‘ Mlcgcmp RE46C100
@390
2009-2014 Microchip Technology Inc. DS20002166B-page 1
RE46C100
Features:
• Low Quiescent Current (< 100 nA)
• Low Driver RON – 20typical at 9V
• Wide Operating Voltage Range
• Available in 8-pin DFN, PDIP and SOIC packages
General Description:
The RE46C100 devices are intended for applications
using a self oscillating piezoelectric horn, although it
can be used in direct drive applications. Feedback
control and a driver circuit are provided, as well as a
horn enable function.
The RE46C100 is intended for use in smoke detectors,
CO detectors, personal security products and
electronic toys.
Package Types
Functional Block Diagram
HRNEN
5
6
7
8
HORNS
VSS
HORNB
1
2
3
4
NC
NC
FEED
VDD
RE46C100
PDIP, SOIC
RE46C100
2x3 DFN*
* Includes Exposed Thermal Pad (EP); see Tab le 2- 1.
NC
VDD
FEED
HORNS
HORNB
1
2
3
4
8
7
6
5
VSS
HRNENNC
EP
9
8
2
56
4
7
HRNEN
VDD
VSS
FEED
HORNS
HORNB
Piezoelectric Horn Driver Circuit
RE46C100
DS20002166B-page 2 2009-2014 Microchip Technology Inc.
Typical Application
1
2
3
4
8
7
6
5
RE46C100
Horn Enable
Active High
9V
Battery
+
-
C2(1)
1 µF
R3
1.5 MΩ
R4
220 kΩ C1
0.001 µF
Note 1: Place C2 close to the device power pins to minimize horn switching noise.
2009-2014 Microchip Technology Inc. DS20002166B-page 3
RE46C100
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage.............................................................. VDD =18V
Input Voltage Range Except FEED, TEST ....... V
IN
= -0.3V to V
DD
+0.3V
FEED Input Voltage Range ........................... VINFD =-10 to +22V
Input Current except FEED ......................................... IIN =10mA
Operating Temperature......................................TA= -40 to +85°C
Storage Temperature ...................................TSTG = -55 to +125°C
Maximum Junction Temperature ............................... TJ= +150°C
† Notice: Stresses above those listed under “Maximum
ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at these or any other conditions above those
indicated in the operation listings of this specification is
not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
DC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA=+25°C, V
DD =9V,
Typical Application.
Parameter Symbol Test
Pin Min. Typ. Max. Units Conditions
Supply Voltage VDD 26 9 16VOperating
Supply Current IDD1 2 — — 100 nA HRNEN = 0V, FEED = 0V
Input Voltage Low VIL1 8— — 1 V
Input Voltage High VIH1 82.3 — — V
Input Leakage Low IIL1 8— —-100nAV
IN =V
SS
ILFD 4 — — -50 µA FEED = -10V
Input Leakage High IIH1 8 — — 100 nA VIN =V
DD
IHFD 4— — 50µAFEED=22V
Output Voltage Low VOL1 6, 7 — 0.3 0.5 V IOL =16mA
VOL2 6, 7 — — 0.9 V IOL =16mA, V
DD =7.2V
Output Voltage High VOH1 6, 7 8.5 8.7 — V IOH=-16mA
VOH2 6, 7 6.3 — — V IOH =-16mA, V
DD =7.2V
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all parameters apply at TA=+25°C, V
DD =9V,
Typical Application.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Temperature Range TA-40 — +85 °C
Storage Temperature Range TSTG -55 — +125 °C
Thermal Package Resistances
Thermal Resistance, 8L 2x3 DFN θJA —75—°C/W
Thermal Resistance, 8L-PDIP θJA — 89.3 — °C/W
Thermal Resistance, 8L-SOIC θJA — 149.5 — °C/W
RE46C100
DS20002166B-page 4 2009-2014 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Tab le 2-1 .
TABLE 2-1: PIN FUNCTION TABLE
RE46C100
PDIP, SOIC
RE46C100
DFN Symbol Description
1 1 NC No connection
22V
DD Connect to the positive supply voltage
3 3 NC No connection
4 4 FEED Usually connected to the feedback electrode through a current-limiting resistor.
If not used, this pin must be connected to VDD or VSS.
55V
SS Connect to the negative supply voltage
6 6 HORNB This pin is connected to the metal electrode of a piezoelectric transducer.
7 7 HORNS This pin is a complementary output to HORNB, connected to the ceramic
electrode of the piezoelectric transducer.
8 8 HRNEN This pin enables the horn with a logic high.
— 9 EP Exposed thermal pad. This pad should be connected to VSS.
2009-2014 Microchip Technology Inc. DS20002166B-page 5
RE46C100
3.0 DEVICE DESCRIPTION
The RE46C100 horn driver provides the circuitry
necessary to drive a three-terminal self-oscillating
piezoelectric horn. It can also drive a two-terminal
piezoelectric horn with the FEED pin used as a signal
input. The horn driver provides a push-pull circuit to
drive the horn, as shown in the Typical Application
circuit.
In a self-oscillating application, the FEED pin is
connected to the feedback pin of the piezoelectric horn
through a resistor. To drive a two-terminal piezoelectric
horn with an external signal, the FEED pin should be
used as the external signal input. The horn is enabled
when HRNEN is driven to a logic high and is silenced
when HRNEN is driven to a logic low. The horn output
can be modulated using the HRNEN input.
XXX
YVWN
LNN L»-
aPIN 1 REM fl
F7 W #3 fl W W W fl
RE46C1
P 2
0% 09 M
m LA L; m U LA LA H
H H H H H H H H
XXXXXXXX 46¢
XXXXYYWW SN 1
0% 08‘
UUUU UUUU
NNN
RE46C100
DS20002166B-page 6 2009-2014 Microchip Technology Inc.
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead DFN (2x3x0.9 mm) Example
ADG
420
25
8-Lead PDIP (300 mil) Example
RE46C100
I/P^^^256
1420
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
8-Lead SOIC (3.90 mm) Example
NNN
46C100I
SN^^^1420
256
3
e
8-Lead Plastic Dual Flat, No Lead Package (MC) — 2x3x0.9 mm Body [DFN]
HT
2009-2014 Microchip Technology Inc. DS20002166B-page 7
RE46C100
!""#$%&
'
'
D
N
E
NOTE 1
12
EXPOSED PAD
NOTE 1
21
D2
K
L
E2
N
e
b
A3 A1
A
NOTE 2
BOTTOM VIEW
TOP VIEW
B-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9mm Body [DFN]
W2
>‘l<—g lud1="" silk="" screen="" recommended="" land="" pattern="" unlls="" millimeters="" dlmenslun="" lmnts="" min="" l="" nom="" l="" max="" contact="" pllcl'l="" e="" 0="" 50="" bsc="" optional="" center="" pad="" wldlh="" w2="" 1="" 45="" opttonal="" center="" pad="" lengtn="" t2="" 1="" 75="" comacl="" pad="" spacing="" 01="" 2.90="" centaa="" pad="" wmtn="" (xa)="" x1="" 0="" 30="" contact="" pad="" length="" (x8)="" y1="" o="" 75="" dlstance="" between="" pads="" g="" 0="" 20="" noles'="" i.="" dimensmning="" and="" iolerancmg="" per="" asme="" ym="" 5m="" bsc'="" baslc="" dlmenslun="" thearellcally="" exact="" value="" shawn="" wltncut="" tolerances="" mlctochip="" tecnnology="" drawing="" no="" commas="">RE46C100
DS20002166B-page 8 2009-2014 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2014 Microchip Technology Inc. DS20002166B-page 9
RE46C100
B
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
eB
E
A
A1
A2
L
8X b
8X b1
D
E1
c
C
PLANE
.010 C
12
N
NOTE 1
TOP VIEW
END VIEWSIDE VIEW
e
RE46C100
DS20002166B-page 10 2009-2014 Microchip Technology Inc.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e.100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c.008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b.014 .018 .022
Overall Row Spacing eB - - .430
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
3.
1.
protrusions shall not exceed .010" per side.
2.
4.
Notes:
§
--
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Pin 1 visual index feature may vary, but must be located within the hatched area.
§ Significant Characteristic
Dimensioning and tolerancing per ASME Y14.5M
e
DATUM A DATUM A
e
b
e
2
b
e
2
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
8-Lead Plastic Small Omline (SN) - Narrow, 3.90 mm Body [SOIC]
/// /
”OZ/[’0
2, ‘
Q 0.10 c D ‘ ' ‘
2x
1 2 3
NOTE1 Afij ‘
TOPVIEW
‘ IEI
A A2 fl; NIX
SEAT‘NG PLANE
T
A1 7 SIDE VIEW
VIEW A-A
chmchxp Technology Drawmg No GOA-057C SheeM on
2009-2014 Microchip Technology Inc. DS20002166B-page 11
RE46C100
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
Umts M1LL|METERS
Dimensmn L1m1ls MIN | NOM 1 MAX
Number of Pms N 5
Fuch E 1.27 586
OveraH He1gm A . . 1.75
Molded Package Truckness A2 1 25 - -
Standofl § A1 0 IO . 0.25
OveraH Width E 6 00 BSC
Molded Package wmh E1 3.90 ass
OveraH Length D 4.90 BSC
Chamfer(0pt1ona1) h 0 25 - o 50
Foot Length L o 40 . 1.27
Footpnm L1 1 DA REF
FootAng1e «1 0° . a”
Lead Tmekness c o 17 . o 25
Lead Wldm b 0 31 - 0.51
Mold Drafl Ang1e Top a 5“ . 15“
Mold Drafl Ang‘e Bottom ’9 5° - 15°
Notes:
1 Pm 1 v1sua1 1ndex feature may vary. m1 must be mated wnnm we hatched area
2 § $1gnmeam Characterisuc
3.Dimens1ons D and E1 do rrot inc1ude mo1d11ash or motrusmns Mo1d flash or
protrusions snau na| exceed 0.15mm per s1de.
4.Dlmens1onmg and Iolerancmg perASME Y14.5M
BSC' Basic D1mens1on Theoreveany exectvalue shown w1theut to1erenees
REF Reference D1menslon, usuaHy wumdut td1eranee. 1dr Infmmatmn purposes cmy
M1crochip Technomgy Drawmg No. 00470571: Sheet 2 012
RE46C100
DS20002166B-page 12 2009-2014 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
No|es:
1 Dimensiomng and toierancing per ASME Y‘M 5M
T
\
/— SILK SCREEN
}
D
3
D U}
V1
«X1
RECOMMENDED LAND PATTERN
Units MILLIMETERS
Dimension Limiis MiN \ NOM \ MAX
Coniaci Pilch E 1 27 est:
Contaci Pad Spacing c 5 40
Contact Pad Width (X8) X1 0 60
Contact Pad Length (x3) v1 1 55
556 Basic Dimension Tnaoralicaiiy exaci vaiue snuwn wmnom taierances
Microchip Technology Drawing No. C0472057A
2009-2014 Microchip Technology Inc. DS20002166B-page 13
RE46C100
(")*(++, !""#$%()-&
'
RE46C100
DS20002166B-page 14 2009-2014 Microchip Technology Inc.
NOTES:
2009-2014 Microchip Technology Inc. DS20002166B-page 15
RE46C100
APPENDIX A: REVISION HISTORY
Revision B (June 2014)
The following is the list of modifications:
1. Added new package to the family (2x3 DFN) and
related information throughout the document.
2. Added thermal package resistance information
in Temperature Specifications.
3. Added package markings and drawings for all
packages.
4. Added Product Identification System.
Revision A (May 2009)
• Original Release of this Document.
PART NO.
X
41—4
41x
2009-2014 Microchip Technology Inc. DS20002166B-page 16
RE46C100
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: RE46C100: CMOS Photoelectric Smoke Detector ASIC
RE46C100T: CMOS Photoelectric Smoke Detector ASIC
(Tape and Reel)
Package: D = 8-Lead DFN
E = Plastic Dual In-Line (300 mil Body), 8-lead (PDIP)
S = Plastic Small Outline - Narrow, 3.90 mm Body,
8-Lead (SOIC)
Examples:
a) RE46C100D8F: 8LD DFN Package,
Lead Free
b) RE46C100D8TF: 8LD DFN Package,
Tape and Reel,
Lead Free
c) RE46C100E8F: 8LD PDIP Package,
Lead Free
d) RE46C100S8F: 8LD SOIC Package,
Lead Free
e) RE46C100S8TF: 8LD SOIC Package,
Tape and Reel,
Lead Free
PART NO. X
Device
XX
Number
of Pins
T
Tape
and Reel Free
X
Lead
Package
YSTEM
<2> 2009-2014 Microchip Technology Inc. DS20002166B-page 17
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2009-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-63276-287-0
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘
‘MICRDCHIP
DS20002166B-page 18 2009-2014 Microchip Technology Inc.
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03/25/14
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