DZ2716000L Datasheet by Panasonic Electronic Components
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DocNo. TT47EA712348
Revision. 3
Panasonic
4W
Farameier
Toiai werdissi aiion
Eleclrosiaiic dwschar
:lm
Max
Farameier Conditions
Zener vuli e
|Z=0.5mA
VR=12V
RZK
IR
Zener rise operaiing reswslance
Reverse currenl
Tem erature Coefficient of Zener voit
e
Established :2010702710
Revised :2013710716
Product Standards
Zener Diode
DZ2716000L
Absolute Maximum Ratings Ta = 25 C
*1: Mounted on glass epoxy print board. ( 45 mm x 45 mm x 1 mm)
Solder in ( 0.4 mm x 0.3 mm)
*2:
Electrical Characteristics Ta = 25 C 3 C
1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.
2. Absolute frequency of input and output is 5 MHz.
3. *1 The temperature must be controlled 25 °C for VZ mesurement.
VZ value measured at other temperature must be adjusted to VZ (25 °C)
*2 VZ guaranted 20 ms after current flow.
*3 Tj = 25 °C to 150 °C
Page
+85 °COperating ambient temperature Topr -40 to
Internal Connection
14.2 mV/°C
V
50
15.30
Max
16.80
1.0 V
Parameter Symbol Conditions
Forward voltage VF IF = 10 mA
Unit
Junction temperature Tj 150 °C
1of4
Unit: mm
Min Typ
SSSMini2-F4-B
JEITA SC-104A
2. Anode
Low zener operating resistance Rz
Excellent rising characteristics of zener current Iz
Halogen-free / RoHS compliant
DZ2716000L
Silicon epitaxial planar type
For constant voltage / For surge absorption circuit
DZ2S160 in SSSMini2 type package
Features
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
Marking Symbol
:
XJ
Code
1. Cathode
SOD-723
Panasonic
Reverse current
Packaging
Embossed type (Thermo-compression sealing) 10 000 pcs / reel (standard)
Parameter Symbol Rating Unit
Zener voltage *1, *2 VZ IZ = 5 mA
Zener operating resistance RZ IZ = 5 mA
Repetitive peak forward current IFRM 200 mA
Electrostatic discharge *2 ESD
+150 °CStorage temperature Tstg -55 to
±8 kV
Total power dissipation *1 PT 120 mW
Zener rise operating resistance RZK IZ = 0.5 mA
μAIR VR = 12 V
Note)
Test method:IEC61000_4_2(C = 150 pF,R = 330 , Contact discharge:10 times)
Note)
0.05
80
Temperature coefficient of zener voltage *3 SZ IZ = 5 mA
1.4
0.6
0.52
1.0
0.27
0.13
2
1
1
2
Doc No.
TT4-EA-12348
Revision.
3
Established
:
2010-02-10
Revised
:
2013-10-16
DocNo. TT47EA712348
Revision. 3
Panasonic
Technical Data reference
III
Established : 2010702710
Revised :2013710716
Product Standards
Zener Diode
DZ2716000L
Technical Data ( reference )
Page 2 of 4
PT - Ta
0
50
100
150
200
0 20 40 60 80 100 120 140 160 180 200
Ambient temperature Ta (°C)
Total power dissipation PT (mW)
Mounted on glass epoxy print board.
Board size : 45 mm × 45 mm x 1 mm
Solder in : 0.4 mm x 0.3 mm
IF - VF
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Forward voltage VF (V)
Forward current IF (A)
Ta = 25 °C
IR - VR
1.E-12
1.E-11
1.E-10
1.E-09
1.E-08
1.E-07
1.E-06
024681012
Reverse voltage VR (V)
Reverse current IR (A)
Ta = 25 °C
IZ - VZ
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
5 1015202530
Zener voltage VZ (V)
Zener current IZ (A)
Ta = 125 °C
85 °C
-40 °C
25 °C
SZ - IZ
0
5
10
15
20
25
0246810
Zener current IZ (mA)
Temparature coefficient of zener
voltage SZ (mV/°C)
RZ-IZ
1
10
100
0.0001 0.001 0.01 0.1
Zener current IZ (A)
Zener operating resistance RZ )
Ta = 25 °C
Doc No.
TT4-EA-12348
Revision.
3
Established
:
2010-02-10
Revised
:
2013-10-16
DocNoi TT47EA712348
Revision 3
Panasonic
Technical Data reference
Established : 2010702710
Revised :2013710716
Product Standards
Zener Diode
DZ2716000L
Technical Data ( reference )
Page 3 of 4
Rth - t
1
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Time t (s)
Thermal resistance Rth (°C/W)
(1)
Rth(j-l) = 100 °C/W
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
Board size : 45 mm × 45 mm x 1 mm
Solder in : 0.4 mm x 0.3 mm
(2)
PZSM - tw
0.1
1
10
100
100 1000 10000
Pulse width tw (μs)
Non-repetitive reverse surge power
dissipation PZSM (W)
Ta = 25 °C
Ct - VR
0
2
4
6
8
10
12
14
16
18
20
024681012
Reverse voltage VR (V)
Terminal capacitance Ct (pF)
Ta = 25 °C
f = 1 MHz
Doc No.
TT4-EA-12348
Revision.
3
Established
:
2010-02-10
Revised
:
2013-10-16
DocNo. TT47EA712348
Revision. 3
Panasonic
F4
4m,
Established : 2010702710
Revised :2013710716
Product Standards
Zener Diode
DZ2716000L
Unit: mm
Page
SSSMini2-F4-B
4
4of
Land Pattern (Reference) (Unit: mm)
0 to 0.05
1.40
±0.05
0.27
+0.05
-0.03
0.13
+0.05
-0.02
0.20
±0.05
0.52
±0.03
(0.27)
0.60
±0.05
1.00
±0.05
(5°)
(5°)
1
2
0.3
0.4
1.3
0.3
Doc No.
TT4-EA-12348
Revision.
3
Established
:
2010-02-10
Revised
:
2013-10-16
Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents. the
laws and regulations of the exporting country. espeCially. those With regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit
examples of the products. No license is granted in and to any intellectual property right or other right owned by
Panasonic Corporation or any other company. Therefore. no responsibility is assumed by our company as to the
infringement upon any such right owned by any other company which may arise as a result of the use of technical
information de-scribed in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment.
communications equipment. measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications. moreover please exchange
documents separately on terms of use etc,: Special applications (such as for in-vehicle equipment. airplanes. aerospace.
automotive equipment. traffic signaling equipment. combustion equipment. medical equipment and safety devices) in
which exceptional quality and reliability are required. or if the failure or malfunction of the products may directly
jeopardize life or harm the human body.
Unless exchanging documents on terms of use etc. in advance. it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book
for any special application.
(4) The products and product speCifications described in this book are subject to change wtthout notice for modification
and/or improvement, At the final stage of your design. purchasing. or use of the products, therefore. ask for the most up-
to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially. please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode»switching. Other-
wtse. we Will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design.
arresting the spread of tire or preventing glitch are recommended in order to prevent physical injury. fire. somal damages.
for example. by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
(ESD. EOS. thermal stress and mechanical stress) at the time of handling. mounting or at customer's process. We do
not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required. satisfy the conditions. such as shelf life and the elapsed
time since first opening the packages.
(7) When reselling products described in this book to other companies without our permission and receiving any claim of
request from the resale destination. please understand that customers will bear the burden.
(B) This book may be not reprinted or reproduced whether wholly or partially. without the prior written permission of our
company.
Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit
examples of the products. No license is granted in and to any intellectual property right or other right owned by
Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the
infringement upon any such right owned by any other company which may arise as a result of the use of technical
information de-scribed in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications, moreover please exchange
documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,
automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly
jeopardize life or harm the human body.
Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book
for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification
and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-
to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
(ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do
not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
time since first opening the packages.
(7) When reselling products described in this book to other companies without our permission and receiving any claim of
request from the resale destination, please understand that customers will bear the burden.
(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
company.
No.010618
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