MSMLx5.0A - MSMLx170CAe3 Datasheet by Microsemi Corporation

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G:SNansenfi \‘cEE DO-215AB DO-214AB Package Package
Microsemi Proprietary and Confidential. MSMLG5.0A–MSMLG170CAe3, MSMLJ5.0A–MSMLJ170CAe3 Datasheet Revision D 1
MSMLG5.0A – MSMLG170CAe3, MSMLJ5.0A – MSMLJ170CAe3 Surface
Mount 3000 Watt Transient Voltage Suppressor
1 Product Overview
The MSMLG5.0A–MSMLG170CA and the MSMLJ5.0A–MSMLJ170CA series of high-reliability transient
voltage suppressors (TVS) protect circuits from voltage spikes containing up to 3000 W (10/1000 μs
model pulse). The SMLG gull-wing design in the DO-215AB package allows for visible solder connections.
The SMLJ J-bend design in the DO-214AB package allows for greater PC board mounting density.
Selections include unidirectional and bidirectional as well as RoHS-compliant versions. These are
available with a variety of upscreening options for enhanced reliability. They protect against the
secondary effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching
environments and induced by RF radiation. Since their response time is virtually instantaneous, they can
also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4.
For the latest information, visit our website .www.microsemi.com
1.1 Features
The following are key features of the MSMLG5.0A through MSMLG170CAe3 and the MSMLJ5.0A
through MSMLJ170CAe3 devices:
High-reliability devices with fabrication and assembly lot traceability for all M prefix devices
All devices are 100% surge tested
3σ lot norm screening performed on standby current (I ) for all M prefix devicesD
Available in both unidirectional and bidirectional versions
Moisture classification is “Level 1” with no dry pack required per IPC/JEDEC J-STD-020B for all M
prefix devices.
Enhanced reliability screening options with M prefix are available in reference to MIL-PRF-19500.
Refer to for more details on the screening High Reliability Up-Screened Plastic Products Portfolio
options (see Part Nomenclature for all available options).
RoHS compliant versions available
Axial-lead equivalent packages for thru-hole mounting are available as M5KP5.0A to M5KP110CA
with 5000 W rating (contact Microsemi for other surface mount options).
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1.2 Applications and Benefits
The following are benefits of the MSMLG5.0A through MSMLG170CAe3 and the MSMLJ5.0A through
MSMLJ170CAe3 devices.
Suppresses transients up to 3000 W (10/1000 µs test pulse—see )Figure 2 (see page 7)
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightning protection per IEC 61000-4-5 with 42 Ω source impedance:
Class 1 and 2: SML 5.0A to SML 170A or CA
Class 3: SML 5.0A to SML 150A or CA
Class 4: SML 5.0A to SML 75A or CA
Secondary lightning protection per IEC 61000-4-5 with 12 Ω source impedance:
Class 1: SML 5.0A to SML 170A or CA
Class 2: SML 5.0A to SML 90A or CA
Class 3: SML 5.0A to SML 48A or CA
Class 4: SML 5.0A to SML 24A or CA
Secondary lightning protection per IEC 61000-4-5 with 2 Ω source impedance:
Class 2: SML 5.0A to SML 43A or CA
Class 3: SML 5.0A to SML 22A or CA
Class 4: SML 5.0A to SML10A or CA
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Microsemi Proprietary and Confidential. MSMLG5.0A–MSMLG170CAe3, MSMLJ5.0A–MSMLJ170CAe3 Datasheet Revision D 3
1.3 Part Nomenclature
The following table lists the part nomenclature for the MSMLG5.0A through MSMLG170CAe3 and the
MSMLJ5.0 through MSMLJ170CAe3 devices.
Table 1 • MXSMLG5.0CAe3 Part Nomenclature
MX Reliability level*M (controlled product)
MA (aviconics grade) MX (reference JANTX)
MXL (MX life)
Blank = commercial
*(see )Hirel Non-Hermetic Product Portfolio
SM Surface-mount package
L3000 W power level
G or J Gull-wing or J-bend lead frame
5.0 Reverse standoff voltage (see Typical Electrical Performance (see page 5)
table)
CUni/bidirectional C = Bidirectional
Blank = Undirectional
A± 5% Tolerance level
e3 RoHS Compliance e3 = RoHS compliant
Blank = non-RoHS compliant
1.4 Symbols and Definitions
The following table lists the symbols and definitions used for the MSMLG5.0A through MSMLG170CAe3
and the MSMLJ5.0 through MSMLJ170CAe3 devices.
Table 2 • Symbols and Definitions
Symbol Value Definition
I(BR) Breakdown current The current used for measuring breakdown voltage V .(BR)
IDStandby current The current at the rated standoff voltage V .WM
IFForward current The forward current dc value, no alternating component.
IPP Peak impulse current The peak current during the impulse.
PPP Peak pulse Power The peak power dissipation resulting from peak impulse current I .PP
V(BR) Minimum breakdown voltage The minimum voltage the device will exhibit at a specified current.
VCClamping voltage Clamping voltage at I (peak pulse current) at the specified pulse PP
conditions (typically shown as maximum value).
VWM Rated working standoff voltage The maximum peak voltage that can be applied over the operating
temperature range.
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1.
2.
2 Electrical Specifications
This section shows the electrical specifications for the MSMLG5.0A–MSMLG170CA and the MSMLJ5.0A–
MSMLJ170CA devices.
2.1 Maximum Ratings
The following table shows you the absolute maximum ratings for the MSMLG5.0A–MSMLG170CA and
the MSMLJ5.0A–MSMLJ170CA devices.
Table 3 • Absolute Maximum Ratings
Parameter/Test Conditions Symbol Value Unit
Junction and storage temperature T and TJ STG –65 to 150 °C
Thermal resistance junction-to-lead RθJL 17.5 °C/W
Thermal resistance junction-to-ambient1RθJA 77.5
Peak pulse power dissipation at 25 °C
(10/1000 μs, see Figures 1, 2, and 3).
PPP 3000 W
Impulse repetition rate (duty factor) df 0.01 or
less
%
t (0 V to V min)clamping (BR) Unidirectional tclamping <100 ps
Bidirectional <5 ns
Rated average power dissipation TL = 45 °C PM(AV) 6 W
TL = 25 °C 1.611
Maximum forward surge current2IFSM 200 A (pk)
Solder temperature at 10 s TSP 260 °C
Notes:
When mounted on FR4 PC board (1 oz Cu) with recommended mounting pad (see pad layout).
Peak impulse of 8.3 ms half-sine wave at 25 °C (unidirectional only).
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2.2 Typical Electrical Performance
The following table shows the Electrical characteristics for the MSMLG5.0A–MSMLG170CA and the
MSMLJ5.05A–MSMLJ170CA devices at 25 °C unless otherwise specified.
For bidirectional device types, indicate a CA suffix after the part number (i.e. MSMLG170CA).
Table 4 • Typical Electrical Performance
Part Number V WM
Reverse
Standoff
Voltage
V BreakdownBR
Voltage at I(BR)
I Test BR
Current
V Max C
Clamping
Voltage
at IPP
I Max PP
Peak
Pulse
Current
I DMax
Stand-by
Current
at V WM
Gull-wing J-bend (V) (V) (mA) (V) (A) (µA)
SMLG5.0A
SMLG6.0A
SMLJ5.0A
SMLJ6.0A
5.0
6.0
6.40 – 7.00
6.67 – 7.37
10
10
9.2
10.3
326.0
291.3
1000
1000
SMLG6.5A
SMLG7.0A
SMLJ6.5A
SMLJ7.0A
6.5
7.0
7.22 – 7.98
7.78 – 8.60
10
10
11.2
12.0
267.9
250.0
500
200
SMLG7.5A
SMLG8.0A
SMLJ7.5A
SMLJ8.0A
7.5
8.0
8.33 – 9.21
8.89 – 9.83
1
1
12.9
13.6
232.6
220.6
100
50
SMLG8.5A
SMLG9.0A
SMLJ8.5A
SMLJ9.0A
8.5
9.0
9.44 – 10.4
10.0 – 11.1
1
1
14.4
15.4
208.4
194.8
25
10
SMLG10A
SMLG11A
SMLJ10A
SMLJ11A
10
11
11.1 – 12.3
12.2 – 13.5
1
1
17.0
18.2
176.4
164.8
5
5
SMLG12A
SMLG13A
SMLJ12A
SMLJ13A
12
13
13.3 – 14.7
14.4 – 15.9
1
1
19.9
21.5
150.6
139.4
5
5
SMLG14A
SMLG15A
SMLJ14A
SMLJ15A
14
15
15.6 – 17.2
16.7 – 18.5
1
1
23.2
24.4
129.4
123.0
2
2
SMLG16A
SMLG17A
SMLJ16A
SMLJ17A
16
17
17.8 – 19.7
18.9 – 20.9
1
1
26.0
27.6
115.4
106.6
2
2
SMLG18A
SMLG20A
SMLJ18A
SMLJ20A
18
20
20.0 – 22.1
22.2 – 24.5
1
1
29.2
32.4
102.8
92.6
2
2
SMLG22A
SMLG24A
SMLJ22A
SMLJ24A
22
24
24.4 – 26.9
26.7 – 29.5
1
1
35.5
38.9
84.4
77.2
2
2
SMLG26A
SMLG28A
SMLJ26A
SMLJ28A
26
28
28.9 – 31.9
31.1 – 34.4
1
1
42.1
45.4
71.2
66.0
2
2
SMLG30A
SMLG33A
SMLJ30A
SMLJ33A
30
33
33.3 – 36.8
36.7 – 40.6
1
1
48.4
53.3
62.0
56.2
2
2
SMLG36A
SMLG40A
SMLJ36A
SMLJ40A
36
40
40.0 – 44.2
44.4 – 49.1
1
1
58.1
64.5
51.6
46.4
2
2
SMLG43A
SMLG45A
SMLJ43A
SMLJ45A
43
45
47.8 – 52.8
50.0 – 55.3
1
1
69.4
72.7
43.2
41.2
2
2
SMLG48A
SMLG51A
SMLJ48A
SMLJ51A
48
51
53.3 – 58.9
56.7 – 62.7
1
1
77.4
82.4
38.8
36.4
2
2
SMLG54A
SMLG58A
SMLJ54A
SMLJ58A
54
58
60.0 – 66.3
64.4 – 71.2
1
1
87.1
93.6
34.4
32.0
2
2
SMLG60A
SMLG64A
SMLJ60A
SMLJ64A
60
64
66.7 – 73.7
71.1 – 78.6
1
1
96.8
103.0
31.0
29.2
2
2
SMLG70A
SMLG75A
SMLJ70A
SMLJ75A
70
75
77.8 – 86.0
83.3 – 92.1
1
1
113
121
26.6
24.8
2
2
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Microsemi Proprietary and Confidential. MSMLG5.0A–MSMLG170CAe3, MSMLJ5.0A–MSMLJ170CAe3 Datasheet Revision D 6
Part Number V WM
Reverse
Standoff
Voltage
V BreakdownBR
Voltage at I(BR)
I Test BR
Current
V Max C
Clamping
Voltage
at IPP
I Max PP
Peak
Pulse
Current
I DMax
Stand-by
Current
at V WM
SMLG78A
SMLG85A
SMLJ78A
SMLJ85A
78
85
86.7 – 95.8
94.4 – 104.0
1
1
126
137
22.8
20.8
2
2
SMLG90A
SMLG100A
SMLJ90A
SMLJ100A
90
100
100 – 111
111 – 123
1
1
146
162
20.6
18.6
2
2
SMLG110A
SMLG120A
SMLJ110A
SMLJ120A
110
120
122 – 135
133 – 147
1
1
177
193
16.8
15.6
2
2
SMLG130A
SMLG150A
SMLJ130A
SMLJ150A
130
150
144 – 159
167 – 185
1
1
209
243
14.4
12.4
2
2
SMLG160A
SMLG170A
SMLJ160A
SMLJ170A
160
170
178 – 197
189 – 209
1
1
259
275
11.6
11.0
2
2
Bidirectional capacitance is half that shown in at 0 V.Figure 4 (see page 8)
2.3 Typical Performance Curves
This section shows the typical performance curves of the MSMLG5.0A–MSMLG170CA and the
MSMLJ5.0A–MSMLJ170CA devices.
The following graph shows peak-pulse power versus pulse time (up to 50% of exponentially decaying
pulse).
Figure 1 • Peak Pulse Power vs. Pulse Time (to 50% of exponentially decaying pulse)
The following graph shows the pulse waveform with these parameters: tr = 10 µs and tp = 1000 µs.
IPP - Peak Pulse Current A % '» Peak Pulse Power (Ppp) or continuous 100 +— Naaak va‘ue lpp m a Half value \pp / T 10 x woo us waveform \ as defined by R.E.A. U | | 1 2 3 tp 7 PulseTrme 7 ms 100% I I 3 Peak purse power 13 (Single pulse) ”5 \ o 75 \ in N 6 50 E g \ a) D- Average power \ .E 25 5 3 o u. 0 0 50 1 00 1 50 200 TL Lead Temperature "C
Microsemi Proprietary and Confidential. MSMLG5.0A–MSMLG170CAe3, MSMLJ5.0A–MSMLJ170CAe3 Datasheet Revision D 7
The following graph shows the pulse waveform with these parameters: tr = 10 µs and tp = 1000 µs.
Figure 2 • Pulse Waveform
The following graph shows the derating curve.
Figure 3 • Derating Curve
100,000 C — Capacitance (pF) 10,000 1,000 100 MEASURED AT ZERO BIAS MEASURED AY STANDOFF VOLTAGE 10 100 V1350 — Breakdown Voltage (V) 1000 o Microsemi a @szwtmn mum
Microsemi Proprietary and Confidential. MSMLG5.0A–MSMLG170CAe3, MSMLJ5.0A–MSMLJ170CAe3 Datasheet Revision D 8
The following graph shows the typical capacitance versus the breakdown voltage. Note that the
bidirectional capacitance is half that shown at 0 V.
Figure 4 • Typical Capacitance vs. Breakdown Voltage (Unidirectional Configuration)
Note:
Bidirectional capacitance is half that shown in Figure 4 at 0 V.
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1.
3 Package Specification
The following sections shows the package specifications for the SMLG (DO-215AB) and SMLG (DO-
214AB) packages.
3.1 Package Information
The following illustration shows the SMLJ DO-214AB package dimensions. The typical standoff height is
0.004 in—0.008 in (0.1—0.2 mm).
Figure 5 • SMLG (DO-215AB) Package Dimensions
The following table shows the SMLG DO-215AB mechanical and packaging information.
Table 5 • SMLG (DO-215AB) Mechanical and Package Information
Letter Dimensions (in.) Dimensions (mm)
A 0.115—0.121 2.92—3.07
B 0.260—0.280 6.60—7.11
C 0.220—0.245 5.59—6.22
E 0.077—0.110 1.95—2.80
F10.380—0.400 9.65—10.16
K 0.025—0.040 0.635—1.016
Note:
Dimesion "E" exceeds the JEDEC outline as shown.
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The following illustration shows the mechanical and packaging information for the SMLG (DO-214AB)
package.
Figure 6 • SMLJ_(DO-214AB)_Package_Dimensions
The following table shows the SMLJ DO-214AB mechanical and packaging information.
Table 6 • SMLJ (DO-214AB) Mechanical and Package Information
Letter Dimensions (in.) Dimensions (mm)
A 0.115—0.121 2.92—3.07
B 0.260—0.280 6.60—7.11
C 0.220—0.245 5.59—6.22
D 0.305—0.320 7.75—8.13
E 0.077—0.110 1.95—2.80
L 0.030—0.060 0.760—1.52
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Microsemi Proprietary and Confidential. MSMLG5.0A–MSMLG170CAe3, MSMLJ5.0A–MSMLJ170CAe3 Datasheet Revision D 11
3.2 Pad Layout
The following illustration shows the pad layout for the SMLG (DO-215AB) and SMLJ (DO-214AB)
packages.
Figure 7 • Pad Layout
The following table shows the SMLG DO-215AB pad layout dimensions.
Table 7 • SMLG (DO-215AB) Pad Layout Dimensions
Letter Dimensions (in.) Dimensions (mm)
A 0.510 12.95
B 0.110 2.79
C 0.150 3.81
The following table shows the SMLJ DO-214AB pad layout dimensions.
Table 8 • SMLJ (DO-214AB) Pad Layout Dimensions
Letter Dimensions (in.) Dimensions (mm)
A 0.390 9.90
B 0.110 2.79
C 0.150 3.81
0 Microsemi a @MICROEHIP company
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products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with
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