DMB53D0UV Datasheet by Diodes Incorporated

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7| 7| I—I Q * % “ .|_| U U H [—| TI .|_| L] U DMB53DOUV 1 017 Document number 0531651 Rev 772 www.diodes.com
DMB53D0UV
Document number: DS31651 Rev. 7 - 2
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DMB53D0UV
N-CHANNEL ENHANCEMENT MODE MOSFET PLUS NPN TRANSISTOR
Features
N-Channel MOSFET and NPN Transistor in One Package
Low On-Resistance
Very Low Gate Threshold Voltage, 1.0V max
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Ultra-Small Surface Mount Package
ESD Protected MOSFET Gate up to 2kV
Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT563
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish - Matte Tin annealed over Copper lead frame.
Solderable per MIL-STD-202, Method 208
Weight: 0.006 grams (approximate)
Ordering Information (Note 3)
Part Number Case Packaging
DMB53D0UV-7 SOT563 3000/Tape & Reel
DMB53D0UV-13 SOT563 10000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code V W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
E
D
2
S
2
Q
1
G
2
Q
2
B
C
MB1 = Marking Code
YM = Date Code Marking
Y = Year (ex: V = 2008)
M = Month (ex: 9 = September)
MB1
Y
M
SOT563
Top View Top View
Internal Schematic
Bottom View
ESD PROTECTED TO 2kV
m5” DMBSSDOUV 2007 Ducumenl number 0531651 Rev 772 www.diodes.cnm
DMB53D0UV
Document number: DS31651 Rev. 7 - 2
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DMB53D0UV
Maximum Ratings – MOSFET, Q1 @TA = 25°C unless otherwise specified
Characteristic Symbol Value Units
Drain-Source Voltage VDSS 50 V
Gate-Source Voltage VGSS ±12 V
Drain Current (Note 4) Continuous ID 160 mA
Pulsed Drain Current (Note 4) IDM 560 mA
Maximum Ratings - NPN Transistor, Q2 @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage VCBO 50 V
Collector-Emitter Voltage VCEO 45 V
Emitter-Base Voltage VEBO 6.0 V
Collector Current IC 100 mA
Thermal Characteristics, Total Device @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Total Power Dissipation (Note 1) PD 250 mW
Thermal Resistance, Junction to Ambient (Note 1) R
θ
JA 500 °C/W
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Electrical Characteristics - MOSFET @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage BVDSS 50 V VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current IDSS 10 μA VDS = 50V, VGS = 0V
Gate-Body Leakage IGSS 1.0
5.0 μA VGS = ±8V, VDS = 0V
VGS = ±12V, VDS = 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage VGS
(
th
)
0.7 0.8 1.0 V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance RDS (ON) 3.1 4 Ω VGS = 4V, ID = 100mA
4 5 VGS = 2.5V, ID = 80mA
Forward Transconductance gFS 180 mS VDS = 10V, ID = 100mA,
f = 1.0KHz
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance Ciss 25 pF VDS = 10V, VGS = 0V,
f = 1.0MHz
Output Capacitance Coss 5 pF
Reverse Transfer Capacitance Crss 2.1 pF
Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to product testing.
m5” amcao ER E0 an we hFE CURRENT DR N CURR T DR DMB53DOUV 3M7 Mavch 2012 Document number Dsatsm Hey 7 , 2 www.dlodes.com ©Dmdes hvcmpavaled
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Electrical Characteristics - NPN Transistor @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage (Note 5) V
(
BR
)
CBO 50 — V
IC = 10μA, IB = 0
Collector-Emitter Breakdown Voltage (Note 5) V
(
BR
)
CEO 45 — V
IC = 10mA, IB = 0
Emitter-Base Breakdown Voltage (Note 5) V
(
BR
)
EBO 6 — V
IE = 1μA, IC = 0
DC Current Gain (Note 5) hFE 200 290 450
VCE = 5.0V, IC = 2.0mA
Collector-Emitter Saturation Voltage (Note 5) VCE(SAT) — —
100
300 mV IC = 10mA, IB = 0.5mA
IC = 100mA, IB = 5.0mA
Base-Emitter Saturation Voltage (Note 5) VBE(SAT) 700
900 — mV
IC = 10mA, IB = 0.5mA
IC = 100mA, IB = 5.0mA
Base-Emitter Voltage (Note 5) VBE 580
660
700
770 mV VCE = 5.0V, IC = 2.0mA
VCE = 5.0V, IC = 10mA
Collector-Cutoff Current (Note 5) ICBO
ICBO — — 15
5.0 nA
µA VCB = 30V
VCB = 30V, TA = 150°C
Collector-Emitter Cut-Off Current (Note 5) ICES — — 100 nA
VCE = 45V
Gain Bandwidth Product fT 100 — MHz
VCE = 5.0V, IC = 10mA,
f = 100MHz
Output Capacitance COBO — — 4.5 pF
VCB = 10V, f = 1.0MHz
Noise Figure NF 10 dB VCE = 5V, RS = 2.0kΩ,
f = 1.0kHz, BW = 200Hz
MOSFET
Fig. 1 Typical Output Characteristics
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
V , DRAIN-SOURCE VOLTAGE (V)
DS
I, D
R
AIN
C
U
R
R
EN
T
(A)
D
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
V = 1.0V
GS
V = 1.5V
GS
V = 2.5V
GS
V = 4.5V
GS
V = 10V
GS
V = 3.0V
GS
Fig. 2 Typical Transfer Characteristics
V , GATE SOURCE VOLTAGE (V)
GS
I, D
R
AIN
C
U
R
R
EN
T
(A)
D
0
0.1
0.2
0.3
0.4
0.5
01 234
V = 10V
DS
T = -55°C
A
T = 25°C
A
T = 125°C
A
T = 150°C
A
T = 85°C
A
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DMB53D0UV
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Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
I , DRAIN CURRENT (A)
D
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
Ω
1
10
0.001 0.01 0.1 1
V = 4.0V
GS
V= 2.5V
GS
I , DRAIN CURRENT (A)
Fig. 4 Typical Drain-Source On-Resistance
vs. Drain Current and Temperature
D
R
, D
R
AIN-S
O
U
R
C
E
O
N-
R
ESIS
T
AN
C
E ( )
DS(ON)
Ω
1
10
0 0.1 0.2 0.3 0.4 0.5
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
Fig. 5 On-Resistance Variation with Temperature
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
R , DRAIN-TO-SOURCE
RESISTANCE (NORMALIZED)
DS(ON)
V = 2.5V
I = 80mA
GS
D
V = 4V
I = 100mA
GS
D
0.4
Fig. 6 Typical Capacitance
0 5 10 15 20 25 30 35 40
V , DRAIN-SOURCE VOLTAGE (V)
DS
C
,
C
A
P
A
C
I
T
A
N
C
E (p
F
)
0
5
10
15
20
25
30
35
f = 1MHz
V = 0V
GS
C
iss
C
oss
C
rss
V , GATE THRESHOLD VOLTAGE (V)
GS(TH)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
-50 -25 0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
0.5
0.6
0.7
0.8
0.9
1.0
1.1
I = 250µA
D
V , SOURCE-DRAIN VOLTAGE (V)
SD
I, S
O
U
R
C
E
C
U
R
R
E
N
T
(A)
S
Fig. 8 Diode Forward Voltage vs. Current
0.0001
0.001
0.01
0.1
1
0.1 0.3 0.5 0.7 0.9 1.1
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
F‘AT‘ON F‘ , POWER DC CURRENT G CO ECTOREM‘TTER ‘G \NEANDW‘DTH PRODUCT 1MH DMB53DOUV 5017 Document number 0531651 Rev 772 www.dlodes.com
DMB53D0UV
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-50 0 50 100 150
250
200
150
50
100
0
T , AMBIENT TEMPERATURE ( C)
Fig. 9 Derating Curve - Total Package Power Dissipation
A
°
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N
(mW)
D
300
RC/W
θ
JA
°
= 500
NPN Transistor
1
10
100
1,000
10 100 1,000
1
h D
C
C
U
R
R
EN
T
G
AIN
FE,
I , COLLECTOR CURRENT (mA)
Fig. 10 Typical DC Current Gain vs. Collector Current
C
T = 25C
A
°
T = -50C
A
°
T = 150 C
A
°
10.1 10 100 1,000
V,
C
O
LLE
C
T
O
R
-EMI
T
T
E
R
SATURATION VOLTAGE (V)
CE(SAT)
I , COLLECTOR CURRENT (mA)
Fig. 11 Typical Collector-Emitter Saturation Voltage
vs. Collector Current
C
T = 25°C
A
T = -50°C
A
T = 150°C
A
0
0.1
0.2
0.3
0.4
I
I
C
B
= 20
1
100
10
1,000
110100
f,
G
AI
N
-BA
N
DWID
T
H
P
R
O
D
U
C
T
(M
H
z)
T
I , COLLECTOR CURRENT (mA)
Fig. 12 Typical Gain-Bandwidth Product
vs. Collector Current
C
V = 5V
CE
1 _L i\% a\ % |+ T |+ +|+ +| T T 4- + + + J— 'Inl DMB53DOUV 6047 Document number 0531651 Rev 772 www.diodes.com
DMB53D0UV
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Package Outline Dimensions
Suggested Pad Layout
SOT563
Dim Min Max Typ
A 0.15 0.30 0.20
B 1.10 1.25 1.20
C 1.55 1.70 1.60
D - - 0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
K 0.55 0.60 0.60
L 0.10 0.30 0.20
M 0.10 0.18 0.11
All Dimensions in mm
Dimensions Value (in mm)
Z 2.2
G 1.2
X 0.375
Y 0.5
C1 1.7
C2 0.5
A
M
L
BC
H
K
G
D
X
Z
Y
C1
C2
C2
G
DMB53D0UV
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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