Tflex 200T V0 Series Datasheet by Laird Technologies - Thermal Materials

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La' ") Sman Techno‘ogy Delweved
Tflex 200T V0 Series
Thermal Gap Filler
FEATURES
Thermal Conductivity 1.5 W/mK
Compliant Elastomeric based thin interface
material
Available in 0.008-inch (0.2mm), 0.010-inch
(0.25mm), 0.012-inch (0.30mm), 0.015-
inch (0.38mm) , and 0.020-inch (0.51mm)
thicknesses
• Slightly tacky for adhesion during assembly
and transport
• Competitive price for high volume
applications
• Available as individual custom parts, sheets,
or custom parts converted on a roll
THIN THERMALLY CONDUCTIVE ELASTOMERIC
INTERFACE MATERIAL
Tflex™ 200T V0 is a specially formulated thin gap filler thermal interface material designed for
thin interfaces that require a combination good thermal performance with great reliability. The
elastomeric property of Tflex™ 200T V0 provides good thermal performance in a thin interface
where reliability and shock and vibration considerations are critical performance considerations
in addition to low thermal resistance.
Tflex™ 200T V0’s unique silicone and ceramic filler technology allows a combination of great
reliability, good thermal performance, and easy handling.
APPLICATIONS
Memory Modules: DDR2, DDR3, SDRAM,
SRAM, RAM, NVRAM
• LED solid state lighting
• Power electronics
Americas: +1.800.843.4556
Europe: +49.8031.24600
Asia: +86.755.2714.116
CLV-customerservice@lairdtech.com
Tflex 200T V0 Series
Thermal Gap Filler
THR-DS-TFLEX-200T-V0_0714
Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user
since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials
or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird
Technologies terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies’ products are sold pursuant to the Laird
Technologies’ terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request. A15922-00 Rev D., 07/14. © 2014 All Rights Reserved. Laird Technologies is a
registered trademark of Laird Technologies, Inc.
8 MIL 10 MIL 15 MIL TEST METHOD
Construction &
Composition
Ceramic filled
silicone elastomer,
reinforced
Ceramic filled
silicone elastomer,
reinforced
Ceramic filled
silicone elastomer,
reinforced
Color Light Grey Light Grey Light Grey Visual
Thickness 0.008”
(0.203mm)
0.010”
(0.254mm)
0.015”
(0.381mm)
Thickness tolerance ±0.0015”
(±0.038mm)
±0.0015”
(±0.038mm)
±0.00225”
(±0.057mm)
Specific Gravity
(Density) 2.32 g/cc 2.32 g/cc 2.32 g/cc Helium
Pycnometer
Hardness 3 seconds
(Shore 00) 55 55 55 ASTM D2240
Outgassing TML
(Post Cured) 0.38% 0.38% 0.38% ASTM E595
Outgassing CVCM
(Post Cured ) 0.11% 0.11% 0.11% ASTM E595
UL Flammability
Rating 94 V0 94 V0 94 V0 E180840
Temperature Range -45°C to 200°C -45°C to 200°C -45°C to 200°C
Thermal Conductivity 1.5 W/mK 1.5 W/mK 1.5 W/mK Hot Disk
Thermal Impedance
@ 10 psi
@ 69 KPa
0.384°C-in²/W
2.48°C-cm²/W
0.488°C-in²/W
3.14°C-cm²/W
0.714°C-in²/W
4.60°C-cm²/W
ASTM D5470
(modified)
Thermal Expansion
(30-150°C) 231.19ppm/°C 231.19ppm/°C 231.19ppm/°C IPC-TM-650
2.4 2.4
Volume Resistivity 3.5x1010 ohm-cm 3.5x1010 ohm-cm 3.5x1010 ohm-cm ASTM D257
Dielectric Constant @
1 MHz 5.0 5.1 5.1 ASTM D150
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.

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