D/CRCW-P Series Datasheet by Vishay Dale

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Revision: 21-Jan-14 1Document Number: 20009
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Lead (Pb)-Bearing Thick Film, Rectangular,
Semi-Precision Chip Resistors
FEATURES
• Low temperature coefficient (50 ppm/K) and tight
tolerances (± 0.25 %)
• Lead (Pb)-bearing termination plating on Ni barrier layer
• Metal glaze on high quality ceramic
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Notes
• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage and
permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.
• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020).
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER
RATING
P70
W
LIMITING
ELEMENT
VOLTAGE
Umax.
ACRMS/DC
V
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE
SERIES
D10/CRCW0402-P 0402 1005 0.063 50 ± 100 ± 0.5 10 to 1M E24; E96
± 50 ± 0.25, ± 0.5, ± 1 100 to 1M
D11/CRCW0603-P 0603 1608 0.1 75
± 100 ± 0.5 10 to 10M
E24; E96
± 50 ± 0.25 100 to 1M
± 0.5, ± 1 100 to 10M
D12/CRCW0805-P 0805 2012 0.125 150
± 100 ± 0.5 10 to 10M
E24; E96
± 50 ± 0.25 100 to 1M
± 0.5, ± 1 100 to 10M
D25/CRCW1206-P 1206 3216 0.25 200
± 100 ± 0.5 10 to 10M
E24; E96
± 50 ± 0.25 100 to 1M
± 0.5, ± 1 100 to 10M
CRCW1210-P 1210 3225 0.5 200 ± 100 ± 0.5 100 to 1M E24; E96
± 50 ± 0.5, ± 1 100 to 1M
CRCW1218-P 1218 3246 1.0 200 ± 100 ± 0.5 100 to 2.2M E24; E96
± 50 ± 0.5, ± 1 100 to 2.2M
CRCW2010-P 2010 5025 0.75 400 ± 100 ± 0.5 10 to 10M E24; E96
± 50 ± 0.5, ± 1 100 to 10M
CRCW2512-P 2512 6332 1.0 500 ± 100 ± 0.5 10 to 10M E24; E96
± 50 ± 0.5, ± 1 100 to 10M
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D/CRCW-P
www.vishay.com Vishay
Revision: 21-Jan-14 2Document Number: 20009
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
TECHNICAL SPECIFICATIONS
PARAMETER UNIT
D10/
CRCW0402-P
D11/
CRCW0603-P
D12/
CRCW0805-P
D25/
CRCW1206-P CRCW1210-P CRCW1218-P CRCW2010-P CRCW2512-P
Rated Dissipation at P70 (1) W 0.063 0.1 0.125 0.25 0.33 1 0.5 1
Operating Voltage
Umax. ACRMS/DC V 50 75 150 200 200 200 400 500
Insulation Voltage Uins (1 min) V 75 100 200 300 300 300 300 300
Insulation Resistance > 109
Operating Temperature Range °C - 55 to + 155
Failure Rate h-1 0.3 x 10-9
Weight mg 0.65 2 5.5 10 16 29.5 25.5 40.5
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW080525R0DKTAP
MODEL RESISTANCE TOLERANCE TCR PACKAGING SPECIAL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
R = Decimal
K = Thousand
M = Million
C = ± 0.25 %
D = ± 0.5 %
F = ± 1.0 %
H = ± 50 ppm/K
K = ± 100 ppm/K
TA, TB,
TC, TD,
TE, TF,
TG, TH,
TK
Up to 2 digits
P =
Semi-Precision
PRODUCT DESCRIPTION: CRCW0805-P 100 25R 0.5% RT1
CRCW0805-P 100 75R 0.5 % RT1
MODEL TCR RESISTANCE TOLERANCE PACKAGING
CRCW0402-P
CRCW0603-P
CRCW0805-P
CRCW1206-P
CRCW1210-P
CRCW1218-P
CRCW2010-P
CRCW2512-P
± 50 ppm/K
± 100 ppm/K
49K9 = 49.9 k
5R1 = 5.1
± 0.25 %
± 0.5 %
± 1 %
RT1, RT5,
RT6, RT7
RT4, R02,
R67, R82,
RT9
C R C W 0 8 0 5 2 5 R 0 K A PTD
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Revision: 21-Jan-14 3Document Number: 20009
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGING
MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER
D10/CRCW0402-P TD = RT7 10 000
Paper tape acc. to
IEC 60068-3
Type I
8 mm 2 mm 180 mm/7"
TE = RF4 50 000 330 mm/13"
D11/CRCW0603-P
TA = RT1 5000
8 mm 4 mm
180 mm/7"
TB = RT5 10 000 285 mm/11.25"
TC = RT6 20 000 330 mm/13"
D12/CRCW0805-P
TA = RT1 5000
8 mm 4 mm
180 mm/7"
TB = RT5 10 000 285 mm/11.25"
TC = RT6 20 000 330 mm/13"
D25/CRCW1206-P
TA = RT1 5000
8 mm 4 mm
180 mm/7"
TB = RT5 10 000 285 mm/11.25"
TC = RT6 20 000 330 mm/13"
CRCW1210-P
TA = RT1 5000
12 mm 4 mm
180 mm/7"
TB = RT5 10 000 285 mm/11.25"
TC = RT6 20 000 330 mm/13"
CRCW1218-P TK = RT9 4000
Blister tape acc. to
IEC 60068-3
Type II
12 mm 4 mm 180 mm/7"
CRCW2010-P TF = R02 4000 12 mm 4 mm 180 mm/7"
CRCW2512-P TG = R67 2000 12 mm 8 mm 180 mm/7"
TH = R82 4000 4 mm
DIMENSIONS in millimeters
SIZE DIMENSIONS SOLDER PAD DIMENSIONS
REFLOW SOLDERING WAVE SOLDERING
INCH METRIC L W H T1 T2 a b l a b l
0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5
0603 1608 1.55 + 0.10
- 0.05 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0
0805 2012 2.0 + 0.20
- 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20
- 0.10 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3
1206 3216 3.2 + 0.10
- 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3
1210 3225 3.2 ± 0.2 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2
1218 3246 3.2 + 0.10
- 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1.05 4.9 1.9 1.25 4.8 1.9
2010 5025 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9
2512 6332 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2
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Revision: 21-Jan-14 4Document Number: 20009
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FUNCTIONAL PERFORMANCE
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types: STABILITY CLASS 1 OR BETTER
D/CRCW-P 1 to 10 M
4.5 - Resistance - ± 0.25 %; ± 0.5 %; ± 1 %
4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown
4.13 - Short time overload U = 2.5 x 2 x Umax.;
duration acc. to style ± (0.25 % R + 0.05 )
4.17.2 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non-activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) °C
(3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature
coefficient
(20/- 55/20) °C and
(20/125/20) °C ± 50 ppm/K; ± 100 ppm/K
4.32 21 (Uu3)Shear
(adhesion)
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N No visible damage
4.33 21 (Uu1) Substrate bending Depth 2 mm;
3 times
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 )
4.19 14 (Na) Rapid change of
temperature
30 min at - 55 °C;
30 min at 125 °C
5 cycles ± (0.25 % R + 0.05 )
1000 cycles ± (1 % R + 0.05 )
Ambient Temperature in
amb
Fraction of Rated Dissipation P
70
- 50 0 50 100 150
0
50
100
70 °C
%
P70 x R
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Revision: 21-Jan-14 5Document Number: 20009
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, variety of environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
4.23 - Climatic sequence: -
± (1 % R + 0.05 )
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic 55 °C; 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold - 55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U =
4.25.1 - Endurance at 70 °C
U = Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (1 % R + 0.05 )
70 °C; 8000 h ± (2 % R + 0.05 )
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
± (0.25 % R + 0.05 )
4.35 - Flamability,
needle flame test
IEC 60695-11-5;
10 s No burning after 30 s
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (1 % R + 0.05 )
4.25.3 -
Endurance at
upper category
temperature
155 °C, 1000 h ± (1 % R + 0.05 )
4.40 -
Electrostatic
discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD voltage acc. to size
± (1 % R + 0.05 )
4.29 45 (XA) Component solvent
resistance
Isopropyl alcohol;
50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance
of marking
Isopropyl alcohol;
50 °C; method 1,
toothbrush
Marking legible,
no visible damage
4.22 6 (Fc) Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz;
x, y, z 1.5 mm;
A 200 m/s2;
10 sweeps per axis
± (0.25 % R + 0.05 )
4.37 - Periodic electric
overload
U =
2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
± (1 % R + 0.05 )
4.27 -
Single pulse high
voltage overload,
10 μs/700 μs
Û = 10 x
2 x Umax.;
10 pulses
± (1 % R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types: STABILITY CLASS 1 OR BETTER
D/CRCW-P 1 to 10 M
P70 x R
P70 x R
15 x P70 x R
P70 x R
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