34AA02, 34LC02 Datasheet by Microchip Technology

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6‘ MICROCHIP HUI—H1 LILILILI
2011 Microchip Technology Inc. DS22029F-page 1
34AA02/34LC02
Features:
Permanent and Resettable Software Write-Protect
for Lower Half of the Array (00h-7Fh)
Single Supply with Operation Down to 1.7V
Low-Power CMOS Technology:
- Read current 1 mA, typical
- Standby current, 100 nA, typical
2-Wire Serial Interface Bus, I2C™ Compatible
Cascadable up to Eight Devices
Schmitt Trigger Inputs for Noise Suppression
Output Slope Control to Eliminate Ground Bounce
100 kHz and 400 kHz Compatibility
1 MHz Clock for LC Versions
Page Write Time 3 ms, typical
Self-Timed Erase/Write Cycle
16-Byte Page Write Buffer
ESD Protection > 4,000V
Software Write Protection for Lower 128 Bytes
Hardware Write Protection for Entire Array
More than 1 Million Erase/Write Cycles
Data Retention > 200 Years
8-Lead PDIP, SOIC, TSSOP, MSOP and TDFN
Packages
6-Lead SOT-23 Package
Pb-free and RoHS Compliant
Available for Extended Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Device Selection Table
Package Types
Description:
The Microchip Technology Inc. 34AA02/34LC02
(34XX02*) is a 2 Kbit Electrically Erasable PROM
capable of operation across a broad voltage range
(1.7V to 5.5V). This device has two software write-
protect features for the lower half of the array, as well
as an external pin that can be used to write-protect the
entire array. This allows the system designer to protect
none, half, or all of the array, depending on the
application. The device is organized as one block of
256 x 8-bit memory with a 2-wire serial interface. Low-
voltage design permits operation down to 1.7V, with
standby and active currents of only 100 nA and 1 mA,
respectively. The 34XX02 also has a page write
capability for up to 16 bytes of data. The 34XX02 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, MSOP and TDFN packages. The
34XX02 is also available in the 6-lead, SOT-23
package.
Part
Number VCC
Range Max. Clock
Frequency Temp
Ranges
34AA02 1.7-5.5 400 kHz(1) I,E
34LC02 2.2-5.5 1 MHz I,E
Note 1: 100 kHz for VCC <1.8V.
A0
A1
A2
VSS
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
PDIP/SOIC/TSSOP/MSOP/TDFN
A0
A1
A2
V
SS
WP
SCL
SDA
V
CC
8
7
6
5
1
2
3
4
SOT-23
6
2
4
SDA
VCC
VSS A0
A1
5
3
1
SCL
2K I2C Serial EEPROM Software Write-Protect
*34XX02 is used in this document as a generic part number
for the 34AA02/34LC02 devices.
34AA02/34LC02
DS22029F-page 2 2011 Microchip Technology Inc.
Block Diagram
I/O
Control
Logic
Memory
Control
Logic XDEC
HV Generator
Standard
Array
Software write-
Write-Protect
Circuitry
YDEC
VCC
VSS
Sense Amp.
R/W Control
SDA SCL
A0 A1 A2 WP
protected area
(00h-7Fh)
2011 Microchip Technology Inc. DS22029F-page 3
34AA02/34LC02
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ..........................................................................................................-0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins  4kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other conditions above
those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
TABLE 1-1: DC SPECIFICATIONS
DC CHARACTERISTICS VCC = +1.7V to +5.5V
Industrial (I): TA = -40°C to +85°C
Automotive (E):TA = -40°C to +125°C
Param.
No. Symbol Characteristic Min. Typ. Max. Units Conditions
A0, A1, A2, SCL, SDA
and WP pins ——
D1 VIH High-level input voltage 0.7 VCC ——V
D2 VIL Low-level input voltage 0.3 VCC V0.2 VCC for VCC < 2.5V
D3 VHYS Hysteresis of Schmitt
Trigger inputs 0.05 VCC ——V(Note)
D4 VOL Low-level output voltage 0.40 V IOL = 3.0 mA, VCC = 2.5V
D5 VHV High-Voltage Detect 7 10 V A0 Pin only, VCC < 2.2V
VCC + 4.8 10 V A0 Pin only, VCC 2.2V
10 — VCC + 4.8 V A0 Pin only, VCC 5.2V
D6 ILI Input leakage current ±1 AVIN = VSS or VCC
D7 ILO Output leakage current ±1 AVOUT = VSS or VCC
D8 CIN,
COUT
Pin capacitance
(all inputs/outputs) ——10pFVCC = 5.5V (Note)
TA = 25°C, FCLK = 1 MHz
D9 ICC write Operating current 0.1 3 mA VCC = 5.5V, SCL = 1 MHz
D10 ICC read 0.05 1 mA
D11 ICCS Standby current
0.01
1
5
A
AIndustrial
Automotive
SDA = SCL = VCC
A0, A1, A2, WP = VSS
Note: This parameter is periodically sampled and not 100% tested.
34AA02/34LC02
DS22029F-page 4 2011 Microchip Technology Inc.
TABLE 1-2: AC SPECIFICATIONS
AC CHARACTERISTICS
VCC = +1.7V to +5.5V
Industrial (I): TA = -40°C to +85°C
Automotive (E):TA = -40°C to +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
1F
CLK Clock frequency
100
400
1000
kHz 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
2T
HIGH Clock high time 4000
600
500
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
3T
LOW Clock low time 4700
1300
500
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
4T
RSDA and SCL rise time (Note 1)
1000
300
300
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
5T
FSDA and SCL fall time (Note 1)
1000
300
300
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
6T
HD:STA Start condition hold time 4000
600
250
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
7T
SU:STA Start condition setup time 4700
600
250
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
8T
HD:DAT Data input hold time 0 ns (Note 2)
9T
SU:DAT Data input setup time 250
100
100
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
10 TSU:STO Stop condition setup time 4000
600
250
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
11 TSU:WP WP setup time 4000
600
600
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
12 THD:WP WP hold time 4700
600
600
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
13 TAA Output valid from clock (Note 2)
3500
900
400
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
14 TBUF Bus free time: Time the bus must be
free before a new transmission can
start
1300
4700
ns 1.7V VCC < 1.8V
1.8V VCC 5.5V
2.5V VCC 5.5V (34LC02)
16 TSP Input filter spike suppression
(SDA and SCL pins)
50 ns All except 34LC02
(Note 1 and Note 3)
17 TWC Write cycle time (byte or page) 5 ms
18 Endurance 1M cycles 25°C, VCC = 5.5V, Block mode
(Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the
falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppres-
sion. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult
the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.
2011 Microchip Technology Inc. DS22029F-page 5
34AA02/34LC02
FIGURE 1-1: BUS TIMING DATA
(unprotected)
(protected)
SCL
SDA
In
SDA
Out
WP
5
7
6
16
3
2
89
13
D4 4
10
11 12
14
34AA02/34LC02
DS22029F-page 6 2011 Microchip Technology Inc.
2.0 FUNCTIONAL DESCRIPTION
The 34XX02 has two Software Write-Protect features
that allow you to protect half of the array from being
written (Addresses 00h-7Fh). One command, Software
Write-Protect (SWP) will prevent writes to half of the
array and is resettable by using the Clear Software
Write-Protect (CSWP) command. The other command
is Permanent Software Write-Protect (PSWP), which is
not resettable and will permanently lock half the array
from being written to. The device still has an external
pin (WP) that allows you to protect the entire array if so
desired.
The 34XX02 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, and a device
receiving data, as a receiver. The bus has to be
controlled by a master device, which generates the
Serial Clock (SCL), controls the bus access and gener-
ates the Start and Stop conditions, while the 34XX02
works as slave. Both master and slave can operate as
transmitter or receiver, but the master device
determines which mode is activated.
3.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
Data transfer may be initiated only when the bus
is not busy.
During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 3-1).
3.1 Bus Not Busy (A)
Both data and clock lines remain high.
3.2 Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
3.3 Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
3.4 Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between the Start and Stop
conditions is determined by the master device and is,
theoretically, unlimited; although only the last sixteen
will be stored when doing a write operation. When an
overwrite does occur, it will replace data in a first-in,
first-out (FIFO) fashion.
3.5 Acknowledge
Each receiving device, when addressed, is obliged to
generate an Acknowledge after the reception of each
byte. Exceptions to this rule relating to software write
protection are described in Section 7.0 “Write Protec-
tion”. The master device must generate an extra clock
pulse, which is associated with this Acknowledge bit.
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end-of-
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (34XX02) will leave the data line
high to enable the master to generate the Stop
condition.
Note: The 34XX02 does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
2011 Microchip Technology Inc. DS22029F-page 7
34AA02/34LC02
FIGURE 3-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
3.6 Device Addressing
A control byte is the first byte received following the
Start condition from the master device. The first part of
the control byte consists of a 4-bit control code which is
set to ‘1010’ for normal read and write operations and
0110’ for writing to the write-protect register. The
control byte is followed by three Chip Select bits (A2,
A1, A0). The Chip Select bits allow the use of up to
eight 34XX02 devices on the same bus and are used to
determine which device is accessed. The Chip Select
bits in the control byte must correspond to the logic lev-
els on the corresponding A2, A1 and A0 pins for the
device to respond.
For the SOT-23 package, the A2 pin is not connected.
During device addressing, the A2 Chip Select bit
(Figure 3-2) should be set to ‘0’. Only four 34XX02
SOT-23 packages can be connected to the same bus.
The eighth bit of slave address determines if the master
device wants to read or write to the 34XX02
(Figure 3-2). When set to a one, a read operation is
selected. When set to a zero, a write operation is
selected.
FIGURE 3-2: CONTROL BYTE
ALLOCATION
4.0 WRITE OPERATIONS
4.1 Byte Write
Following the Start signal from the master, the device
code(4 bits), the Chip Select bits (3 bits) and the R/W
bit, which is a logic low, are placed onto the bus by the
master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will follow,
once it has generated an Acknowledge bit during the
ninth clock cycle. Therefore, the next byte transmitted
by the master is the word address and will be written
into the Address Pointer of the 34XX02.
After receiving another Acknowledge signal from the
34XX02, the master device will transmit the data word
to be written into the addressed memory location. The
34XX02 acknowledges again and the master generates
a Stop condition. This initiates the internal write cycle,
which means that during this time, the 34XX02 will not
generate Acknowledge signals (Figure 4-1). If an
attempt is made to write to the array when the software
or hardware write protection has been enabled, the
device will acknowledge the command, but no data will
be written. The write cycle time must be observed even
if the write protection is enabled.
SCL
SDA
(A) (B) (D) (D) (A)(C)
Start
Condition Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
Operation Control
Code Chip
Select R/W
Read 1010 A2 A1 A0 1
Write 1010 A2 A1 A0 0
Write-Protect Register 0110 A2 A1 A0 0
OR
Start Read/Write
Slave Address R/W A
1010A2 A1 A0
0110A2 A1 A0
w “‘11 Willi}
34AA02/34LC02
DS22029F-page 8 2011 Microchip Technology Inc.
4.2 Page Write
The write control byte, word address and the first data
byte are transmitted to the 34XX02 in the same way as
in a byte write. Instead of generating a Stop condition,
the master transmits up to 15 additional data bytes to
the 34XX02, which are temporarily stored in the on-
chip page buffer and will be written into the memory
after the master has transmitted a Stop condition. Upon
receipt of each word, the four lower order Address
Pointer bits are internally incremented by one. The
higher order four bits of the word address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 4-2). If an attempt
is made to write to the array when the hardware write
protection has been enabled, the device will acknowl-
edge the command, but no data will be written. The
write cycle time must be observed even if the write
protection is enabled.
FIGURE 4-1: BYTE WRITE
FIGURE 4-2: PAGE WRITE
Note: Page write operations are limited to
writing bytes within a single physical page,
regardless of the number of bytes actually
being written. Physical page boundaries
start at addresses that are integer multi-
ples of the page buffer size (or ‘page size’)
and end at addresses that are integer mul-
tiples of [page size – 1]. If a Page Write
command attempts to write across a phys-
ical page boundary, the result is that the
data wraps around to the beginning of the
current page (overwriting data previously
stored there), instead of being written to
the next page, as might be expected. It is
therefore necessary for the application
software to prevent page write operations
that would attempt to cross a page
boundary.
S P
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
S
T
O
P
Control
Byte Word
Address Data
A
C
K
A
C
K
A
C
K
S P
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
Control
Byte Word
Address (n) Data (n) Data (n + 15)
S
T
O
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Data (n + 1)
2011 Microchip Technology Inc. DS22029F-page 9
34AA02/34LC02
5.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If the cycle is complete, then the device will return the
ACK and the master can then proceed with the next
Read or Write command. See Figure 5-1 for flow
diagram.
FIGURE 5-1: ACKNOWLEDGE
POLLING FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
No
Yes
34AA02/34LC02
DS22029F-page 10 2011 Microchip Technology Inc.
6.0 READ OPERATION
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to1’. There are three basic types
of read operations: current address read, random read
and sequential read.
6.1 Current Address Read
The 34XX02 contains an address counter that
maintains the address of the last word accessed, inter-
nally incremented by ‘1’. Therefore, if the previous
access (either a read or write operation) was to
address n, the next current address read operation
would access data from address n+1. Upon receipt of
the slave address with R/W bit set to ‘1, the 34XX02
issues an acknowledge and transmits the 8-bit data
word. The master will not acknowledge the transfer, but
does generate a Stop condition and the 34XX02
discontinues transmission (Figure 6-1).
6.2 Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is done by sending the word address to the
34XX02 as part of a write operation. Once the word
address is sent, the master generates a Start condition
following the acknowledge. This terminates the write
operation, but not before the internal Address Pointer is
set. The master then issues the control byte again, but
with the R/W bit set to a ‘1’. The 34XX02 then issues
an acknowledge and transmits the 8-bit data word. The
master will not acknowledge the transfer, but does
generate a Stop condition and the 34XX02
discontinues transmission (Figure 6-2).
6.3 Sequential Read
Sequential reads are initiated in the same way as a
random read, with the exception that after the 34XX02
transmits the first data byte, the master issues acknowl-
edge, as opposed to a Stop condition in a random read.
This directs the 34XX02 to transmit the next sequen-
tially addressed 8-bit word (Figure 6-3).
To provide sequential reads, the 34XX02 contains an
internal Address Pointer, which is incremented by one
at the completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
6.4 Contiguous Addressing Across
Multiple Devices
The Chip Select bits (A2, A1, A0) can be used to
expand the contiguous address space for up to 16K bits
by adding up to eight 34XX02 devices on the same
bus. In this case, software can use A0 of the control
byte as address bit A8; A1 as address bit A9, and A2
as address bit A10. It is not possible to sequentially
read across device boundaries.
6.5 Noise Protection and Brown-Out
The 34XX02 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.35V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
FIGURE 6-1: CURRENT ADDRESS READ
SP
Bus Activity
Master
SDA Line
Bus Activity
S
T
O
P
Control
Byte Data (n)
A
C
K
N
O
A
C
K
S
T
A
R
T
‘Wklllllll
2011 Microchip Technology Inc. DS22029F-page 11
34AA02/34LC02
FIGURE 6-2: RANDOM READ
FIGURE 6-3: SEQUENTIAL READ
S P
S
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
S
T
O
P
Control
Byte
A
C
K
Word
Address (n) Control
Byte
S
T
A
R
TData (n)
A
C
K
A
C
K
N
O
A
C
K
P
Bus Activity
Master
SDA Line
Bus Activity
S
T
O
P
Control
Byte
A
C
K
N
O
A
C
K
Data (n) Data (n + 1) Data (n + 2) Data (n + X)
A
C
K
A
C
K
A
C
K
34AA02/34LC02
DS22029F-page 12 2011 Microchip Technology Inc.
7.0 WRITE PROTECTION
The 34XX02 has two software write-protect features
(SWP and PSWP) that allows the lower half of the array
(addresses 00h-7Fh) to be write-protected, as well as
a WP pin that can be used to protect the entire array.
The permanent software write-protect feature is
enabled by sending the device a special command.
Once this feature has been enabled, it cannot be
reversed. The resettable software write-protect feature
is also enabled by sending the device a special
command but can be reset by issuing another special
command. In addition to the software protect features,
there is a WP pin that can be used to write-protect the
entire array, regardless of whether the software write-
protect register has been written or not.
Table 7-2 and Table 7-3 describe how the 34XX02 will
acknowledge specific commands under various
circumstances.
7.1 Hardware Write Protection
The WP pin allows the user to write-protect the entire
array (00-FF) when the pin is tied to VCC. If the pin is
tied to VSS the write protection is disabled.
7.2 Software Write Protection (SWP)
and Clear Software Write
Protection (CSWP)
In addition to hardware write-protect the 34XX02 has
an additional software write-protect feature that, when
set, protects the first 128 bytes (00-7Fh) of the array
from being written.
Setting the software write protection is done by sending
the SWP instruction. SWP can also then be cleared by
issuing a CSWP instruction (see Figure 7-1).
These two instructions follow the same format as the
BYTE WRITE instruction with the exception of the
Device Type Identifier, (typically ‘1010’, instead
changes to ‘0110’). Once this identifier is recognized
by the device, the rest of the Byte Write command,
address and data, are “don’t cares”. In addition to the
identifier, high voltage must be applied to the A0 pin of
the device and specific levels must be present on A1
and A2. See Table 7-1 for the available commands.
7.3 Permanent Software Write-Protect
(PSWP)
The Permanent software write protection, or PSWP is
another instruction that may be used to permanently
protect the first 128 byte of the array. Once this
command is issued, the user will no longer have the
ability to clear this feature regardless of instruction,
power cycling, or state of the WP pin. Also, once this
instruction has been executed, the device will no
longer acknowledge the device identifier ‘0110’.
FIGURE 7-1: SOFTWARE WRITE PROTECTION FOR SWP, CSWP, PSWP, OR CPSWP
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
Control
Byte Address
Byte Data
S
T
O
P
A
C
K
A
C
K
A
C
K
S0110 0
A
2A
1A
0P
“Don’t Care” “Don’t Care”
2011 Microchip Technology Inc. DS22029F-page 13
34AA02/34LC02
TABLE 7-2: ACKNOWLEDGE TABLE FOR WRITE OR WRITE PROTECTION WITH R/W = 0
TABLE 7-3: ACKNOWLEDGE TABLE FOR WRITE OR WRITE PROTECTION WITH R/W = 1
TABLE 7-1: SOFTWARE WRITE PROTECTION INSTRUCTION SET WP = 0
Address Pins Device Type Identifier Chip Select Bits R/W
A2 A1 A0 B7 B6 B5 B4 B3 B2 B1 B0
SWP VSS VSS VHV 0 110 0 0 1 0
CSWP VSS VCC VHV 0 110 0 1 1 0
PSWP A2 A1 A0 0 110 A2 A1 A0 0
Read SWP VSS VSS VHV 0 110 0 0 1 1
Read CSWP VSS VCC VHV 0 110 0 1 1 1
Read PSWP A2 A1 A0 0 110 A2 A1 A0 1
1. A0 is used to detect VHV for the SWP and CSWP commands.
2. B3, B2 and B1 are compared to the A2, A1 and A0 external pins, respectively on the 34XX02.
Status Write-
Protect Instruction ACK Address ACK Data Byte ACK Write
Cycle
Permanently Protected x
PSWP, SWP, CSWP No
Ack Don’t Care No
Ack Don’t Care No Ack No
PAGE or BYTE
WRITE in lower 128
bytes Ack Address Ack Data No Ack No
Protected with SWP
0
SWP No
Ack Don’t Care No
Ack Don’t Care No Ack No
CSWP Ack Don’t Care Ack Don’t Care Ack Yes
PSWP Ack Don’t Care Ack Don’t Care Ack Yes
PAGE or BYTE
WRITE in lower 128
bytes Ack Address Ack Data No Ack No
1
SWP No
Ack Don’t Care No
Ack Don’t Care No Ack No
CSWP Ack Don’t Care Ack Don’t Care No Ack No
PSWP Ack Don’t Care Ack Don’t Care No Ack No
PAGE or BYTE
WRITE Ack Address Ack Data No Ack No
Not Protected
0
PSWP, SWP, or CSWP Ack Don’t Care Ack Don’t Care Ack Yes
PAGE or BYTE
WRITE Ack Address Ack Data Ack Yes
1
PSWP, SWP, or CSWP Ack Don’t Care Ack Don’t Care No Ack No
PAGE or BYTE
WRITE Ack Address Ack Address No Ack No
Status Instruction ACK
Permanently Protected PSWP, SWP, CSWP No Ack
Protected with SWP
SWP No Ack
CSWP Ack
PSWP Ack
Not protected PSWP, SWP, CSWP Ack
34AA02/34LC02
DS22029F-page 14 2011 Microchip Technology Inc.
8.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 8-1.
TABLE 8-1: PIN FUNCTION TABLE
8.1 A0, A1, A2
The levels on these inputs are compared with the
corresponding bits in the slave address. The chip is
selected if the compare is true.
Up to eight 34XX02 devices (four for the SOT-23
package) may be connected to the same bus by using
different Chip Select bit combinations. These inputs
must be connected to either VSS or VCC.
The A0 pin is also used to detect VHV.
8.2 Serial Address/Data Input/Output
(SDA)
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal. Therefore, the SDA bus requires a pull-
up resistor to VCC (typical 10 k for 100 kHz, 2 k for
400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
8.3 Serial Clock (SCL)
This input is used to synchronize the data transfer to
and from the device.
8.4 Write-Protect (WP)
This is the hardware write-protect pin. It can be tied to
VCC or VSS. If tied to VCC, the hardware write protection
is enabled. If the WP pin is tied to VSS, the hardware
write protection is disabled.
Symbol PDIP SOIC TSSOP MSOP TDFN SOT-23 Description
A0 1 1 1 1 1 5 Chip Address Input
A1 2 2 2 2 2 4 Chip Address Input
A2 3 3 3 3 3 NC Chip Address Input
VSS 4 4 4 4 4 2 Ground
SDA 5 5 5 5 5 3 Serial Address/Data I/O
SCL 6 6 6 6 6 1 Serial Clock
WP 7 7 7 7 7 NC Write-Protect Input
VCC 8 8 8 8 8 6 +1.7V to 5.5V Power Supply
WV‘M’Wfl LALUJLUJLJ HHHH UUUU HHHH ‘QCD UUUH HHHH UUUU HHUH UUUU
2011 Microchip Technology Inc. DS22029F-page 15
34AA02/34LC02
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
XXXXXXXX
TXXXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
8-Lead SOIC (3.90 mm) Example:
XXXXXXXT
XXXXYYWW
NNN
34AA02
I/P 3EC
0810
34LC02I
SN 0810
3EC
8-Lead MSOP Example:
XXXXXT
YWWNNN
34AA2I
8103EC
8-Lead TSSOP Example:
XXXX
TYWW
NNN
34A2
I810
3EC
8-Lead 2x3 TDFN
XXX
YWW
NN
Example:
3
e
3
e
AJ2
810
3E
1st Line Marking Codes
Part Number TSSOP MSOP TDFN
I-Temp E-Temp
34AA02 34A2 34AA2T AJ2 AJ3
34LC02 34L2 34LC2T AJ5 AJ6
171717 171717 U U U U U 34L002 NNN For
34AA02/34LC02
DS22029F-page 16 2011 Microchip Technology Inc.
Example:
6-Lead SOT-23
XXNN SKEC
SOT-23 Marking Codes
Device
34AA02
34LC02
I-Temp
SKNN
STNN
E-Temp
SLNN
SUNN
Pb-free topside mark is same; Pb-free
noted only on carton label.
3
e
3
e
Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
2011 Microchip Technology Inc. DS22029F-page 17
34AA02/34LC02
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   
N
E1
NOTE 1
D
123
A
A1
A2
L
b1
b
e
E
eB
c
   
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] TOP VIEW “010 an ”” SEATING PLANE A<— side="" view="" view="" a-a="" chrocmp="" techno‘ogy="" drawmg="" no="" c047057c="" sheet="" 1="" 012="">
34AA02/34LC02
DS22029F-page 18 2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Unlls MILLIMETERS Dlmensicn Limlls MlN l NOM l MAX Number ol Pins N a Pllch e 1.27 550 Overall Helght A — — l 75 Molded Package Thlckness A2 1 25 - - Slandofl § A1 010 - O 25 Overall Wldlh E 6 00 BSC Molded Package Wldlh E1 3 90 530 Overall Length D 4 90 EEC Chamfer (Opllonal) n o 25 - n 50 Fuel Length L 0 40 - 1 27 Foolprlnt L1 1 04 REF Fool Angle la 0" . 5“ Lead Thlckness c 0.17 . 0.25 Lead wldln b 0.31 . 0.51 Mold Bran Angle Top a 5" . 15“ Mold Drafi Angle Bottom 5 5° . 15“ Notes: 1 Pin 1 visual index lealure may vary, bul must be leased Wllnln lne nalcned area 2 § signlileanl Characteristic 3 Dimenslons D and E1 do nol include mold llash or prolruslons. Mnld llash or prolmslans snall ngl exceed a 15mm per SldE 4 Dimensloning and tulerancing per ASME YM SM 380 Basic Dimenslorl. Tneorellcally exact value snown Wllhoul tolerances REF Relerence Dlmension. usually willnoul tolerance. igr inlonnanan purposes only. Micvocnlp Technology Drawlrlg No 004-0570 Sheet 2 of 2
2011 Microchip Technology Inc. DS22029F-page 19
34AA02/34LC02
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes. L4 UDE / S‘LK SCREEN LJ BEE: X1 RECOMMENDED LAND PATTERN Umts MlLL‘METERS Dwmension Lvmts MIN \ NOM \ MAX Contact Pitch E 1.27 BSC Comacl Pad Spacmg c 5.40 Contact Pad Wwdth (xa) x1 0.60 Comacl Pad Length (X8) v1 1.55 1 Dimenswonlng and ta‘eranclng per ASME v14 SM 380 Basic Dimensmn. Theoretwca‘ly exam value Shawn wwthout to‘erances. Microcmp Technology Drawmg No. 504720st
34AA02/34LC02
DS22029F-page 20 2011 Microchip Technology Inc.
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2011 Microchip Technology Inc. DS22029F-page 21
34AA02/34LC02
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 

 
   
  
  
   
    
   
  
    
    
    
  
   
   
   
D
N
E
E1
NOTE 1
12
b
e
c
A
A1
A2
L1 L
φ
   
87Lead Plastic Thin Shrink Small Outline (ST) 7 4.4 mm Body [TSSOP] Noles' X17 UDDU’ C1 ‘ E E: i |:| 7 l:| _if G l:| —l El 5 E SlLK SCREEN RECOMMENDED LAND PATTERN Units MILLlMETERS Dimension Limits MIN | NOM | MAX Conlacl Pitch E 0.65 850 Conlacl Pad Spacing c1 5 so Conlacl Pad Width (xe) Xi 0.45 Contact Pad Length (xe) w 1.45 Distance Between Pads <3 0="" 20="" l="" dimensioning="" and="" loletancing="" pet="" asme="" w4="" sm="" 850="" basic="" dimension="" theoretically="" exacl="" value="" snuwn="" without="" lalerances="" microchip="" technalcgy="" drawing="" no.="" cda-zdbea="">
34AA02/34LC02
DS22029F-page 22 2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011 Microchip Technology Inc. DS22029F-page 23
34AA02/34LC02
," !*-, , !
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 
 
 
 
 

 
   
  
  
   
    
   
  
  
  
    
  
   
   
   
D
N
E
E1
NOTE 1
12
e
b
A
A1
A2 c
L1 L
φ
   
S-Lead Plastic Micro Smali Outline Package (MS) [MSOP] ’* ” ' \ SILK SCREEN I i —><—gx recommended="" land="" pattern="" units="" millimeters="" dimension="" limits="" min="" i="" nom="" i="" max="" contact="" pitch="" e="" 0.65="" bsc="" contact="" pad="" spacing="" c="" 4.40="" overali="" width="" 2="" 5.35="" contact="" pad="" width="" (x8)="" x1="" 0.45="" contact="" pad="" length="" (xs)="" y1="" 1.45="" distance="" between="" pads="" (31="" 2.95="" distance="" between="" pads="" gx="" 0.20="" notes="" 1="" dimensiomng="" and="" toierancing="" perasme="" y1a="" sm="" 550="" basic="" dimensiun="" theoreticaiiy="" exact="" vaiue="" shown="" wilhuut="" tolerances="" microchip="" technoiogy="" drawing="" no="" c0472111a="">
34AA02/34LC02
DS22029F-page 24 2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Dual Flat, No Lead Package (MN) 7 2x3x0.75mm Body [TDFN] NOTEI \ 2X Q 0.15 C 2xa-c A SEAT‘NG PLANE ‘— I—I—I—IJé' TOP VIEW r “J f SIDE V‘EW Exposzo J no BXb»‘ / w K _ / \ New 2 1 0.10® c A‘B‘ $ 0.05® c BOWOM VIEW chm A1 an amp Technology Drawmg No congc
2011 Microchip Technology Inc. DS22029F-page 25
34AA02/34LC02
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Dual Flat, No Lead Package (MN) — 2x3x0.75mm Body [TDFN] NOTEZ Units MILLIMETERS Dwmensmn Limits MIN 1 NOM | MAX Number of Plns N 8 Pitch e 0.50 BSC Overaii Hewght A 0 70 0 75 0 80 Standofi A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF OveraH Length D 2.00 580 Overaii Wwdth E 3.00 BSC Exposed Pad Length D2 1 20 - 1 60 Exposed Pad Width E2 1.20 - 1.50 Contact Wwdth b 0.20 0.25 0.30 Contact Length L 0.25 0.30 0.45 ContacHorExposed Pad K 0.20 . . Notes: 1. Pm 1 Visual index ieaiure may vary, but must be located wwthwn the hatched area. 2. Package may have one or more exposed tie bars at ends 3 Package is saw swngu‘aied 4 Dwmensiening and toteraneing per ASME v14 5M BSC: Baswc Dwmension TheoretwcaHy exact value shown wwthout tolerances. REF. Reference Dimension. usuaHy wxihout tolerance, for \nformation purposes onty. Mlcrochwp Technology Drawmg No. 004-1290 Sheet 2 012
34AA02/34LC02
DS22029F-page 26 2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
‘— W2 —’ S‘LK SCREEN ‘fl‘ ~+~m WT’EU E Di: X1 4 L +5.— RECOMMENDED LAND PATTERN Unus M‘LLIMETERS Dimensmn Lxmxls MIN | NOM | MAX Contad PM E o 50 BSC Opuanax Center Pad w‘um W2 1.46 Optiona‘ Center Pad Length TZ 1.35 Contact Pad Spacing (:1 3.00 Contac‘ Pad Wwdlh (X8) X1 0 30 Contact Pad Lengm (x5) v1 0 75 Dwstance Between Pads G 0 20 Notes 1 Dwmenswonlng and mlerancmg per ASME v14 SM 580 Basm Dmensmn Themeueauy exact value shown wimom lo‘erances. Mmmcmp Techno‘ogy Drawmg No 004-21ng
2011 Microchip Technology Inc. DS22029F-page 27
34AA02/34LC02
.$*-,/00%12(.
 

34AA02/34LC02
DS22029F-page 28 2011 Microchip Technology Inc.
3 !(""!( !(/
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 

 
   
  
  
  
   
   
   
   
   
   
   
   
   
   
   
b
E
4
N
E1
PIN1IDBY
LASER MARK
D
123
e
e1
A
A1
A2 c
L
L1
φ
   
6-Lead P‘astic SmaH Outline Transistor (OT) [SOT-23] X f 7 Y i 2 C G ” i SM— SCREEN 7 I I O | | ——— <— gx="" _—="" e=""><— recommended="" land="" pattern="" unlls="" mtllimeters="" dlmenston="" lells="" nhn="" \="" nom="" |="" max="" conlact="" pttch="" e="" u="" 95="" 550="" contact="" pad="" spaclng="" c="" 2="" 30="" contact="" pad="" wtdth="" (x6)="" x="" 0="" 60="" contact="" pad="" lengtn="" (xe)="" y="" 1="" 10="" dtstance="" between="" pads="" g="" 1.70="" dtstance="" between="" pads="" gx="" 0.35="" overan="" wtdlh="" z="" 3="" 90="" notes="" 1="" dtmenstumng="" and="" lolerancmg="" perasme="" v14="" sm="" 556.="" base="" dtmension="" theoretical‘y="" exact="" va‘ue="" shown="" wilhwt="" tolerances.="" mtcrochip="" tecnnotogy="" drawing="" no="" 00472028a="">
2011 Microchip Technology Inc. DS22029F-page 29
34AA02/34LC02
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
34AA02/34LC02
DS22029F-page 30 2011 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision A (1/2007)
Original release of this document.
Revision B (2/2007)
Replaced Package Drawings.
Revision C (2/2008)
Added TDFN and SOT-23 Package info; Removed
“VL” Part.
Revision D (4/2008)
Updated Product Identification System table,
example (e).
Revision E (01/2010)
Revised SOT-23 and TDFN marking codes.
Revision F (03/2011)
Revised Section 3.6; Updated spec to new template.
2011 Microchip Technology Inc. DS22029F-page 31
34AA02/34LC02
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
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Microchip’s customer notification service helps keep
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will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
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CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor,
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included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
34AA02/34LC02
DS22029F-page 32 2011 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
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DS22029F34AA02/34LC02
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
PART X /XX
2011 Microchip Technology Inc. DS22029F-page 33
34AA02/34LC02
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX
PackageTemperature
Range
Device
Device: 34AA02: = 1.7V, 2 Kbit I2C Serial EEPROM
34AA02T: = 1.7V, 2 Kbit I2C Serial EEPROM
(Tape and Reel)
34LC02: = 2.2V, 2 Kbit I2C Serial EEPROM
34LC02T: = 2.2V, 2 Kbit I2C Serial EEPROM
(Tape and Reel)
Temperature
Range:
I = -40°C to +85°C
E = -40°C to +125°C
Package: OT = Plastic Small Outline (SOT-23), 6-lead
P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (3.90 mm body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
MNY(1) = Plastic Dual Flat, no lead package
(2x3 mm body), 8-lead
Examples:
a) 34AA02-I/P: Industrial Temperature,
1.7V, PDIP package
b) 34AA02-I/SN: Industrial Temperature,
1.7V, SOIC package
c) 34AA02T-E/MS: Tape and Reel,
Automotive Temperature, 1.7V, MSOP
package
d) 34LC02-I/P: Industrial Temperature,
2.2V, PDIP package
e) 34LC02-I/MNY: Industrial Temperature,
2.2V, DFN package
f) 34LC02T-E/MS: Tape and Reel,
Automotive Temperature, 2.2V, MSOP
package
Note 1: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
34AA02/34LC02
DS22029F-page 34 2011 Microchip Technology Inc.
NOTES:
QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV = ISO/TS “5949:2002 =
2011 Microchip Technology Inc. DS22029F-page 35
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-947-1
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
6‘ ‘MICRDCHIP
DS22029F-page 36 2011 Microchip Technology Inc.
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02/18/11

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