”A" PIN I ID.
V fi
”D”
7 .
O O 0 "073351
J
L W SEATING a
/ RAILS PLANE \
.040
[ 1.02 ]
i 1
0.64]
f \
.015 $00 H
0.160
[
4‘ [7-312 [6.50]
U U U U U U U B U §
U U U U U+1 U U j E
L 33.333931]
”W 0°“. 0“] TOL. NON- -CUM.
mo ornmpsnmwwmopunwnsonzn
'=[N0.DFPINSPERWW -..1]X0100R54] [64: 05]
ELECTRONICS. INC.
.025. ‘ .002 SQUARE
CONTACT DETAIL
SEATING PLANE
------ “i2: ..
‘7 .160
.125 065 [4.05]
[3.19] ms]
l_
2609 Bartram Road • Bristol, PA 19007-6810 USA
TEL 215-781-9956 • FAX 215-781-9845
WWW.ARIESELEC.COM • INFO@ARIESELEC.COM
12005
Rev. 4.3
1 of 1
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
FOR SOLDER PIN TAILS, SEE DATA SHEETS 12004
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION: ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION.
SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE
FURNISHED, DEPENDING ON QUANTITY.
ARIES RESERVES THE RIGHT TO CHANGE PRODUCT GENERAL SPECIFICATIONS
WITHOUT NOTICE
PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE
CONSIDERED UNCONTROLLED
FEATURES
• Bifurcated Contacts in Standard DIP Sockets with Solder Tails or Wire Wrap Pins
GENERAL SPECIFICATIONS
• STANDARD BODY: Black UL 94V-0 Glass-filled 4/6 Nylon
• BIFURCATED CONTACTS: Grade A Spring-tempered Phosphor Bronze per QQ-B-750
• PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-
N-290B; –OR– 200µ [5.08µ] min. matte Sn per ASTM B545-97(2004)e1 over 50µ [1.27µ] min. Ni
per SAE AMS-QQ-N-290B; –OR– 200µ [5.08µ] min. 90/10 Sn/Pb per MIL-T-10727 Type 1 over 50µ
[1.27µ] min. Ni per SAE AMS-QQ-N-290B
• CONTACT CURRENT RATING: 1.5 amps
• INSERTION FORCE: 110g/pin average
• WITHDRAWAL FORCE: 75g/pin average
• OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn; -67°F to
257°F [-55°C to 125°C] Au
• LEADS ACCEPTED: Flat leads up to 0.014 thick x 0.020 wide [0.36-0.51], Round
leads up to 0.020 [0.51] dia.
• LEAD LENGTHS: from seating plane from 0.075-0.160 [1.91-4.06]
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.045 ±0.002 [1.12 ±0.05] dia.
Series 501 Standard DIP Socket
w/Bifurcated Contacts & Wire Wrap Pins
ORDERING INFORMATION
XX-X 501-X XXX XX
Rails Option
WR = Without Rails
Plating
0 = Sn
1 = Au
0TL = Sn/Pb
Termination
2 = 2-level Wire Wrap
3 = 3-level Wire Wrap
Series
Row-to-Row Spacing (Dim. “C”)
2 = 0.200 [5.08]
3 = 0.300 [7.62]
6 = 0.600 [15.24]
No. of Pins
(See Table)
Centers “C” Width “D” Available Sizes
0.200 [5.08] 0.290 [7.36] 8, 10
0.300 [7.62] 0.390 [9.90] 8, 14-20
0.600 [15.24] 0.690 [17.54] 8-24, 28-40, 48
Wire Wrap Length “E”
2-level 0.410 [10.41]
3-level 0.690 [17.52]
Products related to this Datasheet
CONN IC DIP SOCKET 8POS TIN
CONN IC DIP SOCKET 8POS GOLD
CONN IC DIP SOCKET 8POS TIN
CONN IC DIP SOCKET 10POS TIN
CONN IC DIP SOCKET 10POS GOLD
CONN IC DIP SOCKET 10POS TIN
CONN IC DIP SOCKET 10POS GOLD
CONN IC DIP SOCKET 14POS TIN
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 16POS TIN
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 16POS TIN
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 18POS TIN
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 18POS TIN
CONN IC DIP SOCKET 18POS GOLD
CONN IC DIP SOCKET 24POS TIN
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 24POS TIN
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 28POS TIN
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 32POS TIN
CONN IC DIP SOCKET 32POS GOLD
CONN IC DIP SOCKET 32POS TIN
CONN IC DIP SOCKET 32POS GOLD
CONN IC DIP SOCKET 40POS TIN