Tflex™ 200 V0 Series Datasheet by SparkFun Electronics

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TflexTM 200 V0 Series

Thermal Gap Filler

SOFT, FREESTANDING GAP FILLER

Tflex™ 200 V0 is a very soft, freestanding gap filler that is more compliant than most other

gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this

gap filler produces low thermal resistance. The alumina filler allows the product to remain a

cost effective solution where moderate thermal performance is acceptable.

Naturally tacky and not requiring additional adhesive coating, the Tflex™ 200 V0 can inhibit

thermal performance. This gap filler is both electrically insulating and stable from -40°C to

160°C and meets UL 94 VO rating.

FEATURES AND BENEFITS

• Soft and compressible for low stress applications

• Naturally tacky needing no further adhesive coating

• 1.1 W/mK thermal conductivity

• Available in thicknesses from 0.010” (0.25mm) to 0.200” (5.0mm)

APPLICATIONS

• Cooling components to the chassis or frame

• High speed mass storage drives

• RDRAM memory modules

• Heat pipe thermal solutions

• Automotive engine control units

• Wireless communication hardware

Americas: +1.800.843.4556

Europe: +49.8031.2460.0

Asia: +86.755.2714.1166

CLV-customerservice@lairdtech.com

www.lairdtech.com/thermal

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Innovative Technology

for a Connected World

TflexTM 200 V0 Series

Thermal Gap Filler

THR-DS-Tflex-200V0 0710

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A14175-00 Rev. G, 08/13/08

Tflex™ 220 V0 Tflex™ 240 V0 Tflex™ 260 V0 Tflex™ 280 V0 Tflex™ 2100 V0 TEST METHOD

Construction &

Composition

Reinforced ceramic filled

silicone elastomer

Ceramic filled

silicone elastomer

Ceramic filled

silicone elastomer

Ceramic filled

silicone elastomer

Ceramic filled

silicone elastomer

Color Light Gray Light Gray Light Gray Light Gray Light Gray Visual

Thickness 0.02" (0.508mm) 0.04" (1.016mm) 0.06" (1.524mm) 0.08" (2.032mm) 0.10"(2.54mm)

Thickness Tolerance ± 0.002"

(± 0.05mm)

± 0.004"

(± 0.10mm)

± 0.006"

(± 0.15mm)

± 0.008"

(± 0.20mm)

± 0.010"

(± 0.25mm)

Density 1.75 g/cm31.73 g/cm31.73 g/cm31.73 g/cm31.73 g/cm3Helium Pycnometer

Hardness 50 Shore 00 45 Shore 00 45 Shore 00 45 Shore 00 45 Shore 00 ASTM D2240

Tensile Strength 464 psi 48 psi 48 psi 48 psi 48 psi ASTM D412

% Elongation 10.5 63.0 60.6 60.6 60.6 ASTM D412

Outgassing TML

(Post Cured) 0.34% 0.34% 0.34% 0.34% 0.34% ASTM E595

Outgassing CVCM

(Post Cured) 0.10% 0.10% 0.10% 0.10% 0.10% ASTM E595

UL Flammability Rating 94 VO 94 VO 94 VO 94 VO 94 VO E180840

Temperature Range -45°C to 160°C -45°C to 160°C -45°C to 160°C -45°C to 160°C -45°C to 160°C

Thermal Conductivity 1.1 W/mK 1.1 W/mK 1.1 W/mK 1.1 W/mK 1.1 W/mK ASTM D5470

(modified)

Total Thermal

Resistance

@ 10 psi

@ 69KPa

0.80 °C-in2/W

5.13 °C-cm2/W

1.57 °C-in2/W

10.13 °C-cm2/W

2.05 °C-in2/W

13.23 °C-cm2/W

2.51 °C-in2/W

16.19 °C-cm2/W

2.93 °C-in2/W

18.90 °C-cm2/W

ASTM D5470

(modified)

Coefficient of

Thermal Expansion

229 ppm/°C

35°C to 130°C

229 ppm/°C

35°C to 130°C

229 ppm/°C

35°C to 130°C

229 ppm/°C

35°C to 130°C

229 ppm/°C

35°C to 130°C

IPC-TM-650

2.4.24

Breakdown Voltage 12,000 Volts AC >27,000 Volts >27,000 Volts >27,000 Volts >27,000 Volts ASTM D149

Volume Resistivity 4 x 1013 ohm-cm 4 x 1013 ohm-cm 4 x 1013 ohm-cm 4 x 1013 ohm-cm 4 x 1013 ohm-cm ASTM D257

Dielectric Constant

@ 1MHz 5.5 5.5 5.5 5.5 5.5

STANDARD THICKNESSES

0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm)

0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm)

0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm)

0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory for alternate thicknesses

STANDARD SHEET SIZES

9" x 9" (229mm x 229mm) Tflex™ 200V0 may be die cut into individual

shapes. Pressure sensitive adhesive is not applicable for Tflex™ products.

REINFORCEMENT

0.020" (0.51mm) and 0.030" (0.762mm) are fiberglass reinforced.

Data for design engineer guidance only. Observed performance varies in

application. Engineers are reminded to test the material in application.

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