LQH32CNyyyy53L Spec Datasheet by Murata Electronics

SQecNo.JELF243A70030TVO1 Re fe I' e n C e O n I

SpecNo.JELF243A-0030T-01 P1/8

MURATA MFG.CO., LTD

Reference Only

CHIP COIL (CHIP INDUCTORS) LQH32CN□□□□53L REFERENCE SPECIFICATION

1. Scope

This reference specification applies to LQH32CN_53 Series, Chip coil (Chip Inductors).

2. Part Numbering

(ex) LQ H 32 C N 1R0 M 5 3 L

Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging

(L×W) and

L:Taping

Characteristics

3. Rating

・Operating Temperature Range. -40 to +85°C

・Storage Temperature Range. -40 to +85°C

Customer

Part Number

MURATA

Part Number

Inductance DC

Resistance

(Ω)

Self

Resonant

Frequency

(MHz min)

∗Rated

Current

(mA)

(µH) Tolerance

LQH32CN1R0M53L 1.0

±20%

0.060±30% 100 1000

LQH32CN2R2M53L 2.2 0.097±30% 64 790

LQH32CN3R3M53L 3.3 0.12 ±30% 50 710

LQH32CN4R7M53L 4.7 0.15 ±30% 43 650

LQH32CN6R8M53L 6.8 0.25 ±30% 32 540

LQH32CN100K53L 10

±10%

0.30 ±30% 26 450

LQH32CN150K53L 15 0.58 ±30% 26 300

LQH32CN220K53L 22 0.71 ±30% 19 250

LQH32CN330K53L 33 1.1 ±30% 17 200

LQH32CN470K53L 47 1.3 ±30% 15 170

LQH32CN680K53L 68 2.2 ±30% 12 130

LQH32CN101K53L 100 3.5 ±30% 10 100

∗When applied Rated current to the Products , self temperature rise shall be limited to 20 max and ℃

Inductance will be within ±10% of initial Inductance value.

4. Testing Conditions

Temperature : Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C

Humidity : Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70%(RH)

Atmospheric Pressure : 86 to 106 kPa

5. Appearance and Dimensions

■Unit Mass (Typical value)

0.045ｇ

(in mm)

2.5 ± 0.2

2.5 ± 0.2 2.5 ± 0.2

1.55 ± 0.15

3.2 ± 0.3

0.9 ± 0.31.3 ± 0.2 0.9 ± 0.3

A:2.8max.

※

No marking.

SQecNo.JELF243A70030TVO1 Re fe I' e n C e O n I

SpecNo.JELF243A-0030T-01 P2/8

MURATA MFG.CO., LTD

Reference Only

6.Electrical Performance

No. Item Specification Test Method

6.1 Inductance Inductance shall meet item 3. Measuring Equipment : KEYSIGHT 4192A or equivalent

Measuring Frequency: 1MHz

6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter

6.3 Self Resonant

Frequency(S.R.F)

S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent

7.Mechanical Performance

No. Item Specification Test Method

7.1 Shear Test Chip coil shall not be damaged. Substrate: Glass-epoxy substrate

Applied Direction :

Force: 10N

Hold Duration: 5±1s

7.2 Bending Test Substrate:Glass-epoxy substrate

(100×40×1.6mm)

Speed of Applying Force: 1mm / s

Deflection: 2mm

Hold Duration: 30seconds.

(in mm)

7.3 Vibration Oscillation Frequency : 10~55~10Hz for 1 minute

Total Amplitude: 1.5mm

Testing Time: A period of 2 hours in each of 3

mutually perpendicular directions.

(Total 6 hours)

7.4 Solderability The wetting area of the electrode shall

be at least 90% covered with

new solder coating.

Flux: Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating : 150±10°C / 60 to 90seconds

Solder Temperature : 240±5°C

Immersion Time : 3±1 s

7.5 Resistance to

Soldering Heat

Appearance:No damage

Inductance Change: within ±5%

Flux: Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating: 150±10°C / 60 to 90seconds

Solder Temperature: 270±5°C

Immersion Time: 10±1 s

Then measured after exposure in the room condition

for 24±2 hours.

Ｆ

Chip coil

Substrate

R340

Deflection

45 Product

Pressure jig

SQecNo.JELF243A70030TVO1 Re fe I' e n C e O n I

SpecNo.JELF243A-0030T-01 P3/8

MURATA MFG.CO., LTD

Reference Only

8.Environmental Performance (It shall be soldered on the substrate.)

No. Item Specification Test Method

8.1 Heat Resistance Appearance:No damage

Inductance Change: within ± 5%

DC Resistance Change: within ± 5%

Temperature: 85±2°C

Time: 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.2

Cold Resistance Temperature: -40±2°C

Time: 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.3 Humidity Temperature: 40±2°C

Humidity: 90~95%(RH)

Time: 1000h (+48h , -0h)

Then measured after exposure in the room condition

for 24±2 hours.

8.4 Temperature

Cycle

1 cycle:

1 step: -40±2°C / 30±3 minutes

2 step: Ordinary temp. / 10 to 15 minutes

3 step: +85±2°C / 30±3 min

4 step: Ordinary temp. / 10 to 15 minutes

Total of 10 cycles

Then measured after exposure in the room condition

for 24±2 hours.

9. Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

(in mm)

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not

continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape 10N min.

Cover tape 5N min.

2.9±0.2 2.0±0.05

4.0±0.1

Direction of feed

※

Lead- in/out wire

4.0±0.1

3.6±0.2

8.0±0.2

1.75±0.13.5±0.05

1.5

-0

+0.1

1.7±0.2

0.2

※

The packing directions of the chip coil

in taping are unified with the in/out

positions of the lead wire.

( )

Dimension of the Cavity is measured

at the bottom side.

SQecNo.JELF243AVOO3OTrO1 Re fe I' e n C e O n I Mm Y (A)

SpecNo.JELF243A-0030T-01 P4/8

MURATA MFG.CO., LTD

Reference Only

9.4 Peeling off force of cover tape

Speed of Peeling off 300mm/min

Peeling off force 0.2 to 0.7N

(minimum value is typical)

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.> □□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking » ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,

Quantity, etc ･･･

9.8. Specification of Outer Case

Outer Case Dimensions (mm) Standard Reel Quantity

in Outer Case (Reel)

W D H

186 186 93 5

∗Above Outer Case size is typical. It depends on a quantity of an order.

10. Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)

(2) Aerospace equipment (7) Traffic signal equipment

(3) Undersea equipment (8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment (9) Data-processing equipment

(5) Medical equipment (10) Applications of similar complexity and /or reliability requirements

to the applications listed in the above

165 to 180 degree FCover tape

Plastic tape

Empty tape

190 min.

Leader

Trailer

Cover tape

2.0±0.5

13.0±0.2

21.0±0.8

180±

60±

9±

13±1.4

Direction of feed

210 min.

160 min.

Label

SQecNo.JELF243AVOO3OTrO1 Re fe I' e n C e O n I

SpecNo.JELF243A-0030T-01 P5/8

MURATA MFG.CO., LTD

Reference Only

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land patterns for flow and reflow soldering are as follows:

These have been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

Flow Soldering Reflow Soldering ∗

(in mm)

∗ Applicable to flow soldering.

11.2 Flux, Solder

Flux

・Use rosin-based flux.

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

Solder ・Use Sn-3.0Ag-0.5Cu solder.

・Standard thickness of solder paste : 200μm to 300μm

11.3 Flow soldering conditions / Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to

150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of

product quality.

Soldering profile

(1)Flow soldering profile

Standard Profile Limit Profile

Pre-heating 150℃、60s min.

Heating 250℃、4s～6s 265 ±3℃℃、5s

Cycle of flow 2 times 1 time

Chip Coil

Solder Resist

Land

5.5

1.3

1.0

5.5

1.0

2.0

1.0 1.3 1.0

265℃±3℃

Heating Time

150

Limit Profile

Standard Profile

(s)Time.

Temp.

(℃)

60s min.

250℃

SQecNo.JELF243AVOO3OTrO1 Re fe I' e n C e O n I

SpecNo.JELF243A-0030T-01 P6/8

MURATA MFG.CO., LTD

Reference Only

(2)Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150～180°C 、90s±30s

Heating above 220°C、30s～60s above 230°C、60s max.

Peak temperature 245±3°C 260°C,10s

Cycle of reflow 2 times 1 time

11.4 Reworking with soldering iron.

The following conditions must be strictly followed when using a soldering iron.

Pre-heating 150°C,1 min

Tip temperature 350°C max.

Soldering iron output 80W max.

Tip diameter 3mm max.

Soldering time 3(+1,-0)s

Times 2 times

Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack

on the products due to the thermal shock.

11.5 Solder Volume

・Solder shall be used not to be exceed the upper limits as shown below.

・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦ t ≦T

(T: Lower flange thickness)

11.6 Product's location

The following shall be considered when designing and laying out P.C.B.’s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length: a<b) to the mechanical

stress.

〈

Poor example

〉〈

Good example

〉

Upper Limit

Recommendable

Limit Profile

Standard Profile

90s±30s

230℃

260℃

245℃±3℃

220℃

30s～60s

60s max.

180

150

Temp.

(s)

(℃)

Time.

SQecNoJELFZASAsOOSOTsm /\—/D\ﬂ/\ I 0030 ( ) oooo( ﬂ; (3) Mounling Componenls Near Screw Holes When a component is mounted near a screw hole. ii may be arrecled by lhe board derleclion lhal occurs during lhe lightening oi lhe screw, Mounl lhe componeni Screw We Rec in a posilion as far away from the screw holes as possible. @E-> 11.7 Cleaning Conditions Producls shall be cleaned an lhe following condllicns. (1) Cleaning Iemperalme shall be limiled Io 60"C max (40°C max {or IPA) (2) Ullrasonic cleaning shall comply wiih lhe follcwlrig condilions wiih avoiding lhe resonance ph al lhe mounled producls and P.C.B. Power: 20 W / I max. Frequency : ZBKHZ Ia AOKHZ Tlme : 5 mlnules max. (3) Cleaner 1 Allernalive Cleaner - Isoprupyl alcohol (IPA) 2. Aqueous agenl - PINE ALPHA ST-1DDS (4) There shall be no residual flux and residual cleaner aﬂer cleaning. In lhe case oi using aqueous agenl. producls shall be dried complelely aﬂer rinse wilh dei in order Io remove lhe Cleaner (5) Olher cleaning Please conlac‘ us. 11.6 Resin coaling The induciance value may change due lo high curesslress of resin lo be used for coaling/molding p circuil issue may occur by mechanical slress caused by lhe resin. amounl/cured shape oi re condilion eic. Some resin comalns some impurilies or chloride possible lo generale chlorine by some operaiing condilion may cause corrosion of wire of coil. leading lo open circuii. So, please allenlion when you selecl resin in case ol coaiing/molding lhe producis wilh lhe resin.Prior lo use please make sure no reliability issue is observed by evaluallng producis mounled on your board. 11.9 Caulion for use - Sharp malerial such as a pair of tweezers or olher malerial such as bnslles of cleaning brush. shall no winding ponion m prevenllhe breaking ol wire. - Mechanical shock should nol be applied lo lhe producls mounled on lhe board lo prevenuhe breakin 11.10 Handling 01 a subslrale Aﬂer moumlng producls on a subsiraie, do nol apply any slress lo me produci caused by bending or (Wis when cropping me subslraie. inserling and removing a connecior irom lhe subslrale or ligmerling screwl Excessive mechanical siress may cause cracking in lhe product Bending Twisling MURATA MFG.CO., LTD

SpecNo.JELF243A-0030T-01 P7/8

MURATA MFG.CO., LTD

Reference Only

(2) Components location on P.C.B. separation.

It is effective to implement the following measures, to reduce stress in separating the board.

It is best to implement all of the following three measures; however, implement as many measures

as possible to reduce stress.

Contents of Measures Stress Level

(1) Turn the mounting direction of the component parallel to

the board separation surface. A > D *1

(2) Add slits in the board separation part. A > B

(3) Keep the mounting position of the component away from

the board separation surface. A > C

*1 A > D is valid when stress is added vertically to

the perforation as with Hand Separation.

If a Cutting Disc is used, stress will be diagonal to

the PCB, therefore A > D is invalid.

(3) Mounting Components Near Screw Holes

When a component is mounted near a screw hole,

it may be affected by the board deflection that occurs

during the tightening of the screw. Mount the component

in a position as far away from the screw holes as possible.

11.7 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon

at the mounted products and P.C.B.

Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.

(3) Cleaner

1. Alternative cleaner

・Isopropyl alcohol (IPA)

2. Aqueous agent

・PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning.

In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water

in order to remove the cleaner.

(5) Other cleaning

Please contact us.

11.8 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open

circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating

condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under

some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful

attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin,

please make sure no reliability issue is observed by evaluating products mounted on your board.

11.9 Caution for use

・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the

winding portion to prevent the breaking of wire.

・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core

11.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate

when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

Seam

Slit

Length:a

Screw Hole Recommended

SQecNo.JELF243AVOO3OTrO1 Re fe I' e n C e O n

SpecNo.JELF243A-0030T-01 P8/8

MURATA MFG.CO., LTD

Reference Only

11.11 Storage and Handling Requirements

(1) Storage period

Use the products within 12 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature : -10 ~ 40°C

Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity

The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,

chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.

・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking

of winding wire caused by the collision between the products.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.

・Products should be s stored in the warehouse without heat shock, vibration, direct sunlight and so on.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

12. Note

(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted

to your product.

(2) You are requested not to use our product deviating from the reference specifications.

(3) The contents of this reference specification are subject to change without advance notice. Please approve our

product specifications or transact the approval sheet for product specifications before ordering

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