Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
1
General Description
The AP2815 is an integrated high-side power switch
that consists of N-Channel MOSFET, charge pump,
over current & temperature and other related protection
circuits. The switch’s low RDS(ON), 60mΩ, is designed
to meet the USB voltage drop requirements. The IC
integrates soft-start to limit inrush current,
over-current protection, load short protection with
fold-back, and thermal shutdown to avoid switch
failure during hot plug-in. Under voltage lockout
(UVLO) function is used to ensure the device
remains off unless there is a valid input voltage
present. A FLAG output is available to indicate fault
conditions to the local USB controller.
The AP2815 is available in standard packages of
SOIC-8 and MSOP-8.
Features
• Low MOSFET on Resistance: 60mΩ @
VIN=5.0V
• Compliant to USB Specifications
• Operating Voltage Range: 2.7V to 5.5V
• Low Supply Current: 65µA (Typ.)
• Low Shutdown Current: 1.0µA (Max)
• Guarantee 1.5A Continuous Load
• Current Limit: 1.65A (Min), 2.8A (Max)
• Under-voltage Lockout
• Logic Level Enable Pin:
eAvailable in Active-high or Active-low Version
• Soft Start-up
• Over-current Protection
• Over Temperature Protection
• Load Short Protection with Fold-back
• No Reverse Current when Power Off
• Deglitched FLAG Output with Open Drain
• eWith Output Shutdown Pull-low Resistor for
eA/C Versions
• UL Approved (File No. E339337)
• Nemko CB Scheme IEC60950-1, Ref. Certif
No. NO64001
Applications
• USB Power Management
• USB Bus/Self Powered Hubs
• Hot-plug Power Supplies
• Battery-Charger circuits
• Notebook, Motherboard PCs
Figure 1. Package Types of AP2815
SOIC-8 MSOP-8
GND VOUT
VIN VOUT
VIN VOUT
EN/EN FLAG
EN/W
FLAG
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
2
Pin Configuration
M/MM Package
（SOIC-8/MSOP-8）
Figure 2. Pin Configuration of AP2815 (Top View)
Pin Descriptions
Pin No. Name Descriptions
1 GND Ground
2, 3 VIN Supply Input Pin
4 Chip Enable, Control Input, Active Low or High
5
Fault FLAG Pin, output with open drain, need a pull-up resistor in
application, active low to indicate OCP or OTP.
6, 7, 8 VOUT Output Voltage
EN/EW +—
’7
0'0“ Gate Conlml —{
’7
Band Gap Over Culrent Curran.
Reference lewtlng
Shutdown
Signs“
Thermal FLAG
UVLO SSHSS Deglltch LOQKE
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
3
Functional Block Diagram
Figure 3. Functional Block Diagram of AP2815
AI’2815 [I D EI-EI
Cum“ Typc‘ _
Temperature
Condition Part Numhe
Range
Product Package
«P3 1 5AM.m
50108
Ameigh \P2X151’\MTILGI
Arzxm .40 to 85°C mm mm;
. L .. \PEXISAMWVGI
“SUM Dthu'LL
«P2815AMVTKG
«P3 1 sswnl
50108
ALW'Hish «mmsswmm
Amms .40 to 85°C mum“ Aum
Dhahm’gu «P3 1 SBWMJH
“SUM
\PEXISBVMTKG
«P3 1 scwnl
50108
MUWLW \P2815(‘\1TIL(71
Amxlsc .40 to 85°C mm mm;
Dmymgc «P3 1 50mm!
Msmux
«mxxscmeka
«1’35an
50108
ACUWLW «mmsDMTImI
mm L 5D .40 to 85°C 0 01mm Aum
Dhclmrgc «MUM/mm
Msmux
\PmsDMwTKG
BCD Semiconductor’s Pbrfrcc products, as dcsxgnamd wixh "(i l " suffix
and (irssn
Apr 2012 Revl 7
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
4
Ordering Information
AP2815 -
Circuit Type
Product Package
Temperature
Range Condition Part Number Marking ID Packing
Type
AP2815AM-G1 2815AM-G1 Tube
SOIC-8
AP2815AMTR-G1 2815AM-G1 Tape & Reel
AP2815AMM-G1 2815AMM-G1 Tube
AP2815A
MSOP-8
-40 to 85°C
Active High
with Auto
Discharge
AP2815AMMTR-G1 2815AMM-G1 Tape & Reel
AP2815BM-G1 2815BM-G1 Tube
SOIC-8
AP2815BMTR-G1 2815BM-G1 Tape & Reel
AP2815BMM-G1 2815BMM-G1 Tube
AP2815B
MSOP-8
-40 to 85°C
Active High
without Auto
Discharge
AP2815BMMTR-G1 2815BMM-G1 Tape & Reel
AP2815CM-G1 2815CM-G1 Tube
SOIC-8
AP2815CMTR-G1 2815CM-G1 Tape & Reel
AP2815CMM-G1 2815CMM-G1 Tube
AP2815C
MSOP-8
-40 to 85°C
Active Low
with Auto
Discharge
AP2815CMMTR-G1 2815CMM-G1 Tape & Reel
AP2815DM-G1 2815DM-G1 Tube
SOIC-8
AP2815DMTR-G1 2815DM-G1 Tape & Reel
AP2815DMM-G1 2815DMM-G1 Tube
AP2815D
MSOP-8
-40 to 85°C
Active Low
without Auto
Discharge
AP2815DMMTR-G1 2815DMM-G1 Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant
and Green.
G1: Green
TR: Tape & Reel
Blank: Tube
Package
M: SOIC-8
MM: MSOP-8
Condition
A: Active High with Auto Discharge
B: Active High without Auto Discharge
C: Active Low with Auto Discharge
D: Active Low without Auto Discharge
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
5
Absolute Maximum Ratings (Note 1)
Parameter Symbol Value Unit
Power Supply Voltage VIN 6.0 V
Operating Junction Temperature
Range TJ 150 ºC
Storage Temperature Range TSTG -65 to 150 ºC
Lead Temperature (Soldering, 10sec) TLEAD 260 ºC
SOIC-8 135
Thermal Resistance
(Junction to Ambient) θJA MSOP-8 150 ºC/W
ESD (Machine Model) 200 V
ESD (Human Body Model) 2000 V
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter Symbol Min Max Unit
Supply Voltage VIN 2.7 5.5 V
Operating Ambient Temperature
Range TA -40 85 °C
Slunduvm
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
6
Electrical Characteristics
(VIN=5.0V, CIN=2.2µF, COUT=1.0µF, Typical TA = 25°C, Bold typeface applies over -40°C≤TA≤85°C ranges, unless otherwise
specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Input Voltage Range VIN 2.7 5.5 V
Switch On Resistance RDS(ON) V
IN=5V, IOUT=1.5A 60 80
mΩ
Current Limit ILIMIT V
OUT=4.0V 1.65 2.2 2.8 A
Supply Current ISUPPLY V
IN=5V, RLOAD Open 65 85 µA
Fold-back Short Current ISHORT V
OUT=0 1.12 A
Shutdown Supply Current ISHUTDOWN Chip Disable, Shutdown Mode 0.1 1 µA
Enable High Input Threshold VENH 1.6 5.5 V
Enable Low Input Threshold VENL 0 1.0 V
Enable pin Input Current IEN Force 0 to 5.0V at EN Pin -1.0 1.0 µA
Under Voltage Lockout
threshold voltage VUVLO V
IN Increasing from 0V 2.2 2.5 2.7 V
Under Voltage Hysteresis VUVLOHY 0.2 V
Reverse Current IREVERSE Chip Disable, VOUT->VIN 0.1 1.0
µA
Output Pull Low Resistance
after Shutdown RDISCHARGE AP2815A, AP2815C only 13 50 Ω
Output Turn-on Time tON From Enable Active to 90% o
f
output 500 µs
FLAG PinDelay Time tDFLG From Over Current Fault
Condition to FLAG Active 5 10 15 ms
FLAG Pin Low Voltage VFLG I
SINK=5mA 35 70 mV
FLAG Pin Leakage ILEAKAGE FLAG Disable, Force 5.0V 1.0 µA
Thermal Shutdown
Temperature TOTSD 150
Thermal Shutdown Hysteresis THYOTSD 30
oC
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
7
Typical Performance Characteristics
Figure 4. Supply Current vs. Ambient Temperature Figure 5. Supply Current vs. Supply Voltage
Figure 6. Current Limit vs. Supply Voltage Figure 7. Current Limit vs. Ambient Temperature
-40-200 20406080
0
10
20
30
40
50
60
70
80
90
100
Supply Current (µA)
Ambient Temperature (OC)
VIN=5V
Enable Active
No Load
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
-10
0
10
20
30
40
50
60
70
80
90
100
TA=-40OC
TA= 25OC
TA= 85OC
Supply Curent (µA)
Supply Voltage (V)
Enable Active
3.0 3.5 4.0 4.5 5.0 5.5
1.6
1.8
2.0
2.2
2.4 VIN=5V
Enable Active
Current Limit (A)
Supply Voltage (V)
TA=25OC
-40-200 20406080
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
Enable Active
Current Limit (A)
Ambient Temperature (OC)
VIN=5V
VIN=3.3V
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
8
Typical Performance Characteristics (Continued)
Figure 8. Switch On Resistance vs. Temperature Figure 9. Switch On Resistance vs. Supply Voltage
Figure 10. Flag Delay Time during Over Current Figure 11. Flag Delay Time during Over Current
vs. Ambient Temperature vs. Supply Voltage
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
0
10
20
30
40
50
60
70
80
90
100
IOUT=2.0A
VIN=5V
Enable Active
Switch On Resistance (mΩ)
Ambient Temperature (OC)
3.0 3.5 4.0 4.5 5.0 5.5
30
40
50
60
70
80
90
100
TA=25OC
Switch On Resistance (mΩ)
Supply Voltage (V)
Enable Active
IOUT=2.0A
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
5
6
7
8
9
10
11
12
13
14
15
VIN=5V
Enable Active
Flag Delay Time during Over Current (mS)
Ambient Temperature (OC)
3.0 3.5 4.0 4.5 5.0 5.5
6
8
10
12
14
TA=25OC
Supply Voltage (V)
VIN=5V
Enable Active
Flag Delay Time during Over Current (mS)
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
9
Typical Performance Characteristics (Continued)
Figure 12. Output Short to GND Current Figure 13. Output Short to GND Current
vs. Supply Voltage vs. Ambient Temperature
Figure 14. Enable Threshold Voltage Figure 15. Enable Threshold Voltage
vs. Ambient Temperature vs. Supply Voltage
3.0 3.5 4.0 4.5 5.0
1.00
1.02
1.04
1.06
1.08
1.10
1.12
1.14
1.16
1.18
1.20
1.22
1.24
1.26
1.28
1.30
Supply Voltage (V)
Output Short to GND Current (A)
VIN=5V
Enable Active
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
1.0
1.1
1.2
1.3
1.4
1.5
Ambient Temperature (OC)
Output Short to GND Current (A)
VIN=5V
Enable Active
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
1.0
1.1
1.2
1.3
1.4
1.5
1.6
VEN_H
VEN_L
Ambient Temperature (OC)
VIN=5V
Enable Threshold Voltage (V)
3.0 3.5 4.0 4.5 5.0 5.5
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
Supply Voltage (V)
VEN_H
VEN_L
TA=25OC
Enable Threshold Voltage (V)
I! I‘ II
II \a I,
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
10
Typical Performance Characteristics (Continued)
Figure 16. UVLO Voltage vs. Ambient Temperature Figure 17. Output Short to GND Current
(V
IN=5V, CIN=1.0µF)
Figure 18. FLAG Response during Over Current Figure 19. FLAG Response during
Over Temperature (TA=125oC)
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.55
2.60
2.65
2.70
VIN Falling
Ambient Temperature (OC)
Enable Active
VIN Rising
Under Voltage Lockout Threshold Voltage (V)
VEN
5V/div
IOUT
1A/div
VOUT
1V/div
Time 5ms/div
Time 5ms/div Time 5ms/div
VFLAG
1V/div
IOUT
1A/div
VOUT
1V/div
VFLAG
1V/div
IOUT
1A/div
VOUT
1V/div
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
11
Typical Performance Characteristics (Continued)
Figure 20. Output Turn On and Rise Time Figure 21. Output Turn On and Rise Time
(CIN=1.0µF, COUT=1.0µF, No Load) (CIN=1.0µF, COUT=1.0µF, RL=3.3Ω)
Figure 22. Output Turn On and Rise Time Figure 23. Output Turn Off and Fall Time
(CIN=1.0µF, COUT=220µF, No Load) (V
IN=5V, CIN=1.0µF, No Load)
VEN
5V/div
IINRUSH
20mA/div
Time 500µs/div Time 500µs/div
VOUT
1V/div
VEN
5V/div
IINRUSH
1A/div
VOUT
1V/div
Time 500µs/div Time 5ms/div
VEN
5V/div
VOUT
1V/div
IINRUSH
1A/div
VEN
5V/di
v
VOUT
1V/div
COUT=1
µ
F
COUT=22
µ
F
COUT=100
µ
F
COUT=220µF
COUT=470µF
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
12
Typical Performance Characteristics (Continued)
Figure 24. Output Turn Off and Fall Time
(VIN=5V, CIN=1.0µF, COUT=470µF, RL=3.3Ω)
VEN
5V/div
IOUT
1A/div
Time 5ms/div
VOUT
1V/div
Vm=5V
Enable
10m
usa Controller
VIN FLAG o
A P28 1 5
ENE GND VOUTT \\i Vsus
Cour D*
1 “F D-
\\— GND
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
13
Typical Application
Note 2：2.2µF input capacitor is enough in most application cases.
If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend 22µF.
Figure 25. Typical Application of AP2815
4.700(O.185)
7 7 03200013)
5.1000201) 1.3500053) 7
/ 7 1.750(0.069)
7 ‘ 758
1 1 1 1 / \ \
1 1 1 1 1 ‘
\JK ‘ x478:
06750027)
07250029) 5.800(0228)
1.2700050) .7 762000.244) 4-
TYP
D
0.1000004) 20:1 108000.031)
0.3000012) 0.2000003)
H H ‘ H H
‘ :
1.0000039) ‘
7 7 7 7 7 7 7 3.8000150)
4.0000157)
\ \
K \
D:
D:
I I
H :
0.1 9 0.007
0.330(0013) o_250(0_010)
0.510(0020)
0.900(0035) R0_150(0.006)
0.4500017)
0.800(0.031)
Note: Eject hole, oriented hole and mold mark is options).
Apr 2012 Revl 7
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
14
Mechanical Dimensions
SOIC-8 Unit: mm(inch)
R0.150(0.006)
0.300(0_012)TYP
0.650(0.026)TYP o_150(o.006)TYP
y , _
A
A
A
a :
no 0
r N 7 7 7
o o 7 ,,
s a
E 9 ,
Q m L *
} o» ,
7 6 0.760(0,030)
0.9700338)
0.800(0331)
12000.04?)
2.900(0.114)
3.100(0122)
\
Note: Eject hole, oriented hole and mold mark is optional.
Apr 2012 Rev | 7 BCD Sem
Advance Datasheet
1.5A High-side Power Distribution Switch with Enable and Flag AP2815
Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited
15
Mechanical Dimensions (Continued)
MSOP-8 Unit: mm(inch)
4.700(0.185)
5.100(0.201)
0.410(0.016)
0.650(0.026)
0.000(0.000)
0.200(0.008)
3.100(0.122)
2.900(0.114)
3‘}: [A
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BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
other rights nor the rights of others.
- Wafer Fab
Shanghai SIM-BCD Semiconductor Manufacturing Limited
800, Yi Shan Road, Shanghai 200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
BCD Semiconductor Manufacturing Limited
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http://www.bcdsemi.com
BCD Semiconductor Manufacturing Limited
IMPORTANT NOTICE
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
other rights nor the rights of others.
- Wafer Fab
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.
800 Yi Shan Road, Shanghai 200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
MAIN SITE
REGIONAL SALES OFFICE
Shenzhen Office
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office
Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,
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Taiwan
Tel: +886-2-2656 2808
Fax: +886-2-2656 2806
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