zQSFP+ Stacked Conn Appl Spec Datasheet by Molex

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) olex C TABLE OF CONTENTS REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. DATE. DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY. AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 1 of 13
DATE:
2013/06/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
AS
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171565
-
0002
Jkachlic
TEMPLATE FILENAME: AS1712080002.DOC
TABLE OF CONTENTS
1.0 SCOPE
2.0 PC BOARD REQUIREMENTS
2.1 MATERIAL THICKNESS
2.2 TOLERANCE
2.3 HOLE DIMENSIONS
2.4 LAYOUT
3.0 HIGHSPEED ROUTING
3.1 GENERAL ROUTING EXAMPLE
3.2 HIGH-SPEED TRANSMISSION LINE PLANE
3.3 HIGH-SPEED REFERENCE PLANE ANTI-PAD
3.4 CONNECTOR PRESS-FIT INTERFACE VIA STUBS
3.5 SKEW COMPENSATION
3.6 TRACE COMPARSION
4.0 PIN ASSIGNMENTS
Routing Guideline
Views .bdl
) Product Series DescriEtion REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. DATE. DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY. AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 2 of 13
DATE:
2013/06/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
AS
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171565
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0002
Jkachlic
TEMPLATE FILENAME: AS1712080002.DOC
1.0 SCOPE
This specification covers the high-speed PCB routing recommendations for the 0.80mm centerline
Stacked zQSFP+ Connector series products listed below. The connector is a stacked dual port assembly
and is available in a 2x1,2x2, 2X3 configuration. Eight differential pairs are assigned per port. The
connector has 38 contacts per port of which 26 can be assigned to signals and 12 are for ground
terminals. The connector is a right angle press-fit compliant pin type designed for use with 0.37mm
finished vias for the signal pins.
The connector has compliant pin contacts for mechanical retention to the PC board. The connector
provides inner electromagnetic interference (EMI) suppression ground spring-fingers that contact the
mating plug and is available with either an outer Elastomeric or Metal EMI gasket that contacts the panel.
The connector assembly is designed to be inserted through a standard bezel after being seated onto the
PC board.
Disclaimer: Molex does not guarantee the performance of the final product to match the information
provided in this document. All information in this report is considered proprietary, confidential and the
property of Molex Inc. This guide is not intended as a substitute for engineering analysis.
Product Series Description
171208-**** 2X1 Connector with Elastomeric EMI Gasket
171262-**** 2X3 Connector with Elastomeric EMI Gasket
171565-**** 2X1 thru 2X3 Connector with Elastomeric EMI Gasket and Enhanced EMI cage
171722-**** 2X1 thru 2X3 Connector with Metal EMI Gasket and Enhanced EMI cage
170879-**** 2X1 Connector with Thermal Management Component
171233-**** 2X3 Connector with Thermal Management Component
2.0 PC BOARD REQUIREMENTS
2.1 MATERIAL THICKNESS
The recommended minimum pc board thickness shall be 1.57 mm. Suitable pc board material shall
be glass epoxy (FR-4 or G-10).
2.2 TOLERANCE
Maximum allowable bow of the pc board shall be 0.08 mm over the length of the connector assembly.
2.3 HOLE DIMENSIONS
The holes for the connector assembly must be drilled and plated through to dimensions specified in
Figure 2.
2.4 LAYOUT
The holes for the connector assembly must be precisely located to ensure proper placement and
optimum performance of the connector assembly. Recommended hole pattern, dimensions, and
tolerances are provided in Figure 3.
) olex C ’ * THI. ' EE " -I‘7 T.,T-‘—L THI. KKE ‘: ELEZTI',* E " ITE ‘ LEI. B" REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. DATE. DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY. AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 3 of 13
DATE:
2013/06/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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TEMPLATE FILENAME: AS1712080002.DOC
Recommended Hole Dimensions
MM / (INCH) MM / (INCH) - # DRILL MM / (INCH)
1.05+/-0.05 (.0413+/-.002)
1.181 (.0465) - # 56 1.40 (.055)
0.81+/-0.05 (.032+/-.002) 0.914 (.036) - # 64 1.16 (.046)
0.56+/-0.05 (.022+/-.002) 0.660 (.026) - # 71 0.91 (.036)
0.46+/-0.05 (.0181+/-.002)
0.572 (.022) - # 74 0.81 (.032)
0.37+/-0.05 (.0146+/-.002)
0.457 (.018) - # 77 0.72 (.028)
Note: Refer to appropriate sales drawing for recommended pcb holes and pcb thickness.
PLATING DETAIL FOR COMPLIANT PIN HOLES
Figure 2
) olex C 5: EM : REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. DATE. DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY. AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 4 of 13
DATE:
2013/06/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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TEMPLATE FILENAME: AS1712080002.DOC
Recommended PC Board Layout for the Connector Assembly
Connector
Pattern Detail
Figure 3
) olex C Er,“ :meE SEE L.TE 1 *EE yEnxL / , N REVISION: ECR/ECN INFORMATION. TITLE: SHEET No. EC N DATE. DOCUMENT NUMBER CREATED / REVISED BY: CHECKED BY: APPROVED BY: AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 5 of 13
DATE:
2013/06/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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TEMPLATE FILENAME: AS1712080002.DOC
Recommended Keep-out Zone Area Layout on PC Board for Connector Assembly
Notes:
1. The entire area under the connector cage is a component keep-out zone. The area under the
connector module is a trace keep-out area
2. Cross hatched areas indicate places where the plastic housing and metal cage may be in
contact with the PCB surface. These areas are trace keep-out zones.
3. These rectangular zones are for LED placement. LED height should not exceed 0.8 and
placement should be centered within this LED keep-in zone.
4. Recommended LED chip package size is 0805.
> olex C REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No: DATE: DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 6 of 13
DATE:
2013/06/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
AS
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171565
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0002
Jkachlic
TEMPLATE FILENAME: AS1712080002.DOC
3.0 HIGH-SPEED ROUTING
3.1 GENERAL 2X3 ROUTING EXAMPLE
Showing 6 layers overlaid for a 2X3 side by side configuration with EMI pin field
Routing example shown for reference only.
Shown with 0.127mm (0.005”) traces and 0.254mm (0.010”) spaces
0.75mm (0.0295”) spaces between pair traces.
1ST LAYER 2ND LAYER 3RD LAYER
4TH LAYER 5TH LAYER 6TH LAYER
olex REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC N DATE: DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 7 of 13
DATE:
2013/06/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
AS
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171565
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0002
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TEMPLATE FILENAME: AS1712080002.DOC
Showing 4 layers overlaid for a 2X3 side by side configuration with EMI pin field
Routing example shown for reference only.
Shown with 0.127mm (0.005”) traces and 0.254mm (0.010”) spaces
0.75mm (0.0295”) spaces between pair traces.
1ST LAYER 2ND LAYER
3RD LAYER 4TH LAYER
> olex‘ C REVISION: ECR/ECN INFORMATION. TITLE: SHEET No. EC No: DATE. DOCUMENT NUMBER CREATED / REVISED BY: CHECKED BY: APPROVED BY: AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 8 of 13
DATE:
2013/06/19
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TEMPLATE FILENAME: AS1712080002.DOC
3.2 HIGH-SPEED TRANSMISSION LINE PLANE
Reference ground layer shown and spacing between trace pairs
Routing example shown for reference only
) olex C ~H REF \LL MEF REVISION: ECR/ECN INFORMATION. TITLE: SHEET No. EC No: DATE. DOCUMENT NUMBER CREATED / REVISED BY: CHECKED BY: APPROVED BY: AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 9 of 13
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TEMPLATE FILENAME: AS1712080002.DOC
Trace detail typical for all trace positions
Note:
Option pinning VIA within connector footprint for additional electrical performance, location and size
can vary from recommendation to meet board thickness, routing and electrical performance
requirements.
) olex C JET-ML LET-4L REVISION: ECR/ECN INFORMATION. TITLE: SHEET No. EC No: DATE. DOCUMENT NUMBER CREATED / REVISED BY: CHECKED BY: APPROVED BY: AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 10 of 13
DATE:
2013/06/19
DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
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3.3 HIGH-SPEED REFERENCE PLANE ANTI-PAD
Signal Ground Planes Non-Signal Planes
) olex C BOTTOM LAU NCH *1 E7 ATW 7' WT] C\75‘ VPFiWFF‘ Lzy, TOP LAUNCH REVISION: ECR/ECN INFORMATION. TITLE: SHEET No. EC No: DATE. DOCUMENT NUMBER CREATED / REVISED BY: CHECKED BY: APPROVED BY: AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
SHEET No.
2 EC No: UCP2013-5477 11 of 13
DATE:
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TEMPLATE FILENAME: AS1712080002.DOC
3.4 CONNECTOR PRESS-FIT INTERFACE VIA STUBS
BOTTOM LAUNCH
DRIVEN VIA
(PREFERRED)
TOP LAUNCH
STUB VIA
(WORSE CASE)
STANDARD VIA CONFIGURATION
BACK DRILL DEPTH NOT TO EXCEED
1.00mm FROM TOP
Only two annular rings are required for retention of the press-fit via within the printed circuit consequently
annular rings on the bottom layer are not needed. Removing the bottom layer annular ring helps minimize
the parasitic stub capacitance created by the via.
The anti-pad can be used on other ground layers not shown above. Alternatively, the anti-pad can be made
larger with a broader keep-out region on these other ground layers to minimize parasitic capacitance.
For the connector press-fit vias, specify not only the 0.37mm (0.014") finished hole size but also the
0.45715mm (0.018") drill size for the board fabrication.
) olex C REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. DATE. DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY. AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
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DATE:
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3.5 SKEW COMPENSATION
PREFERRED NOT RECOMMENDED
It is recommended that skew compensation be distributed verses grouped in one or more
locations.
3.6 TRACE COMPARISON
TRANSITION SHOULD BE SYMETRIC
> olex C REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. DATE. DOCUMENT NUMBER CREATED / REVISED BY. CHECKED BY. APPROVED BY. AS-171565-0002
ZQSFP+ STACKED CONNECTOR
BOARD ROUTING RECOMMENDATIONS
REVISION: ECR/ECN INFORMATION: TITLE:
SI ROUTING GUIDELINES FOR
ZQSFP+ STACKED CONNECTORS
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DATE:
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4.0 Pin Assignments
Notes:
1. See sheet no. 4 for physical locations of pin assignments
2. Reference SFF-8436 for further details
Lower Port
Upper Port
Cage
Pin Symbol Description
L1 GND Ground
L2 Tx2n Transmitter Inverted Data Input
L3 Tx2p Transmitter Non-Inverted Data Input
L4 GND Ground
L5 Tx4n Transmitter Inverted Data Input
L6 Tx4p Transmitter Non-Inverted Data Input
L7 GND Ground
L8 ModSelL Module Select
L9 ResetL Module Reset
L10 Vcc Rx +3.3V Power Supply Receiver
L11 SCL 2-wire serial interface clock
L12 SDA 2-wire serial interface data
L13 GND Ground
L14 Rx3p Receiver Non-Inverted Data Input
L15 Rx3n Receiver Inverted Data Input
L16 GND Ground
L17 Rx1p Receiver Non-Inverted Data Input
L18 RX1n Receiver Inverted Data Input
L19 GND Ground
Pin Symbol Description
L38 GND Ground
L37 Tx1n Transmitter Inverted Data Input
L36 Tx1p Transmitter Non-Inverted Data Input
L35 GND Ground
L34 Tx3n Transmitter Inverted Data Input
L33 Tx3p Transmitter Non-Inverted Data Input
L32 GND Ground
L31 LPMode Low Power Mode
L30 Vcc1 +3.3V Power Supply
L29 Vcc Tx +3.3V Power Supply Transmitter
L28 IntL Interrupt
L27 ModPrsL Module Present
L26 GND Ground
L25 Rx4p Receiver Non-Inverted Data Input
L24 Rx4n Receiver Inverted Data Input
L23 GND Ground
L22 Rx2p Receiver Non-Inverted Data Input
L21 RX2n Receiver Inverted Data Input
L20 GND Ground
Pin Symbol Description
U1 GND Ground
U2 Tx2n Transmitter Inverted Data Input
U3 Tx2p Transmitter Non-Inverted Data Input
U4 GND Ground
U5 Tx4n Transmitter Inverted Data Input
U6 Tx4p Transmitter Non-Inverted Data Input
U7 GND Ground
U8 ModSelL Module Select
U9 ResetL Module Reset
U10 Vcc Rx +3.3V Power Supply Receiver
U11 SCL 2-wire serial interface clock
U12 SDA 2-wire serial interface data
U13 GND Ground
U14 Rx3p Receiver Non-Inverted Data Input
U15 Rx3n Receiver Inverted Data Input
U16 GND Ground
U17 Rx1p Receiver Non-Inverted Data Input
U18 RX1n Receiver Inverted Data Input
U19 GND Ground
Pin Symbol Description
U38 GND Ground
U37 Tx1n Transmitter Inverted Data Input
U36 Tx1p Transmitter Non-Inverted Data Input
U35 GND Ground
U34 Tx3n Transmitter Inverted Data Input
U33 Tx3p Transmitter Non-Inverted Data Input
U32 GND Ground
U31 LPMode Low Power Mode
U30 Vcc1 +3.3V Power Supply
U29 Vcc Tx +3.3V Power Supply Transmitter
U28 IntL Interrupt
U27 ModPrsL Module Present
U26 GND Ground
U25 Rx4p Receiver Non-Inverted Data Input
U24 Rx4n Receiver Inverted Data Input
U23 GND Ground
U22 Rx2p Receiver Non-Inverted Data Input
U21 RX2n Receiver Inverted Data Input
U20 GND Ground
Pin Symbol Description
C1 GND Ground
C2 GND Ground
C3 GND Ground
C4 GND Ground
C5 GND Ground
C6 GND Ground
C7 GND Ground
Pin Symbol Description
C8 GND Ground
C9 GND Ground
C10 GND Ground
C11 GND Ground
C12 GND Ground
C13 GND Ground

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