Modular MSOP8 EVM Guide Datasheet by Texas Instruments

J9 TEXAS INSTRUMENTS

Modular MSOP8 EVM

June 2009 Data Acquisition

User’s Guide

SLAU115A

cause harm i0 you

-3

Read This First

Preface

Read This First

About This Manual

This user’s guide describes the characteristics, operation, and use of the

Modular MSOP8 EVM. This EVM is a multi-device, 12 to 16 bit, SSI, analog

to digital converter Evaluation Module. A complete circuit description, as well

as schematic diagram and bill of materials, are included.

How to Use This Manual

This document contains the following chapters:

-Chapter 1—EVM Overview

-Chapter 2—Analog Interface

-Chapter 3—Digital Interface

-Chapter 4—Power Supplies

-Chapter 5—EVM Operation

-Chapter 6—EVM Bill of Materials and Schematic

Information About Cautions and Warnings

This book may contain cautions and warnings.

This is an example of a caution statement.

A caution statement describes a situation that could potentially

damage your software or equipment.

This is an example of a warning statement.

A warning statement describes a situation that could potentially

cause harm to you.

-4

The information in a caution or a warning is provided for your protection.

Please read each caution and warning carefully.

Related Documentation From Texas Instruments

To obtain a copy of any of the following TI documents, call the Texas

Instruments Literature Response Center at (800) 477−8924 or the Product

Information Center (PIC) at (972) 644−5580. When ordering, identify this

booklet by its title and literature number. Updated documents can also be

obtained through our website at www.ti.com.

EVM Compatible Device Data Sheets: Literature Number:

ADS7816 SBAS110

ADS7817 SBAS230

ADS7818 SBAS078

ADS7822 SBAS062

ADS7834 SBAS098

ADS7835 SBAS102

ADS8317 SBAS356

ADS8320 SBAS108

ADS8321 SBAS123

ADS8324 SBAS172

ADS8325 SBAS226

ADS8326 SBAS343

Application Notes/Additional Literature: Literature Number:

Op Amps for Everyone SLOD006

5−6K Interface Board SLAU104

Single and Bipolar Supply Signal Conditioning Boards SLAU105

FCC Warning

This equipment is intended for use in a laboratory test environment only. It gen-

erates, uses, and can radiate radio frequency energy and has not been tested

for compliance with the limits of computing devices pursuant to subpart J of

part 15 of FCC rules, which are designed to provide reasonable protection

against radio frequency interference. Operation of this equipment in other en-

vironments may cause interference with radio communications, in which case

the user at his own expense will be required to take whatever measures may

be required to correct this interference.

Contents

1 EVM Overview 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Introduction 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Analog Interface 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 Digital Interface 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4 Power Supplies 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1 ADC Power 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2 Stand Alone Operation 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.3 Reference Voltage 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5 EVM Operation 5-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1 Analog Input 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2 Digital Control 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3 Chip Select (Shut Down) 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4 Digital I/O Buffers 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.5 Default Jumper Locations 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6 EVM BOM and Schematic 6-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1 EVM Schematic 6-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

2−1 Analog Interface Pin Out 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−1 Digital Interface Pin Out 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4−1 Power Supply Pin Out 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−1 List of Jumpers 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6−1 Bill of Materials 6-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contents

1-1

EVM Overview

The following section gives a general overview of the Modular MSOP8

evaluation board.

Topic Page

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Introduction 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1

Features

1-2

1.1 Features

-Full−featured evaluation board for a variety of single channel, eight pin Mi-

cro SOP, 12 and 16-bit, serial Output, analog to digital converters

-On-board reference and buffer circuits

-High-speed serial interface

-Modular design for use with a variety of DSP and micro controller interface

boards

1.2 Introduction

The Modular MSOP8 Evaluation Module is an updated version of the

Burr-Brown DEM-MSOP8 evaluation board. The EVM is designed so that a

single printed wiring board (PWB) supports a variety of high speed 12 and 16

bit serial ADC’s.

The modular EVM form factor allows for direct evaluation of the ADC’s

performance and operating characteristics. This EVM is compatible with the

5−6K Interface Board (SLAU104) from Texas Instruments.

2-1

Analog Interface

For maximum flexibility, the Modular MSOP8 EVM is designed for easy

interfacing to multiple analog sources. Samtec part numbers

SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin

dual row header/socket combination at J1. This header/socket provides

access to the analog input pins of the ADC. Consult Samtec at

www.samtec.com or call 1−800−SAMTEC−9 for a variety of mating connector

options.

Table 2−1.Analog Interface Pin Out

Pin Number Signal Description

J1.2 AD_IN+ Noninverting Input (Differential Devices)/Analog Input (Single Ended Devices)

J1.4 AD_IN−Inverting Input (Differential Devices)/Analog Ground (Single Ended Devices)

J1.6 Unused

J1.8 Unused

J1.10 Unused Pins are unused and should be left open for use with future amplifier and sensor

J1.12 Unused

Pins are unused and should be left open for use with future amplifier and sensor

input modules.

J1.14 Unused

J1.16 Unused

J1.18 REF(−) Unused

J1.20 REF(+) External Reference Source Input (2.5V NOM, 2.525 MAX)

J1.15 Unused

J1.1− J1.19

(odd) AGND Analog ground connections (except J1.15)

Chapter 2

2-2

3-1

Digital Interface

The Modular MSOP8 EVM is designed for easy interfacing to multiple control

platforms. Samtec part numbers, SSW-110-22-F-D-VS-K and

TSM-110-01-T-DV-P, provide a convenient 10-pin dual row header/socket

combination at J2. This header/socket provides access to the digital control

and serial data pins of the MSOP8 EVM. Consult Samtec at www.samtec.com

or 1−800−SAMTEC−9 for a variety of mating connector options.

Table 3−1.Digital Interface Pin Out

Pin Number Signal Description

J2.1 CS Chip Select – Active low signal, enables data transfer – jumper configurable

(see schematic)

J2.3 SCLK Serial Clock

J2.5 SCLKR Serial Clock Return (for DSP Host systems)

J2.7 FS Frame Sync for DSP host systems – alternate Chip Select through JMP2 (see

schematic)

J2.9 FSR Frame Sync Return (for DSP Host systems)

J2.11 Unused

J2.13 SDO Serial Data Output

J2.15 Unused

J2.17 Unused

J2.19 SPARE

Chapter 3

3-2

4-1

Power Supplies

The Modular MSOP8 EVM board requires 5 V dc for the analog section. This

includes the voltage reference (U2), the reference buffer (U4), and optionally,

the ADC installed on the EVM (via JMP1). Supply voltages of 1.8 V to 5 V dc

for the digital section are also required. When used in combination with one

of the DAP Interface boards, J3 provides connection to the common power bus

described in document SLAU104. Table 4−1 shows the pin out of J3.

Table 4−1.Power Supply Pin Out

Signal Pin Number Signal

Unused 1 2 Unused

+5VA 3 4 Unused

DGND 5 6 AGND

+1.8VD 7 8 +VD1

+3.3VD 9 10 +5VD

When power is supplied to J3, JMP3 allows for one of four different dc voltages

to be applied to the digital sections of the ADC. See the schematic and PWB

silkscreen for details.

Topic Page

4.1 ADC Power 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2 Stand Alone Operation 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.3 Reference Voltage 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 4

ADC Power

4-2

4.1 ADC Power

The device installed on the modular MSOP8 EVM has several options in

regards to its power source. Refer to the schematic for the following

discussion.

JMP1 and JMP3 allow the user to select the power supply used by the ADC.

When JMP1 is in the default factory position (Shunt on pins 1−2), power to the

ADC comes from J3.3 or TP5. Single gate digital buffers (U3, U5, and U6) are

installed on the ADC’s digital input/output lines to allow operation with low

voltage controllers, such as the MSP430. The supply voltage to these buffers

is determined by JMP3 or the voltage applied to TP7.

4.2 Stand Alone Operation

When used as a stand alone EVM, the analog power can be applied to TP5,

referenced to TP6. Digital power can be applied to TP7 referenced to TP4.

While filters are provided for all power supply inputs, optimal performance of

the EVM requires a clean, well-regulated power source.

Caution

The ADC’s that are compatible with this EVM have a variety of

power supply requirements. Check the appropriate data sheets

and verify all power supplies are within the safe operating limits of

the ADC before applying power to the EVM.

4.3 Reference Voltage

The modular MSOP8 can be configured to use the onboard reference/buffer

circuits (U2 and U4) or an external reference applied to J1.20. Jumpers JMP5

and JMP6 control the reference source. In the factory default position (shunt

on JMP5 pins 1−2), a 2.5 V reference is supplied by U2. Moving the shunt at

JMP5 to positions 2−3 allows an external reference applied to J1.20 to be

used.

Caution

The ADC’s that are compatible with this EVM have a variety of

reference requirements. Check the appropriate data sheets and

verify external reference sources are within the safe operating

limits of the ADC before applying power to the EVM.

JMP6 controls the actual application of the reference source to the ADC. Note

that JMP6 is not installed on EVM boards for ADS7818, ADS7834, and

ADS7835 devices. In the factory default position (shunt on pins 1−2), the

reference source is the on board reference/buffer circuit. Moving the shunt on

JMP6 to pins 2−3 allows the voltage applied to the ADC (+Vadc) to be used

as the reference source.

5-1

EVM Operation

The following section provides information in the analog input, digital control,

and general operating conditions of the Modular MSOP8 EVM.

Topic Page

5.1 Analog Input 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2 Digital Control 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3 Chip Select (Shut Down) 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4 Digital I/O Buffers 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.5 Default Jumper Locations 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 5

Analog Input

5-2

5.1 Analog Input

The analog input source can be applied directly to J1 (top or bottom side) or

through optional amplifier and signal conditioning modules. The analog input

range is dependent on the configuration of the EVM and the ADC installed at

location U1. Consult the datasheet for the device to determine the maximum

analog input range.

5.2 Digital Control

The digital control signals can be applied directly to J2 (top or bottom side).

The modular MSOP8 EVM can also be connected directly to a DSP or a micro

controller interface board, such as the 5−6K Interface Board. See the product

folder for the EVM or the installed device for a current list of compatible

interface and/or accessory boards.

5.3 Chip Select (Shut Down)

Jumper JMP2 is provided to allow the selection of the signals applied to the

chip select (/CS) or shutdown (SHDN) pin of the ADC installed on the EVM.

The factory default condition for the EVM is to place a shunt jumper between

pins 1−2 of JMP2. This allows the Frame Sync (FS) signal from DSP host

systems to be used as a chip select for the ADC. This signal originates from

J2.7. When JMP2 is moved to pins 2−3, the /CS (SHDN) signal is applied via

J2.1.

5.4 Digital I/O Buffers

Single gate buffers U3, U5 and U6 are provided to ensure the safe operation

of the modular MSOP8 EVM with low voltage host controllers. The digital I/O

voltage applied to these buffers via JMP3 should be set in accordance with the

operating voltage of the host controller.

5.5 Default Jumper Locations

Table 5−1 provides a list of jumpers found on the EVM and their factory default

conditions.

Table 5−1.List of Jumpers

Jumper Shunt Position Jumper Description

JMP1 Pins 1−2Controls ADC Supply Voltage (default is +5Va Source)

JMP2 Pins 1−2Controls ADC /CS(SHDN) Pin (default is FS from DSP Host)

JMP3 Pins 5−6Controls Digital I/O Voltage (default is +3.3Vd Source)

JMP4 CLOSED Ties ANALOG and DIGITAL grounds together

JMP5 Pins 1−2Controls External Ref. Source (default is +2.5V from U2)

JMP6 Pins 1−2Controls REFERENCE Source to ADC (default is onboard reference/buffer

circuit)

6-1

EVM BOM and Schematic

Topic Page

6.1 EVM Schematic 6-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

The following table contains a complete bill of materials for the modular

MSOP8 EVM bill of materials.

Table 6−1.Bill of Materials

Qty. Designators Description Manufacturer Mfg. Part Number

1 N/A Printed Wiring Board TI 6450845

0C2 C3 C4 C13 Not Installed

0 R11 Not Installed

1 C1 0.47 µF, 0805, ceramic, X7R, 16 V, 10% Panasonic ECJ−2FB1C474K

2C11 C12 0.1 µF, 0805, ceramic, X7R, 50 V, 10% Panasonic ECJ−2YB1H104K

3C6 C8 C10 10 µF, 1206, ceramic, X7R, 10 V, 10% Murata GRM31CR71A106KA01L

3C5 C14 C15 10 µF, A case, tantalum, 10 V AVX TAJA106M010RNJ

3L1 L2 L3 15 µH inductor, SMT, 1608 Series Inductors, Inc. CTDS1608C−153

2J1 J2 (top side) 10 Pin, dual row, SMT header (20 [pos) Samtec TSM−110−01−T−DV−P

2J1B J2B (bottom side) 10 Pin, dual row, SMT socket (20 pos) Samtec SSW−110−22−F−D−VS−K

1J3 (bottom side) 5 Pin, dual row, SMT socket (10 pos) Samtec SSW−105−22−F−D−VS−K

2R9 R10 R12 33 Ω, 0805, 5%, 0.1W Resistor Yageo America RC0805JR−0733RL

4R1 R2 R3 R4 R6 0 Ω, 0805, 0.1 W resistor Yageo America RC0805JR−070RL

5TP1 TP2 TP3 TP5 TP7 Red test point loop Keystone 5001

2TP4 TP6 Black test point loop Keystone 5000

0 U1 Varies (see Note)

1 U2 REF3025 TI REF3025AIDBZT

3U3 U5 U6 SN74LVC1G125 TI SN74LVC1G125DBVT

1 U4 OPA353N TI OPA353NA/250

3JMP1 JMP2 JMP5 3 Pin , 2 mm header Samtec TMMH−103−T−S

1 JMP3 4 Pin, dual row, TH header (8 positive) Samtec TSW−104−07−L−D

Note: The device installed at location U1 is dependent on the EVM ordered. This device is soldered to the board for best perfor-

mance. U1 may be replaced with any device listed in the EVM compatible device data sheets table found at the beginning

of this document.

Chapter 6

EVM Schematic

6-2

6.1 EVM Schematic

The schematic diagram is provided as a reference.

1 2 3 4

321

12500 TI Blvd. Dallas, Texas 75243

Title:

SHEET: OF:FILE:

SIZE: DATE: REV:

31-Jul-2003

Revision History

REV ECN Number Approved

Drawn By:

Engineer:

SDO

10uF

+5Va

JMP5

JMP6

SCLK

/CS

C11

0.1uF

C12

0.1uF

R11

+V(i/o)

JMP4

TP2

+5Va

910

11 12

13 14

15 16

17 18

19 20

910

11 12

13 14

15 16

17 18

19 20

R9 33

R10 33

910

+5Va

SCLK

/CS SDO

REF+

REF-

/CS(SHDN)

REF 1

GND

IN+

IN-

+Vcc 8

DCLOCK

SDO 6

OPA353N

R12

10uF

VIN

GND

OUT 2

REF3025

0.47uF

+5Va

0 ohm

C10

10uF VREF

AD_IN+

AD_IN-

SN74LVC1G125

TP3

TP1

TP5

TP7

TP4

TP6

0 ohm

15uF

JMP1

+V(i/o)

+V(adc)

JMP2

+LVa

+V(i/o)

+5Vd

+3.3Vd

JMP3

+1.8Vd

+VD1

AGNDDGND

C13

SN74LVC1G125

0 ohm

Tom Hendrick

Tom Hendrick B

ADSMSOP8 Evaluation Module

Schematic

11EDGE #6450847

B Initial Release TH

15uF

10uF

C14

10uF

15uF

C15

10uF

+LVa

6-3

EVALUATION BOARD/KIT IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR

EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end−product fit for general consumer use.

Persons handling the product(s) must have electronics training and observe good engineering practice standards. As

such, the goods being provided are not intended to be complete in terms of required design−, marketing−, and/or

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Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned

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TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.

TI assumes no liability for applications assistance, customer product design, software performance, or

infringement of patents or services described herein.

Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling

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No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine,

process, or combination in which such TI products or services might be or are used.

FCC WARNING

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR

EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end−product fit for general consumer use.

It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of

computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio

frequency interference. Operation of this equipment in other environments may cause interference with radio

communications, in which case the user at his own expense will be required to take whatever measures may be required

to correct this interference.

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input voltage range of 1.8VDC to 5 VDC; and the output voltage range of

1.8 VDC to 5 VDC.

Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there

are questions concerning the input range, please contact a TI field representative prior to connecting the input

power.

During normal operation, some circuit components may have case temperatures greater than 30°C The EVM is designed

to operate properly with certain components above 85°C as long as the input and output ranges are maintained. These

components include but are not limited to linear

regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified

using the EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices during

operation, please be aware that these devices may be very warm to the touch.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas75265

ampliﬁer “Lam dataccnveneui com www dlg cam dsg.li.com www com/clacks interlace com IogIcM cam gawerJiLom micrcccmmller 1‘ Cam www com/Igrl www mam/audio www \cam/aulommive www \ cam/b oadband wwwm cam/dlgwtalccnlml wwwm cam/medica‘ wwwm cam/mmtam wwwm cam/oglicalnetwolk wwwm cam/security wwwm cam/(e‘eghcny www \cam/videa www \cam/w‘re‘ess

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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.

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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless