MG1275W-XBN2MM Datasheet by Littelfuse Inc.

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256
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Features
RoHS
Applications
High level of
integration—only one
power semiconductor
module required for the
whole drive
Low saturation voltage
and positive temperature
coefficient
Fast switching and short
tail current
Free wheeling diodes
with fast and soft reverse
recovery
Industry standard
package with insulated
copper base plate and
soldering pins for PCB
mounting
Temperature sense
included
AC motor control
Motion/servo control
Inverter and power
supplies
Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Values Unit
IGBT
VCES Collector - Emitter Voltage TJ=25°C 1200 V
VGES Gate - Emitter Voltage ±20 V
ICDC Collector Current TC=25°C 105 A
TC=80°C 75 A
ICM Repetitive Peak Collector Current tp=1ms 150 A
Ptot Power Dissipation Per IGBT 348 W
Diode
VRRM Repetitive Reverse Voltage TJ=25°C 1200 V
IF(AV) Average Forward Current TC=25°C 105 A
TC=80°C 75 A
IFRM Repetitive Peak Forward Current tp=1ms 150 A
I2t TJ =125°C, t=10ms, VR=0V 115 0 A2s
Module Characteristics (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Min Typ Max Unit
TJ max) Max. Junction Temperature 150 °C
TJ op Operating Temperature -40 125 °C
Tstg Storage Temperature -40 125 °C
Visol Insulation Test Voltage AC, t=1min 3000 V
CTI Comparative Tracking Index 250
MdMounting Torque Recommended (M5) 2.5 5N·m
Weight 300 g
MG1275W-XBN2MM
1
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257
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Symbol Parameters Test Conditions Min Typ Max Unit
IGBT
VGE(th) Gate - Emitter Threshold Voltage VCE=VGE, IC=3.0mA 5.0 5.8 6.5 V
VCE(sat)
Collector - Emitter IC=75A, VGE=15V, TJ=25°C 1. 7 V
Saturation Voltage IC=75A, VGE=15V, TJ=125°C 1. 9 V
IICES Collector Leakage Current VCE=1200V, VGE=0V, TJ=25°C 1mA
VCE=1200V, VGE=0V, TJ=125°C 10 mA
IGES Gate Leakage Current VCE=0V, VGE=±15V, TJ=125°C -400 400 nA
RGint Integrated Gate Resistor 10 Ω
Qge Gate Charge VCE=600V, IC=75A , VGE=±15V 0.7 μC
Cies Input Capacitance
VCE=25V, VGE=0V, f =1MHz
5.3 nF
CRES Reverse Transfer Capacitance 0.2 nF
td(on) Turn - on Delay Time
VCC=600V
IC=75A
RG =4.7Ω
VGE=±15V
Inductive Load
T J=25°C 260 ns
TJ=125°C 290 ns
trRise Time T J=25°C 30 ns
TJ=125°C 50 ns
td(off) Turn - off Delay Time T J=25°C 420 ns
TJ=125°C 520 ns
tfFall Time T J=25°C 70 ns
TJ=125°C 90 ns
Eon Turn - on Energy T J=25°C 6.6 mJ
TJ=125°C 9.4 mJ
Eoff Turn - off Energy T J=25°C 6.8 mJ
TJ=125°C 8.0 mJ
ISC Short Circuit Current tpsc≤10μS , VGE=15V; TJ=125°C , VCC=900V 300 A
RthJC Junction-to-Case Thermal Resistance (Per IGBT) 0.36 K/W
Diode
VFForward Voltage IF=75A, VGE=0V, TJ =25°C 1.65 V
IF=75A, VGE=0V, TJ =125°C 1.65 V
tRR Reverse Recovery Time IF=75A, VR=600V
diF/dt=2000A/µs
TJ=125°C
300 ns
IRRM Max. Reverse Recovery Current 85 A
Erec Reverse Recovery Energy 6.5 mJ
RthJCD Junction-to-Case Thermal Resistance (Per Diode) 0.6 K/W
Electrical and Thermal Specifications (TJ = 25°C, unless otherwise specified)
2
% Litleltuse“ ExpemuADNIEd‘Anxwz | ,
258
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Diode-Rectifier Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Values Unit
VRRM Repetitive Reverse Voltage TJ=25°C 1600 V
IF(AV) Average Forward Current TC=80°C 75 A
IFRM
Non-Repetitive Surge Forward
Current
TJ=45°C, t=10ms, 50Hz 450 A
TJ=45°C, t=8.3ms, 60Hz 400
I2tTJ=45°C, t=10ms, 50Hz 1012 A2s
TJ=45°C, t=8.3ms, 60Hz 800
Diode-Rectifier Electrical and Thermal Specifications (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Min Typ Max Unit
VFForward Voltage IF=75A, TJ =25°C 1.25 V
IF=75A, TJ =125°C 1. 15 V
IRReverse Leakage Current VR=1600V, TJ =25°C 50 μA
VR=1600V, TJ =125°C 1mA
RthJCD
Junction-to-Case Thermal
Resistance (Per Diode) 0.66 K/W
Brake-Chopper Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Values Unit
IGBT
VCES Collector - Emitter Voltage TJ=25°C 1200 V
VGES Gate - Emitter Voltage ±20 V
ICDC Collector Current TC=25°C 55 A
TC=80°C 40 A
ICM Repetitive Peak Collector Current tp=1ms 80 A
Ptot Power Dissipation Per IGBT 195 W
Diode
VRRM Repetitive Reverse Voltage TJ=25°C 1200 V
IF(AV) Average Forward Current TC=25°C 35 A
TC=80°C 25 A
IFRM Repetitive Peak Forward Current tp=1ms 50 A
I2t TJ =125°C, t=10ms, VR=0V 200 A2s
3
% Litleltuse“ ExpemxeADnllzd \ Amway
259
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Symbol Parameters Test Conditions Min Typ Max Unit
IGBT
VGE(th) Gate - Emitter Threshold Voltage VCE=VGE, IC=1.5mA 5.0 5.8 6.5 V
VCE(sat)
Collector - Emitter IC=40A, VGE=15V, TJ=25°C 1. 8 V
Saturation Voltage IC=40A, VGE=15V, TJ=125°C 2.05 V
IICES Collector Leakage Current VCE=1200V, VGE=0V, TJ=25°C 0.25 μA
VCE=1200V, VGE=0V, TJ=125°C 2mA
IGES Gate Leakage Current VCE=0V, VGE=±15V, TJ=125°C -400 400 nA
RGint Integrated Gate Resistor 6 Ω
Qge Gate Charge VCE=600V, IC=40A , VGE=±15V 0.33 μC
Cies Input Capacitance VCE=25V, VGE=0V, f =1MHz 2.5 nF
CRES Reverse Transfer Capacitance 0.11 nF
td(on) Turn - on Delay Time
VCC=600V
IC=40A
RG =27Ω
VGE=±15V
Inductive Load
T J =25°C 90 ns
TJ =125°C 90 ns
trRise Time T J =25°C 30 ns
TJ =125°C 50 ns
td(off) Turn - off Delay Time T J =25°C 420 ns
TJ =125°C 520 ns
tfFall Time T J =25°C 70 ns
TJ =125°C 90 ns
Eon Turn - on Energy T J =25°C 4.1 mJ
TJ =125°C 6.0 mJ
Eoff Turn - off Energy T J =25°C 3.1 mJ
TJ =125°C 3.6 mJ
ISC Short Circuit Current tpsc≤10μS, VGE=15V; TJ=125°C, VCC=900V 160 A
RthJC
Junction-to-Case Thermal
Resistance (Per IGBT) 0.62 K/W
Diode
VFForward Voltage IF=25A , VGE=0V, TJ =25°C 1.55 V
IF=25A , VGE=0V, TJ =125°C 1.54 V
tRR Reverse Recovery Time IF=25A, VR=600V
diF/dt=-400A/µs
TJ=125°C
200 ns
IRRM Max. Reverse Recovery Current 20 A
Erec Reverse Recovery Energy 1. 5 mJ
RthJCD
Junction-to-Case Thermal
Resistance (Per Diode) 1.22 K/W
Brake-Chopper Electrical and Thermal Characteristics (TJ = 25°C, unless otherwise specified)
NTC Characteristics (TJ = 25°C, unless otherwise specified)
Symbol Parameters Test Conditions Min Typ Max Unit
R25 Resistance Tc=25°C 5 KΩ
B25/50 3375 K
4
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260
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Figure 1: Typical Output Characteristics
for IGBT Inverter
I
C
(A)
V
CE
˄V˅
T
j
=125°C
T
j
=25°C
150
120
60
30
0
0 0.5 1.0 1.5 2.0 2.5 3.0
V
GE
=15V
3.5
90
Figure 2: Typical Output Characteristics
for IGBT Inverter
VGE˄V˅
0
30
IC (A)
60
150
Tj
=125°C
Tj
=25°C
VCE =20V
12 9 01 5 6 78 11
90
120
Figure 3: Typical Transfer Characteristics
for IGBT Inverter
15
25
10
5
001020 40 50
E
on
E
off
(
mJ
)
E
on
E
of
f
R
G
˄˅
V
CE
=600V
I
C
=75A
V
GE
=±15V
T
j
=125°C
20
30
Figure 4: Switching Energy vs. Gate Resistor
for IGBT Inverter
0 30
IC˄A˅
VCE=600V
RG=4.7
VGE=±15V
T
j
=125°C
150
90
60
Eoff
Eon
0
10
15
30
Eon Eoff
(
mJ
)
20
120
25
5
Figure 5: Switching Energy vs. Collector Current
for IGBT Inverter
Figure 6: Reverse Biased Safe Operating Area
for IGBT Inverter
0
30
60
90
150
180
0200 400 600 800 1000 1200
V
CE
˄V˅
1400
RG=4.7
VGE=±15V
T
j
=125°C
I
C
(A)
120
V
CE
˄V˅
4.0 3.5 3.0 2.5 1.51.00.50
I
C
(A)
T
J
=125°C
2.04.5 5.0
0
GE
V=11V
GE
V= 9V
GE
V=13V
GE
V=15V
GE
V=17V
GE
V=19V
150
120
60
30
90
5
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261
Power Module
©2015Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Figure 7: Diode Forward Characteristics
for Diode Inverter
V
F
˄V˅
0.5
0 1.0 1.5 0.2
0
30
90
150
60
T
j
=25°C
T
j
=125°C
2.5
120
I
F
(
A
)
E
(
mJ
)
RG˄˅
010 20 30 50
6.0
4.0
2.0
0
10.0
IF=75A
VCE=600V
T
j
=125°C
40
8.0
Figure 8: Switching Energy vs. Gate Resistort
for Diode Inverter
E
rec
(
mJ
)
4.0
2.0
0 30
IF (A)
90 60
0
8.0
10.0
RG=4.7
VCE=600V
T
j
=125°C
150
120
6.0
Figure 9: Switching Energy vs. Forward Current
for Diode Inverter
Rectangular Pulse Duration (seconds)
Z
thJC
(
K/W
)
0.0010.010.1 1 10
0.01
0.1
1
Diode
IGBT
Figure 10: Transient Thermal Impedance of
Diode and IGBT Inverter
Figure 12: Typical Output Characteristics
for IGBT Brake Chopper
I
C
(A)
V
CE
˄V˅
T
j
=125°C
T
j
=25°C
80
60
40
20
000.5 1.01.5 2.0 2.5 3.0
V
GE
=15V
3.5
Figure 11: Diode Forward Characteristics
for IGBT Inverter
V
F
˄V˅
0.2
0 0.4 0.6 1.2
0
25
75
150
50
I
F
(
A
)
T
j
=25°C
T
j
=125°C
0.8 1.0 1.6
100
125
1.4
6
Tc (‘0) ' :m 22:: E 5 ”A “J “J I 2 3 7 1! 17 15 14")J 130J 120J "OJ 3 24C 310 G1275W a E
262
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Figure 14: NTC Characteristics
IF=25
A
VCE=600V
T
V
j
=125°C
R (¡)
T
C
˄°C˅
T
Vj
=125°C
T
Vj
=25°C
100000
10000
1000
100020 40 60 80 100
V
GE
=15V
140
120 160
R
Figure 13: Diode Forward Characteristics
for Diode Brake Chopper
V
F
˄V˅
I
F
(
A
)
0.5
0 1.0 1.5 2.0 3.0
0
10
30
40
50
20
T
j
=25°C
T
j
=125°C
2.5
Part Numbering System Part Marking System
PRODUCT TYPE
M: Power Module
MODULE TYPE
G: IGBT
CIRCUIT TYPE
WAFER TYPE
PACKAGE TYPE
MG1275 W-XBN2MM
VOLTAGE RATING
CURRENT RATING
ASSEMBLY SITE
12: 1200V
75: 75A W: Package W
XB: XB
LOT NUMBER
Space
reserved
for QR
code
MG1275W-XBN2MM
Circuit Diagram
7
% Litleltuse“ ExpemxaADnllzd \ Anxwux Damn
263
Power Module
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:12/04/14
MG1275W-XBN2MM
1200V 75A IGBT Module
Packing Options
Part Number Marking Weight Packing Mode M.O.Q
MG1275W-XBN2MM MG1275W-XBN2MM 300g Bulk Pack 20
Dimensions-Package W
$
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Dimensions (mm)
8

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