1N4678UR-1 ~ 1N4717UR-1 Datasheet by Microsemi Corporation

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o Microsemi ’M e htlQ://va.micmsemi.ccm gart nomenclature Figure 2 “MicmNote 050 Moles Also available in E IN467E- — I N4717-1 MSG - Lawrence MSG - Ireland www.microsemi.com
T4-LDS-0240-1, Rev. 2 (120722) ©2012 Microsemi Corporation Page 1 of 5
1N4678UR-1 thru 1N4717UR-1
Available on
commercial
versions 500 mW SURFACE MOUNT ZENER DIODES
Screening in
reference to
MIL-PRF-19500
available
DESCRIPTION
The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount DO-213AA Zener
voltage regulators provides a selection from 1.8 to 43 volts. Standard tolerance is +/-5%, with
1% and 2% options available. The Zener test current is only 50 uA. The metal slugs that
sandwich the die are metallurgically bonded to the silicon for high reliability. This type of
internally bonded Zener package construction is also available with high-reliability up-
screening as described in the Features section. Microsemi also offers numerous other Zener
products to meet higher and lower power applications.
DO-213AA Package
Also available in:
DO-35 (DO-204AH)
(surface mount)
1N4678-1 – 1N4717-1
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Surface mount equivalent of JEDEC registered 1N4678 thru 1N4717 series.
• Internal metallurgical bond.
• Hermetically sealed surface mount package.
• Tighter voltage tolerances of 2% and 1% are available.
• Up-screening available in reference to MIL-PRF-19500.
(See part nomenclature for all available options.)
• RoHS compliant devices available (commercial grade only).
APPLICATIONS / BENEFITS
• Regulates voltage over a broad operating current and temperature range.
• Voltage selection from 1.8 to 43 V.
• Non-sensitive to ESD per MIL-STD-750 method 1020.
• Minimal capacitance (see Figure 2).
• Inherently radiation hard as described in Microsemi’s “MicroNote 050”.
MAXIMUM RATINGS
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Symbol
Value
Unit
Junction and Storage Temperature
TJ and TSTG
-65 to +175
oC
Thermal Resistance Junction-to-End Cap (1)
RӨJL
100
oC/W
Thermal Resistance Junction-to-Ambient (1)
RӨJA
250
oC/W
Steady-State Power Dissipation (2)
PD
0.5
W
Forward Voltage @ 100 mA
VF
1.5
V
Solder Temperature @ 10 s
TSP
260
oC
Notes: 1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
2. At TEC < 125 oC or at ambient TA < 50 ºC when mounted on FR4 PC board.
o Microsemi Package Dimensions Relia 'lity Level RoHS Compliance available WM Metallugically Bonded JEDEC type number Electrical Characterisiics Surface Mount package Zener Voltage Tolerances
T4-LDS-0240-1, Rev. 2 (120722) ©2012 Microsemi Corporation Page 2 of 5
1N4678UR-1 thru 1N4717UR-1
MECHANICAL and PACKAGING
• CASE: Hermetically sealed glass DO-213AA (SOD80 or MLL34) MELF style package.
• TERMINALS: End caps available with tin-lead plating or RoHS compliant matte-tin plating (commercial version only). Solderable
per MIL-STD-750, method 2026.
• POLARITY: Cathode indicated by band where diode is to be operated with the banded end positive with respect to the opposite
end for Zener regulation.
• MARKING: The cathode is the banded end of the device.
• TAPE & REEL option: Standard per EIA-481-1-B (add “TR” suffix to part number). Consult factory for quantities.
• WEIGHT: 0.04 grams.
• See Package Dimensions on last page.
PART NOMENCLATURE
MQ 1N4678 C UR -1 (e3)
Reliability Level
MQ (reference JAN)
MX reference JANTX
MV (reference JANTXV)
MSP (reference JANS)
Blank = Commercial
JEDEC type number
(see Electrical Characteristics
table)
e3 = RoHS Compliant (available
on commercial grade only)
Blank = non-RoHS Compliant
Metallurgically Bonded
Surface Mount package
Zener Voltage Tolerances
Blank = 5%
C = 2%
SYMBOLS & DEFINITIONS
Symbol
Definition
IZT or IZK
Regulator Current: The dc regulator current (IZ), at a specified test point (IZT), near breakdown knee (IZK).
IR
Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature.
IZM
Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating.
TSP
Temperature Solder Pad: The maximum solder temperature that can be safely applied to the terminal.
VR
Reverse Voltage: The reverse voltage dc value, no alternating component.
VZ
Zener Voltage: The Zener voltage the device will exhibit at a specified current (I
Z
) in its breakdown region.
T4-LDS-0240-1, Rev. 2 (120722) ©2012 Microsemi Corporation Page 3 of 5
1N4678UR-1 thru 1N4717UR-1
ELECTRICAL CHARACTERISTICS @ 25 oC unless otherwise noted.
JEDEC TYPE
NUMBER
(Note 1)
NOMINAL
ZENER
VOLTAGE
(Note 3)
ZENER TEST
CURRENT
MAXIMUM
VOLTAGE
REGULATION
(Note 2 & 3)
MAXIMUM REVERSE
LEAKAGE CURRENT
MAXIMUM dc
ZENER
CURRENT*
V
Z
I
ZT
∆V
Z
I
R
@ V
R
I
ZM
Volts
µA
Volts
µA
Volts
mA
1N4678UR-1
1N4679UR-1
1N4680UR-1
1N4681UR-1
1N4682UR-1
1.8
2.0
2.2
2.4
2.7
50
50
50
50
50
0.70
0.70
0.75
0.80
0.85
7.5
5.0
4.0
2.0
1.0
1.0
1.0
1.0
1.0
1.0
240
220
200
190
180
1N4683UR-1
1N4684UR-1
1N4685UR-1
1N4686UR-1
1N4687UR-1
3.0
3.3
3.6
3.9
4.3
50
50
50
50
50
0.90
0.95
0.95
0.97
0.99
0.8
7.5
7.5
5.0
4.0
1.0
1.5
2.0
2.0
2.0
170
160
150
140
130
1N4688UR-1
1N4689UR-1
1N4690UR-1
1N4691UR-1
1N4692UR-1
4.7
5.1
5.6
6.2
6.8
50
50
50
50
50
0.99
0.97
0.96
0.95
0.90
10.0
10.0
10.0
10.0
10.0
3.0
3.0
4.0
5.0
5.1
120
110
100
90
70
1N4693UR-1
1N4694UR-1
1N4695UR-1
1N4696UR-1
1N4697UR-1
7.5
8.2
8.7
9.1
10.0
50
50
50
50
50
0.75
0.50
0.10
0.08
0.10
10.0
1.0
1.0
1.0
1.0
5.7
6.2
6.6
6.9
7.6
63.6
58.0
54.8
52.4
49.6
1N4698UR-1
1N4699UR-1
1N4700UR-1
1N4701UR-1
1N4702UR-1
11.0
12.0
13.0
14.0
15.0
50
50
50
50
50
0.11
0.12
0.13
0.14
0.15
0.05
0.05
0.05
0.05
0.05
8.4
9.1
9.8
10.6
11.4
43.2
40.8
38.0
35.0
32.6
1N4703UR-1
1N4704UR-1
1N4705UR-1
1N4706UR-1
1N4707UR-1
16.0
17.0
18.0
19.0
20.0
50
50
50
50
50
0.16
0.17
0.18
0.19
0.20
0.05
0.05
0.05
0.05
0.01
12.1
12.9
13.6
14.4
15.2
30.8
29.0
26.4
25.0
23.8
1N4708UR-1
1N4709UR-1
1N4710UR-1
1N4711UR-1
1N4712UR-1
22.0
24.0
25.0
27.0
28.0
50
50
50
50
50
0.22
0.24
0.25
0.27
0.28
0.01
0.01
0.01
0.01
0.01
16.7
18.2
19.0
20.4
21.2
21.6
19.8
19.0
17.6
17.0
1N4713UR-1
1N4714UR-1
1N4715UR-1
1N4716UR-1
1N4717UR-1
30.0
33.0
36.0
39.0
43.0
50
50
50
50
50
0.30
0.33
0.36
0.39
0.43
0.01
0.01
0.01
0.01
0.01
22.8
25.0
27.3
29.6
32.6
15.8
14.4
13.2
12.2
11.0
*JEDEC registered data except that IZM has been increased (doubled) for 500 mW power dissipation capabilities.
NOTES: 1. All types as shown are +/-5% tolerance. Also available in 2% and 1% tolerance.
2. ∆VZ @ 100 µA minus VZ @ 10 µA.
3. The electrical characteristics are measured after allowing the device to stabilize for 20 seconds when mounted with 3/8”
minimum lead length from the base.
I O Microsemi 500 400 300 200 100 0 25 50 75 100 125 150 175 200 o (L POW ER DERATING CURVE 1000 700 500 300 200 100 70 50 30 A no) clue 0 1|) 20 30 4|) 5D 60 70 80 90 100 CAPACITANCE vs. ZENER VOLTAGE TYPICAL
T4-LDS-0240-1, Rev. 2 (120722) ©2012 Microsemi Corporation Page 4 of 5
1N4678UR-1 thru 1N4717UR-1
GRAPHS
TEC – END CAP TEMPERATURE (oC) or
TA on FR4 PC BOARD
FIGURE 1
POWER DERATING CURVE
ZENER VOLTAGE VZ
FIGURE 2
CAPACITANCE vs. ZENER VOLTAGE (TYPICAL)
PD RATED POWER DISSIPATION - mW
TYPICAL CAPACITANCE IN PICOFARADS (Pf)
At zero volts
At –2 volts (VR)
TEC
TA
<—a—>
T4-LDS-0240-1, Rev. 2 (120722) ©2012 Microsemi Corporation Page 5 of 5
1N4678UR-1 thru 1N4717UR-1
PACKAGE DIMENSIONS
PAD LAYOUT
DIM
INCH
MILLIMETERS
MIN
MAX
MIN
MAX
A
0.063
0.067
1.60
1.70
B
0.130
0.146
3.30
3.70
C
0.016
0.022
0.41
0.55
inch
mm
A
.200
5.08
B
.055
1.40
C
.080
2.03

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