MLX90393 Datasheet by Melexis Technologies NV

Figure 1: General Block Drag/um

MLX90393 Triaxis® Magnetic Node

Datasheet

REVISION 003 - SEPTEMBER 14, 2017

3901090393

1. Features and Benefits

 Absolute Position Sensor IC featuring

Triaxis® Hall Technology

 Simple & Robust Magnetic Design

 Miniature size for tiny assemblies

 Selectable SPI and I2C bus protocols

 Wide dynamic range (5-50mT) with on-the-

fly programmable gain

 2.2V-3.6V supply for battery powered

applications, down to 1.8V IO voltage

 On board filter settings

 On the fly programmable operating modes

and sleep times for micro-power use

 External and internal acquisition triggering

modes

 External interrupt pin enables waking a

microcontroller when the field changes

 On board temperature sensor

2. Application Examples

 Non-contacting HMI applications with

push-pull functionality

 Rotary knobs & dials

 (Long stroke) Linear motion in one or

two axes for levers & sliding switches

 Joystick (gimball or ball & socket)

 Home Security 3D closure detection

 Accurate liquid level sensing

 Factory automation position sensing

 Magnetic fingerprint detection

3. Description

The MLX90393 brings the highest flexibility in the

Triaxis portfolio's smallest packaged assembly.

Additionally, the MLX90393 is designed for

micropower applications, with programmable

duty cycles in the range of 0.1% to 100% allowing

for configurable power consumption based on

system requirements.

The MLX90393 magnetic field sensor can be

reprogrammed to different modes and with

different settings at run-time to fine-tune the

performance and power consumed. The sensor

offers a 16-bit output proportional to the

magnetic flux density sensed along the X, Y, and Z

axes using the Melexis proprietary Triaxis

technology and offers a 16-bit temperature

output signal. These digital values are available via

I2C and SPI, where the MLX90393 is a slave on the

bus. Multiple sensors can be connected to the

same bus, by A0 and A1 hardwired connection (4x)

but also through ordering codes with different SW

address (4x).

By selecting which axes are to be measured, the

raw data can be used as input for further post-

processing, such as for joystick applications,

rotary knobs, and more complex 3D position

sensing applications. Unparalleled performance is

achieved with this sensor, which is primarily

targeting industrial and consumer applications.

Figure 1: General Block Diagram

ADC

MUX

Temp Sensor

Bias

EEPROM

State Machine

RAM

Control

SPI/I2C

Interface

Low Power

Oscillator Wake-Up

Oscillator

Temp Compensation

VDD VDD_IO

SDA/MOSI

SCL/SCLK

MS/CS

Interrupt

Trigger

VSS

MISO

A0 A1

Triaxis®

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Contents

1. Features and Benefits ............................................................................................................................... 1

2. Application Examples ................................................................................................................................ 1

3. Description ............................................................................................................................................... 1

4. Ordering Information ............................................................................................................................... 4

5. Functional Diagram .................................................................................................................................. 5

6. Glossary of Terms ..................................................................................................................................... 5

7. Pinout ....................................................................................................................................................... 6

8. Absolute Maximum Ratings ...................................................................................................................... 7

9. General Electrical Specifications ............................................................................................................... 8

10. Thermal Specification ............................................................................................................................. 9

11. Timing Specification ............................................................................................................................. 10

12. Magnetic Specification ......................................................................................................................... 11

13. Mode Selection ..................................................................................................................................... 13

13.1. Burst mode ................................................................................................................................... 15

13.2. Single Measurement mode ......................................................................................................... 16

13.3. Wake-Up on Change mode .......................................................................................................... 16

14. Digital Specification .............................................................................................................................. 16

14.1. Command List .............................................................................................................................. 17

14.2. Status Byte ................................................................................................................................... 19

14.3. SPI Communication ...................................................................................................................... 19

14.4. I2C Communication ...................................................................................................................... 21

14.4.1. I2C Address ............................................................................................................................. 21

14.4.2. I2C Principle ............................................................................................................................ 21

15. Memory Map ........................................................................................................................................ 24

15.1. Parameter Description ................................................................................................................. 25

15.1.1. ANA_RESERVED_LOW ............................................................................................................ 26

15.1.2. BIST ......................................................................................................................................... 26

15.1.3. Z_Series .................................................................................................................................. 26

15.1.4. GAIN_SEL[2:0] ........................................................................................................................ 27

15.1.5. HALLCONF[3:0] ....................................................................................................................... 28

15.1.6. TRIG_INT_SEL ......................................................................................................................... 28

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15.1.7. COMM_MODE[1:0] ................................................................................................................ 28

15.1.8. WOC_DIFF .............................................................................................................................. 28

15.1.9. EXT_TRIG ................................................................................................................................ 29

15.1.10. TCMP_EN ............................................................................................................................. 29

15.1.11. BURST_SEL[3:0] .................................................................................................................... 29

15.1.12. OSR2[1:0] ............................................................................................................................. 29

15.1.13. RES_XYZ[5:0] ........................................................................................................................ 29

15.1.14. DIG_FILT[1:0] ....................................................................................................................... 29

15.1.15. OSR[1:0] ............................................................................................................................... 29

15.1.16. SENS_TC_HT[7:0] ................................................................................................................. 29

15.1.17. SENS_TC_LT[7:0] .................................................................................................................. 30

15.1.18. OFFSET_i[15:0] ..................................................................................................................... 30

15.1.19. WOi_THRESHOLS[15:0] ........................................................................................................ 30

16. Recommended Application Diagram .................................................................................................... 31

1.1 I2C .................................................................................................................................................... 31

1.2 SPI .................................................................................................................................................... 31

17. Packaging Specification ........................................................................................................................ 32

17.1. QFN package ................................................................................................................................ 32

18. Standard Information ........................................................................................................................... 32

19. ESD Precautions .................................................................................................................................... 33

20. Revision History .................................................................................................................................... 33

21. Contact ................................................................................................................................................. 33

22. Disclaimer ............................................................................................................................................. 34

MeleXIs Table 1: Product Ordering Codes Temperature Code: E: from 40°C to BS'C Table 2: Product Ordering Cutie Example

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4. Ordering Information

Product Temperature Package Option Code Packing Form Definition

MLX90393 S (-20°C to 85°C) LW ABA-011 RE I2C address = 00011xx

MLX90393 S (-20°C to 85°C) LW ABA-012 RE I2C address = 00100xx

MLX90393 S (-20°C to 85°C) LW ABA-013 RE I2C address = 00101xx

MLX90393 S (-20°C to 85°C) LW ABA-014 RE I2C address = 00110xx

MLX90393 E (-40°C to 85°C) LW ABA-011 RE I2C address = 00011xx

MLX90393 E (-40°C to 85°C) LW ABA-012 RE I2C address = 00100xx

MLX90393 E (-40°C to 85°C) LW ABA-013 RE I2C address = 00101xx

MLX90393 E (-40°C to 85°C) LW ABA-014 RE I2C address = 00110xx

Table 1: Product Ordering Codes

Legend:

Temperature Code:

S: from -20°C to 85°C

E: from -40°C to 85°C

Package Code: “LW” for QFN-16 3x3x1mm package with wettable flanks

Option Code: ABA-011:

ABA-012:

ABA-013:

ABA-014:

Different I2C addresses – 5 most significant bits. The 2 least significant bits of the

address are defined by the external address pins A0 and A1.

Packing Form: “RE for Reel”

Ordering Example: “MLX90393-ELW-ABA-011-RE”

MLX90393 Micropower magnetometer with I2C address 00011xx where the last

two bits are defined by external address pins A0 and A1. In QFN package,

temperature range -40°C to 85°C.

Table 2: Product Ordering Code Example

Melgxié’" é) j—E l—I l—I

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5. Functional Diagram

6. Glossary of Terms

Term Definition

TC Temperature Coefficient (in ppm/Deg.C.)

Gauss (G), Tesla (T) Units for the magnetic flux density − 1 mT = 10 G

NC Not Connected

PWM Pulse Width Modulation

%DC Duty Cycle of the output signal i.e. TON /(TON + TOFF)

ADC Analog-to-Digital Converter

DAC Digital-to-Analog Converter

LSb Least Significant Bit

MSb Most Significant Bit

DNL Differential Non-Linearity

INL Integral Non-Linearity

EMC Electro-Magnetic Compatibility

ADC

MUX

Temp Sensor

Bias

EEPROM

State Machine

RAM

Control

SPI/I2C

Interface

Low Power

Oscillator Wake-Up

Oscillator

Temp Compensation

DD_IO

SDA/MOSI

SCL/SCLK

MS/CS

Interrupt

Trigger

MISO

A0 A1

Triaxis

Mele Short Table 3: Pinaut Destriptr'an

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7. Pinout

Name Type Supply System Wiring Recommendation

Primary Secondary Reference To I2C 4-wire

SPI

3-wire

SPI

1 INT I/O out N/A VDD_IO Optional Optional Optional

2 SENB/CS I/O in MLX Test VDD_IO To VDD_IO Required Required

3 SCL/SCLK I/O in MLX Test VDD_IO Required Required Required

4 N/C -- -- -- -- -- --

5 SDA/MOSI I/O bi MLX Test VDD_IO Required Required Short

together

6 MISO I/O out MLX Test VDD_IO Floating Required

7 INT/TRIG I/O bi N/A VDD_IO Optional Optional Optional

8 VDD_IO Supply N/A Required Required Required

9 N/C -- -- -- -- -- --

10 N/C -- -- -- -- -- --

11 A1 I2C Address LSB MLX Test VDD To VDD/GND To GND To GND

12 A0 I2C Address LSB MLX Test VDD To VDD/GND To GND To GND

13 VSS Ground N/A Required Required Required

14 N/C -- -- -- -- -- --

15 VDD Supply N/A Required Required Required

16 N/C -- -- -- -- -- --

Table 3: Pinout Description

It is recommended to connect the N/C pins (Not Connected) to Ground.

MeleXIs Table 4: Absolute Maximum Ratings

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8. Absolute Maximum Ratings

Parameter Symbol Min. Typ. Max. Unit

VDD_MAX Analog Supply Voltage Limits -0.3 4 V

VDD_IO_MAX Digital IO Supply Limits -0.3 min(4, VDD+0.3) V

TSTORAGE Storage (idle) temperature range -50 125 °C

ESDHBM According to AEC-Q100-002 2.5 kV

ESDCDM According to AEC-Q100-011-B (QFN) 750 V

Table 4: Absolute Maximum Ratings

Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum-rated

conditions for extended periods may affect device reliability.

MeleXIs Table 5: General Electrical Speciﬁcations

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9. General Electrical Specifications

Parameter Remark Min Nom Max Unit

VDD Analog Supply Voltage 2.2 3 3.6 V

VDD_IO Digital IO Supply 1.65 1.8 VDD V

VPOR_LH Power-on Reset threshold

(rising edge)

1.42 1.55 V

VPOR_HL Power-on Reset threshold

(falling edge)

1 1.31 V

IDD,CONVXY Conversion Current XY-axis 2.29 3 mA

IDD,CONVZ Conversion Current Z-axis 2.96 4 mA

IDD,CONVT Conversion Current Temperature 1.60 2 mA

IDD,STBY Standby Current( 1) 43 60 µA

IDD,IDLE Idle Current(2) 1 2.4 5 µA

IDD,NOM Nominal Current (TXYZ, Datarate = 10Hz,

OSR=OSR2=0, DIG_FILT=4)

100 µA

Table 5: General Electrical Specifications

1 Standby current corresponds to the current consumed in the digital where only the low power oscillator is running.

This standby current is present in burst mode, or whenever the IC is counting down to start a new conversion.

2 Idle current corresponds to the current drawn by the IC in idle mode where all operating functions are disabled except

communications.

MeleXIs Table 6: Thermal Specifications

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10. Thermal Specification

The MLX90393 has an on-board temperature sensor which measures the temperature of the MLX90393

sensor. The temperature can be read out via the communication protocol in a digital format

Parameter Symbol Min. Typ. Max. Unit

TRES Temperature sensor resolution 45.2 LSB/°C

T25 Temperature sensor output at 25°C 46244 LSB16u

TLIN Temperature Linearity (3) +/-3 °C

TOPERATING Operating temperature range [S code] -20 25 85 °C

Operating temperature range [E code] -40

Table 6: Thermal Specifications

3 The linearity is defined as the best fit curve through the digital temperature outputs over the entire temperature

range. It includes ADC non-linearity effects

MeleXIs Single Magnetic axis conversion time " Total conversion time in Single Table 7: Timing Specifications

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11. Timing Specification

The specifications are applicable at 25 Deg. C unless specified otherwise and for the complete supply range.

Parameter Remark Min Nom Max Unit

Main Oscillator & Derived Timings

TSTBY Time from IDLE to STBY 400 500 600 µs

TACTIVE Time from STBY to ACTIVE 8 µs

TCONVM Single Magnetic axis conversion time(4)

typical programming range

0.192 66.56 ms

[(2+2^DIG_FILT)*2^OSR*0.064]

TCONVT Temperature conversion time

typical programming range

0.192 1.54 ms

[2^OSR2*0.192]

TCONV_SMM Total conversion time in Single

Measurement Mode(4) TSTBY + TACTIVE + m*TCONVM + TCONVT ms

TCONV_BURSTWOC Total conversion time in BURST or WOC

Mode(4) TACTIVE + m*TCONVM + TCONVT ms

TOSC_TRIM Trimming accuracy -5 +5 %

TOSC_THD Thermal drift (full temperature range) -5 +5 %

Low-power Oscillator & Derived Timings

TINTERVAL Time in between 2 conversions (Burst

mode or Wake-Up on Change)(5)

0 1260

BURST_DATA_RATE * 20

TLPOSC_TRIM Trimming accuracy -4 +4 %

TLPOSC_THD Thermal drift (full temperature range) -5 +5 %

Startup

TPOR Power-on-reset completion time 0.6 1.5 ms

External Trigger

TTRIG Trigger pulse width (active high) 0.01 250 us

Table 7: Timing Specifications

4 This conversion time is defined as the time to acquire a single axis of the magnetic flux density. When measuring

multiple axes they are obtained through time multiplexing. The conversion time is programmable through parameters

OSR and DIG_FILT for magnetic values and OSR2 for the temperature value. The conversion sequence is TXYZ, opposite

of the ZYXT argument of the command set.

5 The time TINTERVAL is defined as the time between the end of one set of measurements (any combination of TXYZ) and

the start of the following same set of measurements in BURST and WOC mode. As a result of this, the maximum output

data rate is not only a function of TINTERVAL but equals 1/(TCONV_BURSTWOC + TINTERVAL).

MeleXIs RANGE from Table 1Tab|e 4/ SENS“ Programming range of magnetic resolution (uT/LSB) or sensitivity (LSB/mT)

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12. Magnetic Specification

The specifications are applicable at 25 Deg. C unless otherwise specified and for the complete supply voltage

range.

Parameter Remark Min Nom Max Unit

NADC ADC span 17.4 bits

NOUT Output span (taken from 19 by RESXYZ) 16 bits

BRANGE Output range (function of RESXYZ) RANGE from Table 1Table 4 /

SENSii

BSAT Magnetic saturation onset 50 mT

OFFS Deviation from expected 0mT output 0 LSB

OFFSTHD Offset thermal drift, Delta from 25°C (6) < ±1000 LSB

SENSXX,

SENSYY

Programming range of magnetic resolution

(µT/LSB) or sensitivity (LSB/mT) (7)

[modifying GAIN_SEL and RESXYZ], cfr. Table 3

3.220 0.161 µT/LSB

311 6211 LSB/mT

SENSZZ 5.872 0.294 µT/LSB

170 3406 LSB/mT

6 The offset thermal drift is defined as the deviation at 0Gauss from the output with respect to the output at 25°C when

sweeping the temperature. The highest gradient (µT/°C) typically occurs at 85°C. The spec value is based on

characterization on limited sample size at GAIN_SEL=0x7 and RES_XYZ=0x00.

7 The total axis sensitivity is programmable to support different applications, but has no Automatic Gain control on-chip

as do the other angular position sensors from Melexis. The highest gain corresponds to at least the minimum +/-4.8mT

magnetic measurement range and the magnetic resolution defined by SENSii.

Mele SENva, Cross-axis sensitivity (XIV-axis sensitivity to SENSzx, Cross-axis sensitivity (Z—axis sensitivity to X Table 3: Magnetic Speclficutlans

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Parameter Remark Min Nom Max Unit

SENSXY,

SENSYX

Cross-axis sensitivity (X/Y-axis sensitivity to

Y/X magnetic fields)

< ±1 %

SENSXZ,

SENSYZ

Cross-axis sensitivity (X/Y-axis sensitivity to Z

magnetic field)

< ±1 %

SENSZX,

SENSZY

Cross-axis sensitivity (Z-axis sensitivity to X

and Y magnetic fields)

< ±1 %

SENSTHD Sensitivity thermal drift

Delta from 25°C(8)

-3 +3 %

Table 8: Magnetic Specifications

8 The sensitivity thermal drift is expressed as a band around the sensitivity at 25°C. It is applicable on wafer level

trimming, but can be influenced by packaging (overmolding).

Mele I xplo Figure 2: XV axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL : 0x7 xvlo Figure 3:2 axis RMS noise versus conversion time, expressed in mGaussfor GAIN_SEL : 0x7

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12.1. Noise vs Conversion Time

The MLX90393 provides configurable filters to adjust the tradeoff between current consumption, noise, and

conversion time. See section 15.1.5 for details on selecting the conversion time by adjusting OSR and

DIG_FILT.

Figure 2: XY axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7

Figure 3: Z axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7

110 100

Noise Stdev [mGauss]

Conversion Time [ms]

XY-axis Noise over Conversion Time (bundled per OSR setting)

OSR = 0

OSR = 1

OSR = 2

OSR = 3

110 100

Noise Stdev [mGauss]

Conversion Time [ms]

Z-axis Noise over Conversion Time (bundled per OSR setting)

OSR = 0

OSR = 1

OSR = 2

OSR = 3

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13. Mode Selection

The MLX90393 can operate in three modes. They are: Burst mode, Single Measurement mode, and Wake-

On-Change mode.

 Burst mode

The ASIC will have a programmable data rate at which it will operate. This data rate implies auto-

wakeup and sequencing of the ASIC, flagging that data is ready on a dedicated pin (INT/DRDY). The

maximum data rate corresponds to continuous burst mode, and is a function of the chosen

measurement axes. For non-continuous burst modes, the time during which the ASIC has a counter

running but is not doing an actual conversion is called the Standby mode (STBY).

 Single Measure mode

The master will ask for data via the corresponding protocol (I2C or SPI), waking up the ASIC to make a

single conversion, immediately followed by an automatic return to sleep mode (IDLE) until the next

polling of the master. This polling can also be done by strobing the TRG pin instead, which has the

same effect as sending a protocol command for a single measurement.

 Wake-Up on Change

This mode is similar to the burst mode in the sense that the device will be auto-sequencing, with the

difference that the measured component(s) is/are compared with a reference and in case the

difference is bigger than a user-defined threshold, the DRDY signal is set on the designated pin. The

user can select which axes and/or temperature fall under this cyclic check, and which thresholds are

allowed.

The user can change the operating mode at all time through a specific command on the bus. The device

waits in IDLE mode after power-up, but with a proper user command any mode can be set after power-up.

Changing to Burst or WOC mode, coming from Single Measure mode, is always accompanied by a

measurement first. The top-level state diagram indicating the different modes and some relevant timing is

shown below in Figure 4. In the Measure state, the MDATA flag will define which components will be

measured (ZYXT). The order of conversion is defined as TXYZ and can not be modified by the user, only the

combination of axes is a degree of freedom.

Arrows indicated in grey are the direct result of an Exit command. The main difference between STANDBY

and WOC_IDLE is that in STANDBY mode, all analog circuitry is ready to make a conversion, but this is

accompanied by a larger current consumption than IDLE mode. For burst mode this extra current

consumption is justified because the emphasis is more on accurate timing intervals, avoiding the delay of

TSTBY before conversion and supporting an efficient continuous burst mode without standby overhead.

It is the user’s responsibility to read back the measured data as the MLX90393 is a slave device on the bus.

Even in burst mode and WOC mode when the MLX90393 is auto-sequencing, the master will be responsible

for collecting the acquired sensor data.

Melexié figure 4: 70;] my state d/aqmm mm mdltat/on of nmmgs

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STARTUP

LOAD CALIB DATA

IDLE

LP_OSC disabled

STANDBY

LP_OSC enabled

POR

VDD > V

POR_LH

Burst

mode

WOC_IDLE

LP_OSC enabled

WOC

mode

SM mode

TIME

m*T

CONVM

CONVT

ACTIVE

STBY

POR

INTERVAL

&& Burst mode

MDATA ?

MEASURE

LP_OSC & MAIN_OSC

enabled

Figure 4: Top-level state diagram with indication of timings

13.1. Burst mode

When the sensor is operating in burst mode, it will make conversions at specific time intervals. The

programmability of the user is the following:

 Burst speed (TINTERVAL) through parameter BURST_DATA_RATE

 Conversion time (TCONV) through parameters OSR, OSR2 and DIG_FILT

 Axes/Temperature (MDATA) through parameter BURST_SEL or via the command argument (ZYXT)

Whenever the MLX90393 has made the selected conversions (based on MDATA), the DRDY signal will be set

(active H) on the INT and/or INT/TRG pin to indicate that the data is ready for readback. It will remain high

until the master has sent the command to read out at least one of the converted quantities (ZYXT). Should

the master have failed to read out any of them by the time the sensor has made a new conversion, the

INT/DRDY pin will be strobed low for 10us, and the next rising edge will indicate a new set of data is ready.

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13.2. Single Measurement mode

Whenever the sensor is set to this mode (or after startup) the MLX90393 goes to the IDLE state where it

awaits a command from the master to perform a certain acquisition. The duration of the acquisition will be

the concatenation of the TSTBY, TACTIVE, m*TCONVM (with m # of axes) and TCONVT. The conversion time will

effectively be programmable by the user (see burst mode), but is equally a function of the required

axes/temperature to be measured.

Upon reception of such a polling command from the master, the sensor will make the necessary

acquisitions, and set the DRDY signal high to flag that the measurement has been performed and the master

can read out the data on the bus at his convenience. The INT/DRDY will be cleared either when:

 The master has issued a command to read out at least one of the measured components

 The master issues an Exit (EX) command to cancel the measurement

 The chip is reset, after POR (Power-on reset) or Reset command (RT)

13.3. Wake-Up on Change mode

The Wake-Up on Change (WOC) functionality can be set by the master with as main purpose to only receive

an interrupt when a certain threshold is crossed. The WOC mode will always compare a new burst value with

a reference value to assess if the difference between both exceeds a user-defined threshold. The reference

value is defined as one of the following:

 The first measurement of WOC mode is stored as reference value once, because of a measurement.

This measurement at “t=0” is then the basis for comparison or,

 The reference for acquisition(t) is always acquisition(t-1), in such a way that the INT signal will only

be set if the derivative of any component exceeds a threshold.

The in-application programmability is the same as for burst mode, but now the thresholds for setting the

interrupt are also programmable by the user, as well as the reference, if the latter is data(t=0) or data(t-1).

14. Digital Specification

The supported protocols are I2C and SPI. The SENB/CS pin is used to define the protocol to be used:

 /CS = 0 for SPI, addressing the MLX90393 slave in SPI mode (3- and 4-wire), but releasing this line in

between commands (no permanent addressing allowed)

 /CS = 1 for I2C, addressing the MLX90393 slave when the correct address is transmitted over the bus

(permanently kept high)

Mele The mode in which the first valid command is transmitted to the MLX90393 deﬁnes the operating mode (SPI or IZC) for all its future Table 9: Communicatiun made definltian Table 10: Command List

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To ensure the activity on the SPI bus cannot be accidentally interpreted as I2C protocol, programming bits

are available in the memory of the MLX90393 to force the communication mode. It concerns the

COMM_MODE[1:0] bits with the following effect:

COMM_MODE[1] COMM_MODE[0] Description

0 X The mode in which the first valid command is transmitted to the

MLX90393 defines the operating mode (SPI or I2C) for all its future

commands, until a reset (hard or soft) is done.

1 0 SPI mode only

1 1 I2C mode only

Table 9: Communication mode definition

14.1. Command List

The MLX90393 only listens to a specific set of commands. Apart from the Reset command, all commands

generate a status byte that can be read out. The table below indicates the 10 different commands that are

(conditionally) accepted by the MLX90393. The MLX90393 will always acknowledge a command in I2C, even

if the command is not a valid command. Interpreting the associated status byte is the method for

verification of command acceptance.

Command Set

Command Name Symbol # CMD1 byte CMD2 byte CMD3 byte CMD4 byte

Start Burst Mode SB 1 0001 zyxt N/A N/A N/A

Start Wake-up on Change Mode SW 2 0010 zyxt N/A N/A N/A

Start Single Measurement Mode SM 3 0011 zyxt N/A N/A N/A

Read Measurement RM 4 0100 zyxt N/A N/A N/A

Read Register RR 5 0101 0abc {A5…A0,0,0} N/A N/A

Write Register WR 6 0110 0abc D15…D8 D7…D0 {A5…A0,0,0}

Exit Mode EX 8 1000 0000 N/A N/A N/A

Memory Recall HR D 1101 0000 N/A N/A N/A

Memory Store HS E 1110 0000 N/A N/A N/A

Reset RT F 1111 0000 N/A N/A N/A

Table 10: Command List

Melexié"

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3901090393

The argument for the volatile memory access commands (RR/WR) «abc» should be set to 0x0h, in order to

get normal read-out and write of the memory.

The argument in all mode-starting commands (SB/SW/SM) is a nibble specifying the conversions to be

performed by the sensor in the following order «zyxt». For example, if only Y axis and temperature are to be

measured in Single Measurement mode the correct command to be transmitted is 0x35h. The sequence of

measurement execution on-chip is inverted to «TXYZ», so T will be measured before X, followed by Y and

finally Z. By issuing an all-zero «zyxt» nibble, the BURST_SEL value from RAM will be used instead of the

empty argument of the command.

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14.2. Status Byte

The status byte is the first byte transmitted by the MLX90393 in response to a command issued by the

master. It is composed of a fixed combination of informative bits:

bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

BURST_MODE WOC_MODE SM_MODE ERROR SED RS D1 D0

Table 11: Status Byte Definition

 MODE bits

These bits define in which mode the MLX90393 is currently set. Whenever a mode transition

command is rejected, the first status byte after this command will have the expected mode bit

cleared, which serves as an indication that the command has been rejected, next to the ERROR bit.

The SM_MODE flag can be the result of an SM command or from raising the TRG pin when TRG mode

is enabled in the volatile memory of the MLX90393.

 ERROR bit

This bit is set in case a command has been rejected or in case an uncorrectable error is detected in

the memory, a so called ECC_ERROR. A single error in the memory can be corrected (see SED bit),

two errors can be detected and will generate the ECC_ERROR. In such a case all commands but the

RT (Reset) command will be rejected. The error bit is equally set when the master is reading back

data while the DRDY flag is low.

 SED bit

The single error detection bit simply flags that a bit error in the non-volatile memory has been

corrected. It is purely informative and has no impact on the operation of the MLX90393.

 RS bit

Whenever the MLX90393 gets out of a reset situation – both hard and soft reset – the RS flag is set

to highlight this situation to the master in the first status byte that is read out. As soon as the first

status byte is read, the flag is cleared until the next reset occurs.

 D[1:0] bits

These bits only have a meaning after the RR and RM commands, when data is expected as a response

from the MLX90393. The number of response bytes correspond to 2*D[1:0] + 2, so the expected byte

counts are either 2, 4, 6 or 8. For commands where no response is expected, the content of D[1:0]

should be ignored.

14.3. SPI Communication

The MLX90393 can handle SPI communication at a bitrate of 10Mhz. The SPI communication is implemented

in a half-duplex way, showing high similarities with I2C communication, but addressing through the \CS (Chip

Select) pin instead of through bus arbitration. The half-duplex nature is at the basis of the supported 3-wire

SPI operation. SPI mode 3 is implemented: CPHA=1 (data changed on leading edge and captured on trailing

edge, and CPOL=1 (high level is inactive state). The Chip Select line is active-low.

Melexié" Symhul Parameter Value Unit Min Max tqsvc) SPI clock cycle 100 ns qupct SPI clock frequency 10 MHZ (sums) CS setup time 5 (ms) CS hoid time 10 (sum) SDi input setup time 5 [NSU SD‘ input hold time 15 (use SDO valid output time 50 (mm) SDO output hold time 5 tmstsu] SDO output disable time 50 Figure 3. SPI slave timing diagram (2) ' u—p . SDI (a) X MSBIN E X X LSE IN ' (a) 5 Insﬂr E ; m, H H 800 .(3) —< msa="" cm="" x="" x="" x="" lse="" out="" }—(3)-="" 1,="" values="" are="" guavanteeu="" al="" in="" mhz="" dock="" tvequency="" tor="" spi="" with="" mm="" 4="" am:="" 3="" was.="" based="" on="" chalacterizalmn="" results.="" not="" tested="" u.="" pmauemn="" 2,="" measurement="" palms="" ale="" :1an="" at="" o,2»v¢a_|o="" and="" n="" a-vud_lo.="" tar="" mm="" inpul="" and="" output="" pnﬂ="" figure="" 5.="" sp!="" communication="" example="">

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Symbol

Parameter

Value

Unit

Min

Max

tc(SPC)

SPI clock cycle

100

fc(SPC)

SPI clock frequency

MHz

tsu(CS)

CS setup time

th(CS)

CS hold time

tsu(SI)

SDI input setup time

th(SI)

SDI input hold time

tv(SO

SDO valid output time

th(SO)

SDO output hold time

tdis(SO)

SDO output disable time

The communication is also bundled in bytes, equally MSB first and MSByte first. A command can of course

consist of more than 1 byte (refer to Chapter 8.1) as can the response be from the MLX90393 in the form of

multiple bytes after the status byte (not shown in Figure 5)

COMMAND[7:0]

SCL

MOSI

12345678 12345678

MISO

/CS

STATUS_BYTE[7:0]

X (4-wire SPI) or Z (3-wire SPI)

Z (3 & 4-wire SPI)

ADD NADD

Figure 5: SPI communication example

MeleXIs Tub/E 12: I Caddies: ordering Codes.

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3901090393

14.4. I2C Communication

14.4.1. I2C Address

The I2C address is made up of some hard-coded bits and a memory written value as follows:

I2C_ADDR[6:0] = {EE_I2C_ADDR[4:0],A1,A0} with Ai the user-selectable active-high value of the input pads of

the MLX90393, referred to the VDD supply system and EE_I2C_ADDR[4:0] default programmed to 0x03h, but

factory accessible for overwrite. Table 7 below indicated the available ordering codes for different

EE_I2C_ADDR[4:0] factory calibrated values. This permits connection of up to 16 distinguishable sensors on

the bus: 4 ordering codes x 4 possible hardwired A1A0 connections for each.

Ordering Code EE_I2C_ADDR[4:0] 7-bit I2C addresses possible

MLX90393xLW-ABA-011-RE 0x03h 0x0Ch, 0x0Dh, 0x0Eh, 0x0Fh

MLX90393xLW-ABA-012-RE 0x04h 0x10h, 0x11h, 0x12h, 0x13h

MLX90393xLW-ABA-013-RE 0x05h 0x14h, 0x15h, 0x16h, 0x17h

MLX90393xLW-ABA-014-RE 0x06h 0x18h, 0x19h, 0x1Ah, 0x1Bh

Table 12: I2C address ordering codes.

14.4.2. I2C Principle

The MLX90393 supports I2C communication in both Standard Mode and Fast Mode. Bytes are transmitted

MSB first, and in order to reconstruct words, the bytes need to be concatenated MSByte first. The general

principle of communication is always the same:

 Initiating the communication is always done by the Master (Start condition S)

 Addressing the Slave (MLX90393) followed by a cleared bit to indicate the Master intends to write

something to the specific addressed Slave

 Acknowledging by the Slave if the transmitted address corresponds to the Slave’s I2C address. If the

latter isn’t the case, any further activity on the bus except a Sr (Start Repeat) and P (Stop) condition

will be ignored by the MLX90393

 Sending a Command Byte by the Master, as depicted in Figure 6. The Slave will always acknowledge

this, even if it is an unrecognized command. A command such as WR and RR consist of more than 1

byte, which can then be transmitted sequentially over the I2C bus. Referring to Figure 6 the

COMMAND byte should then be a sequence of COMMAND byte1, byte2, etc…

 Issuing a Start Repeat (Sr) condition by the Master in order to restart the addressing phase

 Addressing the Slave (MLX90393) followed by a set bit to indicate the Master intends to read

something from the specific addressed Slave

 Acknowledging by the Slave if the transmitted address corresponds to the Slave’s I2C address. If the

latter isn’t the case, any further activity on the bus except a Sr (Start Repeat) and P (Stop) condition

will be ignored by the MLX90393

Melexié' X:X:X Figure 6' Default! c communication example with status byte rcadback

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3901090393

 Transmitting the Status Byte by the Slave, who is in control of the bus. Following the RR and RM

commands the sensor returns additional data bytes after the status byte.

 Acknowledging by the Master if the data is well received

 Generating a Stop condition (P) by the master

The Master controlled bus activity is shown in blue, the Slave controlled bus activity is shown in orange. In

case a command is longer than a single byte (see Table 6), the bytes are transmitted sequentially before

generating the Start Repeat (Sr) condition.

I2C_ADDR[6:0] W ACK

COMMAND[7:0] ACK

I2C_ADDR[6:0] R ACK

STATUS_BYTE[7:0] ACK

SCL

SDA

SCL

SDA

123456789 123456789

123456789

Figure 6: Default I2C communication example with status byte readback

The same applies to the Slave responses: following RR and RM commands, the Slave response is more than

just the Status Byte. There as well, the data is partitioned in bytes that are transmitted sequentially by the

slave. It is the Master’s responsibility to issue enough clocking pulses to read back all the data. Finding out

how many bytes is possible by decoding the Status Byte information, see Section Status Byte.

Finally, the master is also free to not read back the status byte when issuing a command. In doing so, he

loses the ability to see if the command was received properly by the MLX90393. Moreover, the first SM

command issued by the master after power-up or reset should have the status byte read back to get valid

measurement data back.

Melexis "‘ fiSCt) SCL clock frequency 0 100 0 400 kHz twiscu) SCL clock low time 4.7 1.3 twiscm) SCL clock high time 4.0 0.6 tsuisum SDA setup time 250 100 ns tmsDA) SDA data hoid time 0 3.45 0 0.9 ps trim/4), trisct) SDA and SCL rise time 1000 20+0.1Cb 300 [MEDALWSCU SDA and SCL fall time 300 20+0.1Cb 300 (mm START condition hold time 4 0.6 t Repeated START condition setup time (5u[SP) STOP condition setup time 4 0.6 t Bus free time between STOP and START condition ' Dai- our: cr urc 1 ‘C :miocc mu. 1"”! ’0! ruled ' C’Dcudo" REDEAYED 2 Ch I [on C‘SKH‘“ atom a“: no ' cf : Uelh'e-‘o'i Down n :61 m c 2 v::_ 0 rc : a \':c_ o w oaz- :m

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3901090393

Symbol Parameter

I2C standard mode I2C fast mode

Unit

Min Max Min Max

f(SCL)

SCL clock frequency

100

400

kHz

tw(SCLL)

SCL clock low time

4.7

1.3

µs

tw(SCLH)

SCL clock high time

4.0

0.6

tsu(SDA)

SDA setup time

250

100

th(SDA)

SDA data hold time

3.45

0.9

µs

tr(SDA), tr(SCL)

SDA and SCL rise time

1000

20+0.1Cb

300

tf(SDA), tf(SCL)

SDA and SCL fall time

300

20+0.1Cb

300

th(ST)

START condition hold time

0.6

µs

su(SR)

Repeated START condition setup

time

4.7 0.6

tsu(SP)

STOP condition setup time

0.6

w(SP:SR)

Bus free time between STOP and

START condition

4.7 1.3

Melexns ‘ © <: figure="" 7:="" the="" memories="" of="" the="" mlx90393,="" their="" areas="" and="" the="" impacting="" commands.="">

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15. Memory Map

The MLX90393 has 1kbit of non-volatile memory, and the same amount of volatile memory. Each memory

consists out of 64 addresses containing 16 bit words. The non-volatile memory has automatic 2-bit error

detection and 1-bit error correction capabilities per address. The handling of such corrections & detections

is explained in Section Status Byte.

The memory is split in 2 areas:

 Customer area [address 0x00h to 0x1Fh]

 Melexis area [address 0x20h to 0x3Fh]

The RR and WR commands impact the volatile memory only, there no direct access possible to the non-

volatile memory. The customer area of the volatile memory is bidirectionally accessible to the customer; the

Melexis area is write-protected. Only modifications in the blue area are allowed with the WR command. The

adjustments in the customer area can be stored in the permanent non-volatile memory with the STORE

command HS, which copies the entire volatile memory including the Melexis area to the non-volatile one.

With the HR command the non-volatile memory content can be recalled to the volatile memory, which can

restore any modifications due to prior WR commands. The HR step is performed automatically at start-up of

the ASIC, either through cold reset or warm reset with the RT command.

The above is graphically shown in Figure 7.

CUSTOMER AREA CUSTOMER AREA

MELEXIS AREA MELEXIS AREA

VOLATILE

MEMORY NON-VOLATILE

MEMORY

STORE (HS)

RECALL (HR)

RR WR

Figure 7: The memories of the MLX90393, their areas and the impacting commands.

The customer area houses 3 types of data:

 Analog configuration bits

 Digital configuration bits

MeleXis Figure 3: Custumer ma memory map,

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3901090393

 Informative (free) bits

The latter can be filled with customer content freely, and covers the address span from (and including)

0x0Ah to 0x1Fh, a total of 352 bits. The memory mapping of volatile and non-volatile memory on address

level is identical. The volatile memory map is given in Figure 8.

Figure 8: Customer area memory map.

The non-volatile memory can only be written (HS store command) if pin VDD is supplied with 3.3V minimum,

otherwise the write sequence cannot be performed in a reliable way. Additionally, this HS command was

designed to be used as one-time calibration, but not as multi write-cycle memory within the application. In

case memory is written within the application, the number of write cycles should be kept to a minimum.

There is no limit to the write cycles in the volatile memory (WR write command).

15.1. Parameter Description

The meaning of each customer accessible parameter is explained in this section. The customer area of both

the volatile and the non-volatile memory can be written through standard SPI and I2C communication, within

the application. No external high-voltages are needed to perform such operations, nor access to dedicated

pins that need to be grounded in the application.

Parameter Description

ANA_RESERVED_LOW Reserved IO trimming bits

BIST Enabled the on-chip coil, applying a Z-field [Built-In Self Test]

Z_SERIES Enable all plates for Z-measurement

GAIN_SEL[2:0] Analog chain gain setting, factor 5 between min and max code

HALLCONF[3:0] Hall plate spinning rate adjustment

ADDRESS 15 14 13 12 11 10 9876543210

0x00h BIST Z_SERIES

0x01h

TRIG_INT_

WOC_DIFF EXT_TRIG TCMP_EN

0x02h

0x03h

0x04h

0x05h

0x06h

0x07h

0x08h

0x09h

0x0Ah

0x0Bh

0x0Ch

0x0Dh

0x0Eh

0x0Fh

0x10h

0x11h

0x12h

0x13h

0x14h

0x15h

0x16h

0x17h

0x18h

0x19h

0x1Ah

0x1Bh

0x1Ch

0x1Dh

0x1Eh

0x1Fh

FREE

OFFSET_X

OFFSET_Y

OFFSET_Z

WOXY_THRESHOLD

WOZ_THRESHOLD

WOT_THRESHOLD

OSR2

RES_XYZ

DIG_FILT

OSR

SENS_TC_HT

SENS_TC_LT

BIT NUMBER

ANA_RESERVED_LOW

GAIN_SEL

HALLCONF

COMM_MODE

BURST_SEL (zyxt)

BURST_DATA_RATE

MeleXIs Table 13: NVRAM parameter destriptr'an

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Parameter Description

TRIG_INT_SEL Puts TRIG_INT pin in TRIG mode when cleared, INT mode otherwise

COMM_MODE[1:0] Allow only SPI [10b], only I2C [11b] or both [0Xb] according to CS pin

WOC_DIFF Sets the Wake-up On Change based on Δ{sample(t),sample(t-1)}

EXT_TRIG Allows external trigger inputs when set, if TRIG_INT_SEL = 0

TCMP_EN Enables on-chip sensitivity drift compensation

BURST_SEL[3:0] Defines the MDATA in burst mode if SB command argument = 0

BURST_DATARATE[6:0] Defines TINTERVAL as BURST_DATA_RATE * 20ms

OSR2[1:0] Temperature sensor ADC oversampling ratio

RES_XYZ[5:0] Selects the desired 16-bit output value from the 19-bit ADC

DIG_FILT[1:0] Digital filter applicable to ADC

OSR[1:0] Magnetic sensor ADC oversampling ratio

SENS_TC_HT[7:0] Sensitivity drift compensation factor for T < TREF

SENS_TC_LT[7:0] Sensitivity drift compensation factor for T > TREF

OFFSET_i[15:0] Constant offset correction, independent for i = X, Y, Z

WOi_THRESHOLD[15:0] Wake-up On Change threshold, independent for i = X, Y, Z and T

Table 13: NVRAM parameter description

15.1.1. ANA_RESERVED_LOW

Reserved bits for analog trimming at Melexis factory. Do not modify.

15.1.2. BIST

Enables (1) or disables (0) the built in self-test coil. In normal operation set to 0.

15.1.3. Z_Series

Enables series connection of hall plates for Z axis measurement. In normal operation set to 0.

0.751 0.601 0.451 0.376 0.300 0.250 0.200 0.150 mug- - 2.420 3.004 4.840 6.009 9.680 1.936 2.403 3.872 4.840 7.744 1.452 1.803 2.904 3.605 5.808 1.210 1.502 2.420 3.004 4.840 0.968 1.202 1.936 2.403 3.872 0.807 1.001 1.613 2.003 3.227 0.645 0.801 1.291 1.602 2.581 0.484 0.601 0.968 1.202 1.936 Tabie 14: Sensitivity tabie for given gain and resolution seiectian for HALLCONF:DxC - RES=1 m ------ _ 0.981 1,581 . 3.162 3.926 6.324 _ 0.785 1,265 . 2.530 3.141 5.059 _ 0.589 0,949 1.178 1.897 2.355 3.794 _ 0.491 0,791 0.981 1.581 1.961 3.162 _ 0.393 0,632 0.785 1.265 1.570 2.530 _ 0.327 0,527 0.654 1.054 1.309 2.108 _ 0.262 0,422 0.523 0.843 1.047 1.686 _ 0.196 0,316 0.393 0.632 0.785 1.265 m -_ 7.851 12.648 6.281 10.119 4.711 7.589 3.926 6.324 3.141 5.059 2.617 4.216 2.094 3.373 1.570 2.530 Tobie 15: : Sensitivity table for given gain and resolution selection for HALLCONF:0x0 MeleXIs

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15.1.4. GAIN_SEL[2:0]

Sets the analog gain to the desired value. The sensitivity is dependent on the axis (X and Y have higher

sensitivity) as well as the setting of the RES_XYZ[5:0] parameter. The relationship is given in the below table.

Table for HALLCONF = 0xC, sensitivity in uT/LSB:

GAIN_SEL

RES = 0

RES = 1

RES = 2

RES = 3

SENSXY

SENSZ

SENSXY

SENSZ

SENSXY

SENSZ

SENSXY

SENSZ

0.751

1.210

1.502

2.420

3.004

4.840

6.009

9.680

0.601

0.968

1.202

1.936

2.403

3.872

4.840

7.744

0.451

0.726

0.901

1.452

1.803

2.904

3.605

5.808

0.376

0.605

0.751

1.210

1.502

2.420

3.004

4.840

0.300

0.484

0.601

0.968

1.202

1.936

2.403

3.872

0.250

0.403

0.501

0.807

1.001

1.613

2.003

3.227

0.200

0.323

0.401

0.645

0.801

1.291

1.602

2.581

0.150

0.242

0.300

0.484

0.601

0.968

1.202

1.936

Table 14: Sensitivity table for given gain and resolution selection for HALLCONF=0xC

Table for HALLCONF = 0x0, sensitivity in uT/LSB:

GAIN_SEL

RES = 0

RES = 1

RES = 2

RES = 3

SENSXY

SENSZ

SENSXY

SENSZ

SENSXY

SENSZ

SENSXY

SENSZ

0.981

1.581

1.963

3.162

3.926

6.324

7.851

12.648

0.785

1.265

1.570

2.530

3.141

5.059

6.281

10.119

0.589

0.949

1.178

1.897

2.355

3.794

4.711

7.589

0.491

0.791

0.981

1.581

1.961

3.162

3.926

6.324

0.393

0.632

0.785

1.265

1.570

2.530

3.141

5.059

0.327

0.527

0.654

1.054

1.309

2.108

2.617

4.216

0.262

0.422

0.523

0.843

1.047

1.686

2.094

3.373

0.196

0.316

0.393

0.632

0.785

1.265

1.570

2.530

Table 15: : Sensitivity table for given gain and resolution selection for HALLCONF=0x0

1.84 2.61 4.15 7.22 13.36 25.65 \lmthWNb-io 2.23 3.00 4.53 7.60 13.75 26.04 50.61 2 3.00 3.76 5.30 8.37 14.52 26.80 51.38 100.53 3 5,30 6,84 9,91 16,05 28,34 52.92 102.07 200.37 Tab/E 16: Tcmw as ufunction of OS)? 84 D/G_FILT 493.0 348.0 219.2 125.9 68.0 7 35.4 Table 17. Maximum Output Data Rate (012;?) as a function 0f 05}? & D/G_FILT 408.0 303.4 200,6 119.6 66.1 34.9 18.0 2 303.4 241.5 171.5 108.6 62.6 33,9 17.7 9.0 3 171.5 133.0 91.8 56,6 32,1 17,2 8,9 4,5 Me |exns "

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15.1.5. HALLCONF[3:0]

Modifies the hall plate spinning (2-phase vs 4-phase) which has an effect on the minimum sampling rate

achievable. Some configurations of OSR and DIG_FILT are not permitted. The cells shown in red are not

permitted with HALL_CONF=0xC (default) but are allowed when HALL_CONF=0x0.

Typical T

CONV

(TXYZ)

for OSR2=0x0 [ms]

OSR

DIG_FILT

1.27

1.84

3.00

5.30

1.46

2.23

3.76

6.84

1.84

3.00

5.30

9.91

2.61

4.53

8.37

16.05

4.15

7.60

14.52

28.34

7.22

13.75

26.80

52.92

13.36

26.04

51.38

102.07

25.65

50.61

100.53

200.37

Table 16: TCONV as a function of OSR & DIG_FILT

Maximum ODR

for OSR2=0x0 [Hz]

OSR

DIG_FILT

716.9

493.0

303.4

171.5

622.7

408.0

241.5

133.0

493.0

303.4

171.5

91.8

348.0

200.6

108.6

56.6

219.2

119.6

62.6

32.1

125.9

66.1

33.9

17.2

68.0

34.9

17.7

8.9

35.4

18.0

9.0

4.5

Table 17: Maximum Output Data Rate (ODR) as a function of OSR & DIG_FILT

15.1.6. TRIG_INT_SEL

When set to 0 the TRIG_INT pin is in trigger mode. When set to 1 the TRIG_INT pin acts as an interrupt pin.

15.1.7. COMM_MODE[1:0]

When set to 0x2 only SPI communication is allowed. When set to 0x3 only I2C communication is allowed.

When set to 0x0 or 0x1 both communication modes can be used but the selection is made by the CS pin.

15.1.8. WOC_DIFF

When wake-on-change mode is enabled this parameter defines the difference needed between the current

measurement and the previous measurement (Δ{sample(t),sample(t-1)}) that will cause the interrupt pin to

toggle.

MeleXIs P_EN = 0x0 _—- 2’s complement unsigned OpT = DLSB em = 2 L53 2’s complement unsigned OpT = DLSB em = 2 L53 unsigned our = 2 L53 unsigned our = 2 L53 Table 18: Output Range and Type as afunctian of TCMP_EN and RES_XYZ:(RES)9RE5Y,RE51) -— TCMPJN = on

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15.1.9. EXT_TRIG

Allows for external trigger events when set to 1 and TRIG_INT_SEL = 0. When enabled an acquisition will

start with the external trigger pin detects a high value. Acquisitions will continue to be triggered until the

EST_TRIG pin is brought low.

15.1.10. TCMP_EN

Enables (1) or disables (0) the on-chip sensitivity drift compensation. Enabling the temperature

compensation will influence the way the magnetic values are encoded and transmitted to the system

microcontroller as shown in the table below.

ABA

TCMP_EN = 0x0

TCMP_EN = 0x1

RANGE

TYPE

RANGE

TYPE

RESi

0 ±215

2’s complement

0µT = 0LSB

±215

unsigned

0µT = 2

LSB

1 ±215

2’s complement

0µT = 0LSB

±215

unsigned

0µT = 2

LSB

2 ±22000

unsigned

0µT = 2

LSB

N/A

3 ±11000

unsigned

0µT = 2

LSB

Table 18: Output Range and Type as a function of TCMP_EN and RES_XYZ={RESX,RESY,RESZ}

15.1.11. BURST_SEL[3:0]

Defines the axes that will be converted in burst mode if the SB command argument is 0.

15.1.12. OSR2[1:0]

Selects the temperature sensor ADC oversampling ratio

15.1.13. RES_XYZ[5:0]

See 15.4.1 GAIN_SEL for the relationship between the gain and resolution. Additionally, section 15.1.10

TCMP_EN for the relationship between RES_XYZ and the output data format.

15.1.14. DIG_FILT[1:0]

See 15.1.5 for the selection of DIG_FILT and the impact on conversion time

15.1.15. OSR[1:0]

Oversampling ratio for the magnetic measurements

15.1.16. SENS_TC_HT[7:0]

Sensitivity drift compensation factor for T > TREF

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15.1.17. SENS_TC_LT[7:0]

Sensitivity drift compensation factor for T < TREF

15.1.18. OFFSET_i[15:0]

Constant offset correction, independent of temperature, and programmable for each individual axis where

i=X, Y, or Z.

15.1.19. WOi_THRESHOLS[15:0]

Wake-on-change threshold. Independently programmable for each magnetic axis (i=X, Y, Z) and temperature

(i=T)

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16. Recommended Application Diagram

1.1 I2C

MLX90393

VDDIO

SDA/MOSI

SCL/SCLK

SENB/CS

A1 A0 I2C Address

-------------------------------------

Vss Vss 0001100R/W

Vss Vdd 0001101R/W

Vdd Vss 0001110R/W

Vdd Vdd 0001111R/W

VDD

INT

VSS

VDDIO

(1.71V - VDD)

VDD

(2.2V - 3.6V)

MCU

Interrupt/DRDY

I2C

R1=R2=10K

C1=C2=0.1uF

INT/TRG Trigger

1.2 SPI

MLX90393

VDDIO

SDA/MOSI

SCL/SCLK

SENB/CS

VDD

INT

VSS

VDDIO

(1.71V - VDD)

VDD

(2.2V - 3.6V)

MCU

Interrupt/DRDY

SPI

C1=C2=0.1uF

INT/TRG Trigger

MISO

Short on PCB

for 3-wire SPI

MeIeXis ”I M M m I 2 3 ‘6: L (9 E 22 V J W H H — L D DZ All mmunsms m mm Yype DXE N e A Al A3 D2 E2 L K 0 mm 0.80 0.00 020 1.55 1,55 0.30 020 Illa m '6 050 max 100 nus REF 1,30 1,30 0,50 - n30 Mme: IYoleranneMDmnEis nImm 2 PM 1 mmmennmn mayvzy, Figure 9: Package Out/me Dummy For further detax ethod for product integra soldering recommendation

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17. Packaging Specification

17.1. QFN package

The MLX90393 shall be delivered in a QFN package as shown below in Figure 9.

Figure 9: Package Outline Drawing

The sensing elements – Hall plates with the patented IMC technology – are located in the center of the die, which on its turn

is located in the center of the package. The pinout (in name and function) is given in section 7.

18. Standard Information

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level

according to standards in place in Semiconductor industry.

For further details about test method references and for compliance verification of selected soldering method for

product integration, Melexis recommends reviewing on our web site the General Guidelines soldering

recommendation. For all soldering technologies deviating from the one mentioned in above document (regarding peak

Melexis st-delivery capability, Melexis recommends t lead trimming and forming recommendations romoting lead free solutions. For more information directive on the Restriction Of the use of certain htt : www melexis.com en ualit -Environment Added additional ordering codes for up to 16 sensors on the same Added E temperature code for -40°C capable products and the F www.melexis.com.

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temperature, temperature gradient, temperature profile, etc.), additional classification and qualification tests have to

be agreed upon with Melexis.

For package technology embedding trim and form post-delivery capability, Melexis recommends to consult the

dedicated trim & form recommendation application note: lead trimming and forming recommendations

Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information

on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain

Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment

19. ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

20. Revision History

Date Revision Remark

11-Nov-2014 001  First Document Release

16-Feb-2015 002  Changed Ordering Code to indicate QFN wettable flanks

 Update Document number

 Added description of yellow cells in Table 1 and Table 2.

13-Jul-2017 003  Added additional ordering codes for up to 16 sensors on the same

bus and their description in Table 7

 Added E temperature code for -40°C capable products and the

associated update of the operating range in Chapter 3

 Updated template to new Melexis format

21. Contact

For the latest version of this document, go to our website at www.melexis.com.

For additional information, please contact our Direct Sales team and get help for your specific needs:

Europe, Africa Telephone: +32 13 67 04 95

Email : sales_europe@melexis.com

Americas Telephone: +1 603 223 2362

Email : sales_usa@melexis.com

Asia Email : sales_asia@melexis.com

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22. Disclaimer

The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the

furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special,

consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-

infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.

The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to

designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current.

Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a

particular purpose.

The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, explicitly or implicitly, to

any party any patent rights, licenses, or any other intellectual property rights.

This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities.

The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be

suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or life-

sustaining equipment are specifically not recommended by Melexis.

The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage,

recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons: 2) civil

firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone

or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any

similar violent situation.

The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-and-

conditions.

This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.

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