% Litleltuse“
ExpemxeADnllzd \ Amway
256
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Features
RoHS
Applications
• High level of
integration—only one
power semiconductor
module required for the
whole drive
• Low saturation voltage
and positive temperature
coefficient
• Fast switching and short
tail current
• Free wheeling diodes
with fast and soft reverse
recovery
• Industry standard
package with insulated
copper base plate and
soldering pins for PCB
mounting
• Temperature sense
included
• AC motor control
• Motion/servo control
• Inverter and power
supplies
Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Values Unit
IGBT
VCES Collector - Emitter Voltage TJ=25°C 1200 V
VGES Gate - Emitter Voltage ±20 V
ICDC Collector Current TC=25°C 105 A
TC=80°C 75 A
ICM Repetitive Peak Collector Current tp=1ms 150 A
Ptot Power Dissipation Per IGBT 348 W
Diode
VRRM Repetitive Reverse Voltage TJ=25°C 1200 V
IF(AV) Average Forward Current TC=25°C 105 A
TC=80°C 75 A
IFRM Repetitive Peak Forward Current tp=1ms 150 A
I2t TJ =125°C, t=10ms, VR=0V 115 0 A2s
Module Characteristics (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Min Typ Max Unit
TJ max) Max. Junction Temperature 150 °C
TJ op Operating Temperature -40 125 °C
Tstg Storage Temperature -40 125 °C
Visol Insulation Test Voltage AC, t=1min 3000 V
CTI Comparative Tracking Index 250
MdMounting Torque Recommended (M5) 2.5 5N·m
Weight 300 g
MG1275W-XBN2MM
1
% Litleltuse“
ExpemxaADnllzd \ Anxwux Damn
257
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Symbol Parameters Test Conditions Min Typ Max Unit
IGBT
VGE(th) Gate - Emitter Threshold Voltage VCE=VGE, IC=3.0mA 5.0 5.8 6.5 V
VCE(sat)
Collector - Emitter IC=75A, VGE=15V, TJ=25°C 1. 7 V
Saturation Voltage IC=75A, VGE=15V, TJ=125°C 1. 9 V
IICES Collector Leakage Current VCE=1200V, VGE=0V, TJ=25°C 1mA
VCE=1200V, VGE=0V, TJ=125°C 10 mA
IGES Gate Leakage Current VCE=0V, VGE=±15V, TJ=125°C -400 400 nA
RGint Integrated Gate Resistor 10 Ω
Qge Gate Charge VCE=600V, IC=75A , VGE=±15V 0.7 μC
Cies Input Capacitance
VCE=25V, VGE=0V, f =1MHz
5.3 nF
CRES Reverse Transfer Capacitance 0.2 nF
td(on) Turn - on Delay Time
VCC=600V
IC=75A
RG =4.7Ω
VGE=±15V
Inductive Load
T J=25°C 260 ns
TJ=125°C 290 ns
trRise Time T J=25°C 30 ns
TJ=125°C 50 ns
td(off) Turn - off Delay Time T J=25°C 420 ns
TJ=125°C 520 ns
tfFall Time T J=25°C 70 ns
TJ=125°C 90 ns
Eon Turn - on Energy T J=25°C 6.6 mJ
TJ=125°C 9.4 mJ
Eoff Turn - off Energy T J=25°C 6.8 mJ
TJ=125°C 8.0 mJ
ISC Short Circuit Current tpsc≤10μS , VGE=15V; TJ=125°C , VCC=900V 300 A
RthJC Junction-to-Case Thermal Resistance (Per IGBT) 0.36 K/W
Diode
VFForward Voltage IF=75A, VGE=0V, TJ =25°C 1.65 V
IF=75A, VGE=0V, TJ =125°C 1.65 V
tRR Reverse Recovery Time IF=75A, VR=600V
diF/dt=2000A/µs
TJ=125°C
300 ns
IRRM Max. Reverse Recovery Current 85 A
Erec Reverse Recovery Energy 6.5 mJ
RthJCD Junction-to-Case Thermal Resistance (Per Diode) 0.6 K/W
Electrical and Thermal Specifications (TJ = 25°C, unless otherwise specified)
2
% Litleltuse“
ExpemuADNIEd‘Anxwz | ,
258
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Diode-Rectifier Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Values Unit
VRRM Repetitive Reverse Voltage TJ=25°C 1600 V
IF(AV) Average Forward Current TC=80°C 75 A
IFRM
Non-Repetitive Surge Forward
Current
TJ=45°C, t=10ms, 50Hz 450 A
TJ=45°C, t=8.3ms, 60Hz 400
I2tTJ=45°C, t=10ms, 50Hz 1012 A2s
TJ=45°C, t=8.3ms, 60Hz 800
Diode-Rectifier Electrical and Thermal Specifications (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Min Typ Max Unit
VFForward Voltage IF=75A, TJ =25°C 1.25 V
IF=75A, TJ =125°C 1. 15 V
IRReverse Leakage Current VR=1600V, TJ =25°C 50 μA
VR=1600V, TJ =125°C 1mA
RthJCD
Junction-to-Case Thermal
Resistance (Per Diode) 0.66 K/W
Brake-Chopper Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Values Unit
IGBT
VCES Collector - Emitter Voltage TJ=25°C 1200 V
VGES Gate - Emitter Voltage ±20 V
ICDC Collector Current TC=25°C 55 A
TC=80°C 40 A
ICM Repetitive Peak Collector Current tp=1ms 80 A
Ptot Power Dissipation Per IGBT 195 W
Diode
VRRM Repetitive Reverse Voltage TJ=25°C 1200 V
IF(AV) Average Forward Current TC=25°C 35 A
TC=80°C 25 A
IFRM Repetitive Peak Forward Current tp=1ms 50 A
I2t TJ =125°C, t=10ms, VR=0V 200 A2s
3
% Litleltuse“
ExpemxeADnllzd \ Amway
259
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Symbol Parameters Test Conditions Min Typ Max Unit
IGBT
VGE(th) Gate - Emitter Threshold Voltage VCE=VGE, IC=1.5mA 5.0 5.8 6.5 V
VCE(sat)
Collector - Emitter IC=40A, VGE=15V, TJ=25°C 1. 8 V
Saturation Voltage IC=40A, VGE=15V, TJ=125°C 2.05 V
IICES Collector Leakage Current VCE=1200V, VGE=0V, TJ=25°C 0.25 μA
VCE=1200V, VGE=0V, TJ=125°C 2mA
IGES Gate Leakage Current VCE=0V, VGE=±15V, TJ=125°C -400 400 nA
RGint Integrated Gate Resistor 6 Ω
Qge Gate Charge VCE=600V, IC=40A , VGE=±15V 0.33 μC
Cies Input Capacitance VCE=25V, VGE=0V, f =1MHz 2.5 nF
CRES Reverse Transfer Capacitance 0.11 nF
td(on) Turn - on Delay Time
VCC=600V
IC=40A
RG =27Ω
VGE=±15V
Inductive Load
T J =25°C 90 ns
TJ =125°C 90 ns
trRise Time T J =25°C 30 ns
TJ =125°C 50 ns
td(off) Turn - off Delay Time T J =25°C 420 ns
TJ =125°C 520 ns
tfFall Time T J =25°C 70 ns
TJ =125°C 90 ns
Eon Turn - on Energy T J =25°C 4.1 mJ
TJ =125°C 6.0 mJ
Eoff Turn - off Energy T J =25°C 3.1 mJ
TJ =125°C 3.6 mJ
ISC Short Circuit Current tpsc≤10μS, VGE=15V; TJ=125°C, VCC=900V 160 A
RthJC
Junction-to-Case Thermal
Resistance (Per IGBT) 0.62 K/W
Diode
VFForward Voltage IF=25A , VGE=0V, TJ =25°C 1.55 V
IF=25A , VGE=0V, TJ =125°C 1.54 V
tRR Reverse Recovery Time IF=25A, VR=600V
diF/dt=-400A/µs
TJ=125°C
200 ns
IRRM Max. Reverse Recovery Current 20 A
Erec Reverse Recovery Energy 1. 5 mJ
RthJCD
Junction-to-Case Thermal
Resistance (Per Diode) 1.22 K/W
Brake-Chopper Electrical and Thermal Characteristics (TJ = 25°C, unless otherwise specified)
NTC Characteristics (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Min Typ Max Unit
R25 Resistance Tc=25°C 5 KΩ
B25/50 3375 K
4
% Litleltuse“
ExpemxaADnllzd \ Anxwux Damn
lnA
260
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Figure 1: Typical Output Characteristics
for IGBT Inverter
I
C
(A)
V
CE
˄V˅
T
j
=125°C
T
j
=25°C
150
120
60
30
0
0 0.5 1.0 1.5 2.0 2.5 3.0
V
GE
=15V
3.5
90
Figure 2: Typical Output Characteristics
for IGBT Inverter
VGE˄V˅
0
30
IC (A)
60
150
Tj
=125°C
Tj
=25°C
VCE =20V
12 9 01 5 6 78 11
90
120
Figure 3: Typical Transfer Characteristics
for IGBT Inverter
15
25
10
5
001020 40 50
E
on
E
off
(
mJ
)
E
on
E
of
f
R
G
˄Ω˅
V
CE
=600V
I
C
=75A
V
GE
=±15V
T
j
=125°C
20
30
Figure 4: Switching Energy vs. Gate Resistor
for IGBT Inverter
0 30
IC˄A˅
VCE=600V
RG=4.7
Ω
VGE=±15V
T
j
=125°C
150
90
60
Eoff
Eon
0
10
15
30
Eon Eoff
(
mJ
)
20
120
25
5
Figure 5: Switching Energy vs. Collector Current
for IGBT Inverter
Figure 6: Reverse Biased Safe Operating Area
for IGBT Inverter
0
30
60
90
150
180
0200 400 600 800 1000 1200
V
CE
˄V˅
1400
RG=4.7Ω
VGE=±15V
T
j
=125°C
I
C
(A)
120
V
CE
˄V˅
4.0 3.5 3.0 2.5 1.51.00.50
I
C
(A)
T
J
=125°C
2.04.5 5.0
0
GE
V=11V
GE
V= 9V
GE
V=13V
GE
V=15V
GE
V=17V
GE
V=19V
150
120
60
30
90
5
% Litleltuse“
ExpemxaADnllzd \ Anxwux Damn
I )
\
/
0.6 0
<>
261
Power Module
©2015Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Figure 7: Diode Forward Characteristics
for Diode Inverter
V
F
˄V˅
0.5
0 1.0 1.5 0.2
0
30
90
150
60
T
j
=25°C
T
j
=125°C
2.5
120
I
F
(
A
)
E
rec
(
mJ
)
RG˄Ω˅
010 20 30 50
6.0
4.0
2.0
0
10.0
IF=75A
VCE=600V
T
j
=125°C
40
8.0
Figure 8: Switching Energy vs. Gate Resistort
for Diode Inverter
E
rec
(
mJ
)
4.0
2.0
0 30
IF (A)
90 60
0
8.0
10.0
RG=4.7Ω
VCE=600V
T
j
=125°C
150
120
6.0
Figure 9: Switching Energy vs. Forward Current
for Diode Inverter
Rectangular Pulse Duration (seconds)
Z
thJC
(
K/W
)
0.0010.010.1 1 10
0.01
0.1
1
Diode
IGBT
Figure 10: Transient Thermal Impedance of
Diode and IGBT Inverter
Figure 12: Typical Output Characteristics
for IGBT Brake Chopper
I
C
(A)
V
CE
˄V˅
T
j
=125°C
T
j
=25°C
80
60
40
20
000.5 1.01.5 2.0 2.5 3.0
V
GE
=15V
3.5
Figure 11: Diode Forward Characteristics
for IGBT Inverter
V
F
˄V˅
0.2
0 0.4 0.6 1.2
0
25
75
150
50
I
F
(
A
)
T
j
=25°C
T
j
=125°C
0.8 1.0 1.6
100
125
1.4
6
Tc (‘0)
' :m 22::
E 5
”A “J “J
I 2 3 7 1! 17 15
14")J 130J 120J "OJ
3 24C 310
G1275W
a
E
262
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Figure 14: NTC Characteristics
IF=25
A
VCE=600V
T
V
j
=125°C
R (¡)
T
C
˄°C˅
T
Vj
=125°C
T
Vj
=25°C
100000
10000
1000
100020 40 60 80 100
V
GE
=15V
140
120 160
R
Figure 13: Diode Forward Characteristics
for Diode Brake Chopper
V
F
˄V˅
I
F
(
A
)
0.5
0 1.0 1.5 2.0 3.0
0
10
30
40
50
20
T
j
=25°C
T
j
=125°C
2.5
Part Numbering System Part Marking System
PRODUCT TYPE
M: Power Module
MODULE TYPE
G: IGBT
CIRCUIT TYPE
WAFER TYPE
PACKAGE TYPE
MG1275 W-XBN2MM
VOLTAGE RATING
CURRENT RATING
ASSEMBLY SITE
12: 1200V
75: 75A W: Package W
XB: XB
LOT NUMBER
Space
reserved
for QR
code
MG1275W-XBN2MM
Circuit Diagram
7
% Litleltuse“
ExpemxaADnllzd \ Anxwux Damn
263
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Packing Options
Part Number Marking Weight Packing Mode M.O.Q
MG1275W-XBN2MM MG1275W-XBN2MM 300g Bulk Pack 20
Dimensions-Package W
$
Ø
Dimensions (mm)
8
Products related to this Datasheet
IGBT MOD 1200V 105A 348W