ECD,ECJ,ECY Handling Precautions Datasheet by Panasonic Electronic Components
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Panasonic
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC48 –
Handling Precautions
Multilayer Ceramic Capacitors
Series:ECJ, ECY, ECD
■
Operating Conditions and Circuit Design
1. Circuit Design
1.1
Operating Temperature and Storage Temperature
The specifi ed “Operating Temperature Range” found
in the specifi cations is the absolute maximum and
minimum temperature rating. Every Capacitor shall be
operated within the specifi ed “Operating Temperature
Range”.
The capacitors mounted on PCB shall be stored
without operating within the specified “Storage
Temperature Range” in the Specifications.
1.2 Design of Voltage Application
Capacitors shall not be operated in excess of the
specifi ed “Rated Voltage” in the Specifi cation.
If voltage ratings are exceeded, the Capacitors could
result in failure or damage. The designed peak DC and
AC voltages applied to the Capacitors, shall be within
the specifi ed “Rated Voltage”.
In case of AC of pulse voltage, the peak voltage shall
be within the specifi ed “Rated Voltage”. If high frequency
voltage or fast rising pulse voltages are continuously
applied, even when within the “Rated Voltage”, consider
that the reliability of the Capacitor may change. Continuous
application of those types of voltages can affects the life of
the Capacitors.
1.3 Charging and Discharging Current
The Capacitors shall not be operated beyond the specifi ed
“Maximum Charging/Discharging Current Ratings” in
the specifi cations. For safety reasons Panasonic does
not recommend use in applications with low impedance
circuitry such as “secondary power circuits”.
1.4 Temperature Rise due to Dielectric Loss of
the Capacitors
The “Operating Temperature Range” mentioned above
shall include a maximum surface temperature rise of
20 °C, which is caused by the Dielectric loss of the
Capacitor and applied electrical stresses such as
voltage, frequency and wave form. It is recommended
to measure and check the “Surface Temperature of the
Capacitor” in the application at room temperature (up
to 25 °C).
1.5 Environmental Restrictions
The Capacitors shall not be operated and/or stored
under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfi de, sulfurous acid, chlorine
and ammonia
(2) Mechanical conditions
Under severe conditions of vibration or impact beyond
the specifi ed conditions found in the Specifi cations
1.6 DC Voltage Characteristics
The Capacitors (Class 2) employ dielectric ceramics with
dielectric constant having voltage dependency, and if
the applied DC voltage is high, capacitance may broadly
change. For the specifi ed capacitance, the following
should be confi rmed.
Safety Precautions
Multilayer Ceramic Chip Capacitors (hereafter referred to as “Capacitors”) should be used for general purpose
applications found in consumer electronics (audio/visual, home, offi ce, information & communication) equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifi cations, as noted
in the Ratings and Specifi ed Conditions section, the capacitor may fail in a short circuit mode or in an open-circuit
mode. This case results in a burn-out, smoke or fl aming.
For products which require high safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
●
For the following applications and conditions, please contact us for additional specifi cations not found in this document.
· When your application may have diffi culty complying with the safety or handling precautions specifi ed below.
· F o r a ny applications where a malfunction with this product may directly or indirectly cause hazardous
conditions which could result in death or injury;
1 Aircraft and Aerospace Equipment (artifi cial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (motor vehicles, airplanes, trains, ship, traffi c signal controllers, etc.)
4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment
00 Sep. 2008
Panasonic
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC49 –
0
DC voltage (V)
oC/C (%)
0
Time (h)
oC/C (%)
0
log T
Time (h)
oC/C (%)
0
log THeat Treatment
LAND LANDSMD
ab
c
Solder resist ab
c
SMD
LAND
c
ab
P/2 P
c
ab
P
< >
(1) If capacitance change caused by the applied voltage
is within the allowable range, or if its application allows
unlimited capacitance change.
(2) DC voltage characteristics demonstrate that even
if the applied voltage is under the rated voltage,
the capacitance change rate increases with higher
voltage (Capacitance down). Accordingly, when the
Capacitors are used for circuits with a narrow allowable
capacitance range such as time constant circuits, we
recommend applying a lower voltage after taking
capacitance aging and the above into account.
Capacitance change - DC voltage
Under Ordinary Temperature
Before and After Heat treatment
1.7 Capacitance Aging
The ceramic dielectrics of the Capacitors (Class 2) have
capacitance aging. Accordingly, when the Capacitors
are used for circuits which require a narrow allowable
capacitance range, such as time constant circuits, pay
special attention to capacitance aging before use.
of the Capacitors may be effective in getting the
resonance under control with other equipment such as
printed circuit boards. Attaching the Capacitors to
the printed circuit board by an adhesive may also
be effective.
2.Design of Printed Circuit Board
2.1 Selection of Printed Circuit Board
When the Capacitors are mounted and soldered on
an “Alumina Substrate”, the substrate infl uences the
Capacitors’ reliability against “Temperature Cycles”
and “Heat shock” due to the difference in the thermal
expansion coeffi cient between them. Confi rm that the
actual board used does not deteriorate the characteristics
of the Capacitors.
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown below.
Use the proper amount of solder in order to prevent
cracking. Using too much solder places excessive
stress on the Capacitors.
Size
Component Dimensions
abc
LW T
0201 0.6 0.3 0.3
0.2 to 0.3 0.25 to 0.3 0.2 to 0.3
0402 1.0 0.5 0.5
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
0402✽
11.0 0.5 0.5
0.5 to 0.6 0.4 to 0.5 0.5 to 0.6
0603 1.6 0.8
0.45 to 0.8
0.8 to 1.0 0.6 to 0.8 0.6 to 0.8
0805 2.0 1.25
0.6 to 1.25
0.8 to 1.2 0.8 to 1.0 0.8 to 1.0
1206 3.2 1.6
0.6 to 1.6 1.8 to 2.2 1.0 to 1.2 1.0 to 1.3
1210 3.2 2.5
0.85 to 2.5
1.8 to 2.2 1.0 to 1.2 1.8 to 2.3
0508 1.25 2.0 0.85
0.5 to 0.7 0.5 to 0.6 1.4 to 1.9
0612 1.6 3.2 0.85
0.8 to 1.0 0.6 to 0.7 2.5 to 3.0
Unit (mm)
Recommended land dimensions (Ex.)
High Capacitance, For General Electronic
Equipment, Low Profi leType, Wide-width Type,
100V·200V series, 630V series, High-Q capacitors
<2Array type, 4 Array type>
Size
Component
Dimensions abcP
LWT
0504
2 Array 1.37 1.0 0.6
0.3 to 0.4 0.45 to 0.55
0.3 to 0.4
0.54 to 0.74
0.8
0.3 to 0.6 0.4 to 0.7
0.46 to 0.56 0.71 to 0.91
0805
4 Array 2.0 1.25 0.85
0.55 to 0.75
0.5 to 0.6 0.2 to 0.3 0.4 to 0.6
1206
4 Array 3.2 1.6 0.85
0.9 to 1.1 0.7 to 0.9
0.35 to 0.45
0.7 to 0.9
Unit (mm)
1.8 Piezoelectricity
Dielectrics used for the Capacitors (Class 2) may
cause the following Piezoelectricity (or Electrostriction).
(1) If the signal of a specifi c frequency is applied to
the Capacitors, electric and acoustic noise may be
generated by resonating the characteristic frequen-
cy, which is determined by the dimensions of the
Capacitor.
As a measure to prevent this phenomenon, changing
the size of the Capacitor is effective in changing its
resonance frequency.
In addition, changing the materials of the Capacitors
to the Low-loss type, which has no (or less)
piezoelectricity, or to use Class 1 dielectrics which
have no (or less) piezoelectricity.
(2) Vibration or impact applied to the Capacitors may
cause noise because mechanical force is converted
to electrical signals (Especially to circuitry around
an amplifi er unit).
As a measure to prevent this phenomenon, changing
the materials of the Capacitor to the Low-loss type,
which has no (or less) piezoelectricity, or to Class1 is
also available.
(3) If a “whining sound” is generated it does not
indicate a problem with product performance
and reliability, however, check if this undesirable
phenomenon generates noise in your application.
To prevent this phenomenon, changing the Capacitor’s
characteristics, such as size and shape, as
shown in (1) & (2) above can be effective.
In addition, changing the mounting direction
✽
1 The following value is applied as a dimensional tolerance :
+0.15/-0.05 mm (L, W and T).
00 Sep. 2008
Panasonic
%%%
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC50 –
(a) Excessive amount (b) Proper amount (c) Insufficient amount
Solder resist
Land
Portion to be
excessively soldered
Alead wire of
Retro-fitted component
Soldering iron
Solder
(Ground solder)
Chassis
Electrode pattern
Solder resist
Solder resist
Solder resist
The lead wire of a component
with lead wires
AB
C
E
D
Slit
Magnitude of stress A>B=C>D>E
Perforation
(2) The size of lands shall be designed to have equal
spacing between the right and left sides. If the
amount of solder on the right land is different from that
on the left land, the component may be cracked by
stress since the side with a larger amount of solder
solidifi es later during cooling.
Recommended Amount of Solder
2.3 Applications of Solder Resist
(1) Solder resist shall be utilized to equalize the amounts
of solder on both sides.
(2) Solder resist shall be used to divide the pattern for the
following cases;
· Components are arranged closely.
· The Capacitor is mounted near a component with
lead wires.
· The Capacitor is placed near a chassis.
See the table below.
Item Prohibited
applications
Improved applications
by pattern division
Mixed mounting
with a component
with lead wires
Arrangement
near chassis
Retro-fi tting of
component with
lead wires
Lateral
arrangement
Prohibited Applications and Recommended Applications
2.4 Component Layout
The Capacitors/components shall be placed on the PC
board so as to have both electrodes subjected to uniform
stresses, or to position the component electrodes at right
angles to the grid glove or bending line. This should be
done to avoid cracking the Capacitors from bending of
the PC board after or during placing/mounting on the PC
board.
(1) To minimize mechanical stress caused by warp or
bending of a PC board, please follow the recommended
Capacitors’ layout below.
Prohibited layout Recommended layout
Layout the Capacitor sideways
against the stressing direction
(2) The following drawing is for reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on the
mounting position of the Capacitors.
(3) The magnitude of mechanical stress applied to the
Capacitors when the circuit board is divided is in the
order of push back < slit < V-groove < perforation.
Also take into account the layout of the Capacitors
and the dividing/breaking method.
2.5 Mounting Density and Spaces
If components are arranged in too narrow a space, the
components can be affected by solder bridges and
solder balls. The space between components should
be carefully determined.
■Precautions for Assembly
1. Storage
(1) The Capacitors shall be stored between 5 - 40 °C
and 20 - 70 % RH, not under severe conditions of
high temperature and humidity.
(2) If stored in a place that is humid, dusty, or contains
corrosive gasses (hydrogen sulfi de, sulfurous acid,
hydrogen chloride and ammonia, etc.), the solderability
of the terminal electrodes may deteriorate.
In addition, storage in a place subjected to heating
and/or exposure to direct sunlight will causes
deformed tapes and reels, and component sticking to
tapes, both of which can result in mounting problems.
(3) Do not store components longer than 6 months.
Check the solderability of products that have been
stored for more than 6 months before use.
(4) High dielectric constant capacitors (Class 2, characteristic
B, X7R, X5R and F, Y5V) change in capacitance
with the passage of time, (Capacitance aging), due
to the inherent characteristics of ceramic dielectric
materials.
The capacitance change can be reversed to the initial
value at the time of shipping by heat treatment (See
1. Circuit Design, 1-7. Capacitance aging)
(5) When the initial capacitance is measured, the
Capacitors shall be heat-treated at 150 +0/-10
°C for 1 hour and then subjected to ordinary
temperature and humidity for 48±4 hours before
measuring the initial values.
2.Adhesives for Mounting
(1) The amount and viscosity of an adhesive for mounting
shall be such that the adhesive shall not fl ow off on
the land during its curing.
(2) If the amount of adhesive is insuffi cient for mounting,
the Capacitor may fall off after or during soldering.
(3) If the adhesive is too low in its viscosity, the Capacitors
may be out of alignment after or during soldering.
(4) Adhesives for mounting can be cured by ultraviolet
or infrared radiation. In order to prevent the terminal
electrodes of the Capacitors from oxidizing, curing
shall be done under the following conditions: 160 °C
max., for 2 minutes max.
00 Sep. 2008
Panasonic
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC51 –
Supporting pin
The supporting pin does not necessarily
have to be positioned beneath the Capacitor.
Supporting pin
Crack
Separation of Solder
Crack
260
240
0
Temperature(˚C)
Time
3to5s
Soldering
oT
Gradual cooling
(at ordinary temperature)
60 to 120 s
5.2 Refl ow Soldering
The refl ow soldering temperature conditions are each
temperature curves of Preheating, Temp. rise, Heating,
Peak and Gradual cooling. Large temperature difference
caused by rapid heat application to the Capacitors may
lead to excessive thermal stresses, contributing to the
thermal cracks. The Preheating temperature requires
controlling with great care so that tombstone phenomenon
may be prevented.
(5) Insuffi cient curing may cause the Capacitor to fall
off after or during soldering. In addition, insulation
resistance between terminal electrodes may deteriorate
due to moisture absorption. In order to prevent these
problems, please observe proper curing conditions.
3.Chip Mounting Consideration
(1) When mounting the Capacitors/components on a
PC board, the Capacitor bodies shall be free from
excessive impact loads such as mechanical impact
or stress due to the positioning, pushing force and
displacement of vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip Mounter
must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle
is too low, the Capacitor will crack from excessive
force during mounting.
The following precautions and recommendations are
for your reference.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting
pin on the rear surface of the PC board to suppress
the bending of the PC board in order to minimize
the impact of the vacuum nozzles. Typical examples
are shown in the table below.
Item Prohibited mounting Recommended
mounting
Single surface
mouting
Double surface
mounting
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning chucks
shall be controlled. Maintenance and replacement
of positioning chucks shall be performed regularly
to prevent chipping or cracking of the Capacitors
caused by mechanical impact during positioning
due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted
so that the maximum bending of PC board does
not exceed 0.5 mm at 90 mm span. The PC board
shall be supported by an adequate number of
supporting pins.
4. Selection of Soldering Flux
Soldering fl ux may seriously affect the performance of the
Capacitors. The following shall be confi rmed before use.
(1) The soldering fl ux should have a halogen based
content of 0.1 wt. % (converted to chlorine) or below.
Do not use soldering fl ux with strong acid.
(2) When applying water-soluble soldering fl ux, wash
the Capacitors suffi ciently because the soldering fl ux
residue on the surface of PC boards may deteriorate
the insulation resistance on the Capacitors surface.
5. Soldering
5.1 Flow Soldering
For fl ow soldering, abnormal and large thermal and
mechanical stress, caused by the “Temperature Gradient”
between the mounted Capacitors and melted solder in a
soldering bath may be applied directly to the Capacitors,
resulting in failure and damage of the Capacitors.
Therefore it is essential that soldering process follow
these recommended conditions.
(1) Application of Soldering fl ux:
The soldering fl ux shall be applied to the mounted
Capacitors thinly and uniformly by foaming method.
(2) Preheating:
The mounted Capacitors/Components shall be
pre-heated suffi ciently so that the “Temperature
Gradient” between the Capacitors/Components
and the melted solder shall be 150 °C max. (100
to 130 °C)
(3) Immersion into Soldering Bath:
The Capacitors shall be immersed into a soldering
bath of 240 to 260 °C for 3 to 5 seconds.
(4) Gradual Cooling:
The Capacitors shall be cooled gradually to room
ambient temperature at cooling temperature rates of
8 °C/s max. from 250 °C to 170 °C and 4 °C/s max.
from 170 °C to 130 °C.
(5) Flux Cleaning:
When the Capacitors are immersed into a cleaning
solvent, be sure that the surface temperatures of
the devices do not exceed 100 °C.
(6) Performing fl ow soldering once under the conditions
shown in the fi gure below [Recommended profi le of
Flow soldering (Ex)] will not cause any problems.
However, pay attention to the possible warp and
bending of the PC board.
Recommended profi le for Flow soldering [Ex.]
Size Temp. Tol
0603 to 1206, 0508, 0612 o
T < 150 °C
<Allowable temperature difference o
T>
Item Temperature Period or Speed
1
Preheating
140 to 180 °C 60 to 120 sec
2
Temp. rise
Preheating temp to
Peak temp. 2 to 5 °C/sec
3
Heating
220 °C min. 60 sec max.
4
Peak
260 °C max. 10 sec max.
5
Gradual cooling Peak temp. to 140 °C
1 to 4 °C/sec
For products specifi ed in individual specifi cations, avoid
fl ow soldering.
00 Sep. 2008
Panasonic
L
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC52 –
Time
Gradual
cooling
5
Heating3
Peak4
Temp. rise
왕T
2
Preheating1
60 sec max.60 to 120 sec
Temperature (°C)
260
220
180
140
oT
Preheating
Gradual cooling
60 to 120 sec 3 sec max.
Recommended profi le of Refl ow soldering [Ex.]
Size Temp. Tol
0201 to 1206, 0508, 0612, 0504 o
T < 150 °C
1210 o
T < 130 °C
<Allowable temperature difference o
T>
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Capacitors are immersed into a cleaning
solvent, confi rm that the surface temperatures of the
devices do not exceed 100 °C.
Performing refl ow soldering twice under the conditions
shown in the fi gure above [Recommended profi le of
Refl ow soldering (EX)] will not cause any problems.
However, pay attention to the possible warp and
bending of the PC board.
5.3 Hand Soldering
Hand soldering typically causes signifi cant temperature
change, which may induce excessive thermal stresses
inside the Capacitors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should be
observed.
· T he t e mp er at ure of the soldering tips should be
controlled with special care.
·
The direct contact of soldering tips with the Capacitors
and/or terminal electrodes should be avoided.
· Dismounted Capacitors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering:
φ1.0 mm or below Thread eutectic solder with
soldering fl ux✽ in the core.
✽Rosin-based and non-activated fl ux is recommended.
(b) Preheating:
The Capacitors shall be preheated so that the
“Temperature Gradient” between the devices and
the tip of soldering iron is 150 °C or below.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be melted in
advance on the soldering tip.)
(d) Gradual Cooling:
After soldering, the Capacitors shall be cooled
gradually at room temperature.
(2) Condition 2 (without preheating)
Hand soldering can be performed without preheating,
by following the conditions below:
(a) Soldering iron tip shall never directly touch
the ceramic and terminal electrodes of the
Capacitors.
(b) The lands are suffi ciently preheated with a
soldering iron tip before sliding the soldering
iron tip to the terminal electrodes of the
Capacitor for soldering.
Size Temp. Tol.
0201 to 1206, 0508, 0612, 0504 o
T < 150 °C
1210 o
T < 130 °C
Recommended profi le of Hand Soldering [Ex.]
<Allowable temperature difference o
T>
Item Condition
Size
0201 to 0805, 0508, 0504 1206, 1210, 0612
Temperature of Iron tip
270 °C max. 250 °C max.
Wattage
20 W max.
Shape of Iron tip
φ3 mm max.
Soldering time with a
soldering iron
3 sec max.
<Conditions of Hand soldering without preheating>
6. Post Soldering Cleaning
6.1 Cleaning Solvent
Soldering flux residue may remain on the PC
board if cleaned with an inappropriate solvent. This
may deteriorate the electrical characteristics and
reliability of the Capacitors.
6.2 Cleaning Conditions
Insuffi cient cleaning or excessive cleaning may impair the
electrical characteristics and reliability of the Capacitors.
(1) Insuffi cient cleaning can lead to:
(a) The halogen substance found in the residue of
soldering fl ux may cause the metal of terminal
electrodes to corrode.
(b) The halogen substance found in the residue of
soldering fl ux on the surface of the Capacitors
may change resistance values.
(c) Water- soluble soldering fl ux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering fl ux.
(2) Excessive cleaning can lead to:
(a) Overuse of ultrasonic cleaning may deteriorate
the strength of the terminal electrodes or cause
cracking in the solder and /or ceramic bod-
ies of the Capacitors due to vibration of the PC
boards.
Please follow these conditions for Ultrasonic cleaning:
Ultrasonic wave output : 20 W/L max.
Ultrasonic wave frequency : 40 kHz max.
Ultrasonic wave cleaning time : 5 min max.
6.3 Contamination of Cleaning Solvent
Cleaning with contaminated cleaning solvent may
cause the same results as insuffi cient cleaning due to
the high density of liberated halogen.
7. Ins pe c ti o n Process
When mounted PC boards are inspected with measur-
ing terminal pins, abnormal and excess mechanical
stress shall not be applied to the PC board or mount-
ed components, to prevent failure or damage to the de-
vices.
(1) Mo un ted P C boards shall be supported by an
adequate number of supporting pins with bend
settings of 90 mm span 0.5 mm max.
00 Sep. 2008
Panasonic
cry
Che
A L
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC53 –
Supporting pin
Separated, Crack
Check pinCheck pin
Bending Torsion
PC board
splitting jig
V-groove
PC board
Outline of Jig
PC
board Chip
component
Load
position
V-groove
Load adirection
PC
board Chip
component
Load position
V-groove
Load direction
Floor
Crack
Mounted PCB
Crack
8.Protective Coat
When the surface of a PC board on which the Capacitors
have been mounted is coated with resin to protect
against moisture and dust, it shall be confi rmed that
the protective coating which is corrosive or chemically
active is not used, in order that the reliability of the
Capacitors in the actual equipment may not be infl uenced.
Coating materials that expand or shrink also may lead to
damage to the Capacitors during the curing process.
9. Dividing/Breaking of PC Boards
(1) Abnormal and excessive mechanical stress such as
bending or torsion shown below can cause cracking
in the Capacitors.
Prohibited dividing Recommended dividing
(2) Dividing/Breaking of the PC boards shall be
done carefully at moderate speed by using a jig
or apparatus to prevent the Capacitors on the
boards from mechanical damage.
(3) Examples of PCB dividing/breaking jigs:
The outline of a PC board breaking jig is shown below.
When PC boards are broken or divided, loading points
should be close to the jig to minimize the extent of the
bending
Also, planes with no parts mounted on should
be used as plane of loading, which generates
a compressive stress on the mounted plane, in
order to prevent tensile stress induced by the
bending, which may cause cracks of the Capacitors
or other parts mounted on the PC boards.
■Other
For special mounting conditions, please contact us.
Precautions for Use above are from
The Technical Report EIAJ RCR-2335 Caution
Guide Line for Operation of Fixed Multilayer
Ceramic Capacitors for Electronic Equipment by
Japan Electronics and Information Technology
Industries Association (March 2002 issued)
Please refer to above technical report for details.
(2) Confi rm that the measuring pins have the right tip
shape, are equal in height and are set in the correct
positions.
The following fi gures are for your reference to avoid
bending the PC board.
Item Prohibited setting
Recommended setting
Bending of
PC board
10. Mechanical Impact
(1) The Capacitors shall be free from any excessive
mechanical impact.
The Capacitor body is made of ceramics and may
be damaged or cracked if dropped.
Never use a Capacitor which has been dropped; their
quality may be impaired and failure rate increased.
(2) When handling PC boards with Capacitors mounted
on them, do not allow the Capacitors to collide with
another PC board.
When mounted PC boards are handled or stored
in a stacked state, impact between the corner of a
PC board and the Capacitor may cause damage or
cracking and can deteriorate the withstand voltage
and insulation resistance of the Capacitor.
00 Sep. 2008
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