: :51an \§\
—
HIGH-SPEED GROUND PLANE HEADER
(0.80 mm) .0315" QTE SERIES
QTE–060–01–L–D–A
QTE–040–01–L–D–A
QTE–014–01–F–D–DP–A
Integral metal plane
for power or ground Standard stack heights
from 5 mm to 25 mm
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
QTE PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
(14 pairs per bank = –D–DP)
–F
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150µ"
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1.27 µm) min Ni on
all solder tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
LEAD
STYLE TYPE AOTHER
OPTION
–K
= (7.00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–TR
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
–L
= Latching
Option
(N/A on –042 &
–060 positions)
Specify
LEAD
STYLE
from
chart
HIGH-SPEED GROUND PLANE HEADER
(5.97)
.235
(0.76)
.030
(0.89)
.035 DIA
(20.00) .7875
–D = (No. of Positions per Row/20)
x (20.00) .7875
–D–DP = (No. of Positions per Row/14)
x (20.00) .7875
(0.20)
.008
(0.80)
.0315
01
02
(7.11)
.280
A
(0.64)
.025
QTE
LEAD
STYLE AHEIGHT
WITH QSE*
–01 (4.27) .168 (5.00) .197
–02 (7.26) .286 (8.00) .315
–03 (10.27) .404 (11.00) .433
–04 (15.25) .600 (16.00) .630
–05 (18.26) .718 (19.00) .748
–07 (24.24) .954 (25.00) .984
–09 (13.26) .522 (14.00) .551
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
–L
Board Mates:
QSE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Ye s
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
FILE NO. E111594
®
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
POWER/SIGNAL
APPLICATION
SEM/TEM1-DH1
QTE-D/QSE-D or QTE-DP/QSE-DP
@ 5 mm Mated Stack Height
Rating based on Samtec reference
channel.For full SI performance
data visit Samtec.comor contact
SIG@samtec.com Gbps
28
Gbps
14
QTE-DP/QSE-DPQTE-D/QSE-D
HIGH-SPEED CHANNEL PERFORMANCE
F-219
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount, Guide Posts,
Screw Down & Friction Lock
• 56 (-DP), 80, 100
positions per row
• Retention Option
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
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