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Ultra Precision Thin Film Chip Resistors
TNPU e3 ultra precision thin film flat chip resistors combine
the proven reliability of TNPW e3 products with a most
advanced level of precision and stability. This unique
combination makes the product perfectly suited for all
applications with outstanding requirements towards size,
reliable precision and stability.
FEATURES
• Low temperature coefficients and tight
tolerances
• Sulfur resistance verified according to
ASTM B 809
• Superior moisture resistivity (85 °C; 85 % RH)
• Excellent overall stability at different
environmental conditions, e.g. 0.05 % (1000 h rated
power at 70 °C)
• AEC-Q200 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive
• Industrial equipment
• Test and measuring equipment
• Medical equipment
• Telecommunication
• Instrumentation
Note
(1) Please refer to APPLICATION INFORMATION, see below
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications”
(www.vishay.com/doc?28844) for information on the general nature of thermal resistance.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TECHNICAL SPECIFICATIONS
DESCRIPTION TNPU0402 e3 TNPU0603 e3 TNPU0805 e3 TNPU1206 e3
Imperial size 0402 0603 0805 1206
Metric size code RR1005M RR1608M RR2012M RR3216M
Resistance range 100 to 100 k100 to 100 k100 to 332 k100 to 511 k
Resistance tolerance ± 0.1 %; ± 0.05 % ± 0.1 %; ± 0.05 %; ± 0.02 %
Temperature coefficient ± 10 ppm/K; ± 5 ppm/K ± 10 ppm/K; ± 5 ppm/K; ± 2 ppm/K
Rated dissipation, P70 (1) 0.063 W 0.1 W 0.125 W 0.25 W
Operating voltage, Umax. ACRMS/DC 50 V 75 V 150 V 200 V
Permissible film temperature,
F max. (1) 125 °C
Operating temperature range -55 °C to 125 °C
Internal thermal resistance (1) 90 K/W 63 K/W 38 K/W 32 K/W
Permissible voltage against ambient
(insulation):
1 min; Uins 75 V 100 V 200 V 300 V
FITobserved 0.1 x 10-9/h
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MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE STANDARD
Rated dissipation, P70
TNPU0402 e3 0.063 W
TNPU0603 e3 0.100 W
TNPU0805 e3 0.125 W
TNPU1206 e3 0.250 W
Operating temperature range -55 °C to 125 °C
Permissible film temperature,
F max. 125 °C
Max. resistance change at P70 for resistance range,
|R/R| after:
TNPU0402 e3 100 to 100 k
TNPU0603 e3 100 to 100 k
TNPU0805 e3 100 to 332 k
TNPU1206 e3 100 to 511 k
1000 h 0.05 %
8000 h 0.1 %
225 000 h 0.3 %
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES
TNPU0402 e3
± 10 ppm/K ± 0.05 %
100 to 100 k
E24; E192
± 5 ppm/K ± 0.1 %
± 0.05 %
TNPU0603 e3
± 10 ppm/K ± 0.05 %
100 to 100 k
± 5 ppm/K
± 0.1 %
± 0.05 %
± 0.02 %
± 2 ppm/K
± 0.1 %
500 to 20 k± 0.05 %
± 0.02 %
TNPU0805 e3
± 10 ppm/K ± 0.05 %
100 to 332 k
± 5 ppm/K
± 0.1 %
± 0.05 %
± 0.02 % 100 to 200 k
± 2 ppm/K
± 0.1 %
500 to 20 k± 0.05 %
± 0.02 %
TNPU1206 e3
± 10 ppm/K ± 0.05 %
100 to 511 k
± 5 ppm/K
± 0.1 %
± 0.05 %
± 0.02 % 100 to 200 k
± 2 ppm/K
± 0.1 %
500 to 20 k± 0.05 %
± 0.02 %
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Note
• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
PACKAGING
TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH PACKAGING
DIMENSIONS
TNPU0402 e3 EP1 = EP 1000
Paper tape according
IEC 60286-3,
type 1a
8 mm
2 mm
Ø 180 mm / 7"
ET2 = EI 5000
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
E52 = EN 1000
4 mm
ET1 = EA 5000
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPU12061K32AZEA00
TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING
TNPU0402
TNPU0603
TNPU0805
TNPU1206
R = decimal
K = thousand
M = million
(4 digits)
B = ± 0.1 %
A = ± 0.05 %
H = ± 0.02 %
Y = ± 10 ppm/K
Z = ± 5 ppm/K
W = ± 2 ppm/K
EP
EI
EN
EA
Product Description: TNPU1206 1K32 0.05 % T-16 ET1 e3
TNPU1206 1K32 0.05 % T-16 ET1 e3
TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE
TNPU0402
TNPU0603
TNPU0805
TNPU1206
1K32 = 1320 ± 0.02 %
± 0.05 %
± 0.1 %
T-13 = ± 10 ppm/K
T-16 = ± 5 ppm/K
T-20 = ± 2 ppm/K
EP1
ET2
E52
ET1
e3 = pure tin
termination finish
NPU12061KT2AZEA003
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DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high
grade ceramic substrate (Al2O3) and conditioned to achieve
the desired temperature coefficient. Specially designed
inner contacts are deposited on both sides. A special laser
is used to achieve the target value by smoothly fine trimming
the resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure matte tin on
nickel plating. The result of the determined production is
verified by an extensive testing procedure on 100 % of the
individual chip resistors. Only accepted products are laid
directly into the tape in accordance with IEC 60286-3 Type
1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS compliant, the pure matte tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
RELATED PRODUCTS
For products with precision specification see the datasheet:
• TNPW e3 - High Stability Thin Film Flat Chip Resistors
(www.vishay.com/doc?28758)
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
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FUNCTIONAL PERFORMANCE
Derating
120
100
80
60
40
20
0
Ambient Temperature in °C
Rated Power in %
70
-55 -25 0 25 50 75 100 125 150 175
110
100
90
80
70
60
100
Non-Linearity
A ytiraeni
L-noN
3
Bd ni
Resistance Value in Ω
TNPU0603 e3
TNPU1206 e3
TNPU0805 e3
40
1K 10K 100K 1M
1
100 1K 10K 100K 1M
Current Noise
Current Noise in
µV/V
Resistance Value in Ω
TNPU0805
e3
0.1
0.01
TNPU0603
e3
TNPU1206
e3
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TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400),
sectional specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA / ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
TNPU0402 e3 100 to 100 k
TNPU0603 e3 100 to 100 k
TNPU0805 e3 100 to 332 k
TNPU1206 e3 100 to 511 k
4.5 - Resistance ± 0.1 %; ± 0.05 %; ± 0.02 %
4.8 - Temperature
coefficient
At (20 / -55 / 20) °C
and (20 / 125 / 20) °C ± 10 ppm/K; ± 5 ppm/K; ± 2 ppm/K
4.25.1 - Endurance at 70 °C
U = or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.05 % R + 0.01 )
70 °C; 8000 h ± (0.1 % R + 0.02 )
4.25.3 - Endurance at upper
category temperature
125 °C; 1000 h ± (0.05 % R + 0.01 )
125 °C; 8000 h ± (0.1 % R + 0.02 )
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.1 % R + 0.01 )
4.23 Climatic sequence:
± (0.1 % R + 0.02 )
4.23.2 2 (Bb) Dry heat UCT; 16 h
4.23.3 30 (Db) Damp heat, cyclic
55 °C; 24 h;
> 90 % RH;
5 cycle
4.23.4 1 (Ab) Cold LCT; 2 h
4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C
4.23.6 30 (Db) Damp heat, cyclic
55 °C; 24 h;
> 90 % RH;
5 cycles
4.23.7 - D.c. load
U = Umax.; 1 min
LCT = -55 °C
UCT = 125 °C
- 1 (Aa) Cold -55 °C; 2 h ± (0.05 % R + 0.01 )
P70 x R
P70 x R
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Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
4.19 14 (Na) Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = -55 °C;
UCT = 125 °C;
1000 cycles
± (0.1 % R + 0.01 )
4.13 - Short time
overload
U = 2.5 x
or U = 2 x Umax.;
whichever is the less severe;
5 s
± (0.05 % R + 0.01 )
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s2; 6 h
± (0.05 % R + 0.01 )
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0,5 or SnAg3,5;
non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
4.18 58 (Td) Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.02 % R + 0.01)
4.29 45 (XA) Component solvent
resistance
Isopropyl alcohol
+50 °C; method 2 No visible damage
4.32 21 (Ue3) Shear (adhesion)
RR 1005M and
RR 1608M; 9 N No visible damage
RR 2012M and
RR 3216M; 45 N
4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.05 % R + 0.01)
no visible damage, no open circuit in bent position
4.7 - Voltage proof URMS = Uins; 60 ± 5 s No flashover or breakdown
4.35 - Flammability IEC 60 695-11-5 (1),
needle flame test; 10 s No burning after 30 s
4.39 -
Periodic electric
overload:
Standard operation
mode
U =
or U = 2 x Umax.;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.1 R + 0.02 )
4.37 67 (Cy)
Damp heat,
steady state,
accelerated
(85 ± 5) °C; 56 days
(85 ± 5) % RH ± (0.25 R + 0.05 )
4.38 -
Electro static
discharge
(Human Body Model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
TNPU0402: 400 V
TNPU0603: 1000 V
TNPU0805: 1500 V
TNPU1206: 2000 V
± (0.5 R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
TNPU0402 e3 100 to 100 k
TNPU0603 e3 100 to 100 k
TNPU0805 e3 100 to 332 k
TNPU1206 e3 100 to 511 k
P70 x R
15 x P70 x R
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DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
DIMENSIONS AND MASS
TYPE / SIZE L
(mm)
W
(mm)
H
(mm)
Tt / Tb
(mm)
MASS
(mg)
TNPU0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.2 ± 0.10 0.65
TNPU0603 e3 1.6 ± 0.10 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20 2
TNPU0805 e3 2.0 ± 0.15 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20 5.5
TNPU1206 e3 3.2 ± 0.15 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25 10
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
REFLOW SOLDERING WAVE SOLDERING
a
(mm)
b
(mm)
l
(mm)
a
(mm)
b
(mm)
l
(mm)
TNPU0402 e3 0.4 0.6 0.5 - - -
TNPU0603 e3 0.5 0.9 1.0 0.9 0.9 1.0
TNPU0805 e3 0.7 1.3 1.2 0.9 1.3 1.3
TNPU1206 e3 0.9 1.7 2.0 1.1 1.7 2.3
Tb
Tt
W
L
H
b
a
l
—
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
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