DZ2J082x0L Datasheet by Panasonic Electronic Components

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Doc No. TT47EA711550 Revision. 3 Panasonic DZZJ082>
    Product Standards
    Zener Diode
    DZ2J0820L
    Absolute Maximum Ratings Ta = 25 C
    *1 Mounted on glass epoxy print board ( 45 mm 45 mm 1 mm )
    Solder in ( Recommended land pattern )
    *2 Test method : IEC61000_4_2
    ( C = 150 pF, R = 330 , Contact discharge : 10 times )
    Electrical Characteristics Ta = 25 C 3 C
    Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.
    Absolute frequency of input and output is 5 MHz.
    The temperature must be controlled 25 C for VZ mesurement.
    VZ value measured at other temperature must be adjusted to VZ (25 C).
    VZ guaranted 20 ms after current flow Rank classification
    Tj = 25 C to 150 C
    Page
    Code M 0
    Rank M No-rank
    8.618.43
    Marking symbol JU JJ
    VZ 8.03 to 7.79 to
    0.1
    A
    IR VR = 5 V
    mW
    Operating ambient temperature Topr -40 to C
    C
    ESD
    +150
    +85
    8
    Total power dissipation *1 PT 200
    Junction temperature Tj 150
    Electrostatic discharge *2
    C
    Repetitive peak forward current IFRM 200 mA
    Storage temperature Tstg -55 to
    kV
    SZ IZ = 5 mA
    Zener voltage *1, *2 VZ IZ = 5 mA
    Zener operating resistance RZ IZ = 5 mA
    Reverse current
    Packaging
    Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
    Parameter Symbol Rating Unit
    (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
    Marking Symbol: JJ or JU
    Code
    1. Cathode
    ―
    Panasonic
    DZ2J0820L
    Silicon epitaxial planar type
    For constant voltage / For surge absorption circuit
    Features
    Low zener operating resistance Rz
    Excellent rising characteristics of zener current Iz
    Halogen-free / RoHS compliant
    SMini2-F5-B
    JEITA SC-90A
    2. Anode
    1of4
    Unit: mm
    Min Typ
    V
    Parameter Symbol Conditions
    Forward voltage VF IF = 10 mA
    Unit
    7.79
    Max
    8.61
    1.0
    Internal Connection
    4.7 mV/C
    V
    20
    60
    Zener rise operating resistance RZK IZ = 0.5 mA
    Note)
    Note) 1.
    2.
    Temperature coefficient of zener voltage *3
    *3
    3. *1
    *2
    2.5
    1.25
    0.7
    1.7
    0.13
    0.35
    0.5
    2
    1
    1
    2
    Doc No.
    TT4-EA-11550
    Revision.
    3
    Established
    2009-10-14
    Revised
    2013-07-04
    Doc No‘ TT47EA711550 Revision 3 Panasonic D22J082x0L Technical Data 1 reference 1 Established : 2009710714 Revised : 2013707704
    Product Standards
    Zener Diode
    DZ2J0820L
    Technical Data ( reference )
    Page 2 of 4
    PT - Ta
    0
    50
    100
    150
    200
    250
    0 20 40 60 80 100 120 140 160 180 200
    Ambient temperature Ta (°C)
    Total power dissipation PT (mW)
    Mounted on glass epoxy print board.
    Board size : 45 mm × 45 mm x 1 mm
    Solder in : land pattern
    IF - VF
    1.E-06
    1.E-05
    1.E-04
    1.E-03
    1.E-02
    1.E-01
    1.E+00
    0.0 0.2 0.4 0.6 0.8 1.0 1.2
    Forward voltage VF (V)
    Forward current IF (A)
    Ta = 25 °C
    IR - VR
    1.E-12
    1.E-11
    1.E-10
    1.E-09
    1.E-08
    1.E-07
    1.E-06
    012345
    Reverse voltage VR (V)
    Reverse current IR (A)
    Ta = 25 °C
    IZ - VZ
    1.E-06
    1.E-05
    1.E-04
    1.E-03
    1.E-02
    1.E-01
    4 6 8 10 12 14
    Zener voltage VZ (V)
    Zener current IZ (A)
    Ta = 125 °C
    85 °C
    -40 °C
    25 °C
    SZ - IZ
    0
    2
    4
    6
    8
    10
    0246810
    Zener current IZ (mA)
    Temparature coefficient of zener
    voltage SZ (mV/°C)
    RZ - IZ
    1
    10
    0.0001 0.001 0.01 0.1
    Zener current IZ (A)
    Zener operating resistance RZ )
    Ta = 25 °C
    Doc No.
    TT4-EA-11550
    Revision.
    3
    Established
    2009-10-14
    Revised
    2013-07-04
    Doc No‘ TT47EA711550 Revision 3 Panasonic D22J082x0L Technical Data 1 reference 1 Established : 2009710714 Revised : 2013707704
    Product Standards
    Zener Diode
    DZ2J0820L
    Technical Data ( reference )
    Page 3 of 4
    Rth - t
    1
    10
    100
    1000
    0.001 0.01 0.1 1 10 100 1000
    Time t (s)
    Thermal resistance Rth (°C/W)
    (1)
    Rth(j-l) = 80 °C/W
    (1) Non-heat sink
    (2) Mounted on glass epoxy print board.
    Board size : 45 mm × 45 mm x 1 mm
    Solder in : land pattern
    (2)
    PZSM - tw
    0.1
    1
    10
    100
    100 1000 10000
    Pulse width tw (μs)
    Non-repetitive reverse surge power
    dissipation PZSM (W)
    Ta = 25 °C
    Ct - VR
    0
    5
    10
    15
    20
    25
    30
    35
    40
    02468
    Reverse voltage VR (V)
    Terminal capacitance Ct (pF)
    Ta = 25 °C
    f = 1 MHz
    Doc No.
    TT4-EA-11550
    Revision.
    3
    Established
    2009-10-14
    Revised
    2013-07-04
    Doc No. TT47EA711550 Revision. 3 Panasonic DZZJOBZxOL V—‘\ ‘H’ Established : 2009710714 Revised : 2013707704
    Product Standards
    Zener Diode
    DZ2J0820L
    Unit: mm
    Page
    SMini2-F5-B
    4
    4of
    Land Pattern (Reference) (Unit: mm)
    2.5±0.2
    0.35±0.05
    0.50±0.05
    0.13+0.05
    -0.02
    0.4±0.1
    0.7±0.1
    (0.15)
    1.25±0.10
    1.7±0.1
    (5°)
    (5°)
    0 to 0.05
    1
    2
    2.4
    0.90.9
    1.1
    0.9
    Doc No.
    TT4-EA-11550
    Revision.
    3
    Established
    2009-10-14
    Revised
    2013-07-04
    Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents. the laws and regulations of the exporting country. espeCially. those With regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore. no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment. communications equipment. measuring instruments and household appliances), or for specific applications as expressly stated in this book. Please consult with our sales staff in advance for information on the following applications. moreover please exchange documents separately on terms of use etc,: Special applications (such as for in-vehicle equipment. airplanes. aerospace. automotive equipment. traffic signaling equipment. combustion equipment. medical equipment and safety devices) in which exceptional quality and reliability are required. or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Unless exchanging documents on terms of use etc. in advance. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application. (4) The products and product speCifications described in this book are subject to change wtthout notice for modification and/or improvement, At the final stage of your design. purchasing. or use of the products, therefore. ask for the most up- to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially. please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode»switching. Other- wtse. we Will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design. arresting the spread of tire or preventing glitch are recommended in order to prevent physical injury. fire. somal damages. for example. by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD. EOS. thermal stress and mechanical stress) at the time of handling. mounting or at customer's process. We do not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board. When using products for which damp-proof packing is required. satisfy the conditions. such as shelf life and the elapsed time since first opening the packages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of request from the resale destination. please understand that customers will bear the burden. (B) This book may be not reprinted or reproduced whether wholly or partially. without the prior written permission of our company.
    Request for your special attention and precautions
    in using the technical information and semiconductors described in this book
    (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
    laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
    (2) The technical information described in this book is intended only to show the main characteristics and application circuit
    examples of the products. No license is granted in and to any intellectual property right or other right owned by
    Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the
    infringement upon any such right owned by any other company which may arise as a result of the use of technical
    information de-scribed in this book.
    (3) The products described in this book are intended to be used for general applications (such as office equipment,
    communications equipment, measuring instruments and household appliances), or for specific applications as expressly
    stated in this book.
    Please consult with our sales staff in advance for information on the following applications, moreover please exchange
    documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,
    automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
    which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly
    jeopardize life or harm the human body.
    Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
    responsible for any damage incurred as a result of or in connection with your using the products described in this book
    for any special application.
    (4) The products and product specifications described in this book are subject to change without notice for modification
    and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-
    to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
    (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
    conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
    the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other-
    wise, we will not be liable for any defect which may arise later in your equipment.
    Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
    and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
    arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
    for example, by using the products.
    (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
    (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do
    not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
    When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
    time since first opening the packages.
    (7) When reselling products described in this book to other companies without our permission and receiving any claim of
    request from the resale destination, please understand that customers will bear the burden.
    (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
    company.
    No.010618

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