MM74HC4049/MM74HC4050 Datasheet by ON Semiconductor

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© 1999 Fairchild Semiconductor Corporation DS005214 www.fairchildsemi.com
February 1984
Revised October 1999
MM74HC4049 • MM74HC4050 Hex Inverting Logic Level Down Converter • Hex Logic Level Down Converter
MM74HC4049 • MM74HC4050
Hex Inverting Logic Level Down Converter •
Hex Logic Level Down Converter
General Description
The MM74HC4049 and the MM74HC4050 utilize
advanced silicon-gate CMOS technology, and have a mod-
ified input protection structure that enables these parts to
be used as logic level translators which will convert high
level logic to a low level logic while operating from the low
logic supply. For example, 0–15V CMOS logic can be con-
verted to 0–5V logic when using a 5V supply. The modified
input protection has no diode connected to VCC, thus allow-
ing the input voltage to exceed the supply. The lower zener
diode protects the input from both positive and negative
static voltages. In addition each part can be used as a sim-
ple buffer or inverter without level translation. The
MM74HC4049 is pin and functionally compatible to the
CD4049BC and the MM74HC4050 is compatible to the
CD4050BC
Features
Typical propagation delay: 8 ns
Wide power supply range: 2V–6V
Low quiescent supply current: 20 µA maximum (74HC)
Fanout of 10 LS-TTL loads
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagrams
MM74HC4049 MM74HC4050
Order Number Package Number Package Description
MM74HC4049M M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
MM74HC4049SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC4049MTC MTC16 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide
MM74HC4049N N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
MM74HC4050M M16A 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
MM74HC4050SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC4050MTC MTC16 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153. 4.4mm Wide
MM74HC4050N N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
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MM74HC4049 • MM74HC4050
Absolute Maximum Ratings(Note 1)
(Note 2)
Recommended Operating
Conditions
Note 1: Absolute Maximum Ratings are those values beyond which dam-
age to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating — plastic “N” package:
12 mW/°C from 65°C to 85°C.
DC Electrical Characteristics (Note 4)
Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage cur-
rent (IIN, ICC, IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
Supply Voltage (VCC)0.5 to +7.0V
DC Input Voltage (VIN)1.5 to +18V
DC Output Voltage (VOUT)0.5 to VCC +0.5V
Clamp Diode Current (IZK, IOK)20 mA
DC Output Current, per pin (IOUT)±25 mA
DC VCC or GND Current, per pin (ICC)±50 mA
Storage Temperature Range (TSTG)65°C to +150°C
Power Dissipation (PD)
(Note 3) 600 mW
S.O. Package only 500 mW
Lead Temperature (TL)
(Soldering 10 seconds) 260°C
Min Max Units
Supply Voltage (VCC)26V
DC Input Voltage 0 15 V
(VIN)
DC Output Voltage 0 VCC V
(VOUT)
Operating Temperature Range (TA)40 +85 °C
Input Rise or Fall Times
(tr, tf) VCC
= 2.0V 1000 ns
VCC = 4.5V 500 ns
VCC = 6.0V 400 ns
Symbol Parameter Conditions VCC TA = 25°CT
A = 40°C to 85°CT
A = 55°C to 125°CUnits
Typ Guaranteed Limits
VIH Minimum HIGH Level Input 2.0V 1.5 1.5 1.5 V
Voltage 4.5V 3.15 3.15 3.15 V
6.0V 4.2 4.2 4.2 V
VIL Maximum LOW Level Input 2.0V 0.5 0.5 0.5 V
Voltage 4.5V 1.35 1.35 1.35 V
6.0V 1.8 1.8 1.8 V
VOH Minimum HIGH Level VIN = VIH or VIL
Output Voltage |IOUT| 20 µA 2.0V 2.0 1.9 1.9 1.9 V
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
VIN = VIH or VIL
|IOUT| 4.0 mA 4.5V 4.2 3.98 3.84 3.7 V
|IOUT| 5.2 mA 6.0V 5.7 5.48 5.34 5.2 V
VOL Maximum LOW Level VIN = VIH or VIL
Output Voltage |IOUT| 20 µA 2.0V 0 0.1 0.1 0.1 V
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
VIN = VIH or VIL
|IOUT| 4 mA 4.5V 0.2 0.26 0.33 0.4 V
|IOUT| 5.2 mA 6.0V 0.2 0.26 0.33 0.4 V
IIN Maximum Input Current VIN = VCC or GND 6.0V ±0.1 ±1.0 ±1.0 µA
VIN = 15V 2.0V ±0.5 ±5±5µA
ICC Maximum Quiescent Supply VIN = VCC or GND 6.0V 2.0 20 40 µA
Current IOUT = 0 µA
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MM74HC4049 • MM74HC4050
AC Electrical Characteristics
VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns
AC Electrical Characteristics
VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified)
Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption,
IS = CPD VCC f + ICC.
Symbol Parameter Conditions Typ Guaranteed Units
Limit
tPHL, tPLH Maximum Propagation Delay 8 15 ns
Symbol Parameter Conditions VCC TA = 25°CT
A = 40° to 85°CT
A = 55° to 125°CUnits
Typ Guaranteed Limits
tPHL, tPLH Maximum Propagation 2.0V 30 85 100 130 ns
Delay 4.5V 10 17 20 26 ns
6.0V 9 15 18 22 ns
tTHL, tTLH Maximum Output 2.0V 25 75 95 110 ns
Rise and Fall 4.5V 7 15 19 22 ns
Time 6.0V 6 13 16 19 ns
CPD Power Dissipation (per gate) 25 pF
Capacitance (Note 5)
CIN Maximum Input 5 10 10 10 pF
Capacitance
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MM74HC4049 • MM74HC4050
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
Package Number M16A
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M16D
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5 www.fairchildsemi.com
MM74HC4049 • MM74HC4050
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC16
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MM74HC4049 • MM74HC4050 Hex Inverting Logic Level Down Converter • Hex Logic Level Down Converter
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N16E
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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