refers to the regulation EU
Directive 2002/95/EC on hazardous substances by
the European Union (EU) effective from July 1, 2006.
The Directive bans the use of six specific hazardous
substances in electric and electronic devices and
products handled within the EU. The six substances
are lead, mercury, cadmium, hexavalent chromium,
PBB (polybrominated biphenyls), and PBDE
(polybrominated diphenyl ethers).
2. This means that, in conformity with the EU Directive
2002/95/EC, lead, cadmium, mercury, hexavalent
chromium, and specific bromine-based flame
retardants, PBB and PBDE, have not been used,
except for exempted applications.
For REACH (SVHC : 15 substances according to ECHA /
October 2008) : All TDK MLCC do not contain these
15 substances.
For European Directive 2000/53/CE and 2005/673/CE :
Cadmium, Hexavalent Chromium, Mercury, Lead are
not contained in all TDK MLCC.
For European Directive 2003/11/CE : Pentabromodiphenyl-
ether, Octabromodiphenyl-ether are not contained in
all TDK MLCC.
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.

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