SI5340, SI5341 Datasheet by Silicon Labs

SILICEIN LABS

Si5341/40 Rev D Data Sheet

Low-Jitter, 10 or 4-Output, Any-Frequency, Any-Output Clock

Generator

The any-frequency, any-output Si5341/40 clock generators combine a wide-band PLL

with proprietary MultiSynth™ fractional synthesizer technology to offer a versatile and

high performance clock generator platform. This highly flexible architecture is capable

of synthesizing a wide range of integer and non-integer related frequencies up to 1

GHz on 10 differential clock outputs while delivering sub-100 fs rms phase jitter per-

formance with 0 ppm error. Each of the clock outputs can be assigned its own format

and output voltage enabling the Si5341/40 to replace multiple clock ICs and oscillators

with a single device making it a true "clock tree on a chip."

The Si5341/40 can be quickly and easily configured using ClockBuilderPro software.

Custom part numbers are automatically assigned using a ClockBuilder Pro™ for fast,

free, and easy factory pre-programming or the Si5341/40 can be programmed via I2C

and SPI serial interfaces.

Applications:

•Clock tree generation replacing XOs, buffers, signal format translators

• Any-frequency clock translation

• Clocking for FPGAs, processors, memory

• Ethernet switches/routers

• OTN framers/mappers/processors

• Test equipment and instrumentation

• Broadcast video

KEY FEATURES

• Generates any combination of output

frequencies from any input frequency

• Ultra-low jitter of 90 fs rms

•Input frequency range:

• External crystal: 25 to 54 MHz

• Differential clock: 10 to 750 MHz

• LVCMOS clock: 10 to 250 MHz

• Output frequency range:

• Differential: 100 Hz to 1028 MHz

• LVCMOS: 100 Hz to 250 MHz

• Highly configurable outputs compatible with

LVDS, LVPECL, LVCMOS, CML, and HCSL

with programmable signal amplitude

• Si5341: 4 input, 10 output, 64-QFN 9x9 mm

• Si5340: 4 input, 4 output, 44-QFN 7x7 mm

Up to 10

Output Clocks

OUT7

OUT6

OUT5

OUT1

OUT4

OUT3

OUT2

OUT0

Si5340

Si5341

I2C / SPI Control NVM

Status Flags Status Monitor

4 Input

Clocks

XBXA

25-54 MHz XTAL

OSC MultiSynth ÷INT

÷INT

MultiSynth

÷INT

PLL

÷INT

OUT9

OUT8

÷INT

IN0

IN1

IN2

FB_IN

Zero Delay

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1. Features List

The Si5341/40 Rev D features are listed below:

• Generates any combination of output frequencies from any in-

put frequency

• Ultra-low jitter of 90 fs rms

• Input frequency range:

• External crystal: 25 to 54 MHz

• Differential clock: 10 to 750 MHz

• LVCMOS clock: 10 to 250 MHz

• Output frequency range:

• Differential: 100 Hz to 1028 MHz

• LVCMOS: 100 Hz to 250 MHz

• Highly configurable outputs compatible with LVDS, LVPECL,

LVCMOS, CML, and HCSL with programmable signal ampli-

tude

• Locks to gapped clock inputs

• Optional zero delay mode

• Glitchless on the fly output frequency changes

• DCO mode: as low as 0.001 ppb steps

•Core voltage

• VDD: 1.8 V ±5%

• VDDA: 3.3 V ±5%

• Independent output clock supply pins

• 3.3 V, 2.5 V, or 1.8 V

• Serial interface: I2C or SPI

• In-circuit programmable with non-volatile OTP memory

• ClockBuilder Pro software simplifies device configuration

• Si5341: 4 input, 10 output, 64-QFN 9x9 mm

• Si5340: 4 input, 4 output, 44-QFN 7x7 mm

• Temperature range: –40 to +85 °C

• Pb-free, RoHS-6 compliant

Si5341/40 Rev D Data Sheet

Features List

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2. Ordering Guide

Table 2.1. Si5341/40 Ordering Guide

Ordering Part Number

(OPN)

Number of In-

put/Output

Clocks

Output Clock Frequency

Range (MHz)

Frequency Syn-

thesis Mode Package Temperature

Range

Si5341

Si5341A-D-GM1, 2

4/10

0.0001 to 1028 MHz Integer and

Fractional 64-QFN

9x9 mm

–40 to 85 °C

Si5341B-D-GM1, 2 0.0001 to 350 MHz

Si5341C-D-GM1, 2 0.0001 to 1028 MHz

Integer Only

Si5341D-D-GM1, 2 0.0001 to 350 MHz

Si5340

Si5340A-D-GM1, 2

4/4

0.0001 to 1028 MHz Integer and

Fractional 44-QFN

7x7 mm

–40 to 85 °C

Si5340B-D-GM1, 2 0.0001 to 350 MHz

Si5340C-D-GM1, 2 0.0001 to 1028 MHz

Integer Only

Si5340D-D-GM1, 2 0.0001 to 350 MHz

Si5341/40-D-EVB

Si5341-D-EVB

———Evaluation

Board —

Si5340-D-EVB

Note:

1. Add an R at the end of the OPN to denote tape and reel ordering options.

2. Custom, factory pre-programmed devices are available. Ordering part numbers are assigned by Silicon Labs and the ClockBuild-

er Pro software utility. Custom part number format is: e.g., Si5341A-Dxxxxx-GM, where "xxxxx" is a unique numerical sequence

representing the preprogrammed configuration.

3. See 3.9 Custom Factory Preprogrammed Devicesand 3.10 Enabling Features and/or Configuration Settings Not Available in

ClockBuilder Pro for Factory Pre-Programmed Devices for important notes about specifying a preprogrammed device to use fea-

tures or device register settings not yet available in CBPro.

Si5341/40 Rev D Data Sheet

Ordering Guide

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.V mily . family member (7, 6) A, B, C, D) . ................................. ,- . ................

Si534fg-Rxxxxx-GM

Timing product family

f = Multi-PLL clock family member (7, 6)

g = Device grade (A, B, C, D)

Product Revision*

Custom ordering part number (OPN) sequence ID**

Package, ambient temperature range (QFN, -40 °C to +85°C)

*See Ordering Guide table for current product revision

** 5 digits; assigned by ClockBuilder Pro

Figure 2.1. Ordering Part Number Fields

Si5341/40 Rev D Data Sheet

Ordering Guide

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3. Functional Description

The Si5340/41-D combines a wide band PLL with next generation MultiSynth technology to offer the industry's most versatile and high

performance clock generator. The PLL locks to either an external crystal between XA/XB or to an external clock connected to XA/XB

or IN0, 1, 2. A fractional or integer multiplier takes the selected input clock or cystal frequency up to a very high frequency that is then

divided by the MultiSynth output stage to any frequency in the range of 100 Hz to 1 GHz on each output. The MultiSynth stage can

divide by both integer and fractional values. The high-resolution fractional MultiSynth dividers enable true any-frequency input to any-

frequency on any of the outputs. The output drivers offer flexible output formats which are independently configurable on each of the

outputs. This clock generator is fully configurable via its serial interface (I2C/SPI) and includes in-circuit programmable non-volatile

memory.

3.1 Power-up and Initialization

Once power is applied, the device begins an initialization period where it downloads default register values and configuration data from

NVM and performs other initialization tasks. Communicating with the device through the serial interface is possible once this initializa-

tion period is complete. No clocks will be generated until the initialization is done. There are two types of resets available. A hard reset

is functionally similar to a device power-up. All registers will be restored to the values stored in NVM, and all circuits will be restored to

their initial state including the serial interface. A hard reset is initiated using the RSTb pin or by asserting the hard reset bit. A soft reset

bypasses the NVM download. It is simply used to initiate register configuration changes.

Power-Up

Serial interface

ready

RSTb

pin asserted

Hard Reset

bit asserted

Initialization

NVM download

Soft Reset

bit asserted

Figure 3.1. Si5341 Power-Up and Initialization

3.2 Frequency Configuration

The phase-locked loop is fully contained and does not require external loop filter components to operate. Its function is to phase lock to

the selected input and provide a common reference to the MultiSynth high-performance fractional dividers.

A crosspoint mux connects any of the MultiSynth divided frequencies to any of the outputs drivers. Additional output integer dividers

provide further frequency division by an even integer from 2 to (2^25)-2. The frequency configuration of the device is programmed by

setting the input dividers (P), the PLL feedback fractional divider (Mn/Md), the MultiSynth fractional dividers (Nn/Nd), and the output

integer dividers (R). Silicon Labs's ClockBuilder Pro configuration utility determines the optimum divider values for any desired input

and output frequency plan.

3.3 Inputs

The Si5340/41-D requires either an external crystal at its XA/XB pins or an external clock at XA/XB or IN0, 1, 2.

Si5341/40 Rev D Data Sheet

Functional Description

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Lat _ I 1 Wm gr 3,3V 523ahm AAZohms 25V 475 hm 649 hm

3.3.1 XA/XB Clock and Crystal Input

An internal crystal oscillator exists between pin XA and XB. When this oscillator is enabled, an external crystal connected across these

pins will oscillate and provide a clock input to the PLL. A crystal frequency of 25 MHz can be used although crystals in the frequency

range of 48 MHz to 54 MHz are recommended for best jitter performance. Frequency offsets due to CL mismatch can be adjusted using

the frequency adjustment feature which allows frequency adjustments of ± 1000 ppm. The Si5340/41 Family Reference Manual pro-

vides additional information on PCB layout recommendations for the crystal to ensure optimum jitter performance. Refer to Table

5.12 Crystal Specifications on page 31 for crystal specifications.

To achieve optimal jitter performance and minimize BOM cost, a crystal is recommended on the XA/XB reference input. A clock (e.g.,

XO) may be used in lieu of the crystal, but it will result in higher output jitter. See the Si5340/41 Reference Manual for more information.

Selection between the external XTAL or input clock is controlled by register configuration. The internal crystal load capacitors (CL) are

disabled in the input clock mode. Refer to Table 5.3 Input Clock Specifications on page 20 for the input clock requirements at XAXB.

Both a single-ended or a differential input clock can be connected to the XA/XB pins as shown in the figure below. A PXAXB divider is

available to accommodate external clock frequencies higher than 54 MHz.

100

Differential Connection

2xCL

Single- ended XO Connection

Crystal Connection

OSC

XTAL

2xCL

Si5341/40

Si5341/40 Si5341/40

Note: 2. 0 Vpp_ se max

XO with Clipped Sine Wave

Output

2xCL

OSC

Si5341/40

Note: 2. 0 Vpp_ se max

CMOS Output

XO VDD R1 R2

3. 3 V 523 ohms442 ohms

2. 5 V 475 ohms 649 ohms

1. 8 V 158 ohms 866 ohms

100

0. 1 uf

Single-ended Connection

Note: 2. 5 Vpp diff max

OSC

Figure 3.2. XAXB External Crystal and Clock Connections

Si5341/40 Rev D Data Sheet

Functional Description

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3.3.2 Input Clocks (IN0, IN1, IN2)

A differential or single-ended clock can be applied at IN2, IN1, or IN0. The recommended input termination schemes are shown in the

figure below.

Pulsed CMOS DC Coupled Single Ended

Standard AC Coupled Single Ended

100

3.3V, 2.5V, 1.8V

LVCMOS

Standard AC Coupled Differential LVPECL

INx

INxb

100

Standard AC Coupled Differential LVDS

INx

INxb

3.3V, 2.5V

LVPECL

3.3V, 2.5V

LVDS or

CML

INx

INxb

INx

INxb

Pulsed CMOS

Standard

Si5341/40

3.3V, 2.5V, 1.8V

LVCMOS

Pulsed CMOS

Standard

Pulsed CMOS

Standard

Pulsed CMOS

Standard

VDD R1 (Ohm) R2 (Ohm)

1.8 V

2.5 V

3.3 V

324

511

634

665

475

365

Figure 3.3. Termination of Differential and LVCMOS Input Signals

Si5341/40 Rev D Data Sheet

Functional Description

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3.3.3 Input Selection (IN0, IN1, IN2, XA/XB)

The active clock input is selected using the IN_SEL[1:0] pins or by register control. A register bit determines input selection as pin or

Table 3.1. Manual Input Selection Using IN_SEL[1:0] Pins

IN_SEL[1:0] Selected Input

0 0 IN0

0 1 IN1

1 0 IN2

1 1 XA/XB

3.4 Fault Monitoring

The Si5340/41-D provides fault indicators which monitor loss of signal (LOS) of the inputs (IN0, IN1, IN2, XA/XB, FB_IN) and loss of

lock (LOL) for the PLL as shown in the figure below.

PLL

LPFPD

IN0

IN0b LOS0

÷P

IN1

IN1b ÷P

FB_IN

FB _INb

IN2

IN2b

÷P

LOL

Si5341/40

XA OSC

÷Pfb

LOSXAB

LOS1

LOS2

LOLb

LOSXAB

INTRb

LOSFB

(Si5340)

Figure 3.4. LOS and LOL Fault Monitors

3.4.1 Status Indicators

The state of the status monitors are accessible by reading registers through the serial interface or with dedicated pin (LOLb). Each of

the status indicator register bits has a corresponding sticky bit in a separate register location. Once a status bit is asserted its corre-

sponding sticky bit (_FLG) will remain asserted until cleared. Writing a logic zero to a sticky register bit clears its state.

3.4.2 Interrupt Pin (INTRb)

An interrupt pin (INTRb) indicates a change in state with any of the status registers. All status registers are maskable to prevent asser-

tion of the interrupt pin. The state of the INTRb pin is reset by clearing the status registers.

Si5341/40 Rev D Data Sheet

Functional Description

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3.5 Outputs

The Si5341 supports 10 differential output drivers which can be independently configured as differential or LVCMOS. The Si5340 sup-

ports 4 output drivers independently configurable as differential or LVCMOS.

3.5.1 Output Signal Format

The differential output amplitude and common mode voltage are both fully programmable and compatible with a wide variety of signal

formats including LVDS and LVPECL. In addition to supporting differential signals, any of the outputs can be configured as LVCMOS

(3.3 V, 2.5 V, or 1.8 V) drivers providing up to 20 single-ended outputs, or any combination of differential and single-ended outputs.

3.5.2 Differential Output Terminations

The differential output drivers support both ac-coupled and dc-coupled terminations as shown in the figure below.

100

Internally

self-biased

AC Coupled LVDS/LVPECL

AC Coupled LVPECL/CML

VDD – 1.3V

5050

100

DC Coupled LVDS

OUTx

OUTxb

OUTx

OUTxb

OUTx

OUTxb

VDDO = 3.3V , 2.5V , 1.8V

VDDO = 3.3V , 2.5V

VDDO = 3.3V , 2.5V , 1.8V

Si5341/40 Si5341/40

Si5341/40

AC Coupled HCSL

OUTx

OUTxb

VDDO = 3.3V, 2.5V, 1.8V

Si5341/40

R2 R2

VDD

Standard

HCSL

Receiver

VDDRX

Option 1

For V

CM = 0. 37 V

3. 3 V

2. 5 V

1. 8 V

442 ohms

332 ohms

243 ohms

56.2 ohms

59 ohms

63.4 ohms

R1 R2

Figure 3.5. Supported Differential Output Terminations

3.5.3 Programmable Common Mode Voltage for Differential Outputs

The common mode voltage (VCM) for the differential modes are programmable so that LVDS specifications can be met and for the best

signal integrity with different supply voltages. When dc coupling the output driver it is essential that the receiver should have a relatively

high common mode impedance so that the common mode current from the output driver is very small.

Si5341/40 Rev D Data Sheet

Functional Description

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’VV\« ’VVV 250

3.5.4 LVCMOS Output Terminations

LVCMOS outputs are typically dc-coupled, as shown in the figure below.

3.3V , 2.5V , 1.8 V

LVCMOS

VDDO = 3.3V , 2.5V , 1.8V

DC Coupled LVCMOS

OUTx

OUTxb

Figure 3.6. LVCMOS Output Terminations

3.5.5 LVCMOS Output Impedance and Drive Strength Selection

Each LVCMOS driver has a configurable output impedance. It is highly recommended that the minimum output impedance (strongest

drive setting) is selected and a suitable series resistor (Rs) is chosen to match the trace impedance.

Table 3.2. Nominal Output Impedance vs. OUTx_CMOS_DRV (register)

VDDO CMOS_DRIVE_Selection

OUTx_CMOS_DRV=1 OUTx_CMOS_DRV=2 OUTx_CMOS_DRV=3

3.3 V 38 Ω 30 Ω 22 Ω

2.5 V 43 Ω 35 Ω 24 Ω

1.8 V — 46 Ω 31 Ω

Note: Refer to the Si5340/41 Family Reference Manual for more information on register settings.

3.5.6 LVCMOS Output Signal Swing

The signal swing (VOL/VOH) of the LVCMOS output drivers is set by the voltage on the VDDO pins. Each output driver has its own

VDDO pin allowing a unique output voltage swing for each of the LVCMOS drivers.

3.5.7 LVCMOS Output Polarity

When a driver is configured as an LVCMOS output it generates a clock signal on both pins (OUTx and OUTxb). By default the clock on

the OUTxb pin is generated with complementary polarity with the clock on the OUTx pin. The LVCMOS OUTx and OUTxb outputs can

also be generated in phase.

3.5.8 Output Enable/Disable

The OEb pin provides a convenient method of disabling or enabling the output drivers. When the OEb pin is held high all outputs will be

disabled. When held low, the outputs will be enabled. Outputs in the enabled state can be individually disabled through register control.

3.5.9 Output Driver State When Disabled

The disabled state of an output driver is configurable as: disable low or disable high.

Si5341/40 Rev D Data Sheet

Functional Description

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AAAAA _____

3.5.10 Synchronous/Asynchronous Output Disable Feature

Outputs can be configured to disable synchronously or asynchronously. The default state is synchronous output disable. In synchro-

nous disable mode the output will wait until a clock period has completed before the driver is disabled. This prevents unwanted runt

pulses from occurring when disabling an output. In asynchronous disable mode the output clock will disable immediately without waiting

for the period to complete.

3.5.11 Output Delay Control (t0-t4)

The Si5341/40 uses independent MultiSynth dividers (N0 - N4) to generate up to 5 unique frequencies to its 10 outputs through a cross-

point switch. By default all clocks are phase aligned. A delay path (t0 - t4) associated with each of these dividers is available for applica-

tions that need a specific output skew configuration. Each delay path is controlled by a register parameter call Nx_DELAY with a resolu-

tion of ~0.28 ps over a range of ~±9.14 ns. This is useful for PCB trace length mismatch compensation. After the delay controls are

configured, the soft reset bit SOFT_RST must be set high so that the output delay takes effect and the outputs are re-aligned.

÷N0t0

÷N1t1

÷N2t2

÷N3t3

÷N4t4

OUT2b

VDDO2

OUT2

VDDO3

÷R

OUT3b

OUT3

÷R

OUT1b

VDDO1

OUT1

÷R

OUT5b

VDDO5

OUT5

VDDO6

÷R

OUT6b

OUT6

÷R

OUT4b

VDDO4

OUT4

÷R

OUT7b

VDDO7

OUT7

VDDO8

÷R

OUT8b

OUT8

÷R

OUT0b

VDDO0

OUT0

÷R

VDDO9

OUT9b

OUT9

÷R

Figure 3.7. Example of Independently Configurable Path Delays

All delay values are restored to their NVM programmed values after power-up or after a hard reset. Delay default values can be written

to the NVM allowing a custom delay offset configuration at power-up or after a hardware reset.

Si5341/40 Rev D Data Sheet

Functional Description

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3.5.12 Zero Delay Mode

A zero delay mode is available for applications that require fixed and consistent minimum delay between the selected input and outputs.

The zero delay mode is configured by opening the internal feedback loop through software configuration and closing the loop externally

as shown in the figure below. This helps to cancel out the internal delay introduced by the dividers, the crosspoint, the input, and the

output drivers. Any one of the outputs can be fed back to the FB_IN pins, although using the output driver that achieves the shortest

trace length will help to minimize the input-to-output delay. It is recommended to connect OUT9 (Si5341) or OUT3 (Si5340) to FB_IN for

external feedback. The FB_IN input pins must be terminated and ac-coupled when zero delay mode is used. A differential external

feedback path connection is necessary for best performance.

Zero Delay

Mode

Si5341

IN_SEL[1:0]

IN0

IN0b

IN1

IN1b

IN2

IN2b

÷P0

÷P1

÷P2

OUT0b

VDDO0

OUT0

OUT2b

VDDO2

OUT2

OUT3b

VDDO3

OUT3

OUT7b

VDDO7

OUT7

OUT8b

VDDO8

OUT8

OUT9b

VDDO9

OUT9

OUT1b

VDDO1

OUT1

MultiSynth

& Dividers

FB_IN

FB_INb

100

External Feedback Path

LPF

÷Mn

÷N9n

N9d ÷R9

fFB = fIN

fIN

÷Pfb

PLL

Figure 3.8. Si5341 Zero Delay Mode Setup

3.5.13 Sync Pin (Synchronizing R Dividers)

All the output R dividers are reset to the default NVM register state after a power-up or a hard reset. This ensures consistent and re-

peatable phase alignment across all output drivers to within ±100 ps of the expected value from the NVM download. Resetting the de-

vice using the RSTb pin or asserting the hard reset bit will have the same result. The SYNCb pin provides another method of re-aligning

the R dividers without resetting the device, however, the outputs will only align to within 50 ns when using the SYNCb pin. This pin is

positive edge triggered. Asserting the sync register bit provides the same function as the SYNCb pin. A soft reset will align the outputs

to within ±100 ps of the expected value based upon the Nx_DELAY parameter.

3.5.14 Output Crosspoint

The output crosspoint allows any of the N dividers to connect to any of the clock outputs.

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3.5.15 Digitally Controlled Oscillator (DCO) Modes

Each MultiSynth can be digitally controlled so that all outputs connected to the MultiSynth change frequency in real time without any

transition glitches. There are two ways to control the MultiSynth to accomplish this task:

• Use the Frequency Increment/Decrement Pins or register bits.

• Write directly to the numerator of the MultiSynth divider.

An output that is controlled as a DCO is useful for simple tasks such as frequency margining or CPU speed control. The output can also

be used for more sophisticated tasks such as FIFO management by adjusting the frequency of the read or write clock to the FIFO or

using the output as a variable Local Oscillator in a radio application.

3.5.15.1 DCO with Frequency Increment/Decrement Pins/Bits

Each of the MultiSynth fractional dividers can be independently stepped up or down in predefined steps with a resolution as low as

0.001 ppb. Setting of the step size and control of the frequency increment or decrement is accomplished by setting the step size with

the 44 bit Frequency Step Word (FSTEPW). When the FINC or FDEC pin or register bit is asserted the output frequency will increment

or decrement respectively by the amount specified in the FSTEPW.

3.5.15.2 DCO with Direct Register Writes

When a MultiSynth numerator and its corresponding update bit is written, the new numerator value will take effect and the output fre-

quency will change without any glitches. The MultiSynth numerator and denominator terms can be left and right shifted so that the least

significant bit of the numerator word represents the exact step resolution that is needed for your application.

3.6 Power Management

Several unused functions can be powered down to minimize power consumption. Consult the Si5340/41 Family Reference Manual and

ClockBuilder Pro configuration utility for details.

3.7 In-Circuit Programming

The Si5341/40 is fully configurable using the serial interface (I2C or SPI). At power-up the device downloads its default register values

from internal non-volatile memory (NVM). Application specific default configurations can be written into NVM allowing the device to gen-

erate specific clock frequencies at power-up. Writing default values to NVM is in-circuit programmable with normal operating power sup-

ply voltages applied to its VDD and VDDA pins. The NVM is two time writable. Once a new configuration has been written to NVM, the

old configuration is no longer accessible. Refer to the Si5340/41 Family Reference Manual for a detailed procedure for writing registers

to NVM.

3.8 Serial Interface

Configuration and operation of the Si5341/40 is controlled by reading and writing registers using the I2C or SPI interface. The I2C_SEL

pin selects I2C or SPI operation. Communication with both 3.3 V and 1.8 V host is supported. The SPI mode operates in either 4-wire or

3-wire. See the Si5340/41 Family Reference Manual for details.

3.9 Custom Factory Preprogrammed Devices

For applications where a serial interface is not available for programming the device, custom pre-programmed parts can be ordered

with a specific configuration written into NVM. A factory pre-programmed device will generate clocks at power-up. Custom, factory-pre-

programmed devices are available. Use the ClockBuilder Pro custom part number wizard (www.silabs.com/clockbuilderpro) to quickly

and easily request and generate a custom part number for your configuration. In less than three minutes, you will be able to generate a

custom part number with a detailed data sheet addendum matching your design’s configuration. Once you receive the confirmation

email with the data sheet addendum, simply place an order with your local Silicon Labs sales representative. Samples of your pre-pro-

grammed device will ship to you typically within two weeks.

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3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory Pre-Programmed Devices

As with essentially all software utilities, ClockBuilder Pro is continuously updated and enhanced. By registering at http://

www.silabs.comand opting in for updates to software, you will be notified whenever changes are made and what the impact of those

changes are. This update process will ultimately enable ClockBuilder Pro users to access all features and register setting values docu-

mented in this data sheet and the Si5341/40 Family Reference Manual. However, if you must enable or access a feature or register

setting value so that the device starts up with this feature or a register setting, but the feature or register setting is NOT yet available in

CBPro, you must contact a Silicon Labs applications engineer for assistance. An example of this type of feature or custom setting is the

customizable amplitudes for the clock outputs. After careful review of your project file and custom requirements, a Silicon Labs applica-

tions engineer will email back your CBPro project file with your specific features and register settings enabled, using what is referred to

as the manual "settings override" feature of CBPro. "Override" settings to match your request(s) will be listed in your design report file.

Examples of setting "overrides" in a CBPro design report are shown below:

Table 3.3. Setting Overrides

Location Name Type Target Dec Value Hex Value

0128[6:4] OUT6_AMPL User OPN & EVB 5 5

Once you receive the updated design file, simply open it in CBPro. After you create a custom OPN, the device will begin operation after

startup with the values in the NVM file, including the Silicon Labs-supplied override settings.

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/\ \ V Contact Silicon Labs Technical Suggort /

Do I need a

pre-programmed device with

a feature or setting which is

unavailable in ClockBuilder

Pro?

Yes

Contact Silicon Labs

Technical Support

to submit & review

your

non-standard

configuration

request & CBPro

project file

Configure device

using CBPro

Load project file

into CBPro and test

Receive

updated CBPro

project file

from

Silicon Labs

with “Settings

Override”

Generate

Custom OPN

in CBPro

Does the updated

CBPro Project file

match your

requirements?

Yes

End: Place

sample order

Start

Figure 3.9. Flowchart to Order Custom Parts with Features not Available in CBPro

Note: Contact Silicon Labs Technical Support at www.silabs.com/support/Pages/default.aspx.

Si5341/40 Rev D Data Sheet

Functional Description

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 14

4. Register Map

The register map is divided into multiple pages where each page has 256 addressable registers. Page 0 contains frequently accessible

registers such as alarm status, resets, device identification, etc. Other pages contain registers that need less frequent access such as

frequency configuration, and general device settings. A high level map of the registers is shown in 4.2 High-Level Register Map. Refer

to the Si5340/41 Family Reference Manual for a complete list of register descriptions and settings.

4.1 Addressing Scheme

The device registers are accessible using a 16-bit address which consists of an 8-bit page address + 8-bit register address. By default

the page address is set to 0x00. Changing to another page is accomplished by writing to the ‘Set Page Address’ byte located at ad-

dress 0x01 of each page.

Si5341/40 Rev D Data Sheet

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4.2 High-Level Register Map

Table 4.1. High-Level Register Map

16-Bit Address Content

8-bit Page Address 8-bit Register Address Range

00 00 Revision IDs

01 Set Page Address

02-0A Device IDs

0B-15 Alarm Status

17-1B INTR Masks

1C Reset controls

2C-E1 Alarm Configuration

E2-E4 NVM Controls

FE Device Ready Status

01 01 Set Page Address

08-3A Output Driver Controls

41-42 Output Driver Disable Masks

FE Device Ready Status

02 01 Set Page Address

02-05 XTAL Frequency Adjust

08-2F Input Divider (P) Settings

30 Input Divider (P) Update Bits

35-3D PLL Feedback Divider (M) Settings

3E PLL Feedback Divider (M) Update Bit

47-6A Output Divider (R) Settings

6B-72 User Scratch Pad Memory

FE Device Ready Status

03 01 Set Page Address

02-37 MultiSynth Divider (N0-N4) Settings

0C MultiSynth Divider (N0) Update Bit

17 MultiSynth Divider (N1) Update Bit

22 MultiSynth Divider (N2) Update Bit

2D MultiSynth Divider (N3) Update Bit

38 MultiSynth Divider (N4) Update Bit

39-58 FINC/FDEC Settings N0-N4

59-62 Output Delay (Dt) Settings

63-94 Frequency Readback N0-N4

FE Device Ready Status

Si5341/40 Rev D Data Sheet

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16-Bit Address Content

8-bit Page Address 8-bit Register Address Range

04-08 00-FF Reserved

09 01 Set Page Address

49 Input Settings

1C Zero Delay Mode Settings

A0-FF 00-FF Reserved

Si5341/40 Rev D Data Sheet

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5. Electrical Specifications

Table 5.1. Recommended Operating Conditions1

(VDD=1.8 V ± 5%, VDDA=3.3 V ± 5%, TA= –40 to 85°C)

Parameter Symbol Min Typ Max Units

Ambient Temperature TA–40 25 85 °C

Junction Temperature TJMAX — — 125 °C

Core Supply Voltage VDD 1.71 1.80 1.89 V

VDDA 3.14 3.30 3.47 V

Output Driver Supply Voltage VDDO 3.14 3.30 3.47 V

2.37 2.50 2.62 V

1.71 1.80 1.89 V

Note:

1. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical val-

ues apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted.

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 18

Table 5.2. DC Characteristics

(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, VDDO=1.8V ± 5%, 2.5V ± 5%, or 3.3V ± 5%, TA= -40 to 85°C)

Parameter Symbol Test Condition Min Typ Max Units

Core Supply Current1, 2 IDD Si5340/41 — 115 230 mA

IDDA Si5340/41 — 120 130 mA

Output Buffer Supply Current IDDOx LVPECL Output3

@ 156.25 MHz

— 22 26 mA

LVDS Output3

@ 156.25 MHz

— 15 18 mA

3.3 V LVCMOS4 output

@ 156.25 MHz

— 22 30 mA

2.5 V LVCMOS4 output

@ 156.25 MHz

— 18 23 mA

1.8 V LVCMOS4 output

@ 156.25 MHz

— 12 16 mA

Total Power Dissipation1, 5 PdSi5341 — 880 1150 mW

Si5340 — 680 875 mW

Note:

1. Si5341 test configuration: 7 x 2.5 V LVDS outputs enabled @ 156.25 MHz. Excludes power in termination resistors.

2. Si5340 test configuration: 4 x 2.5 V LVDS outputs enabled @ 156.25 MHz. Excludes power in termination resistors.

3. Differential outputs terminated into an ac-coupled 100 Ω load.

4. LVCMOS outputs measured into a 6-inch 50 W PCB trace with 5 pF load. The LVCMOS outputs were set to

OUTx_CMOS_DRV=3, which is the strongest driver setting. Refer to the Si5341/40 Family Reference Manual for more details on

100

OUT

OUTb

IDDO

Differential Output Test Configuration

0. 1 uF

OUTa

IDDO

5 pF

LVCMOS Output Test Configuration

6 inch

OUTb

5. Detailed power consumption for any configuration can be estimated using ClockBuilderPro when an evaluation board (EVB) is not

available. All EVBs support detailed current measurements for any configuration.

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 19

Table 5.3. Input Clock Specifications

(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, TA=-40 to 85°C)

Parameter Symbol Test Condition Min Typ Max Units

Standard Input Buffer with Differential or Single-Ended - AC-Coupled (IN0/IN0b, IN1/IN1b, IN2/IN2b, FB_IN/FB_INb)

Input Frequency Range fIN Differential 0.008 — 750 MHz

All Single-ended Signals

(including LVCMOS)

0.008 — 250 MHz

Input Voltage Swing1VIN Differential AC-coupled

fIN < 250 MHz

100 — 1800 mVpp_se

Differential AC-coupled

250 MHz < fIN < 750 MHz

225 — 1800 mVpp_se

Single-ended AC-coupled

fIN < 250 MHz

100 — 3600 mVpp_se

Slew Rate2, 3 SR 400 — — V/μs

Duty Cycle DC 40 — 60 %

Input Capacitance CIN — 0.3 — pF

Input Resistance RIN — 16 — kΩ

Pulsed CMOS Input Buffer - DC Coupled (IN0, IN1, IN2)4

Input Frequency fIN 0.008 — 250 MHz

Input Voltage VIL –0.2 — 0.4 V

VIH 0.8 — — V

Slew Rate2, 3 SR 400 — — V/μs

Duty Cycle DC Clock Input 40 — 60 %

Minimum Pulse Width PW Pulse Input 1.6 — — ns

Input Resistance RIN — 8 — kΩ

REFCLK (Applied to XA/XB)

Input Frequency Range fIN Full operating range. Jitter

performance may be re-

duced.

10 — 200 MHz

Range for best jitter. 48 — 54 MHz

Input Single-ended Voltage

Swing

VIN_SE 365 — 2000 mVpp_se

Input Differential Voltage Swing VIN_DIFF 365 — 2500 mVpp_diff

Slew Rate2, 3 SR Imposed for best jitter per-

formance

400 — — V/μs

Input Duty Cycle DC 40 — 60 %

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 20

ﬁ§ PHI

Parameter Symbol Test Condition Min Typ Max Units

Note:

1. Voltage swing is specified as single-ended mVpp.

Vpp_se

Vpp_diff = 2*Vpp_se

Vcm

2. Imposed for jitter performance.

3. Pulsed CMOS mode is intended primarily for single-ended LVCMOS input clocks < 1 MHz, which must be dc-coupled because

they have a duty cycle significantly less than 50%. A typical application example is a low frequency video frame sync pulse. Since

the input thresholds (VIL, VIH) of this buffer are non-standard (0.4 and 0.8 V, respectively), refer to the input attenuator circuit for

DC-coupled Pulsed LVCMOS in the Family Reference Manual. Otherwise, for standard LVCMOS input clocks, use the Standard

AC-Coupled, Single-ended input mode.

4. DC-coupled CMOS Input Buffer selection is not supported in ClockBuilder Pro for new designs. For single-ended LVCMOS inputs

to IN0,1,2 it is required to ac-couple into the differential input buffer.

Table 5.4. Control Input Pin Specifications

(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, VDDS=3.3V ± 5%, 1.8V ± 5%, TA=-40 to 85°C)

Parameter Symbol Test Condition Min Typ Max Units

Si5341 Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, SYNCb, A1, SCLK, A0/CSb, FINC, FDEC, SDA/SDIO)

Input Voltage VIL — — 0.3xVDDIO1V

VIH 0.7xVDDIO1— — V

Input Capacitance CIN — 2 — pF

Input Resistance RIN — 20 — kW

Minimum Pulse Width TPW RSTb, SYNCb, FINC, and

FDEC

100 — — ns

Frequency Update Rate FUR FINC and FDEC — — 1 MHz

Si5340 Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, A1, SCLK, A0/CSb, SDA/SDIO)

Input Voltage VIL — — 0.3xVDDIO1V

VIH 0.7xVDDIO1— — V

Input Capacitance CIN — 2 — pF

Input Resistance RIN — 20 — kW

Minimum Pulse Width TPW RSTb only 100 — — ns

Note:

1. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. Refer to the Family Reference Manual for more

details on register settings.

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 21

Table 5.5. Differential Clock Output Specifications

(VDD=1.8 V ± 5%, VDDA=3.3V ± 5%, VDDO=1.8 V ± 5%, 2.5 V ± 5%, or 3.3 V ± 5%, TA= -40 to 85°C)

Parameter Symbol Test Condition Min Typ Max Units

Output Frequency fOUT MultiSynth not used 0.0001 — 720 MHz

733.33 — 800.00

825 — 1028

MultiSynth used 0.0001 — 720 MHz

Duty Cycle DC fOUT < 400 MHz 48 — 52 %

400 MHz < fOUT < 1028 MHz 45 — 55 %

Output-Output Skew

Using Same MultiSynth

TSKS Outputs on same MultiSynth

(Measured at 712.5 MHz)

— — 65 ps

Output-Output Skew

Between MultiSynths

TSKD Outputs from different

MultiSynths

(Measured at 712.5 MHz)

— — 90 ps

OUT-OUTb Skew TSK_OUT Measured from the positive

to negative output pins

— 0 50 ps

Output Voltage Swing1VOUT LVDS 350 430 510 mVpp_se

LVPECL 640 750 900

Common Mode Voltage1, 2 VCM VDDO = 3.3 V LVDS 1.10 1.2 1.3 V

LVPECL 1.90 2.0 2.1

VDDO = 2.5 V LVPECL

LVDS

1.1 1.2 1.3

VDDO = 1.8 V Sub-LVDS 0.8 0.9 1.0

Rise and Fall Times

(20% to 80%)

tR/tF— 100 150 ps

Differential Output Impedance ZO— 100 — Ω

Power Supply Noise Rejection2PSRR 10 kHz sinusoidal noise — –101 — dBc

100 kHz sinusoidal noise — –96 —

500 kHz sinusoidal noise — –99 —

1 MHz sinusoidal noise — –97 —

Output-Output Crosstalk3XTALK Si5341 — –72 — dBc

Si5340 — –88 — dBc

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 22

E1; FEE

Parameter Symbol Test Condition Min Typ Max Units

Notes:

1. Output amplitude and common-mode settings are programmable through register settings and can be stored in NVM. Each out-

put driver can be programmed independently. The maximum LVDS single-ended amplitude can be up to 110 mV higher than the

TIA/EIA-644 maximum. Refer to the Si5341/40 Family Reference Manual for more suggested output settings. Not all combina-

tions of voltage amplitude and common mode voltages settings are possible.

OUTxb

OUTx

Vpp_se

Vpp_ diff = 2*Vpp_se

Vcm

2. Measured for 156.25 MHz carrier frequency. 100 mVpp sinewave noise added to VDDO = 3.3 V and noise spur amplitude meas-

ured.

3. Measured across two adjacent outputs, both in LVDS mode, with the victim running at 155.52 MHz and the aggressor at 156.25

MHz. Refer to application note, AN862: Optimizing Si534x Jitter Performance in Next Generation Internet Infrastructure Systems,

guidance on crosstalk minimization.

Table 5.6. LVCMOS Clock Output Specifications

(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, VDDO=1.8V ± 5%, 2.5V ± 5%, or 3.3V ± 5%, TA= -40 to 85°C)

Parameter Symbol Test Condition Min Typ Max Units

Output Frequency 0.0001 — 250 MHz

Duty Cycle DC fOUT < 100 MHz 48 — 52 %

100 MHz < fOUT < 250 MHz 45 — 55

Output-to-Output Skew TSK Outputs on same MultiSynth.

FOUT = 156.25 MHz

— 30 140 ps

Output Voltage High1, 2, 3 VOH VDDO = 3.3 V

OUTx_CMOS_DRV=1 IOH = -10 mA VDDO x 0.85 — — V

OUTx_CMOS_DRV=2 IOH = -12 mA — —

OUTx_CMOS_DRV=3 IOH = -17 mA — —

VDDO = 2.5 V

OUTx_CMOS_DRV=1 IOH = -6 mA VDDO x 0.85 — — V

OUTx_CMOS_DRV=2 IOH = -8 mA — —

OUTx_CMOS_DRV=3 IOH = -11 mA — —

VDDO = 1.8 V

OUTx_CMOS_DRV=2 IOH = -4 mA VDDO x 0.85 — — V

OUTx_CMOS_DRV=3 IOH = -5 mA — —

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 23

an. , 1|~ :1 l T WWW-:1 l f

Parameter Symbol Test Condition Min Typ Max Units

Output Voltage Low1, 2, 3 VOL VDDO = 3.3 V

OUTx_CMOS_DRV=1 IOL = 10 mA — — VDDO x 0.15 V

OUTx_CMOS_DRV=2 IOL = 12 mA — —

OUTx_CMOS_DRV=3 IOL = 17 mA — —

VDDO = 2.5 V

OUTx_CMOS_DRV=1 IOL = 6 mA — — VDDO x 0.15 V

OUTx_CMOS_DRV=2 IOL = 8 mA — —

OUTx_CMOS_DRV=3 IOL = 11 mA — —

VDDO = 1.8 V

OUTx_CMOS_DRV=2 IOL = 4 mA — — VDDO x 0.15 V

OUTx_CMOS_DRV=3 IOL = 5 mA — —

LVCMOS Rise and Fall

Times3

(20% to 80%)

tr/tf VDDO = 3.3V — 400 600 ps

VDDO = 2.5 V — 450 600 ps

VDDO = 1.8 V — 550 750 ps

Notes:

1. Driver strength is a register programmable setting and stored in NVM. Options are OUTx_CMOS_DRV = 1, 2, 3. Refer to the

Family Reference Manual for more details on register settings.

2. IOL/IOH is measured at VOL/VOH as shown in the dc test configuration.

3. A series termination resistor (Rs) is recommended to help match the source impedance to a 50 W PCB trace. A 5 pF capacitive

load is assumed. The LVCMOS outputs were set to OUTx_CMOS_DRV = 3.

IOL/IOH

VOL/VOH

OUT

OUTb

IDDO

Trace length 5 inches

4.7 pF

499

AC Test Configuration

50 probe, scope

DC Block

DC Test Configuration

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 24

Table 5.7. Output Status Pin Specifications

(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, VDDS= 3.3V ± 5%, 1.8V ± 5%, TA= -40 to 85°C)

Parameter Symbol Test Condition Min Typ Max Units

Si5341/40 Status Output Pins (INTRb, SDA/SDIO)1

Output Voltage VOH IOH = -2 mA VDDIO2 x

0.85

— — V

VOL IOL = 2 mA — — VDDIO2x

0.15

Si5341 Status Output Pins (LOLb)

Output Voltage VOH IOH = -2 mA VDDIO2 x

0.85

— — V

VOL IOL = 2 mA — — VDDIO2 x

0.15

Si5340 Status Output Pins (LOLb, LOS_XAXBb)

Output Voltage VOH IOH = -2 mA VDDS x 0.85 — — V

VOL IOL = 2 mA — — VDDSx 0.15 V

Notes:

1. The VOH specification does not apply to the open-drain SDA/SDIO output when the serial interface is in I2C mode or is unused

with I2C_SEL pulled high. VOL remains valid in all cases.

2. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. Refer to the Family Reference Manual for more

details on register settings.

Table 5.8. Performance Characteristics

(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, TA= -40 to 85°C)

Parameter Symbol Test Condition Min Typ Max Units

VCO Frequency Range FVCO 13.5 — 14.4 GHz

PLL Loop Bandwidth fBW — 1.0 — MHz

Initial Start-Up Time tSTART Time from power-up to

when the device gener-

ates clocks (Input Fre-

quency >48 MHz)

— 30 45 ms

PLL Lock Time1tACQ fIN = 19.44 MHz 15 — 150 ms

Output Delay Adjustment tDELAY_frac fVCO = 14 GHz

Delay is controlled by the

MultiSynth

—0.28 — ps

tDELAY_int — 71.4 — ps

tRANGE — ±9.14 — ns

POR2 to Serial Interface Ready tRDY — — 15 ms

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 25

Parameter Symbol Test Condition Min Typ Max Units

Jitter Generation Locked to Ex-

ternal Clock3

JGEN Integer Mode4

12 kHz to 20 MHz

— 140 180 fs rms

Fractional/DCO Mode5

12 kHz to 20 MHz

— 160 210 fs rms

JPER Derived from integrated

phase noise

— 110 — fs pk-pk

JCC — 180 — fs pk

JPER N = 10,000 cycles Integer

or Fractional Mode4, 5 .

Measured in the time do-

main. Performance is limi-

ted by the noise floor of

the equipment.

— 7400 — fs pk-pk

JCC — 6700 — fs pk

Jitter Generation Locked to Ex-

ternal XTAL

XTAL Frequency = 48 MHz

JGEN Integer Mode4

12 kHz to 20 MHz

— 90 140 fs rms

Fractional/DCO Mode5

12 kHz to 20 MHz

— 115 170 fs rms

JPER Derived from integrated

phase noise

— 110 — fs pk-pk

JCC — 180 — fs pk

JPER N = 10, 000 cycles Integer

or Fractional Mode.4, 5

Measured in the time do-

main. Performance is limi-

ted by the noise floor of

the equipment.

— 7400 — fs pk-pk

JCC — 6600 — fs pk

XTAL Frequency = 25 MHz

JGEN Integer Mode4

12 kHz to 20 MHz

115 140 fs rms

Fractional Mode5

12 kHz to 20 MHz

140 190 fs rms

Notes:

1. PLL lock time is measured by first letting the PLL lock, then turning off the input clock, and then turning on the input clock. The

time from the first edge of the input clock being re-applied until LOL de-asserts is the PLL lock time.

2. Measured as time from valid VDD and VDD33 rails (90% of their value) to when the serial interface is ready to respond to com-

mands. Measured in SPI 4-wire mode, with SCLK @ 10 MHz.

3. Jitter generation test conditions fIN = 100 MHz, fOUT = 156.25 MHz LVPECL.

4. Integer mode assumes that the output dividers (Nn/Nd) are configured with an integer value.

5. Fractional and DCO modes assume that the output dividers (Nn/Nd) are configured with a fractional value and the feedback divid-

er is integer.

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 26

Table 5.9. I2C Timing Specifications (SCL,SDA)

Parameter Symbol Test Condition Standard Mode

100 kbps

Fast Mode

400 kbps

Units

Min Max Min Max

SCL Clock Frequency fSCL — 100 — 400 kHz

Hold Time (Repeated)

START Condition

tHD:STA 4.0 — 0.6 — μs

Low Period of the SCL Clock tLOW 4.7 — 1.3 — μs

HIGH Period of the SCL

Clock

tHIGH 4.0 — 0.6 — μs

Set-up Time for a Repeated

START Condition

tSU:STA 4.7 — 0.6 — μs

Data Hold Time tHD:DAT 100 — 100 — ns

Data Set-up Time tSU:DAT 250 — 100 — ns

Rise Time of Both SDA and

SCL Signals

tr— 1000 20 300 ns

Fall Time of Both SDA and

SCL Signals

tf— 300 — 300 ns

Set-up Time for STOP Con-

dition

tSU:STO 4.0 — 0.6 — μs

Bus Free Time between a

STOP and START Condition

tBUF 4.7 — 1.3 — μs

Data Valid Time tVD:DAT — 3.45 — 0.9 μs

Data Valid Acknowledge

Time

tVD:ACK — 3.45 — 0.9 μs

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 27

Figure 5.1. I2C Serial Port Timing Standard and Fast Modes

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 28

Table 5.10. SPI Timing Specifications (4-Wire)

(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, TA= -40 to 85°C)

Parameter Symbol Min Typ Max Units

SCLK Frequency fSPI — — 20 MHz

SCLK Duty Cycle TDC 40 — 60 %

SCLK Period TC50 — — ns

Delay Time, SCLK Fall to SDO Active TD1 — 12.5 18 ns

Delay Time, SCLK Fall to SDO TD2 — 10 15 ns

Delay Time, CSb Rise to SDO Tri-State TD3 — 10 15 ns

Setup Time, CSb to SCLK TSU1 5 — — ns

Hold Time, CSb to SCLK Rise TH1 5 — — ns

Setup Time, SDI to SCLK Rise TSU2 5 — — ns

Hold Time, SDI to SCLK Rise TH2 5 — — ns

Delay Time Between Chip Selects (CSb) TCS 2 — — TC

SCLK

CSb

SDI

SDO

TSU1 TD1

TSU2

TD2

TCS

TD3

TH2

TH1

Figure 5.2. 4-Wire SPI Serial Interface Timing

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 29

w + IHIi

Table 5.11. SPI Timing Specifications (3-Wire)

(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, TA= -40 to 85°C)

Parameter Symbol Min Typ Max Units

SCLK Frequency fSPI — — 20 MHz

SCLK Duty Cycle TDC 40 — 60 %

SCLK Period TC50 — — ns

Delay Time, SCLK Fall to SDO Turn-on TD1 — 12.5 20 ns

Delay Time, SCLK Fall to SDO Next-bit TD2 — 10 15 ns

Delay Time, CSb Rise to SDO Tri-State TD3 — 10 15 ns

Setup Time, CSb to SCLK TSU1 5 — — ns

Hold Time, CSb to SCLK Rise TH1 5 — — ns

Setup Time, SDI to SCLK Rise TSU2 5 — — ns

Hold Time, SDI to SCLK Rise TH2 5 — — ns

Delay Time Between Chip Selects (CSb) TCS 2 — — TC

SCLK

CSb

SDIO

TSU1

TD1

TSU2

TD2

TCS

TD3

TH2

TH1

Figure 5.3. 3-Wire SPI Serial Interface Timing

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 30

Table 5.12. Crystal Specifications

Parameter Symbol Test Condition Min Typ Max Units

Crystal Frequency Range fXTAL Full operating range. Jitter per-

formance may be reduced.

24.97 — 54.06 MHz

Range for best jitter. 48 — 54 MHz

Load Capacitance CL— 8 — pF

Crystal Drive Level dL— — 200 μW

Equivalent Series Resistance

Shunt Capacitance

rESR

Refer to the Si5341/40 Family Reference Manual to determine ESR and shunt ca-

pacitance.

Note:

1. Refer to the Si5341/40 Family Reference Manual for recommended 48 to 54 MHz crystals. The Si5341/40 are designed to work

with crystals that meet these specifications.

Table 5.13. Thermal Characteristics

Parameter Symbol Test Condition1Value Units

Si5341 - 64QFN

Thermal Resistance

Junction to Ambient

ϴJA Still Air 22 °C/W

Air Flow 1 m/s 19.4

Air Flow 2 m/s 18.3

Thermal Resistance

Junction to Case

ϴJC 9.5

Thermal Resistance

Junction to Board

ϴJB 9.4

ΨJB 9.3

Thermal Resistance

Junction to Top Center

ΨJT 0.2

Si5340 - 44QFN

Thermal Resistance

Junction to Ambient

ϴJA Still Air 22.3 °C/W

Air Flow 1 m/s 19.4

Air Flow 2 m/s 18.4

Thermal Resistance

Junction to Case

ϴJC 10.9

Thermal Resistance

Junction to Board

ϴJB 9.3

ΨJB 9.2

Thermal Resistance

Junction to Top Center

ΨJT 0.23

Note:

1. Based on PCB Dimension: 3 x 4.5 mm, PCB Land/Via under GND pad: 36, Number of Cu Layers: 4

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 31

Table 5.14. Absolute Maximum Ratings1, 2, 3, 4

Parameter Symbol Test Condition Value Units

Storage Temperature Range TSTG -55 to +150 °C

DC Supply Voltage VDD -0.5 to 3.8 V

VDDA -0.5 to 3.8 V

VDDO5-0.5 to 3.8 V

Input Voltage Range VI1 IN0-IN2, FB_IN -0.85 to 3.8 V

VI2 IN_SEL[1:0], RSTb, OEb,

SYNCb, I2C_SEL, SDI, SCLK,

A0/CSb, A1, SDA/SDIO, FINC/

FDEC

-0.5 to 3.8 V

VI3 XA/XB -0.5 to 2.7 V

Latch-up Tolerance LU JESD78 Compliant

ESD Tolerance HBM 100 pF, 1.5 kΩ 2.0 kV

Maximum Junction Temperature in Operation TJCT 125 °C

Soldering Temperature (Pb-free profile)5TPEAK 260 °C

Soldering Temperature Time at TPEAK

(Pb-free profile)5

TP20 to 40 sec

Notes:

1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to

the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for ex-

tended periods may affect device reliability.

2. 64-QFN and 44-QFN packages are RoHS-6 compliant.

3. Moisture sensitivity level is MSL2. For more packaging information, go to the Silicon Labs RoHS information page.

4. The minimum voltage at these pins can be as low as –1.0 V when an AC input signal of 10 MHz or greater is applied. See Table

5.3 Input Clock Specifications on page 20 spec for single-ended AC-coupled fIN < 250 MHz.

5. The device is compliant with JEDEC J-STD-020.

Si5341/40 Rev D Data Sheet

Electrical Specifications

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 32

6. Typical Application Schematic

25 MHz

“Traditional Discrete” Clock Tree

Level

Translator

Clock

Generator

161.1328125

MHz

Buffer

133.33 MHz

Buffer

One Si5341 replaces:

3x crystal oscillators (XO)

2x buffers

1x Clock Generator

2x level translators

1x delay line

“Clock Tree

On-a-Chip”

25 MHz 200 MHz

2.5V LVCMOS

2x 161.1328125 MHz

LVDS

2x 133.33 MHz

1.8V LVCMOS

Buffer

125 MHz

Level

Translator

Buffer

Delay Line

4x 125 MHz

3.3V LVCMOS

3x 125 MHz

LVPECL

Si5341

1x 161.1328125 MHz

LVDS

1x 161.1328125 MHz

LVDS

2x 133.33 MHz

1.8V LVCMOS

2x 125 MHz

3.3V LVCMOS

2x 125 MHz

3.3V LVCMOS

2x 200 MHz

2.5V LVCMOS

2x 200 MHz

2.5V LVCMOS

1x 125 MHz

LVPECL

1x 125 MHz

LVPECL

1x 125 MHz

LVPECL

Figure 6.1. Using the Si5341 to Replace a Traditional Clock Tree

Si5341/40 Rev D Data Sheet

Typical Application Schematic

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 33

7. Detailed Block Diagrams

VDD

VDDA

SDA/ SDIO

A1/ SDO

SCLK

A0/ CSb

I2C_ SEL

SPI /

I2CNVM

RSTb

Zero Delay

Mode

FB_IN

FB_ INb

OEb

Si5341

Generator

Clock

÷R0

÷R2

÷R3

÷R4

÷R5

÷R6

÷R7

÷R8

÷R9

÷R1

OUT0b

VDDO0

OUT0

OUT2b

VDDO2

OUT2

OUT3b

VDDO3

OUT3

OUT4b

VDDO4

OUT4

OUT5b

VDDO5

OUT5

OUT6b

VDDO6

OUT6

OUT7b

VDDO7

OUT7

OUT8b

VDDO8

OUT8

OUT9b

VDDO9

OUT9

OUT1b

VDDO1

OUT1

÷Pfb

LPF

÷Mn

PLL

IN_SEL[1:0]

÷P2

÷P1

÷P0

IN0

IN0b

IN1

IN1b

IN2

IN2b

FDEC

FINC

Frequency

Control

÷N0n

N0d

÷N2n

N2d

÷N3n

N3d

÷N4n

N4d

÷N1n

N1d t1

MultiSynth

SYNCb

Dividers/

Drivers

Status

Monitors

LO Lb

INTRb

OSC

÷PXAXB

25-54 MHz

XTAL

Figure 7.1. Si5341 Block Diagram

Si5341/40 Rev D Data Sheet

Detailed Block Diagrams

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 34

tit HIM

RSTb

OEb

÷Nn0

Nd0

÷N2n

N2d

÷N3n

N3d

÷Nn1

Nd1 t1

LPF

PLL

LO Lb

I NT Rb

LOSXAB

SDA/SDIO

A1/SDO

SCLK

A0/CSb

I2C_SEL

SPI/

I2CNVM

Status

Monitors

MultiSynth

÷R0

÷R2

÷R3

÷R1

OUT0b

VDDO0

OUT0

OUT2b

VDDO2

OUT2

OUT3b

VDDO3

OUT3

OUT1b

VDDO1

OUT1

Dividers/

Drivers

Zero Delay

Mode

FB_IN

FB_INB ÷P

IN_SEL[1:0]

÷P

IN0

IN0b

IN1

IN1b

IN2

IN2b

25-54 MHz

XTAL OSC

÷P

Si5340

Generator

Clock

VDD

VDDA

XAXB

VDDS

Figure 7.2. Si5340 Detailed Block Diagram

Si5341/40 Rev D Data Sheet

Detailed Block Diagrams

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 35

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8. Typical Operating Characteristics

Figure 8.1. Integer Mode--48 MHz Crystal, 625 MHz Output (2.5 V LVDS)

Si5341/40 Rev D Data Sheet

Typical Operating Characteristics

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 36

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Figure 8.2. Integer Mode--48 MHz Crystal, 156.25 MHz Output (2.5 V LVDS)

Figure 8.3. Fractional Mode--48 MHz Crystal, 155.52 MHz Output (2.5 V LVDS)

Si5341/40 Rev D Data Sheet

Typical Operating Characteristics

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 37

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9. Pin Descriptions

GND

Pad

IN1

IN1b

IN_SEL0

IN_SEL1

SYNCb

RSTb

OEb

INTRb

VDDA

IN2

IN2b

SCLK

A0/CSb

SDA/SDIO

A1/SDO

VDD

RSVD

VDDO0

OUT0b

OUT0

FDEC

OUT1b

OUT1

VDDO2

OUT2b

OUT2

FINC

LOLb

VDD

OUT 6

OUT6b

VDDO6

OUT5

OUT5b

VDDO 5

I2C_SEL

OUT4

OUT4b

VDDO4

OUT3

OUT3b

VDDO 3

VDDO7

OUT7b

OUT7

VDDO8

OUT8b

OUT8

OUT9b

VDDO9

VDD

FB_IN

FB_INb

IN0

IN0b

VDDO1

Si 5341 64QFN

Top View

RSVD

GND

Pad

IN1

IN1b

IN_SEL0

INTRb

OEb

RSTb

VDDA

IN2

A0/CSb

SDA/SDIO

A1/SDO

OUT0b

OUT0

VDDO0

SCLK

I2C_SEL

OUT1

OUT1b

VDDO1

VDDO3

OUT3b

OUT3

FB_IN

FB_INb

IN0

IN0b

Si 5340 44QFN

Top View

VDD

OUT2

OUT2b

VDDO2

VDDS

LOLb

LOS_XAXBb

VDD

IN_SEL1

IN2b 1123

NC 22

VDD

Si5341/40 Rev D Data Sheet

Pin Descriptions

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 38

Table 9.1. Pin Descriptions

Pin Name Pin Number Pin Type1Function

Si5341 Si5340

Inputs

XA 8 5 I Crystal and External Clock Input. These pins are used to con-

nect an external crystal or an external clock. See 3.3.1 XA/XB

Clock and Crystal Input and Figure 3.2 XAXB External Crystal and

Clock Connections on page 5 for connection information. If

IN_SEL[1:0] = 11b, then the XAXB input is selected. If the XAXB

input is not used and powered down, then both inputs can be left

unconnected. ClockBuilder Pro will power down an input that is

set as "Unused".

XB 9 6 I

X1 7 4 I XTAL Shield. Connect these pins directly to the XTAL ground

pins. X1, X2, and the XTAL ground pins must not be connected to

the PCB ground plane. DO NOT GROUND THE CRYSTAL

GROUND PINS. Refer to the Si5341/40 Family Reference Manual

for layout guidelines. These pins should be left disconnected

when connecting XA/XB pins to an external reference clock.

X2 10 7 I

IN0 63 43 I Clock Inputs. These pins accept both differential and single-

ended clock signals. Refer 3.3.2 Input Clocks (IN0, IN1, IN2) for

input termination options. These pins are high-impedance and

must be terminated externally. If both the INx and INx (with over-

strike) inputs are un-used and powered down, then both inputs

can be left floating. ClockBuilder Pro will power down an input that

is set as "Unused".

IN0b 64 44 I

IN1 1 1 I

IN1b 2 2 I

IN2 14 10 I

IN2b 15 11 I

FB_IN 61 41 I External Feedback Input. These pins are used as the external

feedback input (FB_IN/FB_INb) for the optional zero delay mode.

See 3.5.12 Zero Delay Mode for details on the optional zero delay

mode. If FB_IN and FB_IN (with overstrike) are un-used and pow-

ered down, then both inputs can be left floating. ClockBuilder Pro

will power down an input that is set as "Unused".

FB_INb 62 42 I

Si5341/40 Rev D Data Sheet

Pin Descriptions

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 39

Pin Name Pin Number Pin Type1Function

Si5341 Si5340

Outputs

OUT0 24 20 O Output Clocks. These output clocks support a programmable

signal amplitude when configured as a differential output. Desired

output signal format is configurable using register control. Termi-

nation recommendations are provided in 3.5.2 Differential Output

Terminations and 3.5.4 LVCMOS Output Terminations. Unused

outputs should be left unconnected.

OUT0b 23 19 O

OUT1 28 25 O

OUT1b 27 24 O

OUT2 31 31 O

OUT2b 30 30 O

OUT3 35 36 O

OUT3b 34 35 O

OUT4 38 — O

OUT4b 37 — O

OUT5 42 — O

OUT5b 41 — O

OUT6 45 — O

OUT6b 44 — O

OUT7 51 — O

OUT7b 50 — O

OUT8 54 — O

OUT8b 53 — O

OUT9 59 — O

OUT9b 58 — O

Serial Interface

I2C_SEL 39 38 I I2C Select.2 This pin selects the serial interface mode as I2C

(I2C_SEL = 1) or SPI (I2C_SEL = 0). This pin is internally pulled

up by a ~ 20 kΩ resistor to the voltage selected by the

IO_VDD_SEL register bit.

SDA/SDIO 18 13 I/O Serial Data Interface.2 This is the bidirectional data pin (SDA) for

the I2C mode, or the bidirectional data pin (SDIO) in the 3-wire

SPI mode, or the input data pin (SDI) in 4-wire SPI mode. When

in I2C mode, this pin must be pulled-up using an external resistor

of at least 1 kΩ. No pull-up resistor is needed when in SPI mode.

A1/SDO 17 15 I/O Address Select 1/Serial Data Output.2 In I2C mode, this pin

functions as the A1 address input pin and does not have an inter-

nal pull up or pull down resistor. In 4-wire SPI mode this is the se-

rial data output (SDO) pin (SDO) pin and drives high to the volt-

age selected by the IO_VDD_SEL pin.

SCLK 16 14 I Serial Clock Input.2 This pin functions as the serial clock input

for both I2C and SPI modes.This pin is internally pulled up by a

~20 kΩ resistor to the voltage selected by the IO_VDD_SEL regis-

ter bit. In I2C mode this pin should have an external pull up of at

least 1 kΩ. No pull-up resistor is needed when in SPI mode.

Si5341/40 Rev D Data Sheet

Pin Descriptions

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 40

Pin Name Pin Number Pin Type1Function

Si5341 Si5340

A0/CSb 19 16 I Address Select 0/Chip Select.2 This pin functions as the hard-

ware controlled address A0 in I2C mode. In SPI mode, this pin

functions as the chip select input (active low). This pin is internally

pulled up by a ~20 kΩ resistor to the voltage selected by the

IO_VDD_SEL register bit.

Control/Status

INTRb 12 33 O Interrupt. 2 This pin is asserted low when a change in device sta-

tus has occurred. This interrupt has a push pull output and should

be left unconnected when not in use.

RSTb 6 17 I Device Reset. 2 Active low input that performs power-on reset

(POR) of the device. Resets all internal logic to a known state and

forces the device registers to their default values. Clock outputs

are disabled during reset. This pin is internally pulled up with a

~20 kΩ resistor to the voltage selected by the IO_VDD_SEL bit.

OEb 11 12 I Output Enable.2 This pin disables all outputs when held high.

This pin is internally pulled low and can be left unconnected when

not in use.

LOLb 47 — O Loss Of Lock.2 This output pin indicates when the DSPLL™ is

locked (high) or out-of-lock (low). An external pull up or pull down

is not needed.

— 27 O Loss Of Lock.3 This output pin indicates when the DSPLL is

locked (high) or out-of-lock (low). An external pull up or pull down

is not needed.

LOS_XAXBb — 28 O Loss Of Signal.3 This output pin indicates a loss of signal at the

XA/XB pins.

SYNCb 5 — I Output Clock Synchronization.2 An active low signal on this pin

resets the output dividers for the purpose of re-aligning the output

clocks. For a tighter alignment of the clocks, a soft reset should be

applied. This pin is internally pulled up with a ~20 kΩ resistor to

the voltage selected by the IO_VDD_SEL bit and can be left un-

connected when not in use.

FDEC 25 — I Frequency Decrement Pin.2 This pin is used to step-down the

output frequency of a selected output. The affected output driver

and its frequency change step size is register configurable. This

pin is internally pulled low with a ~20 kΩ resistor and can be left

unconnected when not in use.

FINC 48 — I Frequency Increment Pin.2 This pin is used to step-up the out-

put frequency of a selected output. The affected output and its fre-

quency change step size is register configurable. This pin is inter-

nally pulled low with a ~20 kΩ resistor and can be left unconnec-

ted when not in use.

IN_SEL0 3 3 I Input Reference Select.2 The IN_SEL[1:0] pins are used in the

manual pin controlled mode to select the active clock input. These

pins are internally pulled up with a ~20 kΩ resistor to the voltage

selected by the IO_VDD_SEL bit and can be left unconnected

when not in use.

IN_SEL1 4 37 I

RSVD 20 — — Reserved. These pins are connected to the die. Leave discon-

nected.

21 — —

55 — —

56 — —

Si5341/40 Rev D Data Sheet

Pin Descriptions

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 41

Pin Name Pin Number Pin Type1Function

Si5341 Si5340

NC — 22 — No Connect. These pins are not connected to the die. Leave dis-

connected.

Power

VDD 32 21 P Core Supply Voltage. The device core operates from a 1.8 V

supply. A 1.0 µf bypass capacitor is recommended.

46 32

60 39

— 40

VDDA 13 8 P Core Supply Voltage 3.3 V. This core supply pin requires a 3.3 V

power source. A 1.0 µf bypass capacitor is recommended.

— 9 P

VDDS — 26 P Status Output Voltage. The voltage on this pin determines the

VOL/VOH on LOLb and LOS_XAXBb status output pins. A 0.1 µf to

1.0 µf bypass capacitor is recommended.

VDDO0 22 18 P Output Clock Supply Voltage 0–9. Supply voltage (3.3 V, 2.5 V,

1.8 V) for OUTx, OUTx outputs. See the Si5341/40 Family Refer-

ence Manual for power supply filtering recommendations. Leave

VDDO pins of unused output drivers unconnected. An alternate

option is to connect the VDDO pin to a power supply and disable

the output driver to minimize current consumption.

VDDO1 26 23 P

VDDO2 29 29 P

VDDO3 33 34 P

VDDO4 36 — P

VDDO5 40 — P

VDDO6 43 — P

VDDO7 49 — P

VDDO8 52 — P

VDDO9 57 — P

GND PAD P Ground Pad This pad provides electrical and thermal connection

to ground and must be connected for proper operation. Use as

many vias as practical and keep the via length to an internal

ground plan as short as possible.

Note:

1. I = Input, O = Output, P = Power.

2. The IO_VDD_SEL control bit (0x0943 bit 0) selects 3.3 V or 1.8 V operation.

3. The voltage on the VDDS pin(s) determines 3.3 V or 1.8 V operation.

4. Refer to the Family Reference Manual for more information on register setting names.

5. All status pins except I2C and SPI are push-pull.

Si5341/40 Rev D Data Sheet

Pin Descriptions

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 42

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10. Package Outlines

10.1 Si5341 9x9 mm 64-QFN Package Diagram

The figure below illustrates the package details for the Si5341. The table below lists the values for the dimensions shown in the illustra-

tion.

Figure 10.1. 64-Pin Quad Flat No-Lead (QFN)

Table 10.1. Package Dimensions

Dimension Min Nom Max

A 0.80 0.85 0.90

A1 0.00 0.02 0.05

b 0.18 0.25 0.30

D 9.00 BSC

D2 5.10 5.20 5.30

e 0.50 BSC

E 9.00 BSC

E2 5.10 5.20 5.30

L 0.30 0.40 0.50

aaa — — 0.15

bbb — — 0.10

ccc — — 0.08

ddd — — 0.10

eee — — 0.05

Notes:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This drawing conforms to the JEDEC Solid State Outline MO-220.

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

Si5341/40 Rev D Data Sheet

Package Outlines

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 43

EH WWW,“ .7 k ' H 5/; 4. .7 A W mm » a 1 u A. ‘ o A n [r] + 7 7 W x E? H ‘ _ j \ L Um; Punt P U U U U U : VUUUL wuuu‘ 77+ Mi " \ mm H W H1 ﬂﬂﬂ mm L. f

10.2 Si5340 7x7 mm 44-QFN Package Diagram

The figure below illustrates the package details for the Si5340. The table below lists the values for the dimensions shown in the illustra-

tion.

Figure 10.2. 44-Pin Quad Flat No-Lead (QFN)

Table 10.2. Package Dimensions

Dimension Min Nom Max

A 0.80 0.85 0.90

A1 0.00 0.02 0.05

b 0.18 0.25 0.30

D 7.00 BSC

D2 5.10 5.20 5.30

e 0.50 BSC

E 7.00 BSC

E2 5.10 5.20 5.30

L 0.30 0.40 0.50

aaa — — 0.15

bbb — — 0.10

ccc — — 0.08

ddd — — 0.10

Notes:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This drawing conforms to the JEDEC Solid State Outline MO-220.

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

Si5341/40 Rev D Data Sheet

Package Outlines

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 44

rFEWDDQDQDQWﬁ7 000000 IUUDU J L“ ifj000000000= ~7C1 7 waggg ED Saga Ea YE _aaarrhwaaaagam§ﬁ%0 7 w‘+‘w UUUU]Uﬁ_ DR U x2 J W ‘ 0000000 D 0:) EEDEDDDDDD7DDI v c

11. PCB Land Pattern

The figure below illlustrates the PCB land pattern details for the devices. The table below lists the values for the dimensions shown in

the illustration.

Si5341 Si5340

Figure 11.1. PCB Land Pattern

Si5341/40 Rev D Data Sheet

PCB Land Pattern

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 45

Table 11.1. PCB Land Pattern Dimensions

Dimension Si5341 (Max) Si5340 (Max)

C1 8.90 6.90

C2 8.90 6.90

E 0.50 0.50

X1 0.30 0.30

Y1 0.85 0.85

X2 5.30 5.30

Y2 5.30 5.30

Notes:

General

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. This Land Pattern Design is based on the IPC-7351 guidelines.

3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition is calculated based on a fabrication

Allowance of 0.05 mm.

Solder Mask Design

1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm

minimum, all the way around the pad.

Stencil Design

1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

2. The stencil thickness should be 0.125 mm (5 mils).

3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.

4. A 3×3 array of 1.25 mm square openings on 1.80 mm pitch should be used for the center ground pad.

Card Assembly

1. A No-Clean, Type-3 solder paste is recommended.

2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

Si5341/40 Rev D Data Sheet

PCB Land Pattern

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 46

12. Top Marking

YYWWTTTTTT

Rxxxxx- GM

Si 5341g-

e 4 TW

YYWWTTTTTT

Rxxxxx- GM

Si 5340g-

e 4

64-QFN 44-QFN

Figure 12.1. Si5341-40 Top Markings

Table 12.1. Si5341-40 Top Marking Explanation

Line Characters Description

1 Si5341g-

Si5340g-

Base part number and Device Grade for Low Jitter, Any-Frequency, 10-output Clock

Generator.

Si5341: 10-output, 64-QFN

Si5340: 4-output, 44-QFN

g = Device Grade (A, B, C, D). See " " on page 26 for more information.

– = Dash character.

2 Rxxxxx-GM R = Product revision. (See ordering guide for current revision).

xxxxx = Customer specific NVM sequence number. Optional NVM code assigned for

custom, factory pre-programmed devices.

Characters are not included for standard, factory default configured devices. See Or-

dering Guide for more information.

–GM = Package (QFN) and temperature range (–40 to +85 °C)

3 YYWWTTTTTT YYWW = Characters correspond to the year (YY) and work week (WW) of package

assembly.

TTTTTT = Manufacturing trace code.

4 Circle w/ 1.6 mm (64-QFN) or

1.4 mm (44-QFN) diameter

Pin 1 indicator; left-justified

Pb-free symbol; Center-Justified

TW = Taiwan; Country of Origin (ISO Abbreviation)

Si5341/40 Rev D Data Sheet

Top Marking

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 47

13. Device Errata

Please log in or register at www.silabs.com to access the device errata document.

Si5341/40 Rev D Data Sheet

Device Errata

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 48

14. Document Change List

14.1 Revision 1.0

July 15, 2016

• Initial release.

Si5341/40 Rev D Data Sheet

Document Change List

silabs.com | Smart. Connected. Energy-friendly. Rev. 1.0 | 49

Table of Contents

1. Features List ...............................

2. Ordering Guide ..............................2

3. Functional Description............................4

3.1 Power-up and Initialization .........................4

3.2 Frequency Configuration ..........................4

3.3 Inputs ................................4

3.3.1 XA/XB Clock and Crystal Input .......................5

3.3.2 Input Clocks (IN0, IN1, IN2) ........................6

3.3.3 Input Selection (IN0, IN1, IN2, XA/XB) .....................7

3.4 Fault Monitoring .............................7

3.4.1 Status Indicators ............................7

3.4.2 Interrupt Pin (INTRb) ...........................7

3.5 Outputs ................................8

3.5.1 Output Signal Format...........................8

3.5.2 Differential Output Terminations .......................8

3.5.3 Programmable Common Mode Voltage for Differential Outputs.............8

3.5.4 LVCMOS Output Terminations .......................9

3.5.5 LVCMOS Output Impedance and Drive Strength Selection ..............9

3.5.6 LVCMOS Output Signal Swing .......................9

3.5.7 LVCMOS Output Polarity .........................9

3.5.8 Output Enable/Disable ..........................9

3.5.9 Output Driver State When Disabled ......................9

3.5.10 Synchronous/Asynchronous Output Disable Feature ................10

3.5.11 Output Delay Control (t0-t4)........................10

3.5.12 Zero Delay Mode............................11

3.5.13 Sync Pin (Synchronizing R Dividers) .....................11

3.5.14 Output Crosspoint ...........................11

3.5.15 Digitally Controlled Oscillator (DCO) Modes...................12

3.5.15.1 DCO with Frequency Increment/Decrement Pins/Bits ...............12

3.5.15.2 DCO with Direct Register Writes ......................12

3.6 Power Management ............................12

3.7 In-Circuit Programming ...........................12

3.8 Serial Interface .............................12

3.9 Custom Factory Preprogrammed Devices ....................12

3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory Pre-

Programmed Devices ...........................13

4. Register Map .............................. 15

4.1 Addressing Scheme ............................15

4.2 High-Level Register Map ..........................16

5. Electrical Specifications .......................... 18

6. Typical Application Schematic ........................ 33

Table of Contents 50

7. Detailed Block Diagrams .......................... 34

8. Typical Operating Characteristics ...................... 36

9. Pin Descriptions ............................. 38

10. Package Outlines ............................ 43

10.1 Si5341 9x9 mm 64-QFN Package Diagram ...................43

10.2 Si5340 7x7 mm 44-QFN Package Diagram ...................44

11. PCB Land Pattern ............................ 45

12. Top Marking .............................. 47

13. Device Errata .............................. 48

14. Document Change List .......................... 49

14.1 Revision 1.0 ..............................49

Table of Contents 51

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or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and

"Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to

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