FP0705 Series Datasheet by Eaton - Electronics Division

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C colLrnnmcS' FPO705R17R077R FPO705R17R107R FPO705R17R127R FPO705R27R077R N\ RoHS moms/EC (m0hm)@20°C conga Bussmann
Applications
Portable electronics
Servers and workstations
Data networking and storage systems
Notebook and desktop computers
Graphics cards and battery power systems
Multi-phase regulators
Voltage Regulator Module (VRM)
DCR sensing
Environmental Data
Storage temperature range: -40°C to +125°C
Operating temperature range: -40°C to +125°C
(Range is application specific)
Solder reflow temperature: J-STD-020D compliant
Packaging
Supplied in tape-and-reel packaging, 950 parts per reel,
13” dia. reel
Description
125°C maximum total temperature operation
7.0 x 7.0 x 4.95mm surface mount package
Ferrite core material, High current carrying capacity
Low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 72nH to 220nH
Current range from 20 to 65 Amps, frequency range up
to 2MHz
RoHS compliant
High Current, Low-Profile Power Inductors
FLAT-PAC™ FP0705 Series
05-05-08 BU-SB08210 Page 1 of 4 Data Sheet: 4325
SMD Device
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4I
sat1: Peak current for approximately 20% rolloff at +25°C.
5I
sat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K *L *ΔI *10-3,B
p-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP0705Rx-Rxx-R
• FP0705 = Product code and size • Rx is the DCR indicator
• Rxx= Inductance value in μH, R = decimal point “-R” suffix = RoHS compliant
Product Specifications
Part Number OCL1± 10% (nH) FLL2Min. (nH) Irms3(Amps) Isat14@ 25°C (Amps) Isat25@ 125°C (Amps) DCR (mOhm)@20°C K-factor6
RR11 VVeerrssiioonn
FP0705R1-R07-R 72 51
43
65 50
0.25 ± 10%
826
FP0705R1-R10-R 105 75 44 36 826
FP0705R1-R12-R 120 86 37 30 826
FP0705R1-R15-R 150 108 30 24 826
FP0705R1-R18-R 180 130 25 20 826
FP0705R1-R22-R 220 158 20 16 826
RR22 VVeerrssiioonn
FP0705R2-R07-R 72 51
38
65 50
0.32 ± 9.4%
826
FP0705R2-R10-R 105 75 44 36 826
FP0705R2-R12-R 120 86 37 30 826
FP0705R2-R15-R 150 108 30 24 826
FP0705R2-R18-R 180 130 25 20 826
FP0705R2-R22-R 220 158 20 16 826
RR33 VVeerrssiioonn
FP0705R3-R07-R 72 51
32
65 50
0.46 ± 6.5%
826
FP0705R3-R10-R 105 75 44 36 826
FP0705R3-R12-R 120 86 37 30 826
FP0705R3-R15-R 150 108 30 24 826
FP0705R3-R18-R 180 130 25 20 826
FP0705R3-R22-R 220 158 20 16 826
K' > w 600$! Bussmann
Dimensions - mm A = 7.0 Max. B = 7.0 Max. C = 4.95 Max. D = 2.45 ± 0.2 E = 1.52 ± 0.2 F = 3.5 Typ.
Top View
a
b
B
A
E
D
F
1
2
Rxx
wwllyy
Side View Bottom View
2.0
3.1
3.3
Recommended Pad Layout Schematic
1
2
C
0705Rx
R
SECTION A-A
A
A
5.1
7.1
7.1
User direction of feed
1
2
SECTION B-B
B B
6.5
3.5
Rxx
wwllyy
0705Rx
R
16.00
±0.30
1.5
dia.
12.0
1.5
dia
7.5
1.75
4.0
2.0
0
20
40
60
80
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Total Loss (W)
Temperature Rise (°C)
Part Marking: Coiltronics Logo 0705Rx (Rx = DCR indicator) Rxx = inductance value in μH (R = decimal point) wwllyy = date code R = revision level
Supplied in tape-and-reel packaging, 950 parts per reel, 13” diameter reel.
Nominal DCR is measured from point “a” to point “b.”
Packaging Information - mm
Temperature Rise vs. Total Loss
05-05-08 BU-SB08210 Page 2 of 4 Data Sheet: 4325
‘- Bussmann
05-05-08 BU-SB08210 Page 3 of 4 Data Sheet: 4325
OCL vs. I 1
0%
20%
40%
60%
80%
100%
0% 20% 40% 60% 80% 100% 120%
% of I 1
% of OCL
+125°C
+25°C
-40°C
sat
sat
Core Loss vs. B
0.00001
0.0001
0.001
0.01
0.1
1
10
100 1000 10000
B (Gauss)
Core Loss(W)
1MHz
500kHz
300kHz
200kHz
100kHz
p-p
p-p
Inductance Characteristics
Core Loss
I: 7// m 1-— _. L T A ”5‘ "m f COOPER Bussmann
© 2008 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
05-05-08 BU-SB08210 Page 4 of 4 Data Sheet: 4325
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume
Package mm3mm3
Thickness <350 >
_350
<2.5mm 235°C220°C
>
_2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 26C26C26C
1.6 – 2.5mm 26C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
Average ramp up rate Tsmaxto TpC/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C217°C
Time at liquidous (tL)60-150 Seconds60-150 Seconds
Peak package body temperature (TP)*Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tpto Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, with-
out notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in significant injury to the user.

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