B32911x3-16x3 Series Datasheet by EPCOS - TDK Electronics
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Film Capacitors
EMI Suppression Capacitors (MKP)
Series/Type: B32911*3 ... B32916*3
Date: September 2019
© TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto
and the information contained therein without TDK Electronics' prior express consent is prohibited.
@TDK
II
x
3
§
N
69
‘P
m
; N123123123 A
r- xst M 330v~
mm x‘ MKP/SH
40/110/56/5
@0 cNus
KMK154570
Typical applications
X1 class for interference suppression
"Across the line" applications
Climatic
Max. operating temperature: 110 °C
Climatic category (IEC 60068-1:2013):
40/110/56
Construction
Dielectric: polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)
Features
Very small dimensions
Good self-healing properties
High voltage capability
RoHS-compatible
Halogen-free capacitors available on
request
Terminals
Parallel wire leads, lead-free tinned
Special lead lengths available on request
Marking
Manufacturer's logo, lot number,
date code, rated capacitance (coded),
capacitance tolerance (code letter),
rated AC voltage (IEC),
series number, sub-class (X1),
dielectric code (MKP), climatic category,
passive flammability category, approvals.
Delivery mode
Bulk (untaped)
Taped (Ammo pack or reel)
For taping details, refer to chapter
"Taping and packing".
Dimensional drawing
Dimensions in mm
Lead
spacing
±0.4
Lead
diameter
d1±0.05
Type
10 0.6 B32911*3
15 ... 27.5 0.8 B32912*3 ... B32914*3
37.5 1.0 B32916*3
Marking examples
(position of marks may vary):
EMI suppression capacitors (MKP) B32911*3 ... B32916*3
X1/330VAC
Page2of21Please read Cautions and warnings and
Important notes at the end of this document.
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c“
owns
Approvals
Approval
marks
Standards Certificate
EN 60384-14:2014
IEC 60384-14:2013 40032766 (approved by VDE) (C ≤10 μF)
UL 1414:2000
UL 1283:2005 E97863 / E157153
CSA C22.2 No.1:2004
CSA C22.2 No.8:2013 E97863 / E157153 (approved by UL)
UL 60384-14:2014
CSA E60384-14:2013 E97863 (approved by UL)
Notes: Effective January 2014, only for EMI supression capacitors:
UL 60384-14:2014 certification replaces both UL 1414:2000 and UL 1283:2005
standards.
CSA C22.2 No.1.2004 and CSA C22.2 No.8:2013 are replaced by
CSA E60384-14:2013.
References like 1414, 1283 are removed from the capacitor marking.
Capacitors under UL 1414:2000, UL 1283:2005 produced during or before 2013, are
accepted under UL scope.
Capacitors under CSA C22.2 No.1:2004 / CSA C22.2 No.8:2013 produced during or
before 2013, are accepted under cUL scope.
B32911*3 ... B32916*3
X1/330VAC
Page3of21Please read Cautions and warnings and
Important notes at the end of this document.
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Overview of available types
Lead spacing 10 mm 15 mm 22.5 mm 27.5 mm 37.5 mm
Type B32911*3 B32912*3 B32913*3 B32914*3 B32916*3
CR(μF)
0.010
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
B32911*3 ... B32916*3
X1/330VAC
Page4of21Please read Cautions and warnings and
Important notes at the end of this document.
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Ordering codes and packing units
Lead spacing
mm
CR
μF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
Ammo
pack
pcs./MOQ
Reel
pcs./MOQ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code: *** = Packaging code:
M=±20%
K=±10%
289 = Straight terminals, Ammo pack
189 = Straight terminals, Reel
003 = Straight terminals, untaped
(lead length 3.2 ±0.3 mm)
000 = Straight terminals, untaped
(lead length 6 1 mm)
10 0.010 4.0 ×9.0 ×13.0 B32911A3103+*** 4000 6800 4000
0.022 5.0 ×11.0 ×13.0 B32911B3223+*** 3320 5200 4000
0.033 6.0 ×12.0 ×13.0 B32911A3333M*** 2720 4400 4000
15 0.022 5.0 ×10.5 ×18.0 B32912A3223+*** 4680 5200 4000
0.033 5.0 ×10.5 ×18.0 B32912A3333+*** 4680 5200 4000
0.047 5.0 ×10.5 ×18.0 B32912A3473+*** 4680 5200 4000
0.068 6.0 ×11.0 ×18.0 B32912A3683+*** 3840 4400 4000
0.10 7.0 ×12.5 ×18.0 B32912A3104+*** 3320 3600 4000
0.15 7.0 ×12.5 ×18.0 B32912B3154M*** 3320 3600 4000
0.15 8.5 ×14.5 ×18.0 B32912A3154+*** 2720 2800 2000
0.22 8.5 ×14.5 ×18.0 B32912B3224M*** 2720 2800 2000
0.22 9.0 ×17.5 ×18.0 B32912A3224+*** 2560 2800 2000
0.33 9.0 ×17.5 ×18.0 B32912B3334M*** 2560 2800 2000
22.5 0.15 6.0 ×15.0 ×26.5 B32913A3154+*** 2720 2800 2880
0.22 7.0 ×16.0 ×26.5 B32913A3224+*** 2320 2400 2520
0.33 8.5 ×16.5 ×26.5 B32913A3334M*** 1920 2000 2040
0.47 10.5 ×18.5 ×26.5 B32913A3474M*** 1560 1600 2160
B32911*3 ... B32916*3
X1/330VAC
Page5of21Please read Cautions and warnings and
Important notes at the end of this document.
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Ordering codes and packing units
Lead spacing
mm
CR
μF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
Ammo
pack
pcs./MOQ
Reel
pcs./MOQ
Untaped
pcs./MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code: *** = Packaging code:
M=±20%
K=±10%
289 = Straight terminals, Ammo pack
189 = Straight terminals, Reel
003 = Straight terminals, untaped
(lead length 3.2 ±0.3 mm)
000 = Straight terminals, untaped
(lead length 6 1 mm)
27.5 0.47 11.0 ×21.0 ×31.5 B32914A3474+*** 1400 1280
0.68 11.0 ×21.0 ×31.5 B32914B3684+*** 1400 1280
1.0 13.5 ×23.0 ×31.5 B32914A3105+*** 1000 1040
1.5 18.0 ×27.5 ×31.5 B32914A3155+*** 800
2.2 19.0 ×30.0 ×31.5 B32914A3225M*** 720
37.5 3.3 18.0 ×32.5 ×41.5 B32916A3335M*** 720
4.7 20.0 ×39.5 ×42.0 B32916A3475M*** 640
6.8 28.0 ×42.5 ×42.0 B32916A3685M*** 440
B32911*3 ... B32916*3
X1/330VAC
Page6of21Please read Cautions and warnings and
Important notes at the end of this document.
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Technical data
Reference standard: IEC 60384-14:2013 / UL 60384-14:2014.
All data given atT=20°C, unless otherwise specified.
Rated AC voltage
(IEC 60384-14:2013)
330 V (50/60 Hz)
Maximum continuous DC voltage VDC 760 V
Max. operating temperature Top,max +110 °C
DC test voltage 2500 V, 2 s
The repetition of this DC voltage test may damage the capacitor. Special care must be taken in
case of use several capacitors in a parallel configuration.
Dissipation factor tan δ(in 10-3)
at 20 °C (upper limit values)
at CR≤2.2 μF CR> 2.2 μF
1 kHz 1 2
Insulation resistance Rins or time constant
τ=C
RRins at 100 V DC, 20 °C,
rel. humidity ≤65% and for 60 s
(minimum as-delivered values)
CR≤0.33 μF CR> 0.33 μF
100 000 MΩ30 000 s
Passive flammability category B
Capacitance tolerances (measured at 1 kHz) ±10% (K), ±20% (M)
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/μs.
"k0" represents the maximum permissible pulse characteristic of the waveform applied to the
capacitor, expressed in V2/μs.
Note:
The values of dV/dt and k0provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt and k0values
Lead spacing 10 mm 15 mm 22.5 mm 27.5 mm 37.5 mm
dV/dt in V/μs 550 400 200 150 100
k0in V2/μs 473 000 344 000 172 000 129 000 86 000
B32911*3 ... B32916*3
X1/330VAC
Page7of21Please read Cautions and warnings and
Important notes at the end of this document.
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Testing and Standards
Test Reference Conditions of test Performance requirements
Electrical
parameters
IEC
60384-14:2013
Voltage Proof:
Between terminals,
4.3 VR, 1 min.
Terminals and enclosure:
2V
R+1500VAC
Insulation resistance, Rins
Capacitance, C
Dissipation factor, tan δ
Within specified limits
Robustness
of termina-
tions
IEC
60068-2-21:2006
Tensile strength (test Ua1) Capacitance and tan δ
within specified limits
Wire diameter Tensile
force
0.5 < d1≤0.8 mm
0.8 < d1≤1.25 mm
10 N
20 N
Resistance
to soldering
heat
IEC
60068-2-20:2008,
test Tb,
method 1A
Solder bath temperature at
260 ±5°C, immersion for
10 seconds
ΔC/C0≤5%
tan δwithin specified limits
Rapid
change of
temperature
IEC
60384-14:2013
TA= lower category temperature
TB= upper category temperature
Five cycles, duration t = 30 min.
No visible damage
ΔC/C0≤5%
tan δwithin specified limits
Vibration IEC
60384-14:2013
Test FC: vibration sinusoidal
Displacement: 0.75 mm
Accleration: 98 m/s2
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
2 hours each axe
No visible damage
Bump IEC
60384-14:2013
Test Eb: Total 4000 bumps with
400 m/s2mounted on PCB
6 ms duration
No visible damage
ΔC/C0≤5%
tan δwithin specified limits
Climatic
sequence
IEC
60384-14:2013
Dry heat Tb / 16 h
Damp heat cyclic, 1st cycle
+55 °C / 24 h / 95% ... 100% RH
Cold Ta/2h
Damp heat cyclic, 5 cycles
+55 °C / 24 h / 95% ... 100% RH
No visible damage
ΔC/C0≤5%
Δtan δ≤0.008 for C ≤1μF
Δtan δ≤0.005 forC>1μF
Voltage proof
Rins ≥50% of initial limit
B32911*3 ... B32916*3
X1/330VAC
Page8of21Please read Cautions and warnings and
Important notes at the end of this document.
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Test Reference Conditions of test Performance requirements
Damp heat,
steady
state
IEC
60384-14:2013
Test Ca
40 °C / 93% RH / 56 days
No visible damage
ΔC/C0≤5%
Δtan δ≤0.008 for C ≤1μF
Δtan δ≤0.005 forC>1μF
Voltage proof
Rins ≥50% of initial limit
Impulse
test
Endurance
IEC
60384-14:2013
3 impulses
Tb / 1.25 VR/ 1000 hours,
1000 VRMS for 0.1 s every hour
No visible damage
ΔC/C0≤10%
Δtan δ≤0.008 for C ≤1μF
Δtan δ≤0.005 forC>1μF
Voltage proof
Rins ≥50% of initial limit
Passive
flammability
IEC
60384-14:2013
Flame applied for a period of
time depending on capacitor
volume
B
Active
flammability
IEC
60384-14:2013
20 discharges at 2.5 kV + VRThe cheesecloth shall not
burn with a flame
Mounting guidelines
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature 235 ±5°C
Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspection Wetting of wire surface by new solder ≥90%,
free-flowing solder
B32911*3 ... B32916*3
X1/330VAC
Page9of21Please read Cautions and warnings and
Important notes at the end of this document.
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KMK12427V
300 ‘
T C ‘/ 260 C, 4 s
250
W 200 \
150
100
50
0 50 100 150 200 S 250
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1.
Conditions:
Series Solder bath temperature Soldering time
MKT boxed (except 2.5 ×6.5 ×7.2 mm)
coated
uncoated (lead spacing >10 mm)
260 ±5°C 10 ±1s
MFP
MKP (lead spacing >7.5 mm)
MKT boxed (case 2.5 ×6.5 ×7.2 mm) 5±1s
MKP
MKT
(lead spacing ≤7.5 mm)
uncoated (lead spacing ≤10 mm)
insulated (B32559)
<4 s
recommended soldering
profile for MKT uncoated
(lead spacing ≤10 mm) and
insulated (B32559)
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between
capacitor body and liquid solder
Evaluation criteria:
Visual inspection No visible damage
ΔC/C0
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
tan δAs specified in sectional specification
B32911*3 ... B32916*3
X1/330VAC
Page 10 of 21Please read Cautions and warnings and
Important notes at the end of this document.
I
I
I
I
I
I
I
Temperalure Tolal conlacl < 10="" s="" cc="" +=""><7 250,,5="" ,="" 77777777777="" 7="" 7="" 7="" maximum="" solder="" 7="" temperature="" wave="" soldering="" profile="" ts="" i="" \\="" \="" \="" t”="" x="" r="" \\="" capacnor="" body="" ,="" \lemperature="" ls="" \\="" \="" \="" z="" z="" ’="" pre-healing="" 7="" time="" 0="">< 150="" 5="" ts:="" capaciior="" body="" maximum="" temperature="" al="" wave="" soldering="" tp:="" capacitor="" body="" maximum="" temperature="" at="" pre-heallng="" kmkl="" 745-a-e="" @tdk="">1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
Recommendations
As a reference, the recommended wave soldering profile for our film capacitors is as follows:
B32911*3 ... B32916*3
X1/330VAC
Page 11 of 21Please read Cautions and warnings and
Important notes at the end of this document.
H
Body temperature
sensor position
KMKV 744-9-E
@TDK
Body temperature should follow the description below:
MKP capacitor
During pre-heating: Tp≤110 °C
During soldering: Ts≤120 °C, ts≤45 s
MKT capacitor
During pre-heating: Tp≤125 °C
During soldering: Ts≤160 °C, ts≤45 s
When SMD components are used together with leaded ones, the film capacitors should not pass
into the SMD adhesive curing oven. The leaded components should be assembled after the SMD
curing step.
Leaded film capacitors are not suitable for reflow soldering.
In order to ensure proper conditions for manual or selective soldering, the body temperature of
the capacitor (Ts) must be ≤120 °C.
One recommended condition for manual soldering is that the tip of the soldering iron should
be <360 °C and the soldering contact time should be no longer than 3 seconds.
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please refer to our Film Capacitors Data Book in case more details are needed.
B32911*3 ... B32916*3
X1/330VAC
Page 12 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Application
KMK! 3357er
App‘ication
KMK1337-G-E
@TDK
Application note for the different possible X1 / X2 positions
In series with the powerline
(i.e. capacitive power supply)
Typical Applications:
Power meters
ECUs for white goods and household
appliances
Different sensor applications
Severe ambient conditions
In parallel with the powerline
Typical Applications:
Standard X2 are used parallel over the mains for
reducing electromagnetic interferences coming
from the grid. For such purposes they must meet
the applicable EMC directives and standards.
Basic circuit Basic circuit
Required features
High capacitance stability over the lifetime
Narrow tolerances for a controlled current
supply
Required features
Standard safety approvals
(ENEC, UL, CSA, CQC)
High pulse load capability
Withstand surge voltages
Recommended product series
B3293* (305 V AC) heavy duty with
EN approval for X2 (UL Q1/2010)
B3265* MKP series
standard MKP capacitor without safety
approvals
B3267*L MKP series
standard MKP capacitor without safety
approvals
B3292*H/J (305 V AC), severe ambient
condition, approved as X2
Recommended product series
B3292*C/D (305 V AC)
standard series, approved as X2
B3291* (330 V AC), approved as X1
B3291* (530 V AC), approved as X1
B3291* (550 V AC), approved as X1
B3292*H/J (305 V AC), severe ambient
condition, approved as X2
B32911*3 ... B32916*3
X1/330VAC
Page 13 of 21Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
Consult us if application is with severe temperature and humidity condition.
There are no serviceable or repairable parts inside the capacitor. Opening the capacitor or
any attempts to open or repair the capacitor will void the warranty and liability of
TDK Electronics.
Please note that the standards referred to in this publication may have been revised in the
meantime.
The table below summarizes the safety instructions that must always be observed. A detailed
description can be found in the relevant sections of the chapters "General technical information"
and "Mounting guidelines".
Topic Safety information Reference chapter
"General technical
information"
Storage
conditions
Make sure that capacitors are stored within the
specified range of time, temperature and humidity
conditions.
4.5
"Storage conditions"
Flammability Avoid external energy, such as fire or electricity
(passive flammability), avoid overload of the capacitors
(active flammability) and consider the flammability of
materials.
5.3
"Flammability"
Resistance to
vibration
Do not exceed the tested ability to withstand vibration.
The capacitors are tested to IEC 60068-2-6:2007.
TDK Electronics offers film capacitors specially
designed for operation under more severe vibration
regimes such as those found in automotive
applications. Consult our catalog "Film Capacitors for
Automotive Electronics".
5.2
"Resistance to
vibration"
B32911*3 ... B32916*3
X1/330VAC
Page 14 of 21Please read Cautions and warnings and
Important notes at the end of this document.
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Topic Safety information Reference chapter
"Mounting guidelines"
Soldering Do not exceed the specified time or temperature limits
during soldering.
1 "Soldering"
Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"
Embedding of
capacitors in
finished
assemblies
When embedding finished circuit assemblies in plastic
resins, chemical and thermal influences must be taken
into account.
Caution: Consult us first, if you also wish to embed
other uncoated component types!
3 "Embedding of
capacitors in finished
assemblies"
Design of our capacitors
Our EMI capacitors use polypropylene (PP) film metalized with a thin layer of Zinc (Zn).
The following key points have made this design suitable to IEC/UL testing, holding a minimum
size.
Overvoltage AC capability with very high temperature Endurance test of IEC 60384-14:2013
(4th edition) / UL 60384-14:2014 (2nd edition) must be performed at 1.25 ×VRat maximum tem-
perature, during 1000 hours, with a capacitance drift less than 10%.
Higher breakdown voltage withstanding if compared to other film metallizations, like Aluminum.
IEC 60384-14:2013 (4th edition) / UL 60384-14:2014 (2nd edition) establishes high voltage tests
performed at 4.3 ×VR1 minute, impulse testing at 2500 V for C = 1 μF and active flammability
tests.
Damp heat steady state: 40 °C/ 93% RH / 56 days. (without voltage or current load)
Effect of humidity on capacitance stability
Long contact of a film capacitor with humidity can produce irreversible effects. Direct contact with
liquid water or excess exposure to high ambient humidity or dew will eventually remove the film
metallization and thus destroy the capacitor. Plastic boxed capacitors must be properly tested in
the final application at the worst expected conditions of temperature and humidity in order to
check if any parameter drift may provoke a circuit malfunction.
In case of penetration of humidity through the film, the layer of Zinc can be degraded, specially
under AC operation (change of polarity), accelerated by the temperature, provoking an increment
of the serial resistance of the electrode and eventually a reduction of the capacitance value.
For DC operation, the parameter drift is much less.
Plastic boxes and resins can not protect 100% against humidity. Metal enclosures, resin potting or
coatings or similar measures by customers in their applications will offer additional protection
against humidity penetration.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets,
data books, other publications, on the company website, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the order-
B32911*3 ... B32916*3
X1/330VAC
Page 15 of 21Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
ing codes are due to different processes employed and do not affect the specifications of the re-
spective products.
Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.
B32911*3 ... B32916*3
X1/330VAC
Page 16 of 21Please read Cautions and warnings and
Important notes at the end of this document.
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Symbols and terms
Symbol English German
αHeat transfer coefficient Wärmeübergangszahl
αCTemperature coefficient of capacitance Temperaturkoeffizient der Kapazität
ACapacitor surface area Kondensatoroberfläche
βCHumidity coefficient of capacitance Feuchtekoeffizient der Kapazität
CCapacitance Kapazität
CRRated capacitance Nennkapazität
ΔCAbsolute capacitance change Absolute Kapazitätsänderung
ΔC/C Relative capacitance change (relative
deviation of actual value)
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
ΔC/CRCapacitance tolerance (relative deviation
from rated capacitance)
Kapazitätstoleranz (relative Abweichung
vom Nennwert)
dt Time differential Differentielle Zeit
ΔtTime interval Zeitintervall
ΔTAbsolute temperature change
(self-heating)
Absolute Temperaturänderung
(Selbsterwärmung)
Δtan δAbsolute change of dissipation factor Absolute Änderung des Verlustfaktors
ΔVAbsolute voltage change Absolute Spannungsänderung
dV/dt Time differential of voltage function (rate
of voltage rise)
Differentielle Spannungsänderung
(Spannungsflankensteilheit)
ΔV/ΔtVoltage change per time interval Spannungsänderung pro Zeitintervall
EActivation energy for diffusion Aktivierungsenergie zur Diffusion
ESL Self-inductance Eigeninduktivität
ESR Equivalent series resistance Ersatz-Serienwiderstand
fFrequency Frequenz
f1Frequency limit for reducing permissible
AC voltage due to thermal limits
Grenzfrequenz für thermisch bedingte
Reduzierung der zulässigen
Wechselspannung
f2Frequency limit for reducing permissible
AC voltage due to current limit
Grenzfrequenz für strombedingte
Reduzierung der zulässigen
Wechselspannung
frResonant frequency Resonanzfrequenz
FDThermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FTDerating factor Deratingfaktor
iCurrent (peak) Stromspitze
ICCategory current (max. continuous
current)
Kategoriestrom (max. Dauerstrom)
B32911*3 ... B32916*3
X1/330VAC
Page 17 of 21Please read Cautions and warnings and
Important notes at the end of this document.
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Symbol English German
IRMS (Sinusoidal) alternating current,
root-mean-square value
(Sinusförmiger) Wechselstrom
izCapacitance drift Inkonstanz der Kapazität
k0Pulse characteristic Impulskennwert
LSSeries inductance Serieninduktivität
λFailure rate Ausfallrate
λ0Constant failure rate during useful
service life
Konstante Ausfallrate in der
Nutzungsphase
λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate
Pdiss Dissipated power Abgegebene Verlustleistung
Pgen Generated power Erzeugte Verlustleistung
QHeat energy Wärmeenergie
ρDensity of water vapor in air Dichte von Wasserdampf in Luft
RUniversal molar constant for gases Allg. Molarkonstante für Gas
ROhmic resistance of discharge circuit Ohmscher Widerstand des
Entladekreises
RiInternal resistance Innenwiderstand
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RSSeries resistance Serienwiderstand
Sseverity (humidity test) Schärfegrad (Feuchtetest)
tTime Zeit
TTemperature Temperatur
τTime constant Zeitkonstante
tan δDissipation factor Verlustfaktor
tan δDDielectric component of dissipation
factor
Dielektrischer Anteil des Verlustfaktors
tan δPParallel component of dissipation factor Parallelanteil des Verlfustfaktors
tan δSSeries component of dissipation factor Serienanteil des Verlustfaktors
TATemperature of the air surrounding the
component
Temperatur der Luft, die das Bauteil
umgibt
Tmax Upper category temperature Obere Kategorietemperatur
Tmin Lower category temperature Untere Kategorietemperatur
tOL Operating life at operating temperature
and voltage
Betriebszeit bei Betriebstemperatur und
-spannung
Top Operating temperature, TA+ΔT Beriebstemperatur, TA+ΔT
TRRated temperature Nenntemperatur
Tref Reference temperature Referenztemperatur
tSL Reference service life Referenz-Lebensdauer
B32911*3 ... B32916*3
X1/330VAC
Page 18 of 21Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Symbol English German
VAC AC voltage Wechselspannung
VCCategory voltage Kategoriespannung
VC,RMS Category AC voltage (Sinusförmige)
Kategorie-Wechselspannung
VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung
Vch Charging voltage Ladespannung
VDC DC voltage Gleichspannung
VFB Fly-back capacitor voltage Spannung (Flyback)
ViInput voltage Eingangsspannung
VoOutput voltage Ausgangssspannung
Vop Operating voltage Betriebsspannung
VpPeak pulse voltage Impuls-Spitzenspannung
Vpp Peak-to-peak voltage Impedance Spannungshub
VRRated voltage Nennspannung
RAmplitude of rated AC voltage Amplitude der Nenn-Wechselspannung
VRMS (Sinusoidal) alternating voltage,
root-mean-square value
(Sinusförmige) Wechselspannung
VSC S-correction voltage Spannung bei Anwendung "S-correction"
Vsn Snubber capacitor voltage Spannung bei Anwendung
"Beschaltung"
ZImpedance Scheinwiderstand
Lead spacing Rastermaß
B32911*3 ... B32916*3
X1/330VAC
Page 19 of 21Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, we are either unfamiliar with individual customer applications or less familiar with
them than the customers themselves. For these reasons, it is always ultimately incumbent on
the customer to check and decide whether a product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have
any more detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General
Terms and Conditions of Supply.
Important notes
Page 20 of 21
@TDK
7. Our manufacturing sites serving the automotive business apply the IATF 16949
standard. The IATF certifications confirm our compliance with requirements regarding the
quality management system in the automotive industry. Referring to customer requirements
and customer specific requirements (“CSR”) TDK always has and will continue to have the
policy of respecting individual agreements. Even if IATF 16949 may appear to support the
acceptance of unilateral requirements, we hereby like to emphasize that only requirements
mutually agreed upon can and will be implemented in our Quality Management System.
For clarification purposes we like to point out that obligations from IATF 16949 shall only
become legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and
in other countries. Further information will be found on the Internet at
www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
Important notes
Page 21 of 21
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