G
MICRDCHIP
1997-2013 Microchip Technology Inc. DS30234E-page 1
PIC16C6X
8-Bit CMOS Microcontrollers
Devices included in this data sheet:
PIC16C6X Microcontroller Core Features:
• High performance RISC CPU
• Only 35 single word instructions to learn
• All single cycle instructions except for program
branches which are two-cycle
• Operating speed: DC - 20 MHz clock input
DC - 200 ns instruction cycle
• Interrupt capability
• Eight level deep hardware stack
• Direct, indirect, and relative addressing modes
• Power-on Reset (POR)
• Power-up Timer (PWRT) and
Oscillator Start-up Timer (OST)
• Watchdog Timer (WDT) with its own on-chip RC
oscillator for reliable operation
• Programmable code-protection
• Power saving SLEEP mode
• Selectable oscillator options
• PIC16C61 • PIC16C64A
• PIC16C62 • PIC16CR64
• PIC16C62A • PIC16C65
• PIC16CR62 • PIC16C65A
• PIC16C63 • PIC16CR65
• PIC16CR63 • PIC16C66
• PIC16C64 • PIC16C67
• Low-power, high-speed CMOS EPROM/ROM
technology
• Fully static design
• Wide operating voltage range: 2.5V to 6.0V
• Commercial, Industrial, and Extended
temperature ranges
• Low-power consumption:
< 2 mA @ 5V, 4 MHz
15 A typical @ 3V, 32 kHz
< 1 A typical standby current
PIC16C6X Peripheral Features:
• Timer0: 8-bit timer/counter with 8-bit prescaler
• Timer1: 16-bit timer/counter with prescaler,
can be incremented during sleep via
external crystal/clock
• Timer2: 8-bit timer/counter with 8-bit period
register, prescaler and postscaler
• Capture/Compare/PWM (CCP) module(s)
• Capture is 16-bit, max resolution is 12.5 ns,
Compare is 16-bit, max resolution is 200 ns,
PWM max resolution is 10-bit.
• Synchronous Serial Port (SSP) with SPI and I2C
• Universal Synchronous Asynchronous Receiver
Transmitter (USART/SCI)
• Parallel Slave Port (PSP) 8-bits wide, with
external RD, WR and CS controls
• Brown-out detection circuitry for
Brown-out Reset (BOR)
PIC16C6X Features 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Program Memory
(EPROM) x 14
1K 2K 2K — 4K — 2K 2K — 4K 4K — 8K 8K
(ROM) x 14 — — — 2K — 4K — — 2K — — 4K — —
Data Memory (Bytes) x 8 36 128 128 128 192 192 128 128 128 192 192 192 368 368
I/O Pins 13 22 22 22 22 22 33 33 33 33 33 33 22 33
Parallel Slave Port — — — — — — Yes Yes Yes Yes Yes Yes — Yes
Capture/Compare/PWM
Module(s)
—1112211122222
Timer Modules 13333333333333
Serial Communication —SPI/
I2C
SPI/
I2C
SPI/
I2C
SPI/I2C,
USART
SPI/I2C,
USART
SPI/
I2C
SPI/
I2C
SPI/
I2C
SPI/I2C,
USART
SPI/I2C,
USART
SPI/I2C,
USART
SPI/I2C,
USART
SPI/I2C,
USART
In-Circuit Serial
Programming
Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s
B r o w n - o u t R e s e t — — Ye s Ye s Ye s Ye s — Ye s Yes — Ye s Ye s Ye s Ye s
Interrupt Sources 3 7 7 7 10 10 8 8 8 11 11 11 10 11
Sink/Source Current (mA) 25/20 25/25 25/25 25/25 25/25 25/25 25/25 25/25 25/25 25/25 25/25 25/25 25/25 25/25
HHHH:
3 +.
3 +.
3 +.
3 +.
3..
3..
3..
3+.
3..
3..
3..
3..
3..
3..
..[
._.E
+.[
..[
..[
..[
._.E
._.E
+.[
4.[
..[
..[
..[
..[
..[
3..[
a:
a:
.[
..E
..c
..c
..c
4.: J 3..
..E 3..
..E 3..
..E 3..
..E 3..
..E 3..
..E 3..
..E 3..
..E 3..
..E 3..
an 3..
.c 3..
a: 3..
-c 3..
..c 3..
..E 3..
«E 3..
-—-E 3..
..[ 3..
..c 3..
..c
..c
..c
..c
..c
..c
..c
..c
..c
..c
.c
.c
+:
-c
..c
..c
..c
..c
..c
..c
\/
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
3..
a: \ 3+.
+.[ 3+.
+.[ 3+.
+.[ 3+.
+.[ 3+.
+.[ 3+.
+.[ 3+.
.4 3+.
.5 3..
+5 3..
+.: 3..
.5 3...
._.E 3...
._.E 3...
-5 \ 3...
..E 3...
..E 3...
..E 3...
..E 3...
..E 3...
..E 3...
a: 3+.
.5 3..
.5 3..
..E 3...
..E 3...
..E 3...
..E 3...
i .5 \z 3..
..E 3..
..E 3..
..E 3..
..[ 3..
..E 3..
3": 3..
3..E 3..
7»: 3..
3..[ 3..
4.: 3..
a: 3..
+: 3..
..c 3..
..c 3..
..E 3..
..E 3..
..c 3..
..c 3..
..c 3..
PIC16C6X
DS30234E-page 2 1997-2013 Microchip Technology Inc.
Pin Diagrams
PDIP, SOIC, Windowed CERDIP
18
17
16
15
14
13
12
11
10
1
2
3
4
5
6
7
8
9
PIC16C61
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0/INT
VDD
VSS
RC7
RC6
RC5/SDO
RC4/SDI/SDA
MCLR/VPP
RA0
RA1
RA2
RA3
RA4/T0CKI
RA5/SS
VSS
OSC1/CLKIN
OSC2/CLKOUT
RC0/T1OSI/T1CKI
RC1/T1OSO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PIC16C62
RC2/CCP1
RC3/SCK/SCL
SDIP, SOIC, SSOP, Windowed CERDIP (300 mil)
RA2
RA3
RA4/T0CKI
MCLR/VPP
VSS
RB0/INT
RB1
RB2
RB3
RA1
RA0
OSC1/CLKIN
OSC2/CLKOUT
VDD
RB7
RB6
RB5
RB4
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0/INT
VDD
VSS
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
MCLR/VPP
RA0
RA1
RA2
RA3
RA4/T0CKI
RA5/SS
VSS
OSC1/CLKIN
OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PIC16C63
RC2/CCP1
RC3/SCK/SCL
SDIP, SOIC, Windowed CERDIP (300 mil)
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0/INT
VDD
VSS
RC7
RC6
RC5/SDO
RC4/SDI/SDA
MCLR/VPP
RA0
RA1
RA2
RA3
RA4/T0CKI
RA5/SS
VSS
OSC1/CLKIN
OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PIC16C62A
RC2/CCP1
RC3/SCK/SCL
SDIP, SOIC, SSOP, Windowed CERDIP (300 mil)
PIC16CR62
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0/INT
VDD
VSS
RD7/PSP7
RD6/PSP6
RD5/PSP5
RD4/PSP4
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
MCLR/VPP
RA0
RA1
RA2
RA3
RA4/T0CKI
RA5/SS
RE0/RD
RE1/WR
RE2/CS
VDD
VSS
OSC1/CLKIN
OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/CCP1
RC3/SCK/SCL
RD0/PSP0
RD1/PSP1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
PIC16C65
PDIP, Windowed CERDIP
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0/INT
VDD
VSS
RD7/PSP7
RD6/PSP6
RD5/PSP5
RD4/PSP4
RC7
RC6
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
MCLR/VPP
RA0
RA1
RA2
RA3
RA4/T0CKI
RA5/SS
RE0/RD
RE1/WR
RE2/CS
VDD
VSS
OSC1/CLKIN
OSC2/CLKOUT
RC0/T1OSI/T1CKI
RC1/T1OSO
RC2/CCP1
RC3/SCK/SCL
RD0/PSP0
RD1/PSP1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
PIC16C64
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0/INT
VDD
VSS
RD7/PSP7
RD6/PSP6
RD5/PSP5
RD4/PSP4
RC7
RC6
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
MCLR/VPP
RA0
RA1
RA2
RA3
RA4/T0CKI
RA5/SS
RE0/RD
RE1/WR
RE2/CS
VDD
VSS
OSC1/CLKIN
OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI
RC2/CCP1
RC3/SCK/SCL
RD0/PSP0
RD1/PSP1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
PIC16C64A
PIC16C65A
PIC16CR64
PIC16CR63
PIC16CR65
PIC16C66
PIC16C67
mmm:
IHIIIHH
nnnnnnnnnnn \
mmm:
1997-2013 Microchip Technology Inc. DS30234E-page 3
PIC16C6X
Pin Diagrams (Cont.’d)
NC
RC0/T1OSO/T1CKI
OSC2/CLKOUT
OSC1/CLKIN
VSS
VDD
RE2/CS
RE1/WR
RE0/RD
RA5/SS
RA4/T0CKI
RC7/RX/DT
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
VSS
VDD
RB0/INT
RB1
RB2
RB3
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1
RC1/T1OSI/CCP2
NC
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
RA3
RA2
RA1
RA0
MCLR/VPP
RB7
RB6
RB5
RB4
NC
NC
44
43
42
41
40
39
38
37
36
35
34
22
21
20
19
18
17
16
15
14
13
12
PIC16C65
MQFP,
RB3
RB2
RB1
RB0/INT
VDD
VSS
RD7/PSP7
RD6/PSP6
RD5/PSP5
RD4/PSP4
RC7/RX/DT
RA4/T0CKI
RA5/SS
RE0/RD
RE1/WR
RE2/CS
VDD
VSS
OSC1/CLKIN
OSC2/CLKOUT
NC
RA3
RA2
RA1
RA0
MCLR/VPP
NC
RB7
RB6
RB5
RB4
NC
7
8
9
10
11
12
13
14
15
16
17
39
38
37
36
35
34
33
32
31
30
29
NC
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1
RC1/T1OSI
6
5
4
3
2
1
44
43
42
41
40
28
27
26
25
24
23
22
21
20
19
18
PIC16C65
/CCP2
PLCC
RC0/T1OSO/T1CKI
NC
RC0/T1OSO/T1CKI
OSC2/CLKOUT
OSC1/CLKIN
VSS
VDD
RE2/CS
RE1/WR
RE0/RD
RA5/SS
RA4/T0CKI
RC7
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
VSS
VDD
RB0/INT
RB1
RB2
RB3
RC6
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1
RC1/T1OSI
NC
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
RA3
RA2
RA1
RA0
MCLR/VPP
RB7
RB6
RB5
RB4
NC
NC
34
35
36
37
38
39
40
41
42
43
44
PIC16C64A
MQFP,
RB3
RB2
RB1
RB0/INT
VDD
VSS
RD7/PSP7
RD6/PSP6
RD5/PSP5
RD4/PSP4
RC7
RA4/T0CKI
RA5/SS
RE0/RD
RE1/WR
RE2/CS
VDD
VSS
OSC1/CLKIN
OSC2/CLKOUT
NC
RA3
RA2
RA1
RA0
MCLR/VPP
NC
RB7
RB6
RB5
RB4
NC
7
8
9
10
11
12
13
14
15
16
17
39
38
37
36
35
34
33
32
31
30
29
NC
RC6
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1
RC1/T1OSI
6
5
4
3
2
1
44
43
42
41
40
28
27
26
25
24
23
22
21
20
19
18
PIC16C64A
PLCC
RC0/T1OSO/T1CKI
PIC16CR64
PIC16CR64
PIC16C65A PIC16C65A
TQFP (PIC16C64A only)
TQFP (Not on PIC16C65)
RB3
RB2
RB1
RB0/INT
VDD
VSS
RD7/PSP7
RD6/PSP6
RD5/PSP5
RD4/PSP4
RC7
RA4/T0CKI
RA5/SS
RE0/RD
RE1/WR
RE2/CS
VDD
VSS
OSC1/CLKIN
NC
RA3
RA2
RA1
RA0
MCLR/VPP
NC
RB7
RB6
RB5
RB4
NC
7
8
9
10
11
12
13
14
15
16
17
39
38
37
36
35
34
33
32
31
30
29
NC
RC6
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1
RC1/T1OSO
6
5
4
3
2
1
44
43
42
41
40
28
27
26
25
24
23
22
21
20
19
18
PIC16C64
PLCC
NC
RC0/T1OSI/T1CKI
OSC2/CLKOUT
OSC1/CLKIN
VSS
VDD
RE2/CS
RE1/WR
RE0/RD
RA5/SS
RA4/T0CKI
RC7
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
VSS
VDD
RB0/INT
RB1
RB2
RB3
RC6
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1
RC1/T1OSO
NC
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
RA3
RA2
RA1
RA0
MCLR/VPP
RB7
RB6
RB5
RB4
NC
NC
44
43
42
41
40
39
38
37
36
35
34
22
21
20
19
18
17
16
15
14
13
12
PIC16C64
MQFP
RC0/T1OSI/T1CKI
OSC2/CLKOUT
22
21
20
19
18
17
16
15
14
13
12
PIC16CR65 PIC16CR65
PIC16C67 PIC16C67
PIC16C6X
DS30234E-page 4 1997-2013 Microchip Technology Inc.
Table Of Contents
1.0 General Description ....................................................................................................................................................................... 5
2.0 PIC16C6X Device Varieties ........................................................................................................................................................... 7
3.0 Architectural Overview ................................................................................................................................................................... 9
4.0 Memory Organization................................................................................................................................................................... 19
5.0 I/O Ports....................................................................................................................................................................................... 51
6.0 Overview of Timer Modules ......................................................................................................................................................... 63
7.0 Timer0 Module ............................................................................................................................................................................. 65
8.0 Timer1 Module ............................................................................................................................................................................. 71
9.0 Timer2 Module ............................................................................................................................................................................. 75
10.0 Capture/Compare/PWM (CCP) Module(s)................................................................................................................................... 77
11.0 Synchronous Serial Port (SSP) Module ....................................................................................................................................... 83
12.0 Universal Synchronous Asynchronous Receiver Transmitter (USART) Module........................................................................ 105
13.0 Special Features of the CPU ..................................................................................................................................................... 123
14.0 Instruction Set Summary............................................................................................................................................................ 143
15.0 Development Support ................................................................................................................................................................ 159
16.0 Electrical Characteristics for PIC16C61 ..................................................................................................................................... 163
17.0 DC and AC Characteristics Graphs and Tables for PIC16C61.................................................................................................. 173
18.0 Electrical Characteristics for PIC16C62/64................................................................................................................................ 183
19.0 Electrical Characteristics for PIC16C62A/R62/64A/R64............................................................................................................ 199
20.0 Electrical Characteristics for PIC16C65 ..................................................................................................................................... 215
21.0 Electrical Characteristics for PIC16C63/65A ............................................................................................................................. 231
22.0 Electrical Characteristics for PIC16CR63/R65........................................................................................................................... 247
23.0 Electrical Characteristics for PIC16C66/67................................................................................................................................ 263
24.0 DC and AC Characteristics Graphs and Tables for:
PIC16C62, PIC16C62A, PIC16CR62, PIC16C63, PIC16C64, PIC16C64A, PIC16CR64,
PIC16C65A, PIC16C66, PIC16C67 ........................................................................................................................................... 281
25.0 Packaging Information ............................................................................................................................................................... 291
Appendix A: Modifications .............................................................................................................................................................. 307
Appendix B: Compatibility .............................................................................................................................................................. 307
Appendix C: What’s New................................................................................................................................................................ 308
Appendix D: What’s Changed ........................................................................................................................................................ 308
Appendix E: PIC16/17 Microcontrollers ....................................................................................................................................... 309
Pin Compatibility ................................................................................................................................................................................ 315
Index .................................................................................................................................................................................................. 317
List of Equation and Examples........................................................................................................................................................... 326
List of Figures..................................................................................................................................................................................... 326
List of Tables...................................................................................................................................................................................... 330
Reader Response .............................................................................................................................................................................. 334
PIC16C6X Product Identification System........................................................................................................................................... 335
For register and module descriptions in this data sheet, device legends show which devices apply to those sections. For
example, the legend below shows that some features of only the PIC16C62A, PIC16CR62, PIC16C63, PIC16C64A,
PIC16CR64, and PIC16C65A are described in this section.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
To Our Valued Customers
We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional
amount of time to ensure that these documents are correct. However, we realize that we may have missed a few
things. If you find any information that is missing or appears in error, please use the reader response form in the
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Family and Upward Compatibilifl
Develogment Support
1997-2013 Microchip Technology Inc. DS30234E-page 5
PIC16C6X
1.0 GENERAL DESCRIPTION
The PIC16CXX is a family of low-cost, high-perfor-
mance, CMOS, fully-static, 8-bit microcontrollers.
All PIC16/17 microcontrollers employ an advanced
RISC architecture. The PIC16CXX microcontroller fam-
ily has enhanced core features, eight-level deep stack,
and multiple internal and external interrupt sources.
The separate instruction and data buses of the Harvard
architecture allow a 14-bit wide instruction word with
separate 8-bit wide data. The two stage instruction
pipeline allows all instructions to execute in a single
cycle, except for program branches (which require two
cycles). A total of 35 instructions (reduced instruction
set) are available. Additionally, a large register set gives
some of the architectural innovations used to achieve a
very high performance.
PIC16CXX microcontrollers typically achieve a 2:1
code compression and a 4:1 speed improvement over
other 8-bit microcontrollers in their class.
The PIC16C61 device has 36 bytes of RAM and 13 I/O
pins. In addition a timer/counter is available.
The PIC16C62/62A/R62 devices have 128 bytes of
RAM and 22 I/O pins. In addition, several peripheral
features are available, including: three timer/counters,
one Capture/Compare/PWM module and one serial
port. The Synchronous Serial Port can be configured
as either a 3-wire Serial Peripheral Interface (SPI) or
the two-wire Inter-Integrated Circuit (I2C) bus.
The PIC16C63/R63 devices have 192 bytes of RAM,
while the PIC16C66 has 368 bytes. All three devices
have 22 I/O pins. In addition, several peripheral fea-
tures are available, including: three timer/counters, two
Capture/Compare/PWM modules and two serial ports.
The Synchronous Serial Port can be configured as
either a 3-wire Serial Peripheral Interface (SPI) or the
two-wire Inter-Integrated Circuit (I2C) bus. The Univer-
sal Synchronous Asynchronous Receiver Transmitter
(USART) is also know as a Serial Communications
Interface or SCI.
The PIC16C64/64A/R64 devices have 128 bytes of
RAM and 33 I/O pins. In addition, several peripheral
features are available, including: three timer/counters,
one Capture/Compare/PWM module and one serial
port. The Synchronous Serial Port can be configured
as either a 3-wire Serial Peripheral Interface (SPI) or
the two-wire Inter-Integrated Circuit (I2C) bus. An 8-bit
Parallel Slave Port is also provided.
The PIC16C65/65A/R65 devices have 192 bytes of
RAM, while the PIC16C67 has 368 bytes. All four
devices have 33 I/O pins. In addition, several peripheral
features are available, including: three timer/counters,
two Capture/Compare/PWM modules and two serial
ports. The Synchronous Serial Port can be configured
as either a 3-wire Serial Peripheral Interface (SPI) or
the two-wire Inter-Integrated Circuit (I2C) bus. The Uni-
versal Synchronous Asynchronous Receiver Transmit-
ter (USART) is also known as a Serial Communications
Interface or SCI. An 8-bit Parallel Slave Port is also pro-
vided.
The PIC16C6X device family has special features to
reduce external components, thus reducing cost,
enhancing system reliability and reducing power con-
sumption. There are four oscillator options, of which the
single pin RC oscillator provides a low-cost solution,
the LP oscillator minimizes power consumption, XT is a
standard crystal, and the HS is for High Speed crystals.
The SLEEP (power-down) mode offers a power saving
mode. The user can wake the chip from SLEEP
through several external and internal interrupts, and
resets.
A highly reliable Watchdog Timer with its own on-chip
RC oscillator provides protection against software lock-
up.
A UV erasable CERDIP packaged version is ideal for
code development, while the cost-effective
One-Time-Programmable (OTP) version is suitable for
production in any volume.
The PIC16C6X family fits perfectly in applications rang-
ing from high-speed automotive and appliance control
to low-power remote sensors, keyboards and telecom
processors. The EPROM technology makes custom-
ization of application programs (transmitter codes,
motor speeds, receiver frequencies, etc.) extremely
fast and convenient. The small footprint packages
make this microcontroller series perfect for all applica-
tions with space limitations. Low-cost, low-power, high
performance, ease-of-use, and I/O flexibility make the
PIC16C6X very versatile even in areas where no micro-
controller use has been considered before (e.g. timer
functions, serial communication, capture and compare,
PWM functions, and co-processor applications).
1.1 Family and Upward Compatibility
Those users familiar with the PIC16C5X family of
microcontrollers will realize that this is an enhanced
version of the PIC16C5X architecture. Please refer to
Appendix A for a detailed list of enhancements. Code
written for PIC16C5X can be easily ported to
PIC16CXX family of devices (Appendix B).
1.2 Development Support
PIC16C6X devices are supported by the complete line
of Microchip Development tools.
Please refer to Section 15.0 for more details about
Microchip’s development tools.
PIC16C6X
DS30234E-page 6 1997-2013 Microchip Technology Inc.
TABLE 1-1: PIC16C6X FAMILY OF DEVICES
PIC16C61 PIC16C62A PIC16CR62 PIC16C63 PIC16CR63
Clock Maximum Frequency
of Operation (MHz)
20 20 20 20 20
Memory
EPROM Program Memory
(x14 words)
1K 2K — 4K —
ROM Program Memory
(x14 words)
—— 2K —4K
Data Memory (bytes) 36 128 128 192 192
Peripherals
Timer Module(s) TMR0 TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
Capture/Compare/
PWM Module(s)
—1122
Serial Port(s)
(SPI/I2C, USART)
— SPI/I2C SPI/I2C SPI/I2C,
USART
SPI/I2C
USART
Parallel Slave Port — — — — —
Features
Interrupt Sources 3 7 7 10 10
I/O Pins 13 22 22 22 22
Voltage Range (Volts) 3.0-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0
In-Circuit Serial Programming Yes Yes Yes Yes Yes
Brown-out Reset — Yes Yes Yes Yes
Packages 18-pin DIP, SO 28-pin SDIP,
SOIC, SSOP
28-pin SDIP,
SOIC, SSOP
28-pin SDIP,
SOIC
28-pin SDIP,
SOIC
PIC16C64A PIC16CR64 PIC16C65A PIC16CR65 PIC16C66 PIC16C67
Clock Maximum Frequency
of Operation (MHz)
20 20 20 20 20 20
Memory
EPROM Program Memory
(x14 words)
2K — 4K — 8K 8K
ROM Program Memory (x14
words)
—2K— 4K——
Data Memory (bytes) 128 128 192 192 368 368
Peripherals
Timer Module(s) TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
Capture/Compare/PWM Mod-
ule(s)
1 1 2 222
Serial Port(s) (SPI/I2C, USART) SPI/I2CSPI/I
2CSPI/I
2C,
USART
SPI/I2C,
USART
SPI/I2C,
USART
SPI/I2C,
USART
Parallel Slave Port Yes Yes Yes Yes — Yes
Features
Interrupt Sources 8 8 11 11 10 11
I/O Pins 33 33 33 33 22 33
Voltage Range (Volts) 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0
In-Circuit Serial Programming Yes Yes Yes Yes Yes Yes
Brown-out Reset Yes Yes Yes Yes Yes Yes
Packages 40-pin DIP;
44-pin PLCC,
MQFP, TQFP
40-pin DIP;
44-pin PLCC,
MQFP, TQFP
40-pin DIP;
44-pin PLCC,
MQFP, TQFP
40-pin DIP;
44-pin
PLCC,
MQFP,
TQFP
28-pin SDIP,
SOIC
40-pin DIP;
44-pin
PLCC,
MQFP,
TQFP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current
capability. All PIC16C6X Family devices use serial programming with clock pin RB6 and data pin RB7.
roduc on DTP
Serialized Quick-Turnaround
Productlon SQTP Devlces
UV Elasable Devices
Read Onl Memo! ROM Dev es
lo lammable OTP
Devlces
1997-2013 Microchip Technology Inc. DS30234E-page 7
PIC16C6X
2.0 PIC16C6X DEVICE VARIETIES
A variety of frequency ranges and packaging options
are available. Depending on application and production
requirements, the proper device option can be selected
using the information in the PIC16C6X Product Identi-
fication System section at the end of this data sheet.
When placing orders, please use that page of the data
sheet to specify the correct part number.
For the PIC16C6X family of devices, there are four
device “types” as indicated in the device number:
1. C, as in PIC16C64. These devices have
EPROM type memory and operate over the
standard voltage range.
2. LC, as in PIC16LC64. These devices have
EPROM type memory and operate over an
extended voltage range.
3. CR, as in PIC16CR64. These devices have
ROM program memory and operate over the
standard voltage range.
4. LCR, as in PIC16LCR64. These devices have
ROM program memory and operate over an
extended voltage range.
2.1 UV Erasable Devices
The UV erasable version, offered in CERDIP package
is optimal for prototype development and pilot
programs. This version can be erased and
reprogrammed to any of the oscillator modes.
Microchip's PICSTART Plus and PRO MATEII
programmers both support programming of the
PIC16C6X.
2.2 One-Time-Programmable (OTP)
Devices
The availability of OTP devices is especially useful for
customers who need the flexibility for frequent code
updates and small volume applications.
The OTP devices, packaged in plastic packages, per-
mit the user to program them once. In addition to the
program memory, the configuration bits must also be
programmed.
2.3 Quick-Turnaround-Production (QTP)
Devices
Microchip offers a QTP Programming Service for fac-
tory production orders. This service is made available
for users who choose not to program a medium to high
quantity of units and whose code patterns have stabi-
lized. The devices are identical to the OTP devices but
with all EPROM locations and configuration options
already programmed by the factory. Certain code and
prototype verification procedures apply before produc-
tion shipments are available. Please contact your local
Microchip Technology sales office for more details.
2.4 Serialized Quick-Turnaround
Production (SQTPSM) Devices
Microchip offers a unique programming service where
a few user-defined locations in each device are pro-
grammed with different serial numbers. The serial num-
bers may be random, pseudo-random, or sequential.
Serial programming allows each device to have a
unique number which can serve as an entry-code,
password, or ID number.
ROM devices do not allow serialization information in
the program memory space. The user may have this
information programmed in the data memory space.
For information on submitting ROM code, please con-
tact your regional sales office.
2.5 Read Only Memory (ROM) Devices
Microchip offers masked ROM versions of several of
the highest volume parts, thus giving customers a low
cost option for high volume, mature products.
For information on submitting ROM code, please con-
tact your regional sales office.
PIC16C6X
DS30234E-page 8 1997-2013 Microchip Technology Inc.
NOTES:
1997-2013 Microchip Technology Inc. DS30234E-page 9
PIC16C6X
3.0 ARCHITECTURAL OVERVIEW
The high performance of the PIC16CXX family can be
attributed to a number of architectural features com-
monly found in RISC microprocessors. To begin with,
the PIC16CXX uses a Harvard architecture, in which,
program and data are accessed from separate memo-
ries using separate buses. This improves bandwidth
over traditional von Neumann architecture where pro-
gram and data may be fetched from the same memory
using the same bus. Separating program and data bus-
ses further allows instructions to be sized differently
than 8-bit wide data words. Instruction opcodes are
14-bits wide making it possible to have all single word
instructions. A 14-bit wide program memory access
bus fetches a 14-bit instruction in a single cycle. A two-
stage pipeline overlaps fetch and execution of instruc-
tions (Example 3-1). Consequently, all instructions exe-
cute in a single cycle (200 ns @ 20 MHz) except for
program branches.
The PIC16C61 addresses 1K x 14 of program memory.
The PIC16C62/62A/R62/64/64A/R64 address 2K x 14
of program memory, and the
PIC16C63/R63/65/65A/R65 devices address 4K x 14 of
program memory. The PIC16C66/67 address 8K x 14
program memory. All program memory is internal.
The PIC16CXX can directly or indirectly address its
register files or data memory. All special function reg-
isters including the program counter are mapped in
the data memory. The PIC16CXX has an orthogonal
(symmetrical) instruction set that makes it possible to
carry out any operation on any register using any
addressing mode. This symmetrical nature and lack of
“special optimal situations” makes programming with
the PIC16CXX simple yet efficient, thus significantly
reducing the learning curve.
The PIC16CXX device contains an 8-bit ALU and work-
ing register (W). The ALU is a general purpose arithme-
tic unit. It performs arithmetic and Boolean functions
between data in the working register and any register
file.
The ALU is 8-bits wide and capable of addition, sub-
traction, shift, and logical operations. Unless otherwise
mentioned, arithmetic operations are two's comple-
ment in nature. In two-operand instructions, typically
one operand is the working register (W register), the
other operand is a file register or an immediate con-
stant. In single operand instructions, the operand is
either the W register or a file register.
The W register is an 8-bit working register used for ALU
operations. It is not an addressable register.
Depending upon the instruction executed, the ALU may
affect the values of the Carry (C), Digit Carry (DC), and
Zero (Z) bits in the STATUS register. Bits C and DC
operate as a borrow and digit borrow out bit, respec-
tively, in subtraction. See the SUBLW and SUBWF
instructions for examples.
PIC16C6X
DS30234E-page 10 1997-2013 Microchip Technology Inc.
FIGURE 3-1: PIC16C61 BLOCK DIAGRAM
EPROM
Program
Memory
1K x 14
13 Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
RAM
File
Registers
36 x 8
Direct Addr 7
9
Addr MUX
Indirect
Addr8
FSR reg
STATUS reg
MUX
ALU
W reg
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
MCLR VDD, VSS
Timer0
3
PORTA
PORTB
RA1
RA4/T0CKI
RB0/INT
RB7:RB1
8
8
RAM Addr(1)
Note 1: Higher order bits are from the STATUS register.
RA0
RA2
RA3
1997-2013 Microchip Technology Inc. DS30234E-page 11
PIC16C6X
FIGURE 3-2: PIC16C62/62A/R62/64/64A/R64 BLOCK DIAGRAM
EPROM/
Program
Memory
2K x 14
13 Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
RAM
File
Registers
128 x 8
Direct Addr 7
RAM Addr(1) 9
Addr MUX
Indirect
Addr8
FSR reg
STATUS reg
MUX
ALU
W reg
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
MCLR VDD, VSS
Synchronous
Serial Port
3
PORTA
PORTB
PORTC
PORTD
PORTE
RA4/T0CKI
RA5/SS
RB0/INT
RB7:RB1
RC0/T1OSO/T1CKI(4)
RC1/T1OSI(4)
RC2/CCP1
RC3/SCK/SCL
RC4/SDI/SDA
RC5/SDO
RC6
RC7
RE0/RD
RE1/WR
RE2/CS
RD0/PSP0
8
8
(Note 2)
Brown-out
Reset(3)
ROM
Timer0
Timer1 Timer2 CCP1
RA1
RA0
RA2
RA3
RD1/PSP1
RD2/PSP2
RD3/PSP3
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
Parallel Slave
Port
Note 1: Higher order bits are from the STATUS register.
2: PORTD, PORTE and the Parallel Slave Port are not available on the PIC16C62/62A/R62.
3: Brown-out Reset is not available on the PIC16C62/64.
4: Pin functions T1OSI and T1OSO are swapped on the PIC16C62/64.
PIC16C6X
DS30234E-page 12 1997-2013 Microchip Technology Inc.
FIGURE 3-3: PIC16C63/R63/65/65A/R65 BLOCK DIAGRAM
Synchronous
Serial Port
EPROM
Program
Memory
4K x 14
13 Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
RAM
File
Registers
192 x 8
Direct Addr 7
RAM Addr(1) 9
Addr MUX
Indirect
Addr8
FSR reg
STATUS reg
MUX
ALU
W reg
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
MCLR VDD, VSS
3
PORTA
PORTB
PORTC
PORTD
PORTE
RA4/T0CKI
RA5/SS
RB0/INT
RB7:RB1
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/CCP1
RC3/SCK/SCL
RC4/SDI/SDA
RC5/SDO
RC6/TX/CK
RC7/RX/DT
RE0/RD
RE1/WR
RE2/CS
8
8
Brown-out
Reset(3)
(Note 2)
USART
Timer0 Timer1 Timer2
CCP2CCP1
RD0/PSP0
RD1/PSP1
RD2/PSP2
RD3/PSP3
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
RA1
RA0
RA2
RA3
Parallel Slave
Port
Note 1: Higher order bits are from the STATUS register.
2: PORTD, PORTE and the Parallel Slave Port are not available on the PIC16C63/R63.
3: Brown-out Reset is not available on the PIC16C65.
1997-2013 Microchip Technology Inc. DS30234E-page 13
PIC16C6X
FIGURE 3-4: PIC16C66/67 BLOCK DIAGRAM
Synchronous
Serial Port
EPROM
Program
Memory
8K x 14
13 Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
RAM
File
Registers
368 x 8
Direct Addr 7
RAM Addr(1) 9
Addr MUX
Indirect
Addr8
FSR reg
STATUS reg
MUX
ALU
W reg
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
MCLR VDD, VSS
3
PORTA
PORTB
PORTC
PORTD
PORTE
RA4/T0CKI
RA5/SS
RB0/INT
RB7:RB1
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/CCP1
RC3/SCK/SCL
RC4/SDI/SDA
RC5/SDO
RC6/TX/CK
RC7/RX/DT
RE0/RD
RE1/WR
RE2/CS
8
8
Brown-out
Reset
(Note 2)
USART
Timer0 Timer1 Timer2
CCP2CCP1
RD0/PSP0
RD1/PSP1
RD2/PSP2
RD3/PSP3
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
RA1
RA0
RA2
RA3
Parallel Slave
Port
Note 1: Higher order bits are from the STATUS register.
2: PORTD, PORTE and the Parallel Slave Port are not available on the PIC16C66.
PIC16C6X
DS30234E-page 14 1997-2013 Microchip Technology Inc.
TABLE 3-1: PIC16C61 PINOUT DESCRIPTION
Pin Name DIP
Pin#
SOIC
Pin# Pin Type Buffer
Type Description
OSC1/CLKIN 16 16 I ST/CMOS(1) Oscillator crystal input/external clock source input.
OSC2/CLKOUT 15 15 O — Oscillator crystal output. Connects to crystal or resonator in crystal
oscillator mode. In RC mode, the pin outputs CLKOUT which has
1/4 the frequency of OSC1, and denotes the instruction cycle rate.
MCLR/VPP 4 4 I/P ST Master clear reset input or programming voltage input. This pin is an
active low reset to the device.
PORTA is a bi-directional I/O port.
RA0 17 17 I/O TTL
RA1 18 18 I/O TTL
RA2 1 1 I/O TTL
RA3 2 2 I/O TTL
RA4/T0CKI 3 3 I/O ST RA4 can also be the clock input to the Timer0 timer/counter.
Output is open drain type.
PORTB is a bi-directional I/O port. PORTB can be software pro-
grammed for internal weak pull-up on all inputs.
RB0/INT 6 6 I/O TTL/ST(2) RB0 can also be the external interrupt pin.
RB1 7 7 I/O TTL
RB2 8 8 I/O TTL
RB3 9 9 I/O TTL
RB4 10 10 I/O TTL Interrupt on change pin.
RB5 11 11 I/O TTL Interrupt on change pin.
RB6 12 12 I/O TTL/ST(3) Interrupt on change pin. Serial programming clock.
RB7 13 13 I/O TTL/ST(3) Interrupt on change pin. Serial programming data.
VSS 5 5 P — Ground reference for logic and I/O pins.
VDD 14 14 P — Positive supply for logic and I/O pins.
Legend: I = input O = output I/O = input/output P = power
— = Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured in RC oscillator mode and a CMOS input otherwise.
2: This buffer is a Schmitt Trigger input when configured as the external interrupt.
3: This buffer is a Schmitt Trigger input when used in serial programming mode.
1997-2013 Microchip Technology Inc. DS30234E-page 15
PIC16C6X
TABLE 3-2: PIC16C62/62A/R62/63/R63/66 PINOUT DESCRIPTION
Pin Name Pin# Pin Type Buffer
Type Description
OSC1/CLKIN 9 I ST/CMOS(3) Oscillator crystal input/external clock source input.
OSC2/CLKOUT 10 O — Oscillator crystal output. Connects to crystal or resonator in crys-
tal oscillator mode. In RC mode, the pin outputs CLKOUT which
has 1/4 the frequency of OSC1, and denotes the instruction cycle
rate.
MCLR/VPP 1 I/P ST Master clear reset input or programming voltage input. This pin is
an active low reset to the device.
PORTA is a bi-directional I/O port.
RA0 2 I/O TTL
RA1 3 I/O TTL
RA2 4 I/O TTL
RA3 5 I/O TTL
RA4/T0CKI 6 I/O ST RA4 can also be the clock input to the Timer0 timer/counter.
Output is open drain type.
RA5/SS 7 I/O TTL RA5 can also be the slave select for the synchronous serial
port.
PORTB is a bi-directional I/O port. PORTB can be software pro-
grammed for internal weak pull-up on all inputs.
RB0/INT 21 I/O TTL/ST(4) RB0 can also be the external interrupt pin.
RB1 22 I/O TTL
RB2 23 I/O TTL
RB3 24 I/O TTL
RB4 25 I/O TTL Interrupt on change pin.
RB5 26 I/O TTL Interrupt on change pin.
RB6 27 I/O TTL/ST(5) Interrupt on change pin. Serial programming clock.
RB7 28 I/O TTL/ST(5) Interrupt on change pin. Serial programming data.
PORTC is a bi-directional I/O port.
RC0/T1OSO(1)/T1CKI 11 I/O ST RC0 can also be the Timer1 oscillator output(1) or Timer1
clock input.
RC1/T1OSI(1)/CCP2(2) 12 I/O ST RC1 can also be the Timer1 oscillator input(1) or Capture2
input/Compare2 output/PWM2 output(2).
RC2/CCP1 13 I/O ST RC2 can also be the Capture1 input/Compare1 out-
put/PWM1 output.
RC3/SCK/SCL 14 I/O ST RC3 can also be the synchronous serial clock input/output
for both SPI and I2C modes.
RC4/SDI/SDA 15 I/O ST RC4 can also be the SPI Data In (SPI mode) or
data I/O (I2C mode).
RC5/SDO 16 I/O ST RC5 can also be the SPI Data Out (SPI mode).
RC6/TX/CK(2) 17 I/O ST RC6 can also be the USART Asynchronous Transmit(2) or
Synchronous Clock(2).
RC7/RX/DT(2) 18 I/O ST RC7 can also be the USART Asynchronous Receive(2) or
Synchronous Data(2).
VSS 8,19 P — Ground reference for logic and I/O pins.
VDD 20 P — Positive supply for logic and I/O pins.
Legend: I = input O = output I/O = input/output P = power
— = Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: Pin functions T1OSO and T1OSI are reversed on the PIC16C62.
2: The USART and CCP2 are not available on the PIC16C62/62A/R62.
3: This buffer is a Schmitt Trigger input when configured in RC oscillator mode and a CMOS input otherwise.
4: This buffer is a Schmitt Trigger input when configured as the external interrupt.
5: This buffer is a Schmitt Trigger input when used in serial programming mode.
PIC16C6X
DS30234E-page 16 1997-2013 Microchip Technology Inc.
TABLE 3-3: PIC16C64/64A/R64/65/65A/R65/67 PINOUT DESCRIPTION
Pin Name DIP
Pin#
PLCC
Pin#
TQFP
MQFP
Pin#
Pin
Type
Buffer
Type Description
OSC1/CLKIN 13 14 30 I ST/CMOS(3) Oscillator crystal input/external clock source input.
OSC2/CLKOUT 14 15 31 O — Oscillator crystal output. Connects to crystal or resonator in
crystal oscillator mode. In RC mode, the pin outputs CLK-
OUT which has 1/4 the frequency of OSC1, and denotes the
instruction cycle rate.
MCLR/VPP 1 2 18 I/P ST Master clear reset input or programming voltage input. This
pin is an active low reset to the device.
PORTA is a bi-directional I/O port.
RA0 2 3 19 I/O TTL
RA1 3 4 20 I/O TTL
RA2 4 5 21 I/O TTL
RA3 5 6 22 I/O TTL
RA4/T0CKI 6 7 23 I/O ST RA4 can also be the clock input to the Timer0
timer/counter. Output is open drain type.
RA5/SS 7 8 24 I/O TTL RA5 can also be the slave select for the synchronous
serial port.
PORTB is a bi-directional I/O port. PORTB can be software
programmed for internal weak pull-up on all inputs.
RB0/INT 33 36 8 I/O TTL/ST(4) RB0 can also be the external interrupt pin.
RB1 34 37 9 I/O TTL
RB2 35 38 10 I/O TTL
RB3 36 39 11 I/O TTL
RB4 37 41 14 I/O TTL Interrupt on change pin.
RB5 38 42 15 I/O TTL Interrupt on change pin.
RB6 39 43 16 I/O TTL/ST(5) Interrupt on change pin. Serial programming clock.
RB7 40 44 17 I/O TTL/ST(5) Interrupt on change pin. Serial programming data.
PORTC is a bi-directional I/O port.
RC0/T1OSO(1)/T1CKI 15 16 32 I/O ST RC0 can also be the Timer1 oscillator output(1) or
Timer1 clock input.
RC1/T1OSI(1)/CCP2(2) 16 18 35 I/O ST RC1 can also be the Timer1 oscillator input(1) or
Capture2 input/Compare2 output/PWM2 output(2).
RC2/CCP1 17 19 36 I/O ST RC2 can also be the Capture1 input/Compare1 out-
put/PWM1 output.
RC3/SCK/SCL 18 20 37 I/O ST RC3 can also be the synchronous serial clock input/out-
put for both SPI and I2C modes.
RC4/SDI/SDA 23 25 42 I/O ST RC4 can also be the SPI Data In (SPI mode) or
data I/O (I2C mode).
RC5/SDO 24 26 43 I/O ST RC5 can also be the SPI Data Out (SPI mode).
RC6/TX/CK(2) 25 27 44 I/O ST RC6 can also be the USART Asynchronous Transmit(2)
or Synchronous Clock(2).
RC7/RX/DT(2) 26 29 1 I/O ST RC7 can also be the USART Asynchronous Receive(2)
or Synchronous Data(2).
Legend: I = input O = output I/O = input/output P = power
— = Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: Pin functions T1OSO and T1OSI are reversed on the PIC16C64.
2: CCP2 and the USART are not available on the PIC16C64/64A/R64.
3: This buffer is a Schmitt Trigger input when configured in RC oscillator mode and a CMOS input otherwise.
4: This buffer is a Schmitt Trigger input when configured as the external interrupt.
5: This buffer is a Schmitt Trigger input when used in serial programming mode.
6: This buffer is a Schmitt Trigger input when configured as general purpose I/O and a TTL input when used in the Parallel Slave
Port mode (for interfacing to a microprocessor bus).
1997-2013 Microchip Technology Inc. DS30234E-page 17
PIC16C6X
PORTD can be a bi-directional I/O port or parallel slave port
for interfacing to a microprocessor bus.
RD0/PSP0 19 21 38 I/O ST/TTL(6)
RD1/PSP1 20 22 39 I/O ST/TTL(6)
RD2/PSP2 21 23 40 I/O ST/TTL(6)
RD3/PSP3 22 24 41 I/O ST/TTL(6)
RD4/PSP4 27 30 2 I/O ST/TTL(6)
RD5/PSP5 28 31 3 I/O ST/TTL(6)
RD6/PSP6 29 32 4 I/O ST/TTL(6)
RD7/PSP7 30 33 5 I/O ST/TTL(6)
PORTE is a bi-directional I/O port.
RE0/RD 8 9 25 I/O ST/TTL(6) RE0 can also be read control for the parallel slave port.
RE1/WR 9 10 26 I/O ST/TTL(6) RE1 can also be write control for the parallel slave port.
RE2/CS 10 11 27 I/O ST/TTL(6) RE2 can also be select control for the parallel slave port.
VSS 12,31 13,34 6,29 P — Ground reference for logic and I/O pins.
VDD 11,32 12,35 7,28 P — Positive supply for logic and I/O pins.
NC — 1,17,
28,40
12,13,
33,34
— — These pins are not internally connected. These pins should
be left unconnected.
TABLE 3-3: PIC16C64/64A/R64/65/65A/R65/67 PINOUT DESCRIPTION (Cont.’d)
Pin Name DIP
Pin#
PLCC
Pin#
TQFP
MQFP
Pin#
Pin
Type
Buffer
Type Description
Legend: I = input O = output I/O = input/output P = power
— = Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: Pin functions T1OSO and T1OSI are reversed on the PIC16C64.
2: CCP2 and the USART are not available on the PIC16C64/64A/R64.
3: This buffer is a Schmitt Trigger input when configured in RC oscillator mode and a CMOS input otherwise.
4: This buffer is a Schmitt Trigger input when configured as the external interrupt.
5: This buffer is a Schmitt Trigger input when used in serial programming mode.
6: This buffer is a Schmitt Trigger input when configured as general purpose I/O and a TTL input when used in the Parallel Slave
Port mode (for interfacing to a microprocessor bus).
Clocking Scheme/Instruction Cycle Instruction Flow/Pipelining
PIC16C6X
DS30234E-page 18 1997-2013 Microchip Technology Inc.
3.1 Clocking Scheme/Instruction Cycle
The clock input (from OSC1) is internally divided by
four to generate four non-overlapping quadrature
clocks namely Q1, Q2, Q3, and Q4. Internally, the pro-
gram counter (PC) is incremented every Q1, the
instruction is fetched from the program memory and
latched into the instruction register in Q4. The instruc-
tion is decoded and executed during the following Q1
through Q4. The clock and instruction execution flow is
shown in Figure 3-5.
3.2 Instruction Flow/Pipelining
An “Instruction Cycle” consists of four Q cycles (Q1,
Q2, Q3, and Q4). The instruction fetch and execute are
pipelined such that fetch takes one instruction cycle
while decode and execute takes another instruction
cycle. However, due to the pipelining, each instruction
effectively executes in one cycle. If an instruction
causes the program counter to change (e.g. GOTO)
then two cycles are required to complete the instruction
(Example 3-1).
A fetch cycle begins with the program counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the “Instruction Register (IR)” in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3, and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
FIGURE 3-5: CLOCK/INSTRUCTION CYCLE
EXAMPLE 3-1: INSTRUCTION PIPELINE FLOW
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Q1
Q2
Q3
Q4
PC
(Program counter)
OSC2/CLKOUT
(RC mode)
PC PC+1 PC+2
Fetch INST (PC)
Execute INST (PC-1) Fetch INST (PC+1)
Execute INST (PC) Fetch INST (PC+2)
Execute INST (PC+1)
Internal
Phase
Clock
All instructions are single cycle, except for any program branches. These take two cycles since the fetch
instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed.
Tcy0 Tcy1 Tcy2 Tcy3 Tcy4 Tcy5
1. MOVLW 55h Fetch 1 Execute 1
2. MOVWF PORTB Fetch 2 Execute 2
3. CALL SUB_1 Fetch 3 Execute 3
4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush
5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1
A Name Devices
5152 52A R52 53 R53 54 54A R54 55 65A Has 55 57
Program Memory Organization |:|
Rese‘ Vecmr
Reset Veda!
1997-2013 Microchip Technology Inc. DS30234E-page 19
PIC16C6X
4.0 MEMORY ORGANIZATION
4.1 Program Memory Organization
The PIC16C6X family has a 13-bit program counter
capable of addressing an 8K x 14 program memory
space. The amount of program memory available to
each device is listed below:
For those devices with less than 8K program memory,
accessing a location above the physically implemented
address will cause a wraparound.
The reset vector is at 0000h and the interrupt vector is
at 0004h.
FIGURE 4-1: PIC16C61 PROGRAM
MEMORY MAP AND STACK
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Device Program
Memory Address Range
PIC16C61 1K x 14 0000h-03FFh
PIC16C62 2K x 14 0000h-07FFh
PIC16C62A 2K x 14 0000h-07FFh
PIC16CR62 2K x 14 0000h-07FFh
PIC16C63 4K x 14 0000h-0FFFh
PIC16CR63 4K x 14 0000h-0FFFh
PIC16C64 2K x 14 0000h-07FFh
PIC16C64A 2K x 14 0000h-07FFh
PIC16CR64 2K x 14 0000h-07FFh
PIC16C65 4K x 14 0000h-0FFFh
PIC16C65A 4K x 14 0000h-0FFFh
PIC16CR65 4K x 14 0000h-0FFFh
PIC16C66 8K x 14 0000h-1FFFh
PIC16C67 8K x 14 0000h-1FFFh
PC<12:0>
Stack Level 1
Stack Level 8
User Memory
Space
CALL, RETURN
RETFIE, RETLW
13
0000h
0004h
1FFFh
03FFh
0400h
On-chip Program
Memory
0005h
Reset Vector
Peripheral Interrupt Vector
FIGURE 4-2: PIC16C62/62A/R62/64/64A/
R64 PROGRAM MEMORY
MAP AND STACK
FIGURE 4-3: PIC16C63/R63/65/65A/R65
PROGRAM MEMORY MAP
AND STACK
PC<12:0>
Stack Level 1
Stack Level 8
User Memory
Space
CALL, RETURN
RETFIE, RETLW
13
0000h
0004h
1FFFh
07FFh
0800h
On-chip Program
Memory
0005h
Reset Vector
Peripheral Interrupt Vector
PC<12:0>
Stack Level 1
Stack Level 8
User Memory
Space
CALL, RETURN
RETFIE, RETLW
13
0000h
0004h
1FFFh
07FFh
0FFFh
0800h
1000h
On-chip Program
Memory (Page 0)
On-chip Program
Memory (Page 1)
0005h
Reset Vector
Peripheral Interrupt Vector
Rese‘ vmm
Data Memory Organizalion
A cable Dumas
2 2A 6 mm SAIEI
PIC16C6X
DS30234E-page 20 1997-2013 Microchip Technology Inc.
FIGURE 4-4: PIC16C66/67 PROGRAM
MEMORY MAP AND STACK
4.2 Data Memory Organization
The data memory is partitioned into multiple banks
which contain the General Purpose Registers and the
Special Function Registers. Bits RP1 and RP0 are the
bank select bits.
RP1:RP0 (STATUS<6:5>)
= 00 Bank0
= 01 Bank1
= 10 Bank2
= 11 Bank3
Each bank extends up to 7Fh (128 bytes). The lower
locations of each bank are reserved for the Special
Function Registers. Above the Special Function Regis-
ters are General Purpose Registers, implemented as
static RAM. All implemented banks contain special
function registers. Some “high use” special function
registers from one bank may be mirrored in another
bank for code reduction and quicker access.
4.2.1 GENERAL PURPOSE REGISTERS
These registers are accessed either directly or indi-
rectly through the File Select Register (FSR)
(Section 4.5).
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
PC<12:0>
Stack Level 1
Stack Level 8
User Memory
Space
CALL, RETURN
RETFIE, RETLW
13
0000h
0004h
0FFFh
1000h
On-chip Program
Memory (Page 0)
On-chip Program
Memory (Page 1)
0005h
Reset Vector
Peripheral Interrupt Vector
07FFh
0800h
On-chip Program
Memory (Page 2)
On-chip Program
Memory (Page 3)
17FFh
1800h
1FFFh
For the PIC16C61, general purpose register locations
8Ch-AFh of Bank 1 are not physically implemented.
These locations are mapped into 0Ch-2Fh of Bank 0.
FIGURE 4-5: PIC16C61 REGISTER FILE
MAP
File Address
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
2Fh
30h
7Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
AFh
B0h
FFh
Bank 0 Bank 1
INDF(1) INDF(1)
TMR0 OPTION
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
General
Purpose
Register
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
Mapped
in Bank 0(2)
Unimplemented data memory location; read as '0'.
Note 1: Not a physical register.
2: These locations are unimplemented in
Bank 1. Any access to these locations will
access the corresponding Bank 0 register.
File Address
es:
1997-2013 Microchip Technology Inc. DS30234E-page 21
PIC16C6X
FIGURE 4-6: PIC16C62/62A/R62/64/64A/
R64 REGISTER FILE MAP
File Address
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
7Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
FFh
Bank 0 Bank 1
INDF(1) INDF(1)
TMR0 OPTION
PCL
STATUS
FSR
PORTA
PORTB
PORTD(2)
PORTE(2)
PCLATH
INTCON
PCL
STATUS
FSR
TRISA
TRISB
TRISD(2)
TRISE(2)
PCLATH
INTCON
Unimplemented data memory location; read as '0'.
PORTC TRISC
PIR1 PIE1
TMR1L PCON
TMR1H
T1CON
TMR2
T2CON PR2
SSPBUF SSPADD
SSPSTAT
SSPCON
CCPR1L
CCPR1H
CCP1CON
General
Purpose
Register
0Dh 8Dh
0Eh 8Eh
0Fh 8Fh
10h 90h
11h 91h
12h 92h
13h 93h
14h 94h
15h 95h
16h 96h
17h 97h
18h 98h
1Fh 9Fh
20h A0h
BFh
C0h
General
Purpose
Register
Note 1: Not a physical register.
2: PORTD and PORTE are not available on
the PIC16C62/62A/R62.
File Address
FIGURE 4-7: PIC16C63/R63/65/65A/R65
REGISTER FILE MAP
File Address
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
7Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
FFh
Bank 0 Bank 1
INDF(1) INDF(1)
TMR0 OPTION
PCL
STATUS
FSR
PORTA
PORTB
PORTD(2)
PORTE(2)
PCLATH
INTCON
PCL
STATUS
FSR
TRISA
TRISB
TRISD(2)
TRISE(2)
PCLATH
INTCON
Unimplemented data memory location; read as '0'.
PORTC TRISC
PIR1 PIE1
PIR2 PIE2
TMR1L PCON
TMR1H
T1CON
TMR2
T2CON PR2
SSPBUF SSPADD
SSPSTAT
SSPCON
CCPR1L
CCPR1H
CCP1CON
CCPR2L
CCPR2H
CCP2CON
RCSTA
TXREG
RCREG
TXSTA
SPBRG
General
Purpose
Register
General
Purpose
Register
0Dh 8Dh
0Eh 8Eh
0Fh 8Fh
10h 90h
11h 91h
12h 92h
13h 93h
14h 94h
15h 95h
16h 96h
17h 97h
18h 98h
19h 99h
1Ah 9Ah
1Bh 9Bh
1Ch 9Ch
1Dh 9Dh
1Eh 9Eh
1Fh 9Fh
20h A0h
Note 1: Not a physical register
2: PORTD and PORTE are not available on
the PIC16C63/R63.
File Address
F'CLATH
INTCON
F'CLATH
\NTCON
PIC16C6X
DS30234E-page 22 1997-2013 Microchip Technology Inc.
FIGURE 4-8: PIC16C66/67 DATA MEMORY MAP
Indirect addr.(*)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PORTC
PCLATH
INTCON
PIR1
TMR1L
TMR1H
T1CON
TMR2
T2CON
SSPBUF
SSPCON
CCPR1L
CCPR1H
CCP1CON
OPTION
PCL
STATUS
FSR
TRISA
TRISB
TRISC
PCLATH
INTCON
PIE1
PCON
PR2
SSPADD
SSPSTAT
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
20h A0h
7Fh FFh
Bank 0 Bank 1
Unimplemented data memory locations, read as '0'.
* Not a physical register.
These registers are not implemented on the PIC16C66.
Note: The upper 16 bytes of data memory in banks 1, 2, and 3 are mapped in Bank 0. This may require
relocation of data memory usage in the user application code if upgrading to the PIC16C66/67.
File
Address
Indirect addr.(*) Indirect addr.(*)
PCL
STATUS
FSR
PCLATH
INTCON
PCL
STATUS
FSR
PCLATH
INTCON
100h
101h
102h
103h
104h
105h
106h
107h
108h
109h
10Ah
10Bh
10Ch
10Dh
10Eh
10Fh
110h
111h
112h
113h
114h
115h
116h
117h
118h
119h
11Ah
11Bh
11Ch
11Dh
11Eh
11Fh
180h
181h
182h
183h
184h
185h
186h
187h
188h
189h
18Ah
18Bh
18Ch
18Dh
18Eh
18Fh
190h
191h
192h
193h
194h
195h
196h
197h
198h
199h
19Ah
19Bh
19Ch
19Dh
19Eh
19Fh
120h 1A0h
17Fh 1FFh
Bank 2 Bank 3
Indirect addr.(*)
PORTD
PORTE
TRISD
TRISE
TMR0 OPTION
PIR2 PIE2
RCSTA
TXREG
RCREG
CCPR2L
CCPR2H
CCP2CON
TXSTA
SPBRG
General
Purpose
Register
General
Purpose
Register
General
Purpose
Register
General
Purpose
Register
1EFh
1F0h
EFh
F0h
16Fh
170h
General
Purpose
Register
General
Purpose
Register
TRISB
PORTB
96 Bytes 80 Bytes 80 Bytes 80 Bytes
16 Bytes 16 Bytes
(1)
(1)
(1)
(1)
accesses
70h-7Fh
in Bank 0
accesses
70h-7Fh
in Bank 0
accesses
70h-7Fh
in Bank 0
1997-2013 Microchip Technology Inc. DS30234E-page 23
PIC16C6X
4.2.2 SPECIAL FUNCTION REGISTERS:
The Special Function Registers are registers used by
the CPU and peripheral modules for controlling the
desired operation of the device. These registers are
implemented as static RAM.
The special function registers can be classified into two
sets (core and peripheral). The registers associated
with the “core” functions are described in this section
and those related to the operation of the peripheral fea-
tures are described in the section of that peripheral fea-
ture.
TABLE 4-1: SPECIAL FUNCTION REGISTERS FOR THE PIC16C61
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:
POR
Value on
all other
resets(3)
Bank 0
00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h(1) STATUS IRP(4) RP1(4) RP0 TO PD ZDCC0001 1xxx 000q quuu
04h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA ——— PORTA Data Latch when written: PORTA pins when read ---x xxxx ---u uuuu
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h —Unimplemented — —
08h —Unimplemented — —
09h —Unimplemented — —
0Ah(1,2) PCLATH ——— Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh(1) INTCON GIE — T0IE INTE RBIE T0IF INTF RBIF 0-00 000x 0-00 000u
Bank 1
80h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h(1) STATUS IRP(4) RP1(4) RP0 TO PD ZDCC0001 1xxx 000q quuu
84h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA ——— PORTA Data Direction Register ---1 1111 ---1 1111
86h TRISB PORTB Data Direction Control Register 1111 1111 1111 1111
87h –Unimplemented — —
88h –Unimplemented — —
89h –Unimplemented — —
8Ah(1,2) PCLATH ——— Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh(1) INTCON GIE — T0IE INTE RBIE T0IF INTF RBIF 0-00 000x 0-00 000u
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented locations read as '0'.
Shaded locations are unimplemented and read as ‘0’
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose con-
tents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer Reset.
4: The IRP and RP1 bits are reserved on the PIC16C61, always maintain these bits clear.
PIC16C6X
DS30234E-page 24 1997-2013 Microchip Technology Inc.
TABLE 4-2: SPECIAL FUNCTION REGISTERS FOR THE PIC16C62/62A/R62
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Bank 0
00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h(1) STATUS IRP(5) RP1(5) RP0 TO PD ZDCC0001 1xxx 000q quuu
04h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA —— PORTA Data Latch when written: PORTA pins when read --xx xxxx --uu uuuu
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu
08h —Unimplemented — —
09h —Unimplemented — —
0Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 (6) (6) —— SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000
0Dh —Unimplemented — —
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
11h TMR2 Timer2 module’s register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON —— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
18h-1Fh —Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: The BOR bit is reserved on the PIC16C62, always maintain this bit set.
5: The IRP and RP1 bits are reserved on the PIC16C62/62A/R62, always maintain these bits clear.
6: PIE1<7:6> and PIR1<7:6> are reserved on the PIC16C62/62A/R62, always maintain these bits clear.
1997-2013 Microchip Technology Inc. DS30234E-page 25
PIC16C6X
Bank 1
80h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h(1) STATUS IRP(5) RP1(5) RP0 TO PD ZDCC0001 1xxx 000q quuu
84h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA —— PORTA Data Direction Register --11 1111 --11 1111
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
88h —Unimplemented — —
89h —Unimplemented — —
8Ah(1,2) PCLATH ———Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
8Ch PIE1 (6) (6) —— SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000
8Dh —Unimplemented — —
8Eh PCON ——— — ——POR
BOR(4) ---- --qq ---- --uu
8Fh —Unimplemented — —
90h —Unimplemented — —
91h —Unimplemented — —
92h PR2 Timer2 Period Register 1111 1111 1111 1111
93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000
94h SSPSTAT ——D/A PSR/WUA BF --00 0000 --00 0000
95h-9Fh —Unimplemented — —
TABLE 4-2: SPECIAL FUNCTION REGISTERS FOR THE PIC16C62/62A/R62 (Cont.’d)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: The BOR bit is reserved on the PIC16C62, always maintain this bit set.
5: The IRP and RP1 bits are reserved on the PIC16C62/62A/R62, always maintain these bits clear.
6: PIE1<7:6> and PIR1<7:6> are reserved on the PIC16C62/62A/R62, always maintain these bits clear.
1997-2013 Microchip Technology Inc. DS30234E-page 26
PIC16C6X
TABLE 4-3: SPECIAL FUNCTION REGISTERS FOR THE PIC16C63/R63
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Bank 0
00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h(1) STATUS IRP(4) RP1(4) RP0 TO PD ZDCC0001 1xxx 000q quuu
04h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA —— PORTA Data Latch when written: PORTA pins when read --xx xxxx --uu uuuu
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu
08h —Unimplemented — —
09h —Unimplemented — —
0Ah(1,2) PCLATH ——— Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 (5) (5) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
0Dh PIR2 ————– — — —CCP2IF---- ---0 ---- ---0
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
11h TMR2 Timer2 module’s register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON —— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x
19h TXREG USART Transmit Data Register 0000 0000 0000 0000
1Ah RCREG USART Receive Data Register 0000 0000 0000 0000
1Bh CCPR2L Capture/Compare/PWM2 (LSB) xxxx xxxx uuuu uuuu
1Ch CCPR2H Capture/Compare/PWM2 (MSB) xxxx xxxx uuuu uuuu
1Dh CCP2CON —— CCP2X CCP2Y CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000
1Eh-1Fh —Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: The IRP and RP1 bits are reserved on the PIC16C63/R63, always maintain these bits clear.
5: PIE1<7:6> and PIR1<7:6> are reserved on the PIC16C63/R63, always maintain these bits clear.
1997-2013 Microchip Technology Inc. DS30234E-page 27
PIC16C6X
Bank 1
80h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h(1) STATUS IRP(4) RP1(4) RP0 TO PD ZDCC0001 1xxx 000q quuu
84h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA —— PORTA Data Direction Register --11 1111 --11 1111
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
88h —Unimplemented — —
89h —Unimplemented — —
8Ah(1,2) PCLATH ———Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
8Ch PIE1 (5) (5) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
8Dh PIE2 — — — — — — —CCP2IE---- ---0 ---- ---0
8Eh PCON ——— — ——PORBOR ---- --qq ---- --uu
8Fh —Unimplemented — —
90h —Unimplemented — —
91h —Unimplemented — —
92h PR2 Timer2 Period Register 1111 1111 1111 1111
93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000
94h SSPSTAT ——D/A PSR/WUA BF --00 0000 --00 0000
95h —Unimplemented — —
96h —Unimplemented — —
97h —Unimplemented — —
98h(2) TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010
99h(2) SPBRG Baud Rate Generator Register 0000 0000 0000 0000
9Ah —Unimplemented — —
9Bh —Unimplemented — —
9Ch —Unimplemented — —
9Dh —Unimplemented — —
9Eh —Unimplemented — —
9Fh —Unimplemented — —
TABLE 4-3: SPECIAL FUNCTION REGISTERS FOR THE PIC16C63/R63 (Cont.’d)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: The IRP and RP1 bits are reserved on the PIC16C63/R63, always maintain these bits clear.
5: PIE1<7:6> and PIR1<7:6> are reserved on the PIC16C63/R63, always maintain these bits clear.
PIC16C6X
DS30234E-page 28 1997-2013 Microchip Technology Inc.
TABLE 4-4: SPECIAL FUNCTION REGISTERS FOR THE PIC16C64/64A/R64
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Bank 0
00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h(1) STATUS IRP(5) RP1(5) RP0 TO PD ZDCC0001 1xxx 000q quuu
04h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA —— PORTA Data Latch when written: PORTA pins when read --xx xxxx --uu uuuu
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu
08h PORTD PORTD Data Latch when written: PORTD pins when read xxxx xxxx uuuu uuuu
09h PORTE — — — — —RE2RE1RE0---- -xxx ---- -uuu
0Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF (6) —— SSPIF CCP1IF TMR2IF TMR1IF 00-- 0000 00-- 0000
0Dh —Unimplemented — —
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
11h TMR2 Timer2 module’s register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON —— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
18h-1Fh —Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: The BOR bit is reserved on the PIC16C64, always maintain this bit set.
5: The IRP and RP1 bits are reserved on the PIC16C64/64A/R64, always maintain these bits clear.
6: PIE1<6> and PIR1<6> are reserved on the PIC16C64/64A/R64, always maintain these bits clear.
1997-2013 Microchip Technology Inc. DS30234E-page 29
PIC16C6X
Bank 1
80h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h(1) STATUS IRP(5) RP1(5) RP0 TO PD ZDCC0001 1xxx 000q quuu
84h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA —— PORTA Data Direction Register --11 1111 --11 1111
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
88h TRISD PORTD Data Direction Register 1111 1111 1111 1111
89h TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction Bits 0000 -111 0000 -111
8Ah(1,2) PCLATH ———Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
8Ch PIE1 PSPIE (6) —— SSPIE CCP1IE TMR2IE TMR1IE 00-- 0000 00-- 0000
8Dh —Unimplemented — —
8Eh PCON ——— — ——POR
BOR(4) ---- --qq ---- --uu
8Fh —Unimplemented — —
90h —Unimplemented — —
91h —Unimplemented — —
92h PR2 Timer2 Period Register 1111 1111 1111 1111
93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000
94h SSPSTAT ——D/A PSR/WUA BF --00 0000 --00 0000
95h-9Fh —Unimplemented — —
TABLE 4-4: SPECIAL FUNCTION REGISTERS FOR THE PIC16C64/64A/R64 (Cont.’d)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: The BOR bit is reserved on the PIC16C64, always maintain this bit set.
5: The IRP and RP1 bits are reserved on the PIC16C64/64A/R64, always maintain these bits clear.
6: PIE1<6> and PIR1<6> are reserved on the PIC16C64/64A/R64, always maintain these bits clear.
PIC16C6X
DS30234E-page 30 1997-2013 Microchip Technology Inc.
TABLE 4-5: SPECIAL FUNCTION REGISTERS FOR THE PIC16C65/65A/R65
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Bank 0
00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h(1) STATUS IRP(5) RP1(5) RP0 TO PD ZDCC0001 1xxx 000q quuu
04h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA —— PORTA Data Latch when written: PORTA pins when read --xx xxxx --uu uuuu
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu
08h PORTD PORTD Data Latch when written: PORTD pins when read xxxx xxxx uuuu uuuu
09h PORTE — — — — —RE2RE1RE0---- -xxx ---- -uuu
0Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF (6) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
0Dh PIR2 — — — —– — — —CCP2IF---- ---0 ---- ---0
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
11h TMR2 Timer2 module’s register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON —— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x
19h TXREG USART Transmit Data Register 0000 0000 0000 0000
1Ah RCREG USART Receive Data Register 0000 0000 0000 0000
1Bh CCPR2L Capture/Compare/PWM2 (LSB) xxxx xxxx uuuu uuuu
1Ch CCPR2H Capture/Compare/PWM2 (MSB) xxxx xxxx uuuu uuuu
1Dh CCP2CON —— CCP2X CCP2Y CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000
1Eh-1Fh —Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: The BOR bit is reserved on the PIC16C65, always maintain this bit set.
5: The IRP and RP1 bits are reserved on the PIC16C65/65A/R65, always maintain these bits clear.
6: PIE1<6> and PIR1<6> are reserved on the PIC16C65/65A/R65, always maintain these bits clear.
1997-2013 Microchip Technology Inc. DS30234E-page 31
PIC16C6X
Bank 1
80h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h(1) STATUS IRP(5) RP1(5) RP0 TO PD ZDCC0001 1xxx 000q quuu
84h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA —— PORTA Data Direction Register --11 1111 --11 1111
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
88h TRISD PORTD Data Direction Register 1111 1111 1111 1111
89h TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction Bits 0000 -111 0000 -111
8Ah(1,2) PCLATH ———Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
8Ch PIE1 PSPIE (6) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
8Dh PIE2 — — — — — — —CCP2IE---- ---0 ---- ---0
8Eh PCON ——— — ——POR
BOR(4) ---- --qq ---- --uu
8Fh —Unimplemented — —
90h —Unimplemented — —
91h —Unimplemented — —
92h PR2 Timer2 Period Register 1111 1111 1111 1111
93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000
94h SSPSTAT ——D/A PSR/WUA BF --00 0000 --00 0000
95h —Unimplemented — —
96h —Unimplemented — —
97h —Unimplemented — —
98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
9Ah —Unimplemented — —
9Bh —Unimplemented — —
9Ch —Unimplemented — —
9Dh —Unimplemented — —
9Eh —Unimplemented — —
9Fh —Unimplemented — —
TABLE 4-5: SPECIAL FUNCTION REGISTERS FOR THE PIC16C65/65A/R65 (Cont.’d)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from either bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: The BOR bit is reserved on the PIC16C65, always maintain this bit set.
5: The IRP and RP1 bits are reserved on the PIC16C65/65A/R65, always maintain these bits clear.
6: PIE1<6> and PIR1<6> are reserved on the PIC16C65/65A/R65, always maintain these bits clear.
PIC16C6X
DS30234E-page 32 1997-2013 Microchip Technology Inc.
TABLE 4-6: SPECIAL FUNCTION REGISTERS FOR THE PIC16C66/67
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Bank 0
00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
01h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
02h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
03h(1) STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu
04h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
05h PORTA —— PORTA Data Latch when written: PORTA pins when read --xx xxxx --uu uuuu
06h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
07h PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu
08h(5) PORTD PORTD Data Latch when written: PORTD pins when read xxxx xxxx uuuu uuuu
09h(5) PORTE — — — — —RE2RE1RE0---- -xxx ---- -uuu
0Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
0Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF(6) (4) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
0Dh PIR2 — — — —– — — —CCP2IF---- ---0 ---- ---0
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
11h TMR2 Timer2 module’s register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON —— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x
19h TXREG USART Transmit Data Register 0000 0000 0000 0000
1Ah RCREG USART Receive Data Register 0000 0000 0000 0000
1Bh CCPR2L Capture/Compare/PWM2 (LSB) xxxx xxxx uuuu uuuu
1Ch CCPR2H Capture/Compare/PWM2 (MSB) xxxx xxxx uuuu uuuu
1Dh CCP2CON —— CCP2X CCP2Y CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000
1Eh-1Fh —Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: PIE1<6> and PIR1<6> are reserved on the PIC16C66/67, always maintain these bits clear.
5: PORTD, PORTE, TRISD, and TRISE are not implemented on the PIC16C66, read as '0'.
6: PSPIF (PIR1<7>) and PSPIE (PIE1<7>) are reserved on the PIC16C66, maintain these bits clear.
1997-2013 Microchip Technology Inc. DS30234E-page 33
PIC16C6X
Bank 1
80h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h(1) STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu
84h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
85h TRISA —— PORTA Data Direction Register --11 1111 --11 1111
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
88h(5) TRISD PORTD Data Direction Register 1111 1111 1111 1111
89h(5) TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction Bits 0000 -111 0000 -111
8Ah(1,2) PCLATH ———Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
8Ch PIE1 PSPIE(6) (4) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
8Dh PIE2 — — — — — — —CCP2IE---- ---0 ---- ---0
8Eh PCON ——— — ——POR
BOR ---- --qq ---- --uu
8Fh —Unimplemented — —
90h —Unimplemented — —
91h —Unimplemented — —
92h PR2 Timer2 Period Register 1111 1111 1111 1111
93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000
94h SSPSTAT SMP CKE D/A PSR/WUA BF 0000 0000 0000 0000
95h —Unimplemented — —
96h —Unimplemented — —
97h —Unimplemented — —
98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
9Ah —Unimplemented — —
9Bh —Unimplemented — —
9Ch —Unimplemented — —
9Dh —Unimplemented — —
9Eh —Unimplemented — —
9Fh —Unimplemented — —
TABLE 4-6: SPECIAL FUNCTION REGISTERS FOR THE PIC16C66/67 (Cont.’d)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: PIE1<6> and PIR1<6> are reserved on the PIC16C66/67, always maintain these bits clear.
5: PORTD, PORTE, TRISD, and TRISE are not implemented on the PIC16C66, read as '0'.
6: PSPIF (PIR1<7>) and PSPIE (PIE1<7>) are reserved on the PIC16C66, maintain these bits clear.
PIC16C6X
DS30234E-page 34 1997-2013 Microchip Technology Inc.
Bank 2
100h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
101h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
102h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
103h(1) STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu
104h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
105h —Unimplemented — —
106h PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu
107h —Unimplemented — —
108h —Unimplemented — —
109h —Unimplemented — —
10Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
10Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
10Ch-
10Fh —Unimplemented — —
Bank 3
180h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000
181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
182h(1) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
183h(1) STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu
184h(1) FSR Indirect data memory address pointer xxxx xxxx uuuu uuuu
185h —Unimplemented — —
186h TRISB PORTB Data Direction Register 1111 1111 1111 1111
187h —Unimplemented — —
188h —Unimplemented — —
189h —Unimplemented — —
18Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
18Bh(1) INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
18Ch-
19Fh —Unimplemented — —
TABLE 4-6: SPECIAL FUNCTION REGISTERS FOR THE PIC16C66/67 (Cont.’d)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets(3)
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented location read as '0'.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: The upper byte of the Program Counter (PC) is not directly accessible. PCLATH is a holding register for the PC whose
contents are transferred to the upper byte of the program counter. (PC<12:8>)
3: Other (non power-up) resets include external reset through MCLR and the Watchdog Timer reset.
4: PIE1<6> and PIR1<6> are reserved on the PIC16C66/67, always maintain these bits clear.
5: PORTD, PORTE, TRISD, and TRISE are not implemented on the PIC16C66, read as '0'.
6: PSPIF (PIR1<7>) and PSPIE (PIE1<7>) are reserved on the PIC16C66, maintain these bits clear.
R/WrO
R wro
R/Wrfl
PH
FH
R/Wrx
wwrx
R Wrx
1997-2013 Microchip Technology Inc. DS30234E-page 35
PIC16C6X
4.2.2.1 STATUS REGISTER
The STATUS register, shown in Figure 4-9, contains
the arithmetic status of the ALU, the RESET status and
the bank select bits for data memory.
The STATUS register can be the destination for any
instruction, as with any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS will clear the upper-three
bits and set the Z bit. This leaves the STATUS register
as 000u u1uu (where u = unchanged).
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register because these instructions do not
affect the Z, C or DC bits from the STATUS register. For
other instructions, not affecting any status bits, see the
“Instruction Set Summary.”
Note 1: For those devices that do not use bits IRP
and RP1 (STATUS<7:6>), maintain these
bits clear to ensure upward compatibility
with future products.
Note 2: The C and DC bits operate as a borrow
and digit borrow bit, respectively, in sub-
traction. See the SUBLW and SUBWF
instructions for examples.
FIGURE 4-9: STATUS REGISTER (ADDRESS 03h, 83h, 103h, 183h)
R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD Z DC C R = Readable bit
W = Writable bit
- n = Value at POR reset
x = unknown
bit7 bit0
bit 7: IRP: RegIster Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h - 1FFh)
0 = Bank 0, 1 (00h - FFh)
bit 6-5: RP1:RP0: Register Bank Select bits (used for direct addressing)
11 = Bank 3 (180h - 1FFh)
10 = Bank 2 (100h - 17Fh)
01 = Bank 1 (80h - FFh)
00 = Bank 0 (00h - 7Fh)
Each bank is 128 bytes.
bit 4: TO: Time-out bit
1 = After power-up, CLRWDT instruction, or SLEEP instruction
0 = A WDT time-out occurred
bit 3: PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2: Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1: DC: Digit carry/borrow bit (for ADDWF, ADDLW,SUBLW, and SUBWF instructions) (For borrow the polarity is reversed).
1 = A carry-out from the 4th low order bit of the result occurred
0 = No carry-out from the 4th low order bit of the result
bit 0: C: Carry/borrow bit (for ADDWF, ADDLW,SUBLW, and SUBWF instructions)( For borrow the polarity is reversed).
1 = A carry-out from the most significant bit of the result occurred
0 = No carry-out from the most significant bit of the result
Note: a subtraction is executed by adding the two’s complement of the second operand.
For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order bit of the source register.
PIC16C6X
DS30234E-page 36 1997-2013 Microchip Technology Inc.
4.2.2.2 OPTION REGISTER
The OPTION register is a readable and writable regis-
ter which contains various control bits to configure the
TMR0/WDT prescaler, the external INT interrupt,
TMR0, and the weak pull-ups on PORTB.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: To achieve a 1:1 prescaler assignment for
TMR0 register, assign the prescaler to the
Watchdog Timer.
FIGURE 4-10: OPTION REGISTER (ADDRESS 81h, 181h)
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6: INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of RB0/INT pin
0 = Interrupt on falling edge of RB0/INT pin
bit 5: T0CS: TMR0 Clock Source Select bit
1 = Transition on RA4/T0CKI pin
0 = Internal instruction cycle clock (CLKOUT)
bit 4: T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on RA4/T0CKI pin
0 = Increment on low-to-high transition on RA4/T0CKI pin
bit 3: PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0: PS2:PS0: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
Bit Value TMR0 Rate WDT Rate
1997-2013 Microchip Technology Inc. DS30234E-page 37
PIC16C6X
4.2.2.3 INTCON REGISTER
The INTCON Register is a readable and writable regis-
ter which contains the various enable and flag bits for
the TMR0 register overflow, RB port change and exter-
nal RB0/INT pin interrupts.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>).
FIGURE 4-11: INTCON REGISTER (ADDRESS 0Bh, 8Bh, 10Bh 18Bh)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE PEIE T0IE INTE RBIE T0IF INTF RBIF R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
x = unknown
bit7 bit0
bit 7: GIE:(1) Global Interrupt Enable bit
1 = Enables all un-masked interrupts
0 = Disables all interrupts
bit 6: PEIE:(2) Peripheral Interrupt Enable bit
1 = Enables all un-masked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5: T0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 overflow interrupt
0 = Disables the TMR0 overflow interrupt
bit 4: INTE: RB0/INT External Interrupt Enable bit
1 = Enables the RB0/INT external interrupt
0 = Disables the RB0/INT external interrupt
bit 3: RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt
0 = Disables the RB port change interrupt
bit 2: T0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1: INTF: RB0/INT External Interrupt Flag bit
1 = The RB0/INT external interrupt occurred (must be cleared in software)
0 = The RB0/INT external interrupt did not occur
bit 0: RBIF: RB Port Change Interrupt Flag bit
1 = At least one of the RB7:RB4 pins changed state (see Section 5.2 to clear the interrupt)
0 = None of the RB7:RB4 pins have changed state
Note 1: For the PIC16C61/62/64/65, if an interrupt occurs while the GIE bit is being cleared, the GIE bit may unintentionally
be re-enabled by the RETFIE instruction in the user’s Interrupt Service Routine. Refer to Section 13.5 for a detailed
description.
2: The PEIE bit (bit6) is unimplemented on the PIC16C61, read as '0'.
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
PIC16C6X
DS30234E-page 38 1997-2013 Microchip Technology Inc.
4.2.2.4 PIE1 REGISTER
This register contains the individual enable bits for the
peripheral interrupts.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: Bit PEIE (INTCON<6>) must be set to
enable any peripheral interrupt.
FIGURE 4-12: PIE1 REGISTER FOR PIC16C62/62A/R62 (ADDRESS 8Ch)
RW-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — — SSPIE CCP1IE TMR2IE TMR1IE R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-6: Reserved: Always maintain these bits clear.
bit 5-4: Unimplemented: Read as '0'
bit 3: SSPIE: Synchronous Serial Port Interrupt Enable bit
1 = Enables the SSP interrupt
0 = Disables the SSP interrupt
bit 2: CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1: TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0: TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt
0 = Disables the TMR1 overflow interrupt
1997-2013 Microchip Technology Inc. DS30234E-page 39
PIC16C6X
FIGURE 4-13: PIE1 REGISTER FOR PIC16C63/R63/66 (ADDRESS 8Ch)
FIGURE 4-14: PIE1 REGISTER FOR PIC16C64/64A/R64 (ADDRESS 8Ch)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-6: Reserved: Always maintain these bits clear.
bit 5: RCIE: USART Receive Interrupt Enable bit
1 = Enables the USART receive interrupt
0 = Disables the USART receive interrupt
bit 4: TXIE: USART Transmit Interrupt Enable bit
1 = Enables the USART transmit interrupt
0 = Disables the USART transmit interrupt
bit 3: SSPIE: Synchronous Serial Port Interrupt Enable bit
1 = Enables the SSP interrupt
0 = Disables the SSP interrupt
bit 2: CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1: TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0: TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt
0 = Disables the TMR1 overflow interrupt
R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
PSPIE — — — SSPIE CCP1IE TMR2IE TMR1IE R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: PSPIE: Parallel Slave Port Read/Write Interrupt Enable bit
1 = Enables the PSP read/write interrupt
0 = Disables the PSP read/write interrupt
bit 6: Reserved: Always maintain this bit clear.
bit 5-4: Unimplemented: Read as '0'
bit 3: SSPIE: Synchronous Serial Port Interrupt Enable bit
1 = Enables the SSP interrupt
0 = Disables the SSP interrupt
bit 2: CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1: TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0: TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt
0 = Disables the TMR1 overflow interrupt
PIC16C6X
DS30234E-page 40 1997-2013 Microchip Technology Inc.
FIGURE 4-15: PIE1 REGISTER FOR PIC16C65/65A/R65/67 (ADDRESS 8Ch)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSPIE — RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: PSPIE: Parallel Slave Port Read/Write Interrupt Enable bit
1 = Enables the PSP read/write interrupt
0 = Disables the PSP read/write interrupt
bit 6: Reserved: Always maintain this bit clear.
bit 5: RCIE: USART Receive Interrupt Enable bit
1 = Enables the USART receive interrupt
0 = Disables the USART receive interrupt
bit 4: TXIE: USART Transmit Interrupt Enable bit
1 = Enables the USART transmit interrupt
0 = Disables the USART transmit interrupt
bit 3: SSPIE: Synchronous Serial Port Interrupt Enable bit
1 = Enables the SSP interrupt
0 = Disables the SSP interrupt
bit 2: CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1: TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0: TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow interrupt
0 = Disables the TMR1 overflow interrupt
Cgmme Mode
Comgare Mode
PWM Mode
1997-2013 Microchip Technology Inc. DS30234E-page 41
PIC16C6X
4.2.2.5 PIR1 REGISTER
This register contains the individual flag bits for the
peripheral interrupts.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>). User soft-
ware should ensure the appropriate inter-
rupt flag bits are clear prior to enabling an
interrupt.
FIGURE 4-16: PIR1 REGISTER FOR PIC16C62/62A/R62 (ADDRESS 0Ch)
R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — — SSPIF CCP1IF TMR2IF TMR1IF R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-6: Reserved: Always maintain these bits clear.
bit 5-4: Unimplemented: Read as '0'
bit 3: SSPIF: Synchronous Serial Port Interrupt Flag bit
1 = The transmission/reception is complete (must be cleared in software)
0 = Waiting to transmit/receive
bit 2: CCP1IF: CCP1 Interrupt Flag bit
Capture Mode
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare Mode
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM Mode
Unused in this mode
bit 1: TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0: TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflow occurred (must be cleared in software)
0 = No TMR1 register overflow occurred
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
Cagme Mode
Comgave Mode
PWM Mode
PIC16C6X
DS30234E-page 42 1997-2013 Microchip Technology Inc.
FIGURE 4-17: PIR1 REGISTER FOR PIC16C63/R63/66 (ADDRESS 0Ch)
R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-6: Reserved: Always maintain these bits clear.
bit 5: RCIF: USART Receive Interrupt Flag bit
1 = The USART receive buffer is full (cleared by reading RCREG)
0 = The USART receive buffer is empty
bit 4: TXIF: USART Transmit Interrupt Flag bit
1 = The USART transmit buffer is empty (cleared by writing to TXREG)
0 = The USART transmit buffer is full
bit 3: SSPIF: Synchronous Serial Port Interrupt Flag bit
1 = The transmission/reception is complete (must be cleared in software)
0 = Waiting to transmit/receive
bit 2: CCP1IF: CCP1 Interrupt Flag bit
Capture Mode
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare Mode
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM Mode
Unused in this mode
bit 1: TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0: TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflow occurred (must be cleared in software)
0 = No TMR1 register overflow occurred
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
Caglme Mode
Compare Mode
PWM Mode
1997-2013 Microchip Technology Inc. DS30234E-page 43
PIC16C6X
FIGURE 4-18: PIR1 REGISTER FOR PIC16C64/64A/R64 (ADDRESS 0Ch)
R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
PSPIF — — — SSPIF CCP1IF TMR2IF TMR1IF R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: PSPIF: Parallel Slave Port Interrupt Flag bit
1 = A read or a write operation has taken place (must be cleared in software)
0 = No read or write operation has taken place
bit 6: Reserved: Always maintain this bit clear.
bit 5-4: Unimplemented: Read as '0'
bit 3: SSPIF: Synchronous Serial Port Interrupt Flag bit
1 = The transmission/reception is complete (must be cleared in software)
0 = Waiting to transmit/receive
bit 2: CCP1IF: CCP1 Interrupt Flag bit
Capture Mode
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare Mode
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM Mode
Unused in this mode
bit 1: TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0: TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflow occurred (must be cleared in software)
0 = No TMR1 register occurred
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
Cagme Mode
Comgave Mode
PWM Mode
PIC16C6X
DS30234E-page 44 1997-2013 Microchip Technology Inc.
FIGURE 4-19: PIR1 REGISTER FOR PIC16C65/65A/R65/67 (ADDRESS 0Ch)
R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
PSPIF — RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: PSPIF: Parallel Slave Port Interrupt Flag bit
1 = A read or a write operation has taken place (must be cleared in software)
0 = No read or write operation has taken place
bit 6: Reserved: Always maintain this bit clear.
bit 5: RCIF: USART Receive Interrupt Flag bit
1 = The USART receive buffer is full (cleared by reading RCREG)
0 = The USART receive buffer is empty
bit 4: TXIF: USART Transmit Interrupt Flag bit
1 = The USART transmit buffer is empty (cleared by writing to TXREG)
0 = The USART transmit buffer is full
bit 3: SSPIF: Synchronous Serial Port Interrupt Flag bit
1 = The transmission/reception is complete (must be cleared in software)
0 = Waiting to transmit/receive
bit 2: CCP1IF: CCP1 Interrupt Flag bit
Capture Mode
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare Mode
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM Mode
Unused in this mode
bit 1: TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0: TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflow occurred (must be cleared in software)
0 = No TMR1 register overflow occurred
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
1997-2013 Microchip Technology Inc. DS30234E-page 45
PIC16C6X
4.2.2.6 PIE2 REGISTER
This register contains the CCP2 interrupt enable bit.
Applicable Devices
61 62 62A R6263R6364 64A R64 65 65A R65 66 67
FIGURE 4-20: PIE2 REGISTER (ADDRESS 8Dh)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
— — — — — — — CCP2IE R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-1: Unimplemented: Read as '0'
bit 0: CCP2IE: CCP2 Interrupt Enable bit
1 = Enables the CCP2 interrupt
0 = Disables the CCP2 interrupt
Cagme Mode
Comgave Mode
PWM Mode
PIC16C6X
DS30234E-page 46 1997-2013 Microchip Technology Inc.
4.2.2.7 PIR2 REGISTER
This register contains the CCP2 interrupt flag bit.
Applicable Devices
61 62 62A R6263R6364 64A R646565AR656667
.
Note: Interrupt flag bits get set when an interrupt
condition occurs regardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>). User soft-
ware should ensure the appropriate inter-
rupt flag bits are clear prior to enabling an
interrupt.
FIGURE 4-21: PIR2 REGISTER (ADDRESS 0Dh)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
— — — — — — — CCP2IF R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-1: Unimplemented: Read as '0'
bit 0: CCP2IF: CCP2 Interrupt Flag bit
Capture Mode
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare Mode
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM Mode
Unused in this mode
Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the
global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
1997-2013 Microchip Technology Inc. DS30234E-page 47
PIC16C6X
4.2.2.8 PCON REGISTER
The Power Control register (PCON) contains a flag bit
to allow differentiation between a Power-on Reset to an
external MCLR reset or WDT reset. Those devices with
brown-out detection circuitry contain an additional bit to
differentiate a Brown-out Reset condition from a Power-
on Reset condition.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: BOR is unknown on Power-on Reset. It
must then be set by the user and checked
on subsequent resets to see if BOR is
clear, indicating a brown-out has occurred.
The BOR status bit is a “don't care” and is
not necessarily predictable if the brown-out
circuit is disabled (by clearing the BODEN
bit in the Configuration word).
FIGURE 4-22: PCON REGISTER FOR PIC16C62/64/65 (ADDRESS 8Eh)
FIGURE 4-23: PCON REGISTER FOR PIC16C62A/R62/63/R63/64A/R64/65A/R65/66/67
(ADDRESS 8Eh)
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-q
— — — — — —POR— R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
q = value depends on conditions
bit7 bit0
bit 7-2: Unimplemented: Read as '0'
bit 1: POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0: Reserved
This bit should be set upon a Power-on Reset by user software and maintained as set. Use of this bit as a general
purpose read/write bit is not recommended, since this may affect upward compatibility with future products.
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-q
— — — — — —PORBOR R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
q = value depends on conditions
bit7 bit0
bit 7-2: Unimplemented: Read as '0'
bit 1: POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0: BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
PCL and PCLATH
Program Memory Paglng
Appucam: Devices
61‘62‘BZA‘REZ‘BS‘RBS‘EA‘EAA‘REA‘BS‘SSA‘HSS‘65‘67
\nstmuflmn Wm
|:I Ln
PIC16C6X
DS30234E-page 48 1997-2013 Microchip Technology Inc.
4.3 PCL and PCLATH
The program counter (PC) is 13-bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The upper bits (PC<12:8>) are not
readable, but are indirectly writable through the
PCLATH register. On any reset, the upper bits of the PC
will be cleared. Figure 4-24 shows the two situations for
the loading of the PC. The upper example in the figure
shows how the PC is loaded on a write to PCL
(PCLATH<4:0> PCH). The lower example in the fig-
ure shows how the PC is loaded during a CALL or GOTO
instruction (PCLATH<4:3> PCH).
FIGURE 4-24: LOADING OF PC IN
DIFFERENT SITUATIONS
4.3.1 COMPUTED GOTO
A computed GOTO is accomplished by adding an offset
to the program counter (ADDWF PCL). When doing a
table read using a computed GOTO method, care
should be exercised if the table location crosses a PCL
memory boundary (each 256 word block). Refer to the
application note
“Implementing a Table Read”
(AN556).
4.3.2 STACK
The PIC16CXX family has an 8 deep x 13-bit wide
hardware stack. The stack space is not part of either
program or data space and the stack pointer is not
readable or writable. The PC is PUSHed onto the stack
when a CALL instruction is executed or an interrupt
causes a branch. The stack is POPed in the event of a
RETURN, RETLW or a RETFIE instruction execution.
PCLATH is not affected by a PUSH or a POP operation.
The stack operates as a circular buffer. This means that
after the stack has been PUSHed eight times, the ninth
push overwrites the value that was stored from the first
push. The tenth push overwrites the second push (and
so on).
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
PC
12 8 7 0
5PCLATH<4:0>
PCLATH
Instruction with
PCL as
ALU
GOTO, CALL
Opcode <10:0>
8
PC
12 11 10 0
11
PCLATH<4:3>
PCH PCL
87
2
PCLATH
PCH PCL
destination
4.4 Program Memory Paging
PIC16C6X devices are capable of addressing a contin-
uous 8K word block of program memory. The CALL and
GOTO instructions provide only 11 bits of address to
allow branching within any 2K program memory page.
When doing a CALL or GOTO instruction the upper two
bits of the address are provided by PCLATH<4:3>.
When doing a CALL or GOTO instruction, the user must
ensure that the page select bits are programmed so
that the desired program memory page is addressed. If
a return from a CALL instruction (or interrupt) is exe-
cuted, the entire 13-bit PC is pushed onto the stack.
Therefore, manipulation of the PCLATH<4:3> bits are
not required for the return instructions (which POPs the
address from the stack).
Note 1: There are no status bits to indicate stack
overflows or stack underflow conditions.
Note 2: There are no instructions mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW, and RETFIE
instructions, or the vectoring to an inter-
rupt address
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: PIC16C6X devices with 4K or less of pro-
gram memory ignore paging bit
PCLATH<4>. The use of PCLATH<4> as a
general purpose read/write bit is not rec-
ommended since this may affect upward
compatibility with future products.
Indirecl Addressing INDF and FSR
Regislers
1997-2013 Microchip Technology Inc. DS30234E-page 49
PIC16C6X
Example 4-1 shows the calling of a subroutine in
page 1 of the program memory. This example assumes
that the PCLATH is saved and restored by the interrupt
service routine (if interrupts are used).
EXAMPLE 4-1: CALL OF A SUBROUTINE IN
PAGE 1 FROM PAGE 0
ORG 0x500
BSF PCLATH,3 ;Select page 1 (800h-FFFh)
BCF PCLATH,4 ;Only on >4K devices
CALL SUB1_P1 ;Call subroutine in
: ;page 1 (800h-FFFh)
:
:
ORG 0x900
SUB1_P1: ;called subroutine
: ;page 1 (800h-FFFh)
:
RETURN ;return to Call subroutine
;in page 0 (000h-7FFh)
4.5 Indirect Addressing, INDF and FSR
Registers
The INDF register is not a physical register. Address-
ing the INDF register will cause indirect addressing.
Indirect addressing is possible by using the INDF reg-
ister. Any instruction using the INDF register actually
accesses the register pointed to by the File Select Reg-
ister, FSR. Reading the INDF register itself indirectly
(FSR = '0') will produce 00h. Writing to the INDF regis-
ter indirectly results in a no-operation (although status
bits may be affected). An effective 9-bit address is
obtained by concatenating the 8-bit FSR register and
the IRP bit (STATUS<7>), as shown in Figure 4-25.
A simple program to clear RAM location 20h-2Fh using
indirect addressing is shown in Example 4-2.
EXAMPLE 4-2: INDIRECT ADDRESSING
movlw 0x20 ;initialize pointer
movwf FSR ; to RAM
NEXT clrf INDF ;clear INDF register
incf FSR,F ;inc pointer
btfss FSR,4 ;all done?
goto NEXT ;NO, clear next
CONTINUE
: ;YES, continue
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 4-25: DIRECT/INDIRECT ADDRESSING
For memory map detail see Figure 4-5, Figure 4-6, Figure 4-7, and Figure 4-8.
bank select bank select location select
location select
Direct Addressing Indirect Addressing
RP1: RP0 6 0
from opcode IRP 7 FSR 0
00 01 10 11
Bank 0 Bank 1 Bank 2 Bank 3
FFh
80h
Data
Memory
7Fh
00h
17Fh
100h
1FFh
180h
PIC16C6X
DS30234E-page 50 1997-2013 Microchip Technology Inc.
NOTES:
A Name Devices
5152 62A R62 53 R63 54 64A R64 65 65A ass as 67
PORTA and TRISA Regisler
A Name Devices
Ell- II-IMI-IEW
iala Lalch
mi, {%
1997-2013 Microchip Technology Inc. DS30234E-page 51
PIC16C6X
5.0 I/O PORTS
Some pins for these I/O ports are multiplexed with an
alternate function(s) for the peripheral features on the
device. In general, when a peripheral is enabled, that
pin may not be used as a general purpose I/O pin.
5.1 PORTA and TRISA Register
All devices have a 6-bit wide PORTA, except for the
PIC16C61 which has a 5-bit wide PORTA.
Pin RA4/T0CKI is a Schmitt Trigger input and an open
drain output. All other RA port pins have TTL input lev-
els and full CMOS output drivers. All pins have data
direction bits (TRIS registers) which can configure
these pins as output or input.
Setting a bit in the TRISA register puts the correspond-
ing output driver in a hi-impedance mode. Clearing a bit
in the TRISA register puts the contents of the output
latch on the selected pin.
Reading PORTA register reads the status of the pins
whereas writing to it will write to the port latch. All write
operations are read-modify-write operations. There-
fore, a write to a port implies that the port pins are read,
this value is modified, and then written to the port data
latch.
Pin RA4 is multiplexed with Timer0 module clock input
to become the RA4/T0CKI pin.
EXAMPLE 5-1: INITIALIZING PORTA
BCF STATUS, RP0 ;
BCF STATUS, RP1 ; PIC16C66/67 only
CLRF PORTA ; Initialize PORTA by
; clearing output
; data latches
BSF STATUS, RP0 ; Select Bank 1
MOVLW 0xCF ; Value used to
; initialize data
; direction
MOVWF TRISA ; Set RA<3:0> as inputs
; RA<5:4> as outputs
; TRISA<7:6> are always
; read as '0'.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 5-1: BLOCK DIAGRAM OF THE
RA3:RA0 PINS AND THE RA5
PIN
FIGURE 5-2: BLOCK DIAGRAM OF THE
RA4/T0CKI PIN
Data
bus
QD
Q
CK
QD
Q
CK
QD
EN
P
N
WR
Por t
WR
TRIS
Data Latch
TRIS Latch
RD TRIS
RD PORT
TTL
input
buffer
VSS
VDD
I/O pin(1)
Note 1: I/O pins have protection diodes to VDD and
VSS.
2: The PIC16C61 does not have an RA5 pin.
Data
bus
WR
PORT
WR
TRIS
RD PORT
Data Latch
TRIS Latch
RD TRIS
Schmitt
Tr i gg e r
input
buffer
N
VSS
I/O pin(1)
TMR0 clock input
Note 1: I/O pin has protection diodes to VSS only.
QD
Q
CK
QD
Q
CK
EN
QD
EN
PIC16C6X
DS30234E-page 52 1997-2013 Microchip Technology Inc.
TABLE 5-1: PORTA FUNCTIONS
TABLE 5-2: REGISTERS/BITS ASSOCIATED WITH PORTA
Name Bit# Buffer Type Function
RA0 bit0 TTL Input/output
RA1 bit1 TTL Input/output
RA2 bit2 TTL Input/output
RA3 bit3 TTL Input/output
RA4/T0CKI bit4 ST Input/output or external clock input for Timer0.
Output is open drain type.
RA5/SS (1) bit5 TTL Input/output or slave select input for synchronous serial port.
Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: The PIC16C61 does not have PORTA<5> or TRISA<5>, read as ‘0’.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
05h PORTA ——RA5
(1) RA4RA3RA2RA1RA0--xx xxxx --uu uuuu
85h TRISA — — PORTA Data Direction Register(1) --11 1111 --11 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by PORTA.
Note 1: PORTA<5> and TRISA<5> are not implemented on the PIC16C61, read as '0'.
PORTB and TRISE Register
A..\ am De
Ell- mm
Dam Lamh
7
X
:kguH
1997-2013 Microchip Technology Inc. DS30234E-page 53
PIC16C6X
5.2 PORTB and TRISB Register
PORTB is an 8-bit wide bi-directional port. The corre-
sponding data direction register is TRISB. Setting a bit
in the TRISB register puts the corresponding output
driver in a hi-impedance mode. Clearing a bit in the
TRISB register puts the contents of the output latch on
the selected pin(s).
EXAMPLE 5-2: INITIALIZING PORTB
BCF STATUS, RP0 ;
CLRF PORTB ; Initialize PORTB by
; clearing output
; data latches
BSF STATUS, RP0 ; Select Bank 1
MOVLW 0xCF ; Value used to
; initialize data
; direction
MOVWF TRISB ; Set RB<3:0> as inputs
; RB<5:4> as outputs
; RB<7:6> as inputs
Each of the PORTB pins has a weak internal pull-up. A
single control bit can turn on all the pull-ups. This is
performed by clearing bit RBPU (OPTION<7>). The
weak pull-up is automatically turned off when the port
pin is configured as an output. The pull-ups are also
disabled on a Power-on Reset.
Four of PORTB’s pins, RB7:RB4, have an interrupt on
change feature. Only pins configured as inputs can
cause this interrupt to occur (i.e., any RB7:RB4 pin
configured as an output is excluded from the interrupt
on change comparison). The input pins (of RB7:RB4)
are compared with the old value latched on the last
read of PORTB. The “mismatch” outputs of RB7:RB4
are OR’ed together to generate the RB port change
interrupt with flag bit RBIF (INTCON<0>).
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
This interrupt can wake the device from SLEEP. The
user, in the interrupt service routine, can clear the inter-
rupt in the following manner:
a) Any read or write of PORTB. This will end the
mismatch condition.
b) Clear flag bit RBIF.
A mismatch condition will continue to set flag bit RBIF.
Reading PORTB will end the mismatch condition, and
allow flag bit RBIF to be cleared.
This interrupt on mismatch feature, together with soft-
ware configurable pull-ups on these four pins allow
easy interface to a keypad and make it possible for
wake-up on key-depression. Refer to the Embedded
Control Handbook, Application Note,
“Implementing
Wake-up on Key Stroke” (AN552)
.
The interrupt on change feature is recommended for
wake-up on key depression operation and operations
where PORTB is only used for the interrupt on change
feature. Polling of PORTB is not recommended while
using the interrupt on change feature.
FIGURE 5-3: BLOCK DIAGRAM OF THE
RB7:RB4 PINS FOR
PIC16C61/62/64/65
Note: For PIC16C61/62/64/65, if a change on the
I/O pin should occur when a read operation
is being executed (start of the Q2 cycle),
then interrupt flag bit RBIF may not get set.
Data Latch
From other
RBPU(2)
P
VDD
I/O
QD
CK
QD
CK
QD
EN
QD
EN
Data bus
WR Port
WR TRIS
Set RBIF
TRIS Latch
RD TRIS
RD Port
RB7:RB4 pins
weak
pull-up
RD Port
Latch
TTL
Input
Buffer
pin(1)
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s)
and clear the RPBU bit (OPTION<7>).
ST
Buffer
RB7:RB6 in serial programming mode
um meh
\\
ixfi‘H H?
3k gml
PIC16C6X
DS30234E-page 54 1997-2013 Microchip Technology Inc.
FIGURE 5-4: BLOCK DIAGRAM OF THE
RB7:RB4 PINS FOR
PIC16C62A/63/R63/64A/65A/
R65/66/67
Data Latch
From other
RBPU(2)
P
VDD
I/O
QD
CK
QD
CK
QD
EN
QD
EN
Data bus
WR Port
WR TRIS
Set RBIF
TRIS Latch
RD TRIS
RD Port
RB7:RB4 pins
weak
pull-up
RD Port
Latch
TTL
Input
Buffer
pin(1)
Note 1: I/O pins have diode protection to VDD and VSS.
ST
Buffer
RB7:RB6 in serial programming mode
Q3
Q1
2: To enable weak pull-ups, set the appropriate TRIS bit(s)
and clear the RPBU bit (OPTION<7>).
FIGURE 5-5: BLOCK DIAGRAM OF THE
RB3:RB0 PINS
Data Latch
RBPU(2)
P
VDD
QD
CK
QD
CK
QD
EN
Data bus
WR Port
WR TRIS
RD TRIS
RD Port
weak
pull-up
RD Port
RB0/INT
I/O
pin(1)
TTL
Input
Buffer
Schmitt Trigger
Buffer
TRIS Latch
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s)
and clear the RPBU bit (OPTION<7>).
TABLE 5-3: PORTB FUNCTIONS
TABLE 5-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Name Bit# Buffer Type Function
RB0/INT bit0 TTL/ST(1) Input/output pin or external interrupt input. Internal software programmable
weak pull-up.
RB1 bit1 TTL Input/output pin. Internal software programmable weak pull-up.
RB2 bit2 TTL Input/output pin. Internal software programmable weak pull-up.
RB3 bit3 TTL Input/output pin. Internal software programmable weak pull-up.
RB4 bit4 TTL Input/output pin (with interrupt on change). Internal software programmable
weak pull-up.
RB5 bit5 TTL Input/output pin (with interrupt on change). Internal software programmable
weak pull-up.
RB6 bit6 TTL/ST(2) Input/output pin (with interrupt on change). Internal software programmable
weak pull-up. Serial programming clock.
RB7 bit7 TTL/ST(2) Input/output pin (with interrupt on change). Internal software programmable
weak pull-up. Serial programming data.
Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.
2: This buffer is a Schmitt Trigger input when used in serial programming mode.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
06h, 106h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuuu
86h, 186h TRISB PORTB Data Direction Register 1111 1111 1111 1111
81h, 181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB.
PORTC and TRISC Register
Apphcame Devices PORT/7PERWPHERAL Seweu
615252A R52 53 R53 54 54A R54 55 65A R65 55 57 7
‘ P
PORT x’ 7
ms 17 N
‘5 La
1997-2013 Microchip Technology Inc. DS30234E-page 55
PIC16C6X
5.3 PORTC and TRISC Register
PORTC is an 8-bit wide bi-directional port. Each pin is
individually configurable as an input or output through
the TRISC register. PORTC is multiplexed with several
peripheral functions (Table 5-5). PORTC pins have
Schmitt Trigger input buffers.
When enabling peripheral functions, care should be
taken in defining TRIS bits for each PORTC pin. Some
peripherals override the TRIS bit to make a pin an out-
put, while other peripherals override the TRIS bit to
make a pin an input. Since the TRIS bit override is in
effect while the peripheral is enabled, read-modify-
write instructions (BSF, BCF, XORWF) with TRISC as
destination should be avoided. The user should refer to
the corresponding peripheral section for the correct
TRIS bit settings.
EXAMPLE 5-3: INITIALIZING PORTC
BCF STATUS, RP0 ;
BCF STATUS, RP1 ; PIC16C66/67 only
CLRF PORTC ; Initialize PORTC by
; clearing output
; data latches
BSF STATUS, RP0 ; Select Bank 1
MOVLW 0xCF ; Value used to
; initialize data
; direction
MOVWF TRISC ; Set RC<3:0> as inputs
; RC<5:4> as outputs
; RC<7:6> as inputs
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 5-6: PORTC BLOCK DIAGRAM
PORT/PERIPHERAL Select(2)
Data bus
WR
PORT
WR
TRIS
RD
Data Latch
TRIS Latch
RD TRIS Schmitt
Tr i g g er
QD
Q
CK
QD
EN
Peripheral Data Out 0
1
QD
Q
CK
P
N
VDD
VSS
PORT
Peripheral
OE(3)
Peripheral input
I/O
pin(1)
Note 1: I/O pins have diode protection to VDD and VSS.
2: Port/Peripheral select signal selects between port
data and peripheral output.
3: Peripheral OE (output enable) is only activated if
peripheral select is active.
TABLE 5-5: PORTC FUNCTIONS FOR PIC16C62/64
Name Bit# Buffer Type Function
RC0/T1OSI/T1CKI bit0 ST Input/output port pin or Timer1 oscillator input or Timer1 clock input
RC1/T1OSO bit1 ST Input/output port pin or Timer1 oscillator output
RC2/CCP1 bit2 ST Input/output port pin or Capture1 input/Compare1 output/PWM1 output
RC3/SCK/SCL bit3 ST RC3 can also be the synchronous serial clock for both SPI and I2C modes.
RC4/SDI/SDA bit4 ST RC4 can also be the SPI Data In (SPI mode) or data I/O (I2C mode).
RC5/SDO bit5 ST Input/output port pin or synchronous serial port data output
RC6 bit6 ST Input/output port pin
RC7 bit7 ST Input/output port pin
Legend: ST = Schmitt Trigger input
PIC16C6X
DS30234E-page 56 1997-2013 Microchip Technology Inc.
TABLE 5-6: PORTC FUNCTIONS FOR PIC16C62A/R62/64A/R64
TABLE 5-7: PORTC FUNCTIONS FOR PIC16C63/R63/65/65A/R65/66/67
TABLE 5-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC
Name Bit# Buffer Type Function
RC0/T1OSO/T1CKI bit0 ST Input/output port pin or Timer1 oscillator output or Timer1 clock input
RC1/T1OSI bit1 ST Input/output port pin or Timer1 oscillator input
RC2/CCP1 bit2 ST Input/output port pin or Capture input/Compare output/PWM1 output
RC3/SCK/SCL bit3 ST RC3 can also be the synchronous serial clock for both SPI and I2C modes.
RC4/SDI/SDA bit4 ST RC4 can also be the SPI Data In (SPI mode) or data I/O (I2C mode).
RC5/SDO bit5 ST Input/output port pin or synchronous serial port data output
RC6 bit6 ST Input/output port pin
RC7 bit7 ST Input/output port pin
Legend: ST = Schmitt Trigger input
Name Bit# Buffer Type Function
RC0/T1OSO/T1CKI bit0 ST Input/output port pin or Timer1 oscillator output or Timer1 clock input
RC1/T1OSI/CCP2 bit1 ST Input/output port pin or Timer1 oscillator input or Capture2 input/Compare2
output/PWM2 output
RC2/CCP1 bit2 ST Input/output port pin or Capture1 input/Compare1 output/PWM1 output
RC3/SCK/SCL bit3 ST RC3 can also be the synchronous serial clock for both SPI and I2C modes.
RC4/SDI/SDA bit4 ST RC4 can also be the SPI Data In (SPI mode) or data I/O (I2C mode).
RC5/SDO bit5 ST Input/output port pin or synchronous serial port data output
RC6/TX/CK bit6 ST Input/output port pin or USART Asynchronous Transmit, or USART Syn-
chronous Clock
RC7/RX/DT bit7 ST Input/output port pin or USART Asynchronous Receive, or USART Syn-
chronous Data
Legend: ST = Schmitt Trigger input
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
07h PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged.
PORTD and TRISD Register
Apphcame Devices
5152 62A R62 53 R63 54 54A R54 55 65A ass as 57
%> X
X
as Lam
X
V
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1997-2013 Microchip Technology Inc. DS30234E-page 57
PIC16C6X
5.4 PORTD and TRISD Register
PORTD is an 8-bit port with Schmitt Trigger input buf-
fers. Each pin is individually configurable as input or
output.
PORTD can be configured as an 8-bit wide micropro-
cessor port (parallel slave port) by setting control bit
PSPMODE (TRISE<4>). In this mode, the input buffers
are TTL.
Applicable Devices
61 62 62A R62 63 R636464AR646565AR6566 67
FIGURE 5-7: PORTD BLOCK DIAGRAM
(IN I/O PORT MODE)
Data
bus
WR
PORT
WR
TRIS
RD PORT
Data Latch
TRIS Latch
RD TRIS
Schmitt
Trigger
input
buffer
I/O pin(1)
Note 1: I/O pins have protection diodes to VDD and VSS.
QD
CK
QD
CK
EN
QD
EN
TABLE 5-9: PORTD FUNCTIONS
TABLE 5-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD
Name Bit# Buffer Type Function
RD0/PSP0 bit0 ST/TTL(1) Input/output port pin or parallel slave port bit0
RD1/PSP1 bit1 ST/TTL(1) Input/output port pin or parallel slave port bit1
RD2/PSP2 bit2 ST/TTL(1) Input/output port pin or parallel slave port bit2
RD3/PSP3 bit3 ST/TTL(1) Input/output port pin or parallel slave port bit3
RD4/PSP4 bit4 ST/TTL(1) Input/output port pin or parallel slave port bit4
RD5/PSP5 bit5 ST/TTL(1) Input/output port pin or parallel slave port bit5
RD6/PSP6 bit6 ST/TTL(1) Input/output port pin or parallel slave port bit6
RD7/PSP7 bit7 ST/TTL(1) Input/output port pin or parallel slave port bit7
Legend: ST = Schmitt Trigger input, TTL = TTL input
Note 1: Buffer is a Schmitt Trigger when in I/O mode, and a TTL buffer when in Parallel Slave Port mode.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
08h PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx uuuu uuuu
88h TRISD PORTD Data Direction Register 1111 1111 1111 1111
89h TRISE IBF OBF IBOV PSPMODE —PORTE Data Direction Bits 0000 -111 0000 -111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by PORTD.
FORTE and TRISE Register
Appllcahle Dumas
m 52 62A n52 as H63 54 64A H54 55 55A R55 ea 57
PIC16C6X
DS30234E-page 58 1997-2013 Microchip Technology Inc.
5.5 PORTE and TRISE Register
PORTE has three pins, RE2/CS, RE1/WR, and
RE0/RD which are individually configurable as inputs
or outputs. These pins have Schmitt Trigger input buf-
fers.
I/O PORTE becomes control inputs for the micropro-
cessor port when bit PSPMODE (TRISE<4>) is set. In
this mode, the user must make sure that the
TRISE<2:0> bits are set (pins are configured as digital
inputs). In this mode the input buffers are TTL.
Figure 5-9 shows the TRISE register, which controls
the parallel slave port operation and also controls the
direction of the PORTE pins.
Applicable Devices
61 62 62A R62 63 R636464AR646565AR6566 67
FIGURE 5-8: PORTE BLOCK DIAGRAM
(IN I/O PORT MODE)
Data
bus
WR
PORT
WR
TRIS
RD PORT
Data Latch
TRIS Latch
RD TRIS
Schmitt
Tr i g g er
input
buffer
QD
CK
QD
CK
EN
QD
EN
I/O pin(1)
Note 1: I/O pins have protection diodes to VDD and VSS.
FIGURE 5-9: TRISE REGISTER (ADDRESS 89h)
R-0 R-0 R/W-0 R/W-0 U-0 R/W-1 R/W-1 R/W-1
IBF OBF IBOV PSPMODE — bit2 bit1 bit0 R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7 : IBF: Input Buffer Full Status bit
1 = A word has been received and is waiting to be read by the CPU
0 = No word has been received
bit 6: OBF: Output Buffer Full Status bit
1 = The output buffer still holds a previously written word
0 = The output buffer has been read
bit 5: IBOV: Input Buffer Overflow Detect bit (in microprocessor mode)
1 = A write occurred when a previously input word has not been read (must be cleared in software)
0 = No overflow occurred
bit 4: PSPMODE: Parallel Slave Port Mode Select bit
1 = Parallel slave port mode
0 = General purpose I/O mode
bit 3: Unimplemented: Read as '0'
PORTE Data Direction Bits
bit 2: Bit2: Direction Control bit for pin RE2/CS
1 = Input
0 = Output
bit 1: Bit1: Direction Control bit for pin RE1/WR
1 = Input
0 = Output
bit 0: Bit0: Direction Control bit for pin RE0/RD
1 = Input
0 = Output
1997-2013 Microchip Technology Inc. DS30234E-page 59
PIC16C6X
TABLE 5-11: PORTE FUNCTIONS
TABLE 5-12: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE
Name Bit# Buffer Type Function
RE0/RD bit0 ST/TTL(1) Input/output port pin or Read control input in parallel slave port mode.
RD
1 = Not a read operation
0 = Read operation. The system reads the PORTD register (if
chip selected)
RE1/WR bit1 ST/TTL(1) Input/output port pin or Write control input in parallel slave port mode.
WR
1 = Not a write operation
0 = Write operation. The system writes to the PORTD register (if
chip selected)
RE2/CS bit2 ST/TTL(1) Input/output port pin or Chip select control input in parallel slave port
mode.
CS
1 = Device is not selected
0 = Device is selected
Legend: ST = Schmitt Trigger input, TTL = TTL input
Note 1: Buffer is a Schmitt Trigger when in I/O mode, and a TTL buffer when in Parallel Slave Port (PSP) mode.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
09h PORTE — — — — —RE2RE1RE0---- -xxx ---- -uuu
89h TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction Bits 0000 -111 0000 -111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells not used by PORTE.
IIO Programming Considerations
A cable Dumas
2 2A 6 mm SAIEI
PIC16C6X
DS30234E-page 60 1997-2013 Microchip Technology Inc.
5.6 I/O Programming Considerations
5.6.1 BI-DIRECTIONAL I/O PORTS
Any instruction which writes, operates internally as a
read followed by a write operation. The BCF and BSF
instructions, for example, read the register into the
CPU, execute the bit operation and write the result back
to the register. Caution must be used when these
instructions are applied to a port with both inputs and
outputs defined. For example, a BSF operation on bit5
of PORTB will cause all eight bits of PORTB to be read
into the CPU. Then the BSF operation takes place on
bit5 and PORTB is written to the output latches. If
another bit of PORTB is used as a bi-directional I/O pin
(e.g., bit0) and it is defined as an input at this time, the
input signal present on the pin itself would be read into
the CPU and rewritten to the data latch of this particular
pin, overwriting the previous content. As long as the pin
stays in the input mode, no problem occurs. However, if
bit0 is switched into output mode later on, the content
of the data latch may now be unknown.
Reading the port register, reads the values of the port
pins. Writing to the port register writes the value to the
port latch. When using read-modify-write instructions
(ex. BCF, BSF, etc.) on a port, the value of the port pins
is read, the desired operation is done to this value, and
this value is then written to the port latch.
Example 5-4 shows the effect of two sequential
read-modify-write instructions on an I/O port.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
EXAMPLE 5-4: READ-MODIFY-WRITE
INSTRUCTIONS ON AN
I/O PORT
;Initial PORT settings: PORTB<7:4> Inputs
; PORTB<3:0> Outputs
;PORTB<7:6> have external pull-ups and are
;not connected to other circuitry
;
; PORT latch PORT pins
; ---------- ---------
BCF PORTB, 7 ; 01pp pppp 11pp pppp
BCF PORTB, 6 ; 10pp pppp 11pp pppp
BSF STATUS, RP0 ;
BCF TRISB, 7 ; 10pp pppp 11pp pppp
BCF TRISB, 6 ; 10pp pppp 10pp pppp
;
;Note that the user may have expected the
;pin values to be 00pp pppp. The 2nd BCF
;caused RB7 to be latched as the pin value
;(high).
A pin actively outputting a Low or High should not be
driven from external devices at the same time in order
to change the level on this pin (“wired-or”, “wired-and”).
The resulting high output currents may damage the
chip.
5.6.2 SUCCESSIVE OPERATIONS ON I/O PORTS
The actual write to an I/O port happens at the end of an
instruction cycle, whereas for reading, the data must be
valid at the beginning of the instruction cycle
(Figure 5-10). Therefore, care must be exercised if a
write followed by a read operation is carried out on the
same I/O port. The sequence of instructions should be
such to allow the pin voltage to stabilize (load depen-
dent) before the next instruction which causes that file
to be read into the CPU is executed. Otherwise, the
previous state of that pin may be read into the CPU
rather than the new state. When in doubt, it is better to
separate these instructions with a NOP or another
instruction not accessing this I/O port.
FIGURE 5-10: SUCCESSIVE I/O OPERATION
PC PC + 1 PC + 2 PC + 3
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Instruction
fetched
RB7:RB0
MOVWF PORTB
write to
PORTB
NOP
Port pin
sampled here
NOP
MOVF PORTB,W
Instruction
executed
MOVWF PORTB
write to
PORTB
NOP
MOVF PORTB,W
PC
TPD
Note:
This example shows a write to PORTB
followed by a read from PORTB.
Note that:
data setup time = (0.25TCY - TPD)
where TCY = instruction cycle
TPD = propagation delay
Therefore, at higher clock frequencies,
a write followed by a read may be prob-
lematic.
Parallel Slave Port
Applmahle Dev es
5152 52A R62 53 R53 54 54A R54 55 65A Has 65 57
1997-2013 Microchip Technology Inc. DS30234E-page 61
PIC16C6X
5.7 Parallel Slave Port
PORTD operates as an 8-bit wide parallel slave port
(microprocessor port) when control bit PSPMODE
(TRISE<4>) is set. In slave mode it is asynchronously
readable and writable by the external world through
RD control input (RE0/RD) and WR control input pin
(RE1/WR).
It can directly interface to an 8-bit microprocessor data
bus. The external microprocessor can read or write the
PORTD latch as an 8-bit latch. Setting PSPMODE
enables port pin RE0/RD to be the RD input, RE1/WR
to be the WR input and RE2/CS to be the CS (chip
select) input. For this functionality, the corresponding
data direction bits of the TRISE register (TRISE<2:0>)
must be configured as inputs (set).
There are actually two 8-bit latches, one for data-out
(from the PIC16/17) and one for data input. The user
writes 8-bit data to PORTD data latch and reads data
from the port pin latch (note that they have the same
address). In this mode, the TRISD register is ignored
since the microprocessor is controlling the direction of
data flow.
A write to the PSP occurs when both the CS and WR
lines are first detected low. When either the CS or WR
lines become high (level triggered), then the Input Buf-
fer Full status flag bit IBF (TRISE<7>) is set on the Q4
clock cycle, following the next Q2 cycle, to signal the
write is complete (Figure 5-12). The interrupt flag bit
PSPIF (PIR1<7>) is also set on the same Q4 clock
cycle. IBF can only be cleared by reading the PORTD
input latch. The input Buffer Overflow status flag bit
IBOV (TRISE<5>) is set if a second write to the Parallel
Slave Port is attempted when the previous byte has not
been read out of the buffer.
A read from the PSP occurs when both the CS and RD
lines are first detected low. The Output Buffer Full sta-
tus flag bit OBF (TRISE<6>) is cleared immediately
(Figure 5-13) indicating that the PORTD latch is waiting
to be read by the external bus. When either the CS or
RD pin becomes high (level triggered), the interrupt flag
bit PSPIF is set on the Q4 clock cycle, following the next
Q2 cycle, indicating that the read is complete. OBF
remains low until data is written to PORTD by the user
firmware.
When not in Parallel Slave Port mode, the IBF and OBF
bits are held clear. However, if flag bit IBOV was previ-
ously set, it must be cleared in firmware.
An interrupt is generated and latched into flag bit
PSPIF when a read or write operation is completed.
PSPIF must be cleared by the user in firmware and the
interrupt can be disabled by clearing the interrupt
enable bit PSPIE (PIE1<7>).
Applicable Devices
61 62 62A R62 63 R636464AR646565AR6566 67
FIGURE 5-11: PORTD AND PORTE AS A
PARALLEL SLAVE PORT
Data bus
WR
PORT
RD
RDx
QD
CK
EN
QD
EN
PORT
pin
One bit of PORTD
Set interrupt flag
PSPIF (PIR1<7>)
Read
Chip Select
Write
RD
CS
WR
Note: I/O pin has protection diodes to VDD and VSS.
TTL
TTL
TTL
TTL
PIC16C6X
DS30234E-page 62 1997-2013 Microchip Technology Inc.
FIGURE 5-12: PARALLEL SLAVE PORT WRITE WAVEFORMS
FIGURE 5-13: PARALLEL SLAVE PORT READ WAVEFORMS
TABLE 5-13: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
08h PORTD PSP7 PSP6 PSP5 PSP4 PSP3 PSP2 PSP1 PSP0 xxxx xxxx uuuu uuuu
09h PORTE — — — — — RE2 RE1 RE0 ---- -xxx ---- -uuu
89h TRISE IBF OBF IBOV PSPMODE —PORTE Data Direction Bits 0000 -111 0000 -111
0Ch PIR1 PSPIF (1) RCIF(2) TXIF(2) SSPIF CCP1IF TMR2IF TRM1IF 0000 0000 0000 0000
8Ch PIE1 PSPIE (1) RCIE(2) TXIE(2) SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by the PSP.
Note 1: These bits are reserved, always maintain these bits clear.
2: These bits are implemented on the PIC16C65/65A/R65/67 only.
Q1 Q2 Q3 Q4
CS
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
WR
RD
IBF
OBF
PSPIF
PORTD<7:0>
Q1 Q2 Q3 Q4
CS
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
WR
IBF
PSPIF
RD
OBF
PORTD<7:0>
A Name Devices
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Timer2 Overview
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cable Dev :5
Apphcame Devices
51 ‘62‘62A‘R52‘SS‘RSS‘SA‘BAA‘RBA‘BS‘ESA‘RES‘BS‘W
Ap
6‘ ‘BZ‘SZA‘HSZ‘ES‘HSB‘EA‘SAA‘REA‘SS‘BSA‘RBS‘SS‘W‘
1997-2013 Microchip Technology Inc. DS30234E-page 63
PIC16C6X
6.0 OVERVIEW OF TIMER
MODULES
All PIC16C6X devices have three timer modules except
for the PIC16C61, which has one timer module. Each
module can generate an interrupt to indicate that an
event has occurred (i.e., timer overflow). Each of these
modules are detailed in the following sections. The
timer modules are:
• Timer0 module (Section 7.0)
• Timer1 module (Section 8.0)
• Timer2 module (Section 9.0)
6.1 Timer0 Overview
The Timer0 module is a simple 8-bit overflow counter.
The clock source can be either the internal system
clock (Fosc/4) or an external clock. When the clock
source is an external clock, the Timer0 module can be
selected to increment on either the rising or falling
edge.
The Timer0 module also has a programmable pres-
caler option. This prescaler can be assigned to either
the Timer0 module or the Watchdog Timer. Bit PSA
(OPTION<3>) assigns the prescaler, and bits PS2:PS0
(OPTION<2:0>) determine the prescaler value. TMR0
can increment at the following rates: 1:1 when the pres-
caler is assigned to Watchdog Timer, 1:2, 1:4, 1:8,
1:16, 1:32, 1:64, 1:128, and 1:256.
Synchronization of the external clock occurs after the
prescaler. When the prescaler is used, the external
clock frequency may be higher then the device’s fre-
quency. The maximum frequency is 50 MHz, given the
high and low time requirements of the clock.
6.2 Timer1 Overview
Timer1 is a 16-bit timer/counter. The clock source can
be either the internal system clock (Fosc/4), an external
clock, or an external crystal. Timer1 can operate as
either a timer or a counter. When operating as a coun-
ter (external clock source), the counter can either oper-
ate synchronized to the device or asynchronously to
the device. Asynchronous operation allows Timer1 to
operate during sleep, which is useful for applications
that require a real-time clock as well as the power sav-
ings of SLEEP mode.
TImer1 also has a prescaler option which allows TMR1
to increment at the following rates: 1:1, 1:2, 1:4, and
1:8. TMR1 can be used in conjunction with the Capture/
Compare/PWM module. When used with a CCP mod-
ule, Timer1 is the time-base for 16-bit capture or 16-bit
compare and must be synchronized to the device.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
6.3 Timer2 Overview
Timer2 is an 8-bit timer with a programmable prescaler
and a programmable postscaler, as well as an 8-bit
Period Register (PR2). Timer2 can be used with the
CCP module (in PWM mode) as well as the Baud Rate
Generator for the Synchronous Serial Port (SSP). The
prescaler option allows Timer2 to increment at the fol-
lowing rates: 1:1, 1:4, and 1:16.
The postscaler allows TMR2 register to match the
period register (PR2) a programmable number of times
before generating an interrupt. The postscaler can be
programmed from 1:1 to 1:16 (inclusive).
6.4 CCP Overview
The CCP module(s) can operate in one of three modes:
16-bit capture, 16-bit compare, or up to 10-bit Pulse
Width Modulation (PWM).
Capture mode captures the 16-bit value of TMR1 into
the CCPRxH:CCPRxL register pair. The capture event
can be programmed for either the falling edge, rising
edge, fourth rising edge, or sixteenth rising edge of the
CCPx pin.
Compare mode compares the TMR1H:TMR1L register
pair to the CCPRxH:CCPRxL register pair. When a
match occurs, an interrupt can be generated and the
output pin CCPx can be forced to a given state (High or
Low) and Timer1 can be reset. This depends on control
bits CCPxM3:CCPxM0.
PWM mode compares the TMR2 register to a 10-bit
duty cycle register (CCPRxH:CCPRxL<5:4>) as well as
to an 8-bit period register (PR2). When the TMR2 reg-
ister = Duty Cycle register, the CCPx pin will be forced
low. When TMR2 = PR2, TMR2 is cleared to 00h, an
interrupt can be generated, and the CCPx pin (if an out-
put) will be forced high.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
PIC16C6X
DS30234E-page 64 1997-2013 Microchip Technology Inc.
NOTES:
TMRO Inlerru l
a
a
D
A
1997-2013 Microchip Technology Inc. DS30234E-page 65
PIC16C6X
7.0 TIMER0 MODULE
The Timer0 module has the following features:
• 8-bit timer/counter register, TMR0
- Read and write capability
- Interrupt on overflow from FFh to 00h
• 8-bit software programmable prescaler
• Internal or external clock select
- Edge select for external clock
Figure 7-1 is a simplified block diagram of the Timer0
module.
Timer mode is selected by clearing bit T0CS
(OPTION<5>). In timer mode, the Timer0 module will
increment every instruction cycle (without prescaler). If
TMR0 register is written, the increment is inhibited for
the following two instruction cycles (Figure 7-2 and
Figure 7-3). The user can work around this by writing
an adjusted value to the TMR0 register.
Counter mode is selected by setting bit T0CS. In this
mode, Timer0 will increment either on every rising or
falling edge of pin RA4/T0CKI. The incrementing edge
is determined by the source edge select bit T0SE
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
(OPTION<4>). Clearing bit T0SE selects the rising
edge. Restrictions on the external clock input are dis-
cussed in detail in Section 7.2.
The prescaler is mutually exclusively shared between
the Timer0 module and the Watchdog Timer. The pres-
caler assignment is controlled in software by control bit
PSA (OPTION<3>). Clearing bit PSA will assign the
prescaler to the Timer0 module. The prescaler is not
readable or writable. When the prescaler is assigned to
the Timer0 module, prescale values of 1:2, 1:4, ...,
1:256 are selectable. Section 7.3 details the operation
of the prescaler.
7.1 TMR0 Interrupt
The TMR0 interrupt is generated when the register
(TMR0) overflows from FFh to 00h. This overflow sets
interrupt flag bit T0IF (INTCON<2>). The interrupt can
be masked by clearing enable bit T0IE (INTCON<5>).
Flag bit T0IF must be cleared in software by the TImer0
interrupt service routine before re-enabling this inter-
rupt. The TMR0 interrupt cannot wake the processor
from SLEEP since the timer is shut off during SLEEP.
Figure 7-4 displays the Timer0 interrupt timing.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 7-1: TIMER0 BLOCK DIAGRAM
FIGURE 7-2: TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALER
Note 1: Bits, T0CS, T0SE, PSA, and PS2, PS1, PS0 are (OPTION<5:0).
2: The prescaler is shared with Watchdog Timer (refer to Figure 7-6 for detailed diagram).
RA4/T0CKI
T0SE
0
1
1
0
pin
T0CS
FOSC/4
Programmable
Prescaler
Sync with
Internal
clocks
TMR0 reg
PSout
(2 cycle delay)
PSout
Data bus
8
Set bit T0IF
on overflow
PSA
PS2, PS1, PS0
3
PC-1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
Instruction
Fetch
TMR0
PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
T0 T0+1 T0+2 NT0 NT0 NT0 NT0+1 NT0+2
MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Write TMR0
executed
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0 + 1
Read TMR0
reads NT0 + 2
Instruction
Executed
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PM __/’\4‘/_\_/_\ __/_\_/_\ J1 _/_\_/‘\_‘(_\_‘/‘\_/’\ _/’\J—\J1 AFLFL
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PIC16C6X
DS30234E-page 66 1997-2013 Microchip Technology Inc.
FIGURE 7-3: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
FIGURE 7-4: TMR0 INTERRUPT TIMING
PC-1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
(Program
Counter)
Instruction
Fetch
TMR0
PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6
T0 NT0+1
MOVWF TMR0 MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W MOVF TMR0,W
Write TMR0
executed
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0
Read TMR0
reads NT0 + 1
T0+1 NT0
Instruction
Execute
T0
Q2Q1 Q3 Q4Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
11
OSC1
CLKOUT(3)
Timer0
T0IF bit
(INTCON<2>)
FEh
GIE bit
(INTCON<7>)
INSTRUCTION
PC
Instruction
fetched
PC PC +1 PC +1 0004h 0005h
Instruction
executed
Inst (PC)
Inst (PC-1)
Inst (PC+1)
Inst (PC)
Inst (0004h) Inst (0005h)
Inst (0004h)Dummy cycle Dummy cycle
FFh 00h 01h 02h
Note 1: Interrupt flag bit T0IF is sampled here (every Q1).
2: Interrupt latency = 4Tcy where Tcy = instruction cycle time.
3: CLKOUT is available only in RC oscillator mode.
FLOW
Using Time!!! with External Clock
A..\ am De
Ell- mm
1997-2013 Microchip Technology Inc. DS30234E-page 67
PIC16C6X
7.2 Using Timer0 with External Clock
When an external clock input is used for Timer0, it must
meet certain requirements. The requirements ensure
the external clock can be synchronized with the internal
phase clock (T
OSC). Also, there is a delay in the actual
incrementing of Timer0 after synchronization.
7.2.1 EXTERNAL CLOCK SYNCHRONIZATION
When no prescaler is used, the external clock input is
the same as the prescaler output. The synchronization
of T0CKI with the internal phase clocks is accom-
plished by sampling the prescaler output on the Q2 and
Q4 cycles of the internal phase clocks (Figure 7-5).
Therefore, it is necessary for T0CKI to be high for at
least 2Tosc (and a small RC delay of 20 ns) and low for
at least 2Tosc (and a small RC delay of 20 ns). Refer to
the electrical specification of the desired device.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
When a prescaler is used, the external clock input is
divided by the asynchronous ripple-counter type pres-
caler so that the prescaler output is symmetrical. For
the external clock to meet the sampling requirement,
the ripple-counter must be taken into account. There-
fore, it is necessary for T0CKI to have a period of at
least 4Tosc (and a small RC delay of 40 ns) divided by
the prescaler value. The only requirement on T0CKI
high and low time is that they do not violate the mini-
mum pulse width requirement of 10 ns. Refer to param-
eters 40, 41 and 42 in the electrical specification of the
desired device.
7.2.2 TIMER0 INCREMENT DELAY
Since the prescaler output is synchronized with the
internal clocks, there is a small delay from the time the
external clock edge occurs to the time the Timer0 mod-
ule is actually incremented. Figure 7-5 shows the delay
from the external clock edge to the timer incrementing.
FIGURE 7-5: TIMER0 TIMING WITH EXTERNAL CLOCK
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
External Clock Input or
Prescaler output (2)
External Clock/Prescaler
Output after sampling
Increment Timer0 (Q4)
Timer0 T0 T0 + 1 T0 + 2
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc).
Therefore, the error in measuring the interval between two edges on Timer0 input = 4Tosc max.
2: External clock if no prescaler selected, prescaler output otherwise.
3: The arrows indicate the points in time where sampling occurs.
(3)
(1)
Small pulse
misses sampling
PIC16C6X
DS30234E-page 68 1997-2013 Microchip Technology Inc.
7.3 Prescaler
An 8-bit counter is available as a prescaler for the
Timer0 module or as a postscaler for the Watchdog
Timer (WDT), respectively (Figure 7-6). For simplicity,
this counter is being referred to as “prescaler” through-
out this data sheet. Note that the prescaler may be
used by either the Timer0 module or the Watchdog
Timer, but not both. Thus, a prescaler assignment for
the Timer0 module means that there is no prescaler for
the Watchdog Timer, and vice-versa.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
The PSA and PS2:PS0 bits (OPTION<3:0>) determine
the prescaler assignment and prescale ratio.
When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g. CLRF TMR0,
MOVWF TMR0, BSF TMR0,bitx) will clear the pres-
caler count. When assigned to the Watchdog Timer, a
CLRWDT instruction will clear the Watchdog Timer and
the prescaler count. The prescaler is not readable or
writable.
Note: Writing to TMR0 when the prescaler is
assigned to Timer0 will clear the prescaler
count, but will not change the prescaler
assignment.
FIGURE 7-6: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
RA4/T0CKI
T0SE
pin
M
U
X
CLKOUT (=Fosc/4)
SYNC
2
Cycles
TMR0 reg
8-bit Prescaler
8 - to - 1MUX
M
U
X
M U X
Watchdog
Timer
PSA
01
0
1
WDT
Time-out
PS2:PS0
8
Note: T0CS, T0SE, PSA, PS2:PS0 are (OPTION<5:0>).
PSA
WDT Enable bit
M
U
X
0
10
1
Data Bus
Set flag bit T0IF
on Overflow
8
PSA
T0CS
1997-2013 Microchip Technology Inc. DS30234E-page 69
PIC16C6X
7.3.1 SWITCHING PRESCALER ASSIGNMENT
The prescaler assignment is fully under software con-
trol, i.e., it can be changed “on the fly” during program
execution.
EXAMPLE 7-1: CHANGING PRESCALER (TIMER0WDT)
To change prescaler from the WDT to the Timer0 mod-
ule, use the sequence shown in Example 7-2.
EXAMPLE 7-2: CHANGING PRESCALER (WDTTIMER0)
CLRWDT ;Clear WDT and prescaler
BSF STATUS, RP0 ;Bank 1
MOVLW b'xxxx0xxx' ;Select TMR0, new prescale value and clock source
MOVWF OPTION_REG ;
BCF STATUS, RP0 ;Bank 0
TABLE 7-1: REGISTERS ASSOCIATED WITH TIMER0
Note: To avoid an unintended device RESET, the
following instruction sequence (shown in
Example 7-1) must be executed when
changing the prescaler assignment from
Timer0 to the WDT. This precaution must
be followed even if the WDT is disabled.
1) BSF STATUS, RP0 ;Bank 1
Lines 2 and 3 do NOT have to
be included if the final desired
prescale value is other than 1:1.
If 1:1 is final desired value, then
a temporary prescale value is
set in lines 2 and 3 and the final
prescale value will be set in lines
10 and 11.
2) MOVLW b'xx0x0xxx' ;Select clock source and prescale value of
3) MOVWF OPTION_REG ;other than 1:1
4) BCF STATUS, RP0 ;Bank 0
5) CLRF TMR0 ;Clear TMR0 and prescaler
6) BSF STATUS, RP1 ;Bank 1
7) MOVLW b'xxxx1xxx' ;Select WDT, do not change prescale value
8) MOVWF OPTION_REG ;
9) CLRWDT ;Clears WDT and prescaler
10) MOVLW b'xxxx1xxx' ;Select new prescale value and WDT
11) MOVWF OPTION_REG ;
12) BCF STATUS, RP0 ;Bank 0
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on all
other resets
01h, 101h TMR0 Timer0 module’s register xxxx xxxx uuuu uuuu
0Bh,8Bh,
10Bh,18Bh
INTCON GIE PEIE(1) T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
81h, 181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
85h TRISA — — PORTA Data Direction Register(1) --11 1111 --11 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by Timer0.
Note 1: TRISA<5> and bit PEIE are not implemented on the PIC16C61, read as '0'.
PIC16C6X
DS30234E-page 70 1997-2013 Microchip Technology Inc.
NOTES:
wmcs : I
wmcs :0
1997-2013 Microchip Technology Inc. DS30234E-page 71
PIC16C6X
8.0 TIMER1 MODULE
Timer1 is a 16-bit timer/counter consisting of two 8-bit
registers (TMR1H and TMR1L) which are readable and
writable. Register TMR1 (TMR1H:TMR1L) increments
from 0000h to FFFFh and rolls over to 0000h. The
TMR1 Interrupt, if enabled, is generated on overflow
which is latched in interrupt flag bit TMR1IF (PIR1<0>).
This interrupt can be enabled/disabled by setting/clear-
ing the TMR1 interrupt enable bit TMR1IE (PIE1<0>).
Timer1 can operate in one of two modes:
•As a timer
• As a counter
The operating mode is determined by clock select bit,
TMR1CS (T1CON<1>) (Figure 8-2).
In timer mode, Timer1 increments every instruction
cycle. In counter mode, it increments on every rising
edge of the external clock input.
Timer1 can be enabled/disabled by setting/clearing
control bit TMR1ON (T1CON<0>).
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Timer1 also has an internal “reset input”. This reset can
be generated by CCP1 or CCP2 (Capture/Compare/
PWM) module. See Section 10.0 for details. Figure 8-1
shows the Timer1 control register.
For the PIC16C62A/R62/63/R63/64A/R64/65A/R65/
R66/67, when the Timer1 oscillator is enabled
(T1OSCEN is set), the RC1 and RC0 pins become
inputs. That is, the TRISC<1:0> value is ignored.
For the PIC16C62/64/65, when the Timer1 oscillator is
enabled (T1OSCEN is set), RC1 pin becomes an input,
however the RC0 pin will have to be configured as an
input by setting the TRISC<0> bit.
The Timer1 module also has a software programmable
prescaler.
FIGURE 8-1: T1CON: TIMER1 CONTROL REGISTER (ADDRESS 10h)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7-6: Unimplemented: Read as '0'
bit 5-4: T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3: T1OSCEN: Timer1 Oscillator Enable Control bit
1 = Oscillator is enabled
0 = Oscillator is shut off
Note: The oscillator inverter and feedback resistor are turned off to eliminate power drain.
bit 2: T1SYNC: Timer1 External Clock Input Synchronization Control bit
TMR1CS = 1
1 = Do not synchronize external clock input
0 = Synchronize external clock input
TMR1CS = 0
This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.
bit 1: TMR1CS: Timer1 Clock Source Select bit
1 = External clock from T1OSI (on the rising edge) (See pinouts for pin with T1OSI function)
0 = Internal clock (Fosc/4)
bit 0: TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1
er1 Operation in Timer Mode
2 2A 6 mm SAIEI
mer1 Operation in Synchronized
Counter Mode
A
2A 6 “IN 6A-67
PIC16C6X
DS30234E-page 72 1997-2013 Microchip Technology Inc.
8.1 Timer1 Operation in Timer Mode
Timer mode is selected by clearing bit TMR1CS
(T1CON<1>). In this mode, the input clock to the timer
is Fosc/4. The synchronize control bit T1SYNC
(T1CON<2>) has no effect since the internal clock is
always in sync.
8.2 Timer1 Operation in Synchronized
Counter Mode
Counter mode is selected by setting bit TMR1CS. In
this mode the timer increments on every rising edge of
clock input on T1OSI when enable bit T1OSCEN is set
or pin with T1CKI when bit T1OSCEN is cleared.
If T1SYNC is cleared, then the external clock input is
synchronized with internal phase clocks. The synchro-
nization is done after the prescaler stage. The pres-
caler stage is an asynchronous ripple counter.
In this configuration, during SLEEP mode, Timer1 will
not increment even if an external clock is present, since
the synchronization circuit is shut off. The prescaler,
however, will continue to increment.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: The T1OSI function is multiplexed to differ-
ent pins, depending on the device. See the
pinout descriptions to see which pin has
the T1OSI function.
8.2.1 EXTERNAL CLOCK INPUT TIMING FOR
SYNCHRONIZED COUNTER MODE
When an external clock input is used for Timer1 in syn-
chronized counter mode, it must meet certain require-
ments. The external clock requirement is due to
internal phase clock (Tosc) synchronization. Also, there
is a delay in the actual incrementing of TMR1 after syn-
chronization.
When the prescaler is 1:1, the external clock input is
the same as the prescaler output. The synchronization
of T1CKI with the internal phase clocks is accom-
plished by sampling the prescaler output on the Q2 and
Q4 cycles of the internal phase clocks. Therefore, it is
necessary for T1CKI to be high for at least 2Tosc (and
a small RC delay of 20 ns) and low for at least 2Tosc
(and a small RC delay of 20 ns). Refer to appropriate
electrical specification section, parameters 45, 46, and
47.
When a prescaler other than 1:1 is used, the external
clock input is divided by the asynchronous ripple-coun-
ter type prescaler so that the prescaler output is sym-
metrical. In order for the external clock to meet the
sampling requirement, the ripple counter must be taken
into account. Therefore, it is necessary for T1CKI to
have a period of at least 4Tosc (and a small RC delay
of 40 ns) divided by the prescaler value. The only
requirement on T1CKI high and low time is that they do
not violate the minimum pulse width requirements of
10 ns). Refer to applicable electrical specification sec-
tion, parameters 40, 42, 45, 46, and 47.
FIGURE 8-2: TIMER1 BLOCK DIAGRAM
TMR1H TMR1L
T1OSC
T1SYNC
TMR1CS
T1CKPS1:T1CKPS0
SLEEP input
T1OSCEN
Enable
Oscillator(1)
TMR1IF
Overflow
Interrupt
Fosc/4
Internal
Clock
TMR1ON
on/off
Prescaler
1, 2, 4, 8
Synchronize
det
1
0
0
1
Synchronized
clock input
2
T1OSO(2)
T1OSI(2)
TMR1
flag bit
(3)
Note 1: When enable bit T1OSCEN is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.
2: See pinouts for pins with T1OSO and T1OSI functions.
3: For the PIC16C62/64/65, the Schmitt Trigger is not implemented in external clock mode.
Time" Operation in Asynchronous
Counter Mode
A. «name Devices
El. 2A 6 sal-EEII 5A-E557
T mer1 Oscillator
Applmzhle Devices
m 52 62A H62 53 H63 5A 54A R54 55 55A R55 as 57
1997-2013 Microchip Technology Inc. DS30234E-page 73
PIC16C6X
8.3 Timer1 Operation in Asynchronous
Counter Mode
If control bit T1SYNC (T1CON<2>) is set, the external
clock input is not synchronized. The timer continues to
increment asynchronous to the internal phase clocks.
The timer will continue to run during SLEEP and gener-
ate an interrupt on overflow which will wake the proces-
sor. However, special precautions in software are
needed to read-from or write-to the Timer1 register
pair, TMR1L and TMR1H (Section 8.3.2).
In asynchronous counter mode, Timer1 cannot be used
as a time-base for capture or compare operations.
8.3.1 EXTERNAL CLOCK INPUT TIMING WITH
UNSYNCHRONIZED CLOCK
If control bit T1SYNC is set, the timer will increment
completely asynchronously. The input clock must meet
certain minimum high time and low time requirements,
as specified in timing parameters (45 - 47).
8.3.2 READING AND WRITING TMR1 IN
ASYNCHRONOUS COUNTER MODE
Reading TMR1H or TMR1L, while the timer is running
from an external asynchronous clock, will ensure a
valid read (taken care of in hardware). However, the
user should keep in mind that reading the 16-bit timer
in two 8-bit values itself poses certain problems since
the timer may overflow between the reads.
For writes, it is recommended that the user simply stop
the timer and write the desired values. A write conten-
tion may occur by writing to the timer registers while the
register is incrementing. This may produce an unpre-
dictable value in the timer register.
Reading the 16-bit value requires some care.
Example 8-1 is an example routine to read the 16-bit
timer value. This is useful if the timer cannot be
stopped.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
EXAMPLE 8-1: READING A 16-BIT
FREE-RUNNING TIMER
; All Interrupts are disabled
MOVF TMR1H, W ;Read high byte
MOVWF TMPH ;
MOVF TMR1L, W ;Read low byte
MOVWF TMPL ;
MOVF TMR1H, W ;Read high byte
SUBWF TMPH, W ;Sub 1st read
;with 2nd read
BTFSC STATUS,Z ;is result = 0
GOTO CONTINUE ;Good 16-bit read
; TMR1L may have rolled over between the read
; of the high and low bytes. Reading the high
; and low bytes now will read a good value.
MOVF TMR1H, W ;Read high byte
MOVWF TMPH ;
MOVF TMR1L, W ;Read low byte
MOVWF TMPL ;
; Re-enable Interrupt (if required)
CONTINUE ;Continue with
: ;your code
8.4 Timer1 Oscillator
A crystal oscillator circuit is built in-between pins T1OSI
(input) and T1OSO (amplifier output). It is enabled by
setting control bit T1OSCEN (T1CON<3>). The oscilla-
tor is a low power oscillator rated up to 200 kHz. It will
continue to run during SLEEP. It is primarily intended
for a 32 kHz crystal. Table 8-1 shows the capacitor
selection for the Timer1 oscillator.
The Timer1 oscillator is identical to the LP oscillator.
The user must allow a software time delay to ensure
proper oscillator start-up.
TABLE 8-1: CAPACITOR SELECTION FOR
THE TIMER1 OSCILLATOR
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Osc Type Freq C1 C2
LP 32 kHz 33 pF 33 pF
100 kHz 15 pF 15 pF
200 kHz 15 pF 15 pF
These values are for design guidance only.
Crystals Tested:
32.768 kHz Epson C-001R32.768K-A 20 PPM
100 kHz Epson C-2 100.00 KC-P 20 PPM
200 kHz STD XTL 200.000 kHz 20 PPM
Note 1: Higher capacitance increases the stability
of oscillator but also increases the start-up
time.
2: Since each resonator/crystal has its own
characteristics, the user should consult the
resonator/crystal manufacturer for appropri-
ate values of external components.
Reseninq Time" usinq a GOP TriQQEV
Reseflinq of TMRI Reqister Pair
Output
MR1H MRIL
Appllcahle Dumas
Appucame Devices
m ‘52‘62A‘R62‘63‘H63‘54‘64A‘HEA‘SS‘ESA‘RES‘SE‘W‘
m ‘62‘52A‘RBZ‘BS‘RBS‘EA‘EAA‘REA‘BS‘SSA‘HSS‘EB‘E?
:
Ti mell Prescalel
Appucame Devices
m mamR52\samsa‘m‘awnm‘ss‘ssawasmay
PIC16C6X
DS30234E-page 74 1997-2013 Microchip Technology Inc.
8.5 Resetting Timer1 using a CCP Trigger
Output
CCP2 is implemented on the PIC16C63/R63/65/65A/
R65/66/67 only.
If CCP1 or CCP2 module is configured in Compare
mode to generate a “special event trigger”
(CCPxM3:CCPxM0 = 1011), this signal will reset
Timer1.
Timer1 must be configured for either timer or synchro-
nized counter mode to take advantage of this feature.
If the Timer1 is running in asynchronous counter mode,
this reset operation may not work.
In the event that a write to Timer1 coincides with a spe-
cial event trigger from CCP1 or CCP2, the write will
take precedence.
In this mode of operation, the CCPRxH:CCPRxL regis-
ters pair effectively becomes the period register for the
Timer1 module.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: The “special event trigger” from the
CCP1and CCP2 modules will not set inter-
rupt flag bit TMR1IF(PIR1<0>).
8.6 Resetting of TMR1 Register Pair
(TMR1H:TMR1L)
The TMR1H and TMR1L registers are not reset to 00h
on a POR or any other reset except by the CCP1 or
CCP2 special event trigger.
The T1CON register is reset to 00h on a Power-on
Reset or a Brown-out Reset, which shuts off the timer
and leaves a 1:1 prescaler. In all other resets, the reg-
ister is unaffected.
8.7 Timer1 Prescaler
The prescaler counter is cleared on writes to the
TMR1H or TMR1L registers.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
TABLE 8-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets
0Bh,8Bh
10Bh,18Bh
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF(2) (3) RCIF(1) TXIF(1) SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
8Ch PIE1 PSPIE(2) (3) RCIE(1) TXIE(1) SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used by the Timer1 module.
Note 1: The USART is implemented on the PIC16C63/R63/65/65A/R65/66/67 only.
2: Bits PSPIE and PSPIF are reserved on the PIC16C62/62A/R62/63/R63/66, always maintain these bits clear.
3: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
Timer2 Prescaler and Poslscalel
A unable Devices
Output of TMRZ
1997-2013 Microchip Technology Inc. DS30234E-page 75
PIC16C6X
9.0 TIMER2 MODULE
Timer2 is an 8-bit timer with a prescaler and a post-
scaler. It is especially suitable as PWM time-base for
PWM mode of CCP module(s). TMR2 is a readable and
writable register, and is cleared on any device reset.
The input clock (FOSC/4) has a prescale option of 1:1,
1:4 or 1:16, selected by control bits
T2CKPS1:T2CKPS0 (T2CON<1:0>).
The Timer2 module has an 8-bit period register, PR2.
Timer2 increments from 00h until it matches PR2 and
then resets to 00h on the next increment cycle. PR2 is
a readable and writable register. The PR2 register is ini-
tialized to FFh upon reset.
The match output of the TMR2 register goes through a
4-bit postscaler (which gives a 1:1 to 1:16 scaling,
inclusive) to generate a TMR2 interrupt (latched in flag
bit TMR2IF (PIR1<1>)).
The Timer2 module can be shut off by clearing control
bit TMR2ON (T2CON<2>) to minimize power con-
sumption.
Figure 9-2 shows the Timer2 control register. T2CON is
cleared upon reset which initializes Timer2 as shut off
with the prescaler and postscaler at a 1:1 value.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
9.1 Timer2 Prescaler and Postscaler
The prescaler and postscaler counters are cleared
when any of the following occurs:
• a write to the TMR2 register
• a write to the T2CON register
• any device reset (POR, BOR, MCLR Reset, or
WDT Reset).
TMR2 is not cleared when T2CON is written.
9.2 Output of TMR2
The output of TMR2 (before the postscaler) is fed to the
Synchronous Serial Port module which optionally uses
it to generate shift clock.
FIGURE 9-1: TIMER2 BLOCK DIAGRAM
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Comparator
TMR2
Sets
interrupt
TMR2IF
TMR2 reg
output(1)
Reset
Postscaler
Prescaler
PR2 reg
2
Fosc/4
1:1 to 1:16
1:1, 1:4, 1:16
EQ
4
TMR2
flag bit,
Note 1: TMR2 register output can be software selected by
the SSP Module as a baud clock.
FIGURE 9-2: T2CON: TIMER2 CONTROL REGISTER (ADDRESS 12h)
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n = Value at POR reset
bit7 bit0
bit 7: Unimplemented: Read as '0'
bit 6-3: TOUTPS3:TOUTPS0: Timer2 Output Postscale Select bits
0000 = 1:1 postscale
0001 = 1:2 postscale
1111 = 1:16 postscale
bit 2: TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0: T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits
00 = 1:1 prescale
01 = 1:4 prescale
1x = 1:16 prescale
PIC16C6X
DS30234E-page 76 1997-2013 Microchip Technology Inc.
TABLE 9-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
resets
0Bh,8Bh
10Bh,18Bh
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF(2) (3) RCIF(1) TXIF(1) SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
8Ch PIE1 PSPIE(2) (3) RCIE(1) TXIE(1) SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
11h TMR2 Timer2 module’s register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
92h PR2 Timer2 Period register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by Timer2.
Note 1: The USART is implemented on the PIC16C63/R63/65/65A/R65/66/67 only.
2: Bits PSPIE and PSPIF are reserved on the PIC16C62/62A/R62/63/R63/66, always maintain these bits clear.
3: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
A Name Devices
1997-2013 Microchip Technology Inc. DS30234E-page 77
PIC16C6X
10.0 CAPTURE/COMPARE/PWM
(CCP) MODULE(s)
Each CCP (Capture/Compare/PWM) module contains
a 16-bit register which can operate as a 16-bit capture
register, as a 16-bit compare register, or as a PWM
master/slave duty cycle register. Both the CCP1 and
CCP2 modules are identical in operation, with the
exception of the operation of the special event trigger.
Table 10-1 and Table 10-2 show the resources and
interactions of the CCP modules(s). In the following
sections, the operation of a CCP module is described
with respect to CCP1. CCP2 operates the same as
CCP1, except where noted.
CCP1 module:
Capture/Compare/PWM Register1 (CCPR1) is com-
prised of two 8-bit registers: CCPR1L (low byte) and
CCPR1H (high byte). The CCP1CON register controls
the operation of CCP1. All are readable and writable.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 CCP1
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 CCP2
CCP2 module:
Capture/Compare/PWM Register2 (CCPR2) is com-
prised of two 8-bit registers: CCPR2L (low byte) and
CCPR2H (high byte). The CCP2CON register controls
the operation of CCP2. All are readable and writable.
For use of the CCP modules, refer to the
Embedded
Control Handbook,
“Using the CCP Modules” (AN594).
TABLE 10-1: CCP MODE - TIMER
RESOURCE
CCP Mode Timer Resource
Capture
Compare
PWM
Timer1
Timer1
Timer2
TABLE 10-2: INTERACTION OF TWO CCP MODULES
CCPx Mode CCPy Mode Interaction
Capture Capture Same TMR1 time-base.
Capture Compare The compare should be configured for the special event trigger, which clears TMR1.
Compare Compare The compare(s) should be configured for the special event trigger, which clears TMR1.
PWM PWM The PWMs will have the same frequency, and update rate (TMR2 interrupt).
PWM Capture None
PWM Compare None
Cagtuve Mode
Comgave Mode
PWM Mode
Camure Mode
DES
m 52 62A F152 53 H63 54 64A H54 55 55A R55 as 57
{EH
+.L,‘
PIC16C6X
DS30234E-page 78 1997-2013 Microchip Technology Inc.
FIGURE 10-1: CCP1CON REGISTER (ADDRESS 17h) / CCP2CON REGISTER (ADDRESS 1Dh)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— CCPxX CCPxY CCPxM3 CCPxM2 CCPxM1 CCPxM0 R = Readable bit
W = Writable bit
U = Unimplemented bit, read
as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7-6: Unimplemented: Read as '0'
bit 5-4: CCPxX:CCPxY: PWM Least Significant bits
Capture Mode
Unused
Compare Mode
Unused
PWM Mode
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL.
bit 3-0: CCPxM3:CCPxM0: CCPx Mode Select bits
0000 = Capture/Compare/PWM off (resets CCPx module)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (bit CCPxIF is set)
1001 = Compare mode, clear output on match (bit CCPxIF is set)
1010 = Compare mode, generate software interrupt on match (bit CCPxIF is set, CCPx pin is unaffected)
1011 = Compare mode, trigger special event (CCPxIF bit is set; CCP1 resets TMR1; CCP2 resets TMR1)
11xx = PWM mode
10.1 Capture Mode
In Capture mode, CCPR1H:CCPR1L captures the
16-bit value of the TMR1 register when an event occurs
on pin RC2/CCP1 (Figure 10-2). An event is defined
as:
• Every falling edge
• Every rising edge
• Every 4th rising edge
• Every 16th rising edge
An event is selected by control bits CCP1M3:CCP1M0
(CCP1CON<3:0>). When a capture is made, the inter-
rupt request flag bit CCP1IF (PIR1<2>) is set. It must
be cleared in software. If another capture occurs before
the value in register CCPR1 is read, the old captured
value will be lost.
10.1.1 CCP PIN CONFIGURATION
In Capture mode, the RC2/CCP1 pin should be config-
ured as an input by setting the TRISC<2> bit.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: If the RC2/CCP1 pin is configured as an
output, a write to PORTC can cause a cap-
ture condition.
FIGURE 10-2: CAPTURE MODE OPERATION
BLOCK DIAGRAM
10.1.2 TIMER1 MODE SELECTION
Timer1 must be running in Timer mode or Synchro-
nized Counter mode for the CCP module to use the
capture feature. In Asynchronous Counter mode, the
capture operation may not work consistently.
10.1.3 SOFTWARE INTERRUPT
When the Capture event is changed, a false capture
interrupt may be generated. The user should clear
enable bit CCP1IE (PIE1<2>) to avoid false interrupts
and should clear flag bit CCP1IF following any such
change in operating mode.
CCPR1H CCPR1L
TMR1H TMR1L
Set CCP1IF
PIR1<2>
Capture
Enable
Q’s
CCP1CON<3:0>
RC2/CCP1
Prescaler
1, 4, 16
and
edge detect
pin
Compare Mode
(mmemz
F'IC16C7X
1997-2013 Microchip Technology Inc. DS30234E-page 79
PIC16C6X
10.1.4 CCP PRESCALER
There are four prescaler settings, specified by bits
CCP1M3:CCP1M0. Whenever the CCP module is
turned off, or the CCP module is not in Capture mode,
the prescaler counter is cleared. This means that any
reset will clear the prescaler counter.
Switching from one capture prescaler to another may
generate an interrupt. Also, the prescaler counter will
not be cleared, therefore the first capture may be from
a non-zero prescaler. Example 10-1 shows the recom-
mended method for switching between capture pres-
calers. This example also clears the prescaler counter
and will not generate the “false” interrupt.
EXAMPLE 10-1: CHANGING BETWEEN
CAPTURE PRESCALERS
CLRF CCP1CON ; Turn CCP module off
MOVLW NEW_CAPT_PS ; Load the W reg with
; the new prescaler
; mode value and CCP ON
MOVWF CCP1CON ; Load CCP1CON with
; this value
10.2 Compare Mode
In Compare mode, the 16-bit CCPR1 register value is
constantly compared against the TMR1 register pair
value. When a match occurs, the RC2/CCP1 pin is:
•Driven High
•Driven Low
• Remains Unchanged
The action on the pin is based on the value of control
bits CCP1M3:CCP1M0 (CCP1CON<3:0>). At the
same time interrupt flag bit CCP1IF is set.
FIGURE 10-3: COMPARE MODE
OPERATION BLOCK
DIAGRAM
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
CCPR1H CCPR1L
TMR1H TMR1L
Comparator
QS
R
Output
Logic
Special event trigger will reset Timer1, but not
Special Event Trigger
Set CCP1IF
PIR1<2>
match
RC2/CCP1
TRISC<2>
CCP1CON<3:0>
Mode Select
Output Enable
set interrupt flag bit TMR1IF (PIR1<0>).
10.2.1 CCP PIN CONFIGURATION
The user must configure the RC2/CCP1 pin as an out-
put by clearing the TRISC<2> bit.
10.2.1 TIMER1 MODE SELECTION
Timer1 must be running in Timer mode or Synchro-
nized Counter mode if the CCP module is using the
compare feature. In Asynchronous Counter mode, the
compare operation may not work.
10.2.2 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt is chosen, the
CCP1 pin is not affected. Only a CCP interrupt is gen-
erated (if enabled).
10.2.3 SPECIAL EVENT TRIGGER
In this mode, an internal hardware trigger is generated
which may be used to initiate an action.
The special event trigger output of CCP1 and CCP2
resets the TMR1 register pair. This allows the
CCPR1H:CCPR1L and CCPR2H:CCPR2L registers to
effectively be 16-bit programmable period register(s)
for Timer1.
For compatibility issues, the special event trigger out-
put of CCP1 (PIC16C72) and CCP2 (all other
PIC16C7X devices) also starts an A/D conversion.
Note: Clearing the CCP1CON register will force
the RC2/CCP1 compare output latch to the
default low level. This is not the data latch.
Note: The “special event trigger” from the
CCP1and CCP2 modules will not set inter-
rupt flag bit TMR1IF (PIR1<0>).
PWM Mode
Fosc
PIC16C6X
DS30234E-page 80 1997-2013 Microchip Technology Inc.
10.3 PWM Mode
In Pulse Width Modulation (PWM) mode, the CCP1 pin
produces up to a 10-bit resolution PWM output. Since
the CCP1 pin is multiplexed with the PORTC data latch,
the TRISC<2> bit must be cleared to make the CCP1
pin an output.
Figure 10-4 shows a simplified block diagram of the
CCP module in PWM mode.
For a step by step procedure on how to set up the CCP
module for PWM operation, see Section 10.3.3.
FIGURE 10-4: SIMPLIFIED PWM BLOCK
DIAGRAM
A PWM output (Figure 10-5) has a time base (period)
and a time that the output stays high (duty cycle). The
frequency of the PWM is the inverse of the period
(1/period).
FIGURE 10-5: PWM OUTPUT
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: Clearing the CCP1CON register will force
the CCP1 PWM output latch to the default
low level. This is not the PORTC I/O data
latch.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(Note 1)
RQ
S
Duty cycle registers CCP1CON<5:4>
Clear Timer,
CCP1 pin and
latch D.C.
TRISC2
RC2/CCP1
Note 1: 8-bit timer is concatenated with 2-bit internal Q clock
or 2 bits of the prescaler to create 10-bit time-base.
Period
Duty Cycle
TMR2 = PR2
TMR2 = Duty Cycle
TMR2 = PR2
10.3.1 PWM PERIOD
The PWM period is specified by writing to the PR2 reg-
ister. The PWM period can be calculated using the fol-
lowing formula:
PWM period = [(PR2) + 1] • 4 • TOSC •
(TMR2 prescale value)
PWM frequency is defined as 1 / [PWM period].
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
• TMR2 is cleared
• The PWM duty cycle is latched from CCPR1L into
CCPR1H
• The CCP1 pin is set (exception: if PWM duty
cycle = 0%, the CCP1 pin will not be set)
10.3.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing to the
CCPR1L register and to the CCP1CON<5:4> bits. Up
to 10-bit resolution is available: the CCPR1L contains
the eight MSbs and the CCP1CON<5:4> contains the
two LSbs. This 10-bit value is represented by
CCPR1L:CCP1CON<5:4>. The following equation is
used to calculate the PWM duty cycle in time:
PWM duty cycle = (CCPR1L:CCP1CON<5:4>) •
Tosc • (TMR2 prescale value)
CCPR1L and CCP1CON<5:4> can be written to at any
time, but the duty cycle value is not latched into
CCPR1H until after a match between PR2 and TMR2
occurs (i.e., the period is complete). In PWM mode,
CCPR1H is a read-only register.
The CCPR1H register and a 2-bit internal latch are
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation.
When the CCPR1H and 2-bit latch match TMR2 con-
catenated with an internal 2-bit Q clock or 2 bits of the
TMR2 prescaler, the CCP1 pin is cleared.
Maximum PWM resolution (bits) for a given PWM
frequency:
Note: The Timer2 postscaler (see Section 9.1) is
not used in the determination of the PWM
frequency. The postscaler could be used to
have a servo update rate at a different fre-
quency than the PWM output.
Note: If the PWM duty cycle value is longer than
the PWM period the CCP1 pin will not be
forced to the low level.
log( FPWM
log(2)
FOSC )
bits
=
1997-2013 Microchip Technology Inc. DS30234E-page 81
PIC16C6X
EXAMPLE 10-2: PWM PERIOD AND DUTY
CYCLE CALCULATION
Desired PWM frequency is 78.125 kHz,
Fosc = 20 MHz
TMR2 prescale = 1
1/78.125 kHz = [(PR2) + 1] • 4 • 1/20 MHz • 1
12.8 s = [(PR2) + 1] • 4 • 50 ns • 1
PR2 = 63
Find the maximum resolution of the duty cycle that can
be used with a 78.125 kHz frequency and 20 MHz
oscillator:
1/78.125 kHz = 2PWM RESOLUTION • 1/20 MHz • 1
12.8 s= 2
PWM RESOLUTION • 50 ns • 1
256 = 2PWM RESOLUTION
log(256) = (PWM Resolution) • log(2)
8.0 = PWM Resolution
At most, an 8-bit resolution duty cycle can be obtained
from a 78.125 kHz frequency and a 20 MHz oscillator,
i.e., 0 CCPR1L:CCP1CON<5:4> 255. Any value
greater than 255 will result in a 100% duty cycle.
In order to achieve higher resolution, the PWM fre-
quency must be decreased. In order to achieve higher
PWM frequency, the resolution must be decreased.
Table 10-3 lists example PWM frequencies and resolu-
tions for Fosc = 20 MHz. The TMR2 prescaler and PR2
values are also shown.
10.3.3 SET-UP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for PWM operation:
1. Set the PWM period by writing to the PR2 regis-
ter.
2. Set the PWM duty cycle by writing to the
CCPR1L register and CCP1CON<5:4> bits.
3. Make the CCP1 pin an output by clearing the
TRISC<2> bit.
4. Set the TMR2 prescale value and enable Timer2
by writing to T2CON.
5. Configure the CCP1 module for PWM operation.
TABLE 10-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 20 MHz
TABLE 10-4: REGISTERS ASSOCIATED WITH TIMER1, CAPTURE AND COMPARE
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescaler (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 5.5
Add Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
Resets
0Bh,8Bh
10Bh,18Bh
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF(2) (3) RCIF(1) TXIF(1) SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
0Dh(4) PIR2 — — — — — — —CCP2IF---- ---0 ---- ---0
8Ch PIE1 PSPIE(2) (3) RCIE(1) TXIE(1) SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
8Dh(4) PIE2 — — — — — — —CCP2IE---- ---0 ---- ---0
87h TRISC PORTC Data Direction register 1111 1111 1111 1111
0Eh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON — — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
1Bh(4) CCPR2L Capture/Compare/PWM2 (LSB) xxxx xxxx uuuu uuuu
1Ch(4) CCPR2H Capture/Compare/PWM2 (MSB) xxxx xxxx uuuu uuuu
1Dh(4) CCP2CON — — CCP2X CCP2Y CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0’. Shaded cells are not used in these modes.
Note 1: These bits are associated with the USART module, which is implemented on the PIC16C63/R63/65/65A/R65/66/67 only.
2: Bits PSPIE and PSPIF are reserved on the PIC16C62/62A/R62/63/R63/66, always maintain these bits clear.
3: The PIR1<6> and PIE1<6> bits are reserved, always maintain these bits clear.
4: These registers are associated with the CCP2 module, which is only implemented on the PIC16C63/R63/65/65A/R65/66/67.
aux
Rams
PIC16C6X
DS30234E-page 82 1997-2013 Microchip Technology Inc.
TABLE 10-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
Resets
0Bh,8Bh
10Bh,18Bh
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000
000x
0000
000u
0Ch PIR1 PSPIF(2) (3) RCIF(1) TXIF(1) SSPIF CCP1IF TMR2IF TMR1IF 0000
0000
0000
0000
0Dh(4) PIR2 — — — — — — — CCP2IF ---- ---
0
---- ---
0
8Ch PIE1 PSPIE(2) (3) RCIE(1) TXIE(1) SSPIE CCP1IE TMR2IE TMR1IE 0000
0000
0000
0000
8Dh(4) PIE2 — — — — — — —CCP2IE---- ---
0
---- ---
0
87h TRISC PORTC Data Direction register 1111
1111
1111
1111
11h TMR2 Timer2 module’s register 0000
0000
0000
0000
92h PR2 Timer2 module’s Period register 1111
1111
1111
1111
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000
0000
-000
0000
15h CCPR1L Capture/Compare/PWM1 (LSB) xxxx
xxxx
uuuu
uuuu
16h CCPR1H Capture/Compare/PWM1 (MSB) xxxx
xxxx
uuuu
uuuu
17h CCP1CON —— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00
0000
--00
0000
1Bh(4) CCPR2L Capture/Compare/PWM2 (LSB) xxxx
xxxx
uuuu
uuuu
1Ch(4) CCPR2H Capture/Compare/PWM2 (MSB) xxxx
xxxx
uuuu
uuuu
1Dh(4) CCP2CON — — CCP2X CCP2Y CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00
0000
--00
0000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0’. Shaded cells are not used in this mode.
Note 1: These bits are associated with the USART module, which is implemented on the PIC16C63/R63/65/65A/R65/66/67 only.
2: Bits PSPIE and PSPIF are reserved on the PIC16C62/62A/R62/63/R63/66, always maintain these bits clear.
3: The PIR1<6> and PIE1<6> bits are reserved, always maintain these bits clear.
4: These registers are associated with the CCP2 module, which is only implemented on the PIC16C63/R63/65/65A/R65/66/67.
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBG‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
SSP Module Overview
1997-2013 Microchip Technology Inc. DS30234E-page 83
PIC16C6X
11.0 SYNCHRONOUS SERIAL PORT
(SSP) MODULE
11.1 SSP Module Overview
The Synchronous Serial Port (SSP) module is a serial
interface useful for communicating with other periph-
eral or microcontroller devices. These peripheral
devices may be Serial EEPROMs, shift registers, dis-
play drivers, A/D converters, etc. The SSP module can
operate in one of two modes:
• Serial Peripheral Interface (SPI)
• Inter-Integrated Circuit (I2C)
The SSP module in I2C mode works the same in all
PIC16C6X devices that have an SSP module. However
the SSP Module in SPI mode has differences between
the PIC16C66/67 and the other PIC16C6X devices.
The register definitions and operational description of
SPI mode has been split into two sections because of
the differences between the PIC16C66/67 and the
other PIC16C6X devices. The default reset values of
both the SPI modules is the same regardless of the
device:
11.2 SPI Mode for PIC16C62/62A/R62/63/R63/64/
64A/R64/65/65A/R65 ...................................... 84
11.3 SPI Mode for PIC16C66/67 ............................. 89
11.4 I2C™ Overview................................................ 95
11.5 SSP I2C Operation .......................................... 99
Refer to Application Note AN578,
“Use of the SSP
Module in the I
2
C Multi-Master Environment.”
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBS‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘ES‘67
SPI Mode for PIC16062I62NR62/63I
R63]64I64AIR64I65I65NR65
Recewe
Tvansrmt
PIC16C6X
DS30234E-page 84 1997-2013 Microchip Technology Inc.
11.2 SPI Mode for PIC16C62/62A/R62/63/
R63/64/64A/R64/65/65A/R65
This section contains register definitions and opera-
tional characteristics of the SPI module for the
PIC16C62, PIC16C62A, PIC16CR62, PIC16C63,
PIC16CR63, PIC16C64, PIC16C64A, PIC16CR64,
PIC16C65, PIC16C65A, PIC16CR65.
FIGURE 11-1: SSPSTAT: SYNC SERIAL PORT STATUS REGISTER (ADDRESS 94h)
U-0 U-0 R-0 R-0 R-0 R-0 R-0 R-0
——D/A PSR/WUA BF R = Readable bit
W = Writable bit
U = Unimplemented bit, read
as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7-6: Unimplemented: Read as '0'
bit 5: D/A: Data/Address bit (I2C mode only)
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4: P: Stop bit (I2C mode only. This bit is cleared when the SSP module is disabled, SSPEN is cleared)
1 = Indicates that a stop bit has been detected last (this bit is '0' on RESET)
0 = Stop bit was not detected last
bit 3: S: Start bit (I2C mode only. This bit is cleared when the SSP module is disabled, SSPEN is cleared)
1 = Indicates that a start bit has been detected last (this bit is '0' on RESET)
0 = Start bit was not detected last
bit 2: R/W: Read/Write bit information (I2C mode only)
This bit holds the R/W bit information following the last address match. This bit is valid from the address
match to the next start bit, stop bit, or ACK bit.
1 = Read
0 = Write
bit 1: UA: Update Address (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0: BF: Buffer Full Status bit
Receive (SPI and I2C modes)
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Tra n s m it (I2C mode only)
1 = Transmit in progress, SSPBUF is full
0 = Transmit complete, SSPBUF is empty
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devlces
m ‘62‘EZA‘R52‘53‘RBG‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
In SPI mode
M20 mode
In SPI mode
mic mode
In SPI mode
M20 mode
1997-2013 Microchip Technology Inc. DS30234E-page 85
PIC16C6X
FIGURE 11-2: SSPCON: SYNC SERIAL PORT CONTROL REGISTER (ADDRESS 14h)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 R = Readable bit
W = Writable bit
U = Unimplemented bit, read
as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7: WCOL: Write Collision Detect bit
1 = The SSPBUF register is written while it is still transmitting the previous word
(must be cleared in software)
0 = No collision
bit 6: SSPOV: Receive Overflow Detect bit
In SPI mode
1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow,
the data in SSPSR register is lost. Overflow can only occur in slave mode. The user must read the SSP-
BUF, even if only transmitting data, to avoid setting overflow. In master mode the overflow bit is not set
since each new reception (and transmission) is initiated by writing to the SSPBUF register.
0 = No overflow
In I2C mode
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a "don’t care"
in transmit mode. SSPOV must be cleared in software in either mode.
0 = No overflow
bit 5: SSPEN: Synchronous Serial Port Enable bit
In SPI mode
1 = Enables serial port and configures SCK, SDO, and SDI as serial port pins
0 = Disables serial port and configures these pins as I/O port pins
In I2C mode
1 = Enables the serial port and configures the SDA and SCL pins as serial port pins
0 = Disables serial port and configures these pins as I/O port pins
In both modes, when enabled, these pins must be properly configured as input or output.
bit 4: CKP: Clock Polarity Select bit
In SPI mode
1 = Idle state for clock is a high level. Transmit happens on falling edge, receive on rising edge.
0 = Idle state for clock is a low level. Transmit happens on rising edge, receive on falling edge.
In I2C mode
SCK release control
1 = Enable clock
0 = Holds clock low (clock stretch) (Used to ensure data setup time)
bit 3-0: SSPM3:SSPM0: Synchronous Serial Port Mode Select bits
0000 = SPI master mode, clock = Fosc/4
0001 = SPI master mode, clock = Fosc/16
0010 = SPI master mode, clock = Fosc/64
0011 = SPI master mode, clock = TMR2 output/2
0100 = SPI slave mode, clock = SCK pin. SS pin control enabled.
0101 = SPI slave mode, clock = SCK pin. SS pin control disabled. SS can be used as I/O pin.
0110 = I2C slave mode, 7-bit address
0111 = I2C slave mode, 10-bit address
1011 = I2C firmware controlled Master Mode (slave idle)
1110 = I2C slave mode, 7-bit address with start and stop bit interrupts enabled
1111 = I2C slave mode, 10-bit address with start and stop bit interrupts enabled
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBS‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘ES‘67
TMRZ outgm
E
PIC16C6X
DS30234E-page 86 1997-2013 Microchip Technology Inc.
11.2.1 OPERATION OF SSP MODULE IN SPI
MODE
The SPI mode allows 8-bits of data to be synchro-
nously transmitted and received simultaneously. To
accomplish communication, typically three pins are
used:
• Serial Data Out (SDO)
• Serial Data In (SDI)
• Serial Clock (SCK)
Additionally a fourth pin may be used when in a slave
mode of operation:
• Slave Select (SS)
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits in the SSPCON register (SSPCON<5:0>).
These control bits allow the following to be specified:
• Master Mode (SCK is the clock output)
• Slave Mode (SCK is the clock input)
• Clock Polarity (Output/Input data on the Rising/
Falling edge of SCK)
• Clock Rate (Master mode only)
• Slave Select Mode (Slave mode only)
The SSP consists of a transmit/receive Shift Register
(SSPSR) and a Buffer register (SSPBUF). The SSPSR
shifts the data in and out of the device, MSb first. The
SSPBUF holds the data that was written to the SSPSR,
until the received data is ready. Once the 8-bits of data
have been received, that byte is moved to the SSPBUF
register. Then the Buffer Full bit, BF (SSPSTAT<0>)
and flag bit SSPIF are set. This double buffering of the
received data (SSPBUF) allows the next byte to start
reception before reading the data that was just
received. Any write to the SSPBUF register during
transmission/reception of data will be ignored, and the
write collision detect bit, WCOL (SSPCON<7>) will be
set. User software must clear bit WCOL so that it can
be determined if the following write(s) to the SSPBUF
completed successfully. When the application software
is expecting to receive valid data, the SSPBUF register
should be read before the next byte of data to transfer
is written to the SSPBUF register. The Buffer Full bit BF
(SSPSTAT<0>) indicates when the SSPBUF register
has been loaded with the received data (transmission
is complete). When the SSPBUF is read, bit BF is
cleared. This data may be irrelevant if the SPI is only a
transmitter. Generally the SSP Interrupt is used to
determine when the transmission/reception has com-
pleted. The SSPBUF register must be read and/or writ-
ten. If the interrupt method is not going to be used, then
software polling can be done to ensure that a write col-
lision does not occur. Example 11-1 shows the loading
of the SSPBUF (SSPSR) register for data transmission.
The shaded instruction is only required if the received
data is meaningful.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
EXAMPLE 11-1: LOADING THE SSPBUF
(SSPSR) REGISTER
The block diagram of the SSP module, when in SPI
mode (Figure 11-3), shows that the SSPSR register is
not directly readable or writable, and can only be
accessed from addressing the SSPBUF register. Addi-
tionally, the SSP status register (SSPSTAT) indicates
the various status conditions.
FIGURE 11-3: SSP BLOCK DIAGRAM
(SPI MODE)
BSF STATUS, RP0 ;Specify Bank 1
LOOP BTFSS SSPSTAT, BF ;Has data been
;received
;(transmit
;complete)?
GOTO LOOP ;No
BCF STATUS, RP0 ;Specify Bank 0
MOVF SSPBUF, W ;W reg = contents
;of SSPBUF
MOVWF RXDATA ;Save in user RAM
MOVF TXDATA, W ;W reg = contents
; of TXDATA
MOVWF SSPBUF ;New data to xmit
Read Write
Internal
data bus
RC4/SDI/SDA
RC5/SDO
RA5/SS
RC3/SCK/
SSPSR reg
SSPBUF reg
SSPM3:SSPM0
bit0 shift
clock
SS Control
Enable
Edge
Select
Clock Select
TMR2 output
TCY
Prescaler
4, 16, 64
TRISC<3>
2
Edge
Select
2
4
SCL
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBG‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘ES‘67
1997-2013 Microchip Technology Inc. DS30234E-page 87
PIC16C6X
To enable the serial port, SSP enable bit SSPEN
(SSPCON<5>) must be set. To reset or reconfigure SPI
mode, clear enable bit SSPEN, re-initialize SSPCON
register, and then set enable bit SSPEN. This config-
ures the SDI, SDO, SCK, and SS pins as serial port
pins. For the pins to behave as the serial port function,
they must have their data direction bits (in the TRIS reg-
ister) appropriately programmed. That is:
• SDI must have TRISC<4> set
• SDO must have TRISC<5> cleared
• SCK (Master mode) must have TRISC<3>
cleared
• SCK (Slave mode) must have TRISC<3> set
•SS
must have TRISA<5> set (if implemented)
Any serial port function that is not desired may be over-
ridden by programming the corresponding data direc-
tion (TRIS) register to the opposite value. An example
would be in master mode where you are only sending
data (to a display driver), then both SDI and SS could
be used as general purpose outputs by clearing their
corresponding TRIS register bits.
Figure 11-4 shows a typical connection between two
microcontrollers. The master controller (Processor 1)
initiates the data transfer by sending the SCK signal.
Data is shifted out of both shift registers on their pro-
grammed clock edge, and latched on the opposite edge
of the clock. Both processors should be programmed to
the same Clock Polarity (CKP), then both controllers
would send and receive data at the same time.
Whether the data is meaningful (or dummy data)
depends on the application software. This leads to
three scenarios for data transmission:
• Master sends data—Slave sends dummy data
• Master sends data—Slave sends data
• Master sends dummy data—Slave sends data
The master can initiate the data transfer at any time
because it controls the SCK. The master determines
when the slave (Processor 2) is to broadcast data by
the software protocol.
In master mode the data is transmitted/received as
soon as the SSPBUF register is written to. If the SPI is
only going to receive, the SCK output could be disabled
(programmed as an input). The SSPSR register will
continue to shift in the signal present on the SDI pin at
the programmed clock rate. As each byte is received, it
will be loaded into the SSPBUF register as if a normal
received byte (interrupts and status bits appropriately
set). This could be useful in receiver applications as a
“line activity monitor” mode.
In slave mode, the data is transmitted and received as
the external clock pulses appear on SCK. When the
last bit is latched interrupt flag bit SSPIF (PIR1<3>) is
set.
The clock polarity is selected by appropriately program-
ming bit CKP (SSPCON<4>). This then would give
waveforms for SPI communication as shown in
Figure 11-5 and Figure 11-6 where the MSB is trans-
mitted first. In master mode, the SPI clock rate (bit rate)
is user programmable to be one of the following:
• Fosc/4 (or TCY)
• Fosc/16 (or 4 TCY)
• Fosc/64 (or 16 TCY)
• Timer2 output/2
This allows a maximum bit clock frequency (at 20 MHz)
of 5 MHz. When in slave mode the external clock must
meet the minimum high and low times.
In sleep mode, the slave can transmit and receive data
and wake the device from sleep.
FIGURE 11-4: SPI MASTER/SLAVE CONNECTION
Serial Input Buffer
(SSPBUF register)
Shift Register
(SSPSR)
MSb LSb
SDO
SDI
PROCESSOR 1
SCK
SPI Master SSPM3:SSPM0 = 00xxb
Serial Input Buffer
(SSPBUF register)
Shift Register
(SSPSR)
LSb
MSb
SDI
SDO
PROCESSOR 2
SCK
SPI Slave SSPM3:SSPM0 = 010xb
Serial Clock
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
53 ‘62‘EZA‘R52‘53‘RBS‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘ES‘67
W
alHiHHHHHH>i
: ‘ 3 3 3 3 3 3%
PIC16C6X
DS30234E-page 88 1997-2013 Microchip Technology Inc.
The SS pin allows a synchronous slave mode. The
SPI must be in slave mode (SSPCON<3:0> = 04h)
and the TRISA<5> bit must be set the for synchro-
nous slave mode to be enabled. When the SS pin is
low, transmission and reception are enabled and
the SDO pin is driven. When the SS pin goes high,
the SDO pin is no longer driven, even if in the mid-
dle of a transmitted byte, and becomes a floating
output. If the SS pin is taken low without resetting
SPI mode, the transmission will continue from the
point at which it was taken high. External pull-up/
pull-down resistors may be desirable, depending on the
application.
To emulate two-wire communication, the SDO pin can
be connected to the SDI pin. When the SPI needs to
operate as a receiver the SDO pin can be configured as
an input. This disables transmissions from the SDO.
The SDI can always be left as an input (SDI function)
since it cannot create a bus conflict.
FIGURE 11-5: SPI MODE TIMING, MASTER MODE OR SLAVE MODE W/O SS CONTROL
FIGURE 11-6: SPI MODE TIMING, SLAVE MODE WITH SS CONTROL
TABLE 11-1: REGISTERS ASSOCIATED WITH SPI OPERATION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on:
POR,
BOR
Value on
all other
Resets
0Bh,8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF(2) (3) RCIF(1) TXIF(1) SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
8Ch PIE1 PSPIE(2) (3) RCIE(1) TXIE(1) SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
85h TRISA — — PORTA Data Direction Register --11 1111 --11 1111
87h TRISC PORTC Data Direction Register 1111 1111 1111 1111
94h SSPSTAT — — D/A P S R/W UA BF --00 0000 --00 0000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by SSP module in SPI
mode.
Note 1: These bits are associated with the USART which is implemented on the PIC16C63/R63/65/65A/R65 only.
2: PSPIF and PSPIE are reserved on the PIC16C62/62A/R62/63/R63, always maintain these bits clear.
3: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
SSPIF
bit7
bit7 bit0
bit6 bit5 bit4 bit3 bit2 bit1 bit0
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
SSPIF
bit7
bit7 bit0
bit6 bit5 bit4 bit3 bit2 bit1 bit0
SS
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘SZ‘SZA‘RGZ‘SS‘R63‘64‘MA‘REA‘GS‘SSA‘R65‘65‘67
SPI Mode lo! PICISCSGI67
SPI Mas‘er Mode
SPI S‘ave Mode
Hecewe
Transmn
1997-2013 Microchip Technology Inc. DS30234E-page 89
PIC16C6X
11.3 SPI Mode for PIC16C66/67
This section contains register definitions and opera-
tional characterisitics of the SPI module on the
PIC16C66 and PIC16C67 only.
FIGURE 11-7: SSPSTAT: SYNC SERIAL PORT STATUS REGISTER (ADDRESS 94h)(PIC16C66/67)
R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0
SMP CKE D/A PSR/WUA BF R = Readable bit
W = Writable bit
U = Unimplemented bit, read
as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7: SMP: SPI data input sample phase
SPI Master Mode
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
SPI Slave Mode
SMP must be cleared when SPI is used in slave mode
bit 6: CKE: SPI Clock Edge Select (Figure 11-11, Figure 11-12, and Figure 11-13)
CKP = 0
1 = Data transmitted on rising edge of SCK
0 = Data transmitted on falling edge of SCK
CKP = 1
1 = Data transmitted on falling edge of SCK
0 = Data transmitted on rising edge of SCK
bit 5: D/A: Data/Address bit (I2C mode only)
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4: P: Stop bit (I2C mode only. This bit is cleared when the SSP module is disabled, or when the Start bit is
detected last, SSPEN is cleared)
1 = Indicates that a stop bit has been detected last (this bit is '0' on RESET)
0 = Stop bit was not detected last
bit 3: S: Start bit (I2C mode only. This bit is cleared when the SSP module is disabled, or when the Stop bit is
detected last, SSPEN is cleared)
1 = Indicates that a start bit has been detected last (this bit is '0' on RESET)
0 = Start bit was not detected last
bit 2: R/W: Read/Write bit information (I2C mode only)
This bit holds the R/W bit information following the last address match. This bit is only valid from the
address match to the next start bit, stop bit, or ACK bit.
1 = Read
0 = Write
bit 1: UA: Update Address (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0: BF: Buffer Full Status bit
Receive (SPI and I2C modes)
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Tra n s m it (I2C mode only)
1 = Transmit in progress, SSPBUF is full
0 = Transmit complete, SSPBUF is empty
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘SZ‘SZA‘RGZ‘SS‘R63‘64‘MA‘REA‘GS‘SSA‘R65‘65‘67
m SPI mode
m SPI mode
m SPI mode
PIC16C6X
DS30234E-page 90 1997-2013 Microchip Technology Inc.
FIGURE 11-8: SSPCON: SYNC SERIAL PORT CONTROL REGISTER (ADDRESS 14h)(PIC16C66/67)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 R = Readable bit
W = Writable bit
U = Unimplemented bit, read
as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7: WCOL: Write Collision Detect bit
1 = The SSPBUF register is written while it is still transmitting the previous word
(must be cleared in software)
0 = No collision
bit 6: SSPOV: Receive Overflow Indicator bit
In SPI mode
1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow,
the data in SSPSR is lost. Overflow can only occur in slave mode. The user must read the SSPBUF, even
if only transmitting data, to avoid setting overflow. In master mode the overflow bit is not set since each
new reception (and transmission) is initiated by writing to the SSPBUF register.
0 = No overflow
In I2C mode
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a "don’t care"
in transmit mode. SSPOV must be cleared in software in either mode.
0 = No overflow
bit 5: SSPEN: Synchronous Serial Port Enable bit
In SPI mode
1 = Enables serial port and configures SCK, SDO, and SDI as serial port pins
0 = Disables serial port and configures these pins as I/O port pins
In I2C mode
1 = Enables the serial port and configures the SDA and SCL pins as serial port pins
0 = Disables serial port and configures these pins as I/O port pins
In both modes, when enabled, these pins must be properly configured as input or output.
bit 4: CKP: Clock Polarity Select bit
In SPI mode
1 = Idle state for clock is a high level
0 = Idle state for clock is a low level
In I2C mode
SCK release control
1 = Enable clock
0 = Holds clock low (clock stretch) (Used to ensure data setup time)
bit 3-0: SSPM3:SSPM0: Synchronous Serial Port Mode Select bits
0000 = SPI master mode, clock = FOSC/4
0001 = SPI master mode, clock = FOSC/16
0010 = SPI master mode, clock = FOSC/64
0011 = SPI master mode, clock = TMR2 output/2
0100 = SPI slave mode, clock = SCK pin. SS pin control enabled.
0101 = SPI slave mode, clock = SCK pin. SS pin control disabled. SS can be used as I/O pin
0110 = I2C slave mode, 7-bit address
0111 = I2C slave mode, 10-bit address
1011 = I2C firmware controlled master mode (slave idle)
1110 = I2C slave mode, 7-bit address with start and stop bit interrupts enabled
1111 = I2C slave mode, 10-bit address with start and stop bit interrupts enabled
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘RGZ‘53‘RGS‘54‘MA‘REA‘GS‘SSA‘R65‘66‘67
TMRZ mug-A
1997-2013 Microchip Technology Inc. DS30234E-page 91
PIC16C6X
11.3.1 SSP MODULE IN SPI MODE FOR
PIC16C66/67
The SPI mode allows 8-bits of data to be synchro-
nously transmitted and received simultaneously. To
accomplish communication, typically three pins are
used:
• Serial Data Out (SDO) RC5/SDO
• Serial Data In (SDI) RC4/SDI/SDA
• Serial Clock (SCK) RC3/SCK/SCL
Additionally a fourth pin may be used when in a slave
mode of operation:
• Slave Select (SS) RA5/SS
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits in the SSPCON register (SSPCON<5:0>)
and SSPSTAT<7:6>. These control bits allow the fol-
lowing to be specified:
• Master Mode (SCK is the clock output)
• Slave Mode (SCK is the clock input)
• Clock Polarity (Idle state of SCK)
• Clock edge (output data on rising/falling edge of
SCK)
• Clock Rate (Master mode only)
• Slave Select Mode (Slave mode only)
The SSP consists of a transmit/receive Shift Register
(SSPSR) and a buffer register (SSPBUF). The SSPSR
shifts the data in and out of the device, MSb first. The
SSPBUF holds the data that was written to the SSPSR
until the received data is ready. Once the 8-bits of data
have been received, that byte is moved to the SSPBUF
register. Then the buffer full detect bit BF
(SSPSTAT<0>) and interrupt flag bit SSPIF (PIR1<3>)
are set. This double buffering of the received data
(SSPBUF) allows the next byte to start reception before
reading the data that was just received. Any write to the
SSPBUF register during transmission/reception of data
will be ignored, and the write collision detect bit WCOL
(SSPCON<7>) will be set. User software must clear the
WCOL bit so that it can be determined if the following
write(s) to the SSPBUF register completed success-
fully. When the application software is expecting to
receive valid data, the SSPBUF should be read before
the next byte of data to transfer is written to the
SSPBUF. Buffer full bit BF (SSPSTAT<0>) indicates
when SSPBUF has been loaded with the received data
(transmission is complete). When the SSPBUF is read,
bit BF is cleared. This data may be irrelevant if the SPI
is only a transmitter. Generally the SSP Interrupt is
used to determine when the transmission/reception
has completed. The SSPBUF must be read and/or writ-
ten. If the interrupt method is not going to be used, then
software polling can be done to ensure that a write col-
lision does not occur. Example 11-2 shows the loading
of the SSPBUF (SSPSR) for data transmission. The
shaded instruction is only required if the received data
is meaningful.
EXAMPLE 11-2: LOADING THE SSPBUF
(SSPSR) REGISTER
(PIC16C66/67)
BCF STATUS, RP1 ;Specify Bank 1
BSF STATUS, RP0 ;
LOOP BTFSS SSPSTAT, BF ;Has data been
;received
;(transmit
;complete)?
GOTO LOOP ;No
BCF STATUS, RP0 ;Specify Bank 0
MOVF SSPBUF, W ;W reg = contents
; of SSPBUF
MOVF TXDATA, W ;W reg = contents
; of TXDATA
MOVWF SSPBUF ;New data to xmit
The block diagram of the SSP module, when in SPI
mode (Figure 11-9), shows that the SSPSR is not
directly readable or writable, and can only be accessed
from addressing the SSPBUF register. Additionally, the
SSP status register (SSPSTAT) indicates the various
status conditions.
FIGURE 11-9: SSP BLOCK DIAGRAM
(SPI MODE)(PIC16C66/67)
MOVWF RXDATA ;Save in user RAM
Read Write
Internal
data bus
RC4/SDI/SDA
RC5/SDO
RA5/SS
RC3/SCK/
SSPSR reg
SSPBUF reg
SSPM3:SSPM0
bit0 shift
clock
SS Control
Enable
Edge
Select
Clock Select
TMR2 output
TCY
Prescaler
4, 16, 64
TRISC<3>
2
Edge
Select
2
4
SCL
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘SZ‘SZA‘RGZ‘SS‘R63‘64‘MA‘REA‘GS‘SSA‘R65‘65‘67
PIC16C6X
DS30234E-page 92 1997-2013 Microchip Technology Inc.
To enable the serial port, SSP Enable bit, SSPEN
(SSPCON<5>) must be set. To reset or reconfigure SPI
mode, clear bit SSPEN, re-initialize the SSPCON reg-
ister, and then set bit SSPEN. This configures the SDI,
SDO, SCK, and SS pins as serial port pins. For the pins
to behave as the serial port function, they must have
their data direction bits (in the TRISC register) appro-
priately programmed. That is:
• SDI must have TRISC<4> set
• SDO must have TRISC<5> cleared
• SCK (Master mode) must have TRISC<3>
cleared
• SCK (Slave mode) must have TRISC<3> set
•SS
must have TRISA<5> set
Any serial port function that is not desired may be over-
ridden by programming the corresponding data direc-
tion (TRIS) register to the opposite value. An example
would be in master mode where you are only sending
data (to a display driver), then both SDI and SS could
be used as general purpose outputs by clearing their
corresponding TRIS register bits.
Figure 11-10 shows a typical connection between two
microcontrollers. The master controller (Processor 1)
initiates the data transfer by sending the SCK signal.
Data is shifted out of both shift registers on their pro-
grammed clock edge, and latched on the opposite edge
of the clock. Both processors should be programmed to
same Clock Polarity (CKP), then both controllers would
send and receive data at the same time. Whether the
data is meaningful (or dummy data) depends on the
application firmware. This leads to three scenarios for
data transmission:
• Master sends data—Slave sends dummy data
• Master sends data—Slave sends data
• Master sends dummy data—Slave sends data
The master can initiate the data transfer at any time
because it controls the SCK. The master determines
when the slave (Processor 2) is to broadcast data by
the firmware protocol.
In master mode the data is transmitted/received as
soon as the SSPBUF register is written to. If the SPI is
only going to receive, the SCK output could be disabled
(programmed as an input). The SSPSR register will
continue to shift in the signal present on the SDI pin at
the programmed clock rate. As each byte is received, it
will be loaded into the SSPBUF register as if a normal
received byte (interrupts and status bits appropriately
set). This could be useful in receiver applications as a
“line activity monitor” mode.
In slave mode, the data is transmitted and received as
the external clock pulses appear on SCK. When the
last bit is latched the interrupt flag bit SSPIF (PIR1<3>)
is set.
The clock polarity is selected by appropriately program-
ming bit CKP (SSPCON<4>). This then would give
waveforms for SPI communication as shown in
Figure 11-11, Figure 11-12, and Figure 11-13 where
the MSB is transmitted first. In master mode, the SPI
clock rate (bit rate) is user programmable to be one of
the following:
•F
OSC/4 (or TCY)
•F
OSC/16 (or 4 • TCY)
•F
OSC/64 (or 16 • TCY)
• Timer2 output/2
This allows a maximum bit clock frequency (at 20 MHz)
of 5 MHz. When in slave mode the external clock must
meet the minimum high and low times.
In sleep mode, the slave can transmit and receive data
and wake the device from sleep.
FIGURE 11-10: SPI MASTER/SLAVE CONNECTION (PIC16C66/67)
Serial Input Buffer
(SSPBUF)
Shift Register
(SSPSR)
MSb LSb
SDO
SDI
PROCESSOR 1
SCK
SPI Master SSPM3:SSPM0 = 00xxb
Serial Input Buffer
(SSPBUF)
Shift Register
(SSPSR)
LSb
MSb
SDI
SDO
PROCESSOR 2
SCK
SPI Slave SSPM3:SSPM0 = 010xb
Serial Clock
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘RGZ‘53‘RGS‘54‘MA‘REA‘GS‘SSA‘R65‘66‘67
1997-2013 Microchip Technology Inc. DS30234E-page 93
PIC16C6X
The SS pin allows a synchronous slave mode. The
SPI must be in slave mode (SSPCON<3:0> = 04h)
and the TRISA<5> bit must be set for the synchro-
nous slave mode to be enabled. When the SS pin is
low, transmission and reception are enabled and
the SDO pin is driven. When the SS pin goes high,
the SDO pin is no longer driven, even if in the mid-
dle of a transmitted byte, and becomes a floating
output. If the SS pin is taken low without resetting
SPI mode, the transmission will continue from the
point at which it was taken high. External pull-up/
pull-down resistors may be desirable, depending on the
application.
To emulate two-wire communication, the SDO pin can
be connected to the SDI pin. When the SPI needs to
operate as a receiver the SDO pin can be configured as
an input. This disables transmissions from the SDO.
The SDI can always be left as an input (SDI function)
since it cannot create a bus conflict.
Note: When the SPI is in Slave Mode with SS pin
control enabled, (SSPCON<3:0> = 0100)
the SPI module will reset if the SS pin is set
to VDD.
Note: If the SPI is used in Slave Mode with
CKE = '1', then the SS pin control must be
enabled.
FIGURE 11-11: SPI MODE TIMING, MASTER MODE (PIC16C66/67)
FIGURE 11-12: SPI MODE TIMING (SLAVE MODE WITH CKE = 0) (PIC16C66/67)
SCK (CKP = 0,
SDI (SMP = 0)
SSPIF
bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
SDI (SMP = 1)
SCK (CKP = 0,
SCK (CKP = 1,
SCK (CKP = 1,
SDO
bit7
bit7 bit0
bit0
CKE = 0)
CKE = 1)
CKE = 0)
CKE = 1)
SCK (CKP = 0)
SDI (SMP = 0)
SSPIF
bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
SCK (CKP = 1)
SDO
bit7 bit0
SS (optional)
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘SZ‘SZA‘RGZ‘SS‘R63‘64‘MA‘REA‘GS‘SSA‘R65‘65‘67
PIC16C6X
DS30234E-page 94 1997-2013 Microchip Technology Inc.
FIGURE 11-13: SPI MODE TIMING (SLAVE MODE WITH CKE = 1) (PIC16C66/67)
TABLE 11-2: REGISTERS ASSOCIATED WITH SPI OPERATION (PIC16C66/67)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
Power-on
Reset
Value on all
other resets
0Bh,8Bh,
10Bh,18Bh
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF(1) (2) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
8Ch PIE1 PSPIE(1) (2) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
85h TRISA —— PORTA Data Direction register --11 1111 --11 1111
87h TRISC PORTC Data Direction register 1111 1111 1111 1111
94h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'.
Shaded cells are not used by SSP module in SPI mode.
Note 1: PSPIF and PSPIE are reserved on the PIC16C66, always maintain these bits clear.
2: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
SCK (CKP = 0)
SDI (SMP = 0)
SSPIF
bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
SCK (CKP = 1)
SDO
bit7 bit0
SS
(not optional)
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBG‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
1997-2013 Microchip Technology Inc. DS30234E-page 95
PIC16C6X
11.4 I2C™ Overview
This section provides an overview of the Inter-Inte-
grated Circuit (I2C) bus, with Section 11.5 discussing
the operation of the SSP module in I2C mode.
The I2C bus is a two-wire serial interface developed by
the Philips® Corporation. The original specification, or
standard mode, was for data transfers of up to 100
Kbps. The enhanced specification (fast mode) is also
supported. This device will communicate with both
standard and fast mode devices if attached to the same
bus. The clock will determine the data rate.
The I2C interface employs a comprehensive protocol to
ensure reliable transmission and reception of data.
When transmitting data, one device is the “master”
which initiates transfer on the bus and generates the
clock signals to permit that transfer, while the other
device(s) acts as the “slave.” All portions of the slave
protocol are implemented in the SSP module’s hard-
ware, except general call support, while portions of the
master protocol need to be addressed in the
PIC16CXX software. Table 11-3 defines some of the
I2C bus terminology. For additional information on the
I2C interface specification, refer to the Philips docu-
ment “
The
I
2
C bus and how to use it.”
#939839340011,
which can be obtained from the Philips Corporation.
In the I2C interface protocol each device has an
address. When a master wishes to initiate a data trans-
fer, it first transmits the address of the device that it
wishes to “talk” to. All devices “listen” to see if this is
their address. Within this address, a bit specifies if the
master wishes to read-from/write-to the slave device.
The master and slave are always in opposite modes
(transmitter/receiver) of operation during a data trans-
fer. That is they can be thought of as operating in either
of these two relations:
• Master-transmitter and Slave-receiver
• Slave-transmitter and Master-receiver
In both cases the master generates the clock signal.
The output stages of the clock (SCL) and data (SDA)
lines must have an open-drain or open-collector in
order to perform the wired-AND function of the bus.
External pull-up resistors are used to ensure a high
level when no device is pulling the line down. The num-
ber of devices that may be attached to the I2C bus is
limited only by the maximum bus loading specification
of 400 pF.
11.4.1 INITIATING AND TERMINATING DATA
TRANSFER
During times of no data transfer (idle time), both the
clock line (SCL) and the data line (SDA) are pulled high
through the external pull-up resistors. The START and
STOP conditions determine the start and stop of data
transmission. The START condition is defined as a high
to low transition of the SDA when the SCL is high. The
STOP condition is defined as a low to high transition of
the SDA when the SCL is high. Figure 11-14 shows the
START and STOP conditions. The master generates
these conditions for starting and terminating data trans-
fer. Due to the definition of the START and STOP con-
ditions, when data is being transmitted, the SDA line
can only change state when the SCL line is low.
FIGURE 11-14: START AND STOP
CONDITIONS
SDA
SCL SP
Start
Condition
Change
of Data
Allowed
Change
of Data
Allowed
Stop
Condition
TABLE 11-3: I2C BUS TERMINOLOGY
Term Description
Transmitter The device that sends the data to the bus.
Receiver The device that receives the data from the bus.
Master The device which initiates the transfer, generates the clock and terminates the transfer.
Slave The device addressed by a master.
Multi-master More than one master device in a system. These masters can attempt to control the bus at the
same time without corrupting the message.
Arbitration Procedure that ensures that only one of the master devices will control the bus. This ensure that
the transfer data does not get corrupted.
Synchronization Procedure where the clock signals of two or more devices are synchronized.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBS‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
i A A flwmj L;q%
l—l\_ll:l
PIC16C6X
DS30234E-page 96 1997-2013 Microchip Technology Inc.
11.4.2 ADDRESSING I2C DEVICES
There are two address formats. The simplest is the
7-bit address format with a R/W bit (Figure 11-15). The
more complex is the 10-bit address with a R/W bit
(Figure 11-16). For 10-bit address format, two bytes
must be transmitted with the first five bits specifying this
to be a 10-bit address.
FIGURE 11-15: 7-BIT ADDRESS FORMAT
FIGURE 11-16: I2C 10-BIT ADDRESS FORMAT
11.4.3 TRANSFER ACKNOWLEDGE
All data must be transmitted per byte, with no limit to the
number of bytes transmitted per data transfer. After
each byte, the slave-receiver generates an acknowl-
edge bit (ACK) (Figure 11-17). When a slave-receiver
doesn’t acknowledge the slave address or received
data, the master must abort the transfer. The slave
must leave SDA high so that the master can generate
the STOP condition (Figure 11-14).
SR/W ACK
Sent by
Slave
slave address
S
R/W Read/Write pulse
MSb LSb
Start Condition
ACK Acknowledge
S 1 1 1 1 0 A9 A8 R/W ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK
sent by slave
= 0 for write
S
R/W
ACK
- Start Condition
- Read/Write Pulse
- Acknowledge
FIGURE 11-17: SLAVE-RECEIVER
ACKNOWLEDGE
If the master is receiving the data (master-receiver), it
generates an acknowledge signal for each received
byte of data, except for the last byte. To signal the end
of data to the slave-transmitter, the master does not
generate an acknowledge (not acknowledge). The
slave then releases the SDA line so the master can
generate the STOP condition. The master can also
generate the STOP condition during the acknowledge
pulse for valid termination of data transfer.
If the slave needs to delay the transmission of the next
byte, holding the SCL line low will force the master into
a wait state. Data transfer continues when the slave
releases the SCL line. This allows the slave to move the
received data or fetch the data it needs to transfer
before allowing the clock to start. This wait state tech-
nique can also be implemented at the bit level,
Figure 11-18. The slave will inherently stretch the
clock, when it is a transmitter, but will not when it is a
receiver. The slave will have to clear the SSPCON<4>
bit to enable clock stretching when it is a receiver.
S
Data
Output by
Tr a ns m i t te r
Data
Output by
Receiver
SCL from
Master
Start
Condition
Clock Pulse for
Acknowledgment
not acknowledge
acknowledge
1289
FIGURE 11-18: DATA TRANSFER WAIT STATE
12 78 9 123 89 P
SDA
SCL S
Start
Condition Address R/W ACK Wait
State
Data ACK
MSB acknowledgment
signal from receiver
acknowledgment
signal from receiver
byte complete
interrupt with receiver
clock line held low while
interrupts are serviced
Stop
Condition
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBG‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
DD
\ x7
1997-2013 Microchip Technology Inc. DS30234E-page 97
PIC16C6X
Figure 11-19 and Figure 11-20 show Master-transmit-
ter and Master-receiver data transfer sequences.
When a master does not wish to relinquish the bus (by
generating a STOP condition), a repeated START con-
dition (Sr) must be generated. This condition is identi-
cal to the start condition (SDA goes high-to-low while
SCL is high), but occurs after a data transfer acknowl-
edge pulse (not the bus-free state). This allows a mas-
ter to send “commands” to the slave and then receive
the requested information or to address a different
slave device. This sequence is shown in Figure 11-21.
FIGURE 11-19: MASTER-TRANSMITTER SEQUENCE
FIGURE 11-20: MASTER-RECEIVER SEQUENCE
FIGURE 11-21: COMBINED FORMAT
For 7-bit address:
SSlave Address
First 7 bits
SR/W
A1 Slave Address
Second byte
A2
Data A Data P
A master transmitter addresses a slave receiver
with a 10-bit address.
A/A
Slave Address R/W ADataADataA/AP
'0' (write) data transferred
(n bytes - acknowledge)
A master transmitter addresses a slave receiver with a
7-bit address. The transfer direction is not changed.
From master to slave
From slave to master
A = acknowledge (SDA low)
A = not acknowledge (SDA high)
S = Start Condition
P = Stop Condition
(write)
For 10-bit address:
For 7-bit address:
SSlave Address
First 7 bits
SR/W
A1 Slave Address
Second byte
A2
A master transmitter addresses a slave receiver
with a 10-bit address.
Slave Address R/W ADataAData A P
'1' (read) data transferred
(n bytes - acknowledge)
A master reads a slave immediately after the first byte.
From master to slave
From slave to master
A = acknowledge (SDA low)
A = not acknowledge (SDA high)
S = Start Condition
P = Stop Condition
(write)
For 10-bit address:
Slave Address
First 7 bits
Sr R/W A3 AData A PData
(read)
Combined format:
S
Combined format - A master addresses a slave with a 10-bit address, then transmits
Slave Address R/W ADataA/ASr P
(read) Sr = repeated
Transfer direction of data and acknowledgment bits depends on R/W bits.
From master to slave
From slave to master
A = acknowledge (SDA low)
A = not acknowledge (SDA high)
S = Start Condition
P = Stop Condition
Slave Address
First 7 bits
Sr R/W A
(write)
data to this slave and reads data from this slave.
Slave Address
Second byte
Data Sr Slave Address
First 7 bits
R/W ADataA APA ADataA/A Data
(read)
Slave Address R/W ADataA/A
Start Condition
(write) Direction of transfer
may change at this point
(read or write)
(n bytes + acknowledge)
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBS‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
PIC16C6X
DS30234E-page 98 1997-2013 Microchip Technology Inc.
11.4.4 MULTI-MASTER
The I2C protocol allows a system to have more than
one master. This is called multi-master. When two or
more masters try to transfer data at the same time, arbi-
tration and synchronization occur.
11.4.4.1 ARBITRATION
Arbitration takes place on the SDA line, while the SCL
line is high. The master which transmits a high when
the other master transmits a low loses arbitration
(Figure 11-22), and turns off its data output stage. A
master which lost arbitration can generate clock pulses
until the end of the data byte where it lost arbitration.
When the master devices are addressing the same
device, arbitration continues into the data.
FIGURE 11-22: MULTI-MASTER
ARBITRATION
(TWO MASTERS)
Masters that also incorporate the slave function, and
have lost arbitration must immediately switch over to
slave-receiver mode. This is because the winning mas-
ter-transmitter may be addressing it.
Arbitration is not allowed between:
• A repeated START condition
• A STOP condition and a data bit
• A repeated START condition and a STOP condi-
tion
Care needs to be taken to ensure that these conditions
do not occur.
transmitter 1 loses arbitration
DATA 1 SDA
DATA 1
DATA 2
SDA
SCL
11.2.4.2 Clock Synchronization
Clock synchronization occurs after the devices have
started arbitration. This is performed using a wired-
AND connection to the SCL line. A high to low transition
on the SCL line causes the concerned devices to start
counting off their low period. Once a device clock has
gone low, it will hold the SCL line low until its SCL high
state is reached. The low to high transition of this clock
may not change the state of the SCL line, if another
device clock is still within its low period. The SCL line is
held low by the device with the longest low period.
Devices with shorter low periods enter a high wait-
state, until the SCL line comes high. When the SCL line
comes high, all devices start counting off their high
periods. The first device to complete its high period will
pull the SCL line low. The SCL line high time is deter-
mined by the device with the shortest high period,
Figure 11-23.
FIGURE 11-23: CLOCK SYNCHRONIZATION
CLK
1
CLK
2
SCL
wait
state
start counting
HIGH period
counter
reset
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBS‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
SSP IZC Operation
1997-2013 Microchip Technology Inc. DS30234E-page 99
PIC16C6X
11.5 SSP I2C Operation
The SSP module in I2C mode fully implements all slave
functions, except general call support, and provides
interrupts on start and stop bits in hardware to facilitate
firmware implementations of the master functions. The
SSP module implements the standard mode specifica-
tions as well as 7-bit and 10-bit addressing. Two pins
are used for data transfer. These are the RC3/SCK/
SCL pin, which is the clock (SCL), and the RC4/SDI/
SDA pin, which is the data (SDA). The user must con-
figure these pins as inputs or outputs through the
TRISC<4:3> bits. The SSP module functions are
enabled by setting SSP Enable bit SSPEN (SSP-
CON<5>).
FIGURE 11-24: SSP BLOCK DIAGRAM
(I2C MODE)
The SSP module has five registers for I2C operation.
These are the:
• SSP Control Register (SSPCON)
• SSP Status Register (SSPSTAT)
• Serial Receive/Transmit Buffer (SSPBUF)
• SSP Shift Register (SSPSR) - Not directly acces-
sible
• SSP Address Register (SSPADD)
Read Write
SSPSR reg
Match detect
SSPADD reg
Start and
Stop bit detect
SSPBUF reg
Internal
data bus
Addr Match
Set, Reset
S, P bits
(SSPSTAT reg)
RC3/SCK/SCL
RC4/
shift
clock
MSb
SDI/
LSb
SDA
The SSPCON register allows control of the I2C opera-
tion. Four mode selection bits (SSPCON<3:0>) allow
one of the following I2C modes to be selected:
•I
2C Slave mode (7-bit address)
•I
2C Slave mode (10-bit address)
•I
2C Slave mode (7-bit address), with start and
stop bit interrupts enabled
•I
2C Slave mode (10-bit address), with start and
stop bit interrupts enabled
•I
2C Firmware controlled Master Mode, slave is
idle
Selection of any I2C mode, with the SSPEN bit set,
forces the SCL and SDA pins to be open drain, pro-
vided these pins are programmed to inputs by setting
the appropriate TRISC bits.
The SSPSTAT register gives the status of the data
transfer. This information includes detection of a
START or STOP bit, specifies if the received byte was
data or address if the next byte is the completion of 10-
bit address, and if this will be a read or write data trans-
fer. The SSPSTAT register is read only.
The SSPBUF is the register to which transfer data is
written to or read from. The SSPSR register shifts the
data in or out of the device. In receive operations, the
SSPBUF and SSPSR create a doubled buffered
receiver. This allows reception of the next byte to begin
before reading the last byte of received data. When the
complete byte is received, it is transferred to the
SSPBUF register and flag bit SSPIF is set. If another
complete byte is received before the SSPBUF register
is read, a receiver overflow has occurred and bit
SSPOV (SSPCON<6>) is set and the byte in the
SSPSR is lost.
The SSPADD register holds the slave address. In 10-bit
mode, the user first needs to write the high byte of the
address (1111 0 A9 A8 0). Following the high byte
address match, the low byte of the address needs to be
loaded (A7:A0).
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBG‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
PIC16C6X
DS30234E-page 100 1997-2013 Microchip Technology Inc.
11.5.1 SLAVE MODE
In slave mode, the SCL and SDA pins must be config-
ured as inputs (TRISC<4:3> set). The SSP module will
override the input state with the output data when
required (slave-transmitter).
When an address is matched or the data transfer after
an address match is received, the hardware automati-
cally will generate the acknowledge (ACK) pulse, and
then load the SSPBUF register with the received value
currently in the SSPSR register.
There are certain conditions that will cause the SSP
module not to give this ACK pulse. These are if either
(or both):
a) The buffer full bit BF (SSPSTAT<0>) was set
before the transfer was received.
b) The overflow bit SSPOV (SSPCON<6>) was set
before the transfer was received.
In this case, the SSPSR register value is not loaded
into the SSPBUF, but bit SSPIF (PIR1<3>) is set.
Table 11-4 shows what happens when a data transfer
byte is received, given the status of bits BF and SSPOV.
The shaded cells show the condition where user soft-
ware did not properly clear the overflow condition. Flag
bit BF is cleared by reading the SSPBUF register while
bit SSPOV is cleared through software.
The SCL clock input must have a minimum high and
low for proper operation. The high and low times of the
I2C specification as well as the requirement of the SSP
module is shown in timing parameter #100 and param-
eter #101.
11.5.1.1 ADDRESSING
Once the SSP module has been enabled, it waits for a
START condition to occur. Following the START condi-
tion, the 8-bits are shifted into the SSPSR register. All
incoming bits are sampled with the rising edge of the
clock (SCL) line. The value of register SSPSR<7:1> is
compared to the value of the SSPADD register. The
address is compared on the falling edge of the eighth
clock (SCL) pulse. If the addresses match, and the BF
and SSPOV bits are clear, the following events occur:
a) The SSPSR register value is loaded into the
SSPBUF register.
b) The buffer full bit, BF is set.
c) An ACK pulse is generated.
d) SSP interrupt flag bit, SSPIF (PIR1<3>) is set
(interrupt is generated if enabled) - on the falling
edge of the ninth SCL pulse.
In 10-bit address mode, two address bytes need to be
received by the slave (Figure 11-16). The five Most Sig-
nificant bits (MSbs) of the first address byte specify if
this is a 10-bit address. Bit R/W (SSPSTAT<2>) must
specify a write so the slave device will receive the sec-
ond address byte. For a 10-bit address the first byte
would equal ‘1111 0 A9 A8 0’, where A9 and A8 are
the two MSbs of the address. The sequence of events
for 10-bit address is as follows, with steps 7- 9 for slave-
transmitter:
1. Receive first (high) byte of Address (bits SSPIF,
BF, and bit UA (SSPSTAT<1>) are set).
2. Update the SSPADD register with second (low)
byte of Address (clears bit UA and releases the
SCL line).
3. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
4. Receive second (low) byte of Address (bits
SSPIF, BF, and UA are set).
5. Update the SSPADD register with the first (high)
byte of Address, if match releases SCL line, this
will clear bit UA.
6. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
7. Receive repeated START condition.
8. Receive first (high) byte of Address (bits SSPIF
and BF are set).
9. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
TABLE 11-4: DATA TRANSFER RECEIVED BYTE ACTIONS
Status Bits as Data
Transfer is Received
SSPSR SSPBUF
Generate ACK
Pulse
Set bit SSPIF
(SSP Interrupt occurs
if enabled)
BF SSPOV
00 Ye s Ye s Ye s
10 No No Yes
11 No No Yes
0 1 No No Ye s
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘SZ‘SZA‘RBZ‘SS‘RBS‘SA‘BAA‘RBA‘BS‘SSA‘RSS‘ES‘67
1%? /—><:x:x:x—><:x—x w—x—ww="" f="" [j="" flmmfmfmfmfmmm="" rmr‘xfflmwfimummxw="" tl="" ‘="" ‘="" ‘="" ‘="" 1="" a="" ‘="" ‘="" l="" —j—\+—i—‘i="" f7="" j=""> 1997-2013 Microchip Technology Inc. DS30234E-page 101
PIC16C6X
11.5.1.2 RECEPTION
When the R/W bit of the address byte is clear and an
address match occurs, the R/W bit of the SSPSTAT
register is cleared. The received address is loaded into
the SSPBUF register.
When the address byte overflow condition exists, then
no acknowledge (ACK) pulse is given. An overflow con-
dition is defined as either bit BF (SSPSTAT<0>) is set
or bit SSPOV (SSPCON<6>) is set.
An SSP interrupt is generated for each data transfer
byte. Flag bit SSPIF (PIR1<3>) must be cleared in soft-
ware. The SSPSTAT register is used to determine the
status of the byte.
FIGURE 11-25: I2C WAVEFORMS FOR RECEPTION (7-BIT ADDRESS)
P
9
8
76
5
D0
D1
D2
D3D4
D5
D6D7
S
A7 A6 A5 A4 A3 A2 A1SDA
SCL 123456789123456
789123
4
Bus Master
terminates
transfer
Bit SSPOV is set because the SSPBUF register is still full.
Cleared in software
SSPBUF register is read
ACK Receiving Data
Receiving Data
D0
D1
D2
D3D4
D5
D6D7
ACK
R/W=0
Receiving Address
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
SSPOV (SSPCON<6>)
ACK
ACK is not sent.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBS‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
/XX>PIC16C6X
DS30234E-page 102 1997-2013 Microchip Technology Inc.
11.5.1.3 TRANSMISSION
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register. The ACK pulse will
be sent on the ninth bit, and pin RC3/SCK/SCL is held
low. The transmit data must be loaded into the SSP-
BUF register, which also loads the SSPSR register.
Then pin RC3/SCK/SCL should be enabled by setting
bit CKP (SSPCON<4>). The master must monitor the
SCL pin prior to asserting another clock pulse. The
slave devices may be holding off the master by stretch-
ing the clock. The eight data bits are shifted out on the
falling edge of the SCL input. This ensures that the SDA
signal is valid during the SCL high time (Figure 11-26).
An SSP interrupt is generated for each data transfer
byte. Flag bit SSPIF must be cleared in software, and
the SSPSTAT register is used to determine the status
of the byte. Flag bit SSPIF is set on the falling edge of
the ninth clock pulse.
As a slave-transmitter, the ACK pulse from the master-
receiver is latched on the rising edge of the ninth SCL
input pulse. If the SDA line was high (not ACK), then the
data transfer is complete. When the ACK is latched by
the slave, the slave logic is reset (resets SSPSTAT reg-
ister) and the slave then monitors for another occur-
rence of the START bit. If the SDA line was low (ACK),
the transmit data must be loaded into the SSPBUF reg-
ister, which also loads the SSPSR register. Then pin
RC3/SCK/SCL should be enabled by setting bit CKP.
FIGURE 11-26: I2C WAVEFORMS FOR TRANSMISSION (7-BIT ADDRESS)
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
CKP (SSPCON<4>)
A7 A6 A5 A4 A3 A2 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0
ACK
Transmitting DataR/W = 1Receiving Address
123456789 123456789 P
cleared in software
SSPBUF is written in software
From SSP interrupt
service routine
Set bit after writing to SSPBUF
SData in
sampled
SCL held low
while CPU
responds to SSPIF
(the SSPBUF must be written-to
before the CKP bit can be set)
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBG‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
1997-2013 Microchip Technology Inc. DS30234E-page 103
PIC16C6X
11.5.2 MASTER MODE
Master mode of operation is supported in firmware
using interrupt generation on the detection of the
START and STOP conditions. The STOP (P) and
START (S) bits are cleared from a reset or when the
SSP module is disabled. The STOP (P) and START (S)
bits will toggle based on the START and STOP condi-
tions. Control of the I2C bus may be taken when the P
bit is set, or the bus is idle and both the S and P bits are
clear.
In master mode the SCL and SDA lines are manipu-
lated by clearing the corresponding TRISC<4:3> bit(s).
The output level is always low, irrespective of the
value(s) in PORTC<4:3>. So when transmitting data, a
'1' data bit must have the TRISC<4> bit set (input) and
a '0' data bit must have the TRISC<4> bit cleared (out-
put). The same scenario is true for the SCL line with the
TRISC<3> bit.
The following events will cause SSP Interrupt Flag bit,
SSPIF, to be set (SSP Interrupt if enabled):
• START condition
• STOP condition
• Data transfer byte transmitted/received
Master mode of operation can be done with either the
slave mode idle (SSPM3:SSPM0 = 1011) or with the
slave active. When both master and slave modes are
enabled, the software needs to differentiate the
source(s) of the interrupt.
11.5.3 MULTI-MASTER MODE
In multi-master mode, the interrupt generation on the
detection of the START and STOP conditions allows
the determination of when the bus is free. The STOP
(P) and START (S) bits are cleared from a reset or
when the SSP module is disabled. The STOP (P) and
START (S) bits will toggle based on the START and
STOP conditions. Control of the I2C bus may be taken
when bit P (SSPSTAT<4>) is set, or the bus is idle and
both the S and P bits clear. When the bus is busy,
enabling the SSP Interrupt will generate the interrupt
when the STOP condition occurs.
In multi-master operation, the SDA line must be moni-
tored to see if the signal level is the expected output
level. This check only needs to be done when a high
level is output. If a high level is expected and a low level
is present, the device needs to release the SDA and
SCL lines (set TRISC<4:3>). There are two stages
where this arbitration can be lost, these are:
• Address Transfer
• Data Transfer
When the slave logic is enabled, the slave continues to
receive. If arbitration was lost during the address trans-
fer stage, communication to the device may be in prog-
ress. If addressed an ACK pulse will be generated. If
arbitration was lost during the data transfer stage, the
device will need to re-transfer the data at a later time.
TABLE 11-5: REGISTERS ASSOCIATED WITH I2C OPERATION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on all
other resets
0Bh, 8Bh,
10Bh, 18Bh
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 PSPIF(1) (2) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
8Ch PIE1 PSPIE(1) (2) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
93h SSPADD Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
94h SSPSTAT SMP(3) CKE(3) D/A PSR/WUA BF 0000 0000 0000 0000
87h TRISC PORTC Data Direction register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'.
Shaded cells are not used by SSP module in SPI mode.
Note 1: PSPIF and PSPIE are reserved on the PIC16C66, always maintain these bits clear.
2: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
3: The SMP and CKE bits are implemented on the PIC16C66/67 only. All other PIC16C6X devices have these two bits unim-
plemented, read as '0'.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Appucame Devices
m ‘62‘EZA‘R52‘53‘RBG‘EA‘BAA‘RBA‘BS‘SSA‘RSS‘EE‘67
PIC16C6X
DS30234E-page 104 1997-2013 Microchip Technology Inc.
FIGURE 11-27: OPERATION OF THE I2C MODULE IN IDLE_MODE, RCV_MODE OR XMIT_MODE
IDLE_MODE (7-bit):
if (Addr_match) { Set interrupt;
if (R/W = 1) { Send ACK = 0;
set XMIT_MODE;
}
else if (R/W = 0) set RCV_MODE;
}
RCV_MODE:
if ((SSPBUF=Full) OR (SSPOV = 1))
{ Set SSPOV;
Do not acknowledge;
}
else { transfer SSPSR SSPBUF;
send ACK = 0;
}
Receive 8-bits in SSPSR;
Set interrupt;
XMIT_MODE:
While ((SSPBUF = Empty) AND (CKP=0)) Hold SCL Low;
Send byte;
Set interrupt;
if ( ACK Received = 1) { End of transmission;
Go back to IDLE_MODE;
}
else if ( ACK Received = 0) Go back to XMIT_MODE;
IDLE_MODE (10-Bit):
If (High_byte_addr_match AND (R/W = 0))
{ PRIOR_ADDR_MATCH = FALSE;
Set interrupt;
if ((SSPBUF = Full) OR ((SSPOV = 1))
{ Set SSPOV;
Do not acknowledge;
}
else { Set UA = 1;
Send ACK = 0;
While (SSPADD not updated) Hold SCL low;
Clear UA = 0;
Receive Low_addr_byte;
Set interrupt;
Set UA = 1;
If (Low_byte_addr_match)
{ PRIOR_ADDR_MATCH = TRUE;
Send ACK = 0;
while (SSPADD not updated) Hold SCL low;
Clear UA = 0;
Set RCV_MODE;
}
}
}
else if (High_byte_addr_match AND (R/W = 1)
{ if (PRIOR_ADDR_MATCH)
{ send ACK = 0;
set XMIT_MODE;
}
else PRIOR_ADDR_MATCH = FALSE;
}
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Asynchronous mode
Synchmnous mode
Asynchronous mode
Synchmnous mode
1997-2013 Microchip Technology Inc. DS30234E-page 105
PIC16C6X
12.0 UNIVERSAL SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (USART)
MODULE
The Universal Synchronous Asynchronous Receiver
Transmitter (USART) module is one of the two serial
I/O modules. (USART is also known as a Serial Com-
munications Interface or SCI) The USART can be con-
figured as a full duplex asynchronous system that can
communicate with peripheral devices such as CRT ter-
Applicable Devices
61 62 62A R6263R6364 64A R64 65 65A R65 66 67
minals and personal computers, or it can be configured
as a half duplex synchronous system that can commu-
nicate with peripheral devices such as A/D or D/A inte-
grated circuits, Serial EEPROMs etc.
The USART can be configured in the following modes:
• Asynchronous (full duplex)
• Synchronous - Master (half duplex)
• Synchronous - Slave (half duplex)
Bit SPEN (RCSTA<7>) and bits TRISC<7:6> have to
be set in order to configure pins RC6/TX/CK and
RC7/RX/DT as the Universal Synchronous Asynchro-
nous Receiver Transmitter.
FIGURE 12-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER (ADDRESS 98h)
R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R-1 R/W-0
CSRC TX9 TXEN SYNC — BRGH TRMT TX9D R = Readable bit
W = Writable bit
U = Unimplemented bit,
read as ‘0’
- n =Value at POR reset
bit7 bit0
bit 7: CSRC: Clock Source Select bit
Asynchronous mode
Don’t care
Synchronous mode
1 = Master mode (Clock generated internally from BRG)
0 = Slave mode (Clock from external source)
bit 6: TX9: 9-bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5: TXEN: Transmit Enable bit
1 = Transmit enabled
0 = Transmit disabled
Note: SREN/CREN overrides TXEN in SYNC mode.
bit 4: SYNC: USART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3: Unimplemented: Read as '0'
bit 2: BRGH: High Baud Rate Select bit
Asynchronous mode
1 = High speed
Note: For the PIC16C63/R63/65/65A/R65 the asynchronous high speed mode (BRGH = 1) may
experience a high rate of receive errors. It is recommended that BRGH = 0. If you desire a
higher baud rate than BRGH = 0 can support, refer to the device errata for additional infor-
mation or use the PIC16C66/67.
0 = Low speed
Synchronous mode
Unused in this mode
bit 1: TRMT: Transmit Shift Register Status bit
1 = TSR empty
0 = TSR full
bit 0: TX9D: 9th bit of transmit data. Can be parity bit.
Asynchwnous mode
Synchronous mode - masmr
Synchronous mode - s‘ave
Asynchwnous mode
Synchronous mode
PIC16C6X
DS30234E-page 106 1997-2013 Microchip Technology Inc.
FIGURE 12-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER (ADDRESS 18h)
R/W-0 R/W-0 R/W-0 R/W-0 U-0 R-0 R-0 R-x
SPEN RX9 SREN CREN — FERR OERR RX9D R = Readable bit
W = Writable bit
U = Unimplemented
bit, read as ‘0’
- n = Value at POR reset
x= unknown
bit7 bit0
bit 7: SPEN: Serial Port Enable bit
(Configures RC7/RX/DT and RC6/TX/CK pins as serial port pins when bits TRISC<7:6> are set)
1 = Serial port enabled
0 = Serial port disabled
bit 6: RX9: 9-bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5: SREN: Single Receive Enable bit
Asynchronous mode
Don’t care
Synchronous mode - master
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode - slave
Unused in this mode
bit 4: CREN: Continuous Receive Enable bit
Asynchronous mode
1 = Enables continuous receive
0 = Disables continuous receive
Synchronous mode
1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3: Unimplemented: Read as '0'
bit 2: FERR: Framing Error bit
1 = Framing error (Can be updated by reading RCREG register and receive next valid byte)
0 = No framing error
bit 1: OERR: Overrun Error bit
1 = Overrun error (Can be cleared by clearing bit CREN)
0 = No overrun error
bit 0: RX9D: 9th bit of received data (Can be parity bit)
USART Baud Rate Generalor ERG
A. «name Devices
IEW
m. 2A 6 53 sal-m- 5A
mu m-
1997-2013 Microchip Technology Inc. DS30234E-page 107
PIC16C6X
12.1 USART Baud Rate Generator (BRG)
The BRG supports both the Asynchronous and Syn-
chronous modes of the USART. It is a dedicated 8-bit
baud rate generator. The SPBRG register controls the
period of a free running 8-bit timer. In asynchronous
mode bit BRGH (TXSTA<2>) also controls the baud
rate. In synchronous mode bit BRGH is ignored.
Table 12-1 shows the formula for computation of the
baud rate for different USART modes which only apply
in master mode (internal clock).
Given the desired baud rate and Fosc, the nearest inte-
ger value for the SPBRG register can be calculated
using the formula in Table 12-1. From this, the error in
baud rate can be determined.
Example 12-1 shows the calculation of the baud rate
error for the following conditions:
FOSC = 16 MHz
Desired Baud Rate = 9600
BRGH = 0
SYNC = 0
Applicable Devices
61 62 62A R6263R6364 64A R64 65 65A R65 66 67
EXAMPLE 12-1: CALCULATING BAUD RATE
ERROR
It may be advantageous to use the high baud rate
(BRGH = 1) even for slower baud clocks. This is
because the FOSC/(16(X + 1)) equation can reduce the
baud rate error in some cases.
Writing a new value to the SPBRG register, causes the
BRG timer to be reset (or cleared), this ensures that the
BRG does not wait for a timer overflow before output-
ting the new baud rate.
Note: For the PIC16C63/R63/65/65A/R65 the
asynchronous high speed mode
(BRGH = 1) may experience a high rate of
receive errors. It is recommended that
BRGH = 0. If you desire a higher baud rate
than BRGH = 0 can support, refer to the
device errata for additional information or
use the PIC16C66/67.
Desired Baud rate = Fosc / (64 (X + 1))
9600 = 16000000 /(64 (X + 1))
X=25.042 = 25
Calculated Baud Rate=16000000 / (64 (25 + 1))
=9615
Error = (Calculated Baud Rate - Desired Baud Rate)
Desired Baud Rate
= (9615 - 9600) / 9600
=0.16%
TABLE 12-1: BAUD RATE FORMULA
TABLE 12-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR
SYNC BRGH = 0 (Low Speed) BRGH = 1 (High Speed)
0
1
(Asynchronous) Baud Rate = FOSC/(64(X+1))
(Synchronous) Baud Rate = FOSC/(4(X+1))
Baud Rate = FOSC/(16(X+1))
N/A
X = value in SPBRG (0 to 255)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
Resets
98h TXSTA CSRC TX9 TXEN SYNC —BRGHTRMT TX9D 0000 -010 0000 -010
18h RCSTA SPEN RX9 SREN CREN —FERR OERR RX9D 0000 -00x 0000 -00x
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented read as '0'. Shaded cells are not used by the BRG.
PIC16C6X
DS30234E-page 108 1997-2013 Microchip Technology Inc.
TABLE 12-3: BAUD RATES FOR SYNCHRONOUS MODE
TABLE 12-4: BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 0)
BAUD
RATE
(K)
FOSC = 20 MHz SPBRG
value
(decimal)
16 MHz SPBRG
value
(decimal)
10 MHz SPBRG
value
(decimal)
7.15909 MHz SPBRG
value
(decimal)
KBAUD %
ERROR KBAUD %
ERROR KBAUD %
ERROR KBAUD %
ERROR
0.3NA- -NA- -NA- -NA- -
1.2NA- -NA- -NA- -NA- -
2.4NA- -NA- -NA- -NA- -
9.6 NA - - NA - - 9.766 +1.73 255 9.622 +0.23 185
19.2 19.53 +1.73 255 19.23 +0.16 207 19.23 +0.16 129 19.24 +0.23 92
76.8 76.92 +0.16 64 76.92 +0.16 51 75.76 -1.36 32 77.82 +1.32 22
96 96.15 +0.16 51 95.24 -0.79 41 96.15 +0.16 25 94.20 -1.88 18
300 294.1 -1.96 16 307.69 +2.56 12 312.5 +4.17 7 298.3 -0.57 5
500 500 0 9 500 0 7 500 0 4 NA - -
HIGH 5000 - 0 4000 - 0 2500 - 0 1789.8 - 0
LOW 19.53 - 255 15.625 - 255 9.766 - 255 6.991 - 255
BAUD
RATE
(K)
FOSC = 5.0688 MHz 4 MHz
SPBRG
value
(decimal)
3.579545 MHz
SPBRG
value
(decimal)
1 MHz
SPBRG
value
(decimal)
32.768 kHz
SPBRG
value
(decimal)
KBAUD %
ERROR
SPBRG
value
(decimal)
KBAUD %
ERROR
KBAUD %
ERROR
KBAUD %
ERROR
KBAUD %
ERROR
0.3NA- -NA- - NA- -NA- -0.303+1.1426
1.2 NA - - NA - - NA - - 1.202 +0.16 207 1.170 -2.48 6
2.4NA- -NA- - NA- -2.404+0.16103NA- -
9.6 9.6 0 131 9.615 +0.16 103 9.622 +0.23 92 9.615 +0.16 25 NA - -
19.2 19.2 0 65 19.231 +0.16 51 19.04 -0.83 46 19.24 +0.16 12 NA - -
76.8 79.2 +3.13 15 76.923 +0.16 12 74.57 -2.90 11 83.34 +8.51 2 NA - -
96 97.48 +1.54 12 1000 +4.17 9 99.43 +3.57 8 NA - - NA - -
300 316.8 +5.60 3 NA - - 298.3 -0.57 2 NA - - NA - -
500NA- - NA- - NA- - NA- - NA- -
HIGH 1267 - 0 100 - 0 894.9 - 0 250 - 0 8.192 - 0
LOW 4.950 - 255 3.906 - 255 3.496 - 255 0.9766 - 255 0.032 - 255
BAUD
RATE
(K)
FOSC = 20 MHz SPBRG
value
(decimal)
16 MHz SPBRG
value
(decimal)
10 MHz SPBRG
value
(decimal)
7.15909 MHz SPBRG
value
(decimal)KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR
0.3NA--NA --NA --NA--
1.2 1.221 +1.73 255 1.202 +0.16 207 1.202 +0.16 129 1.203 +0.23 92
2.4 2.404 +0.16 129 2.404 +0.16 103 2.404 +0.16 64 2.380 -0.83 46
9.6 9.469 -1.36 32 9.615 +0.16 25 9.766 +1.73 15 9.322 -2.90 11
19.2 19.53 +1.73 15 19.23 +0.16 12 19.53 +1.73 7 18.64 -2.90 5
76.8 78.13 +1.73 3 83.33 +8.51 2 78.13 +1.73 1 NA - -
96 104.2 +8.51 2 NA - - NA - - NA - -
300 312.5 +4.17 0 NA - - NA - - NA - -
500NA- -NA- -NA- -NA- -
HIGH 312.5 - 0 250 - 0 156.3 - 0 111.9 - 0
LOW 1.221 - 255 0.977 - 255 0.6104 - 255 0.437 - 255
BAUD
RATE
(K)
FOSC = 5.0688 MHz 4 MHz
SPBRG
value
(decimal)
3.579545 MHz
SPBRG
value
(decimal)
1 MHz
SPBRG
value
(decimal)
32.768 kHz
SPBRG
value
(decimal)KBAUD
%
ERROR
SPBRG
value
(decimal) KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR
0.3 0.31 +3.13 255 0.3005 -0.17 207 0.301 +0.23 185 0.300 +0.16 51 0.256 -14.67 1
1.2 1.2 0 65 1.202 +1.67 51 1.190 -0.83 46 1.202 +0.16 12 NA - -
2.4 2.4 0 32 2.404 +1.67 25 2.432 +1.32 22 2.232 -6.99 6 NA - -
9.6 9.9 +3.13 7 NA - - 9.322 -2.90 5 NA - - NA - -
19.2 19.8 +3.13 3 NA - - 18.64 -2.90 2 NA - - NA - -
76.879.2+3.130NA--NA--NA--NA--
96 NA - - NA - - NA - - NA - - NA - -
300NA- -NA- -NA- -NA- -NA- -
500NA- -NA- -NA- -NA- -NA- -
HIGH 79.2 - 0 62.500 - 0 55.93 - 0 15.63 - 0 0.512 - 0
LOW 0.3094 - 255 3.906 - 255 0.2185 - 255 0.0610 - 255 0.0020 - 255
1997-2013 Microchip Technology Inc. DS30234E-page 109
PIC16C6X
TABLE 12-5: BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 1)
BAUD
RATE
(K)
FOSC = 20 MHz SPBRG
value
(decimal)
16 MHz SPBRG
value
(decimal)
10 MHz SPBRG
value
(decimal)
7.16 MHz SPBRG
value
(decimal)KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR
9.6 9.615 +0.16 129 9.615 +0.16 103 9.615 +0.16 64 9.520 -0.83 46
19.2 19.230 +0.16 64 19.230 +0.16 51 18.939 -1.36 32 19.454 +1.32 22
38.4 37.878 -1.36 32 38.461 +0.16 25 39.062 +1.7 15 37.286 -2.90 11
57.6 56.818 -1.36 21 58.823 +2.12 16 56.818 -1.36 10 55.930 -2.90 7
115.2 113.636 -1.36 10 111.111 -3.55 8 125 +8.51 4 111.860 -2.90 3
250 250 0 4 250 0 3 NA - - NA - -
625 625 0 1 NA - - 625 0 0 NA - -
1250 1250 0 0 NA - - NA - - NA - -
BAUD
RATE
(K)
FOSC = 5.068 MHz SPBRG
value
(decimal)
4 MHz SPBRG
value
(decimal)
3.579 MHz SPBRG
value
(decimal)
1 MHz SPBRG
value
(decimal)
32.768 kHz SPBRG
value
(decimal)KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR KBAUD
%
ERROR
9.6 9.6 0 32 NA - - 9.727 +1.32 22 8.928 -6.99 6 NA - -
19.2 18.645 -2.94 16 1.202 +0.17 207 18.643 -2.90 11 20.833 +8.51 2 NA - -
38.4 39.6 +3.12 7 2.403 +0.13 103 37.286 -2.90 5 31.25 -18.61 1 NA - -
57.6 52.8 -8.33 5 9.615 +0.16 25 55.930 -2.90 3 62.5 +8.51 0 NA - -
115.2 105.6 -8.33 2 19.231 +0.16 12 111.860 -2.90 1 NA - - NA - -
250 NA - - NA - - 223.721 -10.51 0 NA - - NA - -
625NA - -NA- -NA- -NA- -NA- -
1250 NA - - NA - - NA - - NA - - NA - -
Note: For the PIC16C63/R63/65/65A/R65 the asynchronous high speed mode (BRGH = 1) may experience a high
rate of receive errors. It is recommended that BRGH = 0. If you desire a higher baud rate than BRGH = 0
can support, refer to the device errata for additional information or use the PIC16C66/67.
4 Q Q 5 g Q L
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PIC16C6X
DS30234E-page 110 1997-2013 Microchip Technology Inc.
12.1.1 SAMPLING
The data on the RC7/RX/DT pin is sampled three times
by a majority detect circuit to determine if a high or a
low level is present at the RX pin. If bit BRGH
(TXSTA<2>) is clear (i.e., at the low baud rates), the
sampling is done on the seventh, eighth and ninth fall-
ing edges of a x16 clock (Figure 12-3). If bit BRGH is
set (i.e., at the high baud rates), the sampling is done
on the 3 clock edges preceding the second rising edge
after the first falling edge of a x4 clock (Figure 12-4 and
Figure 12-5).
FIGURE 12-3: RX PIN SAMPLING SCHEME (BRGH = 0) PIC16C63/R63/65/65A/R65)
FIGURE 12-4: RX PIN SAMPLING SCHEME (BRGH = 1) (PIC16C63/R63/65/65A/R65)
FIGURE 12-5: RX PIN SAMPLING SCHEME (BRGH = 1) (PIC16C63/R63/65/65A/R65)
RX
baud CLK
x16 CLK
Start bit Bit0
Samples
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2 3
Baud CLK for all but start bit
(RC7/RX/DT pin)
RC7/RX/DT pin
baud clk
x4 clk
Q2, Q4 clk
Start Bit bit0 bit1
First falling edge after RX pin goes low
Second rising edge
Samples Samples Samples
1234123412
RC7/RX/DT pin
baud clk
x4 clk
Q2, Q4 clk
Start Bit bit0
First falling edge after RX pin goes low
Second rising edge
Samples
1234
Baud clk for all but start bit
1997-2013 Microchip Technology Inc. DS30234E-page 111
PIC16C6X
FIGURE 12-6: RX PIN SAMPLING SCHEME (BRGH = 0 OR = 1) (PIC16C66/67)
RX
baud CLK
x16 CLK
Start bit Bit0
Samples
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2 3
Baud CLK for all but start bit
(RC7/RX/DT pin)
USART Asynchronous Mode
II“ MIME-
PIC16C6X
DS30234E-page 112 1997-2013 Microchip Technology Inc.
12.2 USART Asynchronous Mode
In this mode, the USART uses standard nonreturn-to-
zero (NRZ) format (one start bit, eight or nine data bits
and one stop bit). The most common data format is
8-bits. An on-chip dedicated 8-bit baud rate generator
can be used to derive standard baud rate frequencies
from the oscillator. The USART transmits and receives
the LSb first. The USART’s transmitter and receiver are
functionally independent but use the same data format
and baud rate. The baud rate generator produces a
clock either x16 or x64 of the bit shift rate, depending
on bit BRGH (TXSTA<2>). Parity is not supported by
the hardware, but can be implemented in software (and
stored as the ninth data bit). Asynchronous mode is
stopped during SLEEP.
Asynchronous mode is selected by clearing bit SYNC
(TXSTA<4>).
The USART Asynchronous module consists of the fol-
lowing important elements:
• Baud Rate Generator
• Sampling Circuit
• Asynchronous Transmitter
• Asynchronous Receiver
12.2.1 USART ASYNCHRONOUS TRANSMITTER
The USART transmitter block diagram is shown in
Figure 12-7. The heart of the transmitter is the transmit
(serial) shift register (TSR). The shift register obtains its
data from the read/write transmit buffer, TXREG. The
TXREG register is loaded with data in software. The
TSR register is not loaded until the STOP bit has been
transmitted from the previous load. As soon as the
STOP bit is transmitted, the TSR is loaded with new
data from the TXREG (if available). Once the TXREG
register transfers the data to the TSR register (occurs
in one TCY) the TXREG register is empty and flag bit
TXIF (PIR1<4>) is set. This interrupt is enabled/dis-
Applicable Devices
61 62 62A R6263R6364 64A R646565AR656667
abled by setting/clearing enable bit TXIE (PIE1<4>).
Flag bit TXIF will be set regardless of the state of
enable bit TXIE and cannot be cleared in software. It
will reset only when new data is loaded into the TXREG
register. While flag bit TXIF indicates the status of the
TXREG register, another bit, TRMT (TXSTA<1>)
shows the status of the TSR register. Status bit TRMT
is a read only bit which is set when the TSR register is
empty. No interrupt logic is tied to this bit, so the user
has to poll this bit in order to determine if the TSR reg-
ister is empty.
Transmission is enabled by setting enable bit TXEN
(TXSTA<5>). The actual transmission will not occur
until the TXREG register has been loaded with data
and the baud rate generator (BRG) has produced a
shift clock (Figure 12-7). The transmission can also be
started by first loading the TXREG register and then
setting enable bit TXEN. Normally when transmission
is first started, the TSR register is empty, so a transfer
to the TXREG register will result in an immediate trans-
fer to TSR register resulting in an empty TXREG regis-
ter. A back-to-back transfer is thus possible (Figure 12-
9). Clearing enable bit TXEN during a transmission will
cause the transmission to be aborted and will reset the
transmitter. As a result the RC6/TX/CK pin will revert to
hi-impedance.
In order to select 9-bit transmission, transmit bit TX9
(TXSTA<6>) should be set and the ninth bit should be
written to bit TX9D (TXSTA<0>). The ninth bit must be
written before writing the 8-bit data to the TXREG reg-
ister. This is because a data write to the TXREG regis-
ter can result in an immediate transfer of the data to the
TSR register (if the TSR is empty). In such a case, an
incorrect ninth data bit maybe loaded in the TSR regis-
ter.
Note 1: The TSR register is not mapped in data
memory so it is not available to the user.
Note 2: Flag bit TXIF is set when enable bit TXEN
is set.
FIGURE 12-7: USART TRANSMIT BLOCK DIAGRAM
TXIF
TXIE
Interrupt
TXEN Baud Rate CLK
SPBRG
Baud Rate Generator
TX9D
MSb LSb
Data Bus
TXREG register
TSR register
(8) 0
TX9
TRMT SPEN
RC6/TX/CK pin
Pin Buffer
and Control
8
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1997-2013 Microchip Technology Inc. DS30234E-page 113
PIC16C6X
Steps to follow when setting up an Asynchronous
Transmission:
1. Initialize the SPBRG register for the appropriate
baud rate. If a high speed baud rate is desired,
then set bit BRGH. (Section 12.1).
2. Enable the asynchronous serial port by clearing
bit SYNC and setting bit SPEN.
3. If interrupts are desired, then set enable bit
TXIE.
4. If 9-bit transmission is desired, then set transmit
bit TX9.
5. Enable the transmission by setting bit TXEN,
which will also set bit TXIF.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit TX9D.
7. Load data to the TXREG register (starts trans-
mission).
FIGURE 12-8: ASYNCHRONOUS MASTER TRANSMISSION
FIGURE 12-9: ASYNCHRONOUS MASTER TRANSMISSION (BACK TO BACK)
TABLE 12-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
Resets
0Ch PIR1 PSPIF(1) (2) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN —FERR OERR RX9D 0000 -00x 0000 -00x
19h TXREG USART Transmit Register 0000 0000 0000 0000
8Ch PIE1 PSPIE(1) (2) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC —BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as '0'. Shaded cells are not used for Asynchronous Transmission.
Note 1: PSPIF and PSPIE are reserved on the PIC16C63/R63/66, always maintain these bits clear.
2: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
WORD 1
Stop Bit
WORD 1
Tra ns mit Sh ift Reg
Start Bit Bit 0 Bit 1 Bit 7/8
Write to TXREG reg
Word 1
BRG output
(shift clock)
RC6/TX/CK (pin)
TXIF bit
(Transmit buffer
reg. empty flag)
TRMT bit
(Transmit shift
reg. empty flag)
Transmit Shift Reg.
Write to TXREG reg
BRG output
(shift clock)
RC6/TX/CK (pin)
TXIF bit
(interrupt reg. flag)
TRMT bit
(Transmit shift
reg. empty flag)
Word 1 Word 2
WORD 1 WORD 2
Start Bit Stop Bit Start Bit
Transmit Shift Reg.
WORD 1 WORD 2
Bit 0 Bit 1 Bit 7/8 Bit 0
Note: This timing diagram shows two consecutive transmissions.
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PIC16C6X
DS30234E-page 114 1997-2013 Microchip Technology Inc.
12.2.2 USART ASYNCHRONOUS RECEIVER
The receiver block diagram is shown in Figure 12-10.
The data comes in the RC7/RX/DT pin and drives the
data recovery block. The data recovery block is actually
a high speed shifter operating at x16 times the baud
rate, whereas the main receive serial shifter operates at
the bit rate or at FOSC.
Once Asynchronous mode is selected, reception is
enabled by setting bit CREN (RCSTA<4>).
The heart of the receiver is the receive (serial) shift reg-
ister (RSR). After sampling the STOP bit, the received
data in the RSR is transferred to the RCREG register (if
it is empty). If the transfer is complete, flag bit RCIF
(PIR1<5>) is set. The actual interrupt can be
enabled/disabled by setting/clearing enable bit RCIE
(PIE1<5>). Flag bit RCIF is a read only bit which is
cleared by the hardware. It is cleared when the RCREG
register has been read and is empty. The RCREG is
double buffered register, i.e., it is a two deep FIFO. It is
possible for two bytes of data to be received and trans-
ferred to the RCREG FIFO and a third byte begin shift-
ing to the RSR register. On the detection of the STOP
bit of the third byte, if the RCREG is still full, then the
overrun error bit, OERR (RCSTA<1>) will be set. The
word in the RSR register will be lost. The RCREG reg-
ister can be read twice to retrieve the two bytes in the
FIFO. Overrun bit OERR has to be cleared in software.
This is done by resetting the receive logic (CREN is
cleared and then set). If bit OERR is set, transfers from
the RSR register to the RCREG register are inhibited,
so it is essential to clear overrun bit OERR if it is set.
Framing error bit FERR (RCSTA<2>) is set if a stop bit
is detected as clear. Error bit FERR and the 9th receive
bit are buffered the same way as the receive data.
Reading the RCREG register will load bits RX9D and
FERR with new values. Therefore it is essential for the
user to read the RCSTA register before reading
RCREG in order not to lose the old FERR and RX9D
information.
FIGURE 12-10: USART RECEIVE BLOCK DIAGRAM
FIGURE 12-11: ASYNCHRONOUS RECEPTION
x64 Baud Rate CLK
SPBRG
Baud Rate Generator
RC7/RX/DT
Pin Buffer
and Control
SPEN
Data
Recovery
CREN
OERR FERR
RSR register
MSb LSb
RX9D RCREG register
FIFO
Interrupt RCIF
RCIE
Data Bus
8
64
16
or
Stop Start
(8) 710
RX9
Start
bit bit7/8
bit1bit0 bit7/8 bit0Stop
bit
Start
bit
Start
bit
bit7/8 Stop
bit
RC7/RX/DT (pin)
reg
Rcv buffer reg
Rcv shift
Read Rcv
buffer reg
RCREG
RCIF
(interrupt flag)
OERR bit
CREN bit
WORD 1
RCREG
WORD 2
RCREG
Stop
bit
Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word,
causing overrun error bit OERR to be set.
1997-2013 Microchip Technology Inc. DS30234E-page 115
PIC16C6X
Steps to follow when setting up an Asynchronous
Reception:
1. Initialize the SPBRG register for the appropriate
baud rate. If a high speed baud rate is desired,
set bit BRGH (Section 12.1).
2. Enable the asynchronous serial port by clearing
bit SYNC and setting bit SPEN.
3. If interrupts are desired, then set enable bit
RCIE.
4. If 9-bit reception is desired, then set bit RX9.
5. Enable the reception by setting enable bit
CREN.
6. Flag bit RCIF will be set when reception is com-
plete, and an interrupt will be generated if
enable bit RCIE was set.
7. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
8. Read the 8-bit received data by reading the
RCREG register.
9. If any error occurred, clear the error by clearing
enable bit CREN.
TABLE 12-7: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
Resets
0Ch PIR1 PSPIF(1) (2) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x
1Ah RCREG USART Receive Register 0000 0000 0000 0000
8Ch PIE1 PSPIE(1) (2) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC —BRGHTRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as '0'. Shaded cells are not used for Asynchronous Reception.
Note 1: PSPIE and PSPIF are reserved on the PIC16C63/R63/66, always maintain these bits clear.
2: PIE1<6> and PIR1<6> are reserved, always maintain these bits clear.
USART Synchronous Master Mode
"E 6 63M SA-EI
PIC16C6X
DS30234E-page 116 1997-2013 Microchip Technology Inc.
12.3 USART Synchronous Master Mode
In Synchronous Master mode the data is transmitted in
a half-duplex manner i.e., transmission and reception
do not occur at the same time. When transmitting data
the reception is inhibited and vice versa. Synchronous
mode is entered by setting bit SYNC (TXSTA<4>). In
addition enable bit SPEN (RCSTA<7>) is set in order to
configure the RC6 and RC7 I/O pins to CK (clock) and
DT (data) lines respectively. The Master mode indi-
cates that the processor transmits the master clock on
the CK line. The Master mode is entered by setting bit
CSRC (TXSTA<7>).
12.3.1 USART SYNCHRONOUS MASTER
TRANSMISSION
The USART transmitter block diagram is shown in
Figure 12-7. The heart of the transmitter is the transmit
(serial) shift register (TSR). The shift register obtains its
data from the read/write transmit buffer register,
TXREG. The TXREG register is loaded with data in
software. The TSR register is not loaded until the last
bit has been transmitted from the previous load. As
soon as the last bit is transmitted, the TSR register is
loaded with new data from the TXREG register (if avail-
able). Once the TXREG register transfers the data to
the TSR register (occurs in one Tcycle), the TXREG
register is empty and interrupt flag bit TXIF (PIR1<4>)
is set. This interrupt can be enabled/disabled by set-
ting/clearing enable bit TXIE (PIE1<4>). Flag bit TXIF
will be set regardless of the status of enable bit TXIE
and cannot be cleared in software. It will clear only
when new data is loaded into the TXREG register.
While flag bit TXIF indicates the status of the TXREG
register, another bit, TRMT (TXSTA<1>), shows the
status of the TSR register. Status bit TRMT is a read
only bit which is set when the TSR register is empty. No
interrupt logic is tied to this bit, so the user has to poll
this bit in order to determine if the TSR register is
empty. The TSR register is not mapped in data memory
so it is not available to the user.
Transmission is enabled by setting enable bit TXEN
(TXSTA<5>). The actual transmission will not occur
until the TXREG register has been loaded with data.
The first data bit will be shifted out on the next available
rising edge of the clock on the CK line. Data out is sta-
ble around the falling edge of the synchronous clock
(Figure 12-12). The transmission can also be started
by first loading the TXREG register and then setting
enable bit TXEN (Figure 12-13). This is advantageous
when slow baud rates are selected, since the BRG is
kept in reset when bits TXEN, CREN, and SREN are
clear. Setting enable bit TXEN will start the BRG, cre-
ating a shift clock immediately. Normally when trans-
mission is first started, the TSR register is empty, so a
transfer to the TXREG register will result in an immedi-
ate transfer to TSR resulting in an empty TXREG reg-
ister. Back-to-back transfers are possible.
Applicable Devices
61 62 62A R6263R6364 64A R646565AR656667
Clearing enable bit TXEN, during a transmission, will
cause the transmission to be aborted and will reset the
transmitter. The DT and CK pins will revert to hi-imped-
ance. If, during a transmission, either bit CREN or bit
SREN is set the transmission is aborted and the DT pin
reverts to a hi-impedance state (for a reception). The
CK pin will remain an output if bit CSRC is set (internal
clock). The transmitter logic however, is not reset
although it is disconnected from the pins. In order to
reset the transmitter, the user has to clear enable bit
TXEN. If enable bit SREN is set (to interrupt an on
going transmission and receive a single word), then
after the single word is received, enable bit SREN will
be cleared, and the serial port will revert back to trans-
mitting since enable bit TXEN is still set. The DT line
will immediately switch from hi-impedance receive
mode to transmit and start driving. To avoid this, enable
bit TXEN should be cleared.
In order to select 9-bit transmission, bit TX9
(TXSTA<6>) should be set and the ninth bit should be
written to bit TX9D (TXSTA<0>). The ninth bit must be
written before writing the 8-bit data to the TXREG reg-
ister. This is because a data write to the TXREG regis-
ter can result in an immediate transfer of the data to the
TSR register (if the TSR is empty). If the TSR register
was empty and the TXREG register was written before
writing the “new” TX9D, the “present” value of bit TX9D
is loaded.
Steps to follow when setting up a Synchronous Master
Transmission:
1. Initialize the SPBRG register for the appropriate
baud rate (Section 12.1).
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN, and CSRC.
3. If interrupts are desired, then set enable bit
TXIE.
4. If 9-bit transmission is desired, then set bit TX9.
5. Enable the transmission by setting enable bit
TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit TX9D.
7. Start transmission by loading data to the
TXREG register.
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1997-2013 Microchip Technology Inc. DS30234E-page 117
PIC16C6X
TABLE 12-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
FIGURE 12-12: SYNCHRONOUS TRANSMISSION
FIGURE 12-13: SYNCHRONOUS TRANSMISSION THROUGH TXEN
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
Resets
0Ch PIR1 PSPIF(1) (2) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN —FERR OERR RX9D 0000 -00x 0000 -00x
19h TXREG USART Transmit Register 0000 0000 0000 0000
8Ch PIE1 PSPIE(1) (2) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as '0'. Shaded cells are not used for Synchronous Master Transmission.
Note 1: PSPIE and PSPIF are reserved on the PIC16C63/R63/66, always maintain these bits clear.
2: PIE1<6> and PIR1<6> are reserved, always maintain these bits clear.
Bit 0 Bit 1 Bit 7
WORD 1
Q1Q2 Q3Q4 Q1 Q2 Q3 Q4Q1 Q2Q3 Q4Q1 Q2Q3 Q4Q1 Q2 Q3Q4 Q3Q4 Q1Q2 Q3Q4 Q1Q2 Q3Q4 Q1Q2 Q3 Q4 Q1 Q2Q3 Q4Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4
Bit 2 Bit 0 Bit 1 Bit 7
RC7/RX/DT pin
RC6/TX/CK pin
Write to
TXREG reg
TXIF bit
(Interrupt flag)
TRMT
TXEN bit '1' '1'
Note: Sync master mode; SPBRG = '0'. Continuous transmission of two 8-bit words
WORD 2
TRMT bit
Write word1 Write word2
RC7/RX/DT pin
RC6/TX/CK pin
Write to
TXREG reg
TXIF bit
TRMT bit
bit0 bit1 bit2 bit6 bit7
TXEN bit
PIC16C6X
DS30234E-page 118 1997-2013 Microchip Technology Inc.
12.3.2 USART SYNCHRONOUS MASTER
RECEPTION
Once Synchronous Mode is selected, reception is
enabled by setting either enable bit SREN (RCSTA<5>)
bit or enable bit CREN (RCSTA<4>). Data is sampled
on the DT pin on the falling edge of the clock. If enable
bit SREN is set, then only a single word is received. If
enable bit CREN is set, the reception is continuous until
bit CREN is cleared. If both the bits are set then bit
CREN takes precedence. After clocking the last bit, the
received data in the Receive Shift Register (RSR) is
transferred to the RCREG register (if it is empty). When
the transfer is complete, interrupt bit RCIF (PIR1<5>) is
set. The actual interrupt can be enabled/disabled by
setting/clearing enable bit RCIE (PIE1<5>). Flag bit
RCIF is a read only bit which is reset by the hardware.
In this case, it is reset when the RCREG register has
been read and is empty. The RCREG is a double buff-
ered register, i.e., it is a two deep FIFO. It is possible for
two bytes of data to be received and transferred to the
RCREG FIFO and a third byte to begin shifting into the
RSR register. On the clocking of the last bit of the third
byte, if the RCREG register is still full, then overrun
error bit, OERR (RCSTA<1>) is set. The word in the
RSR register will be lost. The RCREG register can be
read twice to retrieve the two bytes in the FIFO. Over-
run error bit OERR has to be cleared in software (by
clearing bit CREN). If bit OERR is set, transfers from
the RSR to the RCREG are inhibited, so it is essential
to clear bit OERR if it is set. The 9th receive bit is buff-
ered the same way as the receive data. Reading the
RCREG register will load bit RX9D with a new value.
Therefore it is essential for the user to read the RCSTA
register before reading the RCREG register in order not
to lose the old RX9D bit information.
Steps to follow when setting up Synchronous Master
Reception:
1. Initialize the SPBRG register for the appropriate
baud rate (Section 12.1).
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN, and CSRC.
3. Ensure bits CREN and SREN are clear.
4. If interrupts are desired, then set enable bit
RCIE.
5. If 9-bit reception is desired, then set bit RX9.
6. If a single reception is required, set enable bit
SREN. For continuous reception set enable bit
CREN.
7. Flag bit RCIF will be set when reception is com-
plete and an interrupt will be generated if enable
bit RCIE was set.
8. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
9. Read the 8-bit received data by reading the
RCREG register.
10. If any error occurred, clear the error by clearing
enable bit CREN.
TABLE 12-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
Resets
0Ch PIR1 PSPIF(1) (2) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN — FERR OERR RX9D 0000 -00x 0000 -00x
1Ah RCREG USART Receive Register 0000 0000 0000 0000
8Ch PIE1 PSPIE(1) (2) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC —BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as '0'. Shaded cells are not used for Synchronous Master Reception.
Note 1: PSPIF and PSPIE are reserved on the PIC16C63/R63/66, always maintain these bits clear.
2: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
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1997-2013 Microchip Technology Inc. DS30234E-page 119
PIC16C6X
FIGURE 12-14: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
CREN bit
RC7/RX/DT pin
RC6/TX/CK pin
Write to
bit SREN
SREN bit
RCIF bit
(interrupt)
Read
RXREG
Note: Timing diagram demonstrates SYNC master mode with bit SREN = '1' and bit BRG = '0'.
Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q2 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
'0'
bit0 bit1 bit2 bit3 bit4 bit5 bit6 bit7
'0'
Q1 Q2 Q3 Q4
USART Synchronous Slave Mode
"E 6 63M SA-EI
PIC16C6X
DS30234E-page 120 1997-2013 Microchip Technology Inc.
12.4 USART Synchronous Slave Mode
Synchronous Slave Mode differs from Master Mode in
the fact that the shift clock is supplied externally at the
CK pin (instead of being supplied internally in master
mode). This allows the device to transfer or receive
data while in SLEEP mode. Slave mode is entered by
clearing bit CSRC (TXSTA<7>).
12.4.1 USART SYNCHRONOUS SLAVE
TRANSMIT
The operation of the synchronous master and slave
modes are identical except in the case of the SLEEP
mode.
If two words are written to the TXREG and then the
SLEEP instruction is executed, the following will occur:
a) The first word will immediately transfer to the
TSR register and transmit.
b) The second word will remain in TXREG register.
c) Flag bit TXIF will not be set.
d) When the first word has been shifted out of TSR,
the TXREG register will transfer the second
word to the TSR and flag bit TXIF will now be
set.
e) If enable bit TXIE is set, the interrupt will wake
the chip from SLEEP and if the global interrupt
is enabled, the program will branch to the inter-
rupt vector (0004h).
Steps to follow when setting up Synchronous Slave
Transmission:
1. Enable the synchronous slave serial port by set-
ting bits SYNC and SPEN, and clearing bit
CSRC.
2. Clear bits CREN and SREN.
3. If interrupts are desired, then set enable bit
TXIE.
4. If 9-bit transmission is desired, then set bit TX9.
5. Enable the transmission by setting bit TXEN.
6. If 9-bit transmission is selected, the ninth bit
should be loaded in bit TX9D.
7. Start transmission by loading data to the
TXREG register.
Applicable Devices
61 62 62A R6263R6364 64A R646565AR656667
12.4.2 USART SYNCHRONOUS SLAVE
RECEPTION
The operation of the synchronous master and slave
modes is identical except in the case of the SLEEP
mode. Also, enable bit SREN is a don't care in slave
mode.
If receive is enabled by setting bit CREN prior to the
SLEEP instruction, then a word may be received during
SLEEP. On completely receiving the word, the RSR
register will transfer the data to the RCREG register
and if enable bit RCIE is set, the interrupt generated will
wake the chip from SLEEP. If the global interrupt is
enabled, the program will branch to the interrupt vector
(0004h).
Steps to follow when setting up a Synchronous Slave
Reception:
1. Enable the synchronous master serial port by
setting bits SYNC and SPEN, and clearing bit
CSRC.
2. If interrupts are desired, then set enable bit
RCIE.
3. If 9-bit reception is desired, then set bit RX9.
4. To enable reception, set enable bit CREN.
5. Flag bit RCIF will be set when reception is com-
plete, and an interrupt will be generated if
enable bit RCIE was set.
6. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
7. Read the 8-bit received data by reading the
RCREG register.
8. If any error occurred, clear the error by clearing
enable bit CREN.
1997-2013 Microchip Technology Inc. DS30234E-page 121
PIC16C6X
TABLE 12-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
TABLE 12-11: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
Resets
0Ch PIR1 PSPIF(1) (2) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN —FERR OERR RX9D 0000 -00x 0000 -00x
19h TXREG USART Transmit Register 0000 0000 0000 0000
8Ch PIE1 PSPIE(1) (2) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as '0'. Shaded cells are not used for Synchronous Slave Transmission.
Note 1: PSPIF and PSPIE are reserved on the PIC16C63/R63/66, always maintain these bits clear.
2: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR,
BOR
Value on
all other
Resets
0Ch PIR1 PSPIF(1) (2) RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN —FERR OERR RX9D 0000 -00x 0000 -00x
1Ah RCREG USART Receive Register 0000 0000 0000 0000
8Ch PIE1 PSPIE(1) (2) RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC —BRGH TRMT TX9D 0000 -010 0000 -010
99h SPBRG Baud Rate Generator Register 0000 0000 0000 0000
Legend: x = unknown, - = unimplemented locations read as '0'. Shaded cells are not used for Synchronous Slave Reception.
Note 1: PSPIF and PSPIE are reserved on the PIC16C63/R63/66, always maintain these bits clear.
2: PIR1<6> and PIE1<6> are reserved, always maintain these bits clear.
PIC16C6X
DS30234E-page 122 1997-2013 Microchip Technology Inc.
NOTES:
Configuration Bits
1997-2013 Microchip Technology Inc. DS30234E-page 123
PIC16C6X
13.0 SPECIAL FEATURES OF THE
CPU
What sets a microcontroller apart from other proces-
sors are special circuits to deal with the needs of real-
time applications. The PIC16CXX family has a host of
such features intended to maximize system reliability,
minimize cost through elimination of external compo-
nents, provide power saving operating modes and offer
code protection. These are:
• Oscillator selection
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
• Interrupts
• Watchdog Timer (WDT)
• SLEEP mode
• Code protection
• ID locations
• In-circuit serial programming
The PIC16CXX has a Watchdog Timer which can be
shut off only through configuration bits. It runs off its
own RC oscillator for added reliability. There are two
timers that offer necessary delays on power-up. One is
the Oscillator Start-up Timer (OST), intended to keep
the chip in RESET until the crystal oscillator is stable.
The other is the Power-up Timer (PWRT), which pro-
vides a fixed delay of 72 ms (nominal) on power-up
only, designed to keep the part in reset while the power
supply stabilizes. With these two timers on-chip, most
applications need no external reset circuitry.
SLEEP mode is designed to offer a very low current
power-down mode. The user can wake from SLEEP
through external reset, Watchdog Timer Wake-up or
through an interrupt. Several oscillator options are also
made available to allow the part to fit the application.
The RC oscillator option saves system cost while the
LP crystal option saves power. A set of configuration
bits are used to select various options.
13.1 Configuration Bits
The configuration bits can be programmed (read as '0')
or left unprogrammed (read as '1') to select various
device configurations. These bits are mapped in pro-
gram memory location 2007h.
The user will note that address 2007h is beyond the
user program memory space. In fact, it belongs to the
special test/configuration memory space (2000h -
3FFFh), which can be accessed only during program-
ming.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 13-1: CONFIGURATION WORD FOR PIC16C61
— — — — — — — — — CP0 PWRTE WDTE FOSC1 FOSC0 Register: CONFIG
Address 2007h
bit13 bit0
bit 13-5: Unimplemented: Read as '1'
bit 4: CP0: Code protection bit
1 = Code protection off
0 = All memory is code protected, but 00h - 3Fh is writable
bit 3: PWRTE: Power-up Timer Enable bit
1 = Power-up Timer enabled
0 = Power-up Timer disabled
bit 2: WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator Selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
PIC16C6X
DS30234E-page 124 1997-2013 Microchip Technology Inc.
FIGURE 13-2: CONFIGURATION WORD FOR PIC16C62/64/65
FIGURE 13-3: CONFIGURATION WORD FOR PIC16C62A/R62/63/R63/64A/R64/65A/R65/66/67
———————— CP1 CP0 PWRTE WDTE FOSC1 FOSC0 Register: CONFIG
Address 2007h
bit13 bit0
bit 13-6: Unimplemented: Read as '1'
bit 5-4: CP1:CP0: Code Protection bits
11 = Code protection off
10 = Upper half of program memory code protected
01 = Upper 3/4th of program memory code protected
00 = All memory is code protected
bit 3: PWRTE: Power-up Timer Enable bit
1 = Power-up Timer enabled
0 = Power-up Timer disabled
bit 2: WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator Selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
CP1 CP0 CP1 CP0 CP1 CP0 — BODEN CP1 CP0 PWRTE WDTE FOSC1 FOSC0 Register: CONFIG
Address 2007h
bit13 bit0
bit 13-8: CP1:CP0: Code Protection bits(2)
bit 5:4 11 = Code protection off
10 = Upper half of program memory code protected
01 = Upper 3/4th of program memory code protected
00 = All memory is code protected
bit 7: Unimplemented: Read as '1'
bit 6: BODEN: Brown-out Reset Enable bit (1)
1 = Brown-out Reset enabled
0 = Brown-out Reset disabled
bit 3: PWRTE: Power-up Timer Enable bit (1)
1 = Power-up Timer disabled
0 = Power-up Timer enabled
bit 2: WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 1-0: FOSC1:FOSC0: Oscillator Selection bits
11 = RC oscillator
10 = HS oscillator
01 = XT oscillator
00 = LP oscillator
Note 1: Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE.
Ensure the Power-up Timer is enabled anytime Brown-out Reset is enabled.
2: All of the CP1:CP0 pairs have to be given the same value to implement the code protection scheme listed.
Oscillator Configurations
A Name Devices
m. 2A 5 53 sal-m- 5A
IE5 57
1997-2013 Microchip Technology Inc. DS30234E-page 125
PIC16C6X
13.2 Oscillator Configurations
13.2.1 OSCILLATOR TYPES
The PIC16CXX can be operated in four different oscil-
lator modes. The user can program two configuration
bits (FOSC1 and FOSC0) to select one of these four
modes:
• LP Low Power Crystal
• XT Crystal/Resonator
• HS High Speed Crystal/Resonator
• RC Resistor/Capacitor
13.2.2 CRYSTAL OSCILLATOR/CERAMIC
RESONATORS
In LP, XT, or HS modes a crystal or ceramic resonator
is connected to the OSC1/CLKIN and OSC2/CLKOUT
pins to establish oscillation (Figure 13-4). The
PIC16CXX oscillator design requires the use of a par-
allel cut crystal. Use of a series cut crystal may give a
frequency out of the crystal manufacturers specifica-
tions. When in LP, XT, or HS modes, the device can
have an external clock source to drive the OSC1/
CLKIN pin (Figure 13-5).
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 13-4: CRYSTAL/CERAMIC
RESONATOR OPERATION
(HS, XT OR LP OSC
CONFIGURATION)
FIGURE 13-5: EXTERNAL CLOCK INPUT
OPERATION (HS, XT OR LP
OSC CONFIGURATION)
C1
C2
XTAL
OSC2
Note1
OSC1
RFSLEEP
To i nt e r n al
logic
PIC16CXX
RS
See Table 13-1, Table 13-3, Table 13-2 and Table 13-4 for
recommended values of C1 and C2.
Note 1: A series resistor may be required for AT strip
cut crystals.
2: For the PIC16C61 the buffer is on the OSC2
pin, all other devices have the buffer on the
OSC1 pin.
(2)
(2)
To i nt e r n al
logic
OSC1
OSC2
Open
Clock from
ext. system PIC16CXX
PIC16C6X
DS30234E-page 126 1997-2013 Microchip Technology Inc.
TABLE 13-1: CERAMIC RESONATORS
PIC16C61
TABLE 13-2: CERAMIC RESONATORS
PIC16C62/62A/R62/63/R63/64/
64A/R64/65/65A/R65/66/67
Ranges Tested:
Mode Freq OSC1 OSC2
XT 455 kHz
2.0 MHz
4.0 MHz
47 - 100 pF
15 - 68 pF
15 - 68 pF
47 - 100 pF
15 - 68 pF
15 - 68 pF
HS 8.0 MHz
16.0 MHz
15 - 68 pF
10 - 47 pF
15 - 68 pF
10 - 47 pF
These values are for design guidance only. See
notes at bottom of page.
Resonators Used:
455 kHz Panasonic EFO-A455K04B 0.3%
2.0 MHz Murata Erie CSA2.00MG 0.5%
4.0 MHz Murata Erie CSA4.00MG 0.5%
8.0 MHz Murata Erie CSA8.00MT 0.5%
16.0 MHz Murata Erie CSA16.00MX 0.5%
All resonators used did not have built-in capacitors.
Ranges Tested:
Mode Freq OSC1 OSC2
XT 455 kHz
2.0 MHz
4.0 MHz
68 - 100 pF
15 - 68 pF
15 - 68 pF
68 - 100 pF
15 - 68 pF
15 - 68 pF
HS 8.0 MHz
16.0 MHz
10 - 68 pF
10 - 22 pF
10 - 68 pF
10 - 22 pF
These values are for design guidance only. See
notes at bottom of page.
Resonators Used:
455 kHz Panasonic EFO-A455K04B 0.3%
2.0 MHz Murata Erie CSA2.00MG 0.5%
4.0 MHz Murata Erie CSA4.00MG 0.5%
8.0 MHz Murata Erie CSA8.00MT 0.5%
16.0 MHz Murata Erie CSA16.00MX 0.5%
All resonators used did not have built-in capacitors.
TABLE 13-3: CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR FOR
PIC16C61
TABLE 13-4: CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR FOR
PIC16C62/62A/R62/63/R63/64/
64A/R64/65/65A/R65/66/67
Mode Freq OSC1 OSC2
LP 32 kHz
200 kHz
33 - 68 pF
15 - 47 pF
33 - 68 pF
15 - 47 pF
XT 100 kHz
500 kHz
1 MHz
2 MHz
4 MHz
47 - 100 pF
20 - 68 pF
15 - 68 pF
15 - 47 pF
15 - 33 pF
47 - 100 pF
20 - 68 pF
15 - 68 pF
15 - 47 pF
15 - 33 pF
HS 8 MHz
20 MHz
15 - 47 pF
15 - 47 pF
15 - 47 pF
15 - 47 pF
These values are for design guidance only. See
notes at bottom of page.
Osc Type Crystal
Freq
Cap. Range
C1
Cap.
Range
C2
LP 32 kHz 33 pF 33 pF
200 kHz 15 pF 15 pF
XT 200 kHz 47-68 pF 47-68 pF
1 MHz 15 pF 15 pF
4 MHz 15 pF 15 pF
HS 4 MHz 15 pF 15 pF
8 MHz 15-33 pF 15-33 pF
20 MHz 15-33 pF 15-33 pF
These values are for design guidance only. See
notes at bottom of page.
Crystals Used
32 kHz Epson C-001R32.768K-A ± 20 PPM
200 kHz STD XTL 200.000KHz ± 20 PPM
1 MHz ECS ECS-10-13-1 ± 50 PPM
4 MHz ECS ECS-40-20-1 ± 50 PPM
8 MHz EPSON CA-301 8.000M-C ± 30 PPM
20 MHz EPSON CA-301 20.000M-C ± 30 PPM
Note 1: Recommended values of C1 and C2 are identical to the ranges tested Table 13-1 and Table 13-2.
2: Higher capacitance increases the stability of oscillator but also increases the start-up time.
3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal man-
ufacturer for appropriate values of external components.
4: Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level speci-
fication.
1997-2013 Microchip Technology Inc. DS30234E-page 127
PIC16C6X
13.2.3 EXTERNAL CRYSTAL OSCILLATOR
CIRCUIT
Either a prepackaged oscillator can be used or a simple
oscillator circuit with TTL gates can be built. Prepack-
aged oscillators provide a wide operating range and
better stability. A well-designed crystal oscillator will
provide good performance with TTL gates. Two types of
crystal oscillator circuits can be used; one with series
resonance, or one with parallel resonance.
Figure 13-6 shows implementation of a parallel reso-
nant oscillator circuit. The circuit is designed to use the
fundamental frequency of the crystal. The 74AS04
inverter performs the 180-degree phase shift that a par-
allel oscillator requires. The 4.7 k resistor provides
the negative feedback for stability. The 10 k potenti-
ometer biases the 74AS04 in the linear region. This
could be used for external oscillator designs.
FIGURE 13-6: EXTERNAL PARALLEL
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
Figure 13-7 shows a series resonant oscillator circuit.
This circuit is also designed to use the fundamental fre-
quency of the crystal. The inverter performs a 180-
degree phase shift in a series resonant oscillator cir-
cuit. The 330 k resistors provide the negative feed-
back to bias the inverters in their linear region.
FIGURE 13-7: EXTERNAL SERIES
RESONANT CRYSTAL
OSCILLATOR CIRCUIT
20 pF
+5V
20 pF
10k
4.7k
10k
74AS04
XTAL
10k
74AS04 PIC16CXX
CLKIN
To O the r
Devices
330 k
74AS04 74AS04 PIC16CXX
CLKIN
To O the r
Devices
XTAL
330 k
74AS04
0.1F
13.2.4 RC OSCILLATOR
For timing insensitive applications the RC device option
offers additional cost savings. The RC oscillator fre-
quency is a function of the supply voltage, the resistor
(Rext) and capacitor (Cext) values, and the operating
temperature. In addition to this, the oscillator frequency
will vary from unit to unit due to normal process param-
eter variation. Furthermore, the difference in lead frame
capacitance between package types will also affect the
oscillation frequency, especially for low Cext values.
The user also needs to take into account variation due
to tolerance of external R and C components used.
Figure 13-8 shows how the RC combination is con-
nected to the PIC16CXX. For Rext values below
2.2 k, the oscillator operation may become unstable
or stop completely. For very high Rext values (e.g.
1M), the oscillator becomes sensitive to noise,
humidity and leakage. Thus, we recommend keeping
Rext between 3 k and 100 k.
Although the oscillator will operate with no external
capacitor (Cext = 0 pF), we recommend using values
above 20 pF for noise and stability reasons. With no or
small external capacitance, the oscillation frequency
can vary dramatically due to changes in external
capacitances, such as PCB trace capacitance or pack-
age lead frame capacitance.
See characterization data for desired device for RC fre-
quency variation from part to part due to normal pro-
cess variation. The variation is larger for larger R (since
leakage current variation will affect RC frequency more
for large R) and for smaller C (since variation of input
capacitance will affect RC frequency more).
See characterization data for desired device for varia-
tion of oscillator frequency due to VDD for given Rext/
Cext values as well as frequency variation due to oper-
ating temperature for given R, C, and VDD values.
The oscillator frequency, divided by 4, is available on
the OSC2/CLKOUT pin, and can be used for test pur-
poses or to synchronize other logic (see Figure 3-5 for
waveform).
FIGURE 13-8: RC OSCILLATOR MODE
OSC2/CLKOUT
Cext
VDD
Rext
VSS
PIC16CXX
OSC1
Fosc/4
Internal
clock
Reset
PIC16C6X
DS30234E-page 128 1997-2013 Microchip Technology Inc.
13.3 Reset
The PIC16CXX differentiates between various kinds of
reset:
• Power-on Reset (POR)
•M
CLR reset during normal operation
•MCLR
reset during SLEEP
• WDT Reset (normal operation)
• Brown-out Reset (BOR) - Not on PIC16C61/62/
64/65
Some registers are not affected in any reset condition,
their status is unknown on POR and unchanged in any
other reset. Most other registers are reset to a “reset
state” on Power-on Reset (POR), on MCLR or WDT
Reset, on MCLR reset during SLEEP, and on Brown-
out Reset (BOR). They are not affected by a WDT
Wake-up, which is viewed as the resumption of normal
operation.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
The TO and PD bits are set or cleared differently in dif-
ferent reset situations as indicated in Table 13-7,
Table 13-8, and Table 13-9. These bits are used in soft-
ware to determine the nature of the reset. See
Table 13-12 for a full description of reset states of all
registers.
A simplified block diagram of the on-chip reset circuit is
shown in Figure 13-9.
On the PIC16C62A/R62/63/R63/64A/R64/65A/R65/
66/67, the MCLR reset path has a noise filter to detect
and ignore small pulses. See parameter #34 for pulse
width specifications.
It should be noted that a WDT Reset does not drive the
MCLR pin low.
FIGURE 13-9: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
RQ
External Reset
MCLR/VPP pin
VDD pin
OSC1/
WDT
Module
VDD rise
detect
OST/PWRT
On-chip
RC OSC
WDT
Power-on Reset
OST
10-bit Ripple counter
PWRT
Chip Reset
10-bit Ripple counter
Time-out
Enable OST
Enable PWRT
SLEEP
Brown-out
Reset BODEN
Note 1: This is a separate oscillator from the RC oscillator of the CLKIN pin.
2: Brown-out Reset is NOT implemented on the PIC16C61/62/64/65.
3: See Table 13-5 and Table 13-6 for time-out situations.
(2)
(1)
CLKIN
pin
(3)
Power-on Reset POR Power-Hg
Timer PWRT Oscillator Start-up
Timer DST and Brown-out Resel
BOR
ah De s
all-- mm
A..
1997-2013 Microchip Technology Inc. DS30234E-page 129
PIC16C6X
13.4 Power-on Reset (POR), Power-up
Timer (PWRT), Oscillator Start-up
Timer (OST) and Brown-out Reset
(BOR)
13.4.1 POWER-ON RESET (POR)
A Power-on Reset pulse is generated on-chip when
VDD rise is detected (in the range of 1.5V - 2.1V). To
take advantage of the POR, just tie the MCLR/VPP pin
directly (or through a resistor) to VDD. This will elimi-
nate external RC components usually needed to create
a Power-on Reset. A maximum rise time for VDD is
required. See Electrical Specifications for details.
When the device starts normal operation (exits the
reset condition), device operating parameters (voltage,
frequency, temperature, ...) must be met to ensure
operation. If these conditions are not met, the device
must be held in reset until the operating conditions are
met. Brown-out Reset may be used to meet the startup
conditions.
For additional information, refer to Application Note
AN607, “
Power-up Trouble Shooting
.”
13.4.2 POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 72 ms nominal
time-out on power-up only, from POR. The Power-up
Timer operates on an internal RC oscillator. The chip is
kept in reset as long as PWRT is active. The PWRT’s
time delay allows VDD to rise to an acceptable level. A
configuration bit is provided to enable/disable the
PWRT.
The power-up time delay will vary from chip to chip due
to VDD, temperature, and process variation. See DC
parameters for details.
13.4.3 OSCILLATOR START-UP TIMER (OST)
The Oscillator Start-up Timer (OST) provides 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is over. This ensures the crystal oscillator
or resonator has started and stabilized.
The OST time-out is invoked only for XT, LP and HS
modes and only on Power-on Reset or wake-up from
SLEEP.
13.4.4 BROWN-OUT RESET (BOR)
A configuration bit, BODEN, can disable (if clear/pro-
grammed) or enable (if set) the Brown-out Reset cir-
cuitry. If VDD falls below 4.0V (parameter D005 in
Electrical Specification section) for greater than param-
eter #34 (see Electrical Specification section), the
brown-out situation will reset the chip. A reset may not
occur if VDD falls below 4.0V for less than parameter
#34. The chip will remain in Brown-out Reset until VDD
rises above BVDD. The Power-up Timer will now be
invoked and will keep the chip in RESET an additional
72 ms. If VDD drops below BVDD while the Power-up
Timer is running, the chip will go back into a Brown-out
Reset and the Power-up Timer will be initialized. Once
VDD rises above BVDD, the Power-up Timer will exe-
cute a 72 ms time delay. The Power-up Timer should
always be enabled when Brown-out Reset is enabled.
Figure 13-10 shows typical brown-out situations.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 13-10: BROWN-OUT SITUATIONS
72 ms
BVDD Max.
BVDD Min.
VDD
Internal
Reset
BVDD Max.
BVDD Min.
VDD
Internal
Reset 72 ms
<72 ms
72 ms
BVDD Max.
BVDD Min.
VDD
Internal
Reset
PWHTE = I
Axum-came Davlces
m ‘62‘BZA‘RBZ‘BS‘RBS‘EA‘EAA‘REA‘BS‘SSA‘HSS‘EB‘E?
PIC16C6X
DS30234E-page 130 1997-2013 Microchip Technology Inc.
13.4.5 TIME-OUT SEQUENCE
On power-up the time-out sequence is as follows: First
a PWRT time-out is invoked after the POR time delay
has expired. Then OST is activated. The total time-out
will vary based on oscillator configuration and the sta-
tus of the PWRT. For example, in RC mode, with the
PWRT disabled, there will be no time-out at all.
Figure 13-11, Figure 13-12, and Figure 13-13 depict
time-out sequences on power-up.
Since the time-outs occur from the POR pulse, if the
MCLR/VPP pin is kept low long enough, the time-outs
will expire. Then bringing the MCLR/VPP pin high will
begin execution immediately (Figure 13-14). This is
useful for testing purposes or to synchronize more than
one PIC16CXX device operating in parallel.
Table 13-10 and Table 13-11 show the reset conditions
for some special function registers, while Table 13-12
shows the reset conditions for all the registers.
13.4.6 POWER CONTROL/STATUS REGISTER
(PCON)
The Power Control/Status Register, PCON has up to
two bits, depending upon the device. Bit0 is not imple-
mented on the PIC16C62/64/65.
Bit0 is BOR (Brown-out Reset Status bit). BOR is
unknown on Power-on Reset. It must then be set by the
user and checked on subsequent resets to see if BOR
cleared, indicating that a brown-out has occurred. The
BOR status bit is a “Don’t Care” and is not necessarily
predictable if the Brown-out Reset circuitry is disabled
(by clearing bit BODEN in the Configuration Word).
Bit1 is POR (Power-on Reset Status bit). It is cleared on
a Power-on Reset and unaffected otherwise. The user
must set this bit following a Power-on Reset.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
TABLE 13-5: TIME-OUT IN VARIOUS SITUATIONS, PIC16C61/62/64/65
TABLE 13-6: TIME-OUT IN VARIOUS SITUATIONS,
PIC16C62A/R62/63/R63/64A/R64/65A/R65/66/67
TABLE 13-7: STATUS BITS AND THEIR SIGNIFICANCE, PIC16C61
TABLE 13-8: STATUS BITS AND THEIR SIGNIFICANCE, PIC16C62/64/65
Oscillator Configuration Power-up Wake-up from SLEEP
PWRTE = 1 PWRTE = 0
XT, HS, LP 72 ms + 1024T
OSC 1024TOSC 1024 TOSC
RC 72 ms — —
Oscillator Configuration Power-up Brown-out Wake up from
SLEEP
PWRTE = 0 PWRTE = 1
XT, HS, LP 72 ms + 1024T
OSC 1024TOSC 72 ms + 1024TOSC 1024 TOSC
RC 72 ms — 72 ms —
TO PD
11Power-on Reset or MCLR reset during normal operation
01WDT Reset
00WDT Wake-up
10MCLR reset during SLEEP or interrupt wake-up from SLEEP
POR TO PD
011Power-on Reset
00xIllegal, TO is set on a Power-on Reset
0x0Illegal, PD is set on a Power-on Reset
101WDT Reset
100WDT Wake-up
1uuMCLR reset during normal operation
110MCLR reset during SLEEP or interrupt wake-up from SLEEP
Legend: x = unknown, u = unchanged
1997-2013 Microchip Technology Inc. DS30234E-page 131
PIC16C6X
TABLE 13-9: STATUS BITS AND THEIR SIGNIFICANCE FOR
PIC16C62A/R62/63/R63/64A/R64/65A/R65/66/67
TABLE 13-10: RESET CONDITION FOR SPECIAL REGISTERS ON PIC16C61/62/64/65
TABLE 13-11: RESET CONDITION FOR SPECIAL REGISTERS ON
PIC16C62A/R62/63/R63/64A/R64/65A/R65/66/67
POR BOR TO PD
0x11Power-on Reset
0x0xIllegal, TO is set on a Power-on Reset
0xx0Illegal, PD is set on a Power-on Reset
10xxBrown-out Reset
1101WDT Reset
1100WDT Wake-up
11uuMCLR reset during normal operation
1110MCLR reset during SLEEP or interrupt wake-up from SLEEP
Legend: x = unknown, u = unchanged
Program Counter STATUS PCON(2)
Power-on Reset 000h 0001 1xxx ---- --0-
MCLR reset during normal operation 000h 000u uuuu ---- --u-
MCLR reset during SLEEP 000h 0001 0uuu ---- --u-
WDT Reset 000h 0000 1uuu ---- --u-
WDT Wake-up PC + 1 uuu0 0uuu ---- --u-
Interrupt wake-up from SLEEP PC + 1(1) uuu1 0uuu ---- --u-
Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0'.
Note 1: When the wake-up is due to an interrupt and the global enable bit, GIE is set, the PC is loaded with the inter-
rupt vector (0004h) after execution of PC+1.
2: The PCON register is not implemented on the PIC16C61.
Program Counter STATUS PCON
Power-on Reset 000h 0001 1xxx ---- --0x
MCLR reset during normal operation 000h 000u uuuu ---- --uu
MCLR reset during SLEEP 000h 0001 0uuu ---- --uu
WDT Reset 000h 0000 1uuu ---- --uu
Brown-out Reset 000h 0001 1uuu ---- --u0
WDT Wake-up PC + 1 uuu0 0uuu ---- --uu
Interrupt wake-up from SLEEP PC + 1(1) uuu1 0uuu ---- --uu
Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0'.
Note 1: When the wake-up is due to an interrupt and global enable bit, GIE is set, the PC is loaded with the interrupt
vector (0004h) after execution of PC+1.
PIC16C6X
DS30234E-page 132 1997-2013 Microchip Technology Inc.
TABLE 13-12: INITIALIZATION CONDITIONS FOR ALL REGISTERS
Register Applicable Devices Power-on Reset
Brown-out
Reset
MCLR Reset during:
– normal operation
– SLEEP
WDT Reset
Wake-up via
interrupt or
WDT Wake-up
W 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
INDF 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 N/A N/A N/A
TMR0 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
PCL 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 0000h 0000h PC + 1(2)
STATUS 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 0001 1xxx 000q quuu(3) uuuq quuu(3)
FSR 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
PORTA 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 ---x xxxx ---u uuuu ---u uuuu
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 --xx xxxx --uu uuuu --uu uuuu
PORTB 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
PORTC 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
PORTD 61 62 62A R62 63 R636464AR646565AR6566 67 xxxx xxxx uuuu uuuu uuuu uuuu
PORTE 61 62 62A R62 63 R636464AR646565AR6566 67 ---- -xxx ---- -uuu ---- -uuu
PCLATH 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 ---0 0000 ---0 0000 ---u uuuu
INTCON 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 0000 000x 0000 000u uuuu uuuu(1)
PIR1 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 00-- 0000 00-- 0000 uu-- uuuu(1)
61 62 62A R62 63 R63 64 64A R646565AR656667 0000 0000 0000 0000 uuuu uuuu(1)
PIR2 61 62 62A R62 63 R63 64 64A R646565AR656667 ---- ---0 ---- ---0 ---- ---u(2)
TMR1L 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 --00 0000 --uu uuuu --uu uuuu
TMR2 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 0000 0000 0000 0000 uuuu uuuu
T2CON 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 -000 0000 -000 0000 -uuu uuuu
SSPBUF 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
SSPCON 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 0000 0000 0000 0000 uuuu uuuu
CCPR1L 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 --00 0000 --00 0000 --uu uuuu
RCSTA 61 62 62A R62 63 R63 64 64A R646565AR656667 0000 -00x 0000 -00x uuuu -uuu
TXREG 61 62 62A R62 63 R63 64 64A R646565AR656667 0000 0000 0000 0000 uuuu uuuu
RCREG 61 62 62A R62 63 R63 64 64A R646565AR656667 0000 0000 0000 0000 uuuu uuuu
CCPR2L 61 62 62A R62 63 R63 64 64A R646565AR656667 xxxx xxxx uuuu uuuu uuuu uuuu
CCPR2H 61 62 62A R62 63 R63 64 64A R646565AR656667 xxxx xxxx uuuu uuuu uuuu uuuu
CCP2CON 61 62 62A R62 63 R63 64 64A R646565AR656667 0000 0000 0000 0000 uuuu uuuu
OPTION 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 1111 1111 1111 1111 uuuu uuuu
TRISA 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 ---1 1111 ---1 1111 ---u uuuu
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 --11 1111 --11 1111 --uu uuuu
TRISB 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 1111 1111 1111 1111 uuuu uuuu
TRISC 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 1111 1111 1111 1111 uuuu uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0', q = value depends on condition.
Note 1: One or more bits in INTCON, PIR1 and/or PIR2 will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the global enable bit, GIE is set, the PC is loaded with the interrupt vector (0004h)
after execution of PC + 1.
3: See Table 13-10 and Table 13-11 for reset value for specific conditions.
1997-2013 Microchip Technology Inc. DS30234E-page 133
PIC16C6X
TRISD 61 62 62A R62 63 R636464AR646565AR6566 67 1111 1111 1111 1111 uuuu uuuu
TRISE 61 62 62A R62 63 R636464AR646565AR6566 67 0000 -111 0000 -111 uuuu -uuu
PIE1 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 00-- 0000 00-- 0000 uu-- uuuu
61 62 62A R62 63 R63 64 64A R646565AR656667 0000 0000 0000 0000 uuuu uuuu
PIE2 61 62 62A R62 63 R63 64 64A R646565AR656667 ---- ---0 ---- ---0 ---- ---u
PCON 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 ---- --0u ---- --uu ---- --uu
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 ---- --0- ---- --u- ---- --u-
PR2 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 1111 1111 1111 1111 1111 1111
SSPADD 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 0000 0000 0000 0000 uuuu uuuu
SSPSTAT 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67 --00 0000 --00 0000 --uu uuuu
TXSTA 61 62 62A R62 63 R63 64 64A R646565AR656667 0000 -010 0000 -010 uuuu -uuu
SPBRG 61 62 62A R62 63 R63 64 64A R646565AR656667 0000 0000 0000 0000 uuuu uuuu
TABLE 13-12: INITIALIZATION CONDITIONS FOR ALL REGISTERS (Cont.’d)
Register Applicable Devices Power-on Reset
Brown-out
Reset
MCLR Reset during:
– normal operation
– SLEEP
WDT Reset
Wake-up via
interrupt or
WDT Wake-up
Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0', q = value depends on condition.
Note 1: One or more bits in INTCON, PIR1 and/or PIR2 will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the global enable bit, GIE is set, the PC is loaded with the interrupt vector (0004h)
after execution of PC + 1.
3: See Table 13-10 and Table 13-11 for reset value for specific conditions.
PIC16C6X
DS30234E-page 134 1997-2013 Microchip Technology Inc.
FIGURE 13-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
FIGURE 13-12: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
FIGURE 13-13: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
TPWRT
TOST
TPWRT
TOST
VDD
MCLR
INTERNAL POR
PWRT TIME-OUT
OST TIME-OUT
INTERNAL RESET
1997-2013 Microchip Technology Inc. DS30234E-page 135
PIC16C6X
FIGURE 13-14: EXTERNAL POWER-ON
RESET CIRCUIT (FOR SLOW
VDD POWER-UP)
Note 1: External Power-on Reset circuit is required
only if VDD power-up slope is too slow. The
diode D helps discharge the capacitor
quickly when VDD powers down.
2: R < 40 k is recommended to make sure
that voltage drop across R does not violate
the devices electrical specifications.
3: R1 = 100 to 1 k will limit any current
flowing into MCLR from external capacitor
C in the event of MCLR/VPP pin break-
down due to Electrostatic Discharge
(ESD) or Electrostatic Overstress (EOS).
C
R1
R
D
VDD
MCLR
PIC16CXX
FIGURE 13-15: EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 1
FIGURE 13-16: EXTERNAL BROWN-OUT
PROTECTION CIRCUIT 2
Note 1: This circuit will activate reset when VDD
goes below (Vz + 0.7V) where Vz = Zener
voltage.
2: Internal brown-out detection on the
PIC16C62A/R62/63/R63/64A/R64/65A/
R65/66/67 should be disabled when using
this circuit.
3: Resistors should be adjusted for the
characteristics of the transistors.
VDD
33k
10k
40k
VDD
MCLR
PIC16CXX
Note 1: This brown-out circuit is less expensive,
albeit less accurate. Transistor Q1 turns
off when VDD is below a certain level such
that:
2: Internal brown-out detection on the
PIC16C62A/R62/63/R63/64A/R64/65A/
R65/66/67 should be disabled when using
this circuit.
3: Resistors should be adjusted for the
characteristics of the transistors.
VDD • R1
R1 + R2 = 0.7V
VDD
R2 40k
VDD
MCLR
PIC16CXX
R1
Q1
Interrupts
A cahleDev es
5‘ 52 62A F152 53 H63 54 64A H54 55 55A R55 as 57
PIC16C6X
DS30234E-page 136 1997-2013 Microchip Technology Inc.
13.5 Interrupts
The PIC16C6X family has up to 11 sources of interrupt.
The interrupt control register (INTCON) records individ-
ual interrupt requests in flag bits. It also has individual
and global interrupt enable bits.
Global interrupt enable bit, GIE (INTCON<7>) enables
(if set) all un-masked interrupts or disables (if cleared)
all interrupts. When bit GIE is enabled, and an interrupt
flag bit and mask bit are set, the interrupt will vector
immediately. Individual interrupts can be disabled
through their corresponding enable bits in the INTCON
register. GIE is cleared on reset.
The “return from interrupt” instruction, RETFIE, exits
the interrupt routine as well as sets the GIE bit, which
re-enable interrupts.
The RB0/INT pin interrupt, the RB port change interrupt
and the TMR0 overflow interrupt flag bits are contained
in the INTCON register.
The peripheral interrupt flag bits are contained in spe-
cial function registers PIR1 and PIR2. The correspond-
ing interrupt enable bits are contained in special
function registers PIE1 and PIE2 and the peripheral
interrupt enable bit is contained in special function reg-
ister INTCON.
When an interrupt is responded to, bit GIE is cleared to
disable any further interrupts, the return address is
pushed onto the stack and the PC is loaded with 0004h.
Once in the interrupt service routine the source(s) of
the interrupt can be determined by polling the interrupt
flag bits. The interrupt flag bit(s) must be cleared in soft-
ware before re-enabling interrupts to avoid recursive
interrupts.
For external interrupt events, such as the RB0/INT pin
or RB port change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends when the interrupt event occurs (Figure 13-
19). The latency is the same for one or two cycle
instructions. Once in the interrupt service routine the
source(s) of the interrupt can be determined by polling
the interrupt flag bits. The interrupt flag bit(s) must be
cleared in software before re-enabling interrupts to
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: Individual interrupt flag bits are set regard-
less of the status of their corresponding
mask bit or global enable bit, GIE.
avoid infinite interrupt requests. Individual interrupt flag
bits are set regardless of the status of their correspond-
ing mask bit or the GIE bit.
Note: For the PIC16C61/62/64/65, if an interrupt
occurs while the Global Interrupt Enable
bit, GIE is being cleared, bit GIE may unin-
tentionally be re-enabled by the user’s
Interrupt Service Routine (the RETFIE
instruction). The events that would cause
this to occur are:
1. An instruction clears the GIE bit while
an interrupt is acknowledged
2. The program branches to the Interrupt
vector and executes the Interrupt Ser-
vice Routine.
3. The Interrupt Service Routine com-
pletes with the execution of the RET-
FIE instruction. This causes the GIE
bit to be set (enables interrupts), and
the program returns to the instruction
after the one which was meant to dis-
able interrupts.
4. Perform the following to ensure that
interrupts are globally disabled.
LOOP BCF INTCON,GIE ;Disable Global
;Interrupt bit
BTFSC INTCON,GIE ;Global Interrupt
;Disabled?
GOTO LOOP ;NO, try again
: ;Yes, continue
;with program flow
my
1997-2013 Microchip Technology Inc. DS30234E-page 137
PIC16C6X
FIGURE 13-17: INTERRUPT LOGIC FOR PIC16C61
FIGURE 13-18: INTERRUPT LOGIC FOR PIC16C6X
RBIF
RBIE
T0IF
T0IE
INTF
INTE
GIE
Wake-up
(If in SLEEP mode)
Interrupt to CPU
TMR1IF
TMR1IE
TMR2IF
TMR2IE
CCP1IF
CCP1IE
CCP2IF
CCP2IE
TXIF
TXIE
RCIF
RCIE
SSPIF
SSPIE
T0IF
T0IE
INTF
INTE
RBIF
RBIE
GIE
PEIE
Wake-up (If in SLEEP mode)
Interrupt to CPU
PSPIE
PSPIF
The following table shows which devices have which interrupts.
Device T0IF INTF RBIF PSPIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF CCP2IF
PIC16C62 Yes Yes Yes - - - Yes Yes Yes Yes -
PIC16C62A Yes Yes Yes - - - Yes Yes Yes Yes -
PIC16CR62 Yes Yes Yes - - - Yes Yes Yes Yes -
P I C 1 6 C 6 3 Ye s Ye s Ye s - Ye s Ye s Ye s Ye s Ye s Ye s Ye s
PIC16CR63 Yes Yes Yes - Yes Yes Yes Yes Yes Yes Yes
PIC16C64 Yes Yes Yes Yes - - Yes Yes Yes Yes -
PIC16C64A Yes Yes Yes Yes - - Yes Yes Yes Yes -
PIC16C64 Yes Yes Yes Yes - - Yes Yes Yes Yes -
P I C 1 6 C 6 5 Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s
PIC16C65A Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
PIC16CR65 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
P I C 1 6 C 6 6 Ye s Ye s Ye s - Ye s Ye s Ye s Ye s Ye s Ye s Ye s
P I C 1 6 C 6 7 Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s Ye s
:
‘xxx‘xxx‘xxx‘xxx‘xxx‘
TL NW 4541 1F\_F\ fLFLflfufifJL/fi 4i J’U’LFL:
(\
INsmucnow now
PIC16C6X
DS30234E-page 138 1997-2013 Microchip Technology Inc.
13.5.1 INT INTERRUPT
External interrupt on RB0/INT pin is edge triggered:
either rising if edge select bit INTEDG (OPTION<6>) is
set, or falling, if bit INTEDG is clear. When a valid edge
appears on the RB0/INT pin, flag bit INTF
(INTCON<1>) is set. This interrupt can be disabled by
clearing enable bit INTE (INTCON<4>). The INTF bit
must be cleared in software in the interrupt service rou-
tine before re-enabling this interrupt. The INT interrupt
can wake the processor from SLEEP, if enable bit INTE
was set prior to going into SLEEP. The status of global
enable bit GIE decides whether or not the processor
branches to the interrupt vector following wake-up. See
Section 13.8 for details on SLEEP mode.
13.5.2 TMR0 INTERRUPT
An overflow (FFh 00h) in the TMR0 register will set
flag bit T0IF (INTCON<2>). The interrupt can be
enabled/disabled by setting/clearing enable bit T0IE
(INTCON<5>) (Section 7.0).
13.5.3 PORTB INTERRUPT ON CHANGE
An input change on PORTB<7:4> sets flag bit RBIF
(INTCON<0>). The interrupt can be enabled/disabled
by setting/clearing enable bit RBIE (INTCON<4>)
(Section 5.2).
Note: For the PIC16C61/62/64/65, if a change on
the I/O pin should occur when the read
operation is being executed (start of the Q2
cycle), then flag bit RBIF may not get set.
FIGURE 13-19: INT PIN INTERRUPT TIMING
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT(3)
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
fetched
Instruction
executed
Interrupt Latency (2)
PC PC+1 PC+1 0004h 0005h
Inst (0004h) Inst (0005h)
Dummy Cycle
Inst (PC) Inst (PC+1)
Inst (PC-1) Inst (0004h)
Dummy Cycle
Inst (PC)
—
1
4
5
1
Note 1: INTF flag is sampled here (every Q1).
2: Interrupt latency = 3TCY for synchronous interrupt and 3-4TCY for asynchronous interrupt.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in RC oscillator mode.
4: For minimum width spec of INT pulse, refer to AC specs.
5: INTF can to be set anytime during the Q4-Q1 cycles.
Context Sa 9 During Intervugts
A. «name Devices
IEW
m. 2A 5 53 sal-m- 5A
1997-2013 Microchip Technology Inc. DS30234E-page 139
PIC16C6X
13.6 Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key reg-
isters during an interrupt i.e., W register and STATUS
register. This will have to be implemented in software.
Example 13-1 stores and restores the STATUS and W
registers. Example 13-2 stores and restores the
STATUS, W, and PCLATH registers (Devices with
paged program memory). For all PIC16C6X devices
with greater than 1K of program memory (all devices
except PIC16C61), the register, W_TEMP, must be
defined in all banks and must be defined at the same
offset from the bank base address (i.e., if W_TEMP is
defined at 0x20 in bank 0, it must also be defined at
0xA0 in bank 1, 0x120 in bank 2, and 0x1A0 in bank 3).
The examples:
a) Stores the W register
b) Stores the STATUS register in bank 0
c) Stores PCLATH
d) Executes ISR code
e) Restores PCLATH
f) Restores STATUS register (and bank select bit)
g) Restores W register
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
EXAMPLE 13-1: SAVING STATUS AND W REGISTERS IN RAM (PIC16C61)
MOVWF W_TEMP ;Copy W to TEMP register, could be bank one or zero
SWAPF STATUS,W ;Swap status to be saved into W
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
:
:(ISR)
:
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W
EXAMPLE 13-2: SAVING STATUS, W, AND PCLATH REGISTERS IN RAM
(ALL OTHER PIC16C6X DEVICES)
MOVWF W_TEMP ;Copy W to TEMP register, could be bank one or zero
SWAPF STATUS,W ;Swap status to be saved into W
CLRF STATUS ;bank 0, regardless of current bank, Clears IRP,RP1,RP0
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
MOVF PCLATH, W ;Only required if using pages 1, 2 and/or 3
MOVWF PCLATH_TEMP ;Save PCLATH into W
CLRF PCLATH ;Page zero, regardless of current page
BCF STATUS, IRP ;Return to Bank 0
MOVF FSR, W ;Copy FSR to W
MOVWF FSR_TEMP ;Copy FSR from W to FSR_TEMP
:(ISR)
:
MOVF PCLATH_TEMP, W ;Restore PCLATH
MOVWF PCLATH ;Move W into PCLATH
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W
Watchdog Timer WDT
s
I“ “ma
PIC16C6X
DS30234E-page 140 1997-2013 Microchip Technology Inc.
13.7 Watchdog Timer (WDT)
The Watchdog Timer is a free running on-chip RC oscil-
lator which does not require any external components.
This RC oscillator is separate from the RC oscillator of
the OSC1/CLKIN pin. That means that the WDT will
run, even if the clock on the OSC1/CLKIN and OSC2/
CLKOUT pins of the device has been stopped, for
example, by execution of a SLEEP instruction. During
normal operation, a WDT time-out generates a device
reset. If the device is in SLEEP mode, a WDT time-out
causes the device to wake-up and continue with normal
operation (WDT Wake-up). The WDT can be perma-
nently disabled by clearing configuration bit WDTE
(Section 13.1).
13.7.1 WDT PERIOD
The WDT has a nominal time-out period of 18 ms, (with
no prescaler). The time-out periods vary with tempera-
ture, VDD and process variations from part to part (see
DC specs). If longer time-out periods are desired, a
prescaler with a division ratio of up to 1:128 can be
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
assigned to the WDT under software control by writing
to the OPTION register. Thus, time-out periods up to
2.3 seconds can be realized.
The CLRWDT and SLEEP instructions clear the WDT
and the postscaler, if assigned to the WDT, and prevent
it from timing out and generating a device RESET con-
dition.
The TO bit in the STATUS register will be cleared upon
a WDT time-out.
13.7.2 WDT PROGRAMMING CONSIDERATIONS
It should also be taken in account that under worst case
conditions (VDD = Min., Temperature = Max., max.
WDT prescaler) it may take several seconds before a
WDT time-out occurs.
Note: When a CLRWDT instruction is executed
and the prescaler is assigned to the WDT,
the prescaler count will be cleared, but the
prescaler assignment is not changed.
FIGURE 13-20: WATCHDOG TIMER BLOCK DIAGRAM
FIGURE 13-21: SUMMARY OF WATCHDOG TIMER REGISTERS
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
2007h Config. bits (1) BODEN(1) CP1 CP0 PWRTE(1) WDTE FOSC1 FOSC0
81h,181h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: See Figure 13-1, Figure 13-2, and Figure 13-3 for details of these bits for the specific device.
From TMR0 Clock Source
(see Figure 7-6)
To TMR0 (Figure 7-6)
Watchdog
Timer
WDT
Enable bit
0
1
M
U
X
PSA
Postscaler
8- to -1 MUX PS2:PS0
01
MUX PSA
WDT
Time-out
8
Note: Bits T0CS, T0SE, PSA, PS2:PS0 are (OPTION<5:0>).
Power-down Mode SLEEP
A. «name Devices
IEW
m. 2A 5 53 sal-m- 5A
1997-2013 Microchip Technology Inc. DS30234E-page 141
PIC16C6X
13.8 Power-down Mode (SLEEP)
Power-down mode is entered by executing a SLEEP
instruction.
If enabled, the Watchdog Timer will be cleared but
keeps running, status bit PD (STATUS<3>) is cleared,
status bit TO (STATUS<4>) is set, and the oscillator
driver is turned off. The I/O ports maintain the status
they had before the SLEEP instruction was executed
(driving high, low, or hi-impedance).
For lowest current consumption in this mode, place all
I/O pins at either VDD, or VSS, ensure no external cir-
cuitry is drawing current from the I/O pin, and disable
external clocks. Pull all I/O pins, that are hi-impedance
inputs, high or low externally to avoid switching currents
caused by floating inputs. The T0CKI input should also
be at VDD or VSS for lowest current consumption. The
contribution from on-chip pull-ups on PORTB should be
considered.
The MCLR/VPP pin must be at a logic high level
(VIHMC).
13.8.1 WAKE-UP FROM SLEEP
The device can wake from SLEEP through one of the
following events:
1. External reset input on MCLR/VPP pin.
2. Watchdog Timer Wake-up (if WDT was
enabled).
3. Interrupt from RB0/INT pin, RB port change, or
some peripheral interrupts.
External MCLR Reset will cause a device reset. All
other events are considered a continuation of program
execution and cause a “wake-up”. The TO and PD bits
in the STATUS register can be used to determine the
cause of device reset. The PD bit, which is set on
power-up is cleared when SLEEP is invoked. The TO bit
is cleared if WDT time-out occurred (and caused wake-
up).
The following peripheral interrupts can wake the device
from SLEEP:
1. TMR1 interrupt. Timer1 must be operating as an
asynchronous counter.
2. SSP (Start/Stop) bit detect interrupt.
3. SSP transmit or receive in slave mode (SPI/I2C).
4. CCP capture mode interrupt.
5. Parallel Slave Port read or write.
6. USART TX or RX (synchronous slave mode).
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Other peripherals can not generate interrupts since
during SLEEP, no on-chip Q clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is pre-fetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up is
regardless of the state of the GIE bit. If the GIE bit is
clear (disabled), the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction and then branches to the inter-
rupt address (0004h). In cases where the execution of
the instruction following SLEEP is not desirable, the
user should have a NOP after the SLEEP instruction.
13.8.2 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction, the SLEEP instruction will com-
plete as a NOP. Therefore, the WDT and WDT
postscaler will not be cleared, the TO bit will not
be set and PD bits will not be cleared.
• If the interrupt occurs during or after the execu-
tion of a SLEEP instruction, the device will imme-
diately wake up from sleep. The SLEEP instruction
will be completely executed before the wake-up.
Therefore, the WDT and WDT postscaler will be
cleared, the TO bit will be set and the PD bit will
be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruc-
tion should be executed before a SLEEP instruction.
‘\\\‘\\\ \\\‘\\\‘
‘FLFLFLFL‘FLFL/‘Lfl r\ MLFL mLflNLF‘mILFmflfL/WJL
Program Verification/Code Protection
II 2A 6 IIEIHEII SAWW
:
ID Locations
6‘I 2A 6 IIIW 6AIE67
In-Circuil Serial Programming
6 I 2A 6 IIE6H§II 6AIEI
PIC16C6X
DS30234E-page 142 1997-2013 Microchip Technology Inc.
FIGURE 13-22: WAKE-UP FROM SLEEP THROUGH INTERRUPT
Note 1: XT, HS or LP oscillator mode assumed.
2: TOST = 1024TOSC (drawing not to scale) This delay will not be there for RC osc mode.
3: GIE = '1' assumed. In this case after wake-up, the processor jumps to the interrupt routine.
If GIE = '0', execution will continue in-line.
4: CLKOUT is not available in these osc modes, but shown here for timing reference.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
fetched
Instruction
executed
PC PC+1 PC+2
Inst(PC) = SLEEP
Inst(PC - 1)
Inst(PC + 1)
SLEEP
Processor in
SLEEP
Interrupt Latency
(Note 2)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Dummy cycle
PC + 2 0004h 0005h
Dummy cycle
T
OST(2)
PC+2
13.9 Program Verification/Code Protection
If the code protection bit(s) have not been pro-
grammed, the on-chip program memory can be read
out for verification purposes.
13.10 ID Locations
Four memory locations (2000h - 2003h) are designated
as ID locations where the user can store checksum or
other code-identification numbers. These locations are
not accessible during normal execution but are read-
able and writable during program/verify. It is recom-
mended that only the 4 least significant bits of the ID
location are used.
For ROM devices, these values are submitted along
with the ROM code.
13.11 In-Circuit Serial Programming
The PIC16CXX microcontrollers can be serially pro-
grammed while in the end application circuit. This is
simply done with two lines for clock and data, and three
other lines for power, ground, and the programming
voltage. This allows customers to manufacture boards
with unprogrammed devices, and then program the
microcontroller just before shipping the product. This
also allows the most recent firmware or a custom firm-
ware to be programmed.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Note: Microchip does not recommend code pro-
tecting windowed devices.
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Applicable Devices
61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
The device is placed into a program/verify mode by
holding pins RB6 and RB7 low while raising the MCLR
(VPP) pin from VIL to VIHH (see programming specifica-
tion). RB6 becomes the programming clock and RB7
becomes the programming data. Both RB6 and RB7
are Schmitt Trigger inputs in this mode.
After reset, to place the device in program/verify mode,
the program counter (PC) is at location 00h. A 6-bit
command is then supplied to the device. Depending on
the command, 14-bits of program data are then sup-
plied to or from the device, depending if the command
was a load or a read. For complete details of serial pro-
gramming, please refer to the PIC16C6X/7X Program-
ming Specifications (Literature #DS30228).
FIGURE 13-23: TYPICAL IN-CIRCUIT SERIAL
PROGRAMMING
CONNECTION
External
Connector
Signals
To Normal
Connections
To Nor mal
Connections
PIC16CXX
VDD
VSS
MCLR/VPP
RB6
RB7
+5V
0V
VPP
CLK
Data I/O
VDD
do not use
1997-2013 Microchip Technology Inc. DS30234E-page 143
PIC16C6X
14.0 INSTRUCTION SET SUMMARY
Each PIC16CXX instruction is a 14-bit word divided
into an OPCODE which specifies the instruction type
and one or more operands which further specify the
operation of the instruction. The PIC16CXX instruction
set summary in Table 14-2 lists byte-oriented, bit-ori-
ented, and literal and control operations. Table 14-1
shows the opcode field descriptions.
For byte-oriented instructions, 'f' represents a file reg-
ister designator and 'd' represents a destination desig-
nator. The file register designator specifies which file
register is to be used by the instruction.
The destination designator specifies where the result of
the operation is to be placed. If 'd' is zero, the result is
placed in the W register. If 'd' is one, the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, 'b' represents a bit field
designator which selects the number of the bit affected
by the operation, while 'f' represents the number of the
file in which the bit is located.
For literal and control operations, 'k' represents an
eight or eleven bit constant or literal value.
TABLE 14-1: OPCODE FIELD
DESCRIPTIONS
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral field, constant data or label
xDon't care location (= 0 or 1)
The assembler will generate code with x = 0. It is the
recommended form of use for compatibility with all
Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1
label Label name
TOS Top of Stack
PC Program Counter
PCLATH Program Counter High Latch
GIE Global Interrupt Enable bit
WDT Watchdog Timer/Counter
TO Time-out bit
PD Power-down bit
dest Destination either the W register or the specified
register file location
[ ] Options
( ) Contents
Assigned to
< > Register bit field
In the set of
i
talics
User defined term (font is courier)
The instruction set is highly orthogonal and is grouped
into three basic categories:
•Byte-oriented operations
•Bit-oriented operations
•Literal and control operations
All instructions are executed within one single instruc-
tion cycle, unless a conditional test is true or the pro-
gram counter is changed as a result of an instruction.
In this case, the execution takes two instruction cycles
with the second cycle executed as a NOP. One instruc-
tion cycle consists of four oscillator periods. Thus, for
an oscillator frequency of 4 MHz, the normal instruction
execution time is 1 s. If a conditional test is true or the
program counter is changed as a result of an instruc-
tion, the instruction execution time is 2 s.
Table 14-2 lists the instructions recognized by the
MPASM assembler.
Figure 14-1 shows the general formats that the instruc-
tions can have.
All examples use the following format to represent a
hexadecimal number:
0xhh
where h signifies a hexadecimal digit.
FIGURE 14-1: GENERAL FORMAT FOR
INSTRUCTIONS
Note: To maintain upward compatibility with
future PIC16CXX products, do not use the
OPTION and TRIS instructions.
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC16C6X
DS30234E-page 144 1997-2013 Microchip Technology Inc.
TABLE 14-2: PIC16CXX INSTRUCTION SET
Mnemonic,
Operands
Description Cycles 14-Bit Opcode Status
Affected
Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C,DC,Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C,DC,Z
Z
1,2
1,2
2
1,2
1,2
1,2,3
1,2
1,2,3
1,2
1,2
1,2
1,2
1,2
1,2
1,2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1,2
1,2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
-
k
k
k
-
k
-
-
k
k
Add literal and W
AND literal with W
Call subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move literal to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C,DC,Z
Z
TO,PD
Z
TO,PD
C,DC,Z
Z
Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external
device, the data will be written back with a '0'.
2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned
to the Timer0 Module.
3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
Instruction Descriptions
1997-2013 Microchip Technology Inc. DS30234E-page 145
PIC16C6X
14.1 Instruction Descriptions
ADDLW Add Literal and W
Syntax: [
label
] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Encoding: 11 111x kkkk kkkk
Description: The contents of the W register are
added to the eight bit literal 'k' and the
result is placed in the W register.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k'
Process
data
Write to
W
Example: ADDLW 0x15
Before Instruction
W = 0x10
After Instruction
W = 0x25
ADDWF Add W and f
Syntax: [
label
] ADDWF f,d
Operands: 0 f 127
d
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Encoding: 00 0111 dfff ffff
Description: Add the contents of the W register with
register 'f'. If 'd' is 0 the result is stored
in the W register. If 'd' is 1 the result is
stored back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example ADDWF FSR, 0
Before Instruction
W = 0x17
FSR = 0xC2
After Instruction
W= 0xD9
FSR = 0xC2
ANDLW AND Literal with W
Syntax: [
label
] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Encoding: 11 1001 kkkk kkkk
Description: The contents of W register are
AND’ed with the eight bit literal 'k'. The
result is placed in the W register.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal "k"
Process
data
Write to
W
Example ANDLW 0x5F
Before Instruction
W= 0xA3
After Instruction
W = 0x03
ANDWF AND W with f
Syntax: [
label
] ANDWF f,d
Operands: 0 f 127
d
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Encoding: 00 0101 dfff ffff
Description: AND the W register with register 'f'. If 'd'
is 0 the result is stored in the W regis-
ter. If 'd' is 1 the result is stored back in
register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example ANDWF FSR, 1
Before Instruction
W= 0x17
FSR = 0xC2
After Instruction
W= 0x17
FSR = 0x02
PIC16C6X
DS30234E-page 146 1997-2013 Microchip Technology Inc.
BCF Bit Clear f
Syntax: [
label
] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Affected: None
Encoding: 01 00bb bfff ffff
Description: Bit 'b' in register 'f' is cleared.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write
register 'f'
Example BCF FLAG_REG, 7
Before Instruction
FLAG_REG = 0xC7
After Instruction
FLAG_REG = 0x47
BSF Bit Set f
Syntax: [
label
] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Affected: None
Encoding: 01 01bb bfff ffff
Description: Bit 'b' in register 'f' is set.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write
register 'f'
Example BSF FLAG_REG, 7
Before Instruction
FLAG_REG = 0x0A
After Instruction
FLAG_REG = 0x8A
BTFSC Bit Test, Skip if Clear
Syntax: [
label
] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Affected: None
Encoding: 01 10bb bfff ffff
Description: If bit 'b' in register 'f' is '1' then the next
instruction is executed.
If bit 'b', in register 'f', is '0' then the next
instruction is discarded, and a NOP is
executed instead, making this a 2TCY
instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f'
Process
data
No-
Operation
If Skip: (2nd Cycle)
Q1 Q2 Q3 Q4
No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example HERE
FALSE
TRUE
BTFSC
GOTO
•
•
•
FLAG,1
PROCESS_CODE
Before Instruction
PC = address HERE
After Instruction
if FLAG<1> = 0,
PC = address TRUE
if FLAG<1>=1,
PC = address FALSE
1997-2013 Microchip Technology Inc. DS30234E-page 147
PIC16C6X
BTFSS Bit Test f, Skip if Set
Syntax: [
label
] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Encoding: 01 11bb bfff ffff
Description: If bit 'b' in register 'f' is '0' then the next
instruction is executed.
If bit 'b' is '1', then the next instruction is
discarded and a NOP is executed
instead, making this a 2TCY instruction.
Words: 1
Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f'
Process
data
No-
Operation
If Skip: (2nd Cycle)
Q1 Q2 Q3 Q4
No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example HERE
FALSE
TRUE
BTFSC
GOTO
•
•
•
FLAG,1
PROCESS_CODE
Before Instruction
PC = address HERE
After Instruction
if FLAG<1> = 0,
PC = address FALSE
if FLAG<1> = 1,
PC = address TRUE
CALL Call Subroutine
Syntax: [
label
] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<4:3>) PC<12:11>
Status Affected: None
Encoding: 10 0kkk kkkk kkkk
Description: Call Subroutine. First, return address
(PC+1) is pushed onto the stack. The
eleven bit immediate address is loaded
into PC bits <10:0>. The upper bits of
the PC are loaded from PCLATH. CALL
is a two cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode Read
literal 'k',
Push PC
to Stack
Process
data
Write to
PC
2nd Cycle No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example HERE CALL THERE
Before Instruction
PC = Address HERE
After Instruction
PC = Address THERE
TOS = Address HERE+1
PIC16C6X
DS30234E-page 148 1997-2013 Microchip Technology Inc.
CLRF Clear f
Syntax: [
label
] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Encoding: 00 0001 1fff ffff
Description: The contents of register 'f' are cleared
and the Z bit is set.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write
register 'f'
Example CLRF FLAG_REG
Before Instruction
FLAG_REG = 0x5A
After Instruction
FLAG_REG = 0x00
Z=1
CLRW Clear W
Syntax: [
label
] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Encoding: 00 0001 0xxx xxxx
Description: W register is cleared. Zero bit (Z) is
set.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode No-
Operation
Process
data
Write to
W
Example CLRW
Before Instruction
W= 0x5A
After Instruction
W= 0x00
Z=1
CLRWDT Clear Watchdog Timer
Syntax: [
label
] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Affected: TO, PD
Encoding: 00 0000 0110 0100
Description: CLRWDT instruction resets the Watch-
dog Timer. It also resets the prescaler
of the WDT. Status bits TO and PD are
set.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode No-
Operation
Process
data
Clear
WDT
Counter
Example CLRWDT
Before Instruction
WDT counter = ?
After Instruction
WDT counter = 0x00
WDT prescaler= 0
TO =1
PD =1
1997-2013 Microchip Technology Inc. DS30234E-page 149
PIC16C6X
COMF Complement f
Syntax: [
label
] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Encoding: 00 1001 dfff ffff
Description: The contents of register 'f' are comple-
mented. If 'd' is 0 the result is stored in
W. If 'd' is 1 the result is stored back in
register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example COMF REG1,0
Before Instruction
REG1 = 0x13
After Instruction
REG1 = 0x13
W=0xEC
DECF Decrement f
Syntax: [
label
] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Affected: Z
Encoding: 00 0011 dfff ffff
Description: Decrement register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example DECF CNT, 1
Before Instruction
CNT = 0x01
Z=0
After Instruction
CNT = 0x00
Z=1
DECFSZ Decrement f, Skip if 0
Syntax: [
label
] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Encoding: 00 1011 dfff ffff
Description: The contents of register 'f' are decre-
mented. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is placed
back in register 'f'.
If the result is 1, the next instruction, is
executed. If the result is 0, then a NOP is
executed instead making it a 2TCY instruc-
tion.
Words: 1
Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f'
Process
data
Write to
destination
If Skip: (2nd Cycle)
Q1 Q2 Q3 Q4
No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example HERE DECFSZ CNT, 1
GOTO LOOP
CONTINUE •
•
•
Before Instruction
PC = address HERE
After Instruction
CNT = CNT - 1
if CNT = 0,
PC = address CONTINUE
if CNT 0,
PC = address HERE+1
PIC16C6X
DS30234E-page 150 1997-2013 Microchip Technology Inc.
GOTO Unconditional Branch
Syntax: [
label
] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<4:3> PC<12:11>
Status Affected: None
Encoding: 10 1kkk kkkk kkkk
Description: GOTO is an unconditional branch. The
eleven bit immediate value is loaded
into PC bits <10:0>. The upper bits of
PC are loaded from PCLATH<4:3>.
GOTO is a two cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode Read
literal 'k'
Process
data
Write to
PC
2nd Cycle No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example GOTO THERE
After Instruction
PC = Address THERE
INCF Increment f
Syntax: [
label
] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Encoding: 00 1010 dfff ffff
Description: The contents of register 'f' are incre-
mented. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example INCF CNT, 1
Before Instruction
CNT = 0xFF
Z=0
After Instruction
CNT = 0x00
Z=1
1997-2013 Microchip Technology Inc. DS30234E-page 151
PIC16C6X
INCFSZ Increment f, Skip if 0
Syntax: [
label
] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Affected: None
Encoding: 00 1111 dfff ffff
Description: The contents of register 'f' are incre-
mented. If 'd' is 0 the result is placed in
the W register. If 'd' is 1 the result is
placed back in register 'f'.
If the result is 1, the next instruction is
executed. If the result is 0, a NOP is exe-
cuted instead making it a 2TCY instruc-
tion.
Words: 1
Cycles: 1(2)
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f'
Process
data
Write to
destination
If Skip: (2nd Cycle)
Q1 Q2 Q3 Q4
No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example HERE INCFSZ CNT, 1
GOTO LOOP
CONTINUE •
•
•
Before Instruction
PC = address HERE
After Instruction
CNT = CNT + 1
if CNT= 0,
PC = address CONTINUE
if CNT0,
PC = address HERE +1
IORLW Inclusive OR Literal with W
Syntax: [
label
] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Encoding: 11 1000 kkkk kkkk
Description: The contents of the W register is
OR’ed with the eight bit literal 'k'. The
result is placed in the W register.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k'
Process
data
Write to
W
Example IORLW 0x35
Before Instruction
W= 0x9A
After Instruction
W= 0xBF
Z=1
PIC16C6X
DS30234E-page 152 1997-2013 Microchip Technology Inc.
IORWF Inclusive OR W with f
Syntax: [
label
] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Encoding: 00 0100 dfff ffff
Description: Inclusive OR the W register with regis-
ter 'f'. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is placed
back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example IORWF RESULT, 0
Before Instruction
RESULT = 0x13
W = 0x91
After Instruction
RESULT = 0x13
W = 0x93
Z=1
MOVF Move f
Syntax: [
label
] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Encoding: 00 1000 dfff ffff
Description: The contents of register f is moved to a
destination dependant upon the status
of d. If d = 0, destination is W register. If
d = 1, the destination is file register f
itself. d = 1 is useful to test a file regis-
ter since status flag Z is affected.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example MOVF FSR, 0
After Instruction
W = value in FSR register
Z= 1
MOVLW Move Literal to W
Syntax: [
label
] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Encoding: 11 00xx kkkk kkkk
Description: The eight bit literal 'k' is loaded into W
register. The don’t cares will assemble
as 0’s.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k'
Process
data
Write to
W
Example MOVLW 0x5A
After Instruction
W= 0x5A
MOVWF Move W to f
Syntax: [
label
] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Affected: None
Encoding: 00 0000 1fff ffff
Description: Move data from W register to register
'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write
register 'f'
Example MOVWF OPTION_REG
Before Instruction
OPTION = 0xFF
W=0x4F
After Instruction
OPTION = 0x4F
W=0x4F
1997-2013 Microchip Technology Inc. DS30234E-page 153
PIC16C6X
NOP No Operation
Syntax: [
label
] NOP
Operands: None
Operation: No operation
Status Affected: None
Encoding: 00 0000 0xx0 0000
Description: No operation.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode No-
Operation
No-
Operation
No-
Operation
Example NOP
OPTION Load Option Register
Syntax: [
label
] OPTION
Operands: None
Operation: (W) OPTION
Status Affected: None
Encoding: 00 0000 0110 0010
Description: The contents of the W register are
loaded in the OPTION register. This
instruction is supported for code com-
patibility with PIC16C5X products.
Since OPTION is a readable/writable
register, the user can directly address
it.
Words: 1
Cycles: 1
Example
To maintain upward compatibility
with future PIC16CXX products, do
not use this instruction.
RETFIE Return from Interrupt
Syntax: [
label
] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Encoding: 00 0000 0000 1001
Description: Return from Interrupt. Stack is POPed
and Top of Stack (TOS) is loaded in the
PC. Interrupts are enabled by setting
Global Interrupt Enable bit, GIE
(INTCON<7>). This is a two cycle
instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode No-
Operation
Set the
GIE bit
Pop from
the Stack
2nd Cycle No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example RETFIE
After Interrupt
PC = TOS
GIE = 1
PIC16C6X
DS30234E-page 154 1997-2013 Microchip Technology Inc.
RETLW Return with Literal in W
Syntax: [
label
] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Encoding: 11 01xx kkkk kkkk
Description: The W register is loaded with the eight
bit literal 'k'. The program counter is
loaded from the top of the stack (the
return address). This is a two cycle
instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode Read
literal 'k'
No-
Operation
Write to
W, Pop
from the
Stack
2nd Cycle No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example
TABLE
CALL TABLE ;W contains table
;offset value
• ;W now has table value
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ; End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [
label
] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Encoding: 00 0000 0000 1000
Description: Return from subroutine. The stack is
POPed and the top of the stack (TOS)
is loaded into the program counter. This
is a two cycle instruction.
Words: 1
Cycles: 2
Q Cycle Activity: Q1 Q2 Q3 Q4
1st Cycle Decode No-
Operation
No-
Operation
Pop from
the Stack
2nd Cycle No-
Operation
No-
Operation
No-
Operation
No-
Operation
Example RETURN
After Interrupt
PC = TOS
EI->|:|—~
1997-2013 Microchip Technology Inc. DS30234E-page 155
PIC16C6X
RLF Rotate Left f through Carry
Syntax: [
label
] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Encoding: 00 1101 dfff ffff
Description: The contents of register 'f' are rotated
one bit to the left through the Carry
Flag. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is stored
back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example RLF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W= 1100 1100
C=1
Register fC
RRF Rotate Right f through Carry
Syntax: [
label
] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Encoding: 00 1100 dfff ffff
Description: The contents of register 'f' are rotated
one bit to the right through the Carry
Flag. If 'd' is 0 the result is placed in the
W register. If 'd' is 1 the result is placed
back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example RRF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W= 0111 0011
C=0
Register fC
PIC16C6X
DS30234E-page 156 1997-2013 Microchip Technology Inc.
SLEEP
Syntax: [
label
] SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Affected: TO, PD
Encoding: 00 0000 0110 0011
Description: The power-down status bit, PD is
cleared. Time-out status bit, TO is
set. Watchdog Timer and its pres-
caler are cleared.
The processor is put into SLEEP
mode with the oscillator stopped. See
Section 13.8 for more details.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode No-
Operation
No-
Operation
Go to
Sleep
Example: SLEEP
SUBLW Subtract W from Literal
Syntax: [
label
] SUBLW k
Operands: 0 k 255
Operation: k - (W) W)
Status Affected: C, DC, Z
Encoding: 11 110x kkkk kkkk
Description: The W register is subtracted (2’s comple-
ment method) from the eight bit literal 'k'.
The result is placed in the W register.
Words: 1
Cycles: 1
Q Cycle Activity:Q1Q2Q3Q4
Decode Read
literal 'k'
Process
data
Write to W
Example 1: SUBLW 0x02
Before Instruction
W= 1
C= ?
Z=?
After Instruction
W= 1
C = 1; result is positive
Z=0
Example 2: Before Instruction
W= 2
C= ?
Z=?
After Instruction
W= 0
C = 1; result is zero
Z=1
Example 3: Before Instruction
W= 3
C= ?
Z=?
After Instruction
W= 0xFF
C = 0; result is negative
Z=0
1997-2013 Microchip Technology Inc. DS30234E-page 157
PIC16C6X
SUBWF Subtract W from f
Syntax: [
label
] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) destination)
Status Affected: C, DC, Z
Encoding: 00 0010 dfff ffff
Description: Subtract (2’s complement method) W reg-
ister from register 'f'. If 'd' is 0 the result is
stored in the W register. If 'd' is 1 the
result is stored back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f'
Process
data
Write to
destination
Example 1: SUBWF REG1,1
Before Instruction
REG1 = 3
W=2
C=?
Z=?
After Instruction
REG1 = 1
W=2
C = 1; result is positive
Z=0
Example 2: Before Instruction
REG1 = 2
W=2
C=?
Z=?
After Instruction
REG1 = 0
W=2
C = 1; result is zero
Z=1
Example 3: Before Instruction
REG1 = 1
W=2
C=?
Z=?
After Instruction
REG1 = 0xFF
W=2
C = 0; result is negative
Z=0
SWAPF Swap Nibbles in f
Syntax: [
label
] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Encoding: 00 1110 dfff ffff
Description: The upper and lower nibbles of register
'f' are exchanged. If 'd' is 0 the result is
placed in W register. If 'd' is 1 the result
is placed in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register 'f'
Process
data
Write to
destination
Example SWAPF REG, 0
Before Instruction
REG1 = 0xA5
After Instruction
REG1 = 0xA5
W=0x5A
TRIS Load TRIS Register
Syntax: [
label
] TRIS f
Operands: 5 f 7
Operation: (W) TRIS register f;
Status Affected: None
Encoding: 00 0000 0110 0fff
Description: The instruction is supported for code
compatibility with the PIC16C5X prod-
ucts. Since TRIS registers are read-
able and writable, the user can directly
address them.
Words: 1
Cycles: 1
Example
To maintain upward compatibility
with future PIC16CXX products, do
not use this instruction.
PIC16C6X
DS30234E-page 158 1997-2013 Microchip Technology Inc.
XORLW Exclusive OR Literal with W
Syntax: [
label
]XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Affected: Z
Encoding: 11 1010 kkkk kkkk
Description: The contents of the W register are
XOR’ed with the eight bit literal 'k'.
The result is placed in the W regis-
ter.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
literal 'k'
Process
data
Write to
W
Example: XORLW 0xAF
Before Instruction
W= 0xB5
After Instruction
W = 0x1A
XORWF Exclusive OR W with f
Syntax: [
label
] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Affected: Z
Encoding: 00 0110 dfff ffff
Description: Exclusive OR the contents of the W
register with register 'f'. If 'd' is 0 the
result is stored in the W register. If 'd' is
1 the result is stored back in register 'f'.
Words: 1
Cycles: 1
Q Cycle Activity: Q1 Q2 Q3 Q4
Decode Read
register
'f'
Process
data
Write to
destination
Example XORWF REG 1
Before Instruction
REG = 0xAF
W=0xB5
After Instruction
REG = 0x1A
W=0xB5
1997-2013 Microchip Technology Inc. DS30234E-page 159
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
15.0 ELECTRICAL CHARACTERISTICS FOR PIC16C61
Absolute Maximum Ratings †
Ambient temperature under bias.............................................................................................................-55°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS (Note 2).............................................................................................. 0V to +14V
Voltage on RA4 pin with respect to Vss .......................................................................................................... 0V to +14V
Total power dissipation (Note 1)...........................................................................................................................800 mW
Maximum current out of VSS pin ...........................................................................................................................150 mA
Maximum current into VDD pin ..............................................................................................................................100 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................20 mA
Maximum current sunk byPORTA ..........................................................................................................................80 mA
Maximum current sourced by PORTA .....................................................................................................................50 mA
Maximum current sunk by PORTB........................................................................................................................ 150 mA
Maximum current sourced by PORTB...................................................................................................................100 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
Note 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus,
a series resistor of 50-100 should be used when applying a “low” level to the MCLR pin rather than pulling
this pin directly to VSS.
TABLE 15-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC PIC16C61-04 PIC16C61-20 PIC16LC61-04 JW Devices
RC VDD: 4.0V to 6.0V
IDD: 3.3 mA max. at 5.5V
IPD: 14 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 1.8 mA typ. at 5.5V
IPD: 1.0 A typ. at 4V
Freq: 4 MHz max.
VDD: 3.0V to 6.0V
IDD: 1.4 mA typ. at 3.0V
IPD: 0.6 A typ. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 3.3 mA max. at 5.5V
IPD: 14 A max. at 4V
Freq: 4 MHz max.
XT VDD: 4.0V to 6.0V
IDD: 3.3 mA max. at 5.5V
IPD: 14 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 1.8 mA typ. at 5.5V
IPD: 1.0 A typ. at 4V
Freq: 4 MHz max.
VDD: 3.0V to 6.0V
IDD: 1.4 mA typ. at 3.0V
IPD: 0.6 A typ. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 3.3 mA max. at 5.5V
IPD: 14 A max. at 4V
Freq: 4 MHz max.
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for use in
HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at 5.5V IDD: 30 mA max. at 5.5V IDD: 30 mA max. at 5.5V
IPD: 1.0 A typ. at 4.5V IPD: 1.0 A typ. at 4.5V IPD: 1.0 A typ. at 4.5V
Freq: 4 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP VDD: 4.0V to 6.0V
IDD: 15 A typ. at 32 kHz,
4.0V
IPD: 0.6 A typ. at 4.0V
Freq: 200 kHz max.
Not recommended for
use in LP mode
VDD: 3.0V to 6.0V
IDD: 32 A max. at 32 kHz,
3.0V
IPD: 9 A max. at 3.0V
Freq: 200 kHz max.
VDD: 3.0V to 6.0V
IDD: 32 A max. at 32 kHz,
3.0V
IPD: 9 A max. at 3.0V
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications.
It is recommended that the user select the device type that ensures the specifications required.
No.
PIC16C6X
DS30234E-page 160 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
15.1 DC Characteristics: PIC16C61-04 (Commercial, Industrial, Extended)
PIC16C61-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage VDD 4.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-
on Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on
Reset signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D010
D013
Supply Current (Note 2) IDD -
-
1.8
13.5
3.3
30
mA
mA
FOSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
FOSC = 20 MHz, VDD = 5.5V
D020
D021
D021A
D021B
Power-down Current
(Note 3)
IPD -
-
-
-
7
1.0
1.0
1.0
28
14
16
20
A
A
A
A
VDD = 4.0V, WDT enabled, -40C to +85C
VDD = 4.0V, WDT disabled, -0C to +70C
VDD = 4.0V, WDT disabled, -40C to +85C
VDD = 4.0V, WDT disabled, -40C to +125C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
1997-2013 Microchip Technology Inc. DS30234E-page 161
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
15.2 DC Characteristics: PIC16LC61-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 3.0 - 6.0 V XT, RC, and LP osc configuration
D002* RAM Data Retention Volt-
age (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D010
D010A
Supply Current (Note 2) IDD -
-
1.4
15
2.5
32
mA
A
FOSC = 4 MHz, VDD = 3.0V (Note 4)
FOSC = 32 kHz, VDD = 3.0V, WDT disabled,
LP osc configuration
D020
D021
D021A
Power-down Current
(Note 3)
IPD -
-
-
5
0.6
0.6
20
9
12
A
A
A
VDD = 3.0V, WDT enabled, -40C to +85C
VDD = 3.0V, WDT disabled, 0C to +70C
VDD = 3.0V, WDT disabled, -40C to +85C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
u
PIC16C6X
DS30234E-page 162 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
15.3 DC Characteristics: PIC16C61-04 (Commercial, Industrial, Extended)
PIC16C61-20 (Commercial, Industrial, Extended)
PIC16LC61-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 15.1 and
Section 15.2.
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
Input Low Voltage
I/O ports VIL
D030
D030A
with TTL buffer Vss
VSS
-
-
0.15VDD
0.8V
V
V
For entire VDD range
4.5V VDD 5.5V
D031 with Schmitt Trigger buffer Vss - 0.2VDD V
D032 MCLR, OSC1 (in RC mode) Vss - 0.2VDD V
D033 OSC1 (in XT, HS and LP) Vss - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V4.5V VDD 5.5V
D040A 0.25VDD
+ 0.8V
-V
DD V For entire VDD range
D041 with Schmitt Trigger buffer 0.85VDD -VDD V For entire VDD range
D042 MCLR 0.85VDD -VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD -VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD -VDD V
D070 PORTB weak pull-up current IPURB 50 250 † 400 AVDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL --1AVss VPIN VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - 5AVss VPIN VDD
D063 OSC1 - - 5AVss VPIN VDD, XT, HS and
LP osc configuration
Output Low Voltage
D080 I/O ports VOL --0.6VIOL = 8.5 mA, VDD = 4.5V,
-40C to +85C
D080A - - 0.6 V IOL = 7.0 mA, VDD = 4.5V,
-40C to +125C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40C to +85C
D083A - - 0.6 V IOL = 1.2 mA, VDD = 4.5V,
-40C to +125C
* The parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
1997-2013 Microchip Technology Inc. DS30234E-page 163
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Output High Voltage
D090 I/O ports (Note 3) VOH VDD-0.7 - - V IOH = -3.0 mA,
VDD = 4.5V, -40C to +85C
D090A VDD-0.7 - - V IOH = -2.5 mA,
VDD = 4.5V, -40C to +125C
D092 OSC2/CLKOUT (RC osc config) VDD-0.7 - - V IOH = -1.3 mA,
VDD = 4.5V, -40C to +85C
D092A VDD-0.7 - - V IOH = -1.0 mA,
VDD = 4.5V, -40C to +125C
D150* Open-Drain High Voltage VOD - - 14 V RA4 pin
Capacitive Loading Specs on
Output Pins
D100 OSC2 pin COSC2 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO 50 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 15.1 and
Section 15.2.
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
* The parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
Timing Parameter Symbology
Load common 1
Load condmon 2
PIC16C6X
DS30234E-page 164 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
15.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 15-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
HHigh RRise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
I2C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition
STA START condition
VDD/2
CL
RL
Pin Pin
VSS VSS
CL
RL= 464
CL= 50 pF for all pins except OSC2/CLKOUT
15 pF for OSC2 output
Load condition 1 Load condition 2
Timin Dia rams ands ecificalions
1997-2013 Microchip Technology Inc. DS30234E-page 165
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
15.5 Timing Diagrams and Specifications
FIGURE 15-2: EXTERNAL CLOCK TIMING
TABLE 15-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1)
DC — 4 MHz XT and RC osc mode
DC — 4 MHz HS osc mode (-04)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1)
DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
1 — 4 MHz HS osc mode (-04)
1 — 20 MHz HS osc mode (-20)
1ToscExternal CLKIN Period
(Note 1)
250 — — ns XT and RC osc mode
250 — — ns HS osc mode (-04)
50 — — ns HS osc mode (-20)
5— —s LP osc mode
Oscillator Period
(Note 1)
250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 1,000 ns HS osc mode (-04)
50 — 1,000 ns HS osc mode (-20)
5— —s LP osc mode
2T
CY Instruction Cycle Time (Note 1) 1.0 TCY DC sTCY = 4/Fosc
3TosL,
TosH
External Clock in (OSC1) High or
Low Time
50 — — ns XT oscillator
2.5 — — s LP oscillator
10 — — ns HS oscillator
4TosR,
TosF
External Clock in (OSC1) Rise or
Fall Time
25 — — ns XT oscillator
50 — — ns LP oscillator
15 — — ns HS oscillator
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
3
344
1
2
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
CLKOUT
PIC16C6X
DS30234E-page 166 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 15-3: CLKOUT AND I/O TIMING
TABLE 15-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1 to CLKOUT —1530nsNote 1
11* TosH2ckH OSC1 to CLKOUT —1530nsNote 1
12* TckR CLKOUT rise time — 5 15 ns Note 1
13* TckF CLKOUT fall time — 5 15 ns Note 1
14* TckL2ioV CLKOUT to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT 0.25TCY + 25 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT 0——nsNote 1
17* TosH2ioV OSC1 (Q1 cycle) to Port out valid — — 80 - 100 ns
18* TosH2ioI OSC1 (Q2 cycle) to Port input invalid
(I/O in hold time)
TBD — — ns
19* TioV2osH Port input valid to OSC1(I/O in setup
time)
TBD — — ns
20* TioR Port output rise time PIC16C61 — 10 25 ns
PIC16LC61 — — 60 ns
21* TioF Port output fall time PIC16C61 — 10 25 ns
PIC16LC61 — — 60 ns
22††* Tinp RB0/INT pin high or low time 20 — — ns
23††* Trbp RB7:RB4 change int high or low time 20 — — ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edges.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13 14
17
20, 21
19 18
15
11
12
16
old value new value
Note: Refer to Figure 15-1 for load conditions.
1997-2013 Microchip Technology Inc. DS30234E-page 167
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 15-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
TABLE 15-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
30*TmcL MCLR Pulse Width (low) 200 — — ns VDD = 5V, -40°C to +125°C
31*Twdt Watchdog Timer Time-out Period
(No Prescaler)
71833ms
VDD = 5V, -40°C to +125°C
32 Tost Oscillation Start-up Timer Period — 1024TOSC —TOSC = OSC1 period
33*Tpwrt Power-up Timer Period 28 72 132 ms VDD = 5V, -40°C to +125°C
34*TIOZ I/O Hi-impedance from MCLR Low — — 100 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 15-1 for load conditions.
PIC16C6X
DS30234E-page 168 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 15-5: TIMER0 EXTERNAL CLOCK TIMINGS
TABLE 15-5: TIMER0 EXTERNAL CLOCK REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
40*Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
41*Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42*Tt0P T0CKI Period No Prescaler TCY + 40 — — ns N = prescale value
(2, 4, ..., 256)
With Prescaler Greater of:
20 ns or
TCY + 40
N
——ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 15-1 for load conditions.
41
42
40
RA4/T0CKI
TMR0
w
1997-2013 Microchip Technology Inc. DS30234E-page 169
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
16.0 DC AND AC
CHARACTERISTICS GRAPHS
AND TABLES FOR PIC16C61
The graphs and tables provided in this section are for
design guidance and are not tested or guaranteed.
In some graphs or tables the data presented are
outside specified operating range (i.e., outside
specified VDD range). This is for information only
and devices are guaranteed to operate properly
only within the specified range.
Note: The data presented in this section is a sta-
tistical summary of data collected on units
from different lots over a period of time and
matrix samples. 'Typical' represents the
mean of the distribution while 'max' or 'min'
represents (mean +3) and (mean -3)
respectively where is standard deviation.
FIGURE 16-1: TYPICAL RC OSCILLATOR FREQUENCY vs. TEMPERATURE
TABLE 16-1: RC OSCILLATOR FREQUENCIES
The percentage variation indicated here is part to part variation due to normal process distribution. The variation indi-
cated is 3 standard deviation from average value for VDD = 5V.
Cext Rext Average
Fosc @ 5V, 25C
20 pF 4.7k 4.52 MHz 17.35%
10k 2.47 MHz 10.10%
100k 290.86 kHz 11.90%
100 pF 3.3k 1.92 MHz 9.43%
4.7k 1.48 MHz 9.83%
10k 788.77 kHz 10.92%
100k 88.11 kHz 16.03%
300 pF 3.3k 726.89 kHz 10.97%
4.7k 573.95 kHz 10.14%
10k 307.31 kHz 10.43%
100k 33.82 kHz 11.24%
FOSC
FOSC (25C)
1.050
1.025
1.00
0.975
0.950
0.925
0.900
0.875
010 20253040506070
T (C)
Frequency Normalized TO +25C
VDD = 5.5V
VDD = 3.5V
REXT 10 k
CEXT = 100 pF
0.850
PIC16C6X
DS30234E-page 170 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 16-2: TYPICAL RC OSCILLATOR
FREQUENCY VS. VDD
FIGURE 16-3: TYPICAL RC OSCILLATOR
FREQUENCY VS. VDD
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
Fosc (MHz)
R = 10k
R = 100k
R = 4.7k
Cext = 20 pF, T = 25C
VDD (Volts)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Fosc (MHz)
R = 10k
R = 4.7k
R = 3.3k
Cext = 100 pF, T = 25C
R = 100k
VDD (Volts)
FIGURE 16-4: TYPICAL RC OSCILLATOR
FREQUENCY VS. VDD
FIGURE 16-5: TYPICAL IPD VS. VDD
WATCHDOG TIMER
DISABLED 25C
3.0 3.5 4.0 4.5 5.0 5.5 6.0
Fosc (MHz)
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
R = 100k
R = 10k
R = 3.3k
R = 4.7k
Cext = 300 pF, T = 25C
VDD (Volts)
0.6
0.5
0.4
0.3
0.2
0.1
0.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (A)
VDD (Volts)
Data based on matrix samples. See first page of this section for details.
1997-2013 Microchip Technology Inc. DS30234E-page 171
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 16-6: TYPICAL IPD VS. VDD
WATCHDOG TIMER ENABLED
25C
14
12
10
8
6
4
2
0
3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
IPD (A)
FIGURE 16-7: MAXIMUM IPD VS. VDD
WATCHDOG DISABLED
3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
0C
-55C
-40C
70C
85C
125C
IPD (A)
25
20
15
10
5
0
Data based on matrix samples. See first page of this section for details.
PIC16C6X
DS30234E-page 172 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 16-8: MAXIMUM IPD VS. VDD
WATCHDOG ENABLED*
*IPD, with Watchdog Timer enabled, has two compo-
nents: The leakage current which increases with higher
temperature and the operating current of the Watchdog
Timer logic which increases with lower temperature. At
-40C, the latter dominates explaining the apparently
anomalous behavior.
45
3.0
-55C
40
35
30
25
20
15
10
5
0
3.5 4.0 4.5 5.0 5.5 6.0
VDD (Volts)
IPD (A)
-40C
125C
0C
70C
85C
FIGURE 16-9: VTH (INPUT THRESHOLD
VOLTAGE) OF I/O PINS VS.
VDD
VDD (Volts)
0.80
1.00
1.20
1.40
1.60
1.80
2.00
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
0.60
Max (-40C to 85C)
VTH (Volts)
25C, Typ
Min (-40C to 85C)
Data based on matrix samples. See first page of this section for details.
1997-2013 Microchip Technology Inc. DS30234E-page 173
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 16-10: VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) VS. VDD
FIGURE 16-11: VTH (INPUT THRESHOLD VOLTAGE) OF OSC1 INPUT (IN XT, HS, AND LP MODES)
VS. VDD
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VIH, Max (-40C to 85C)
VIH, Min (-40C to 85C)
VIH, Typ (25C)
VIH, VIL (Volts)
VIL, Max (-40C to 85C)
VIL, Min (-40C to 85C)
VIL, Typ (25C)
VDD (Volts)
These pins have Schmitt Trigger input buffers.
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
Max (-40C to 85C)
Min (-40C to 85C)
Ty p (2 5 C)
VTH (Volts)
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
VDD (Volts)
Data based on matrix samples. See first page of this section for details.
PIC16C6X
DS30234E-page 174 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 16-12: TYPICAL IDD VS. FREQUENCY (EXTERNAL CLOCK, 25C)
FIGURE 16-13: MAXIMUM IDD VS. FREQUENCY (EXTERNAL CLOCK, -40 TO +85C)
1
10
100
1,000
10,000
10,000 100,000 1,000,000 10,000,000 100,000,000
IDD (A)
Frequency (Hz)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
10
100
1,000
10,000
10,000 100,000 1,000,000 10,000,000 100,000,000
IDD (A)
Frequency (Hz)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
Data based on matrix samples. See first page of this section for details.
1997-2013 Microchip Technology Inc. DS30234E-page 175
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 16-14: MAXIMUM IDD VS. FREQUENCY (EXTERNAL CLOCK, -55 TO +125C)
10
100
1,000
10,000
10,000 100,000 1,000,000 10,000,000 100,000,000
IDD (A)
Frequency (Hz)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
FIGURE 16-15: WDT TIMER TIME-OUT
PERIOD VS. VDD
50
45
40
35
30
25
20
15
10
5234567
VDD (Volts)
WDT period (ms)
Max. 85C
Max. 70C
Typ. 2 5C
Min. 0C
Min. -40C
FIGURE 16-16: TRANSCONDUCTANCE (gm)
OF HS OSCILLATOR VS. VDD
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
234567
VDD (Volts)
gm (A/V)
Max. -40C
Typ. 25 C
MIn. 85C
Data based on matrix samples. See first page of this section for details.
Mm
5c
w
5c
PIC16C6X
DS30234E-page 176 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 16-17: TRANSCONDUCTANCE (gm)
OF LP OSCILLATOR VS. VDD
FIGURE 16-18: TRANSCONDUCTANCE (gm)
OF XT OSCILLATOR VS. VDD
225
3.0
VDD (Volts)
gm (A/V)
200
175
150
125
100
75
50
25
0
3.5 4.0 4.5 5.0 5.5 6.0
Max. -40C
Ty p. 2 5 C
MIn. 85C
2500
200
1500
100
500
0
23 4 567
VDD (Volts)
gm (A/V)
Max. -40C
Ty p. 25C
MIn. 85C
FIGURE 16-19: IOH VS. VOH, VDD = 3V
FIGURE 16-20: IOH VS. VOH, VDD = 5V
0
-5
-10
-15
-20
-25
0 0.5 1.0 1.5 2.0 2.5 3.0
VOH (Volts)
IOH (mA)
Max. -40C
Typ. 25 C
MIn. 85C
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VOH (Volts)
IOH (mA)
Min @ 85C
Typ @ 2 5C
Max @ -40C
Data based on matrix samples. See first page of this section for details.
1997-2013 Microchip Technology Inc. DS30234E-page 177
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 16-21: IOL VS. VOL, VDD = 3V
35
30
25
20
15
10
5
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VOL (Volts)
IOL (mA)
Min @ -40C
Typ @ 25C
Min @ +85C
FIGURE 16-22: IOL VS. VOL, VDD = 5V
Min @ -40C
80
90
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VOL (Volts)
IOL (mA)
Min @ +85C
Ty p @ 25C
TABLE 16-2: INPUT CAPACITANCE*
Pin Name Typical Capacitance (pF)
18L PDIP 18L SOIC
RA port 5.0 4.3
RB port 5.0 4.3
MCLR 17.0 17.0
OSC1/CLKIN 4.0 3.5
OSC2/CLKOUT 4.3 3.5
T0CKI 3.2 2.8
*All capacitance values are typical at 25C. A part to part variation of 25% (three standard deviations) should be
taken into account.
Data based on matrix samples. See first page of this section for details.
PIC16C6X
DS30234E-page 178 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
NOTES:
1997-2013 Microchip Technology Inc. DS30234E-page 179
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
17.0 ELECTRICAL CHARACTERISTICS FOR PIC16C62/64
Absolute Maximum Ratings †
Ambient temperature under bias...............................................................................................................-55°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS (Note 2)............................................................................................... 0V to +14V
Voltage on RA4 with respect to Vss ............................................................................................................... 0V to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byPORTA, PORTB, and PORTE* (combined) ................................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE* (combined) ...........................................................200 mA
Maximum current sunk by PORTC and PORTD* (combined)...............................................................................200 mA
Maximum current sourced by PORTC and PORTD* (combined) .........................................................................200 mA
* PORTD and PORTE not available on the PIC16C62.
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
Note 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus,
a series resistor of 50-100 should be used when applying a “low” level to the MCLR pin rather than pulling
this pin directly to VSS.
TABLE 17-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC PIC16C62-04
PIC16C64-04
PIC16C62-10
PIC16C64-10
PIC16C62-20
PIC16C64-20
PIC16LC62-04
PIC16LC64-04 JW Devices
RC VDD: 4.0V to 6.0V
IDD: 3.8 mA max. at 5.5V
IPD: 21 A max. at 4V
Freq:4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.0 mA typ. at 5.5V
IPD:1.5 A typ. at 4V
Freq:4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.0 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq:4 MHz max.
VDD: 3.0V to 6.0V
IDD: 3.8 mA max. at 3.0V
IPD: 13.5 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 3.8 mA max. at 5.5V
IPD: 21 A max. at 4V
Freq:4 MHz max.
XT VDD: 4.0V to 6.0V
IDD: 3.8 mA max. at 5.5V
IPD: 21 A max. at 4V
Freq:4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.0 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq:4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.0 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq:4 MHz max.
VDD: 3.0V to 6.0V
IDD: 3.8 mA max. at 3.0V
IPD: 13.5 A max. at 3.0V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 3.8 mA max. at 5.5V
IPD: 21 A max. at 4V
Freq:4 MHz max.
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for
use in HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at 5.5V IDD: 15 mA max. at 5.5V IDD: 30 mA max. at 5.5V IDD: 30 mA max. at 5.5V
IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V
Freq:4 MHz max. Freq: 10 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP VDD: 4.0V to 6.0V
IDD: 52.5 A typ.
at 32 kHz, 4.0V
IPD:0.9 A typ. at 4.0V
Freq:200 kHz max.
Not recommended for
use in LP mode
Not recommended for
use in LP mode
VDD: 3.0V to 6.0V
IDD: 48 A max.
at 32 kHz, 3.0V
IPD: 13.5 A max. at 3.0V
Freq:200 kHz max.
VDD: 3.0V to 6.0V
IDD: 48 A max.
at 32 kHz, 3.0V
IPD:13.5 A max. at 3.0V
Freq:200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recommended
that the user select the device type that ensures the specifications required.
PIC16C6X
DS30234E-page 180 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
17.1 DC Characteristics: PIC16C62/64-04 (Commercial, Industrial)
PIC16C62/64-10 (Commercial, Industrial)
PIC16C62/64-20 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage VDD 4.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-
on Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on
Reset signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D010
D013
Supply Current
(Note 2, 5)
IDD -
-
2.7
13.5
5.0
30
mA
mA
XT, RC, osc configuration
FOSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
FOSC = 20 MHz, VDD = 5.5V
D020
D021
D021A
Power-down Current
(Note 3, 5)
IPD -
-
-
10.5
1.5
1.5
42
21
24
A
A
A
VDD = 4.0V, WDT enabled, -40C to +85C
VDD = 4.0V, WDT disabled, -0C to +70C
VDD = 4.0V, WDT disabled, -40C to +85C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
1997-2013 Microchip Technology Inc. DS30234E-page 181
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
17.2 DC Characteristics: PIC16LC62/64-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 3.0 - 6.0 V LP, XT, RC osc configuration (DC - 4 MHz)
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-
on Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D010
D010A
Supply Current
(Note 2, 5)
IDD -
-
2.0
22.5
3.8
48
mA
A
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D020
D021
D021A
Power-down Current
(Note 3, 5)
IPD -
-
-
7.5
0.9
0.9
30
13.5
18
A
A
A
VDD = 3.0V, WDT enabled, -40C to +85C
VDD = 3.0V, WDT disabled, 0C to +70C
VDD = 3.0V, WDT disabled, -40C to +85C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
u
PIC16C6X
DS30234E-page 182 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
17.3 DC Characteristics: PIC16C62/64-04 (Commercial, Industrial)
PIC16C62/64-10 (Commercial, Industrial)
PIC16C62/64-20 (Commercial, Industrial)
PIC16LC62/64-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 17.1
and Section 17.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
Input Low Voltage
I/O ports VIL
D030
D030A
with TTL buffer VSS
VSS
-
-
0.15VDD
0.8V
V
V
For entire VDD range
4.5V VDD 5.5V
D031 with Schmitt Trigger buffer VSS -0.2VDD V
D032 MCLR, OSC1 (in RC mode) Vss - 0.2VDD V
D033 OSC1 (in XT, HS and LP) Vss - 0.3VDD V Note1
Input High Voltage
I/O ports VIH
D040 with TTL buffer 2.0 - VDD V4.5V VDD 5.5V
D040A 0.25VDD
+ 0.8V
-VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8VDD -VDD For entire VDD range
D042 MCLR 0.8VDD -VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD -VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD -VDD V
D070 PORTB weak pull-up current IPURB 50 200 400 AVDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL --1AVss VPIN VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - 5AVss VPIN VDD
D063 OSC1 - - 5AVss VPIN VDD, XT, HS and
LP osc configuration
Output Low Voltage
D080 I/O ports VOL --0.6VIOL = 8.5 mA, VDD = 4.5V,
-40C to +85C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40C to +85C
Output High Voltage
D090 I/O ports (Note 3) VOH VDD-0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40C to +85C
D092 OSC2/CLKOUT (RC osc config) VDD-0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40C to +85C
D150* Open-Drain High Voltage VOD - - 14 V RA4 pin
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified lev-
els represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as current sourced by the pin.
1997-2013 Microchip Technology Inc. DS30234E-page 183
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Capacitive Loading Specs on Output
Pins
D100 OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes
when external clock is used to
drive OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO - - 50 pF
D102 SCL, SDA in I2C mode Cb - - 400 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 17.1
and Section 17.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified lev-
els represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as current sourced by the pin.
Timing Parameter Symbology
Load sandman 1 Load common 2
M
T
43w 0
PIC16C6X
DS30234E-page 184 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
17.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 17-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
HHigh RRise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
I2C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition
STA START condition
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL= 464
CL= 50 pF for all pins except OSC2/CLKOUT
but including D and E outputs as ports
15 pF for OSC2 output
Load condition 1 Load condition 2
Note 1: PORTD and PORTE are not imple-
mented on the PIC16C62.
Timin Dia rams ands ecificalions
1997-2013 Microchip Technology Inc. DS30234E-page 185
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
17.5 Timing Diagrams and Specifications
FIGURE 17-2: EXTERNAL CLOCK TIMING
TABLE 17-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1)
DC — 4 MHz XT and RC osc mode
DC — 4 MHz HS osc mode (-04)
DC — 10 MHz HS osc mode (-10)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1)
DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4 — 20 MHz HS osc mode
5 — 200 kHz LP osc mode
1ToscExternal CLKIN Period
(Note 1)
250 — — ns XT and RC osc mode
250 — — ns HS osc mode (-04)
100 — — ns HS osc mode (-10)
50 — — ns HS osc mode (-20)
5— — s LP osc mode
Oscillator Period
(Note 1)
250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 250 ns HS osc mode (-04)
100 — 250 ns HS osc mode (-10)
50 — 1,000 ns HS osc mode (-20)
5— — s LP osc mode
2T
CY Instruction Cycle Time (Note 1) 200 TCY DC ns TCY = 4/FOSC
3TosL,
TosH
External Clock in (OSC1) High
or Low Time
100 — — ns XT oscillator
2.5 — — s LP oscillator
15 — — ns HS oscillator
4TosR,
TosF
External Clock in (OSC1) Rise
or Fall Time
— — 25 ns XT oscillator
— — 50 ns LP oscillator
— — 15 ns HS oscillator
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
3
344
1
2
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
CLKOUT
PIC16C6X
DS30234E-page 186 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 17-3: CLKOUT AND I/O TIMING
TABLE 17-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameters Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1 to CLKOUT — 75 200 ns Note 1
11* TosH2ckH OSC1 to CLKOUT — 75 200 ns Note 1
12* TckR CLKOUT rise time — 35 100 ns Note 1
13* TckF CLKOUT fall time — 35 100 ns Note 1
14* TckL2ioV CLKOUT to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT T
OSC + 200 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT 0——nsNote 1
17* TosH2ioV OSC1 (Q1 cycle) to Port out valid — 50 150 ns
18* TosH2ioI OSC1 (Q2 cycle) to Port
input invalid (I/O in hold time)
PIC16C62/64 100 — — ns
PIC16LC62/64 200 — — ns
19* TioV2osH Port input valid to OSC1
(I/O in setup time)
0——ns
20* TioR Port output rise time PIC16C62/64 — 10 40 ns
PIC16LC62/64 — — 80 ns
21* TioF Port output fall time PIC16C62/64 — 10 40 ns
PIC16LC62/64 — — 80 ns
22††* Tinp INT pin high or low time TCY ——ns
23††* Trbp RB7:RB4 change INT high or low time TCY ——ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edge.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13 14
17
20, 21
19 18
15
11
12
16
old value new value
Note: Refer to Figure 17-1 for load conditions.
1997-2013 Microchip Technology Inc. DS30234E-page 187
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 17-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
TABLE 17-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
30* TmcL MCLR Pulse Width (low) 100 — — ns VDD = 5V, -40°C to +85°C
31* Twdt Watchdog Timer Time-out Period
(No Prescaler)
71833ms
VDD = 5V, -40°C to +85°C
32 Tost Oscillation Start-up Timer Period — 1024TOSC ——
TOSC = OSC1 period
33* Tpwrt Power-up Timer Period 28 72 132 ms VDD = 5V, -40°C to +85°C
34* TIOZ I/O Hi-impedance from MCLR Low — — 100 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 17-1 for load conditions.
K‘
Kl
T’ i }#
%%H%
L 7;%
‘w
L7 4’} ‘ ‘ 1
1k 4;
PIC16C6X
DS30234E-page 188 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 17-5: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 17-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42* Tt0P T0CKI Period No Prescaler TCY + 40 — — ns
With Prescaler Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
46* Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
47* Tt1P T1CKI input period Synchronous PIC16C6X Greater of:
30 OR TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
PIC16LC6X Greater of:
50 OR TCY + 40
N
N = prescale value
(1, 2, 4, 8)
Asynchronous PIC16C6X 60 — — ns
PIC16LC6X 100 — — ns
Ft1 Timer1 oscillator input frequency range
(oscillator enabled by setting bit T1OSCEN)
DC — 200 kHz
48 TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 17-1 for load conditions.
RA4/T0CKI
RC0/T1OSI/T1CKI
TMR0 or
TMR1
46
47
45
48
41
42
40
\\\\\\\\\\\\H
a %—*\
*Q:
f
am +AD
1997-2013 Microchip Technology Inc. DS30234E-page 189
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 17-6: CAPTURE/COMPARE/PWM TIMINGS (CCP1)
TABLE 17-6: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
50* TccL CCP1
input low time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C62/64 10 — — ns
PIC16LC62/64 20 — — ns
51* TccH CCP1
input high time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C62/64 10 — — ns
PIC16LC62/64 20 — — ns
52* TccP CCP1 input period 3TCY + 40
N
— — ns N = prescale value
(1,4 or 16)
53 TccR CCP1 output rise time PIC16C62/64 —1025ns
PIC16LC62/64 —2545ns
54 TccF CCP1 output fall time PIC16C62/64 —1025ns
PIC16LC62/64 —2545ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 17-1 for load conditions.
RC2/CCP1
(Capture Mode)
50 51
52
RC2/CCP1
53 54
PWM Mode)
(Compare or
\ U
PIC16C6X
DS30234E-page 190 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 17-7: PARALLEL SLAVE PORT TIMING (PIC16C64)
TABLE 17-7: PARALLEL SLAVE PORT REQUIREMENTS (PIC16C64)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
62 TdtV2wrH Data in valid before WR or CS (setup time) 20 — — ns
63* TwrH2dtI WR or CS to data–in invalid
(hold time)
PIC16C64 20 — — ns
PIC16LC64 35 — — ns
64 TrdL2dtV RD and CS to data–out valid — — 80 ns
65 TrdH2dtI RD or CS to data–out invalid 10 — 30 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 17-1 for load conditions
RE2/CS
RE0/RD
RE1/WR
RD7:RD0
62
63
64
65
dex
1997-2013 Microchip Technology Inc. DS30234E-page 191
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 17-8: SPI MODE TIMING
TABLE 17-8: SPI MODE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
70 TssL2scH,
TssL2scL
SS to SCK or SCK input TCY ——ns
71 TscH SCK input high time (slave mode) TCY + 20 — — ns
72 TscL SCK input low time (slave mode) TCY + 20 — — ns
73 TdiV2scH,
TdiV2scL
Setup time of SDI data input to SCK
edge
50 — — ns
74 TscH2diL,
TscL2diL
Hold time of SDI data input to SCK
edge
50 — — ns
75 TdoR SDO data output rise time — 10 25 ns
76 TdoF SDO data output fall time — 10 25 ns
77 TssH2doZ SS to SDO output hi-impedance 10 — 50 ns
78 TscR SCK output rise time (master mode) — 10 25 ns
79 TscF SCK output fall time (master mode) — 10 25 ns
80 TscH2doV,
TscL2doV
SDO data output valid after SCK
edge
— — 50 ns
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 17-1 for load conditions
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76 77
78
79
80
79
78
3’ /§2;i
PIC16C6X
DS30234E-page 192 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 17-9: I2C BUS START/STOP BITS TIMING
TABLE 17-9: I2C BUS START/STOP BITS REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ Max Units Conditions
90 TSU:STA START condition 100 kHz mode 4700 — — ns Only relevant for repeated START
condition
Setup time 400 kHz mode 600 — —
91 THD:STA START condition 100 kHz mode 4000 — — ns After this period the first clock
pulse is generated
Hold time 400 kHz mode 600 — —
92 TSU:STO STOP condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
93 THD:STO STOP condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
Note: Refer to Figure 17-1 for load conditions
SCL
SDA
START
Condition
STOP
Condition
90
91
92
93
1997-2013 Microchip Technology Inc. DS30234E-page 193
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 17-10: I2C BUS DATA TIMING
TABLE 17-10: I2C BUS DATA REQUIREMENTS
Parameter
No.
Sym Characteristic Min Max Units Conditions
100 THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
101 TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
102 TRSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10 to 400 pF
103 TFSDA and SCL fall time 100 kHz mode — 300 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10 to 400 pF
90 TSU:STA START condition
setup time
100 kHz mode 4.7 — s Only relevant for repeated
START condition
400 kHz mode 0.6 — s
91 THD:STA START condition hold
time
100 kHz mode 4.0 — s After this period the first clock
pulse is generated
400 kHz mode 0.6 — s
106 THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
107 TSU:DAT Data input setup time 100 kHz mode 250 — ns Note 2
400 kHz mode 100 — ns
92 TSU:STO STOP condition setup
time
100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
109 TAA Output valid from
clock
100 kHz mode — 3500 ns Note 1
400 kHz mode — — ns
110 TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission can
start
400 kHz mode 1.3 — s
Cb Bus capacitive loading — 400 pF
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement
tsu;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the
SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
TR max. + tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line is
released.
Note: Refer to Figure 17-1 for load conditions
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
PIC16C6X
DS30234E-page 194 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
NOTES:
55v
5v
1997-2013 Microchip Technology Inc. DS30234E-page 195
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
18.0 ELECTRICAL CHARACTERISTICS FOR PIC16C62A/R62/64A/R64
Absolute Maximum Ratings †
Ambient temperature under bias.............................................................................................................-55°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS (Note 2)............................................................................................... 0V to +14V
Voltage on RA4 with respect to Vss ................................................................................................................ 0V to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byPORTA, PORTB, and PORTE (combined)..................................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (combined) ............................................................200 mA
Maximum current sunk by PORTC and PORTD (combined) ................................................................................200 mA
Maximum current sourced by PORTC and PORTD (combined) ...........................................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
Note 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus,
a series resistor of 50-100 should be used when applying a “low” level to the MCLR pin rather than pulling
this pin directly to VSS.
TABLE 18-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC
PIC16C62A-04
PIC16CR62-04
PIC16C64A-04
PIC16CR64-04
PIC16C62A-10
PIC16CR62-10
PIC16C64A-10
PIC16CR64-10
PIC16C62A-20
PIC16CR62-20
PIC16C64A-20
PIC16CR64-20
PIC16LC62A-04
PIC16LCR62-04
PIC16LC64A-04
PIC16LCR64-04
JW Devices
RC VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq:4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.0 mA typ. at 5.5V
IPD:1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.0 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 6.0V
IDD: 3.8 mA max. at 3.0V
IPD: 5 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq:4 MHz max.
XT VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.0 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.0 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 6.0V
IDD: 3.8 mA max. at 3.0V
IPD: 5 A max. at 3.0V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for use
in HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at 5.5V IDD: 10 mA max. at 5.5V IDD: 20 mA max. at 5.5V IDD: 20 mA max. at 5.5V
IPD: 1.5 A typ. at 4.5V IPD:1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V IPD:1.5 A typ. at 4.5V
Freq: 4 MHz max. Freq: 10 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP VDD: 4.0V to 6.0V
IDD: 52.5 A typ.
at 32 kHz, 4.0V
IPD:0.9 A typ. at 4.0V
Freq: 200 kHz max.
Not recommended for
use in LP mode
Not recommended for
use in LP mode
VDD: 2.5V to 6.0V
IDD: 48 A max. at 32
kHz, 3.0V
IPD: 5 A max. at 3.0V
Freq: 200 kHz max.
VDD: 2.5V to 6.0V
IDD: 48 A max.
at 32 kHz, 3.0V
IPD: 5 A max. at 3.0V
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recommended
that the user select the device type that ensures the specifications required.
PIC16C6X
DS30234E-page 196 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
18.1 DC Characteristics: PIC16C62A/R62/64A/R64-04 (Commercial, Industrial, Extended)
PIC16C62A/R62/64A/R64-10 (Commercial, Industrial, Extended)
PIC16C62A/R62/64A/R64-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage VDD 4.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN bit in configuration word enabled
3.7 4.0 4.4 V Extended Range Only
D010
D013
D015*
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
IDD
IBOR
-
-
-
2.7
10
350
5
20
425
mA
mA
A
XT, RC, osc configuration FOSC = 4 MHz,
VDD = 5.5V (Note 4)
HS osc configuration FOSC = 20 MHz,
VDD = 5.5V
BOR enabled, VDD = 5.0V
D020
D021
D021A
D021B
D023*
Power-down Current (Note
3, 5)
Brown-out Reset Current
(Note 6)
IPD
IBOR
-
-
-
-
-
10.5
1.5
1.5
2.5
350
42
16
19
19
425
A
A
A
A
A
VDD = 4.0V, WDT enabled, -40C to +85C
VDD = 4.0V, WDT disabled, -0C to +70C
VDD = 4.0V, WDT disabled, -40C to +85C
VDD = 4.0V, WDT disabled, -40C to +125C
BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
1997-2013 Microchip Technology Inc. DS30234E-page 197
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
18.2 DC Characteristics: PIC16LC62A/R62/64A/R64-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 2.5 - 6.0 V LP, XT, RC osc configuration (DC - 4 MHz)
D002* RAM Data Retention Volt-
age (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN bit in configuration word enabled
D010
D010A
D015*
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
IDD
IBOR
-
-
-
2.0
22.5
350
3.8
48
425
mA
A
A
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
BOR enabled, VDD = 5.0V
D020
D021
D021A
D023*
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
IPD
IBOR
-
-
-
-
7.5
0.9
0.9
350
30
5
5
425
A
A
A
A
VDD = 3.0V, WDT enabled, -40C to +85C
VDD = 3.0V, WDT disabled, 0C to +70C
VDD = 3.0V, WDT disabled, -40C to +85C
BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be added
to the base IDD or IPD measurement.
PIC16C6X
DS30234E-page 198 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
18.3 DC Characteristics: PIC16C62A/R62/64A/R64-04 (Commercial, Industrial, Extended)
PIC16C62A/R62/64A/R64-10 (Commercial, Industrial, Extended)
PIC16C62A/R62/64A/R64-20 (Commercial, Industrial, Extended)
PIC16LC62A/R62/64A/R64-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 18.1 and
Section 18.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
Input Low Voltage
I/O ports VIL
D030
D030A
with TTL buffer Vss
VSS
-
-
0.15VDD
0.8V
V
V
For entire VDD range
4.5V VDD 5.5V
D031 with Schmitt Trigger buffer Vss - 0.2VDD V
D032 MCLR, OSC1 (in RC mode) Vss - 0.2VDD V
D033 OSC1 (in XT, HS and LP) Vss - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V4.5V VDD 5.5V
D040A 0.25VDD
+ 0.8V
-VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8VDD -VDD V For entire VDD range
D042 MCLR 0.8VDD -VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD -VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD -VDD V
D070 PORTB weak pull-up current IPURB 50 250 400 AVDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL --1AVss VPIN VDD, Pin at hi-imped-
ance
D061 MCLR, RA4/T0CKI - - 5AVss VPIN VDD
D063 OSC1 - - 5AVss VPIN VDD, XT, HS and LP
osc configuration
Output Low Voltage
D080 I/O ports VOL --0.6VIOL = 8.5 mA, VDD = 4.5V,
-40C to +85C
D080A - - 0.6 V IOL = 7.0 mA, VDD = 4.5V,
-40C to +125C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40C to +85C
D083A - - 0.6 V IOL = 1.2 mA, VDD = 4.5V,
-40C to +125C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified lev-
els represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as current sourced by the pin.
1997-2013 Microchip Technology Inc. DS30234E-page 199
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Output High Voltage
D090 I/O ports (Note 3) VOH VDD-0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40C to +85C
D090A VDD-0.7 - - V IOH = -2.5 mA, VDD = 4.5V,
-40C to +125C
D092 OSC2/CLKOUT (RC osc config) VDD-0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40C to +85C
D092A VDD-0.7 - - V IOH = -1.0 mA, VDD = 4.5V,
-40C to +125C
D150* Open-Drain High Voltage VOD - - 14 V RA4 pin
Capacitive Loading Specs on Out-
put Pins
D100 OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO - - 50 pF
D102 SCL, SDA in I2C mode Cb - - 400 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 18.1 and
Section 18.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified lev-
els represent normal operating conditions. Higher leakage current may be measured at different input voltages.
3: Negative current is defined as current sourced by the pin.
Timing Parameter Symbology
Load sandman 1
Load common 2
E
T
PIC16C6X
DS30234E-page 200 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
18.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 18-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
HHigh RRise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
I2C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition
STA START condition
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464
CL= 50 pF for all pins except OSC2/CLKOUT
but including D and E outputs as ports
15 pF for OSC2 output
Load condition 1 Load condition 2
Note 1: PORTD and PORTE are not
implemented on the
PIC16C62A/R62.
Timin Dia rams ands ecificalions
1997-2013 Microchip Technology Inc. DS30234E-page 201
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
18.5 Timing Diagrams and Specifications
FIGURE 18-2: EXTERNAL CLOCK TIMING
TABLE 18-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1) DC — 4 MHz XT and RC osc mode
DC — 4 MHz HS osc mode (-04)
DC — 10 MHz HS osc mode (-10)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1)
DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4 — 20 MHz HS osc mode
5 — 200 kHz LP osc mode
1ToscExternal CLKIN Period
(Note 1)
250 — — ns XT and RC osc mode
250 — — ns HS osc mode (-04)
100 — — ns HS osc mode (-10)
50 — — ns HS osc mode (-20)
5— —s LP osc mode
Oscillator Period
(Note 1)
250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 250 ns HS osc mode (-04)
100 — 250 ns HS osc mode (-10)
50 — 250 ns HS osc mode (-20)
5— —s LP osc mode
2T
CY Instruction Cycle Time (Note 1) 200 TCY DC ns TCY = 4/FOSC
3TosL,
TosH
External Clock in (OSC1) High or
Low Time
100 — — ns XT oscillator
2.5 — — s LP oscillator
15 — — ns HS oscillator
4TosR,
TosF
External Clock in (OSC1) Rise or
Fall Time
— — 25 ns XT oscillator
— — 50 ns LP oscillator
— — 15 ns HS oscillator
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
3
344
1
2
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
CLKOUT
PIC16C6X
DS30234E-page 202 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 18-3: CLKOUT AND I/O TIMING
TABLE 18-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameters Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1 to CLKOUT — 75 200 ns Note 1
11* TosH2ckH OSC1 to CLKOUT — 75 200 ns Note 1
12* TckR CLKOUT rise time — 35 100 ns Note 1
13* TckF CLKOUT fall time — 35 100 ns Note 1
14* TckL2ioV CLKOUT to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT Tosc + 200 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT 0——nsNote 1
17* TosH2ioV OSC1 (Q1 cycle) to Port out valid — 50 150 ns
18* TosH2ioI OSC1 (Q2 cycle) to Port input
invalid (I/O in hold time)
PIC16C62A/
R62/64A/R64
100 — — ns
PIC16LC62A/
R62/64A/R64
200 — — ns
19* TioV2osH Port input valid to OSC1(I/O in setup time) 0 — — ns
20* TioR Port output rise time PIC16C62A/
R62/64A/R64
—10 40 ns
PIC16LC62A/
R62/64A/R64
—— 80 ns
21* TioF Port output fall time PIC16C62A/
R62/64A/R64
—10 40 ns
PIC16LC62A/
R62/64A/R64
—— 80 ns
22††* Tinp RB0/INT pin high or low time TCY ——ns
23††* Trbp RB7:RB4 change int high or low time TCY ——ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edge.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19 18
15
11
12
16
old value new value
Note: Refer to Figure 18-1 for load conditions.
1997-2013 Microchip Technology Inc. DS30234E-page 203
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 18-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
FIGURE 18-5: BROWN-OUT RESET TIMING
TABLE 18-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
AND BROWN-OUT RESET REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2 — — sVDD = 5V, -40°C to +125°C
31* Twdt Watchdog Timer Time-out Period
(No Prescaler)
71833ms
VDD = 5V, -40°C to +125°C
32 Tost Oscillation Start-up Timer Period — 1024TOSC ——
TOSC = OSC1 period
33* Tpwrt Power-up Timer Period 28 72 132 ms VDD = 5V, -40°C to +125°C
34 TIOZ I/O Hi-impedance from MCLR Low
or WDT Reset
——2.1
s
35 TBOR Brown-out Reset Pulse Width 100 — — sVDD BVDD (param. D005)
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 18-1 for load conditions.
VDD
BVDD
35
PIC16C6X
DS30234E-page 204 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 18-6: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 18-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42* Tt0P T0CKI Period No Prescaler TCY + 40 — — ns
With Prescaler Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
46* Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
47* Tt1P T1CKI input period Synchronous PIC16C6X Greater of:
30 OR TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
PIC16LC6X Greater of:
50 OR TCY + 40
N
N = prescale value
(1, 2, 4, 8)
Asynchronous PIC16C6X 60 — — ns
PIC16LC6X 100 — — ns
Ft1 Timer1 oscillator input frequency range
(oscillator enabled by setting bit T1OSCEN)
DC — 200 kHz
48 TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 18-1 for load conditions.
46
47
45
48
41
42
40
RA4/T0CKI
RC0/T1OSO/T1CKI
TMR0 or
TMR1
am * an
1997-2013 Microchip Technology Inc. DS30234E-page 205
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 18-7: CAPTURE/COMPARE/PWM TIMINGS (CCP1)
TABLE 18-6: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
50* TccL CCP1
input low time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C62A/R62/
64A/R64
10 — — ns
PIC16LC62A/R62/
64A/R64
20 — — ns
51* TccH CCP1
input high time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C62A/R62/
64A/R64
10 — — ns
PIC16LC62A/R62/
64A/R64
20 — — ns
52* TccP CCP1 input period 3TCY + 40
N
— — ns N = prescale value
(1,4 or 16)
53* TccR CCP1 output rise time PIC16C62A/R62/
64A/R64
—1025ns
PIC16LC62A/R62/
64A/R64
—2545ns
54* TccF CCP1 output fall time PIC16C62A/R62/
64A/R64
—1025ns
PIC16LC62A/R62/
64A/R64
—2545ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 18-1 for load conditions.
RC2/CCP1
(Capture Mode)
50 51
52
RC2/CCP1
53 54
PWM Mode)
(Compare or
\ U
PIC16C6X
DS30234E-page 206 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 18-8: PARALLEL SLAVE PORT TIMING (PIC16C64A/R64)
TABLE 18-7: PARALLEL SLAVE PORT REQUIREMENTS (PIC16C64A/R64)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
62 TdtV2wrH Data in valid before WR or CS (setup time) 20 — — ns
25 — — ns Extended
Range Only
63* TwrH2dtI WR or CS to data–in invalid (hold
time)
PIC16C64A/R64 20 — — ns
PIC16LC64A.R64 35 — — ns
64 TrdL2dtV RD and CS to data–out valid — — 80 ns
——90 nsExtended
Range Only
65* TrdH2dtI RD or CS to data–out invalid 10 — 30 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 18-1 for load conditions
RE2/CS
RE0/RD
RE1/WR
RD7:RD0
62
63
64
65
dex
1997-2013 Microchip Technology Inc. DS30234E-page 207
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 18-9: SPI MODE TIMING
TABLE 18-8: SPI MODE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
70* TssL2scH,
TssL2scL
SS to SCK or SCK input TCY ——ns
71* TscH SCK input high time (slave mode) TCY + 20 — — ns
72* TscL SCK input low time (slave mode) TCY + 20 — — ns
73* TdiV2scH,
TdiV2scL
Setup time of SDI data input to SCK
edge
50 — — ns
74* TscH2diL,
TscL2diL
Hold time of SDI data input to SCK
edge
50 — — ns
75* TdoR SDO data output rise time — 10 25 ns
76* TdoF SDO data output fall time — 10 25 ns
77* TssH2doZ SS to SDO output hi-impedance 10 — 50 ns
78* TscR SCK output rise time (master mode) — 10 25 ns
79* TscF SCK output fall time (master mode) — 10 25 ns
80* TscH2doV,
TscL2doV
SDO data output valid after SCK
edge
— — 50 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 18-1 for load conditions
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76 77
7879
80
7978
3’ /§2;i
PIC16C6X
DS30234E-page 208 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 18-10: I2C BUS START/STOP BITS TIMING
TABLE 18-9: I2C BUS START/STOP BITS REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ Max Units Conditions
90* TSU:STA START condition 100 kHz mode 4700 — — ns Only relevant for repeated START
condition
Setup time 400 kHz mode 600 — —
91* THD:STA START condition 100 kHz mode 4000 — — ns After this period the first clock
pulse is generated
Hold time 400 kHz mode 600 — —
92* TSU:STO STOP condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
93* THD:STO STOP condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
*These parameters are characterized but not tested.
Note: Refer to Figure 18-1 for load conditions
SCL
SDA
START
Condition
STOP
Condition
90
91
92
93
1997-2013 Microchip Technology Inc. DS30234E-page 209
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 18-11: I2C BUS DATA TIMING
TABLE 18-10: I2C BUS DATA REQUIREMENTS
Parameter
No.
Sym Characteristic Min Max Units Conditions
100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
102* T
RSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
103* TFSDA and SCL fall time 100 kHz mode — 300 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
90* TSU:STA START condition
setup time
100 kHz mode 4.7 — s Only relevant for repeated
START condition
400 kHz mode 0.6 — s
91* THD:STA START condition hold
time
100 kHz mode 4.0 — s After this period the first clock
pulse is generated
400 kHz mode 0.6 — s
106* THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
107* TSU:DAT Data input setup time 100 kHz mode 250 — ns Note 2
400 kHz mode 100 — ns
92* TSU:STO STOP condition setup
time
100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
109* T
AA Output valid from
clock
100 kHz mode — 3500 ns Note 1
400 kHz mode — — ns
110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission can
start
400 kHz mode 1.3 — s
Cb Bus capacitive loading — 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement
tsu;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the
SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line is
released.
Note: Refer to Figure 18-1 for load conditions
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
PIC16C6X
DS30234E-page 210 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
NOTES:
5v
1997-2013 Microchip Technology Inc. DS30234E-page 211
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
19.0 ELECTRICAL CHARACTERISTICS FOR PIC16C65
Absolute Maximum Ratings †
Ambient temperature under bias...............................................................................................................-55°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS (Note 2)............................................................................................... 0V to +14V
Voltage on RA4 with respect to Vss ................................................................................................................ 0V to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byPORTA, PORTB, and PORTE (combined)..................................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (combined) ............................................................200 mA
Maximum current sunk by PORTC and PORTD (combined) ................................................................................200 mA
Maximum current sourced by PORTC and PORTD (combined) ...........................................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
Note 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus,
a series resistor of 50-100 should be used when applying a “low” level to the MCLR pin rather than pulling
this pin directly to VSS.
TABLE 19-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC PIC16C65-04 PIC16C65-10 PIC16C65-20 PIC16LC65-04 JW Devices
RC VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 21 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 3.0V to 6.0V
IDD: 3.8 mA max. at 3V
IPD: 800 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 21 A max. at 4V
Freq: 4 MHz max.
XT VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 21 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 3.0V to 6.0V
IDD: 3.8 mA max. at 3V
IPD: 800 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 21 A max. at 4V
Freq: 4 MHz max.
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for
use in HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at
5.5V
IDD: 15 mA max. at 5.5V IDD: 30 mA max. at
5.5V
IDD: 30 mA max. at 5.5V
IPD: 1.5 A typ. at 4.5V IPD 1.0 A typ. at 4.5V IPD:1.5 A typ. at 4.5V IPD:1.5 A typ. at 4.5V
Freq: 4 MHz max. Freq: 10 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP VDD: 4.0V to 6.0V
IDD: 52.5 A typ.
at 32 kHz, 4.0V
IPD: 0.9 A typ. at 4.0V
Freq: 200 kHz max.
Not recommended for
use in LP mode
Not recommended for
use in LP mode
VDD: 3.0V to 6.0V
IDD: 105 A max.
at 32 kHz, 3.0V
IPD: 800 A max. at
3.0V
Freq: 200 kHz max.
VDD: 3.0V to 6.0V
IDD: 105 A max.
at 32 kHz, 3.0V
IPD: 800 A max. at
3.0V
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recom-
mended that the user select the device type that ensures the specifications required.
PIC16C6X
DS30234E-page 212 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
19.1 DC Characteristics: PIC16C65-04 (Commercial, Industrial)
PIC16C65-10 (Commercial, Industrial)
PIC16C65-20 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C TA +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage VDD 4.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D010
D013
Supply Current (Note 2, 5) IDD -
-
2.7
13.5
5
30
mA
mA
XT, RC osc configuration
FOSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
FOSC = 20 MHz, VDD = 5.5V
D020
D021
D021A
Power-down Current
(Note 3, 5)
IPD -
-
-
10.5
1.5
1.5
800
800
800
A
A
A
VDD = 4.0V, WDT enabled,-40C to +85C
VDD = 4.0V, WDT disabled,-0C to +70C
VDD = 4.0V, WDT disabled,-40C to +85C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
1997-2013 Microchip Technology Inc. DS30234E-page 213
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
19.2 DC Characteristics: PIC16LC65-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 3.0 - 6.0 V LP, XT, RC osc configuration (DC - 4 MHz)
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D010
D010A
Supply Current (Note 2, 5) IDD -
-
2.0
22.5
3.8
105
mA
A
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 4.0V, WDT disabled
D020
D021
D021A
Power-down Current
(Note 3, 5)
IPD -
-
-
7.5
0.9
0.9
800
800
800
A
A
A
VDD = 3.0V, WDT enabled, -40C to +85C
VDD = 3.0V, WDT disabled, 0C to +70C
VDD = 3.0V, WDT disabled, -40C to +85C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
0 25mm +
PIC16C6X
DS30234E-page 214 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
19.3 DC Characteristics: PIC16C65-04 (Commercial, Industrial)
PIC16C65-10 (Commercial, Industrial)
PIC16C65-20 (Commercial, Industrial)
PIC16LC65-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 19.1 and
Section 19.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
Input Low Voltage
I/O ports VIL
D030
D030A
with TTL buffer VSS
VSS
-
-
0.15VDD
0.8V
V
V
For entire VDD range
4.5V VDD 5.5V
D031 with Schmitt Trigger buffer VSS -0.2VDD V
D032 MCLR, OSC1(in RC mode) Vss - 0.2VDD V
D033 OSC1 (in XT, HS and LP) Vss - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V4.5V VDD 5.5V
D040A 0.25VDD +
0.8V
-VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8VDD -VDD For entire VDD range
D042 MCLR 0.8VDD -VDD V
D042A OSC1 (XT, HS and LP) 0.7 VDD -VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD -VDD V
D070 PORTB weak pull-up current IPURB 50 250 400 AVDD = 5V, VPIN = VSS
Input Leakage Current
(Notes 2, 3)
D060 I/O ports IIL --1AVss VPIN VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - 5AVss VPIN VDD
D063 OSC1 - - 5AVss VPIN VDD, XT, HS, and
LP osc configuration
Output Low Voltage
D080 I/O ports VOL --0.6VIOL = 8.5 mA, VDD = 4.5V,
-40C to +85C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40C to +85C
Output High Voltage
D090 I/O ports (Note 3) VOH VDD-0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40C to +85C
D092 OSC2/CLKOUT (RC osc config) VDD-0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40C to +85C
D150* Open-Drain High Voltage VOD - - 14 V RA4 pin
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
1997-2013 Microchip Technology Inc. DS30234E-page 215
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Capacitive Loading Specs on
Output Pins
D100 OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO - - 50 pF
D102 SCL, SDA in I2C mode Cb - - 400 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 19.1 and
Section 19.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
Timing Parameter Symbology
Load sandman 1 Load common 2
u
XTL
PIC16C6X
DS30234E-page 216 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
19.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 19-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
HHigh RRise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
I2C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition
STA START condition
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL= 464
CL= 50 pF for all pins except OSC2/CLKOUT
but including D and E outputs as ports
15 pF for OSC2 output
Load condition 1 Load condition 2
Timin Dia rams ands ecificalions
1997-2013 Microchip Technology Inc. DS30234E-page 217
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
19.5 Timing Diagrams and Specifications
FIGURE 19-2: EXTERNAL CLOCK TIMING
TABLE 19-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1)
DC — 4 MHz XT and RC osc mode
DC — 4 MHz HS osc mode (-04)
DC — 10 MHz HS osc mode (-10)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1)
DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4 — 20 MHz HS osc mode
5 — 200 kHz LP osc mode
1ToscExternal CLKIN Period
(Note 1)
250 — — ns XT and RC osc mode
250 — — ns HS osc mode (-04)
100 — — ns HS osc mode (-10)
50 — — ns HS osc mode (-20)
5— —s LP osc mode
Oscillator Period
(Note 1)
250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 250 ns HS osc mode (-04)
100 — 250 ns HS osc mode (-10)
50 — 250 ns HS osc mode (-20)
5— —s LP osc mode
2T
CY Instruction Cycle Time (Note 1) 200 TCY DC ns TCY = 4/FOSC
3TosL,
TosH
External Clock in (OSC1) High or
Low Time
50 — — ns XT oscillator
2.5 — — s LP oscillator
15 — — ns HS oscillator
4TosR,
TosF
External Clock in (OSC1) Rise or
Fall Time
— — 25 ns XT oscillator
— — 50 ns LP oscillator
— — 15 ns HS oscillator
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
3
344
1
2
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
CLKOUT
PIC16C6X
DS30234E-page 218 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-3: CLKOUT AND I/O TIMING
TABLE 19-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1 to CLKOUT — 75 200 ns Note 1
11* TosH2ckH OSC1 to CLKOUT — 75 200 ns Note 1
12* TckR CLKOUT rise time — 35 100 ns Note 1
13* TckF CLKOUT fall time — 35 100 ns Note 1
14* TckL2ioV CLKOUT to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT 0.25TCY + 25 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT 0——nsNote 1
17* TosH2ioV OSC1 (Q1 cycle) to Port out valid — 50 150 ns
18* TosH2ioI OSC1 (Q2 cycle) to Port
input invalid (I/O in hold time)
PIC16C65 100 — — ns
PIC16LC65 200 — — ns
19* TioV2osH Port input valid to OSC1(I/O in setup time) 0 — — ns
20* TioR Port output rise time PIC16C65 — 10 25 ns
PIC16LC65 — — 60 ns
21* TioF Port output fall time PIC16C65 — 10 25 ns
PIC16LC65 — — 60 ns
22††* Tinp RB0/INT pin high or low time TCY ——ns
23††* Trbp RB7:RB4 change int high or low time TCY ——ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edge.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
Note: Refer to Figure 19-1 for load conditions.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19 18
15
11
12
16
old value new value
1997-2013 Microchip Technology Inc. DS30234E-page 219
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
TABLE 19-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
30* TmcL MCLR Pulse Width (low) 100 — — ns VDD = 5V, -40°C to +85°C
31* Twdt Watchdog Timer Time-out Period
(No Prescaler)
71833ms
VDD = 5V, -40°C to +85°C
32 Tost Oscillation Start-up Timer Period — 1024TOSC ——
TOSC = OSC1 period
33* Tpwrt Power-up Timer Period or WDT
reset
28 72 132 ms VDD = 5V, -40°C to +85°C
34 TIOZ I/O Hi-impedance from MCLR Low — — 100 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 19-1 for load conditions.
PIC16C6X
DS30234E-page 220 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-5: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 19-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42* Tt0P T0CKI Period No Prescaler TCY + 40 — — ns
With Prescaler Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
46* Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
47* Tt1P T1CKI input period Synchronous PIC16C6X Greater of:
30 OR TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
PIC16LC6X Greater of:
50 OR TCY + 40
N
N = prescale value
(1, 2, 4, 8)
Asynchronous PIC16C6X 60 — — ns
PIC16LC6X 100 — — ns
Ft1 Timer1 oscillator input frequency range
(oscillator enabled by setting bit T1OSCEN)
DC — 200 kHz
48 TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 19-1 for load conditions.
46
47
45
48
41
42
40
RA4/T0CKI
RC0/T1OSO/T1CKI
TMR0 or
TMR1
1997-2013 Microchip Technology Inc. DS30234E-page 221
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-6: CAPTURE/COMPARE/PWM TIMINGS (CCP1 AND CCP2)
TABLE 19-6: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1 AND CCP2)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
50* TccL CCP1 and CCP2
input low time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C65 10 — — ns
PIC16LC65 20 — — ns
51* TccH CCP1 and CCP2
input high time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C65 10 — — ns
PIC16LC65 20 — — ns
52* TccP CCP1 and CCP2 input period 3TCY + 40
N
— — ns N = prescale value
(1,4, or 16)
53 TccR CCP1 and CCP2 output rise time PIC16C65 — 10 25 ns
PIC16LC65 — 25 45 ns
54 TccF CCP1 and CCP2 output fall time PIC16C65 — 10 25 ns
PIC16LC65 — 25 45 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 19-1 for load conditions.
RC1/T1OSI/CCP2
and RC2/CCP1
(Capture Mode)
50 51
52
RC1/T1OSI/CCP2
and RC2/CCP1
53 54
PWM Mode)
(Compare or
\ U
PIC16C6X
DS30234E-page 222 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-7: PARALLEL SLAVE PORT TIMING
TABLE 19-7: PARALLEL SLAVE PORT REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
62 TdtV2wrH Data in valid before WR or CS (setup time) 20 — — ns
63* TwrH2dtI WR or CS to data–in invalid (hold
time)
PIC16C65 20 — — ns
PIC16LC65 35 — — ns
64 TrdL2dtV RD and CS to data–out valid — — 80 ns
65 TrdH2dtI RD or CS to data–out invalid 10 — 30 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 19-1 for load conditions
RE2/CS
RE0/RD
RE1/WR
RD7:RD0
62
63
64
65
dex
1997-2013 Microchip Technology Inc. DS30234E-page 223
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-8: SPI MODE TIMING
TABLE 19-8: SPI MODE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
70 TssL2scH,
TssL2scL
SS to SCK or SCK input TCY ——ns
71 TscH SCK input high time (slave mode) TCY + 20 — — ns
72 TscL SCK input low time (slave mode) TCY + 20 — — ns
73 TdiV2scH,
TdiV2scL
Setup time of SDI data input to SCK
edge
50 — — ns
74 TscH2diL,
TscL2diL
Hold time of SDI data input to SCK
edge
50 — — ns
75 TdoR SDO data output rise time — 10 25 ns
76 TdoF SDO data output fall time — 10 25 ns
77 TssH2doZ SS to SDO output hi-impedance 10 — 50 ns
78 TscR SCK output rise time (master mode) — 10 25 ns
79 TscF SCK output fall time (master mode) — 10 25 ns
80 TscH2doV,
TscL2doV
SDO data output valid after SCK
edge
— — 50 ns
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 19-1 for load conditions
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76 77
78
79
80
79
78
3’ /§2;i
PIC16C6X
DS30234E-page 224 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-9: I2C BUS START/STOP BITS TIMING
TABLE 19-9: I2C BUS START/STOP BITS REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ Max Units Conditions
90 TSU:STA START condition 100 kHz mode 4700 — — ns Only relevant for repeated START
condition
Setup time 400 kHz mode 600 — —
91 THD:STA START condition 100 kHz mode 4000 — — ns After this period the first clock
pulse is generated
Hold time 400 kHz mode 600 — —
92 TSU:STO STOP condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
93 THD:STO STOP condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
Note: Refer to Figure 19-1 for load conditions
91
92
SCL
SDA
START
Condition
STOP
Condition
90
93
1997-2013 Microchip Technology Inc. DS30234E-page 225
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-10: I2C BUS DATA TIMING
TABLE 19-10: I2C BUS DATA REQUIREMENTS
Parameter
No.
Sym Characteristic Min Max Units Conditions
100 THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 0.6 — s Devce must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
101 TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
102 TRSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
103 TFSDA and SCL fall time 100 kHz mode — 300 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
90 TSU:STA START condition
setup time
100 kHz mode 4.7 — s Only relevant for repeated
START condition
400 kHz mode 0.6 — s
91 THD:STA START condition hold
time
100 kHz mode 4.0 — s After this period the first clock
pulse is generated
400 kHz mode 0.6 — s
106 THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
107 TSU:DAT Data input setup time 100 kHz mode 250 — ns Note 2
400 kHz mode 100 — ns
92 TSU:STO STOP condition setup
time
100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
109 TAA Output valid from
clock
100 kHz mode — 3500 ns Note 1
400 kHz mode — — ns
110 TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission can
start
400 kHz mode 1.3 — s
Cb Bus capacitive loading — 400 pF
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement
tsu;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the
SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line is
released.
Note: Refer to Figure 19-1 for load conditions
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
PIC16C6X
DS30234E-page 226 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 19-11: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 19-11: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 19-12: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 19-12: USART SYNCHRONOUS RECEIVE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
120 TckH2dtV SYNC XMIT (MASTER & SLAVE)
Clock high to data out valid
PIC16C65 — — 80 ns
PIC16LC65 — — 100 ns
121 Tckrf Clock out rise time and fall time
(Master Mode)
PIC16C65 — — 45 ns
PIC16LC65 — — 50 ns
122 Tdtrf Data out rise time and fall time PIC16C65 — — 45 ns
PIC16LC65 — — 50 ns
†: Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
125 TdtV2ckL SYNC RCV (MASTER & SLAVE)
Data setup before CK (DT setup time) 15 — — ns
126 TckL2dtl Data hold after CK (DT hold time) 15 — — ns
†: Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 19-1 for load conditions
121
121
120 122
RC6/TX/CK
RC7/RX/DT
pin
pin
Note: Refer to Figure 19-1 for load conditions
125
126
RC6/TX/CK
RC7/RX/DT
pin
pin
5v
1997-2013 Microchip Technology Inc. DS30234E-page 227
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
20.0 ELECTRICAL CHARACTERISTICS FOR PIC16C63/65A
Absolute Maximum Ratings (†)
Ambient temperature under bias.............................................................................................................-55°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS (Note 2)............................................................................................... 0V to +14V
Voltage on RA4 with respect to Vss ................................................................................................................ 0V to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byPORTA, PORTB, and PORTE (Note 3) (combined)....................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (Note 3) (combined) ..............................................200 mA
Maximum current sunk by PORTC and PORTD (Note 3) (combined) ..................................................................200 mA
Maximum current sourced by PORTC and PORTD (Note 3) (combined) .............................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
Note 2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR/VPP pin rather
than pulling this pin directly to VSS.
Note 3: PORTD and PORTE not available on the PIC16C63.
TABLE 20-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC PIC16C63-04
PIC16C65A-04
PIC16C63-10
PIC16C65A-10
PIC16C63-20
PIC16C65A-20
PIC16LC63-04
PIC16LC65A-04 JW Devices
RC VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 6.0V
IDD: 3.8 mA max. at 3V
IPD: 5 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
XT VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 6.0V
IDD: 3.8 mA max. at 3V
IPD: 5 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for
use in HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at
5.5V
IDD: 10 mA max. at 5.5V IDD: 20 mA max. at 5.5V IDD: 20 mA max. at
5.5V
IPD: 1.5 A typ. at 4.5V IPD 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V
Freq: 4 MHz max. Freq: 10 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP VDD: 4.0V to 6.0V
IDD: 52.5 A typ.
at 32 kHz, 4.0V
IPD: 0.9 A typ. at 4.0V
Freq: 200 kHz max.
Not recommended for
use in LP mode
Not recommended for
use in LP mode
VDD: 2.5V to 6.0V
IDD: 48 A max. at 32
kHz, 3.0V
IPD: 5 A max. at 3.0V
Freq: 200 kHz max.
VDD: 2.5V to 6.0V
IDD: 48 A max.
at 32 kHz, 3.0V
IPD: 5 A max. at 3.0V
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recom-
mended that the user select the device type that ensures the specifications required.
PIC16C6X
DS30234E-page 228 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
20.1 DC Characteristics: PIC16C63/65A-04 (Commercial, Industrial, Extended)
PIC16C63/65A-10 (Commercial, Industrial, Extended)
PIC16C63/65A-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage VDD 4.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
3.7 4.0 4.4 V Extended Range Only
D010
D013
D015*
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
IDD
IBOR
-
-
-
2.7
10
350
5
20
425
mA
mA
A
XT, RC, osc config FOSC = 4 MHz,
VDD = 5.5V (Note 4)
HS osc config FOSC = 20 MHz, VDD = 5.5V
BOR enabled, VDD = 5.0V
D020
D021
D021A
D021B
D023*
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
IPD
IBOR
-
-
-
-
-
10.5
1.5
1.5
2.5
350
42
16
19
19
425
A
A
A
A
A
VDD = 4.0V, WDT enabled,-40C to +85C
VDD = 4.0V, WDT disabled,-0C to +70C
VDD = 4.0V, WDT disabled,-40C to +85C
VDD = 4.0V, WDT disabled,-40C to +125C
BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
1997-2013 Microchip Technology Inc. DS30234E-page 229
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
20.2 DC Characteristics: PIC16LC63/65A-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 2.5 - 6.0 V LP, XT, RC osc configuration (DC - 4 MHz)
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
D010
D010A
D015*
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
IDD
IBOR
-
-
-
2.0
22.5
350
3.8
48
425
mA
A
A
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
BOR enabled, VDD = 5.0V
D020
D021
D021A
D023*
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
IPD
IBOR
-
-
-
-
7.5
0.9
0.9
350
30
5
5
425
A
A
A
A
VDD = 3.0V, WDT enabled, -40C to +85C
VDD = 3.0V, WDT disabled, 0C to +70C
VDD = 3.0V, WDT disabled, -40C to +85C
BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
PIC16C6X
DS30234E-page 230 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
20.3 DC Characteristics: PIC16C63/65A-04 (Commercial, Industrial, Extended)
PIC16C63/65A-10 (Commercial, Industrial, Extended)
PIC16C63/65A-20 (Commercial, Industrial, Extended)
PIC16LC63/65A-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 20.1 and
Section 20.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
Input Low Voltage
I/O ports VIL
D030
D030A
with TTL buffer VSS
VSS
-
-
0.15VDD
0.8V
V
V
For entire VDD range
4.5V VDD 5.5V
D031 with Schmitt Trigger buffer VSS -0.2VDD V
D032 MCLR, OSC1 (in RC mode) Vss - 0.2VDD V
D033 OSC1 (in XT, HS and LP) Vss - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V4.5V VDD 5.5V
D040A 0.25VDD
+ 0.8V
-VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8VDD -VDD V For entire VDD range
D042 MCLR 0.8VDD -VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD -VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD -VDD V
D070 PORTB weak pull-up current IPURB 50 250 400 AVDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL --1A Vss VPIN VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - 5A Vss VPIN VDD
D063 OSC1 - - 5A Vss VPIN VDD, XT, HS and
LP osc configuration
Output Low Voltage
D080 I/O ports VOL --0.6VIOL = 8.5 mA, VDD = 4.5V,
-40C to +85C
D080A - - 0.6 V IOL = 7.0 mA, VDD = 4.5V,
-40C to +125C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40C to +85C
D083A - - 0.6 V IOL = 1.2 mA, VDD = 4.5V,
-40C to +125C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
1997-2013 Microchip Technology Inc. DS30234E-page 231
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Output High Voltage
D090 I/O ports (Note 3) VOH VDD-0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40C to +85C
D090A VDD-0.7 - - V IOH = -2.5 mA, VDD = 4.5V,
-40C to +125C
D092 OSC2/CLKOUT (RC osc config) VDD-0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40C to +85C
D092A VDD-0.7 - - V IOH = -1.0 mA, VDD = 4.5V,
-40C to +125C
D150* Open-Drain High Voltage VOD - - 14 V RA4 pin
Capacitive Loading Specs on Out-
put Pins
D100 OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO --50pF
D102 SCL, SDA in I2C mode Cb - - 400 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 20.1 and
Section 20.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
Timing Parameter Symbology
Load sandman 1 Load condmon 2
o
XTl
PIC16C6X
DS30234E-page 232 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
20.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 20-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
HHigh RRise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
I2C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition
STA START condition
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464
CL= 50 pF for all pins except OSC2/CLKOUT
but including D and E outputs as ports
15 pF for OSC2 output
Load condition 1 Load condition 2
Note 1: PORTD and PORTE are not imple-
mented on the PIC16C63.
Timin Dia rams ands ecificalions
1997-2013 Microchip Technology Inc. DS30234E-page 233
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
20.5 Timing Diagrams and Specifications
FIGURE 20-2: EXTERNAL CLOCK TIMING
TABLE 20-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1)
DC — 4 MHz XT and RC osc mode
DC — 4 MHz HS osc mode (-04)
DC — 10 MHz HS osc mode (-10)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1)
DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4 — 20 MHz HS osc mode
5 — 200 kHz LP osc mode
1ToscExternal CLKIN Period
(Note 1)
250 — — ns XT and RC osc mode
250 — — ns HS osc mode (-04)
100 — — ns HS osc mode (-10)
50 — — ns HS osc mode (-20)
5— — s LP osc mode
Oscillator Period
(Note 1)
250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 250 ns HS osc mode (-04)
100 — 250 ns HS osc mode (-10)
50 — 250 ns HS osc mode (-20)
5— — s LP osc mode
2T
CY Instruction Cycle Time (Note 1) 200 TCY DC ns TCY = 4/FOSC
3* TosL,
To s H
External Clock in (OSC1) High or
Low Time
100 — — ns XT oscillator
2.5 — — s LP oscillator
15 — — ns HS oscillator
4* TosR,
To s F
External Clock in (OSC1) Rise or
Fall Time
— — 25 ns XT oscillator
— — 50 ns LP oscillator
— — 15 ns HS oscillator
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
3
344
1
2
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
CLKOUT
PIC16C6X
DS30234E-page 234 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-3: CLKOUT AND I/O TIMING
TABLE 20-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1 to CLKOUT — 75 200 ns Note 1
11* TosH2ckH OSC1 to CLKOUT — 75 200 ns Note 1
12* TckR CLKOUT rise time — 35 100 ns Note 1
13* TckF CLKOUT fall time — 35 100 ns Note 1
14* TckL2ioV CLKOUT to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT Tosc + 200 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT 0——nsNote 1
17* TosH2ioV OSC1 (Q1 cycle) to Port out valid — 50 150 ns
18* TosH2ioI OSC1 (Q2 cycle) to Port input
invalid (I/O in hold time)
PIC16C63/65A 100 — — ns
PIC16LC63/65A 200 — — ns
19* TioV2osH Port input valid to OSC1(I/O in setup time) 0 — — ns
20* TioR Port output rise time PIC16C63/65A — 10 40 ns
PIC16LC63/65A — — 80 ns
21* TioF Port output fall time PIC16C63/65A — 10 40 ns
PIC16LC63/65A — — 80 ns
22††* Tinp INT pin high or low time TCY ——ns
23††* Trbp RB7:RB4 change INT high or low time TCY ——ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edge.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
Note: Refer to Figure 20-1 for load conditions.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19 18
15
11
12
16
old value new value
1997-2013 Microchip Technology Inc. DS30234E-page 235
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
FIGURE 20-5: BROWN-OUT RESET TIMING
TABLE 20-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
AND BROWN-OUT RESET REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2 — — sVDD = 5V, -40°C to +125°C
31* Twdt Watchdog Timer Time-out Period
(No Prescaler)
71833ms
VDD = 5V, -40°C to +125°C
32 Tost Oscillation Start-up Timer Period — 1024 TOSC ——
TOSC = OSC1 period
33* Tpwrt Power-up Timer Period 28 72 132 ms VDD = 5V, -40°C to +125°C
34 TIOZ I/O Hi-impedance from MCLR Low
or WDT reset
——2.1
s
35 TBOR Brown-out Reset Pulse Width 100 — — sVDD BVDD (D005)
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 20-1 for load conditions.
VDD
BVDD
35
\
‘ x H
L7 4.‘ .7 4"
‘ H ‘w
\
‘7 4.x
‘
‘ A
‘
\
‘ Hg"!
‘47 a“? 4“
\ ‘ \
\ x
57 4.,7
Tome
chma
m . 40
PIC16C6X
DS30234E-page 236 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-6: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 20-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42* Tt0P T0CKI Period No Prescaler TCY + 40 — — ns
With Prescaler Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
46* Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
47* Tt1P T1CKI input period Synchronous PIC16C6X Greater of:
30 OR TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
PIC16LC6X Greater of:
50 OR TCY + 40
N
N = prescale value
(1, 2, 4, 8)
Asynchronous PIC16C6X 60 — — ns
PIC16LC6X 100 — — ns
Ft1 Timer1 oscillator input frequency range
(oscillator enabled by setting bit T1OSCEN)
DC — 200 kHz
48 TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 20-1 for load conditions.
46
47
45
48
41
42
40
RA4/T0CKI
RC0/T1OSO/T1CKI
TMR0 or
TMR1
am +AU
1997-2013 Microchip Technology Inc. DS30234E-page 237
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-7: CAPTURE/COMPARE/PWM TIMINGS (CCP1 AND CCP2)
TABLE 20-6: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1 AND CCP2)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
50* TccL CCP1 and CCP2
input low time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C63/65A 10 — — ns
PIC16LC63/65A 20 — — ns
51* TccH CCP1 and CCP2
input high time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C63/65A 10 — — ns
PIC16LC63/65A 20 — — ns
52* TccP CCP1 and CCP2 input period 3TCY + 40
N
— — ns N = prescale value
(1,4, or 16)
53* TccR CCP1 and CCP2 output rise time PIC16C63/65A — 10 25 ns
PIC16LC63/65A — 25 45 ns
54* TccF CCP1 and CCP2 output fall time PIC16C63/65A — 10 25 ns
PIC16LC63/65A — 25 45 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 20-1 for load conditions.
RC1/T1OSI/CCP2
and RC2/CCP1
(Capture Mode)
50 51
52
RC1/T1OSI/CCP2
and RC2/CCP1
53 54
PWM Mode)
(Compare or
\ U
PIC16C6X
DS30234E-page 238 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-8: PARALLEL SLAVE PORT TIMING (PIC16C65A)
TABLE 20-7: PARALLEL SLAVE PORT REQUIREMENTS (PIC16C65A)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
62* TdtV2wrH Data in valid before WR or CS (setup time) 20 — — ns
25 — — ns Extended
Range Only
63* TwrH2dtI WR or CS to data–in invalid (hold
time)
PIC16C65A 20 — — ns
PIC16LC65A 35 — — ns
64 TrdL2dtV RD and CS to data–out valid — — 80 ns
— — 90 ns Extended
Range Only
65* TrdH2dtI RD or CS to data–out invalid 10 — 30 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 20-1 for load conditions
RE2/CS
RE0/RD
RE1/WR
RD7:RD0
62
63
64
65
dex
1997-2013 Microchip Technology Inc. DS30234E-page 239
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-9: SPI MODE TIMING
TABLE 20-8: SPI MODE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
70* TssL2scH,
TssL2scL
SS to SCK or SCK input TCY ——ns
71* TscH SCK input high time (slave mode) TCY + 20 — — ns
72* TscL SCK input low time (slave mode) TCY + 20 — — ns
73* TdiV2scH,
TdiV2scL
Setup time of SDI data input to SCK
edge
50 — — ns
74* TscH2diL,
TscL2diL
Hold time of SDI data input to SCK
edge
50 — — ns
75* TdoR SDO data output rise time — 10 25 ns
76* TdoF SDO data output fall time — 10 25 ns
77* TssH2doZ SS to SDO output hi-impedance 10 — 50 ns
78* TscR SCK output rise time (master mode) — 10 25 ns
79* TscF SCK output fall time (master mode) — 10 25 ns
80* TscH2doV,
TscL2doV
SDO data output valid after SCK
edge
— — 50 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 20-1 for load conditions
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76 77
78
79
80
79
78
3, /
PIC16C6X
DS30234E-page 240 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-10: I2C BUS START/STOP BITS TIMING
TABLE 20-9: I2C BUS START/STOP BITS REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ Max Units Conditions
90* TSU:STA START condition 100 kHz mode 4700 — — ns Only relevant for repeated START
condition
Setup time 400 kHz mode 600 — —
91* THD:STA START condition 100 kHz mode 4000 — — ns After this period the first clock
pulse is generated
Hold time 400 kHz mode 600 — —
92* TSU:STO STOP condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
93 THD:STO STOP condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
* These parameters are characterized but not tested.
Note: Refer to Figure 20-1 for load conditions
91
92
93
SCL
SDA
START
Condition
STOP
Condition
90
1997-2013 Microchip Technology Inc. DS30234E-page 241
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-11: I2C BUS DATA TIMING
TABLE 20-10: I2C BUS DATA REQUIREMENTS
Parameter
No.
Sym Characteristic Min Max Units Conditions
100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
102* T
RSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
103* TFSDA and SCL fall time 100 kHz mode — 300 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
90* TSU:STA START condition
setup time
100 kHz mode 4.7 — s Only relevant for repeated
START condition
400 kHz mode 0.6 — s
91* THD:STA START condition hold
time
100 kHz mode 4.0 — s After this period the first clock
pulse is generated
400 kHz mode 0.6 — s
106* THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
107* TSU:DAT Data input setup time 100 kHz mode 250 — ns Note 2
400 kHz mode 100 — ns
92* TSU:STO STOP condition setup
time
100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
109* T
AA Output valid from
clock
100 kHz mode — 3500 ns Note 1
400 kHz mode — — ns
110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission can
start
400 kHz mode 1.3 — s
Cb Bus capacitive loading — 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement
Tsu:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of
the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA
line TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line
is released.
Note: Refer to Figure 20-1 for load conditions
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
swc xmr MASTER & SLAVE
PIC16C6X
DS30234E-page 242 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 20-12: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 20-11: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 20-13: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 20-12: USART SYNCHRONOUS RECEIVE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
120* TckH2dtV SYNC XMIT (MASTER & SLAVE)
Clock high to data out valid
PIC16C63/65A — — 80 ns
PIC16LC63/65A — — 100 ns
121* Tckrf Clock out rise time and fall time
(Master Mode)
PIC16C63/65A — — 45 ns
PIC16LC63/65A — — 50 ns
122* Tdtrf Data out rise time and fall time PIC16C63/65A — — 45 ns
PIC16LC63/65A — — 50 ns
* These parameters are characterized but not tested.
†: Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
125* TdtV2ckL SYNC RCV (MASTER & SLAVE)
Data setup before CK (DT setup time) 15 — — ns
126* TckL2dtl Data hold after CK (DT hold time) 15 — — ns
* These parameters are characterized but not tested.
†: Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 20-1 for load conditions
121 121
120 122
RC6/TX/CK
RC7/RX/DT
pin
pin
Note: Refer to Figure 20-1 for load conditions
125
126
RC6/TX/CK
RC7/RX/DT
pin
pin
1997-2013 Microchip Technology Inc. DS30234E-page 243
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
21.0 ELECTRICAL CHARACTERISTICS FOR PIC16CR63/R65
Absolute Maximum Ratings (†)
Ambient temperature under bias.............................................................................................................-55°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS (Note 2)............................................................................................... 0V to +14V
Voltage on RA4 with respect to Vss ................................................................................................................ 0V to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byPORTA, PORTB, and PORTE (Note 3) (combined)....................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (Note 3) (combined) ..............................................200 mA
Maximum current sunk by PORTC and PORTD (Note 3) (combined) ..................................................................200 mA
Maximum current sourced by PORTC and PORTD (Note 3) (combined) .............................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
Note 2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR/VPP pin rather
than pulling this pin directly to VSS.
Note 3: PORTD and PORTE not available on the PIC16CR63.
TABLE 21-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC PIC16CR63-04
PIC16CR65-04
PIC16CR63-10
PIC16CR65-10
PIC16CR63-20
PIC16CR65-20
PIC16LCR63-04
PIC16LCR65-04 JW Devices
RC VDD: 4.0V to 5.5V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 3.0V to 5.5V
IDD: 3.8 mA max. at 3V
IPD: 5 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 5.5V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
XT VDD: 4.0V to 5.5V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 3.0V to 5.5V
IDD: 3.8 mA max. at 3V
IPD: 5 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 5.5V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for
use in HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at
5.5V
IDD: 10 mA max. at 5.5V IDD: 20 mA max. at 5.5V IDD: 20 mA max. at
5.5V
IPD: 1.5 A typ. at 4.5V IPD 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V
Freq: 4 MHz max. Freq: 10 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP VDD: 4.0V to 5.5V
IDD: 52.5 A typ.
at 32 kHz, 4.0V
IPD: 0.9 A typ. at 4.0V
Freq: 200 kHz max.
Not recommended for
use in LP mode
Not recommended for
use in LP mode
VDD: 3.0V to 5.5V
IDD: 48 A max. at 32
kHz, 3.0V
IPD: 5 A max. at 3.0V
Freq: 200 kHz max.
VDD: 3.0V to 5.5V
IDD: 48 A max.
at 32 kHz, 3.0V
IPD: 5 A max. at 3.0V
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recom-
mended that the user select the device type that ensures the specifications required.
urauon \
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DS30234E-page 244 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
21.1 DC Characteristics: PIC16CR63/R65-04 (Commercial, Industrial)
PIC16CR63/R65-10 (Commercial, Industrial)
PIC16CR63/R65-20 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage VDD 4.0
4.5
-
-
5.5
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
D010
D013
D015*
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
IDD
IBOR
-
-
-
2.7
10
350
5
20
425
mA
mA
A
XT, RC, osc config FOSC = 4 MHz,
VDD = 5.5V (Note 4)
HS osc config
FOSC = 20 MHz, VDD = 5.5V
BOR enabled, VDD = 5.0V
D020
D021
D021A
D023*
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
IPD
IBOR
-
-
-
-
10.5
1.5
1.5
350
42
16
19
425
A
A
A
A
VDD = 4.0V, WDT enabled,-40C to +85C
VDD = 4.0V, WDT disabled,-0C to +70C
VDD = 4.0V, WDT disabled,-40C to +85C
BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
1997-2013 Microchip Technology Inc. DS30234E-page 245
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
21.2 DC Characteristics: PIC16LCR63/R65-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 3.0 - 5.5 V LP, XT, RC osc configuration (DC - 4 MHz)
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
D010
D010A
D015*
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
IDD
IBOR
-
-
-
2.0
22.5
350
3.8
48
425
mA
A
A
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
BOR enabled, VDD = 5.0V
D020
D021
D021A
D023*
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
IPD
IBOR
-
-
-
-
7.5
0.9
0.9
350
30
5
5
425
A
A
A
A
VDD = 3.0V, WDT enabled, -40C to +85C
VDD = 3.0V, WDT disabled, 0C to +70C
VDD = 3.0V, WDT disabled, -40C to +85C
BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
u
PIC16C6X
DS30234E-page 246 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
21.3 DC Characteristics: PIC16CR63/R65-04 (Commercial, Industrial)
PIC16CR63/R65-10 (Commercial, Industrial)
PIC16CR63/R65-20 (Commercial, Industrial)
PIC16LCR63/R65-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C TA +70°C for commercial
Operating voltage VDD range as described in DC spec Section 21.1 and
Section 21.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
Input Low Voltage
I/O ports VIL
D030
D030A
with TTL buffer VSS
VSS
-
-
0.15VDD
0.8V
V
V
For entire VDD range
4.5V VDD 5.5V
D031 with Schmitt Trigger buffer VSS -0.2VDD V
D032 MCLR, OSC1 (in RC mode) Vss - 0.2VDD V
D033 OSC1 (in XT, HS and LP) Vss - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V4.5V VDD 5.5V
D040A 0.25VDD
+ 0.8V
-VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8VDD -VDD V For entire VDD range
D042 MCLR 0.8VDD -VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD -VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD -VDD V
D070 PORTB weak pull-up current IPURB 50 250 400 AVDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL --1A Vss VPIN VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - 5A Vss VPIN VDD
D063 OSC1 - - 5A Vss VPIN VDD, XT, HS and
LP osc configuration
Output Low Voltage
D080 I/O ports VOL --0.6VIOL = 8.5 mA, VDD = 4.5V,
-40C to +85C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40C to +85C
Output High Voltage
D090 I/O ports (Note 3) VOH VDD-0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40C to +85C
D092 OSC2/CLKOUT (RC osc config) VDD-0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40C to +85C
D150* Open-Drain High Voltage VOD - - 14 V RA4 pin
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
1997-2013 Microchip Technology Inc. DS30234E-page 247
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Capacitive Loading Specs on Out-
put Pins
D100 OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO - - 50 pF
D102 SCL, SDA in I2C mode Cb - - 400 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C TA +70°C for commercial
Operating voltage VDD range as described in DC spec Section 21.1 and
Section 21.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
Timing Parameter Symbology
Load sandman 1 Load condmon 2
o
XTl
PIC16C6X
DS30234E-page 248 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
21.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 21-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
HHigh RRise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
I2C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition
STA START condition
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464
CL= 50 pF for all pins except OSC2/CLKOUT
but including D and E outputs as ports
15 pF for OSC2 output
Load condition 1 Load condition 2
Note 1: PORTD and PORTE are not imple-
mented on the PIC16CR63.
Timing Diagrams and Sgecificalions
1997-2013 Microchip Technology Inc. DS30234E-page 249
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
21.5 Timing Diagrams and Specifications
FIGURE 21-2: EXTERNAL CLOCK TIMING
TABLE 21-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1)
DC — 4 MHz XT and RC osc mode
DC — 4 MHz HS osc mode (-04)
DC — 10 MHz HS osc mode (-10)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1)
DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4 — 20 MHz HS osc mode
5 — 200 kHz LP osc mode
1ToscExternal CLKIN Period
(Note 1)
250 — — ns XT and RC osc mode
250 — — ns HS osc mode (-04)
100 — — ns HS osc mode (-10)
50 — — ns HS osc mode (-20)
5— — s LP osc mode
Oscillator Period
(Note 1)
250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 250 ns HS osc mode (-04)
100 — 250 ns HS osc mode (-10)
50 — 250 ns HS osc mode (-20)
5— — s LP osc mode
2T
CY Instruction Cycle Time (Note 1) 200 TCY DC ns TCY = 4/FOSC
3* TosL,
To s H
External Clock in (OSC1) High or
Low Time
100 — — ns XT oscillator
2.5 — — s LP oscillator
15 — — ns HS oscillator
4* TosR,
To s F
External Clock in (OSC1) Rise or
Fall Time
— — 25 ns XT oscillator
— — 50 ns LP oscillator
— — 15 ns HS oscillator
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
3
344
1
2
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
CLKOUT
Max
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PIC16C6X
DS30234E-page 250 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-3: CLKOUT AND I/O TIMING
TABLE 21-3: CLKOUT AND I/O TIMING REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1 to CLKOUT — 75 200 ns Note 1
11* TosH2ckH OSC1 to CLKOUT — 75 200 ns Note 1
12* TckR CLKOUT rise time — 35 100 ns Note 1
13* TckF CLKOUT fall time — 35 100 ns Note 1
14* TckL2ioV CLKOUT to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT Tosc + 200 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT 0——nsNote 1
17* TosH2ioV OSC1 (Q1 cycle) to Port out valid — 50 150 ns
18* TosH2ioI OSC1 (Q2 cycle) to Port input
invalid (I/O in hold time)
PIC16CR63/R65 100 — — ns
PIC16LCR63/R65 200 — — ns
19* TioV2osH Port input valid to OSC1(I/O in setup time) 0 — — ns
20* TioR Port output rise time PIC16CR63/R65 — 10 40 ns
PIC16LCR63/R65 — — 80 ns
21* TioF Port output fall time PIC16CR63/R65 — 10 40 ns
PIC16LCR63/R65 — — 80 ns
22††* Tinp INT pin high or low time TCY ——ns
23††* Trbp RB7:RB4 change INT high or low time TCY ——ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edge.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
Note: Refer to Figure 21-1 for load conditions.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19 18
15
11
12
16
old value new value
1997-2013 Microchip Technology Inc. DS30234E-page 251
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
FIGURE 21-5: BROWN-OUT RESET TIMING
TABLE 21-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
AND BROWN-OUT RESET REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2 — — sVDD = 5V, -40°C to +125°C
31* Twdt Watchdog Timer Time-out Period
(No Prescaler)
71833ms
VDD = 5V, -40°C to +125°C
32 Tost Oscillation Start-up Timer Period — 1024 TOSC ——
TOSC = OSC1 period
33* Tpwrt Power-up Timer Period 28 72 132 ms VDD = 5V, -40°C to +125°C
34 TIOZ I/O Hi-impedance from MCLR Low
or WDT reset
——2.1
s
35 TBOR Brown-out Reset Pulse Width 100 — — sVDD BVDD (D005)
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 21-1 for load conditions.
VDD
BVDD
35
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PIC16C6X
DS30234E-page 252 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-6: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 21-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42* Tt0P T0CKI Period No Prescaler TCY + 40 — — ns
With Prescaler Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
46* Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
47* Tt1P T1CKI input period Synchronous PIC16C6X Greater of:
30 OR TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
PIC16LC6X Greater of:
50 OR TCY + 40
N
N = prescale value
(1, 2, 4, 8)
Asynchronous PIC16C6X 60 — — ns
PIC16LC6X 100 — — ns
Ft1 Timer1 oscillator input frequency range
(oscillator enabled by setting bit T1OSCEN)
DC — 200 kHz
48 TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 21-1 for load conditions.
46
47
45
48
41
42
40
RA4/T0CKI
RC0/T1OSO/T1CKI
TMR0 or
TMR1
am * AG
1997-2013 Microchip Technology Inc. DS30234E-page 253
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-7: CAPTURE/COMPARE/PWM TIMINGS (CCP1 AND CCP2)
TABLE 21-6: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1 AND CCP2)
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
50* TccL CCP1 and CCP2
input low time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16CR63/R65 10 — — ns
PIC16LCR63/R65 20 — — ns
51* TccH CCP1 and CCP2
input high time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16CR63/R65 10 — — ns
PIC16LCR63/R65 20 — — ns
52* TccP CCP1 and CCP2 input period 3TCY + 40
N
— — ns N = prescale value
(1,4, or 16)
53* TccR CCP1 and CCP2 output rise time PIC16CR63/R65 — 10 25 ns
PIC16LCR63/R65 — 25 45 ns
54* TccF CCP1 and CCP2 output fall time PIC16CR63/R65 — 10 25 ns
PIC16LCR63/R65 — 25 45 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 21-1 for load conditions.
RC1/T1OSI/CCP2
and RC2/CCP1
(Capture Mode)
50 51
52
RC1/T1OSI/CCP2
and RC2/CCP1
53 54
PWM Mode)
(Compare or
\ U
PIC16C6X
DS30234E-page 254 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-8: PARALLEL SLAVE PORT TIMING (PIC16CR65)
TABLE 21-7: PARALLEL SLAVE PORT REQUIREMENTS (PIC16CR65)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
62* TdtV2wrH Data in valid before WR or CS (setup time) 20 — — ns
63* TwrH2dtI WR or CS to data–in invalid (hold
time)
PIC16CR65 20 — — ns
PIC16LCR65 35 — — ns
64 TrdL2dtV RD and CS to data–out valid — — 80 ns
65* TrdH2dtI RD or CS to data–out invalid 10 — 30 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 21-1 for load conditions
RE2/CS
RE0/RD
RE1/WR
RD7:RD0
62
63
64
65
1997-2013 Microchip Technology Inc. DS30234E-page 255
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-9: SPI MODE TIMING
TABLE 21-8: SPI MODE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
70* TssL2scH,
TssL2scL
SS to SCK or SCK input TCY ——ns
71* TscH SCK input high time (slave mode) TCY + 20 — — ns
72* TscL SCK input low time (slave mode) TCY + 20 — — ns
73* TdiV2scH,
TdiV2scL
Setup time of SDI data input to SCK
edge
50 — — ns
74* TscH2diL,
TscL2diL
Hold time of SDI data input to SCK
edge
50 — — ns
75* TdoR SDO data output rise time — 10 25 ns
76* TdoF SDO data output fall time — 10 25 ns
77* TssH2doZ SS to SDO output hi-impedance 10 — 50 ns
78* TscR SCK output rise time (master mode) — 10 25 ns
79* TscF SCK output fall time (master mode) — 10 25 ns
80* TscH2doV,
TscL2doV
SDO data output valid after SCK
edge
— — 50 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 21-1 for load conditions
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76 77
78
79
80
79
78
3, /
PIC16C6X
DS30234E-page 256 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-10: I2C BUS START/STOP BITS TIMING
TABLE 21-9: I2C BUS START/STOP BITS REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ Max Units Conditions
90* TSU:STA START condition 100 kHz mode 4700 — — ns Only relevant for repeated START
condition
Setup time 400 kHz mode 600 — —
91* THD:STA START condition 100 kHz mode 4000 — — ns After this period the first clock
pulse is generated
Hold time 400 kHz mode 600 — —
92* TSU:STO STOP condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
93 THD:STO STOP condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
* These parameters are characterized but not tested.
Note: Refer to Figure 21-1 for load conditions
91
92
93
SCL
SDA
START
Condition
STOP
Condition
90
1997-2013 Microchip Technology Inc. DS30234E-page 257
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-11: I2C BUS DATA TIMING
TABLE 21-10: I2C BUS DATA REQUIREMENTS
Parameter
No.
Sym Characteristic Min Max Units Conditions
100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
102* T
RSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
103* TFSDA and SCL fall time 100 kHz mode — 300 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
90* TSU:STA START condition
setup time
100 kHz mode 4.7 — s Only relevant for repeated
START condition
400 kHz mode 0.6 — s
91* THD:STA START condition hold
time
100 kHz mode 4.0 — s After this period the first clock
pulse is generated
400 kHz mode 0.6 — s
106* THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
107* TSU:DAT Data input setup time 100 kHz mode 250 — ns Note 2
400 kHz mode 100 — ns
92* TSU:STO STOP condition setup
time
100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
109* T
AA Output valid from
clock
100 kHz mode — 3500 ns Note 1
400 kHz mode — — ns
110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission can
start
400 kHz mode 1.3 — s
Cb Bus capacitive loading — 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement
Tsu:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of
the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA
line TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line
is released.
Note: Refer to Figure 21-1 for load conditions
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
swc xmr MASTER & SLAVE
PIC16C6X
DS30234E-page 258 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 21-12: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 21-11: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 21-13: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 21-12: USART SYNCHRONOUS RECEIVE REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
120* TckH2dtV SYNC XMIT (MASTER & SLAVE)
Clock high to data out valid
PIC16CR63/R65 — — 80 ns
PIC16LCR63/R65 — — 100 ns
121* Tckrf Clock out rise time and fall time
(Master Mode)
PIC16CR63/R65 — — 45 ns
PIC16LCR63/R65 — — 50 ns
122* Tdtrf Data out rise time and fall time PIC16CR63/R65 — — 45 ns
PIC16LCR63/R65 — — 50 ns
* These parameters are characterized but not tested.
†: Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
125* TdtV2ckL SYNC RCV (MASTER & SLAVE)
Data setup before CK (DT setup time) 15 — — ns
126* TckL2dtl Data hold after CK (DT hold time) 15 — — ns
* These parameters are characterized but not tested.
†: Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 21-1 for load conditions
121 121
120 122
RC6/TX/CK
RC7/RX/DT
pin
pin
Note: Refer to Figure 21-1 for load conditions
125
126
RC6/TX/CK
RC7/RX/DT
pin
pin
5v
1997-2013 Microchip Technology Inc. DS30234E-page 259
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
22.0 ELECTRICAL CHARACTERISTICS FOR PIC16C66/67
Absolute Maximum Ratings (†)
Ambient temperature under bias.............................................................................................................-55°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS (Note 2)............................................................................................... 0V to +14V
Voltage on RA4 with respect to Vss ................................................................................................................ 0V to +14V
Total power dissipation (Note 1)................................................................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byPORTA, PORTB, and PORTE (Note 3) (combined)....................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (Note 3) (combined) ..............................................200 mA
Maximum current sunk by PORTC and PORTD (Note 3) (combined) ..................................................................200 mA
Maximum current sourced by PORTC and PORTD (Note 3) (combined) .............................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
Note 2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR/VPP pin rather
than pulling this pin directly to VSS.
Note 3: PORTD and PORTE not available on the PIC16C66.
TABLE 22-1: CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS
AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
OSC PIC16C66-04
PIC16C67-04
PIC16C66-10
PIC16C67-10
PIC16C66-20
PIC16C67-20
PIC16LC66-04
PIC16LC67-04 JW Devices
RC VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 6.0V
IDD: 3.8 mA max. at 3V
IPD: 5 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
XT VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 4.5V to 5.5V
IDD: 2.7 mA typ. at 5.5V
IPD: 1.5 A typ. at 4V
Freq: 4 MHz max.
VDD: 2.5V to 6.0V
IDD: 3.8 mA max. at 3V
IPD: 5 A max. at 3V
Freq: 4 MHz max.
VDD: 4.0V to 6.0V
IDD: 5 mA max. at 5.5V
IPD: 16 A max. at 4V
Freq: 4 MHz max.
HS VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V
Not recommended for
use in HS mode
VDD: 4.5V to 5.5V
IDD: 13.5 mA typ. at
5.5V
IDD: 10 mA max. at 5.5V IDD: 20 mA max. at 5.5V IDD: 20 mA max. at
5.5V
IPD: 1.5 A typ. at 4.5V IPD 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V
Freq: 4 MHz max. Freq: 10 MHz max. Freq: 20 MHz max. Freq: 20 MHz max.
LP VDD: 4.0V to 6.0V
IDD: 52.5 A typ.
at 32 kHz, 4.0V
IPD: 0.9 A typ. at 4.0V
Freq: 200 kHz max.
Not recommended for
use in LP mode
Not recommended for
use in LP mode
VDD: 2.5V to 6.0V
IDD: 48 A max. at 32
kHz, 3.0V
IPD: 5 A max. at 3.0V
Freq: 200 kHz max.
VDD: 2.5V to 6.0V
IDD: 48 A max.
at 32 kHz, 3.0V
IPD: 5 A max. at 3.0V
Freq: 200 kHz max.
The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recom-
mended that the user select the device type that ensures the specifications required.
PIC16C6X
DS30234E-page 260 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
22.1 DC Characteristics: PIC16C66/67-04 (Commercial, Industrial, Extended)
PIC16C66/67-10 (Commercial, Industrial, Extended)
PIC16C66/67-20 (Commercial, Industrial, Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage VDD 4.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
3.7 4.0 4.4 V Extended Range Only
D010
D013
D015*
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
IDD
IBOR
-
-
-
2.7
10
350
5
20
425
mA
mA
A
XT, RC, osc config FOSC = 4 MHz, VDD = 5.5V
(Note 4)
HS osc config
FOSC = 20 MHz, VDD = 5.5V
BOR enabled, VDD = 5.0V
D020
D021
D021A
D021B
D023*
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
IPD
IBOR
-
-
-
-
-
10.5
1.5
1.5
2.5
350
42
16
19
19
425
A
A
A
A
A
VDD = 4.0V, WDT enabled,-40C to +85C
VDD = 4.0V, WDT disabled,-0C to +70C
VDD = 4.0V, WDT disabled,-40C to +85C
VDD = 4.0V, WDT disabled,-40C to +125C
BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
1997-2013 Microchip Technology Inc. DS30234E-page 261
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
22.2 DC Characteristics: PIC16LC66/67-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial and
0°C T
A +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001 Supply Voltage VDD 2.5 - 6.0 V LP, XT, RC osc configuration (DC - 4 MHz)
D002* RAM Data Retention
Voltage (Note 1)
VDR -1.5- V
D003 VDD start voltage to
ensure internal Power-on
Reset signal
VPOR -VSS - V See section on Power-on Reset for details
D004* VDD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 - - V/ms See section on Power-on Reset for details
D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
D010
D010A
D015*
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
IDD
IBOR
-
-
-
2.0
22.5
350
3.8
48
425
mA
A
A
XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
BOR enabled, VDD = 5.0V
D020
D021
D021A
D023*
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
IPD
IBOR
-
-
-
-
7.5
0.9
0.9
350
30
5
5
425
A
A
A
A
VDD = 3.0V, WDT enabled, -40C to +85C
VDD = 3.0V, WDT disabled, 0C to +70C
VDD = 3.0V, WDT disabled, -40C to +85C
BOR enabled, VDD = 5.0V
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
PIC16C6X
DS30234E-page 262 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
22.3 DC Characteristics: PIC16C66/67-04 (Commercial, Industrial, Extended)
PIC16C66/67-10 (Commercial, Industrial, Extended)
PIC16C66/67-20 (Commercial, Industrial, Extended)
PIC16LC66/67-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 22.1
and Section 22.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
Input Low Voltage
I/O ports VIL
D030
D030A
with TTL buffer VSS
VSS
-
-
0.15VDD
0.8V
V
V
For entire VDD range
4.5V VDD 5.5V
D031 with Schmitt Trigger buffer VSS -0.2VDD V
D032 MCLR, OSC1 (in RC mode) Vss - 0.2VDD V
D033 OSC1 (in XT, HS and LP) Vss - 0.3VDD V Note1
Input High Voltage
I/O ports VIH -
D040 with TTL buffer 2.0 - VDD V4.5V VDD 5.5V
D040A 0.25VDD
+ 0.8V
-VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8VDD -VDD V For entire VDD range
D042 MCLR 0.8VDD -VDD V
D042A OSC1 (XT, HS and LP) 0.7VDD -VDD V Note1
D043 OSC1 (in RC mode) 0.9VDD -VDD V
D070 PORTB weak pull-up current IPURB 50 250 400 AVDD = 5V, VPIN = VSS
Input Leakage Current (Notes 2, 3)
D060 I/O ports IIL --1AVss VPIN VDD, Pin at hi-
impedance
D061 MCLR, RA4/T0CKI - - 5AVss VPIN VDD
D063 OSC1 - - 5AVss VPIN VDD, XT, HS and
LP osc configuration
Output Low Voltage
D080 I/O ports VOL --0.6VIOL = 8.5 mA, VDD = 4.5V,
-40C to +85C
D080A - - 0.6 V IOL = 7.0 mA, VDD = 4.5V,
-40C to +125C
D083 OSC2/CLKOUT (RC osc config) - - 0.6 V IOL = 1.6 mA, VDD = 4.5V,
-40C to +85C
D083A - - 0.6 V IOL = 1.2 mA, VDD = 4.5V,
-40C to +125C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
1997-2013 Microchip Technology Inc. DS30234E-page 263
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
Output High Voltage
D090 I/O ports (Note 3) VOH VDD-0.7 - - V IOH = -3.0 mA, VDD = 4.5V,
-40C to +85C
D090A VDD-0.7 - - V IOH = -2.5 mA, VDD = 4.5V,
-40C to +125C
D092 OSC2/CLKOUT (RC osc config) VDD-0.7 - - V IOH = -1.3 mA, VDD = 4.5V,
-40C to +85C
D092A VDD-0.7 - - V IOH = -1.0 mA, VDD = 4.5V,
-40C to +125C
D150* Open-Drain High Voltage VOD - - 14 V RA4 pin
Capacitive Loading Specs on Out-
put Pins
D100 OSC2 pin COSC2 - - 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1.
D101 All I/O pins and OSC2 (in RC mode) CIO - - 50 pF
D102 SCL, SDA in I2C mode Cb - - 400 pF
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended,
-40°C T
A +85°C for industrial and
0°C T
A +70°C for commercial
Operating voltage VDD range as described in DC spec Section 22.1
and Section 22.2
Param
No.
Characteristic Sym Min Typ
†
Max Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the
PIC16C6X be driven with external clock in RC mode.
2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input volt-
ages.
3: Negative current is defined as current sourced by the pin.
Timing Parameter Symbology
Load sandman 1 Load condmon 2
o
XTl
PIC16C6X
DS30234E-page 264 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
22.4 Timing Parameter Symbology
The timing parameter symbols have been created following one of the following formats:
FIGURE 22-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
HHigh RRise
I Invalid (Hi-impedance) V Valid
L Low Z Hi-impedance
I2C only
AA output access High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO STOP condition
STA START condition
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464
CL= 50 pF for all pins except OSC2/CLKOUT
but including D and E outputs as ports
15 pF for OSC2 output
Load condition 1 Load condition 2
Note 1: PORTD and PORTE are not imple-
mented on the PIC16C66.
Timin Dia rams ands ecificalions
1997-2013 Microchip Technology Inc. DS30234E-page 265
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
22.5 Timing Diagrams and Specifications
FIGURE 22-2: EXTERNAL CLOCK TIMING
TABLE 22-2: EXTERNAL CLOCK TIMING REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
Fosc External CLKIN Frequency
(Note 1)
DC — 4 MHz XT and RC osc mode
DC — 4 MHz HS osc mode (-04)
DC — 10 MHz HS osc mode (-10)
DC — 20 MHz HS osc mode (-20)
DC — 200 kHz LP osc mode
Oscillator Frequency
(Note 1)
DC — 4 MHz RC osc mode
0.1 — 4 MHz XT osc mode
4 — 20 MHz HS osc mode
5 — 200 kHz LP osc mode
1ToscExternal CLKIN Period
(Note 1)
250 — — ns XT and RC osc mode
250 — — ns HS osc mode (-04)
100 — — ns HS osc mode (-10)
50 — — ns HS osc mode (-20)
5— — s LP osc mode
Oscillator Period
(Note 1)
250 — — ns RC osc mode
250 — 10,000 ns XT osc mode
250 — 250 ns HS osc mode (-04)
100 — 250 ns HS osc mode (-10)
50 — 250 ns HS osc mode (-20)
5— — s LP osc mode
2T
CY Instruction Cycle Time (Note 1) 200 TCY DC ns TCY = 4/FOSC
3* TosL,
To s H
External Clock in (OSC1) High or
Low Time
100 — — ns XT oscillator
2.5 — — s LP oscillator
15 — — ns HS oscillator
4* TosR,
To s F
External Clock in (OSC1) Rise or
Fall Time
— — 25 ns XT oscillator
— — 50 ns LP oscillator
— — 15 ns HS oscillator
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices.
3
344
1
2
Q4 Q1 Q2 Q3 Q4 Q1
OSC1
CLKOUT
PIC16C6X
DS30234E-page 266 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-3: CLKOUT AND I/O TIMING
TABLE 22-3: CLKOUT AND I/O TIMING REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
10* TosH2ckL OSC1 to CLKOUT — 75 200 ns Note 1
11* TosH2ckH OSC1 to CLKOUT — 75 200 ns Note 1
12* TckR CLKOUT rise time — 35 100 ns Note 1
13* TckF CLKOUT fall time — 35 100 ns Note 1
14* TckL2ioV CLKOUT to Port out valid — — 0.5TCY + 20 ns Note 1
15* TioV2ckH Port in valid before CLKOUT Tosc + 200 — — ns Note 1
16* TckH2ioI Port in hold after CLKOUT 0——nsNote 1
17* TosH2ioV OSC1 (Q1 cycle) to Port out valid — 50 150 ns
18* TosH2ioI OSC1 (Q2 cycle) to Port input
invalid (I/O in hold time)
PIC16C66/67 100 — — ns
PIC16LC66/67 200 — — ns
19* TioV2osH Port input valid to OSC1(I/O in setup time) 0 — — ns
20* TioR Port output rise time PIC16C66/67 — 10 40 ns
PIC16LC66/67 — — 80 ns
21* TioF Port output fall time PIC16C66/67 — 10 40 ns
PIC16LC66/67 — — 80 ns
22††* Tinp INT pin high or low time TCY ——ns
23††* Trbp RB7:RB4 change INT high or low time TCY ——ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events not related to any internal clock edge.
Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC.
Note: Refer to Figure 22-1 for load conditions.
OSC1
CLKOUT
I/O Pin
(input)
I/O Pin
(output)
Q4 Q1 Q2 Q3
10
13
14
17
20, 21
19 18
15
11
12
16
old value new value
1997-2013 Microchip Technology Inc. DS30234E-page 267
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
FIGURE 22-5: BROWN-OUT RESET TIMING
TABLE 22-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
AND BROWN-OUT RESET REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
30 TmcL MCLR Pulse Width (low) 2 — — sVDD = 5V, -40°C to +125°C
31* Twdt Watchdog Timer Time-out Period
(No Prescaler)
71833ms
VDD = 5V, -40°C to +125°C
32 Tost Oscillation Start-up Timer Period — 1024 TOSC ——
TOSC = OSC1 period
33* Tpwrt Power-up Timer Period 28 72 132 ms VDD = 5V, -40°C to +125°C
34 TIOZ I/O Hi-impedance from MCLR Low
or WDT reset
——2.1
s
35 TBOR Brown-out Reset Pulse Width 100 — — sVDD BVDD (D005)
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
RESET
Watchdog
Timer
RESET
33
32
30
31
34
I/O Pins
34
Note: Refer to Figure 22-1 for load conditions.
VDD
BVDD
35
\
‘ x H
L7 4.‘ .7 4"
‘ H ‘w
\
‘7 4.x
‘
‘ A
‘
\
‘ Hg"!
‘47 a“? 4“
\ ‘ \
\ x
57 4.,7
Tome
chma
m . 40
PIC16C6X
DS30234E-page 268 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-6: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 22-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
40* Tt0H T0CKI High Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
41* Tt0L T0CKI Low Pulse Width No Prescaler 0.5TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42* Tt0P T0CKI Period No Prescaler TCY + 40 — — ns
With Prescaler Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
46* Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler =
2,4,8
PIC16C6X 15 — — ns
PIC16LC6X 25 — — ns
Asynchronous PIC16C6X 30 — — ns
PIC16LC6X 50 — — ns
47* Tt1P T1CKI input period Synchronous PIC16C6X Greater of:
30 OR TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
PIC16LC6X Greater of:
50 OR TCY + 40
N
N = prescale value
(1, 2, 4, 8)
Asynchronous PIC16C6X 60 — — ns
PIC16LC6X 100 — — ns
Ft1 Timer1 oscillator input frequency range
(oscillator enabled by setting bit T1OSCEN)
DC — 200 kHz
48 TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc — 7Tosc —
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 22-1 for load conditions.
46
47
45
48
41
42
40
RA4/T0CKI
RC0/T1OSO/T1CKI
TMR0 or
TMR1
am +AU
1997-2013 Microchip Technology Inc. DS30234E-page 269
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-7: CAPTURE/COMPARE/PWM TIMINGS (CCP1 AND CCP2)
TABLE 22-6: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1 AND CCP2)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
50* TccL CCP1 and CCP2
input low time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C66/67 10 — — ns
PIC16LC66/67 20 — — ns
51* TccH CCP1 and CCP2
input high time
No Prescaler 0.5TCY + 20 — — ns
With Prescaler PIC16C66/67 10 — — ns
PIC16LC66/67 20 — — ns
52* TccP CCP1 and CCP2 input period 3TCY + 40
N
— — ns N = prescale value
(1,4, or 16)
53* TccR CCP1 and CCP2 output rise time PIC16C66/67 — 10 25 ns
PIC16LC66/67 — 25 45 ns
54* TccF CCP1 and CCP2 output fall time PIC16C66/67 — 10 25 ns
PIC16LC66/67 — 25 45 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 22-1 for load conditions.
RC1/T1OSI/CCP2
and RC2/CCP1
(Capture Mode)
50 51
52
RC1/T1OSI/CCP2
and RC2/CCP1
53 54
PWM Mode)
(Compare or
\ U
PIC16C6X
DS30234E-page 270 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-8: PARALLEL SLAVE PORT TIMING (PIC16C67)
TABLE 22-7: PARALLEL SLAVE PORT REQUIREMENTS (PIC16C67)
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
62* TdtV2wrH Data in valid before WR or CS (setup time) 20 — — ns
25 — — ns Extended
Range Only
63* TwrH2dtI WR or CS to data–in invalid (hold
time)
PIC16C67 20 — — ns
PIC16LC67 35 — — ns
64 TrdL2dtV RD and CS to data–out valid — — 80 ns
— — 90 ns Extended
Range Only
65* TrdH2dtI RD or CS to data–out invalid 10 — 30 ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 22-1 for load conditions
RE2/CS
RE0/RD
RE1/WR
RD7:RD0
62
63
64
65
*? s;
L 22
y
1997-2013 Microchip Technology Inc. DS30234E-page 271
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-9: SPI MASTER MODE TIMING (CKE = 0)
FIGURE 22-10: SPI MASTER MODE TIMING (CKE = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76
78
79
80
79
78
MSB LSB
BIT6 - - - - - -1
MSB IN LSB IN
BIT6 - - - -1
Refer to Figure 22-1 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
81
71 72
74
75, 76
78
80
MSB
79
73
MSB IN
BIT6 - - - - - -1
LSB IN
BIT6 - - - -1
LSB
Refer to Figure 22-1 for load conditions.
PIC16C6X
DS30234E-page 272 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-11: SPI SLAVE MODE TIMING (CKE = 0)
FIGURE 22-12: SPI SLAVE MODE TIMING (CKE = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76 77
78
79
80
79
78
SDI
MSB LSB
BIT6 - - - - - -1
MSB IN BIT6 - - - -1 LSB IN
83
Refer to Figure 22-1 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
82
SDI
74
75, 76
MSB BIT6 - - - - - -1 LSB
77
MSB IN BIT6 - - - -1 LSB IN
80
83
Refer to Figure 22-1 for load conditions.
No,
1997-2013 Microchip Technology Inc. DS30234E-page 273
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
TABLE 22-8: SPI MODE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
70* TssL2scH,
TssL2scL
SS to SCK or SCK input TCY ——ns
71* TscH SCK input high time (slave mode) TCY + 20 — — ns
72* TscL SCK input low time (slave mode) TCY + 20 — — ns
73* TdiV2scH,
TdiV2scL
Setup time of SDI data input to SCK
edge
100 — — ns
74* TscH2diL,
TscL2diL
Hold time of SDI data input to SCK
edge
100 — — ns
75* TdoR SDO data output rise time — 10 25 ns
76* TdoF SDO data output fall time — 10 25 ns
77* TssH2doZ SS to SDO output hi-impedance 10 — 50 ns
78* TscR SCK output rise time (master mode) — 10 25 ns
79* TscF SCK output fall time (master mode) — 10 25 ns
80* TscH2doV,
TscL2doV
SDO data output valid after SCK
edge
— — 50 ns
81* TdoV2scH,
TdoV2scL
SDO data output setup to SCK
edge
TCY ——ns
82* TssL2doV SDO data output valid after SS
edge
— — 50 ns
83* TscH2ssH,
TscL2ssH
SS after SCK edge 1.5TCY + 40 — — ns
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
3, /
PIC16C6X
DS30234E-page 274 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-13: I2C BUS START/STOP BITS TIMING
TABLE 22-9: I2C BUS START/STOP BITS REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ Max Units Conditions
90* TSU:STA START condition 100 kHz mode 4700 — — ns Only relevant for repeated START
condition
Setup time 400 kHz mode 600 — —
91* THD:STA START condition 100 kHz mode 4000 — — ns After this period the first clock
pulse is generated
Hold time 400 kHz mode 600 — —
92* TSU:STO STOP condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
93 THD:STO STOP condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
* These parameters are characterized but not tested.
Note: Refer to Figure 22-1 for load conditions
91
92
93
SCL
SDA
START
Condition
STOP
Condition
90
1997-2013 Microchip Technology Inc. DS30234E-page 275
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-14: I2C BUS DATA TIMING
TABLE 22-10: I2C BUS DATA REQUIREMENTS
Parameter
No.
Sym Characteristic Min Max Units Conditions
100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a mini-
mum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a mini-
mum of 10 MHz
SSP Module 1.5TCY —
102* T
RSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
103* TFSDA and SCL fall time 100 kHz mode — 300 ns
400 kHz mode 20 + 0.1Cb 300 ns Cb is specified to be from
10-400 pF
90* TSU:STA START condition
setup time
100 kHz mode 4.7 — s Only relevant for repeated
START condition
400 kHz mode 0.6 — s
91* THD:STA START condition hold
time
100 kHz mode 4.0 — s After this period the first clock
pulse is generated
400 kHz mode 0.6 — s
106* THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
107* TSU:DAT Data input setup time 100 kHz mode 250 — ns Note 2
400 kHz mode 100 — ns
92* TSU:STO STOP condition setup
time
100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
109* T
AA Output valid from
clock
100 kHz mode — 3500 ns Note 1
400 kHz mode — — ns
110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission can
start
400 kHz mode 1.3 — s
Cb Bus capacitive loading — 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of
the falling edge of SCL to avoid unintended generation of START or STOP conditions.
2: A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement
Tsu:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of
the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA
line TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line
is released.
Note: Refer to Figure 22-1 for load conditions
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
swc xmr MASTER & SLAVE
PIC16C6X
DS30234E-page 276 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 22-15: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 22-11: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 22-16: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 22-12: USART SYNCHRONOUS RECEIVE REQUIREMENTS
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
120* TckH2dtV SYNC XMIT (MASTER & SLAVE)
Clock high to data out valid
PIC16C66/67 — — 80 ns
PIC16LC66/67 — — 100 ns
121* Tckrf Clock out rise time and fall time
(Master Mode)
PIC16C66/67 — — 45 ns
PIC16LC66/67 — — 50 ns
122* Tdtrf Data out rise time and fall time PIC16C66/67 — — 45 ns
PIC16LC66/67 — — 50 ns
* These parameters are characterized but not tested.
†: Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Parameter
No.
Sym Characteristic Min Typ† Max Units Conditions
125* TdtV2ckL SYNC RCV (MASTER & SLAVE)
Data setup before CK (DT setup time) 15 — — ns
126* TckL2dtl Data hold after CK (DT hold time) 15 — — ns
* These parameters are characterized but not tested.
†: Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 22-1 for load conditions
121 121
120 122
RC6/TX/CK
RC7/RX/DT
pin
pin
Note: Refer to Figure 22-1 for load conditions
125
126
RC6/TX/CK
RC7/RX/DT
pin
pin
1997-2013 Microchip Technology Inc. DS30234E-page 277
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
23.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES FOR:
PIC16C62, PIC16C62A, PIC16CR62, PIC16C63, PIC16C64, PIC16C64A,
PIC16CR64, PIC16C65A, PIC16C66, PIC16C67
The graphs and tables provided in this section are for design guidance and are not tested or guaranteed.
In some graphs or tables the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are guaranteed to operate properly only within the specified
range.
FIGURE 23-1: TYPICAL IPD vs. VDD (WDT DISABLED, RC MODE)
FIGURE 23-2: MAXIMUM IPD vs. VDD (WDT DISABLED, RC MODE)
Note: The data presented in this section is a statistical summary of data collected on units from different lots over
a period of time and matrix samples. 'Typical' represents the mean of the distribution at, 25C, while 'max'
or 'min' represents (mean +3) and (mean -3) respectively where is standard deviation.
35
30
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(nA)
VDD(Volts)
IPD(A)
VDD(Volts)
10.000
1.000
0.100
0.010
0.001
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
85C
70C
25C
0C
-40C
PIC16C6X
DS30234E-page 278 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-3: TYPICAL IPD vs. VDD @ 25C
(WDT ENABLED, RC MODE)
FIGURE 23-4: MAXIMUM IPD vs. VDD (WDT
ENABLED, RC MODE)
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(A)
VDD(Volts)
35
30
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD(A)
VDD(Volts)
-40C
0C
70C
85C
FIGURE 23-5: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
FIGURE 23-6: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
FIGURE 23-7: TYPICAL RC OSCILLATOR
FREQUENCY vs. VDD
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Fosc(MHz)
Cext = 22 pF, T = 25C
R = 100k
R = 10k
R = 5k
Shaded area is beyond recommended range.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Fosc(MHz)
Cext = 100 pF, T = 25C
R = 100k
R = 10k
R = 5k
R = 3.3k
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
1000
900
800
700
600
500
400
300
200
100
0
Fosc(kHz)
Cext = 300 pF, T = 25C
R = 3.3k
R = 5k
R = 10k
R = 100k
Data based on matrix samples. See first page of this section for details.
1997-2013 Microchip Technology Inc. DS30234E-page 279
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-8: TYPICAL IPD vs. VDD BROWN-
OUT DETECT ENABLED (RC
MODE)
FIGURE 23-9: MAXIMUM IPD vs. VDD
BROWN-OUT DETECT
ENABLED
(85C TO -40C, RC MODE)
The shaded region represents the built-in hysteresis of the
brown-out reset circuitry.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
1400
1200
1000
800
600
400
200
0
VDD(Volts)
IPD(A)
Device in
Brown-out
Device NOT in
Brown-out Reset
Reset
The shaded region represents the built-in hysteresis of the
brown-out reset circuitry.
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
1400
1200
1000
800
600
400
200
0
VDD(Volts)
IPD(A)
4.3
1600
Device NOT in
Brown-out Reset
Device in
Brown-out
Reset
FIGURE 23-10: TYPICAL IPD vs. TIMER1
ENABLED (32 kHz, RC0/RC1 =
33 pF/33 pF, RC MODE)
FIGURE 23-11: MAXIMUM IPD vs. TIMER1
ENABLED
(32 kHz, RC0/RC1 = 33 pF/33
pF, 85C TO -40C, RC MODE)
30
25
20
15
10
5
0
2.53.03.54.04.55.05.56.0
VDD(Volts)
IPD(A)
30
25
20
15
10
5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
IPD(A)
35
40
45
Data based on matrix samples. See first page of this section for details.
PIC16C6X
DS30234E-page 280 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-12: TYPICAL IDD vs. FREQUENCY (RC MODE @ 22 pF, 25C)
FIGURE 23-13: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 22 pF, -40C TO 85C)
2000
1800
1600
1400
1200
800
1000
600
400
200
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Frequency(MHz)
IDD(A)
Shaded area is
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
beyond recommended range
2000
1800
1600
1400
1200
800
1000
600
400
200
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Frequency(MHz)
IDD(A)
Shaded area is
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
beyond recommended range
Data based on matrix samples. See first page of this section for details.
1997-2013 Microchip Technology Inc. DS30234E-page 281
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-14: TYPICAL IDD vs. FREQUENCY (RC MODE @ 100 pF, 25C)
FIGURE 23-15: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 100 pF, -40C TO 85C)
1600
1400
1200
1000
800
600
400
200
0
0 200 400 600 800 1000 1200 1400 1600 1800
Frequency(kHz)
IDD(A)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
Shaded area is
beyond recommended range
1600
1400
1200
1000
800
600
400
200
0
0 200 400 600 800 1000 1200 1400 1600 1800
Frequency(kHz)
IDD(A)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
Shaded area is
beyond recommended range
Data based on matrix samples. See first page of this section for details.
PIC16C6X
DS30234E-page 282 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-16: TYPICAL IDD vs. FREQUENCY (RC MODE @ 300 pF, 25C)
FIGURE 23-17: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 300 pF, -40C TO 85C)
1200
1000
800
600
400
200
0
0 100 200 300 400 500 600 700
Frequency(kHz)
IDD(A)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1200
1000
800
600
400
200
0
0 100 200 300 400 500 600 700
Frequency(kHz)
IDD(A)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
Data based on matrix samples. See first page of this section for details.
1997-2013 Microchip Technology Inc. DS30234E-page 283
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-18: TYPICAL IDD vs.
CAPACITANCE @ 500 kHz
(RC MODE)
TABLE 23-1: RC OSCILLATOR
FREQUENCIES
Cext Rext
Average
Fosc @ 5V, 25C
22 pF 5k 4.12 MHz ± 1.4%
10k 2.35 MHz ± 1.4%
100k 268 kHz ± 1.1%
100 pF 3.3k 1.80 MHz ± 1.0%
5k 1.27 MHz ± 1.0%
10k 688 kHz ± 1.2%
100k 77.2 kHz ± 1.0%
300 pF 3.3k 707 kHz ± 1.4%
5k 501 kHz ± 1.2%
10k 269 kHz ± 1.6%
100k 28.3 kHz ± 1.1%
The percentage variation indicated here is part to
part variation due to normal process distribution. The
variation indicated is ±3 standard deviation from
average value for VDD = 5V.
Capacitance(pF)
600
IDD(A)
500
400
300
200
100
0
20 pF 100 pF 300 pF
5.0V
4.0V
3.0V
FIGURE 23-19: TRANSCONDUCTANCE(gm)
OF HS OSCILLATOR vs. VDD
FIGURE 23-20: TRANSCONDUCTANCE(gm)
OF LP OSCILLATOR vs. VDD
FIGURE 23-21: TRANSCONDUCTANCE(gm)
OF XT OSCILLATOR vs. VDD
4.0
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(mA/V)
VDD(Volts)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Max -40C
Typ 25C
Min 85C
Shaded area is
beyond recommended range
110
100
90
80
70
60
50
40
30
20
10
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(A/V)
VDD(Volts)
Max -40C
Typ 25C
Min 85C
Shaded areas are
beyond recommended range
1000
900
800
700
600
500
400
300
200
100
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
gm(A/V)
VDD(Volts)
Max -40C
Typ 25C
Min 85C
Shaded areas are
beyond recommended range
Data based on matrix samples. See first page of this section for details.
PIC16C6X
DS30234E-page 284 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-22: TYPICAL XTAL STARTUP
TIME vs. VDD (LP MODE, 25C)
FIGURE 23-23: TYPICAL XTAL STARTUP
TIME vs. VDD (HS MODE,
25C)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(Volts)
Startup Time(Seconds)
32 kHz, 33 pF/33 pF
200 kHz, 15 pF/15 pF
7
6
5
4
3
2
1
4.0 4.5 5.0 5.5 6.0
VDD(Volts)
Startup Time(ms)
20 MHz, 33 pF/33 pF
8 MHz, 33 pF/33 pF
8 MHz, 15 pF/15 pF
20 MHz, 15 pF/15 pF
FIGURE 23-24: TYPICAL XTAL STARTUP
TIME vs. VDD (XT MODE, 25C)
TABLE 23-2: CAPACITOR SELECTION FOR
CRYSTAL OSCILLATORS
Osc Type Crystal
Freq
Cap. Range
C1
Cap. Range
C2
LP 32 kHz 33 pF 33 pF
200 kHz 15 pF 15 pF
XT 200 kHz 47-68 pF 47-68 pF
1 MHz 15 pF 15 pF
4 MHz 15 pF 15 pF
HS 4 MHz 15 pF 15 pF
8 MHz 15-33 pF 15-33 pF
20 MHz 15-33 pF 15-33 pF
Crystals
Used
32 kHz Epson C-001R32.768K-A ± 20 PPM
200 kHz STD XTL 200.000KHz ± 20 PPM
1 MHz ECS ECS-10-13-1 ± 50 PPM
4 MHz ECS ECS-40-20-1 ± 50 PPM
8 MHz EPSON CA-301 8.000M-C ± 30 PPM
20 MHz EPSON CA-301 20.000M-C ± 30 PPM
70
60
50
40
30
20
10
03.0 3.52.5 4.0 5.0 5.5 6.04.5
VDD(Volts)
Startup Time(ms)
200 kHz, 68 pF/68 pF
200 kHz, 47 pF/47 pF
1 MHz, 15 pF/15 pF
4 MHz, 15 pF/15 pF
Data based on matrix samples. See first page of this section for details.
1997-2013 Microchip Technology Inc. DS30234E-page 285
PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-25: TYPICAL IDD vs. FREQUENCY
(LP MODE, 25°C)
FIGURE 23-26: MAXIMUM IDD vs.
FREQUENCY
(LP MODE, 85°C TO -40°C)
120
100
80
60
40
20
0
0 50 100 150 200
Frequency(kHz)
IDD(A)
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
120
100
80
60
40
20
0
0 50 100 150 200
Frequency(kHz)
IDD(A)
140
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
FIGURE 23-27: TYPICAL IDD vs. FREQUENCY
(XT MODE, 25°C)
FIGURE 23-28: MAXIMUM IDD vs.
FREQUENCY
(XT MODE, -40°C TO 85°C)
1200
1000
800
600
400
200
0
0.0 0.4
Frequency(MHz)
IDD(A)
1400
1600
1800
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
1200
1000
800
600
400
200
0
0.0 0.4
Frequency(MHz)
IDD(A)
1400
1600
1800
0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
Data based on matrix samples. See first page of this section for details.
PIC16C6X
DS30234E-page 286 1997-2013 Microchip Technology Inc.
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
FIGURE 23-29: TYPICAL IDD vs. FREQUENCY
(HS MODE, 25°C)
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
12 4 6 8 10 12 14 16 18 20
Frequency(MHz)
IDD(mA)
6.0V
5.5V
5.0V
4.5V
4.0V
FIGURE 23-30: MAXIMUM IDD vs.
FREQUENCY
(HS MODE, -40°C TO 85°C)
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
12 4 6 8 101214 161820
Frequency(MHz)
IDD(mA)
6.0V
5.5V
5.0V
4.5V
4.0V
Data based on matrix samples. See first page of this section for details.
Emwm
1997-2013 Microchip Technology Inc. DS30234E-page 287
PIC16C6X
24.0 PACKAGING INFORMATION
24.1 18-Lead Plastic Dual In-line (300 mil) (P)
Package Group: Plastic Dual In-Line (PLA)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
010010
A – 4.064 – 0.160
A1 0.381 – 0.015 –
A2 3.048 3.810 0.120 0.150
B 0.355 0.559 0.014 0.022
B1 1.524 1.524 Reference 0.060 0.060 Reference
C 0.203 0.381 Typical 0.008 0.015 Typical
D 22.479 23.495 0.885 0.925
D1 20.320 20.320 Reference 0.800 0.800 Reference
E 7.620 8.255 0.300 0.325
E1 6.096 7.112 0.240 0.280
e1 2.489 2.591 Typical 0.098 0.102 Typical
eA 7.620 7.620 Reference 0.300 0.300 Reference
eB 7.874 9.906 0.310 0.390
L 3.048 3.556 0.120 0.140
N1818 1818
S 0.889 – 0.035 –
S1 0.127 – 0.005 –
N
Pin No. 1
Indicator
Area
E1 E
S
D
B1
BD1
Base
Plane
Seating
Plane
S1
A1 A2 A
L
e1
C
eA
eB
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
28-Lead Plastic Dual In-line 300 mil SP
Etifimw
t \
t
PIC16C6X
DS30234E-page 288 1997-2013 Microchip Technology Inc.
24.2 28-Lead Plastic Dual In-line (300 mil) (SP)
Package Group: Plastic Dual In-Line (PLA)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
010010
A 3.632 4.572 0.143 0.180
A1 0.381 – 0.015 –
A2 3.175 3.556 0.125 0.140
B 0.406 0.559 0.016 0.022
B1 1.016 1.651 Typical 0.040 0.065 Typical
B2 0.762 1.016 4 places 0.030 0.040 4 places
B3 0.203 0.508 4 places 0.008 0.020 4 places
C 0.203 0.331 Typical 0.008 0.013 Typical
D 34.163 35.179 1.385 1.395
D1 33.020 33.020 Reference 1.300 1.300 Reference
E 7.874 8.382 0.310 0.330
E1 7.112 7.493 0.280 0.295
e1 2.540 2.540 Typical 0.100 0.100 Typical
eA 7.874 7.874 Reference 0.310 0.310 Reference
eB 8.128 9.652 0.320 0.380
L 3.175 3.683 0.125 0.145
N2828 2828
S 0.584 1.220 0.023 0.048
N
Pin No. 1
Indicator
Area
E1 E
S
D
D1
Base
Plane
Seating
Plane
A1 A2 A
L
e1
C
eA
eB
Detail A
Detail A
B2 B1
B
B3
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
\_n_n_n_n_1 x_n_n_u_1
Eiyflflfimfi
1997-2013 Microchip Technology Inc. DS30234E-page 289
PIC16C6X
24.3 40-Lead Plastic Dual In-line (600 mil) (P)
Package Group: Plastic Dual In-Line (PLA)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
010010
A – 5.080 – 0.200
A1 0.381 – 0.015 –
A2 3.175 4.064 0.125 0.160
B 0.355 0.559 0.014 0.022
B1 1.270 1.778 Typical 0.050 0.070 Typical
C 0.203 0.381 Typical 0.008 0.015 Typical
D 51.181 52.197 2.015 2.055
D1 48.260 48.260 Reference 1.900 1.900 Reference
E 15.240 15.875 0.600 0.625
E1 13.462 13.970 0.530 0.550
e1 2.489 2.591 Typical 0.098 0.102 Typical
eA 15.240 15.240 Reference 0.600 0.600 Reference
eB 15.240 17.272 0.600 0.680
L 2.921 3.683 0.115 0.145
N4040 4040
S 1.270 – 0.050 –
S1 0.508 – 0.020 –
N
Pin No. 1
Indicator
Area
E1 E
S
D
B1
BD1
Base
Plane
Seating
Plane
S1
A1 A2 A
L
e1
C
eA
eB
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
1B-Lead Plastic Surface Mount SOIC - Wide 300 mil Bod SO
Win flflflfl ”72:7
* x \
UUUUMUU
4% : fifik
PIC16C6X
DS30234E-page 290 1997-2013 Microchip Technology Inc.
24.4 18-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body) (SO)
Package Group: Plastic SOIC (SO)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
0808
A 2.362 2.642 0.093 0.104
A1 0.101 0.300 0.004 0.012
B 0.355 0.483 0.014 0.019
C 0.241 0.318 0.009 0.013
D 11.353 11.735 0.447 0.462
E 7.416 7.595 0.292 0.299
e 1.270 1.270 Reference 0.050 0.050 Reference
H 10.007 10.643 0.394 0.419
h 0.381 0.762 0.015 0.030
L 0.406 1.143 0.016 0.045
N1818 1818
CP – 0.102 – 0.004
B
e
N
Index
Area
Chamfer
h x 45
EH
123
CP
h x 45
C
L
Seating
Plane
Base
Plane
D
A1 A
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
Afififlwflflflfl
’* Q\ I} ifi:iijL4
x a «r
UUUU‘UUU i
A§ : @fiy
1997-2013 Microchip Technology Inc. DS30234E-page 291
PIC16C6X
24.5 28-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body) (SO)
Package Group: Plastic SOIC (SO)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
0808
A 2.362 2.642 0.093 0.104
A1 0.101 0.300 0.004 0.012
B 0.355 0.483 0.014 0.019
C 0.241 0.318 0.009 0.013
D 17.703 18.085 0.697 0.712
E 7.416 7.595 0.292 0.299
e 1.270 1.270 Typical 0.050 0.050 Typical
H 10.007 10.643 0.394 0.419
h 0.381 0.762 0.015 0.030
L 0.406 1.143 0.016 0.045
N2828 2828
CP – 0.102 – 0.004
B
e
N
Index
Area
Chamfer
h x 45
EH
123
CP
h x 45
C
L
Seating
Plane
Base
Plane
D
A1 A
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
18-Lead Ceramic CERDIP Dual In-Iine with Window (300 mil) (JW)
r—‘r—H—H—H—H—H—H—Hfi
uuuuuuuuu
PIC16C6X
DS30234E-page 292 1997-2013 Microchip Technology Inc.
24.6 18-Lead Ceramic CERDIP Dual In-line with Window (300 mil) (JW)
Package Group: Ceramic CERDIP Dual In-Line (CDP)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
010010
A — 5.080 — 0.200
A1 0.381 1.778 0.015 0.070
A2 3.810 4.699 0.150 0.185
A3 3.810 4.445 0.150 0.175
B 0.355 0.585 0.014 0.023
B1 1.270 1.651 Typical 0.050 0.065 Typical
C 0.203 0.381 Typical 0.008 0.015 Typical
D 22.352 23.622 0.880 0.930
D1 20.320 20.320 Reference 0.800 0.800 Reference
E 7.620 8.382 0.300 0.330
E1 5.588 7.874 0.220 0.310
e1 2.540 2.540 Reference 0.100 0.100 Reference
eA 7.366 8.128 Typical 0.290 0.320 Typical
eB 7.620 10.160 0.300 0.400
L 3.175 3.810 0.125 0.150
N1818 1818
S 0.508 1.397 0.020 0.055
S1 0.381 1.270 0.015 0.050
N
Pin No. 1
Indicator
Area
E1 E
S
D
B1
BD1
Base
Plane
Seating
Plane
S1
A1 A3 A
L
C
eA
eB
e1 A2
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
23-Lead Ceramic CERDIP Dual In-Iine with Window (300 mil” (JW)
AWWJWW l “K" R ;L
\:1 fijflumflfl:
1997-2013 Microchip Technology Inc. DS30234E-page 293
PIC16C6X
24.7 28-Lead Ceramic CERDIP Dual In-line with Window (300 mil)) (JW)
Package Group: Ceramic CERDIP Dual In-Line (CDP)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
010010
A 3.30 5.84 .130 0.230
A1 0.38 — 0.015 —
A2 2.92 4.95 0.115 0.195
B 0.35 0.58 0.014 0.023
B1 1.14 1.78 Typical 0.045 0.070 Typical
C 0.20 0.38 Typical 0.008 0.015 Typical
D 34.54 37.72 1.360 1.485
D2 32.97 33.07 Reference 1.298 1.302 Reference
E 7.62 8.25 0.300 0.325
E1 6.10 7.87 0.240 0.310
e 2.54 2.54 Typical 0.100 0.100 Typical
eA 7.62 7.62 Reference 0.300 0.300 Reference
eB — 11.43 — 0.450
L 2.92 5.08 0.115 0.200
N2828 2828
D1 0.13 — 0.005 —
N
Pin No. 1
Indicator
Area
E1 E
D
B1
BD2
Base
Plane
Seating
Plane
D1
A1 A2 A
L
e1
C
eA
eB
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
40-Lead Ceramic CERDIP Dual In-Iine with Window (600 mil) (JW)
PIC16C6X
DS30234E-page 294 1997-2013 Microchip Technology Inc.
24.8 40-Lead Ceramic CERDIP Dual In-line with Window (600 mil) (JW)
Package Group: Ceramic CERDIP Dual In-Line (CDP)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
010010
A 4.318 5.715 0.170 0.225
A1 0.381 1.778 0.015 0.070
A2 3.810 4.699 0.150 0.185
A3 3.810 4.445 0.150 0.175
B 0.355 0.585 0.014 0.023
B1 1.270 1.651 Typical 0.050 0.065 Typical
C 0.203 0.381 Typical 0.008 0.015 Typical
D 51.435 52.705 2.025 2.075
D1 48.260 48.260 Reference 1.900 1.900 Reference
E 15.240 15.875 0.600 0.625
E1 12.954 15.240 0.510 0.600
e1 2.540 2.540 Reference 0.100 0.100 Reference
eA 14.986 16.002 Typical 0.590 0.630 Typical
eB 15.240 18.034 0.600 0.710
L 3.175 3.810 0.125 0.150
N4040 4040
S 1.016 2.286 0.040 0.090
S1 0.381 1.778 0.015 0.070
N
Pin No. 1
Indicator
Area
E1 E
S
D
B1
BD1
Base
Plane
Seating
Plane
S1
A1 A3 AA2
L
e1
C
eA
eB
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
23-Lead Ceramic Side Erazed Dual In-Line with Window 300 mil JW
1997-2013 Microchip Technology Inc. DS30234E-page 295
PIC16C6X
24.9 28-Lead Ceramic Side Brazed Dual In-Line with Window (300 mil) (JW)
Package Group: Ceramic Side Brazed Dual In-Line (CER)
Symbol Millimeters Inches
Min Max Notes Min Max Notes
010010
A 3.937 5.030 0.155 0.198
A1 1.016 1.524 0.040 0.060
A2 2.921 3.506 0.115 0.138
A3 1.930 2.388 0.076 0.094
B 0.406 0.508 0.016 0.020
B1 1.219 1.321 Typical 0.048 0.052
C 0.228 0.305 Typical 0.009 0.012
D 35.204 35.916 1.386 1.414
D1 32.893 33.147 Reference 1.295 1.305
E 7.620 8.128 0.300 0.320
E1 7.366 7.620 0.290 0.300
e1 2.413 2.667 Typical 0.095 0.105
eA 7.366 7.874 Reference 0.290 0.310
eB 7.594 8.179 0.299 0.322
L 3.302 4.064 0.130 0.160
N2828 2828
S 1.143 1.397 0.045 0.055
S1 0.533 0.737 0.021 0.029
E1 E
S
Base
Plane
Seating
Plane
B1
B
S1
D
LA1
A2A3
A
e1
Pin #1
Indicator Area
D1
C
eA
eB
N
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2B-Lead Plastic Surface MouM (SSOP - 209 mil Bodv 5.30 mm) (55)
NW
l (J\\\\/L/
: + F /
\
HHHHHHHHHHHHHH
(H HHHHHHHHHHM
PIC16C6X
DS30234E-page 296 1997-2013 Microchip Technology Inc.
24.10 28-Lead Plastic Surface Mount (SSOP - 209 mil Body 5.30 mm) (SS)
Package Group: Plastic SSOP
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
0808
A 1.730 1.990 0.068 0.078
A1 0.050 0.210 0.002 0.008
B 0.250 0.380 0.010 0.015
C 0.130 0.220 0.005 0.009
D 10.070 10.330 0.396 0.407
E 5.200 5.380 0.205 0.212
e 0.650 0.650 Reference 0.026 0.026 Reference
H 7.650 7.900 0.301 0.311
L 0.550 0.950 0.022 0.037
N2828 2828
CP - 0.102 - 0.004
Index
area
N
H
123
E
eB
CP
D
A
A1
Base plane
Seating plane
L
C
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
44-Lead Plaslic Leaded Chi Carrier S uale PLCC
1997-2013 Microchip Technology Inc. DS30234E-page 297
PIC16C6X
24.11 44-Lead Plastic Leaded Chip Carrier (Square) (PLCC)
Package Group: Plastic Leaded Chip Carrier (PLCC)
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
A 4.191 4.572 0.165 0.180
A1 2.413 2.921 0.095 0.115
D 17.399 17.653 0.685 0.695
D1 16.510 16.663 0.650 0.656
D2 15.494 16.002 0.610 0.630
D3 12.700 12.700 Reference 0.500 0.500 Reference
E 17.399 17.653 0.685 0.695
E1 16.510 16.663 0.650 0.656
E2 15.494 16.002 0.610 0.630
E3 12.700 12.700 Reference 0.500 0.500 Reference
N4444 4444
CP – 0.102 – 0.004
LT 0.203 0.381 0.008 0.015
S
0.177
.007 BD-E
-A-
0.254
D1
D
3
3
3
-C-
-F-
-D-
4
9
8
-B-
-E-
S
0.177
.007 AF-G
S
S
EE1
-H-
-G-
6
2
3
.010 Max
1.524
.060
10
2
11
0.508
.020
1.651
.065
R1.14/0.64
.045/.025
R1.14/0.64
.045/.025
1.651
.065
0.508
.020 -H-
11
0.254
.010 Max
6
Min
0.812/0.661
.032/.026 3
-C-
0.64
.025 Min
5
0.533/0.331
.021/.013
0.177
.007 MAF-G S ,D-E S
1.27
.050
2 Sides
A
S
0.177
.007 BA
S
D3/E3
D20.101
.004
0.812/0.661
.032/.026
S
0.38
.015 F-G
4
S
0.38
.015 F-G
E2
D
-H-
A1
Seating
Plane
2 Sides
N Pics
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
lid-Lead Plastic Surface MounHMOFP1DX1O mm BodV1.6/O.15 mm Lead Form) (P0)
. AD ml:
83 @H @‘61
i ‘ ‘ ‘ :*
J A \ /
U MUN
/
x L‘”
eB-I (SEA
$ @H @W‘AA
4k ,k i
PIC16C6X
DS30234E-page 298 1997-2013 Microchip Technology Inc.
24.12 44-Lead Plastic Surface Mount (MQFP 10x10 mm Body 1.6/0.15 mm Lead Form) (PQ)
Package Group: Plastic MQFP
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
0707
A 2.000 2.350 0.078 0.093
A1 0.050 0.250 0.002 0.010
A2 1.950 2.100 0.768 0.083
b 0.300 0.450 Typical 0.011 0.018 Typical
C 0.150 0.180 0.006 0.007
D 12.950 13.450 0.510 0.530
D1 9.900 10.100 0.390 0.398
D3 8.000 8.000 Reference 0.315 0.315 Reference
E 12.950 13.450 0.510 0.530
E1 9.900 10.100 0.390 0.398
E3 8.000 8.000 Reference 0.315 0.315 Reference
e 0.800 0.800 0.031 0.032
L 0.730 1.030 0.028 0.041
N4444 4444
CP 0.102 – 0.004 –
Index
area
9b
TYP 4x
Base
Plane
A2
eB
A
A1
Seating
Plane
6
D
D1
D3
4
5 7
E3E1E
10
0.20 M A-B
0.05 mm/mm D
HSSD
0.20 M A-B
CSSD
75
4
0.20 M A-B
CSSD
0.20 M A-B
HSSD
0.05 mm/mm A-B
C
L
1.60 Ref.
0.13/0.30 R
0.13 R min.
0.20 min.
PA R T I N G
LINE
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
44-Lead Plastic Suriace Mounl (TQFP 10x10 mm BOdV1.0/O.10 mm Lead Form) (T0)
;\
xxf
,
H1 0 05 Mm
R (ma/0,2 f
#4 3m
§§ {T*
f w
* Ease Meta Lead F
¢L1+
1997-2013 Microchip Technology Inc. DS30234E-page 299
PIC16C6X
24.13 44-Lead Plastic Surface Mount (TQFP 10x10 mm Body 1.0/0.10 mm Lead Form) (TQ)
Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010”) per
side. D1 and E1 dimensions including mold mismatch.
2: Dimension “b” does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m
(0.003”)max.
3: This outline conforms to JEDEC MS-026.
Package Group: Plastic TQFP
Symbol
Millimeters Inches
Min Max Notes Min Max Notes
A 1.00 1.20 0.039 0.047
A1 0.05 0.15 0.002 0.006
A2 0.95 1.05 0.037 0.041
D 11.75 12.25 0.463 0.482
D1 9.90 10.10 0.390 0.398
E 11.75 12.25 0.463 0.482
E1 9.90 10.10 0.390 0.398
L 0.45 0.75 0.018 0.030
e 0.80 BSC 0.031 BSC
b 0.30 0.45 0.012 0.018
b1 0.30 0.40 0.012 0.016
c 0.09 0.20 0.004 0.008
c1 0.09 0.16 0.004 0.006
N4444 4444
0707
D
E
D1
E1
Pin#1
2
e
1.0ø (0.039ø) Ref.
Option 1 (TOP side)
Pin#1
2
Option 2 (TOP side)
3.0ø (0.118ø) Ref.
Detail A
Detail B
L
1.00 Ref.
A2
A1
Ab
b1
cc1
Base Metal
Detail A
Lead Finish
Detail B
11
/13
(4x)
0
Min
11
/13
(4x)
R1 0.08 Min
R 0.08/0.20
Gage Plane
0.250
L
L1
S
0.20
Min
1.00 Ref
Detail B
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
Package Marking Information
0 Q
‘O
0 Q
PIC16C6X
DS30234E-page 300 1997-2013 Microchip Technology Inc.
24.14 Package Marking Information
Legend: MM...M
XX...X
AA
BB
C
D1
D2
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
Mask revision number for microcontroller
Mask revision number for EEPROM
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
*
MMMMMMMMMMMMM
XXXXXXXXXXXXXXXX
AABBCDE
18-Lead PDIP
18-Lead SOIC
XXXXXXXXXXXX
AABBCDE
XXXXXXXXXXXX
MMMMMMMMMM
MMMMMM
XXXXXXXX
AABBCDE
18-Lead CERDIP Windowed
PIC16C61-04/P
9450CBA
Example
Example
-20/SO
9449CBA
PIC16C61
PIC16C61
/JW
9440CBT
Example
S = Tempe, Arizona, U.S.A.
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
AABBCAE
28-Lead PDIP (.300 MIL)
PIC16C63-04I/SP
9452CAN
Example
Package Marking Inlolmation Conl'd
O Q Mama:
0
M01 «2 M
d5 as
|\
\ 0 rs Mm",
O
1997-2013 Microchip Technology Inc. DS30234E-page 301
PIC16C6X
Package Marking Information (Cont’d)
Legend: MM...M
XX...X
AA
BB
C
D1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
*
S = Tempe, Arizona, U.S.A.
AABBCAE
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCAE
XXXXXXXXXXXXXXXXXXXX
MMMMMMMMMMMMMMMMMMXX
28-Lead SOIC
28-Lead SSOP
9517SBP
20I/SS025
PIC16C62
9515SBA
PIC16C62-20/S0111
Example
Example
Example28-Lead Side Brazed Skinny Windowed
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
Example
PIC16C62/JW
9517SBT
28-Lead CERDIP Skinny Windowed
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
AABBCDE
PIC16C66/JW
9517CAT
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
AABBCDE
40-Lead PDIP
MMMMMMMMMMMMMM
9510CAA
Example
PIC16C65-04/P
Package Marking Information Cont’d
“6‘0 WW)
Mel-=— ’ M K
Msnucnw Mann:
G o
3‘ G
o o
G G
PIC16C6X
DS30234E-page 302 1997-2013 Microchip Technology Inc.
Package Marking Information (Cont’d)
Legend: MM...M
XX...X
AA
BB
C
D1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
*
44-Lead MQFP
XXXXXXXXXX
AABBCDE
MMMMMMMM
XXXXXXXXXX
44-Lead PLCC
MMMMMMMM
AABBCDE
XXXXXXXXXX
XXXXXXXXXX
MMMMMMMMM
XXXXXXXXXXX
AABBCDE
40-Lead CERDIP Windowed
XXXXXXXXXXX
Example
-04/PQ
9444CAP
PIC16C64
Example
PIC16C64
9442CAN
-20/L
PIC16C67/JW
9450CAT
Example
S = Tempe, Arizona, U.S.A.
44-Lead TQFP
XXXXXXXXXX
AABBCDE
MMMMMMMM
XXXXXXXXXX
Example
-10/TQ
AABBCDE
PIC16C64A
1997-2013 Microchip Technology Inc. DS30234E-page 303
PIC16C6X
APPENDIX A: MODIFICATIONS
The following are the list of modifications over the
PIC16C5X microcontroller family:
1. Instruction word length is increased to 14-bits.
This allows larger page sizes both in program
memory (2K now as opposed to 512 before) and
register file (128 bytes now versus 32 bytes
before).
2. A PC high latch register (PCLATH) is added to
handle program memory paging. PA2, PA1, PA0
bits are removed from STATUS register.
3. Data memory paging is redefined slightly. STA-
TUS register is modified.
4. Four new instructions have been added:
RETURN, RETFIE, ADDLW, and SUBLW.
Two instructions TRIS and OPTION are being
phased out although they are kept for compati-
bility with PIC16C5X.
5. OPTION and TRIS registers are made address-
able.
6. Interrupt capability is added. Interrupt vector is
at 0004h.
7. Stack size is increased to 8 deep.
8. Reset vector is changed to 0000h.
9. Reset of all registers is revisited. Five different
reset (and wake-up) types are recognized. Reg-
isters are reset differently.
10. Wake-up from SLEEP through interrupt is
added.
11. Two separate timers, Oscillator Start-up Timer
(OST) and Power-up Timer (PWRT), are
included for more reliable power-up. These tim-
ers are invoked selectively to avoid unnecessary
delays on power-up and wake-up.
12. PORTB has weak pull-ups and interrupt on
change feature.
13. Timer0 pin is also a port pin (RA4/T0CKI) now.
14. FSR is made a full 8-bit register.
15. “In-circuit programming” is made possible. The
user can program PIC16CXX devices using only
five pins: VDD, VSS, VPP, RB6 (clock) and RB7
(data in/out).
16. Power Control register (PCON) is added with a
Power-on Reset status bit (POR).(Not on the
PIC16C61).
17. Brown-out Reset has been added to the follow-
ing devices:
PIC16C62A/R62/63/R63/64A/R64/65A/R65/66/
67.
APPENDIX B: COMPATIBILITY
To convert code written for PIC16C5X to PIC16CXX,
the user should take the following steps:
1. Remove any program memory page select
operations (PA2, PA1, PA0 bits) for CALL,
GOTO.
2. Revisit any computed jump operations (write to
PC or add to PC, etc.) to make sure page bits
are set properly under the new scheme.
3. Eliminate any data memory page switching.
Redefine data variables to reallocate them.
4. Verify all writes to STATUS, OPTION, and FSR
registers since these have changed.
5. Change reset vector to 0000h.
PIC16C6X
DS30234E-page 304 1997-2013 Microchip Technology Inc.
APPENDIX C: WHAT’S NEW
Added PIC16CR63 and PIC16CR65 devices.
Added PIC16C66 and PIC16C67 devices. The
PIC16C66/67 devices have 368 bytes of data memory
distributed in 4 banks and 8K of program memory in 4
pages. These two devices have an enhanced SPI that
supports both clock phase and polarity. The USART
has been enhanced.
When upgrading to the PIC16C66/67 please note that
the upper 16 bytes of data memory in banks 1,2, and 3
are mapped into bank 0. This may require relocation of
data memory usage in the user application code.
Q-cycles for instruction execution were added to Sec-
tion 14.0 Instruction Set Summary.
APPENDIX D: WHAT’S CHANGED
Minor changes, spelling and grammatical changes.
Divided SPI section into SPI for the PIC16C66/67
(Section 11.3) and SPI for all other devices
(Section 11.2).
Added the following note for the USART. This applies to
all devices except the PIC16C66 and PIC16C67.
For the PIC16C63/R63/65/65A/R65 the asynchronous
high speed mode (BRGH = 1) may experience a high
rate of receive errors. It is recommended that BRGH =
0. If you desire a higher baud rate than BRGH = 0 can
support, refer to the device errata for additional infor-
mation or use the PIC16C66/67.
APPENDIX E: REVISION E
January 2013 - Added a note to each package drawing.
P|C120XXX Family of Devices
P|C14COOO Family ol Devices
1997-2013 Microchip Technology Inc. DS30234E-page 305
PIC16C6X
APPENDIX F: PIC16/17 MICROCONTROLLERS
F.1 PIC12CXXX Family of Devices
F.2 PIC14C000 Family of Devices
PIC12C508 PIC12C509 PIC12C671 PIC12C672
Clock Maximum Frequency
of Operation (MHz)
4444
Memory EPROM Program Memory 512 x 12 1024 x 12 1024 x 14 2048 x 14
Data Memory (bytes) 25 41 128 128
Peripherals Timer Module(s) TMR0 TMR0 TMR0 TMR0
A/D Converter (8-bit) Channels — — 4 4
Features
Wake-up from SLEEP on
pin change
Yes Yes Yes Yes
I/O Pins 5 5 5 5
Input Pins 1 1 1 1
Internal Pull-ups Yes Yes Yes Yes
Voltage Range (Volts) 2.5-5.5 2.5-5.5 2.5-5.5 2.5-5.5
In-Circuit Serial Programming Yes Yes Yes Yes
Number of Instructions 33 33 35 35
Packages 8-pin DIP, SOIC 8-pin DIP, SOIC 8-pin DIP, SOIC 8-pin DIP, SOIC
All PIC12C5XX devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability.
All PIC12C5XX devices use serial programming with data pin GP1 and clock pin GP0.
PIC14C000
Clock Maximum Frequency of Operation (MHz) 20
Memory
EPROM Program Memory (x14 words) 4K
Data Memory (bytes) 192
Timer Module(s) TMR0
ADTMR
Peripherals Serial Port(s)
(SPI/I2C, USART)
I2C with SMBus
Support
Features
Slope A/D Converter Channels 8 External; 6 Internal
Interrupt Sources 11
I/O Pins 22
Voltage Range (Volts) 2.7-6.0
In-Circuit Serial Programming Yes
Additional On-chip Features Internal 4MHz Oscillator, Bandgap Reference,Temperature Sensor,
Calibration Factors, Low Voltage Detector, SLEEP, HIBERNATE,
Comparators with Programmable References (2)
Packages 28-pin DIP (.300 mil), SOIC, SSOP
PIC1GC15X Family of Devices
PIC1GCSX Family of De ces
PIC16C6X
DS30234E-page 306 1997-2013 Microchip Technology Inc.
F.3 PIC16C15X Family of Devices
F.4 PIC16C5X Family of Devices
PIC16C154 PIC16CR154 PIC16C156 PIC16CR156 PIC16C158 PIC16CR158
Clock Maximum Frequency
of Operation (MHz)
20 20 20 20 20 20
Memory
EPROM Program Memory
(x12 words)
512 — 1K — 2K —
ROM Program Memory
(x12 words)
—512—1K— 2K
RAM Data Memory (bytes) 25 25 25 25 73 73
Peripherals Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0 TMR0
Features
I/O Pins 12 12 12 12 12 12
Voltage Range (Volts) 3.0-5.5 2.5-5.5 3.0-5.5 2.5-5.5 3.0-5.5 2.5-5.5
Number of Instructions 33 33 33 33 33 33
Packages 18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high
I/O current capability.
PIC16C52 PIC16C54 PIC16C54A PIC16CR54A PIC16C55 PIC16C56
Clock Maximum Frequency
of Operation (MHz)
420 20 20 2020
Memory
EPROM Program Memory
(x12 words)
384 512 512 — 512 1K
ROM Program Memory
(x12 words)
—— — 512 — —
RAM Data Memory (bytes) 25 25 25 25 24 25
Peripherals Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0 TMR0
Features
I/O Pins 12 12 12 12 20 12
Voltage Range (Volts) 2.5-6.25 2.5-6.25 2.0-6.25 2.0-6.25 2.5-6.25 2.5-6.25
Number of Instructions 33 33 33 33 33 33
Packages 18-pin DIP,
SOIC
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
28-pin DIP,
SOIC,
SSOP
18-pin DIP,
SOIC;
20-pin SSOP
PIC16C57 PIC16CR57B PIC16C58A PIC16CR58A
Clock Maximum Frequency
of Operation (MHz)
20 20 20 20
Memory
EPROM Program Memory
(x12 words)
2K — 2K —
ROM Program Memory
(x12 words)
—2K — 2K
RAM Data Memory (bytes) 72 72 73 73
Peripherals Timer Module(s) TMR0 TMR0 TMR0 TMR0
Features
I/O Pins 20 20 12 12
Voltage Range (Volts) 2.5-6.25 2.5-6.25 2.0-6.25 2.5-6.25
Number of Instructions 33 33 33 33
Packages 28-pin DIP,
SOIC,
SSOP
28-pin DIP, SOIC,
SSOP
18-pin DIP, SOIC;
20-pin SSOP
18-pin DIP, SOIC;
20-pin SSOP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer (except PIC16C52), selectable code protect and high
I/O current capability.
P|C16055X Family ol Devices
P|C16062X and P|C1SCE4X Fa II of Devices
1997-2013 Microchip Technology Inc. DS30234E-page 307
PIC16C6X
F.5 PIC16C55X Family of Devices
F.6 PIC16C62X and PIC16C64X Family of Devices
PIC16C554 PIC16C556(1) PIC16C558
Clock Maximum Frequency of Operation (MHz) 20 20 20
Memory EPROM Program Memory (x14 words) 512 1K 2K
Data Memory (bytes) 80 80 128
Peripherals
Timer Module(s) TMR0 TMR0 TMR0
Comparators(s) — — —
Internal Reference Voltage — — —
Features
Interrupt Sources 3 3 3
I/O Pins 13 13 13
Voltage Range (Volts) 2.5-6.0 2.5-6.0 2.5-6.0
Brown-out Reset — — —
Packages 18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high
I/O current capability. All PIC16C5XX Family devices use serial programming with clock pin RB6 and data pin RB7.
Note 1: Please contact your local Microchip sales office for availability of these devices.
PIC16C620 PIC16C621 PIC16C622 PIC16C642 PIC16C662
Clock Maximum Frequency
of Operation (MHz)
20 20 20 20 20
Memory
EPROM Program Memory
(x14 words)
5121K2K4K4K
Data Memory (bytes) 80 80 128 176 176
Peripherals
Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0
Comparators(s) 22222
Internal Reference Voltage Yes Yes Yes Yes Yes
Features
Interrupt Sources 44445
I/O Pins 13 13 13 22 33
Voltage Range (Volts) 2.5-6.0 2.5-6.0 2.5-6.0 3.0-6.0 3.0-6.0
Brown-out Reset Yes Yes Yes Yes Yes
Packages 18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
28-pin PDIP,
SOIC,
Windowed
CDIP
40-pin PDIP,
Windowed
CDIP;
44-pin PLCC,
MQFP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high
I/O current capability. All PIC16C62X and PIC16C64X Family devices use serial programming with clock pin RB6 and data pin RB7.
PIC1GC7XX Family 0! Devces
PIC16C6X
DS30234E-page 308 1997-2013 Microchip Technology Inc.
F.7 PIC16C7XX Family of Devces
PIC16C710 PIC16C71 PIC16C711 PIC16C715 PIC16C72 PIC16CR72(1)
Clock Maximum Frequency
of Operation (MHz)
20 20 20 20 20 20
Memory
EPROM Program Memory
(x14 words)
5121K1K2K2K —
ROM Program Memory
(14K words)
—————2K
Data Memory (bytes) 36 36 68 128 128 128
Peripherals
Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
Capture/Compare/
PWM Module(s)
————1 1
Serial Port(s)
(SPI/I2C, USART)
— — — — SPI/I2C SPI/I2C
Parallel Slave Port — — — — — —
A/D Converter (8-bit) Channels 4 4 4 4 5 5
Features
Interrupt Sources 4 4 4 4 8 8
I/O Pins 13 13 13 13 22 22
Voltage Range (Volts) 3.0-6.0 3.0-6.0 3.0-6.0 3.0-5.5 2.5-6.0 3.0-5.5
In-Circuit Serial Programming Yes Yes Yes Yes Yes Yes
Brown-out Reset Yes — Yes Yes Yes Yes
Packages 18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC
18-pin DIP,
SOIC;
20-pin SSOP
18-pin DIP,
SOIC;
20-pin SSOP
28-pin SDIP,
SOIC, SSOP
28-pin SDIP,
SOIC, SSOP
PIC16C73A PIC16C74A PIC16C76 PIC16C77
Clock Maximum Frequency of Oper-
ation (MHz)
20 20 20 20
Memory
EPROM Program Memory
(x14 words)
4K 4K 8K 8K
Data Memory (bytes) 192 192 368 368
Peripherals
Timer Module(s) TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
Capture/Compare/PWM Mod-
ule(s)
2222
Serial Port(s) (SPI/I2C,
USART)
SPI/I2C, USART SPI/I2C, USART SPI/I2C, USART SPI/I2C, USART
Parallel Slave Port — Yes — Yes
A/D Converter (8-bit) Channels 5 8 5 8
Features
Interrupt Sources 11 12 11 12
I/O Pins 22 33 22 33
Voltage Range (Volts) 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0
In-Circuit Serial Programming Yes Yes Yes Yes
Brown-out Reset Yes Yes Yes Yes
Packages 28-pin SDIP,
SOIC
40-pin DIP;
44-pin PLCC,
MQFP, TQFP
28-pin SDIP,
SOIC
40-pin DIP;
44-pin PLCC,
MQFP, TQFP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capabil-
ity. All PIC16C7XX Family devices use serial programming with clock pin RB6 and data pin RB7.
Note 1: Please contact your local Microchip sales office for availability of these devices.
P|C1SCSX Family ol Devices
P|C1609XX Fam 1 Of Devices
1997-2013 Microchip Technology Inc. DS30234E-page 309
PIC16C6X
F.8 PIC16C8X Family of Devices
F.9 PIC16C9XX Family Of Devices
PIC16F83 PIC16CR83 PIC16F84 PIC16CR84
Clock Maximum Frequency
of Operation (MHz)
10 10 10 10
Flash Program Memory 512 — 1K —
Memory
EEPROM Program Memory — — — —
ROM Program Memory — 512 — 1K
Data Memory (bytes) 36 36 68 68
Data EEPROM (bytes) 64 64 64 64
Peripher-
als
Timer Module(s) TMR0 TMR0 TMR0 TMR0
Features
Interrupt Sources 4 4 4 4
I/O Pins 13 13 13 13
Voltage Range (Volts) 2.0-6.0 2.0-6.0 2.0-6.0 2.0-6.0
Packages 18-pin DIP,
SOIC
18-pin DIP,
SOIC
18-pin DIP,
SOIC
18-pin DIP,
SOIC
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capabil-
ity. All PIC16C8X Family devices use serial programming with clock pin RB6 and data pin RB7.
PIC16C923 PIC16C924
Clock Maximum Frequency of Operation (MHz) 8 8
Memory EPROM Program Memory 4K 4K
Data Memory (bytes) 176 176
Peripherals
Timer Module(s) TMR0,
TMR1,
TMR2
TMR0,
TMR1,
TMR2
Capture/Compare/PWM Module(s) 1 1
Serial Port(s)
(SPI/I2C, USART)
SPI/I2C SPI/I2C
Parallel Slave Port — —
A/D Converter (8-bit) Channels — 5
LCD Module 4 Com,
32 Seg
4 Com,
32 Seg
Features
Interrupt Sources 8 9
I/O Pins 25 25
Input Pins 27 27
Voltage Range (Volts) 3.0-6.0 3.0-6.0
In-Circuit Serial Programming Yes Yes
Brown-out Reset — —
Packages 64-pin SDIP(1),
TQFP;
68-pin PLCC,
Die
64-pin SDIP(1),
TQFP;
68-pin PLCC,
Die
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capa-
bility. All PIC16C9XX Family devices use serial programming with clock pin RB6 and data pin RB7.
PIC17CXXX Family ol Devices
PIC16C6X
DS30234E-page 310 1997-2013 Microchip Technology Inc.
F.10 PIC17CXXX Family of Devices
PIC17C42A PIC17CR42 PIC17C43 PIC17CR43 PIC17C44
Clock Maximum Frequency
of Operation (MHz)
33 33 33 33 33
Memory
EPROM Program Memory
(words)
2K — 4K — 8K
ROM Program Memory
(words)
—2K—4K—
RAM Data Memory (bytes) 232 232 454 454 454
Peripherals
Timer Module(s) TMR0,
TMR1,
TMR2,
TMR3
TMR0,
TMR1,
TMR2,
TMR3
TMR0,
TMR1,
TMR2,
TMR3
TMR0,
TMR1,
TMR2,
TMR3
TMR0,
TMR1,
TMR2,
TMR3
Captures/PWM Module(s)22222
Serial Port(s) (USART) Yes Yes Yes Yes Yes
Features
Hardware Multiply Yes Yes Yes Yes Yes
External Interrupts Yes Yes Yes Yes Yes
Interrupt Sources1111111111
I/O Pins 33 33 33 33 33
Voltage Range (Volts) 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0
Number of Instructions 58 58 58 58 58
Packages 40-pin DIP;
44-pin PLCC,
MQFP, TQFP
40-pin DIP;
44-pin PLCC,
MQFP, TQFP
40-pin DIP;
44-pin PLCC,
MQFP, TQFP
40-pin DIP;
44-pin PLCC,
MQFP, TQFP
40-pin DIP;
44-pin PLCC,
MQFP, TQFP
PIC17C752 PIC17C756
Clock Maximum Frequency
of Operation (MHz)
33 33
Memory
EPROM Program Memory
(words)
8K 16K
ROM Program Memory
(words)
——
RAM Data Memory (bytes) 454 902
Peripherals
Timer Module(s) TMR0,
TMR1,
TMR2,
TMR3
TMR0,
TMR1,
TMR2,
TMR3
Captures/PWM Module(s) 4/3 4/3
Serial Port(s) (USART) 2 2
Features
Hardware Multiply Yes Yes
External Interrupts Yes Yes
Interrupt Sources 18 18
I/O Pins 50 50
Voltage Range (Volts) 3.0-6.0 3.0-6.0
Number of Instructions 58 58
Packages 64-pin DIP;
68-pin LCC,
68-pin TQFP
64-pin DIP;
68-pin LCC,
68-pin TQFP
All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high
I/O current capability.
1997-2013 Microchip Technology Inc. DS30234E-page 311
PIC16C6X
PIN COMPATIBILITY
Devices that have the same package type and VDD,
VSS and MCLR pin locations are said to be pin
compatible. This allows these different devices to
operate in the same socket. Compatible devices may
only requires minor software modification to allow
proper operation in the application socket
(ex., PIC16C56 and PIC16C61 devices). Not all
devices in the same package size are pin compatible;
for example, the PIC16C62 is compatible with the
PIC16C63, but not the PIC16C55.
Pin compatibility does not mean that the devices offer
the same features. As an example, the PIC16C54 is
pin compatible with the PIC16C71, but does not have
an A/D converter, weak pull-ups on PORTB, or
interrupts.
TABLE F-1: PIN COMPATIBLE DEVICES
Pin Compatible Devices Package
PIC12C508, PIC12C509, PIC12C671, PIC12C672 8-pin
PIC16C154, PIC16CR154, PIC16C156,
PIC16CR156, PIC16C158, PIC16CR158,
PIC16C52, PIC16C54, PIC16C54A,
PIC16CR54A,
PIC16C56,
PIC16C58A, PIC16CR58A,
PIC16C61,
PIC16C554, PIC16C556, PIC16C558
PIC16C620, PIC16C621, PIC16C622
PIC16C641, PIC16C642, PIC16C661, PIC16C662
PIC16C710, PIC16C71, PIC16C711, PIC16C715
PIC16F83, PIC16CR83,
PIC16F84A, PIC16CR84
18-pin,
20-pin
PIC16C55, PIC16C57, PIC16CR57B 28-pin
PIC16CR62, PIC16C62A, PIC16C63, PIC16CR63,
PIC16C66, PIC16C72, PIC16C73A, PIC16C76
28-pin
PIC16CR64, PIC16C64A, PIC16C65A,
PIC16CR65, PIC16C67, PIC16C74A, PIC16C77
40-pin
PIC17CR42, PIC17C42A,
PIC17C43, PIC17CR43, PIC17C44
40-pin
PIC16C923, PIC16C924 64/68-pin
PIC17C756, PIC17C752 64/68-pin
PIC16C6X
DS30234E-page 312 1997-2013 Microchip Technology Inc.
NOTES:
1997-2013 Microchip Technology Inc. DS30234E-page 313
PIC16C6X
INDEX
Numerics
9-bit Receive Enable bit, RX9 ........................................... 106
9-bit Transmit Enable bit, TX9 .......................................... 105
9th bit of received data, RX9D .......................................... 106
9th bit of transmit data, TX9D ........................................... 105
A
Absolute Maximum
Ratings .............................. 163, 183, 199, 215, 231, 247, 263
ACK..................................................................... 96, 100, 101
ALU ....................................................................................... 9
Application Notes
AN552 (Implementing Wake-up on Key Stroke) ......... 53
AN556 (Implementing a Table Read) ......................... 48
AN594 (Using the CCP Modules) ............................... 77
Architectural Overview .......................................................... 9
B
Baud Rate Formula........................................................... 107
Baud Rate Generator........................................................ 107
Baud Rates
Asynchronous Mode ................................................. 108
Error, Calculating ...................................................... 107
RX Pin Sampling, Timing Diagrams.................. 110, 111
Sampling ................................................................... 110
Synchronous Mode ................................................... 108
BF ......................................................................... 84, 89, 100
Block Diagrams
Capture Mode Operation ............................................ 78
Compare Mode ........................................................... 79
Crystal Oscillator, Ceramic Resonator...................... 125
External Brown-out Protection .................................. 135
External Parallel Resonant Crystal Circuit ................ 127
External Power-on Reset .......................................... 135
External Series Resonant Crystal Circuit.................. 127
I2C Mode..................................................................... 99
In-circuit Programming Connections......................... 142
Interrupt Logic ........................................................... 137
On-chip Reset Circuit................................................ 128
Parallel Slave Port, PORTD-PORTE .......................... 61
PIC16C61 ................................................................... 10
PIC16C62 ................................................................... 11
PIC16C62A ................................................................. 11
PIC16C63 ................................................................... 12
PIC16C64 ................................................................... 11
PIC16C64A ................................................................. 11
PIC16C65 ................................................................... 12
PIC16C65A ................................................................. 12
PIC16C66 ................................................................... 13
PIC16C67 ................................................................... 13
PIC16CR62................................................................. 11
PIC16CR63................................................................. 12
PIC16CR64................................................................. 11
PIC16CR65................................................................. 12
PORTC ....................................................................... 55
PORTD (I/O Mode) ..................................................... 57
PORTE (I/O Mode) ..................................................... 58
PWM ........................................................................... 80
RA3:RA0 pins ............................................................. 51
RA4/T0CKI pin ............................................................ 51
RA5 pin ....................................................................... 51
RB3:RB0 pins ............................................................. 54
RB7:RB4 pins ....................................................... 53, 54
RC Oscillator Mode................................................... 127
SPI Master/Slave Connection..................................... 87
SSP in I2C Mode ........................................................ 99
SSP in SPI Mode.................................................. 86, 91
Timer0 ........................................................................ 65
Timer0/WDT Prescaler ............................................... 68
Timer1 ........................................................................ 72
Timer2 ........................................................................ 75
USART Receive ....................................................... 114
USART Transmit ...................................................... 112
Watchdog Timer ....................................................... 140
BOR .................................................................................. 129
BOR............................................................................ 47, 131
BRGH ............................................................................... 105
Brown-out Reset (BOR).................................................... 129
Brown-out Reset Status bit, BOR ....................................... 47
Buffer Full Status bit, BF............................................... 84, 89
C
C ......................................................................................... 35
C Compiler........................................................................ 161
Capture
Block Diagram ............................................................ 78
Mode........................................................................... 78
Pin Configuration ........................................................ 78
Prescaler .................................................................... 79
Software Interrupt ....................................................... 78
Capture Interrupt ................................................................ 78
Capture/Compare/PWM (CCP)
Capture Mode............................................................. 78
Capture Mode Block Diagram .................................... 78
CCP1 .......................................................................... 77
CCP2 .......................................................................... 77
Compare Mode........................................................... 79
Compare Mode Block Diagram .................................. 79
Overview..................................................................... 63
Prescaler .................................................................... 79
PWM Block Diagram .................................................. 80
PWM Mode................................................................. 80
PWM, Example Frequencies/Resolutions .................. 81
Section........................................................................ 77
Carry ..................................................................................... 9
Carry bit .............................................................................. 35
CCP Module Interaction...................................................... 77
CCP pin Configuration........................................................ 78
CCP to Timer Resource Use .............................................. 77
CCP1 Interrupt Enable bit, CCP1IE.................................... 38
CCP1 Interrupt Flag bit, CCP1IF ........................................ 41
CCP1 Mode Select bits....................................................... 78
CCP1CON ............................................ 24, 26, 28, 30, 32, 34
CCP1IE............................................................................... 38
CCP1IF ............................................................................... 41
CCP1M3:CCM1M0............................................................. 78
CCP1X:CCP1Y................................................................... 78
CCP2 Interrupt Enable bit, CCP2IE.................................... 45
CCP2 Interrupt Flag bit, CCP2IF ........................................ 46
CCP2 Mode Select bits....................................................... 78
CCP2CON ............................................ 24, 26, 28, 30, 32, 34
CCP2IE............................................................................... 45
CCP2IF ............................................................................... 46
CCP2M3:CCP2M0.............................................................. 78
CCP2X:CCP2Y................................................................... 78
CCPR1H............................................... 24, 26, 28, 30, 32, 34
CCPR1L ............................................... 24, 26, 28, 30, 32, 34
CCPR2H............................................... 24, 26, 28, 30, 32, 34
CCPR2L ............................................... 24, 26, 28, 30, 32, 34
CKE .................................................................................... 89
CKP .............................................................................. 85, 90
PIC16C6X
DS30234E-page 314 1997-2013 Microchip Technology Inc.
Clearing Interrupts............................................................... 53
Clock Polarity Select bit, CKP ....................................... 85, 90
Clock Polarity, SPI Mode .................................................... 87
Clock Source Select bit, CSRC......................................... 105
Clocking Scheme ................................................................ 18
Code Examples
Changing Between Capture Prescalers ...................... 79
Ensuring Interrupts are Globally Disabled ................ 136
Indirect Addressing ..................................................... 49
Initializing PORTA ....................................................... 51
Initializing PORTB ....................................................... 53
Initializing PORTC....................................................... 55
Loading the SSPBUF Register ................................... 86
Loading the SSPBUF register..................................... 91
Reading a 16-bit Free-running Timer.......................... 73
Read-Modify-Write on an I/O Port............................... 60
Saving Status, W, and PCLATH Registers ............... 139
Subroutine Call, Page0 to Page1................................ 49
Code Protection ................................................................ 142
Compare
Block Diagram............................................................. 79
Mode ........................................................................... 79
Pin Configuration ........................................................ 79
Software Interrupt ....................................................... 79
Special Event Trigger.................................................. 79
Computed GOTO ................................................................ 48
Configuration Bits .............................................................. 123
Configuration Word, Diagram............................................ 124
Connecting Two Microcontrollers........................................ 87
Continuous Receive Enable bit, CREN............................. 106
CREN ................................................................................ 106
CSRC ................................................................................ 105
D
D/A ................................................................................ 84, 89
Data/Address bit, D/A.................................................... 84, 89
Data Memory
Organization................................................................ 20
Section ........................................................................ 20
Data Sheet
Compatibility ............................................................. 307
Modifications ............................................................. 307
What’s New ............................................................... 308
DC ....................................................................................... 35
DC CHARACTERISTICS .. 164, 184, 200, 216, 232, 248, 264
Development Support ....................................................... 159
Development Tools ........................................................... 159
Device Drawings
18-Lead Ceramic CERDIP Dual In-line
with Window (300 mil) ............................................... 296
18-Lead Plastic Dual In-line (300 mil) ....................... 291
18-Lead Plastic Surface Mount
(SOIC - Wide, 300 mil Body).................................... 294
28-Lead Ceramic CERDIP Dual In-line with
Window (300 mil)) ..................................................... 297
28-Lead Ceramic Side Brazed Dual In-Line
with Window (300 mil) ............................................... 299
28-Lead Plastic Dual In-line (300 mil) ....................... 292
28-Lead Plastic Surface Mount
(SOIC - Wide, 300 mil Body)..................................... 295
28-Lead Plastic Surface Mount
(SSOP - 209 mil Body 5.30 mm)............................... 300
40-Lead Ceramic CERDIP Dual In-line
with Window (600 mil) ............................................... 298
40-Lead Plastic Dual In-line (600 mil) ....................... 293
44-Lead Plastic Leaded Chip Carrier (Square) ......... 301
44-Lead Plastic Surface Mount (MQFP
10x10 mm Body 1.6/0.15 mm Lead Form) ....... 302, 303
Device Varieties.................................................................... 7
Digit Carry............................................................................. 9
Digit Carry bit ...................................................................... 35
Direct Addressing ............................................................... 49
E
Electrical Characteristics .. 163, 183, 199, 215, 231, 247, 263
External Clock Synchronization, TMR0 .............................. 67
F
Family of Devices
PIC12CXXX.............................................................. 309
PIC14C000 ............................................................... 309
PIC16C15X............................................................... 310
PIC16C55X............................................................... 311
PIC16C5X................................................................. 310
PIC16C62X and PIC16C64X.................................... 311
PIC16C6X..................................................................... 6
PIC16C7XX .............................................................. 312
PIC16C8X................................................................. 313
PIC16C9XX .............................................................. 313
PIC17CXX ................................................................ 314
FERR ................................................................................ 106
Framing Error bit, FERR ................................................... 106
FSR......................... 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34
Fuzzy Logic Dev. System (
fuzzy
TECH-MP)........... 159, 161
G
General Description .............................................................. 5
General Purpose Registers ................................................ 20
GIE...................................................................................... 37
Global Interrupt Enable bit, GIE.......................................... 37
Graphs
PIC16C6X................................................................. 281
PIC16C61 ................................................................. 173
H
High Baud Rate Select bit, BRGH .................................... 105
I
I/O Ports, Section................................................................ 51
I2C
Addressing................................................................ 100
Addressing I2C Devices.............................................. 96
Arbitration ................................................................... 98
Block Diagram ............................................................ 99
Clock Synchronization ................................................ 98
Combined Format ....................................................... 97
I2C Operation.............................................................. 99
I2C Overview............................................................... 95
Initiating and Terminating Data Transfer .................... 95
Master Mode............................................................. 103
Master-Receiver Sequence ........................................ 97
Master-Transmitter Sequence .................................... 97
Mode........................................................................... 99
Mode Selection ........................................................... 99
Multi-master................................................................ 98
Multi-Master Mode.................................................... 103
Reception ................................................................. 101
Reception Timing Diagram ....................................... 101
SCL and SDA pins.................................................... 100
Slave Mode............................................................... 100
START ........................................................................ 95
STOP .................................................................... 95, 96
1997-2013 Microchip Technology Inc. DS30234E-page 315
PIC16C6X
Transfer Acknowledge ................................................ 96
Transmission............................................................. 102
ID Locations ...................................................................... 142
IDLE_MODE ..................................................................... 104
In-circuit Serial Programming............................................ 142
INDF...................................................... 24, 26, 28, 30, 32, 34
Indirect Addressing ............................................................. 49
Instruction Cycle ................................................................. 18
Instruction Flow/Pipelining .................................................. 18
Instruction Format ............................................................. 143
Instruction Set
ADDLW ..................................................................... 145
ADDWF ..................................................................... 145
ANDLW ..................................................................... 145
ANDWF ..................................................................... 145
BCF........................................................................... 146
BSF ........................................................................... 146
BTFSC ...................................................................... 146
BTFSS ...................................................................... 147
CALL ......................................................................... 147
CLRF......................................................................... 148
CLRW ....................................................................... 148
CLRWDT................................................................... 148
COMF ....................................................................... 149
DECF ........................................................................ 149
DECFSZ.................................................................... 149
GOTO ....................................................................... 150
INCF.......................................................................... 150
INCFSZ ..................................................................... 151
IORLW ...................................................................... 151
IORWF ...................................................................... 152
MOVF........................................................................ 152
MOVLW .................................................................... 152
MOVWF .................................................................... 152
NOP .......................................................................... 153
OPTION .................................................................... 153
RETFIE ..................................................................... 153
RETLW ..................................................................... 154
RETURN ................................................................... 154
RLF ........................................................................... 155
RRF........................................................................... 155
SLEEP ...................................................................... 156
SUBLW ..................................................................... 156
SUBWF ..................................................................... 157
SWAPF ..................................................................... 157
TRIS.......................................................................... 157
XORLW ..................................................................... 158
XORWF..................................................................... 158
Section ...................................................................... 143
Summary Table......................................................... 144
INTCON .................. 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34
INTE .................................................................................... 37
INTEDG .............................................................................. 36
Interrupt Edge Select bit, INTEDG ...................................... 36
Interrupt on Change Feature............................................... 53
Interrupts
Section ...................................................................... 136
CCP ............................................................................ 78
CCP1 .......................................................................... 38
CCP1 Flag bit.............................................................. 41
CCP2 Enable bit ......................................................... 45
CCP2 Flag bit.............................................................. 46
Context Saving.......................................................... 139
Parallel Slave Port Flag bit.......................................... 43
Parallel Slave Prot Read/Write Enable bit .................. 39
Port RB ....................................................................... 53
RB0/INT .............................................................. 54, 138
RB0/INT Timing Diagram ......................................... 138
Receive Flag bit.......................................................... 42
Timer0 ........................................................................ 65
Timer0, Timing............................................................ 66
Timing Diagram, Wake-up from SLEEP ................... 142
TMR0........................................................................ 138
USART Receive Enable bit ........................................ 39
USART Transmit Enable bit ....................................... 39
USART Transmit Flag bit............................................ 42
Wake-up ................................................................... 141
Wake-up from SLEEP .............................................. 141
INTF.................................................................................... 37
IRP...................................................................................... 35
L
Loading the Program Counter ............................................ 48
M
MPASM Assembler................................................... 159, 160
MPLAB-C.......................................................................... 161
MPSIM Software Simulator....................................... 159, 161
O
OERR ............................................................................... 106
One-Time-Programmable Devices ....................................... 7
OPCODE .......................................................................... 143
Open-Drain ......................................................................... 51
OPTION ................................................ 25, 27, 29, 31, 33, 34
Oscillator Start-up Timer (OST)................................ 123, 129
Oscillators
Block Diagram, External Parallel Resonant Crystal . 127
Capacitor Selection .................................................... 73
Configuration ............................................................ 125
External Crystal Circuit ............................................. 127
HS..................................................................... 125, 130
LP ..................................................................... 125, 130
RC, Block Diagram ................................................... 127
RC, Section .............................................................. 127
XT ............................................................................. 125
Overrun Error bit, OERR................................................... 106
P
P ................................................................................... 84, 89
Packaging Information...................................................... 291
Parallel Slave Port
PORTD ....................................................................... 57
Section........................................................................ 61
Parallel Slave Port Interrupt Flag bit, PSPIF....................... 43
Parallel Slave Port Read/Write Interrupt Enable bit, PSPIE 39
PCL......................... 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34
PCLATH ........... 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 48
PCON ........................................... 25, 27, 29, 31, 33, 34, 130
PD............................................................................... 35, 131
PEIE ................................................................................... 37
Peripheral Interrupt Enable bit, PEIE.................................. 37
PICDEM-1 Low-Cost PIC16/17 Demo Board ........... 159, 160
PICDEM-2 Low-Cost PIC16CXX Demo Board......... 159, 160
PICDEM-3 Low-Cost PIC16C9XXX Demo Board ............ 160
PICMASTER In-Circuit Emulator...................................... 159
PICSTART Low-Cost Development System..................... 159
PIE1 ...................................................... 25, 27, 29, 31, 33, 34
PIE2 ...................................................... 25, 27, 29, 31, 33, 34
Pin Compatible Devices.................................................... 315
Pin Functions
MCLR/VPP .................................................................. 16
PIC16C6X
DS30234E-page 316 1997-2013 Microchip Technology Inc.
OSC1/CLKIN............................................................... 16
OSC2/CLKOUT........................................................... 16
PORTA........................................................................ 52
PORTB........................................................................ 54
PORTC ....................................................................... 55
PORTD ....................................................................... 57
PORTE........................................................................ 59
RA4/T0CKI............................................................ 16, 52
RA5/SS ................................................................. 16, 52
RB0/INT ................................................................ 16, 54
RB6 ........................................................................... 142
RB7 ........................................................................... 142
RC0/T1OSI/T1CKI ...................................................... 55
RC0/T1OSO/T1CKI .............................................. 16, 55
RC1/T1OSI ................................................................. 55
RC1/T1OSI/CCP2 ................................................. 16, 55
RC1/T1OSO................................................................ 55
RC2/CCP1 ...................................................... 16, 55, 56
RC3/SCK/SCL ................................................ 16, 55, 56
RC4/SDI/SDA ................................................. 16, 55, 56
RC5/SDO ........................................................ 16, 55, 56
RC6/TX/CK ..................................... 16, 55, 56, 105–120
RC7/RX/DT ..................................... 16, 55, 56, 105–120
RD7/PSP7:RD0/PSP0 .......................................... 17, 57
RE0/RD ........................................................... 17, 59, 61
RE1/WR .......................................................... 17, 59, 61
RE2/CS ........................................................... 17, 59, 61
SCK....................................................................... 86–88
SDI ........................................................................ 86–88
SDO ...................................................................... 86–88
SS ......................................................................... 86–88
VDD.............................................................................. 17
VSS.............................................................................. 17
PIR1 ...................................................... 24, 26, 28, 30, 32, 34
PIR2 ...................................................... 24, 26, 28, 30, 32, 34
POP..................................................................................... 48
POR ............................................................................ 47, 131
POR Time-Out Sequence on Power-Up ........................... 134
Port RB Interrupt ................................................................. 53
PORTA ............................................ 24, 26, 28, 30, 32, 34, 51
PORTB ............................................ 24, 26, 28, 30, 32, 34, 53
PORTB Interrupt on Change ............................................. 138
PORTB Pull-up Enable bit, RBPU....................................... 36
PORTC............................................ 24, 26, 28, 30, 32, 34, 55
PORTD............................................ 24, 26, 28, 30, 32, 34, 57
PORTE ............................................ 24, 26, 28, 30, 32, 34, 58
Ports
Bi-directional ............................................................... 60
I/O Programming Considerations................................ 60
PORTA........................................................................ 16
PORTB........................................................................ 16
PORTC ....................................................................... 16
PORTD ....................................................................... 17
PORTE........................................................................ 17
Successive Operations on an I/O Port ........................ 60
Power/Control Status Register, PCON ............................. 130
Power-down bit ................................................................... 35
Power-down Mode ............................................................ 141
Power-on Reset (POR) ..................................................... 129
Power-on Reset Status bit, POR......................................... 47
Power-up Timer (PWRT)........................................... 123, 129
PR2 ....................................................... 25, 27, 29, 31, 33, 34
Prescaler ............................................................................. 68
Prescaler Assignment bit, PSA ........................................... 36
Prescaler Rate Select bits, PS2:PS0 .................................. 36
PRO MATE Universal Programmer .................................. 159
Program Memory
Map....................................................................... 19, 20
Organization ............................................................... 19
Paging ........................................................................ 48
Section........................................................................ 19
Programming While In-circuit............................................ 142
PS2:PS0 ............................................................................. 36
PSA..................................................................................... 36
PSPIE ................................................................................. 39
PSPIF ................................................................................. 43
Pull-ups............................................................................... 53
PUSH.................................................................................. 48
PWM
Block Diagram ............................................................ 80
Calculations ................................................................ 81
Mode........................................................................... 80
Output Timing ............................................................. 80
PWM Least Significant bits................................................. 78
Q
Quadrature Clocks.............................................................. 18
Quick-Turnaround-Production .............................................. 7
R
R/W bit............................................ 84, 89, 96, 100, 101, 102
RA0 pin ............................................................................... 51
RA1 pin ............................................................................... 51
RA2 pin ............................................................................... 51
RA3 pin ............................................................................... 51
RA4/T0CKI pin.................................................................... 51
RA5 pin ............................................................................... 51
RB Port Change Interrupt Enable bit, RBIE........................ 37
RB Port Change Interrupt Flag bit, RBIF ............................ 37
RB0..................................................................................... 54
RB0/INT ............................................................................ 138
RB0/INT External Interrupt Enable bit, INTE ...................... 37
RB0/INT External Interrupt Flag bit, INTF........................... 37
RB1..................................................................................... 54
RB2..................................................................................... 54
RB3..................................................................................... 54
RB4..................................................................................... 53
RB5..................................................................................... 53
RB6..................................................................................... 53
RB7..................................................................................... 53
RBIE ................................................................................... 37
RBIF.................................................................................... 37
RBPU............................................................................ 36, 53
RC Oscillator..................................................................... 130
RCIE ................................................................................... 39
RCIF ................................................................................... 42
RCREG................................................. 24, 26, 28, 30, 32, 34
RCSTA.......................................... 24, 26, 28, 30, 32, 34, 106
RCV_MODE ..................................................................... 104
Read Only Memory............................................................... 7
Read/Write bit Information, R/W ................................... 84, 89
Receive and Control Register........................................... 106
Receive Overflow Detect bit, SSPOV................................. 85
Receive Overflow Indicator bit, SSPOV.............................. 90
Register Bank Select bit, Indirect........................................ 35
Register Bank Select bits. Direct ........................................ 35
1997-2013 Microchip Technology Inc. DS30234E-page 317
PIC16C6X
Registers
CCP1CON
Diagram .............................................................. 78
Section ................................................................ 78
Summary .................................... 24, 26, 28, 30, 32
CCP2CON
Diagram .............................................................. 78
Section ................................................................ 78
Summary ................................................ 26, 30, 32
CCPR1H
Summary .................................... 24, 26, 28, 30, 32
CCPR1L
Summary .................................... 24, 26, 28, 30, 32
CCPR2H
Summary ................................................ 26, 30, 32
CCPR2L
Summary ................................................ 26, 30, 32
FSR
Indirect Addressing ............................................. 49
Summary .............................. 24, 26, 28, 30, 32, 34
INDF
Indirect Addressing ............................................. 49
Summary .............................. 24, 26, 28, 30, 32, 34
INTCON
Diagram .............................................................. 37
Section ................................................................ 37
Summary .............................. 24, 26, 28, 30, 32, 34
OPTION
Diagram .............................................................. 36
Section ................................................................ 36
Summary .............................. 25, 27, 29, 31, 33, 34
PCL
Section ................................................................ 48
Summary .............................. 24, 26, 28, 30, 32, 34
PCLATH
Section ................................................................ 48
Summary .............................. 24, 26, 28, 30, 32, 34
PCON
Diagram .............................................................. 47
Section ................................................................ 47
Summary .................................... 25, 27, 29, 31, 33
PIE1
Diagram .............................................................. 40
Section ................................................................ 38
Summary .................................... 25, 27, 29, 31, 33
PIE2
Diagram .............................................................. 45
Section ................................................................ 45
Summary ................................................ 27, 31, 33
PIR1
Diagram .............................................................. 44
Section ................................................................ 41
Summary .................................... 24, 26, 28, 30, 32
PIR2
Diagram .............................................................. 46
Section ................................................................ 46
Summary ................................................ 26, 30, 32
PORTA
Section ................................................................ 51
Summary .................................... 24, 26, 28, 30, 32
PORTB
Section ................................................................ 53
Summary .............................. 24, 26, 28, 30, 32, 34
PORTC
Section ................................................................ 55
Summary .................................... 24, 26, 28, 30, 32
PORTD
Section ............................................................... 57
Summary ................................................ 28, 30, 32
PORTE
Section ............................................................... 58
Summary ................................................ 28, 30, 32
PR2
Summary .................................... 25, 27, 29, 31, 33
RCREG
Summary ................................................ 26, 30, 32
RCSTA
Diagram ............................................................ 106
Summary ................................................ 26, 30, 32
SPBRG
Summary ................................................ 27, 31, 33
SSPBUF
Section ............................................................... 86
Summary .................................... 24, 26, 28, 30, 32
SSPCON
Diagram .............................................................. 85
Summary .................................... 24, 26, 28, 30, 32
SSPSR
Section ............................................................... 86
SSPSTAT ................................................................... 89
Diagram .............................................................. 84
Section ............................................................... 84
Summary .................................... 25, 27, 29, 31, 33
STATUS
Diagram .............................................................. 35
Section ............................................................... 35
Summary .............................. 24, 26, 28, 30, 32, 34
T1CON
Diagram .............................................................. 71
Section ............................................................... 71
Summary .................................... 24, 26, 28, 30, 32
T2CON
Diagram .............................................................. 75
Section ............................................................... 75
Summary .................................... 24, 26, 28, 30, 32
TMR0
Summary .............................. 24, 26, 28, 30, 32, 34
TMR1H
Summary .................................... 24, 26, 28, 30, 32
TMR1L
Summary .................................... 24, 26, 28, 30, 32
TMR2.......................................................................... 75
Summary .................................... 24, 26, 28, 30, 32
TRISA
Section ............................................................... 51
Summary .................................... 25, 27, 29, 31, 33
TRISB
Section ............................................................... 53
Summary .............................. 25, 27, 29, 31, 33, 34
TRISC
Section ............................................................... 55
Summary .................................... 25, 27, 29, 31, 33
TRISD
Section ............................................................... 57
Summary ................................................ 29, 31, 33
TRISE
Diagram .............................................................. 58
Section ............................................................... 58
Summary ................................................ 29, 31, 33
TXREG
Summary ................................................ 26, 30, 32
PIC16C6X
DS30234E-page 318 1997-2013 Microchip Technology Inc.
TXSTA
Diagram ............................................................ 105
Section .............................................................. 105
Summary....................................................... 31, 33
W................................................................................... 9
Special Function Registers, Initialization
Conditions ................................................................. 132
Special Function Registers, Reset Conditions .......... 131
Special Function Register Summary...24, 26, 28, 30, 32
File Maps .................................................................... 21
Resets ............................................................................... 128
ROM ...................................................................................... 7
RP0 bit .......................................................................... 20, 35
RP1 ..................................................................................... 35
RX9 ................................................................................... 106
RX9D................................................................................. 106
S
S.................................................................................... 84, 89
SCI - See Universal Synchronous Asynchronous Receiver
Transmitter (USART)
SCK ..................................................................................... 86
SCL ................................................................................... 100
SDI ...................................................................................... 86
SDO .................................................................................... 86
Serial Port Enable bit, SPEN............................................. 106
Serial Programming .......................................................... 142
Serial Programming, Block Diagram ................................. 142
Serialized Quick-Turnaround-Production .............................. 7
Single Receive Enable bit, SREN ..................................... 106
Slave Mode
SCL ........................................................................... 100
SDA........................................................................... 100
SLEEP Mode............................................................. 123, 141
SMP .................................................................................... 89
Software Simulator (MPSIM)............................................. 161
SPBRG.................................................. 25, 27, 29, 31, 33, 34
Special Features, Section ................................................. 123
SPEN ................................................................................ 106
SPI
Block Diagram....................................................... 86, 91
Master Mode ............................................................... 92
Master Mode Timing ................................................... 93
Mode ........................................................................... 86
Serial Clock ................................................................. 91
Serial Data In .............................................................. 91
Serial Data Out ........................................................... 91
Slave Mode Timing ..................................................... 94
Slave Mode Timing Diagram....................................... 93
Slave Select ................................................................ 91
SPI clock ..................................................................... 92
SPI Mode .................................................................... 91
SSPCON ..................................................................... 90
SSPSTAT.................................................................... 89
SPI Clock Edge Select bit, CKE.......................................... 89
SPI Data Input Sample Phase Select bit, SMP................... 89
SPI Mode ............................................................................ 86
SREN ................................................................................ 106
SS ....................................................................................... 86
SSP
Module Overview ........................................................ 83
Section ........................................................................ 83
SSPBUF...................................................................... 92
SSPCON ..................................................................... 90
SSPSR ........................................................................ 92
SSPSTAT.................................................................... 89
SSP in I2C Mode - See I2C
SSPADD ......................................... 25, 27, 29, 31, 33, 34, 99
SSPBUF ......................................... 24, 26, 28, 30, 32, 34, 99
SSPCON................................... 24, 26, 28, 30, 32, 34, 85, 90
SSPEN.......................................................................... 85, 90
SSPIE ................................................................................. 38
SSPIF ................................................................................. 41
SSPM3:SSPM0 ............................................................ 85, 90
SSPOV ................................................................. 85, 90, 100
SSPSTAT ................................. 25, 27, 29, 31, 33, 34, 84, 99
SSPSTAT Register ............................................................. 89
Stack................................................................................... 48
Start bit, S ..................................................................... 84, 89
STATUS.................. 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34
Status bits ................................................................. 130, 131
Status Bits During Various Resets.................................... 131
Stop bit, P ..................................................................... 84, 89
Switching Prescalers .......................................................... 69
SYNC,USART Mode Select bit, SYNC............................. 105
Synchronizing Clocks, TMR0.............................................. 67
Synchronous Serial Port (SSP)
Block Diagram, SPI Mode........................................... 86
SPI Master/Slave Diagram ......................................... 87
SPI Mode .................................................................... 86
Synchronous Serial Port Enable bit, SSPEN................ 85, 90
Synchronous Serial Port Interrupt Enable bit, SSPIE ......... 38
Synchronous Serial Port Interrupt Flag bit, SSPIF ............. 41
Synchronous Serial Port Mode Select bits,
SSPM3:SSPM0 ............................................................ 85, 90
Synchronous Serial Port Module ........................................ 83
Synchronous Serial Port Status Register ........................... 89
T
T0CS................................................................................... 36
T0IE .................................................................................... 37
T0IF .................................................................................... 37
T0SE................................................................................... 36
T1CKPS1:T1CKPS0........................................................... 71
T1CON.................................................. 24, 26, 28, 30, 32, 34
T1OSCEN........................................................................... 71
T1SYNC.............................................................................. 71
T2CKPS1:T2CKPS0........................................................... 75
T2CON............................................ 24, 26, 28, 30, 32, 34, 75
TIme-out ........................................................................... 130
Time-out bit......................................................................... 35
Time-out Sequence .......................................................... 130
Timer Modules
Overview, all ............................................................... 63
Timer0
Block Diagram .................................................... 65
Counter Mode..................................................... 65
External Clock .................................................... 67
Interrupt .............................................................. 65
Overview............................................................. 63
Prescaler ............................................................ 68
Section................................................................ 65
Timer Mode ........................................................ 65
Timing DiagramTiiming Diagrams
Timer0 ................................................................ 65
TMR0 register..................................................... 65
Timer1
Block Diagram .................................................... 72
Capacitor Selection ............................................ 73
Counter Mode, Asynchronous ............................ 73
Counter Mode, Synchronous.............................. 72
External Clock .................................................... 73
Oscillator............................................................. 73
1997-2013 Microchip Technology Inc. DS30234E-page 319
PIC16C6X
Overview............................................................. 63
Prescaler............................................................. 72
Read/Write in Asynchronous Counter Mode ...... 73
Section ................................................................ 71
Synchronizing with External Clock...................... 72
Timer Mode......................................................... 72
TMR1 Register Pair ............................................ 71
Timer2
Block Diagram .................................................... 75
Overview............................................................. 63
Postscaler ........................................................... 75
Prescaler............................................................. 75
Timer0 Clock Synchronization, Delay ................................. 67
TImer0 Interrupt ................................................................ 138
Timer1 Clock Source Select bit, TMR1CS .......................... 71
Timer1 External Clock Input Synchronization
Control bit, T1SYNC ........................................................... 71
Timer1 Input Clock Prescale Select bits ............................. 71
Timer1 Mode Selection ....................................................... 78
Timer1 On bit, TMR1ON ..................................................... 71
Timer1 Oscillator Enable Control bit, T1OSCEN ................ 71
Timer2 Clock Prescale Select bits,
T2CKPS1:T2CKPS0 ........................................................... 75
Timer2 Module .................................................................... 75
Timer2 On bit, TMR2ON ..................................................... 75
Timer2 Output Postscale Select bits,
TOUTPS3:TOUTPS0.......................................................... 75
Timing Diagrams
Brown-out Reset ....................................................... 129
I2C Clock Synchronization .......................................... 98
I2C Data Transfer Wait State ...................................... 96
I2C Multi-Master Arbitration......................................... 98
I2C Reception (7-bit Address)................................... 101
PIC16C61
CLKOUT and I/O .............................................. 170
External Clock................................................... 169
Oscillator Start-up Timer ................................... 171
Power-up Timer ................................................ 171
Reset ................................................................ 171
Timer0............................................................... 172
Watchdog Timer ............................................... 171
PIC16C62
Capture/Compare/PWM ................................... 193
CLKOUT and I/O .............................................. 190
External Clock................................................... 189
I2C Bus Data..................................................... 197
I2C Bus Start/Stop Bits ..................................... 196
Oscillator Start-up Timer ................................... 191
Power-up Timer ................................................ 191
Reset ................................................................ 191
SPI Mode .......................................................... 195
Timer0............................................................... 192
Timer1............................................................... 192
Watchdog Timer ............................................... 191
PIC16C62A
Brown-out Reset ............................................... 207
Capture/Compare/PWM ................................... 209
CLKOUT and I/O .............................................. 206
External Clock................................................... 205
I2C Bus Data..................................................... 213
I2C Bus Start/Stop Bits ..................................... 212
Oscillator Start-up Timer ................................... 207
Power-up Timer ................................................ 207
Reset ................................................................ 207
SPI Mode .......................................................... 211
Timer0............................................................... 208
Timer1............................................................... 208
Watchdog Timer ............................................... 207
PIC16C63
Brown-out Reset............................................... 239
Capture/Compare/PWM ................................... 241
CLKOUT and I/O .............................................. 238
External Clock .................................................. 237
I2C Bus Data..................................................... 245
I2C Bus Start/Stop Bits ..................................... 244
Oscillator Start-up Timer................................... 239
Power-up Timer ................................................ 239
Reset ................................................................ 239
SPI Mode.......................................................... 243
Timer0 .............................................................. 240
Timer1 .............................................................. 240
USART Synchronous Receive
(Master/Slave) ................................................. 246
Watchdog Timer ............................................... 239
PIC16C64
Capture/Compare/PWM ................................... 193
CLKOUT and I/O .............................................. 190
External Clock .................................................. 189
I2C Bus Data..................................................... 197
I2C Bus Start/Stop Bits ..................................... 196
Oscillator Start-up Timer................................... 191
Parallel Slave Port............................................ 194
Power-up Timer ................................................ 191
Reset ................................................................ 191
SPI Mode.......................................................... 195
Timer0 .............................................................. 192
Timer1 .............................................................. 192
Watchdog Timer ............................................... 191
PIC16C64A
Brown-out Reset............................................... 207
Capture/Compare/PWM ................................... 209
CLKOUT and I/O .............................................. 206
External Clock .................................................. 205
I2C Bus Data..................................................... 213
I2C Bus Start/Stop Bits ..................................... 212
Oscillator Start-up Timer................................... 207
Parallel Slave Port............................................ 210
Power-up Timer ................................................ 207
Reset ................................................................ 207
SPI Mode.......................................................... 211
Timer0 .............................................................. 208
Timer1 .............................................................. 208
Watchdog Timer ............................................... 207
PIC16C65
Capture/Compare/PWM ................................... 225
CLKOUT and I/O .............................................. 222
External Clock .................................................. 221
I2C Bus Data..................................................... 229
I2C Bus Start/Stop Bits ..................................... 228
Oscillator Start-up Timer................................... 223
Parallel Slave Port............................................ 226
Reset ................................................................ 223
SPI Mode.......................................................... 227
Timer0 .............................................................. 224
Timer1 .............................................................. 224
USART Synchronous Receive
(Master/Slave) .................................................. 230
Watchdog Timer ............................................... 223
PIC16C65A
Brown-out Reset............................................... 239
Capture/Compare/PWM ................................... 241
CLKOUT and I/O .............................................. 238
External Clock .................................................. 237
I2C Bus Data..................................................... 245
PIC16C6X
DS30234E-page 320 1997-2013 Microchip Technology Inc.
I2C Bus Start/Stop Bits...................................... 244
Oscillator Start-up Timer ................................... 239
Parallel Slave Port ............................................ 242
Power-up Timer ................................................ 239
Reset................................................................. 239
SPI Mode .......................................................... 243
Timer0 ............................................................... 240
Timer1 ............................................................... 240
USART Synchronous Receive
(Master/Slave)................................................... 246
Watchdog Timer................................................ 239
PIC16C66
Brown-out Reset ............................................... 271
Capture/Compare/PWM.................................... 273
CLKOUT and I/O............................................... 270
External Clock................................................... 269
I2C Bus Data ..................................................... 279
I2C Bus Start/Stop Bits...................................... 278
Oscillator Start-up Timer ................................... 271
Power-up Timer ................................................ 271
Reset................................................................. 271
Timer0 ............................................................... 272
Timer1 ............................................................... 272
USART Synchronous Receive
(Master/Slave)................................................... 280
Watchdog Timer................................................ 271
PIC16C67
Brown-out Reset ............................................... 271
Capture/Compare/PWM.................................... 273
CLKOUT and I/O............................................... 270
External Clock................................................... 269
I2C Bus Data ..................................................... 279
I2C Bus Start/Stop Bits...................................... 278
Oscillator Start-up Timer ................................... 271
Parallel Slave Port ............................................ 274
Power-up Timer ................................................ 271
Reset................................................................. 271
Timer0 ............................................................... 272
Timer1 ............................................................... 272
USART Synchronous Receive
(Master/Slave)................................................... 280
Watchdog Timer................................................ 271
PIC16CR62
Capture/Compare/PWM.................................... 209
CLKOUT and I/O............................................... 206
External Clock................................................... 205
I2C Bus Data ..................................................... 213
I2C Bus Start/Stop Bits...................................... 212
Oscillator Start-up Timer ................................... 207
Power-up Timer ................................................ 207
Reset................................................................. 207
SPI Mode .......................................................... 211
Timer0 ............................................................... 208
Timer1 ............................................................... 208
Watchdog Timer................................................ 207
PIC16CR63
Brown-out Reset............................................... 255
Capture/Compare/PWM ................................... 257
CLKOUT and I/O .............................................. 254
External Clock .................................................. 253
I2C Bus Data..................................................... 261
I2C Bus Start/Stop Bits ..................................... 260
Oscillator Start-up Timer................................... 255
Power-up Timer ................................................ 255
Reset ................................................................ 255
SPI Mode.......................................................... 259
Timer0 .............................................................. 256
Timer1 .............................................................. 256
USART Synchronous Receive
(Master/Slave) ................................................. 262
Watchdog Timer ............................................... 255
PIC16CR64
Capture/Compare/PWM ................................... 209
CLKOUT and I/O .............................................. 206
External Clock .................................................. 205
I2C Bus Data..................................................... 213
I2C Bus Start/Stop Bits ..................................... 212
Oscillator Start-up Timer................................... 207
Parallel Slave Port ............................................ 210
Power-up Timer ................................................ 207
Reset ................................................................ 207
SPI Mode.......................................................... 211
Timer0 .............................................................. 208
Timer1 .............................................................. 208
Watchdog Timer ............................................... 207
PIC16CR65
Brown-out Reset............................................... 255
Capture/Compare/PWM ................................... 257
CLKOUT and I/O .............................................. 254
External Clock .................................................. 253
I2C Bus Data..................................................... 261
I2C Bus Start/Stop Bits ..................................... 260
Oscillator Start-up Timer................................... 255
Parallel Slave Port ............................................ 258
Power-up Timer ................................................ 255
Reset ................................................................ 255
SPI Mode.......................................................... 259
Timer0 .............................................................. 256
Timer1 .............................................................. 256
USART Synchronous Receive
(Master/Slave) .................................................. 262
Watchdog Timer ............................................... 255
Power-up Timer ........................................................ 223
PWM Output ............................................................... 80
RB0/INT Interrupt...................................................... 138
RX Pin Sampling............................................... 110, 111
SPI Master Mode........................................................ 93
SPI Mode, Master/Slave Mode,
No SS Control............................................................. 88
SPI Mode, Slave Mode With SS Control .................... 88
SPI Slave Mode (CKE = 1)......................................... 94
SPI Slave Mode Timing (CKE = 0) ............................. 93
Timer0 with External Clock ......................................... 67
TMR0 Interrupt Timing................................................ 66
USART Asynchronous Master Transmission ........... 113
USART Asynchronous Master Transmission
(Back to Back) .......................................................... 113
USART Asynchronous Reception............................. 114
USART Synchronous Reception in
Master Mode............................................................. 119
USART Synchronous Tranmission ........................... 117
Wake-up from SLEEP Through Interrupts................ 142
1997-2013 Microchip Technology Inc. DS30234E-page 321
PIC16C6X
TMR0 .................................................... 24, 26, 28, 30, 32, 34
TMR0 Clock Source Select bit, T0CS................................. 36
TMR0 Interrupt .................................................................... 65
TMR0 Overflow Interrupt Enable bit, T0IE .......................... 37
TMR0 Overflow Interrupt Flag bit, T0IF .............................. 37
TMR0 Prescale Selection Table ......................................... 36
TMR0 Source Edge Select bit, T0SE.................................. 36
TMR1 Overflow Interrupt Enable bit, TMR1IE .................... 38
TMR1 Overflow Interrupt Flag bit, TMR1IF ......................... 41
TMR1CS ............................................................................. 71
TMR1H.................................................. 24, 26, 28, 30, 32, 34
TMR1IE ............................................................................... 38
TMR1IF ............................................................................... 41
TMR1L .................................................. 24, 26, 28, 30, 32, 34
TMR1ON............................................................................. 71
TMR2 .................................................... 24, 26, 28, 30, 32, 34
TMR2 Register .................................................................... 75
TMR2 to PR2 Match Interrupt Enable bit, TMR2IE............. 38
TMR2 to PR2 Match Interrupt Flag bit, TMR2IF ................. 41
TMR2IE ............................................................................... 38
TMR2IF ............................................................................... 41
TMR2ON............................................................................. 75
TO ............................................................................... 35, 131
TOUTPS3:TOUTPS0.......................................................... 75
Transmit Enable bit, TXEN ............................................... 105
Transmit Shift Register Status bit, TRMT ......................... 105
Transmit Status and Control Register............................... 105
TRISA ............................................. 25, 27, 29, 31, 33, 34, 51
TRISB ............................................. 25, 27, 29, 31, 33, 34, 53
TRISC ....................................... 25, 27, 29, 31, 33, 34, 55, 94
TRISD ............................................. 25, 27, 29, 31, 33, 34, 57
TRISE ............................................. 25, 27, 29, 31, 33, 34, 58
TRMT ................................................................................ 105
TX9 ................................................................................... 105
TX9D ................................................................................. 105
TXEN ................................................................................ 105
TXIE .................................................................................... 39
TXIF .................................................................................... 42
TXREG.................................................. 24, 26, 28, 30, 32, 34
TXSTA .......................................... 25, 27, 29, 31, 33, 34, 105
U
UA ................................................................................. 84, 89
Universal Synchronous Asynchronous Receiver Transmitter
(USART)
Asynchronous Mode
Setting Up Transmission................................... 113
Timing Diagram, Master Transmission ............. 113
Transmitter........................................................ 112
Asynchronous Receiver
Setting Up Reception ........................................ 115
Timing Diagram ................................................ 114
Asynchronous Receiver Mode
Block Diagram .................................................. 114
Section .............................................................. 114
Section ...................................................................... 105
Synchronous Master Mode
Reception.......................................................... 118
Section .............................................................. 116
Setting Up Reception ........................................ 118
Setting Up Transmission................................... 116
Timing Diagram, Reception .............................. 119
Timing Diagram, Transmission ......................... 117
Transmission .................................................... 116
Synchronous Slave Mode
Reception ......................................................... 120
Section ............................................................. 120
Setting Up Reception........................................ 120
Setting Up Transmission .................................. 120
Transmit............................................................ 120
Transmit Block Diagram ........................................... 112
Update Address bit, UA ................................................ 84, 89
USART Receive Interrupt Enable bit, RCIE........................ 39
USART Receive Interrupt Flag bit, RCIF............................ 42
USART Transmit Interrupt Enable bit, TXIE ....................... 39
USART Transmit Interrupt Flag bit, TXIF............................ 42
UV Erasable Devices............................................................ 7
W
Wake-up from Sleep......................................................... 141
Wake-up on Key Depression .............................................. 53
Wake-up Using Interrupts................................................. 141
Watchdog Timer (WDT)
Block Diagram .......................................................... 140
Period ....................................................................... 140
Programming Considerations ................................... 140
Section...................................................................... 140
WCOL ........................................................................... 85, 90
Weak Internal Pull-ups........................................................ 53
Write Collision Detect bit, WCOL.................................. 85, 90
X
XMIT_MODE .................................................................... 104
XT ..................................................................................... 130
Z
Z ......................................................................................... 35
Zero bit ........................................................................... 9, 35
PIC16C6X
DS30234E-page 322 1997-2013 Microchip Technology Inc.
LIST OF EQUATION AND EXAMPLES
Example 3-1: Instruction Pipeline Flow............................. 18
Example 4-1: Call of a Subroutine in Page 1
from Page 0 ................................................ 49
Example 4-2: Indirect Addressing ..................................... 49
Example 5-1: Initializing PORTA....................................... 51
Example 5-2: Initializing PORTB....................................... 53
Example 5-3: Initializing PORTC ...................................... 55
Example 5-4: Read-Modify-Write Instructions on an
I/O Port ....................................................... 60
Example 7-1: Changing Prescaler (Timer0WDT) .......... 69
Example 7-2: Changing Prescaler (WDTTimer0) .......... 69
Example 8-1: Reading a 16-bit
Free-running Timer ..................................... 73
Example 10-1: Changing Between
Capture Prescalers ..................................... 79
Example 10-2: PWM Period and Duty
Cycle Calculation ........................................ 81
Example 11-1: Loading the SSPBUF
(SSPSR) Register ....................................... 86
Example 11-2: Loading the SSPBUF
(SSPSR) Register (PIC16C66/67) .............. 91
Example 12-1: Calculating Baud Rate Error ..................... 107
Example 13-1: Saving Status and W
Registers in RAM ...................................... 139
Example 13-2: Saving Status, W, and
PCLATH Registers in RAM
(All other PIC16C6X devices) ................... 139
LIST OF FIGURES
Figure 3-1: PIC16C61 Block Diagram ........................... 10
Figure 3-2: PIC16C62/62A/R62/64/64A/R64
Block Diagram ............................................11
Figure 3-3: PIC16C63/R63/65/65A/R65
Block Diagram ............................................12
Figure 3-4: PIC16C66/67 Block Diagram ...................... 13
Figure 3-5: Clock/Instruction Cycle ............................... 18
Figure 4-1: PIC16C61 Program Memory Map
and Stack .................................................... 19
Figure 4-2: PIC16C62/62A/R62/64/64A/
R64 Program Memory Map and Stack ....... 19
Figure 4-3: PIC16C63/R63/65/65A/R65 Program
Memory Map and Stack .............................. 19
Figure 4-4: PIC16C66/67 Program Memory
Map and Stack ............................................ 20
Figure 4-5: PIC16C61 Register File Map ...................... 20
Figure 4-6: PIC16C62/62A/R62/64/64A/
R64 Register File Map ................................ 21
Figure 4-7: PIC16C63/R63/65/65A/R65
Register File Map........................................ 21
Figure 4-8: PIC16C66/67 Data Memory Map................ 22
Figure 4-9: STATUS Register
(Address 03h, 83h, 103h, 183h) ................. 35
Figure 4-10: OPTION Register
(Address 81h, 181h) ................................... 36
Figure 4-11: INTCON Register
(Address 0Bh, 8Bh, 10Bh 18Bh)................. 37
Figure 4-12: PIE1 Register for PIC16C62/62A/R62
(Address 8Ch)............................................. 38
Figure 4-13: PIE1 Register for PIC16C63/R63/66
(Address 8Ch)............................................. 39
Figure 4-14: PIE1 Register for PIC16C64/64A/R64
(Address 8Ch)............................................. 39
Figure 4-15: PIE1 Register for PIC16C65/65A/R65/67
(Address 8Ch) ............................................ 40
Figure 4-16: PIR1 Register for PIC16C62/62A/R62
(Address 0Ch) ............................................ 41
Figure 4-17: PIR1 Register for PIC16C63/R63/66
Address 0Ch).............................................. 42
Figure 4-18: PIR1 Register for PIC16C64/64A/R64
(Address 0Ch) ............................................ 43
Figure 4-19: PIR1 Register for PIC16C65/65A/R65/67
(Address 0Ch) ............................................ 44
Figure 4-20: PIE2 Register (Address 8Dh) ..................... 45
Figure 4-21: PIR2 Register (Address 0Dh)..................... 46
Figure 4-22: PCON Register for PIC16C62/64/65
(Address 8Eh)............................................. 47
Figure 4-23: PCON Register for PIC16C62A/R62/63/
R63/64A/R64/65A/R65/66/67
(Address 8Eh)............................................. 47
Figure 4-24: Loading of PC in Different Situations.......... 48
Figure 4-25: Direct/Indirect Addressing .......................... 49
Figure 5-1: Block Diagram of the
RA3:RA0 Pins and the RA5 Pin ................. 51
Figure 5-2: Block Diagram of the RA4/T0CKI Pin......... 51
Figure 5-3: Block Diagram of the
RB7:RB4 Pins for PIC16C61/62/64/65....... 53
Figure 5-4: Block Diagram of the
RB7:RB4 Pins for PIC16C62A/63/R63/
64A/65A/R65/66/67 .................................... 54
Figure 5-5: Block Diagram of the
RB3:RB0 Pins............................................. 54
Figure 5-6: PORTC Block Diagram............................... 55
Figure 5-7: PORTD Block Diagram
(In I/O Port Mode)....................................... 57
Figure 5-8: PORTE Block Diagram
(In I/O Port Mode)...................................... 58
Figure 5-9: TRISE Register (Address 89h) ................... 58
Figure 5-10: Successive I/O Operation........................... 60
Figure 5-11: PORTD and PORTE as a Parallel
Slave Port................................................... 61
Figure 5-12: Parallel Slave Port Write Waveforms ......... 62
Figure 5-13: Parallel Slave Port Read Waveforms ......... 62
Figure 7-1: Timer0 Block Diagram ................................ 65
Figure 7-2: Timer0 Timing: Internal Clock/No
Prescaler .................................................... 65
Figure 7-3: Timer0 Timing: Internal
Clock/Prescale 1:2...................................... 66
Figure 7-4: TMR0 Interrupt Timing................................ 66
Figure 7-5: Timer0 Timing With External Clock ............ 67
Figure 7-6: Block Diagram of the Timer0/WDT
Prescaler .................................................... 68
Figure 8-1: T1CON: Timer1 Control Register
(Address 10h) ............................................. 71
Figure 8-2: Timer1 Block Diagram ................................ 72
Figure 9-1: Timer2 Block Diagram ................................ 75
Figure 9-2: T2CON: Timer2 Control Register
(Address 12h) ............................................. 75
Figure 10-1: CCP1CON Register (Address 17h) /
CCP2CON Register (Address 1Dh) ........... 78
Figure 10-2: Capture Mode Operation
Block Diagram ............................................ 78
Figure 10-3: Compare Mode Operation
Block Diagram ............................................ 79
Figure 10-4: Simplified PWM Block Diagram.................. 80
Figure 10-5: PWM Output............................................... 80
Figure 11-1: SSPSTAT: Sync Serial Port Status
Register (Address 94h)............................... 84
1997-2013 Microchip Technology Inc. DS30234E-page 323
PIC16C6X
Figure 11-2: SSPCON: Sync Serial Port
Control Register (Address 14h) .................. 85
Figure 11-3: SSP Block Diagram (SPI Mode) ................. 86
Figure 11-4: SPI Master/Slave Connection..................... 87
Figure 11-5: SPI Mode Timing, Master Mode or
Slave Mode w/o SS Control........................ 88
Figure 11-6: SPI Mode Timing, Slave Mode with
SS Control .................................................. 88
Figure 11-7: SSPSTAT: Sync Serial Port Status
Register (Address 94h)(PIC16C66/67)....... 89
Figure 11-8: SSPCON: Sync Serial Port Control
Register (Address 14h)(PIC16C66/67)....... 90
Figure 11-9: SSP Block Diagram (SPI Mode)
(PIC16C66/67)............................................ 91
Figure 11-10: SPI Master/Slave Connection
(PIC16C66/67)............................................ 92
Figure 11-11: SPI Mode Timing, Master Mode
(PIC16C66/67)............................................ 93
Figure 11-12: SPI Mode Timing (Slave Mode With
CKE = 0) (PIC16C66/67) ............................ 93
Figure 11-13: SPI Mode Timing (Slave Mode With
CKE = 1) (PIC16C66/67) ............................ 94
Figure 11-14: Start and Stop Conditions........................... 95
Figure 11-15: 7-bit Address Format .................................. 96
Figure 11-16: I2C 10-bit Address Format .......................... 96
Figure 11-17: Slave-receiver Acknowledge ...................... 96
Figure 11-18: Data Transfer Wait State ............................ 96
Figure 11-19: Master-transmitter Sequence ..................... 97
Figure 11-20: Master-receiver Sequence.......................... 97
Figure 11-21: Combined Format ....................................... 97
Figure 11-22: Multi-master Arbitration
(Two Masters)............................................. 98
Figure 11-23: Clock Synchronization ................................ 98
Figure 11-24: SSP Block Diagram (I2C Mode).................. 99
Figure 11-25: I2C Waveforms for Reception
(7-bit Address) .......................................... 101
Figure 11-26: I2C Waveforms for Transmission
(7-bit Address) .......................................... 102
Figure 11-27: Operation of the I2C Module in
IDLE_MODE, RCV_MODE or
XMIT_MODE ............................................ 104
Figure 12-1: TXSTA: Transmit Status and
Control Register (Address 98h) ................ 105
Figure 12-2: RCSTA: Receive Status and
Control Register (Address 18h) ................ 106
Figure 12-3: RX Pin Sampling Scheme (BRGH = 0)
PIC16C63/R63/65/65A/R65) .................... 110
Figure 12-4: RX Pin Sampling Scheme (BRGH = 1)
(PIC16C63/R63/65/65A/R65) ................... 110
Figure 12-5: RX Pin Sampling Scheme (BRGH = 1)
(PIC16C63/R63/65/65A/R65) ................... 110
Figure 12-6: RX Pin Sampling Scheme (BRGH = 0 or = 1)
(PIC16C66/67).......................................... 111
Figure 12-7: USART Transmit Block Diagram .............. 112
Figure 12-8: Asynchronous Master Transmission......... 113
Figure 12-9: Asynchronous Master Transmission
(Back to Back) .......................................... 113
Figure 12-10: USART Receive Block Diagram ............... 114
Figure 12-11: Asynchronous Reception .......................... 114
Figure 12-12: Synchronous Transmission ...................... 117
Figure 12-13: Synchronous Transmission
through TXEN ........................................... 117
Figure 12-14: Synchronous Reception
(Master Mode, SREN) .............................. 119
Figure 13-1: Configuration Word for PIC16C61 ............ 123
Figure 13-2: Configuration Word for
PIC16C62/64/65....................................... 124
Figure 13-3: Configuration Word for
PIC16C62A/R62/63/R63/64A/R64/
65A/R65/66/67 ......................................... 124
Figure 13-4: Crystal/Ceramic Resonator Operation
(HS, XT or LP OSC Configuration)........... 125
Figure 13-5: External Clock Input Operation
(HS, XT or LP OSC Configuration)........... 125
Figure 13-6: External Parallel Resonant
Crystal Oscillator Circuit........................... 127
Figure 13-7: External Series Resonant
Crystal Oscillator Circuit........................... 127
Figure 13-8: RC Oscillator Mode .................................. 127
Figure 13-9: Simplified Block Diagram of
On-chip Reset Circuit ............................... 128
Figure 13-10: Brown-out Situations ................................ 129
Figure 13-11: Time-out Sequence on Power-up
(MCLR not Tied to VDD): Case 1 .............. 134
Figure 13-12: Time-out Sequence on Power-up
(MCLR Not Tied To VDD): Case 2 ............ 134
Figure 13-13: Time-out Sequence on Power-up
(MCLR Tied to VDD) ................................. 134
Figure 13-14: External Power-on Reset Circuit
(For Slow VDD Power-up)......................... 135
Figure 13-15: External Brown-out
Protection Circuit 1 ................................... 135
Figure 13-16: External Brown-out
Protection Circuit 2 ................................... 135
Figure 13-17: Interrupt Logic for PIC16C61.................... 137
Figure 13-18: Interrupt Logic for PIC16C6X ................... 137
Figure 13-19: INT Pin Interrupt Timing ........................... 138
Figure 13-20: Watchdog Timer Block Diagram............... 140
Figure 13-21: Summary of Watchdog
Timer Registers........................................ 140
Figure 13-22: Wake-up from Sleep
Through Interrupt...................................... 142
Figure 13-23: Typical In-circuit Serial
Programming Connection......................... 142
Figure 14-1: General Format for Instructions................ 143
Figure 16-1: Load Conditions for Device Timing
Specifications ........................................... 168
Figure 16-2: External Clock Timing .............................. 169
Figure 16-3: CLKOUT and I/O Timing .......................... 170
Figure 16-4: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Timing....................................................... 171
Figure 16-5: Timer0 External Clock Timings ................ 172
Figure 17-1: Typical RC Oscillator
Frequency vs. Temperature .................... 173
Figure 17-2: Typical RC Oscillator
Frequency vs. VDD ................................... 174
Figure 17-3: Typical RC Oscillator
Frequency vs. VDD ................................... 174
Figure 17-4: Typical RC Oscillator
Frequency vs. VDD ................................... 174
Figure 17-5: Typical IPD vs. VDD Watchdog Timer
Disabled 25C .......................................... 174
Figure 17-6: Typical IPD vs. VDD Watchdog Timer
Enabled 25C ........................................... 175
Figure 17-7: Maximum IPD vs. VDD Watchdog
Disabled ................................................... 175
Figure 17-8: Maximum IPD vs. VDD Watchdog
Enabled*................................................... 176
Figure 17-9: VTH (Input Threshold Voltage) of
I/O Pins vs. VDD ....................................... 176
PIC16C6X
DS30234E-page 324 1997-2013 Microchip Technology Inc.
Figure 17-10: VIH, VIL of MCLR, T0CKI and OSC1
(in RC Mode) vs. VDD ............................... 177
Figure 17-11: VTH (Input Threshold Voltage) of
OSC1 Input (in XT, HS,
and LP Modes) vs. VDD ............................ 177
Figure 17-12: Typical IDD vs. Frequency
(External Clock, 25C) .............................. 178
Figure 17-13: Maximum IDD vs. Frequency
(External Clock, -40 to +85C)................. 178
Figure 17-14: Maximum IDD vs. Frequency
(External Clock, -55 to +125C)............... 179
Figure 17-15: WDT Timer Time-out Period vs. VDD........ 179
Figure 17-16: Transconductance (gm) of HS
Oscillator vs. VDD ...................................... 179
Figure 17-17: Transconductance (gm) of LP
Oscillator vs. VDD ...................................... 180
Figure 17-18: Transconductance (gm) of XT
Oscillator vs. VDD ...................................... 180
Figure 17-19: IOH vs. VOH, VDD = 3V .............................. 180
Figure 17-20: IOH vs. VOH, VDD = 5V .............................. 180
Figure 17-21: IOL vs. VOL, VDD = 3V ............................... 181
Figure 17-22: IOL vs. VOL, VDD = 5V ............................... 181
Figure 18-1: Load Conditions for Device
Timing Specifications................................ 188
Figure 18-2: External Clock Timing ............................... 189
Figure 18-3: CLKOUT and I/O Timing........................... 190
Figure 18-4: Reset, Watchdog Timer,
Oscillator Start-up Timer and
Power-up Timer Timing ............................ 191
Figure 18-5: Timer0 and Timer1 External
Clock Timings ........................................... 192
Figure 18-6: Capture/Compare/PWM Timings
(CCP1) ...................................................... 193
Figure 18-7: Parallel Slave Port Timing
(PIC16C64) ............................................... 194
Figure 18-8: SPI Mode Timing ...................................... 195
Figure 18-9: I2C Bus Start/Stop Bits Timing.................. 196
Figure 18-10: I2C Bus Data Timing ................................. 197
Figure 19-1: Load Conditions for Device
Timing Specifications................................ 204
Figure 19-2: External Clock Timing ............................... 205
Figure 19-3: CLKOUT and I/O Timing........................... 206
Figure 19-4: Reset, Watchdog Timer,
Oscillator Start-up Timer and
Power-up Timer Timing ............................ 207
Figure 19-5: Brown-out Reset Timing ........................... 207
Figure 19-6: Timer0 and Timer1 External
Clock Timings ........................................... 208
Figure 19-7: Capture/Compare/PWM Timings
(CCP1) ...................................................... 209
Figure 19-8: Parallel Slave Port Timing
(PIC16C64A/R64)..................................... 210
Figure 19-9: SPI Mode Timing ...................................... 211
Figure 19-10: I2C Bus Start/Stop Bits Timing.................. 212
Figure 19-11: I2C Bus Data Timing ................................. 213
Figure 20-1: Load Conditions for Device Timing
Specifications............................................ 220
Figure 20-2: External Clock Timing ............................... 221
Figure 20-3: CLKOUT and I/O Timing........................... 222
Figure 20-4: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Timing ....................................................... 223
Figure 20-5: Timer0 and Timer1 External Clock
Timings ..................................................... 224
Figure 20-6: Capture/Compare/PWM Timings
(CCP1 and CCP2) .................................... 225
Figure 20-7: Parallel Slave Port Timing ........................ 226
Figure 20-8: SPI Mode Timing...................................... 227
Figure 20-9: I2C Bus Start/Stop Bits Timing ................. 228
Figure 20-10: I2C Bus Data Timing................................. 229
Figure 20-11: USART Synchronous Transmission
(Master/Slave) Timing .............................. 230
Figure 20-12: USART Synchronous Receive
(Master/Slave) Timing .............................. 230
Figure 21-1: Load Conditions for Device Timing
Specifications ........................................... 236
Figure 21-2: External Clock Timing............................... 237
Figure 21-3: CLKOUT and I/O Timing .......................... 238
Figure 21-4: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Timing....................................................... 239
Figure 21-5: Brown-out Reset Timing ........................... 239
Figure 21-6: Timer0 and Timer1 External Clock
Timings ..................................................... 240
Figure 21-7: Capture/Compare/PWM Timings
(CCP1 and CCP2)................................... 241
Figure 21-8: Parallel Slave Port Timing
(PIC16C65A) ............................................ 242
Figure 21-9: SPI Mode Timing...................................... 243
Figure 21-10: I2C Bus Start/Stop Bits Timing ................. 244
Figure 21-11: I2C Bus Data Timing................................. 245
Figure 21-12: USART Synchronous Transmission
(Master/Slave) Timing .............................. 246
Figure 21-13: USART Synchronous Receive
(Master/Slave) Timing .............................. 246
Figure 22-1: Load Conditions for Device Timing
Specifications ........................................... 252
Figure 22-2: External Clock Timing............................... 253
Figure 22-3: CLKOUT and I/O Timing .......................... 254
Figure 22-4: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Timing....................................................... 255
Figure 22-5: Brown-out Reset Timing ........................... 255
Figure 22-6: Timer0 and Timer1 External Clock
Timings ..................................................... 256
Figure 22-7: Capture/Compare/PWM Timings
(CCP1 and CCP2).................................... 257
Figure 22-8: Parallel Slave Port Timing
(PIC16CR65) ............................................ 258
Figure 22-9: SPI Mode Timing...................................... 259
Figure 22-10: I2C Bus Start/Stop Bits Timing ................. 260
Figure 22-11: I2C Bus Data Timing................................. 261
Figure 22-12: USART Synchronous Transmission
(Master/Slave) Timing .............................. 262
Figure 22-13: USART Synchronous Receive
(Master/Slave) Timing .............................. 262
Figure 23-1: Load Conditions for Device Timing
Specifications ........................................... 268
Figure 23-2: External Clock Timing............................... 269
Figure 23-3: CLKOUT and I/O Timing .......................... 270
Figure 23-4: Reset, Watchdog Timer, Oscillator
Start-up Timer and Power-up Timer
Timing....................................................... 271
Figure 23-5: Brown-out Reset Timing ........................... 271
Figure 23-6: Timer0 and Timer1 External Clock
Timings ..................................................... 272
Figure 23-7: Capture/Compare/PWM Timings
(CCP1 and CCP2).................................... 273
Figure 23-8: Parallel Slave Port Timing (PIC16C67) .... 274
Figure 23-9: SPI Master Mode Timing (CKE = 0) ......... 275
Figure 23-10: SPI Master Mode Timing (CKE = 1) ......... 275
Figure 23-11: SPI Slave Mode Timing (CKE = 0) ........... 276
1997-2013 Microchip Technology Inc. DS30234E-page 325
PIC16C6X
Figure 23-12: SPI Slave Mode Timing (CKE = 1) ........... 276
Figure 23-13: I2C Bus Start/Stop Bits Timing.................. 278
Figure 23-14: I2C Bus Data Timing ................................. 279
Figure 23-15: USART Synchronous Transmission
(Master/Slave) Timing............................... 280
Figure 23-16: USART Synchronous Receive
(Master/Slave) Timing............................... 280
Figure 24-1: Typical IPD vs. VDD
(WDT Disabled, RC Mode) ....................... 281
Figure 24-2: Maximum IPD vs. VDD
(WDT Disabled, RC Mode) ....................... 281
Figure 24-3: Typical IPD vs. VDD @ 25C
(WDT Enabled, RC Mode)........................ 282
Figure 24-4: Maximum IPD vs. VDD
(WDT Enabled, RC Mode)........................ 282
Figure 24-5: Typical RC Oscillator
Frequency vs. VDD.................................... 282
Figure 24-6: Typical RC Oscillator
Frequency vs. VDD.................................... 282
Figure 24-7: Typical RC Oscillator
Frequency vs. VDD.................................... 282
Figure 24-8: Typical IPD vs. VDD Brown-out
Detect Enabled (RC Mode)....................... 283
Figure 24-9: Maximum IPD vs. VDD Brown-out
Detect Enabled
(85C to -40C, RC Mode) ........................ 283
Figure 24-10: Typical IPD vs. Timer1 Enabled
(32 kHz, RC0/RC1 = 33 pF/33 pF,
RC Mode) ................................................ 283
Figure 24-11: Maximum IPD vs. Timer1 Enabled
(32 kHz, RC0/RC1 = 33 pF/33 pF,
85C to -40C, RC Mode) ......................... 283
Figure 24-12: Typical IDD vs. Frequency
(RC Mode @ 22 pF, 25°C) ....................... 284
Figure 24-13: Maximum IDD vs. Frequency
(RC Mode @ 22 pF, -40°C to 85°C) ......... 284
Figure 24-14: Typical IDD vs. Frequency
(RC Mode @ 100 pF, 25°C) ..................... 285
Figure 24-15: Maximum IDD vs. Frequency
(RC Mode @ 100 pF, -40°C to 85°C) ....... 285
Figure 24-16: Typical IDD vs. Frequency
(RC Mode @ 300 pF, 25°C) ..................... 286
Figure 24-17: Maximum IDD vs. Frequency
(RC Mode @ 300 pF, -40°C to 85°C) ....... 286
Figure 24-18: Typical IDD vs. Capacitance @ 500 kHz
(RC Mode) ................................................ 287
Figure 24-19: Transconductance(gm) of HS
Oscillator vs. VDD...................................... 287
Figure 24-20: Transconductance(gm) of LP
Oscillator vs. VDD...................................... 287
Figure 24-21: Transconductance(gm) of XT
Oscillator vs. VDD...................................... 287
Figure 24-22: Typical XTAL Startup Time vs. VDD
(LP Mode, 25C) ....................................... 288
Figure 24-23: Typical XTAL Startup Time vs. VDD
(HS Mode, 25C) ...................................... 288
Figure 24-24: Typical XTAL Startup Time vs. VDD
(XT Mode, 25C)....................................... 288
Figure 24-25: Typical Idd vs. Frequency
(LP Mode, 25°C) ....................................... 289
Figure 24-26: Maximum IDD vs. Frequency
(LP Mode, 85°C to -40°C)......................... 289
Figure 24-27: Typical IDD vs. Frequency
(XT Mode, 25°C)....................................... 289
Figure 24-28: Maximum IDD vs. Frequency
(XT Mode, -40°C to 85°C)......................... 289
Figure 24-29: Typical IDD vs. Frequency
(HS Mode, 25°C)...................................... 290
Figure 24-30: Maximum IDD vs. Frequency
(HS Mode, -40°C to 85°C)........................ 290
PIC16C6X
DS30234E-page 326 1997-2013 Microchip Technology Inc.
LIST OF TABLES
Table 1-1: PIC16C6X Family of Devices ....................... 6
Table 3-1: PIC16C61 Pinout Description ..................... 14
Table 3-2: PIC16C62/62A/R62/63/R63/66
Pinout Description....................................... 15
Table 3-3: PIC16C64/64A/R64/65/65A/R65/67
Pinout Description....................................... 16
Table 4-1: Special Function Registers for the
PIC16C61 ................................................... 23
Table 4-2: Special Function Registers for the
PIC16C62/62A/R62 .................................... 24
Table 4-3: Special Function Registers for the
PIC16C63/R63 ............................................ 26
Table 4-4: Special Function Registers for the
PIC16C64/64A/R64 .................................... 28
Table 4-5: Special Function Registers for the
PIC16C65/65A/R65 .................................... 30
Table 4-6: Special Function Registers for the
PIC16C66/67 .............................................. 32
Table 5-1: PORTA Functions ....................................... 52
Table 5-2: Registers/Bits Associated with
PORTA ....................................................... 52
Table 5-3: PORTB Functions ....................................... 54
Table 5-4: Summary of Registers Associated with
PORTB ....................................................... 54
Table 5-5: PORTC Functions for PIC16C62/64 ........... 55
Table 5-6: PORTC Functions for
PIC16C62A/R62/64A/R64 .......................... 56
Table 5-7: PORTC Functions for
PIC16C63/R63/65/65A/R65/66/67.............. 56
Table 5-8: Summary of Registers Associated with
PORTC ....................................................... 56
Table 5-9: PORTD Functions....................................... 57
Table 5-10: Summary of Registers Associated with
PORTD ....................................................... 57
Table 5-11: PORTE Functions ....................................... 59
Table 5-12: Summary of Registers Associated with
PORTE ....................................................... 59
Table 5-13: Registers Associated with
Parallel Slave Port ...................................... 62
Table 7-1: Registers Associated with Timer0 .............. 69
Table 8-1: Capacitor Selection for the
Timer1 Oscillator......................................... 73
Table 8-2: Registers Associated with
Timer1 as a Timer/Counter......................... 74
Table 9-1: Registers Associated with
Timer2 as a Timer/Counter......................... 76
Table 10-1: CCP Mode - Timer Resource ..................... 77
Table 10-2: Interaction of Two CCP Modules ................ 77
Table 10-3: Example PWM Frequencies
and Resolutions at 20 MHz......................... 81
Table 10-4: Registers Associated with Timer1,
Capture and Compare ................................ 81
Table 10-5: Registers Associated with PWM
and Timer2.................................................. 82
Table 11-1: Registers Associated with SPI
Operation .................................................... 88
Table 11-2: Registers Associated with SPI
Operation (PIC16C66/67) ........................... 94
Table 11-3: I2C Bus Terminology................................... 95
Table 11-4: Data Transfer Received Byte
Actions ...................................................... 100
Table 11-5: Registers Associated with I2C
Operation .................................................. 103
Table 12-1: Baud Rate Formula................................... 107
Table 12-2: Registers Associated with Baud
Rate Generator......................................... 107
Table 12-3: Baud Rates for Synchronous Mode.......... 108
Table 12-4: Baud Rates for Asynchronous Mode
(BRGH = 0)............................................... 108
Table 12-5: Baud Rates for Asynchronous Mode
(BRGH = 1)............................................... 109
Table 12-6: Registers Associated with
Asynchronous Transmission .................... 113
Table 12-7: Registers Associated with
Asynchronous Reception.......................... 115
Table 12-8: Registers Associated with
Synchronous Master Transmission .......... 117
Table 12-9: Registers Associated with
Synchronous Master Reception ............... 118
Table 12-10: Registers Associated with
Synchronous Slave Transmission ............ 121
Table 12-11: Registers Associated with
Synchronous Slave Reception ................. 121
Table 13-1: Ceramic Resonators PIC16C61 ............... 126
Table 13-2: Ceramic Resonators
PIC16C62/62A/R62/63/R63/
64/64A/R64/65/65A/R65/66/67 ................ 126
Table 13-3: Capacitor Selection for Crystal
Oscillator for PIC16C61............................ 126
Table 13-4: Capacitor Selection for Crystal
Oscillator for PIC16C62/62A/R62/63/R63/
64/64A/R64/65/65A/R65/66/67 ................ 126
Table 13-5: Time-out in Various Situations,
PIC16C61/62/64/65.................................. 130
Table 13-6: Time-out in Various Situations,
PIC16C62A/R62/63/R63/
64A/R64/65A/R65/66/67 .......................... 130
Table 13-7: Status Bits and Their Significance,
PIC16C61................................................. 130
Table 13-8: Status bits and Their Significance,
PIC16C62/64/65....................................... 130
Table 13-9: Status Bits and Their Significance for
PIC16C62A/R62/63/R63/
64A/R64/65A/R65/66/67 .......................... 131
Table 13-10: Reset Condition for Special
Registers on PIC16C61/62/64/65............. 131
Table 13-11: Reset Condition for Special
Registers on
PIC16C62A/R62/63/R63/
64A/R64/65A/R65/66/67 .......................... 131
Table 13-12: Initialization Conditions for
all Registers.............................................. 132
Table 14-1: Opcode Field Descriptions ....................... 143
Table 14-2: PIC16CXX Instruction Set ........................ 144
Table 15-1: Development Tools from Microchip.......... 162
Table 16-1: Cross Reference of Device
Specs for Oscillator Configurations
and Frequencies of Operation
(Commercial Devices) .............................. 163
Table 16-2: External Clock Timing
Requirements ........................................... 169
Table 16-3: CLKOUT and I/O Timing
Requirements ........................................... 170
Table 16-4: Reset, Watchdog Timer,
Oscillator Start-up Timer and
Power-up Timer Requirements................. 171
Table 16-5: Timer0 External Clock Requirements....... 172
Table 17-1: RC Oscillator Frequencies........................ 173
Table 17-2: Input Capacitance* ................................... 181
1997-2013 Microchip Technology Inc. DS30234E-page 327
PIC16C6X
Table 18-1: Cross Reference of Device Specs
for Oscillator Configurations and
Frequencies of Operation
(Commercial Devices) .............................. 183
Table 18-2: External Clock Timing
Requirements ........................................... 189
Table 18-3: CLKOUT and I/O Timing
Requirements ........................................... 190
Table 18-4: Reset, Watchdog Timer,
Oscillator Start-up Timer and
Power-up Timer Requirements................. 191
Table 18-5: Timer0 and Timer1 External
Clock Requirements ................................. 192
Table 18-6: Capture/Compare/PWM
Requirements (CCP1) .............................. 193
Table 18-7: Parallel Slave Port Requirements (PIC16C64)
194
Table 18-8: SPI Mode Requirements........................... 195
Table 18-9: I2C Bus Start/Stop Bits
Requirements ........................................... 196
Table 18-10: I2C Bus Data Requirements ..................... 197
Table 19-1: Cross Reference of Device Specs
for Oscillator Configurations and
Frequencies of Operation
(Commercial Devices) .............................. 199
Table 19-2: External Clock Timing
Requirements ........................................... 205
Table 19-3: CLKOUT and I/O Timing
Requirements ........................................... 206
Table 19-4: Reset, Watchdog Timer,
Oscillator Start-up Timer,
Power-up Timer, and Brown-out
Reset Requirements ................................. 207
Table 19-5: Timer0 and Timer1 External
Clock Requirements ................................. 208
Table 19-6: Capture/Compare/PWM
Requirements (CCP1) .............................. 209
Table 19-7: Parallel Slave Port Requirements
(PIC16C64A/R64)..................................... 210
Table 19-8: SPI Mode Requirements........................... 211
Table 19-9: I2C Bus Start/Stop Bits
Requirements ........................................... 212
Table 19-10: I2C Bus Data Requirements ..................... 213
Table 20-1: Cross Reference of Device Specs
for Oscillator Configurations and
Frequencies of Operation
(Commercial Devices) .............................. 215
Table 20-2: External Clock Timing
Requirements ........................................... 221
Table 20-3: CLKOUT and I/O Timing
Requirements ........................................... 222
Table 20-4: Reset, Watchdog Timer,
Oscillator Start-up Timer and
Power-up Timer Requirements................. 223
Table 20-5: Timer0 and Timer1 External
Clock Requirements ................................. 224
Table 20-6: Capture/Compare/PWM
Requirements (CCP1 and CCP2)............. 225
Table 20-7: Parallel Slave Port Requirements............. 226
Table 20-8: SPI Mode Requirements........................... 227
Table 20-9: I2C Bus Start/Stop Bits
Requirements ........................................... 228
Table 20-10: i2C Bus Data Requirements...................... 229
Table 20-11: USART Synchronous Transmission
Requirements ........................................... 230
Table 20-12: USART Synchronous Receive
Requirements ........................................... 230
Table 21-1: Cross Reference of Device
Specs for Oscillator Configurations
and Frequencies of Operation
(Commercial Devices) .............................. 231
Table 21-2: External Clock Timing
Requirements ........................................... 237
Table 21-3: CLKOUT and I/O Timing
Requirements ........................................... 238
Table 21-4: Reset, Watchdog Timer, Oscillator
Start-up Timer, Power-up Timer, and
Brown-out Reset Requirements ............... 239
Table 21-5: Timer0 and Timer1 External
Clock Requirements ................................. 240
Table 21-6: Capture/Compare/PWM
Requirements (CCP1 and CCP2) ............ 241
Table 21-7: Parallel Slave Port Requirements
(PIC16C65A) ............................................ 242
Table 21-8: SPI Mode Requirements .......................... 243
Table 21-9: I2C Bus Start/Stop Bits
Requirements ........................................... 244
Table 21-10: I2C Bus Data Requirements ..................... 245
Table 21-11: USART Synchronous
Transmission Requirements..................... 246
Table 21-12: USART Synchronous Receive
Requirements .......................................... 246
Table 22-1: Cross Reference of Device Specs
for Oscillator Configurations and
Frequencies of Operation
(Commercial Devices) .............................. 247
Table 22-2: External Clock Timing
Requirements ........................................... 253
Table 22-3: CLKOUT and I/O Timing
Requirements ........................................... 254
Table 22-4: Reset, Watchdog Timer,
Oscillator Start-up Timer,
Power-up Timer, and Brown-out
Reset Requirements................................. 255
Table 22-5: Timer0 and Timer1 External
Clock Requirements ................................. 256
Table 22-6: Capture/Compare/PWM
Requirements (CCP1 and CCP2) ............ 257
Table 22-7: Parallel Slave Port Requirements
(PIC16CR65)............................................ 258
Table 22-8: SPI Mode Requirements .......................... 259
Table 22-9: I2C Bus Start/Stop Bits
Requirements ........................................... 260
Table 22-10: I2C Bus Data Requirements ..................... 261
Table 22-11: USART Synchronous Transmission
Requirements ........................................... 262
Table 22-12: USART Synchronous Receive
Requirements .......................................... 262
Table 23-1: Cross Reference of Device Specs
for Oscillator Configurations and
Frequencies of Operation
(Commercial Devices) .............................. 263
Table 23-2: External Clock Timing
Requirements ........................................... 269
Table 23-3: CLKOUT and I/O Timing
Requirements ........................................... 270
Table 23-4: Reset, Watchdog Timer,
Oscillator Start-up Timer,
Power-up Timer, and Brown-out
Reset Requirements................................. 271
PIC16C6X
DS30234E-page 328 1997-2013 Microchip Technology Inc.
Table 23-5: Timer0 and Timer1 External
Clock Requirements ................................. 272
Table 23-6: Capture/Compare/PWM
Requirements (CCP1 and CCP2) ............. 273
Table 23-7: Parallel Slave Port Requirements (PIC16C67)
274
Table 23-8: SPI Mode Requirements........................... 277
Table 23-9: I2C Bus Start/Stop Bits
Requirements ........................................... 278
Table 23-10: I2C Bus Data Requirements ..................... 279
Table 23-11: USART Synchronous Transmission
Requirements ........................................... 280
Table 23-12: USART Synchronous Receive
Requirements ........................................... 280
Table 24-1: RC Oscillator Frequencies ........................ 287
Table 24-2: Capacitor Selection for Crystal
Oscillators ................................................. 288
Table E-1: Pin Compatible Devices............................ 315
Internet:
CompuServe Commu ca ons Network:
1997-2013 Microchip Technology Inc. DS30234E-page 329
PIC16C6X
The procedure to connect will vary slightly from country
to country. Please check with your local CompuServe
agent for details if you have a problem. CompuServe
service allow multiple users various baud rates
depending on the local point of access.
The following connect procedure applies in most loca-
tions.
1. Set your modem to 8-bit, No parity, and One stop
(8N1). This is not the normal CompuServe setting
which is 7E1.
2. Dial your local CompuServe access number.
3. Depress the <Enter> key and a garbage string will
appear because CompuServe is expecting a 7E1
setting.
4. Type +, depress the <Enter> key and “Host Name:”
will appear.
5. Type MCHIPBBS, depress the <Enter> key and you
will be connected to the Microchip BBS.
In the United States, to find the CompuServe phone
number closest to you, set your modem to 7E1 and dial
(800) 848-4480 for 300-2400 baud or (800) 331-7166
for 9600-14400 baud connection. After the system
responds with “Host Name:”, type NETWORK, depress
the <Enter> key and follow CompuServe's directions.
For voice information (or calling from overseas), you
may call (614) 723-1550 for your local CompuServe
number.
Microchip regularly uses the Microchip BBS to distribute
technical information, application notes, source code,
errata sheets, bug reports, and interim patches for
Microchip systems software products. For each SIG, a
moderator monitors, scans, and approves or disap-
proves files submitted to the SIG. No executable files
are accepted from the user community in general to
limit the spread of computer viruses.
Systems Information and Upgrade Hot Line
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive any currently available upgrade kits.The
Hot Line Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-602-786-7302 for the rest of the world.
Trademarks: The Microchip name, logo, PIC, PICSTART,
PICMASTER and PRO MATE are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
Flex
ROM, MPLAB and
fuzzy
LAB, are trade-
marks and SQTP is a service mark of Microchip in the
U.S.A.
fuzzy
TECH is a registered trademark of Inform Software
Corporation. IBM, IBM PC-AT are registered trademarks of
International Business Machines Corp. Pentium is a trade-
mark of Intel Corporation. Windows is a trademark and
MS-DOS, Microsoft Windows are registered trademarks
of Microsoft Corporation. CompuServe is a registered
trademark of CompuServe Incorporated.
All other trademarks mentioned herein are the property of
their respective companies.
ON-LINE SUPPORT
Microchip provides two methods of on-line support.
These are the Microchip BBS and the Microchip World
Wide Web (WWW) site.
Use Microchip's Bulletin Board Service (BBS) to get
current information and help about Microchip products.
Microchip provides the BBS communication channel
for you to use in extending your technical staff with
microcontroller and memory experts.
To provide you with the most responsive service possible,
the Microchip systems team monitors the BBS, posts
the latest component data and software tool updates,
provides technical help and embedded systems
insights, and discusses how Microchip products pro-
vide project solutions.
The web site, like the BBS, is used by Microchip as a
means to make files and information easily available to
customers. To view the site, the user must have access
to the Internet and a web browser, such as Netscape or
Microsoft Explorer. Files are also available for FTP
download from our FTP site.
Connecting to the Microchip Internet Web Site
The Microchip web site is available by using your
favorite Internet browser to attach to:
www.microchip.com
The file transfer site is available by using an FTP ser-
vice to connect to:
ftp://ftp.futureone.com/pub/microchip
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
Connecting to the Microchip BBS
Connect worldwide to the Microchip BBS using either
the Internet or the CompuServe communications net-
work.
Internet:
You can telnet or ftp to the Microchip BBS at the
address: mchipbbs.microchip.com
CompuServe Communications Network:
When using the BBS via the Compuserve Network,
in most cases, a local call is your only expense.
The Microchip BBS connection does not use CompuServe
membership services, therefore you do not need
CompuServe membership to join Microchip's BBS.
There is no charge for connecting to the Microchip BBS.
970301
PIC16C6X
DS30234E-page 330 1997-2013 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
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DS30234E
PIC16C6X
P|C1606X Producl Iden at n System
__ 1;
Sales and Support
To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed
sales offices.
* JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of
each oscillator type (including LC devices).
Sales and Support
Products supported by a preliminary Data Sheet may possibly have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. The Microchip Website at www.microchip.com
2. Your local Microchip sales office (see following page)
Pattern: 3-Digit Pattern Code for QTP (blank otherwise)
Package: L=PLCC
SP = Skinny DIP
P=PDIP
SO = SOIC (Gull Wing, 300 mil body)
PQ = MQFP (Metric PQFP)
TQ = TQFP
JW* = Windowed CERDIP
SS = Shrink SOIC (Gull Wing, 300 mil body)
Temperature - = 0°C to +70°C (T for tape/reel)
Range: I = – 40°C to +85°C (S for tape/reel)
E = – 40°C to +125°C
Frequency 04 = 200 kHz (PIC16C6X-04)
Range: 04 = 4 MHz
10 = 10 MHz
20 = 20 MHz
Device: PIC16C6X :VDD range 4.0V to 6.0V
PIC16C6XT :VDD range 4.0V to 6.0V (Tape and Reel)
PIC16LC6X :VDD range 2.5V to 6.0V
PIC16LC6XT :VDD range 2.5V to 6.0V (Tape and Reel)
PIC16CR6X :VDD range 4.0V to 6.0V
PIC16CR6XT :VDD range 4.0V to 6.0V (Tape and Reel)
PIC16LCR6X :VDD range 2.5V to 6.0V
PIC16LCR6XT:VDD range 2.5V to 6.0V
PART NO. -XX X /XX XXX
Examples:
a)PIC16C62A - 04/P 301 = Commercial temp., PDIP package, 4 MHz, normal VDD limits, QTP pattern #301
b)PIC16LC65A - 04I/PQ = Industrial temp., MQFP package, 4 MHz, extended VDD limits
c)PIC16C67 - 10E/P = Extended temp., PDIP package, 10 MHz, normal VDD limits
PIC16C6X
1997-2013 Microchip Technology Inc. DS30234E-page 331
PIC16C6X Product Identification System
PIC16C6X
DS30234E-page 332 1997-2013 Microchip Technology Inc.
1997-2013 Microchip Technology Inc. DS30234E-page 333
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 1997-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620769652
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
Q
MICRDCHIP
DS30234E-page 334 1997-2013 Microchip Technology Inc.
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Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Worldwide Sales and Service
11/29/12
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