KPS-MCC Series Datasheet by KEMET

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One world. One KEMET
Benefits
Straight Pin lead wires for "thru-hole" mounting
Formed "J" and "L" lead wires for surface mounting
• Operatingtemperaturerangeof−55°to+200°C
Military-style case codes (MCC) 3, 4 and 5
DC voltage ratings of 50 – 2,000 V
Capacitance offerings ranging from 4.7 nF – 2.0 µF
• Industrial grade
High frequency performance and bulk capacitance in a
reduced footprint
Low ESR and ESL
High thermal stability
• High ripple current capability
Applications
• Industrial
• Down-hole
Defense and aerospace
Hybrid Electric Vehicles (HEVs)
• SMPS
• Inputandoutputfilteringonpowersupplies,oftenfoundon
“capacitor banks“
Snubber circuits and DC link
• Resonator circuits
Overview
KEMET Power Solutions - Military Case Code (KPS-MCC)
High Temperature SMPS Ceramic Stacked Capacitors
combine a robust and proprietary C0G/NPO base metal
electrode (BME) dielectric system with a durable lead-
frame technology for high temperature and high power
SMPSapplications.Thesedevicesarespecifically
designed to withstand the demands of harsh industrial
environments such as down-hole oil exploration and
automotive/avionics engine compartment circuitry.
The KPS-MCC is constructed with large chip multilayer
ceramic capacitors (MLCCs), horizontally stacked and
secured to a lead-frame termination system, using a high
melting point (HMP) solder alloy. The lead-frame isolates
the MLCCs from the printed circuit board (PCB), while
establishingaparallelcircuitconfiguration.Mechanically
isolating the capacitors from the PCB improves mechanical
and thermal stress performance, while the parallel circuit
configurationallowsforbulkcapacitanceinthesameor
smaller design footprint.
KEMET’s high temperature C0G capacitors are temperature-
compensating and are well suited for resonant circuit
applications, or for those where Q and stability of
capacitance characteristics are required. They exhibit no
change in capacitance with respect to time and voltage, and
boast a negligible change in capacitance with reference to
ambient temperature. Capacitance change is limited to ±30
ppm/ºCfrom−55°Cto+200°C.Inaddition,thesecapacitors
exhibit high insulation resistance with low dissipation factor
atelevatedtemperaturesupto+200°C.Theyalsoexhibit
low ESR at high frequencies and offer greater volumetric
efficiencyovercompetitivehightemperatureBMEceramic
capacitor devices.
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks
50 – 2,000 VDC (Industrial Grade)
ammmc compmm KEIVIEI' crummy:
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Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Ordering Information
L1 GN30 C 106 K A 02
Product Family
Dielectric
Classification/
Characteristic
Lead
Configuration1
Case Size/
Case Code
(CC)
Rated
Voltage
(DC)
Capacitance
Code (pF)
Capacitance
Tolerance
Lead/
Termination
Finish
Number
of Chips
L1 G =
200°CC0G
(BME)
N = Straight pin
L = Formed "L"
J = Formed "J"
30 = CC3
40 = CC4
50 = CC5
5 = 50 V
1 = 100 V
2 = 200 V
C = 500 V
B = 630 V
D = 1,000 V
F = 1,500 V
G = 2,000 V
Two
Significant
Digits and
number of
zeros
J = ±5%
K = ±10%
A = Silver
H = Solder
Coated (60/40)
01 - 10
1 Lead configuration and dimension details are outlined in the "Dimensions" section of this document. Additional lead configurations may be available.
Contact KEMET for details.
Lead Configurations – Inches (Millimeters)
Lead Style
Symbol Lead Style L
Lead Length
N (N) Straight 0.250 minimum
(6.35)
L (L) Formed 0.055 ±0.005
(1.4 ±0.127)
J(J) Formed 0.055 ±0.005
(1.4 ±0.127)
Additional lead configurations may be available. Contact KEMET for details.
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Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Dimensions – Inches (Millimeters)
C
Straight Lead (N)
E
L
Formed J Lead (J)
C
E
Pin Thickness
0.01 (0.25)
L
Formed L Lead (L)
E
C
Case Codes 3, 4 and 5
D
H K
F
Seating Plane
L
B
A
D
H K F
Seating Plane
B
A
Straight Lead (N) Formed J and L Lead (J/L)
LEAD ALIGNMENT
Note:
Lead alignment within pin rows
shall be 0.01” maximum.
Case Code 3
D
H
K
D
HK
F
Seating Plane
L
B
A
F
Seating Plane
B
A
Straight Lead (N) Formed J and L Lead (J/L)
LEAD ALIGNMENT
Note:
Lead alignment within pin rows
shall be 0.01” maximum.
Case Codes 4 and 5
Case
Code
C
Lead Spacing2
±0.025 (0.635)
E
Length
D Width
±0.025
(0.635)
A
Height
Maximum
B
Height
Maximum
H
Lead
Pitch
K
Lead
Width
F
Seating Plane1
±0.010 (0.250)
Number
of Leads
Per Side
Mounting
Technique
3 0.450
(11.43)
For straight lead (N) and (J) lead:
E = 0.5 (12.7) maximum
For (L) lead: E = 0.54 (13.7)
±0.035
1.01
(25.64)
Refer to
Product
Ordering
Table 1
For straight
lead (N), add
0.07 inch to
dimension "A"
For (L) and
(J) lead add
0.08 inches to
dimension "A"
0.1
(2.54)
0.02
(0.5)
For straight lead
(N), seating plane is
0.055
For (L) and (J) lead,
seating plane is
0.070
10
Solderreflow
only
4 0.400
(10.16)
For straight lead (N) and (J)
lead: E = 0.44 (11.18) maximum
For (L) lead: E = 0.49 (12.45)
±0.035
0.40
(10.16) 4
5 0.250
(6.35)
For straight lead (N) and (J)
lead: E = 0.3 (7.62) maximum
For (L) lead: E = 0.34 (8.64)
±0.035
0.25
(6.35) 3
1 Seating plane is the distance between the circuit board and the bottom of the lowest capacitor in the stack.
2 Lead spacing dimension from outside of lead frame.
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Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Environmental Compliance
KPS-MCCparttypes≥500Vwithsilver(Ag)platingareRoHScompliantwithexemption7a.
Electrical Parameters/Performance Characteristics
Item Parameters/Characteristics
Operating Temperature Range –55°Cto+200°C
CapacitanceChangewithReferenceto+25°C
and 0 VDC Applied (TCC) ±30ppm/°C(upto200°C)
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0%
Dielectric Withstanding Voltage (DWV)1
250% of rated voltage for voltage rating of < 500 V
130%ofratedvolageforvoltageratingof≥500to<1,000V
120%ofratedvoltageforvoltageratingof≥1,000V
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
DissipationFactor(DF)MaximumLimitat25°C20.1%
InsulationResistance(IR)MinimumLimitat25°C31,000MΩµFor100GΩ
(Ratedvoltageappliedfor120±5secondsat25°C)
1 DWV is the voltage a capacitor can withstand for a short period of time. It exceeds the nominal and continuous working voltage of a capacitor.
2 Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF.
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF.
3 To obtain IR limit, divide MΩ - µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance, it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
ammmc compmm KEIVIEI' crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1094_KPS-MCC_200C_STACKS • 9/27/2017 55
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Table 1 - Product Ordering Codes & Ratings
1 Complete part number requires additional characters in the numbered positions provided in order to indicate lead configuration, capacitance tolerance
and lead finish. For each numbered position, available options are as follows:
(a) Lead style character "N," "L," or "J."
(b) Capacitance tolerance character "J" or "K."
(c) Lead finish character "A" for 100% Ag, "H" for solder coated.
2 Capacitance values listed are for stacked components and do not follow E12, E24 format defined by BS 2488 standard. Please contact factory to
inquire about capacitance values not listed.
3 Identical capacitance values may be listed for the same voltage rating. User can select which case size and chip count is desired for the given
capacitance value.
4 KPS-MCC Stacked Capacitors ≥ 500 V with Ag plating are RoHS compliant by exemption 7a.
KEMET Part
Number1
Capacitance
(µF)2,3 Case Code Number of Chips
Height A
Inch (mm)
Maximum
RoHS Compliance
50 V
L1G(1)505304(2)(3)01 0.3 5 1 0.11 (2.79) No
L1G(1)505604(2)(3)02 0.6 5 2 0.21 (5.3) No
L1G(1)505904(2)(3)03 0.9 5 3 0.32 (8.13) No
L1G(1)505125(2)(3)04 1.2 5 4 0.42 (10.67) No
L1G(1)505155(2)(3)05 1.5 5 5 0.53 (13.46) No
100 V
L1G(1)501304(2)(3)01 0.3 5 1 0.11 (2.79) No
L1G(1)401334(2)(3)01 0.33 4 1 0.11 (2.79) No
L1G(1)501604(2)(3)02 0.6 5 2 0.21 (5.3) No
L1G(1)401684(2)(3)02 0.68 4 2 0.21 (5.3) No
L1G(1)501904(2)(3)03 0.9 5 3 0.32 (8.13) No
L1G(1)401105(2)(3)03 1.0 4 3 0.32 (8.13) No
L1G(1)501125(2)(3)04 1.2 5 4 0.42 (10.67) No
L1G(1)401135(2)(3)04 1.3 4 4 0.42 (10.67) No
L1G(1)501155(2)(3)05 1.5 5 5 0.53 (13.46) No
L1G(1)401175(2)(3)05 1.7 4 5 0.53 (13.46) No
200 V
L1G(1)502114(2)(3)01 0.11 5 1 0.11 (2.79) No
L1G(1)502224(2)(3)02 0.22 5 2 0.21 (5.3) No
L1G(1)502334(2)(3)03 0.33 5 3 0.32 (8.13) No
L1G(1)402334(2)(3)01 0.33 4 1 0.11 (2.79) No
L1G(1)302404(2)(3)02 0.4 3 2 0.11 (2.79) No
L1G(1)502444(2)(3)04 0.44 5 4 0.42 (10.67) No
L1G(1)502554(2)(3)05 0.55 5 5 0.53 (13.46) No
L1G(1)402684(2)(3)02 0.68 4 2 0.21 (5.3) No
L1G(1)302804(2)(3)04 0.8 3 4 0.21 (5.3) No
L1G(1)402105(2)(3)03 1.0 4 3 0.32 (8.13) No
L1G(1)302125(2)(3)06 1.2 3 6 0.32 (8.13) No
L1G(1)402135(2)(3)04 1.3 4 4 0.42 (10.67) No
L1G(1)302165(2)(3)08 1.6 3 8 0.42 (10.67) No
L1G(1)402175(2)(3)05 1.7 4 5 0.53 (13.46) No
L1G(1)302205(2)(3)10 2.0 310 0.53 (13.46) No
500 V
L1G(1)50C473(2)(3)01 0.047 5 1 0.11 (2.79)
Yes (see note 4)
L1G(1)50C923(2)(3)02 0.092 5 2 0.21 (5.3)
L1G(1)40C124(2)(3)01 0.12 4 1 0.11 (2.79)
L1G(1)50C144(2)(3)03 0.15 5 3 0.32 (8.13)
L1G(1)50C194(2)(3)04 0.19 5 4 0.42 (10.67)
L1G(1)40C244(2)(3)02 0.24 4 2 0.21 (5.3)
L1G(1)50C254(2)(3)05 0.25 5 5 0.53 (13.46)
L1G(1)40C364(2)(3)03 0.36 4 3 0.32 (8.13)
L1G(1)30C404(2)(3)02 0.4 3 2 0.11 (2.79)
L1G(1)40C474(2)(3)04 0.47 4 4 0.42 (10.67)
L1G(1)40C604(2)(3)05 0.6 4 5 0.53 (13.46)
L1G(1)30C804(2)(3)04 0.8 3 4 0.21 (5.3)
L1G(1)30C125(2)(3)06 1.2 3 6 0.32 (8.13)
L1G(1)30C165(2)(3)08 1.6 3 8 0.42 (10.67)
L1G(1)30C205(2)(3)10 2.0 310 0.53 (13.46)
KEMET Part Number1Capacitance (µF)2,3 Case Code Number of Chips Height A Inch (mm)
Maximum RoHS Compliance
ammmc compmm KEIVIEI' crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1094_KPS-MCC_200C_STACKS • 9/27/2017 66
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Table 1 - Product Ordering Codes & Ratings cont'd
1 Complete part number requires additional characters in the numbered positions provided in order to indicate lead configuration, capacitance tolerance
and lead finish. For each numbered position, available options are as follows:
(a) Lead style character "N," "L," or "J."
(b) Capacitance tolerance character "J" or "K."
(c) Lead finish character "A" for 100% Ag, "H" for solder coated.
2 Capacitance values listed are for stacked components and do not follow E12, E24 format defined by BS 2488 standard. Please contact factory to
inquire about capacitance values not listed.
3 Identical capacitance values may be listed for the same voltage rating. User can select which case size and chip count is desired for the given
capacitance value.
4 KPS-MCC Stacked Capacitors ≥ 500 V with Ag plating are RoHS compliant by exemption 7a.
KEMET Part
Number1
Capacitance
(µF)2,3 Case Code Number of Chips
Height A
Inch (mm)
Maximum
RoHS Compliance
630 V
L1G(1)50B283(2)(3)01 0.028 5 1 0.11 (2.79)
Yes (see note 4)
L1G(1)50B563(2)(3)02 0.056 5 2 0.21 (5.3)
L1G(1)40B823(2)(3)01 0.082 4 1 0.11 (2.79)
L1G(1)50B843(2)(3)03 0.084 5 3 0.32 (8.13)
L1G(1)50B114(2)(3)04 0.11 5 4 0.42 (10.67)
L1G(1)50B154(2)(3)05 0.15 5 5 0.53 (13.46)
L1G(1)40B174(2)(3)02 0.17 4 2 0.21 (5.3)
L1G(1)40B254(2)(3)03 0.25 4 3 0.32 (8.13)
L1G(1)30B254(2)(3)02 0.25 3 2 0.11 (2.79)
L1G(1)40B334(2)(3)04 0.33 4 4 0.42 (10.67)
L1G(1)40B424(2)(3)05 0.42 4 5 0.53 (13.46)
L1G(1)30B504(2)(3)04 0.5 3 4 0.21 (5.3)
L1G(1)30B754(2)(3)06 0.75 3 6 0.32 (8.13)
L1G(1)30B105(2)(3)08 1.0 3 8 0.42 (10.67)
L1G(1)30B125(2)(3)10 1.2 310 0.53 (13.46)
1,000 V
L1G(1)50D183(2)(3)01 0.018 5 1 0.11 (2.79)
Yes (see note 4)
L1G(1)50D363(2)(3)02 0.036 5 2 0.21 (5.3)
L1G(1)50D543(2)(3)03 0.054 5 3 0.32 (8.13)
L1G(1)40D563(2)(3)01 0.056 4 1 0.11 (2.79)
L1G(1)50D723(2)(3)04 0.072 5 4 0.42 (10.67)
L1G(1)50D923(2)(3)05 0.092 5 5 0.53 (13.46)
L1G(1)40D124(2)(3)02 0.12 4 2 0.21 (5.3)
L1G(1)30D164(2)(3)02 0.16 3 2 0.11 (2.79)
L1G(1)40D174(2)(3)03 0.17 4 3 0.32 (8.13)
L1G(1)40D224(2)(3)04 0.22 4 4 0.42 (10.67)
L1G(1)40D274(2)(3)05 0.27 4 5 0.53 (13.46)
L1G(1)30D334(2)(3)04 0.33 3 4 0.21 (5.3)
L1G(1)30D474(2)(3)06 0.47 3 6 0.32 (8.13)
L1G(1)30D634(2)(3)08 0.63 3 8 0.42 (10.67)
L1G(1)30D824(2)(3)10 0.82 310 0.53 (13.46)
1,500 V
L1G(1)50F682(2)(3)01 0.0068 5 1 0.11 (2.79)
Yes (see note 4)
L1G(1)50F133(2)(3)02 0.013 5 2 0.21 (5.3)
L1G(1)50F203(2)(3)03 0.02 5 3 0.32 (8.13)
L1G(1)40F223(2)(3)01 0.022 4 1 0.11 (2.79)
L1G(1)50F273(2)(3)04 0.027 5 4 0.42 (10.67)
L1G(1)50F333(2)(3)05 0.033 5 5 0.53 (13.46)
L1G(1)40F443(2)(3)02 0.044 4 2 0.21 (5.3)
L1G(1)40F663(2)(3)03 0.066 4 3 0.32 (8.13)
L1G(1)30F663(2)(3)02 0.066 3 2 0.11 (2.79)
L1G(1)40F883(2)(3)04 0.088 4 4 0.42 (10.67)
L1G(1)40F114(2)(3)05 0.11 4 5 0.53 (13.46)
L1G(1)30F134(2)(3)04 0.13 3 4 0.21 (5.3)
L1G(1)30F204(2)(3)06 0.2 3 6 0.32 (8.13)
L1G(1)30F274(2)(3)08 0.27 3 8 0.42 (10.67)
L1G(1)30F334(2)(3)10 0.33 310 0.53 (13.46)
KEMET Part Number1Capacitance (µF)2,3 Case Code Number of Chips Height A Inch (mm)
Maximum RoHS Compliance
ammmc compmm KEIVIEI' crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1094_KPS-MCC_200C_STACKS • 9/27/2017 77
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Table 1 - Product Ordering Codes & Ratings cont'd
1 Complete part number requires additional characters in the numbered positions provided in order to indicate lead configuration, capacitance tolerance
and lead finish. For each numbered position, available options are as follows:
(a) Lead style character "N," "L," or "J."
(b) Capacitance tolerance character "J" or "K."
(c) Lead finish character "A" for 100% Ag, "H" for solder coated.
2 Capacitance values listed are for stacked components and do not follow E12, E24 format defined by BS 2488 standard. Please contact factory to
inquire about capacitance values not listed.
3 Identical capacitance values may be listed for the same voltage rating. User can select which case size and chip count is desired for the given
capacitance value.
4 KPS-MCC Stacked Capacitors ≥ 500 V with Ag plating are RoHS compliant by exemption 7a.
KEMET Part
Number1
Capacitance
(µF)2,3 Case Code Number of Chips
Height A
Inch (mm)
Maximum
RoHS Compliance
2,000 V
L1G(1)50G472(2)(3)01 0.0047 5 1 0.11 (2.79)
Yes (see note 4)
L1G(1)50G922(2)(3)02 0.0092 5 2 0.21 (5.3)
L1G(1)50G153(2)(3)03 0.015 5 3 0.32 (8.13)
L1G(1)40G153(2)(3)01 0.015 4 1 0.11 (2.79)
L1G(1)50G193(2)(3)04 0.019 5 4 0.42 (10.67)
L1G(1)50G253(2)(3)05 0.025 5 5 0.53 (13.46)
L1G(1)40G293(2)(3)02 0.029 4 2 0.21 (5.3)
L1G(1)30G403(2)(3)02 0.04 3 2 0.11 (2.79)
L1G(1)40G423(2)(3)03 0.042 4 3 0.32 (8.13)
L1G(1)40G563(2)(3)04 0.056 4 4 0.42 (10.67)
L1G(1)40G723(2)(3)05 0.072 4 5 0.53 (13.46)
L1G(1)30G803(2)(3)04 0.08 3 4 0.21 (5.3)
L1G(1)30G124(2)(3)06 0.12 3 6 0.32 (8.13)
L1G(1)30G164(2)(3)08 0.16 3 8 0.42 (10.67)
L1G(1)30G204(2)(3)10 0.2 310 0.53 (13.46)
KEMET Part Number1Capacitance (µF)2,3 Case Code Number of Chips
Height A Inch (mm)
Maximum RoHS Compliance
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Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Soldering Process
Thecapacitorsandassembliesoutlinedinthisspecificationsheetaresusceptibletothermalshockdamageduetotheir
largeceramicmass.Temperatureprofilesusedshouldprovideadequatetemperatureriseandcool-downtimetoprevent
damage from thermal shock. In general, KEMET recommends against hand-soldering for these types of large ceramic
devices, but if hand-soldering cannot be avoided, refer to hand-soldering section below.
Recommended Soldering Technique:
  •Solderreflow
Recommended Reflow Soldering Profile:
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp Up Rate = 2°C/second
Maximum Ramp Down Rate = 2°C/second
tP
tL
ts
25°C to Peak
Profile Feature Sn-Pb Pb-Free
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (TSmax)
150°C
200°C
Time (ts) from Tsmin to Tsmax)
60 – 90 seconds
60 – 120 seconds
Ramp-up rate (TL to TP)
2°C/second
3°C/second
Liquidous temperature (TL)
183°C
217°C
Time above liquidous (tL)
95 seconds
95 seconds
Peak temperature (TP)
240°C
260°C
Timewithin5°Cofmaximumpeak
temperature (tP)5 seconds 5 seconds
Ramp-down rate (TP to TL)
2°C/second
2°C/second
Time25°Ctopeaktemperature
3.5 minutes
3.5 minutes
Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow.
Preheating and Reflow Profile Notes:
Due to the differences in the coefficient of the thermal expansion for the different materials of construction, it is critical to monitor and control the heating
and cooling rates during the soldering process. To ensure optimal component reliability, KEMET's recommended heating and cooling rate is 2°C/second.
After soldering, the capacitors should be air cooled to room temperature before further processing. Forced air cooling is not recommended.
ammm Compancnls KEIVIEI' cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1094_KPS-MCC_200C_STACKS • 9/27/2017 99
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Soldering Process cont'd
Recommendations for Hand-Soldering:
Care should be taken when hand-soldering large ceramic stacks. Excessive thermal shock on the ceramic material can lead
tocrackingandreliabilityissues.Toreduceriskofthermalshock,KEMETrecommendssolderreflow,butifhandsoldering
cannot be avoided, please see recommended guidelines below.
Pre-Heating
Stacksshouldbepreheatedtoatemperaturewithin50°Cofreflowtemperature.KEMETrecommendsaramprateof2°C/
second to avoid thermal shock during the pre-heating process.
Hand-Soldering
When using a solder iron, keep tip of the iron as far away from ceramic body to avoid excessive heating.
Cool Down
Afterreflow,stacksshouldbeallowedtocoolatapreferablerateof2°C/seconduntilroomtemperatureisreached.
Storage & Handling
Ceramic capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels and may soften or warp,
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturedoesnotexceed40°Cand
maximumstoragehumiditydoesnotexceed70%relativehumidity.Temperaturefluctuationsshouldbeminimizedto
avoid condensation on the parts. Atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within 1.5 years of receipt.
ammmc compmm KEIl/IEI' EHARGED!
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1094_KPS-MCC_200C_STACKS • 9/27/2017 1010
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Table 2 - Performance & Reliability: Test Methods & Conditions
Inspection
Test Method
Reliability/Environmental Tests
High Temperature Life MIL–STD–202, Method 108 200°C,ratedvoltage,1,000hours
Temperature Cycling JESD22, Method JA–104 –40°Cto+240°C,400cycles
Thermal Shock MILSTD–202, Method 107 –40°Cto+240°C,20secondstransfer,
15 minutes dwell, 5 cycles
Moisture Resistance MIL–STD–202, Method 106 20 cycles, no voltage applied
Physical, Mechanical and Process Tests
Vibration MIL–STD–202, Method 204
Condition D per MIL–PRF–49470, simple
harmonic, 20 g peak, 10 – 2000 Hz,
20 minute sweep, 12 sweeps per axis
Resistance to Soldering Heat MIL–STD–202, Method 210 ConditionB,260°C,10seconds
Terminal Strength MIL–STD–202, Method 202 Condition A
Immersion MIL–STD–202, Method 104 Condition B
Solderability J–STD–002C
Category 3
For Sn-Pb solder alloy:
MethodA,245°C,5seconds
MethodS,220°Cpeak
For Pb-Free solder alloy:
MethodA1,260°C,5seconds
MethodS1,245°Cpeak
Ei-cunmc Companm; KEIVIEI' CHARGED! Detailed Cross Section Waffle Packaging Quantities
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1094_KPS-MCC_200C_STACKS • 9/27/2017 1111
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
Construction
Dielectric material
(CaZrO3)
Detailed Cross Section
Barrier layer
(Ni)
Inner electrodes
(Ni)
Termination finish
(Sn10/Pb88/Ag2)
Barrier layer
(Ni)
Termination finish
(Sn10/Pb88/Ag2)
Inner electrodes
(Ni)
Dielectric material
(CaZrO3)
Lead-frame
attach solder
(Sn10/Pb88/Ag2)
Lead-frame
(Phosphor Bronze -Alloy 510)
Lead-frame finish
(Ag or Sn60/Pb40)
End termination/
External electrode
(Cu)
End termination/
External electrode
(Cu)
Packaging
Waffle Packaging Quantities
Case Code Lead Style Number of Chips in
Stack
WafflePack
Quantity1
3
L/N
2, 4, 6, 8, 10
16
J
25
4
L/J/N
1, 2, 3
50
4
25
5
16
5
1, 2, 3
50
4, 5
25
1 Minimum order value applies. Contact KEMET for details.
ammm Compancnls KEIVIEI' cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1094_KPS-MCC_200C_STACKS • 9/27/2017 1212
Surface Mount and Through-Hole Multilayer Ceramic Capacitors
KPS-MCC High Temperature 200°C SMPS Stacks, 50 – 2,000 VDC (Industrial Grade)
KEMET Electronics Corporation Sales Offi ces
Foracompletelistofourglobalsalesoffices,pleasevisitwww.kemet.com/sales.
Disclaimer
Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsiblefor
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET)knowledgeoftypicaloperatingconditionsforsuch
applications,butarenotintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryor
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.

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