EZACT,DT,ST,SS,NT_EZASTB,SSB Series Datasheet by Panasonic Electronic Components

View All Related Products | Download PDF Datasheet
– 261 –
Chip RC Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
GND GND
GND GND
Discrete Chips
Discrete Chips
Chip RC Network
(EZACT, EZADT, EZAST/SS, EZANT)
Chip RC Network
(EZACT, EZADT, EZAST/SS, EZANT)
Chip RC Network
(EZASTB/SSB)
Chip RC Network
(EZASTB/SSB)
I/O I/O
I/O I/O
I/O I/O
I/O I/O
I/O I/O
I/O I/O
Chip RC Networks
Type: EZACT
EZADT
EZAST/SS
EZANT
Type: EZASTB/SSB
Features
Smallest SMD R/C networks
4 popular noise reduction circuits made
EZACT : 2.0 mm ҂ 1.2 mm ҂ 0.6 mm, 0.5 mm pitch (Flat terminal type)
EZADT : 3.2 mm ҂ 1.6 mm ҂ 0.65 mm, 0.635 mm pitch (Concave terminal type)
EZAST/SS : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.8 mm pitch (Concave terminal type)
EZASTB/SSB : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.65 mm pitch (Convex terminal type)
EZANT : 6.4 mm ҂ 3.1 mm ҂ 0.80 mm, 1.27 mm pitch (Concave terminal type)
Takes up less space than discrete chip resistor & chip capacitor
EZACT:25 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZADT:50 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZAST/SS, EZASTB/SSB:70 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZANT:55 % of 0805 inches (2.0 mm ҂ 1.2 mm) chips placing area
RC Low pass fi lter AC Terminator
<Effect of high density placing, PWB space saving>
Recommended Applications
Digital equipment such as PCs, printers, HDD, PCMCIA cards, PDAs, and word processors
Communication equipment, digital cordless phones, automobile phones, GSM, PHS, DECT
Digital audio and video equipment
Electronic musical instruments, and other digital devices
Sep. 201000
●RoHS compliant
Discontinued
Panasonic DDDDDDDDDDDD ESE DDDDDCDDDDDD n u Emma Cduu Jr a; m atmuv enhuv edr chum. uplu'm‘fi‘c ‘qu E n u Emma ‘axz Cduu Jr a; ‘ m atmuv enhuv edr chum. uplu'm‘fi‘c v ekflue ‘011 m . D:KDDCDDDDDD DEEDS EEG IDDDDDD
– 262 –
Chip RC Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
Z
2
A
3
S
4
S
5
B
6
7
7
0
8
1
9
A
10
J
11 12
SSB
J±5%
4.0 mm
҂2.1 mm
Thick Film Noise
Suppression and
Filtering
Components
Suffix for Special
Requirement
Dimension and
Circuit Configuration
Resistance
Tolerance
Design Number
Common Code
Convex
terminal type
Chip RC
Networks
Resistance Value : 10 to 100 k
Capacitance Value : 10 pF to 180 pF
In above-mentioned range, it is possible to
choose optional R/C.
E
1
Z
2
A
3
S
4
S
5
7
6
0
7
1
8
Y
9
A
10
J
11 12
SS
J
SS
CT ±5%
4.0 mm
҂2.1 mm
NT 6.4 mm
҂3.1 mm
Thick Film Noise
Suppression and
Filtering
Components
Suffix for Special
Requirement
Dimension and
Circuit Configuration
Resistance
Tolerance
Design Number
Common Code
DT 3.2 mm
҂1.6 mm
CT 2.0 mm
҂1.2 mm
Chip RC
Networks
Resistance Value : 10 to 100 k
Capacitance Value : 10 pF to 180 pF
In above-mentioned range, it is possible to
choose optional R/C.
Resistance Value : 10 to 100 k
Capacitance Value : 10 pF to 33 pF
In above-mentioned range, it is possible to
choose optional R/C.
DT
Resistance Value : 10 to 100 k
Capacitance Value : 10 pF to 100 pF
In above-mentioned range, it is possible to
choose optional R/C.
NT
Resistance Value : 10 to 100 k
Capacitance Value : 220 pF to 1000 pF
In above-mentioned range, it is possible to
choose optional R/C.
E
1
Z
2
A
3
S
4
T
5
B
6
3
7
3
8
A
9
A
10
J
11 12
STB 22
47
100
220
470
1k
1
2
3
4
5
6
22 pF
47 pF
100 pF
1
2
3
AA J±5%
4.0 mm
҂2.1 mm
Thick Film Noise
Suppression and
Filtering
Components
Standard
Suffix for Special
Requirement
Dimension and
Circuit Configuration
Resistance
Tolerance
Design
Configuration
Common Code
R/C Standard Combination
Convex
terminal type
Chip RC
Networks
Resistance Value
Configuration
Capacitance Value
Configuration
E
1
Z
2
A
3
S
4
T
5
3
6
3
7
A
8
A
9
A
10
J
11 12
ST
10
22
47
100
220
470
1k
AAA J±5%
4.0 mm
҂2.1 mm
NT 6.4 mm
҂3.1 mm
Thick Film Noise
Suppression and
Filtering
Components
Standard
Suffix for Special
Requirement
Dimension and
Circuit Configuration
Resistance
Tolerance
Design
Configuration
Common Code
R/C Standard Combination
DT 3.2 mm
҂1.6 mm Chip RC
Networks
Resistance Value
Configuration 1
Capacitance Value
Configuration 2
122to1kavailable for EZADT, EZAST, and EZANT
210pFand 22 pF available for EZACT. 22 pF to 100 pF available for EZAST, EZADT. 220 pF to 1000 pF available for EZANT.
10 pF
22 pF
47 pF
100 pF
220 pF
470 pF
1000 pF
CT 2.0 mm
҂1.2 mm
0
1
2
3
4
5
6
0
1
2
3
4
5
6
EZASSB (R/C Except the standard Com bi na tion)
Explanation of Part Numbers
EZACT EZADT EZAST EZANT (R/C Standard Combination)
EZACT EZADT EZASS EZANT (R/C Except the standard Combination)
EZASTB (R/C Standard Combination)
Sep. 201000
Discontinued
Panasonic gal—ca £721“ HIDLM HIGH“ +A V. + H + H
– 263 –
Chip RC Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
GND
Electrode
(Outer)
Marking
Protective coating
Alumina substrate
Electrode
(Outer)
GND
Electrode
(Outer)
33
GND
Electrode
(Outer)
Marking
Protective coating
Alumina substrate
Electrode
(Outer)
GND
Electrode
(Outer)
GND
Electrode
(Outer)
Marking
Protective coating
Alumina substrate
Electrode
(Outer)
GND
Electrode
(Outer)
R1
C1
R2
C2
R3 R4
C3 C4
10 9 8 7
2345
61
R1=R2=R3=R4
C1=C2=C3=C4
GND GND
R1
C1
R2
C2
R3 R4
C3 C4
10 9 8 7
23 4 561
GNDGND R1=R2=R3=R4
C1=C2=C3=C4
1112
GND
Electrode
(Outer)
Marking
Protective coating
Alumina substrate
Electrode
(Outer)
GND
Electrode
(Outer)
33
GND
Electrode
(Outer)
Marking
Protective coating Alumina substrate
Electrode
(Outer)
R1 R2 R3 R4
C1 C2 C3 C4
10 9 8 7
GND GND
2345
61
R1=R2=R3=R4
C1=C2=C3=C4
Construction
Circuit Confi guration
EZACT EZADT EZAST/SS
EZANT EZASTB/SSB
EZACT EZADT EZAST/SS EZANT EZASTB/SSB
Sep. 201000
Discontinued
anasonic
– 264 –
Chip RC Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
0.2±0.1
0.33±0.10
0.40±0.15
(0.635)
3.20±0.15
61
4523
8710 9
1.60±0.15
0.65
0.40±0.15
0.45±0.15
0.35±0.15 0.35±0.10
+
0.20
0.10
33
0.25±0.20
0.5±0.2
0.5±0.2
(0.8)
4.0±0.2
61
4523
8710 9
2.1±0.2
0.65 0.20
0.10
+
0.4±0.2
0.45±0.20
0.5±0.2
0.4±0.2
0.65±0.20
1
0.8±0.2
(1.27)
6.4±0.2
4523
8710 9
0.25±0.20
3.1±0.2
6
0.5±0.2
0.9±0.2
0.55±0.20
0.80+
0.20
0.10
0.75±0.20
12 34 5 6
12 11 10 9 8 7
2.2±0.2
0.25±0.15
0.58±0.2
4.0±0.2 0.65 0.20
0.10
+
0.35±0.20 0.3±0.2
0.275 0.200
0.100
+
0.2 0.2
0.1
+
0.4±0.2
(0.65)
33
45
61
23
(0.5)
2.0±0.1
0.20±0.15 0.30±0.15
8710 9
1.25±0.10
0.25±0.15
0.40±0.15
0.55±0.10
Dimensions in mm(not to scale)
EZACT EZADT
Size : 0805 inches
( ) Reference Mass (Weight) [1000 pcs.] :4 g
Size : 1206 inches
( ) Reference Mass (Weight) [1000 pcs.] :11 g
EZAST/SS EZANT
Size : 1608 inches
( ) Reference Mass (Weight) [1000 pcs.] :17 g
Size : 2512 inches
( ) Reference Mass (Weight) [1000 pcs.] :55 g
EZASTB/SSB
Size : 1608 inches
( ) Reference Mass (Weight) [1000 pcs.] :18 g
Sep. 201000
Discontinued
Panasonic
– 265 –
Chip RC Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Frequency (Hz)
Attenuation (dB) Attenuation (dB)
Frequency (Hz)Frequency (Hz)
Frequency (Hz)
Attenuation (dB) Attenuation (dB)
1M 10M 100M 1G
0
10
20
30
40
50
60
70
80
0
10
20
30
40
50
1M 10M 100 M 1 G 3G
100M 3G1G10M1M1M 10M 100M 1G 3G
0
10
20
30
40
50
10
0
–10
–20
–30
–40
–50
100 /10pF
100 /22pF
100 /22pF
100/ 100 pF
100/47pF
1k/330 pF
1k/ 1000 pF
100 /100 pF
100 /22pF
100 /4
7pF
Measurement Circuit
~
50
50
EZACT
EZADT
EZAST
EZASTB
EZANT
100
80
60
40
20
0
30
0102030405060708090
Ambient Temperature (°C)
Rated Load (%)
70 °C
85 °C
20 10
Attenuation Characteristics
EZACT
EZST EZASTB
EZADT
(1) For resistors operated in ambient temperature above 70 °C, rated power shall be derated. (“Power Derating Curve” is shown below)
(2) Rated Voltage for resistor shall be determined from Rated Power҂Resistance Value, or Limiting Element Voltage whichever less.
(3) In measuring at 1 MHz, Capacitance and Dissipation Factor are different.
Ratings
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the fi gure on the right.
Item Specifi cation
Resistor
Resistance Values
10 to 100 k
EZAC Standard : 10 , 22 , 47 , 100 , 220 , 470 , 1 k
EZAD/S/N Standard : 22 , 47 , 100 , 220 , 470 , 1 k
Resistance Tolerance ±5 %
Temperature Coeffi cient of Resistance (T.C.R.) ±200 ҂ 10–6/°C
Rated Power EZAC : 0.031 W(<70 °C(1))
EZAD/S/N : 0.063 W(<70 °C(1))
Limiting Element Voltage 25 V(2)
Capacitor
Capacitance Values
(25 °C, 1 kHz(3), 1 Vrms)
EZAC : 10 pF to 33 pF
Standard : 10 pF, 22 pF
EZAD : 10 pF to 100 pF
EZAS : 10 pF to 180 pF
Standard : 22 pF, 47 pF, 100 pF
EZAN : 220 pF to 1000 pF
Standard : 220 pF, 470 pF, 1000 pF
Capacitance Tolerance +30 %/–20 %
Capacitance Temperature Characteristics E Characteristic: +20 %/–55 %(–25 to +85 °C)
Dissipation Factor Less than 3 %(25, 1 kHz(3), 1 Vrms)
Rated Voltage
EZAC, EZAD : 12 V
EZAS : 25 V
EZAN : 50 V
Category Temperature Range –25 °C to +85 °C
EZANT
Sep. 201000
Discontinued
Panasonic WU' L‘K U\ F‘I LJ 1'" LJ (H— \L
– 266 –
Chip RC Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
TTA
P0
P2
P1
φD0
B
F
W
E
φD1(Only Emboss)
φN
W2
W1
φA
φC
Carrier Tape (Unit : mm)
(Unit : mm)
Taping Reel
Packaging Methods (Taping)
Standard Quantity
Type A B W F E P1P2P0φD0TφD1
EZACT 1.55±0.15 2.30±0.20
8.00±0.20 3.50±0.05 1.75±0.10
4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10
0.85±0.05
EZADT 2.00±0.20 3.60±0.20
EZAST/SS 2.50±0.20 4.40±0.20
12.00±0.30 5.50±0.20 1.75±0.20 1.15±0.20
1.50+0.10
EZASTB/SSB
EZANT 3.50±0.20 6.80±0.20 1.30±0.20
−0
−0
Type Kind of Taping Pitch (P1) Quantity
EZACT Punched Carrier Taping
4 mm
5000 pcs./reel
EZADT
EZAST/SS
Embossed Carrier Taping 4000 pcs./reel
EZASTB/SSB
EZANT
Type φAφNφCW
1W2
EZACT
180.0–1.5 60+1.0 13.0±0.2
9.0+1.0 11.4±1.0
EZADT
EZAST/SS
13.0+1.0 15.4±1.0
EZASTB/SSB
EZANT
+0
–0
–0
–0
Sep. 201000
Panasonh Yifit:i {TIEII-< h="" w—\="" 7="" i="" i="" i="" if,="" i§="" +="">
– 267 –
Chip RC Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
GND
c
f2
f1
a
e
d
b P
Land pattern
Solder resistant
GND
f2
f1
a
Pc db
Land pattern
Land pattern
Pb
f
a
g
c
d
f
a
g
c
d
PbLand pattern
e
a
h
g
c
Pb
d
Land pattern
Recommended Land Pattern Design
EZAST/SS
EZACT
EZASTB/SSB
EZANT
Design to make GND pattern as large as possible, because high
frequency noise is removed from GND terminals of chip RC network.
abcd
Dimensions
(mm) 1.2 to 1.4 0.4 3.1 to 3.3 0.4 to 0.5
ef1f2P
Dimensions
(mm) 0.8 2.9 to 3.3 4.8 to 5.2 0.8
abcd
Dimensions
(mm) 0.75 0.25 1.70 0.35
ehgP
Dimensions
(mm) 1.85 2.60 0.25 0.50
abcd
Dimensions
(mm) 1.4 to 1.6 0.35 0.45 0.3
f1 f2 P
Dimensions
(mm) 2.7 to 3.5 3.8 0.65
abcd
Dimensions
(mm) 2.3 to 2.5 0.4 to 0.6 5.6 to 5.8 0.4 to 0.8
fgP
Dimensions
(mm) 4.3 to 4.7 7.6 to 8.0 1.27
EZADT
abcd
Dimensions
(mm) 0.9 to 1.1 0.2 to 0.3 2.6 to 2.8 0.3 to 0.4
fgP
Dimensions
(mm) 2.0 to 2.6 3.6 to 4.2 0.635
Sep. 201000
Discontinued
Panasonic
– 268 –
Chip RC Networks
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Preheating
Peak
Heating
Temperature
Time
Recommended Soldering Conditions
Recommendations and precautions are described below.
The following are precautions for individual products. Please also refer to the common precautions shown on page 4
of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC networks)
so as not to damage their electrodes and protective coatings.
Be careful not to misplace the RC networks on the land patterns. Otherwise, solder bridging may occur.
2. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the RC networks' performance
and/or reliability.
3. Perform suffi cient preheating so that the difference of the solder temperature and the RC networks chip surface
temperature becomes 100 °C or less. Maintain the temperature difference within 100 °C during rapid cooling by
immersion into solvent after soldering.
4. When soldering with a soldering iron, never touch the RC networks' bodies with the tip of the soldering iron. When
using a soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at
350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the RC networks increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the RC networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC networks'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the RC networks from abnormal stress.
8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to
dielectric materials having a high dielectric constant.
Safety Precautions
Flow Soldering
We do not recommend fl ow soldering to the prod uct, because solder bridging may occur due to the
narrow pitch of the terminals and the characteristics of the product may be badly affected when using
adhesive to affi x it to a circuit board.
Recommended soldering conditions for refl ow
·Refl ow soldering shall be performed a maximum of
two times.
·Please contact us for additional information when
used in conditions other than those specifi ed.
·Please measure the temperature of the terminals and
study every kind of solder and printed circuit board
for solderability be fore actual use.
For soldering (Example : Sn/Pb)
Temperature Time
Preheating 140 °C to 160 °C 60 s to120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
This product has circuits on both sides. Therefore, do not use
adhesives because they may impair the products characteristics.
For lead-free soldering (Example : Sn/Ag/Cu)
Sep. 201000
Discontinued
Panasonic A
– 4 –
Safety Precautions
(Common precautions for Fixed Resistors, Noise Suppression Device, ESD Suppressor, fuses, and MR Sensors)
When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
Do not use the products beyond the specifi cations described in this catalog.
This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to
vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault
(1) Precautions for use
These products are designed and manufactured for general and standard use in general elec tron ic equipment
(e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment)
These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components (except Thermal Cutoffs).
Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al
at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
The performance of EMI Filters is guaranteed for 6 months or a year after our delivery, provided that they are stored
at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the
specifi cations. The performance of Thermal Cut offs is guaranteed for a year after our delivery, provided that they are
stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Sep. 201000

Products related to this Datasheet

FILTER RC 100 OHM/10PF SMD
FILTER RC(PI) 22 OHM/22PF SMD
FILTER RC(PI) 470 OHM/47PF SMD
FILTER RC 100 OHM/10PF SMD
FILTER RC 10 OHM/10PF SMD
FILTER RC 47 OHM/10PF SMD
FILTER RC 10 OHM/10PF SMD
FILTER RC(PI) 220 OHM/47PF SMD
FILTER RC(PI) 220 OHM/100PF SMD
FILTER RC(PI) 1 KOHM/22PF SMD
FILTER RC(PI) 220 OHM/47PF SMD
FILTER RC(PI) 220 OHM/100PF SMD
FILTER RC 47 OHM/10PF SMD
FILTER RC(PI) 470 OHM/47PF SMD
FILTER RC(PI) 100 OHM/22PF SMD
FILTER RC(PI) 470 OHM/22PF SMD
FILTER RC(PI) 22 OHM/220PF SMD
FILTER RC(PI) 22 OHM/22PF SMD
FILTER RC 22 OHM/10PF SMD
FILTER RC(PI) 1 KOHM/47PF SMD
FILTER RC(PI) 1 KOHM/470PF SMD
FILTER RC(PI) 1 KOHM/22PF SMD
FILTER RC(PI) 220 OHM/22PF SMD
FILTER RC(PI) 22 OHM/100PF SMD
FILTER RC(PI) 100 OHM/47PF SMD
FILTER RC(PI) 22 OHM/47PF SMD
FILTER RC(PI) 22 OHM/100PF SMD
FILTER RC(PI) 47 OHM/22PF SMD
FILTER RC(PI) 47 OHM/47PF SMD
FILTER RC(PI) 47 OHM/100PF SMD