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SPEC NO: DSAM8567 REV NO: V.2A DATE: MAR/20/2015 PAGE: 1 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: P.Cheng ERP: 1332000162
50mm (2.0INCH) 5x7 DOT MATRIX DISPLAY
Part Number: TA20-11SURKWA Hyper Red
Features
z2.0 inch matrix height.
zDot size 5mm.
zLow current operation.
zHigh contrast and light output.
zStackable horizontally.
zEasy mounting on P.C. boards or sockets.
zCategorized for luminous intensity.
zMechanically rugged.
zStandard : gray face, white dot.
zRoHS compliant.
Description
The Hyper Red source color devices are made with Al-
GaInP on GaAs substrate Light Emitting Diode.
Package Dimensions& Internal Circuit Diagram
Notes:
1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted.
2. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
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SPEC NO: DSAM8567 REV NO: V.2A DATE: MAR/20/2015 PAGE: 2 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: P.Cheng ERP: 1332000162
Selection Guide
Notes:
1. Luminous intensity/ luminous Flux: +/-15%.
*Luminous intensity value is traceable to the CIE127-2007 compliant national standards.
Absolute Maximum Ratings at TA=25°C
Electrical / Optical Characteristics at TA=25°C
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. 2mm below package base.
Part No. Dice Lens Type
Iv (ucd) [1]
@ 10mA Description
Min. Typ.
TA20-11SURKWA Hyper Red (AlGaInP) White Diffused
52000 130000
*21000 *42000
Column Anode
Symbol Parameter Device Typ. Max. Units Test Conditions
λpeak Peak Wavelength Hyper Red 645 nm IF=20mA
λD [1] Dominant Wavelength Hyper Red 630 nm IF=20mA
Δλ1/2 Spectral Line Half-width Hyper Red 28 nm IF=20mA
C Capacitance Hyper Red 35 pF VF=0V;f=1MHz
VF [2] Forward Voltage Hyper Red 1.95 2.5 V IF=20mA
IR Reverse Current Hyper Red 10 uA VR=5V
Parameter Hyper Red Units
Power dissipation 75 mW
DC Forward Current 30 mA
Peak Forward Current [1] 185 mA
Reverse Voltage 5 V
Operating / Storage Temperature -40°C To +85°C
Lead Solder Temperature[2] 260°C For 3-5 Seconds
Notes:
1. Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
3. Wavelength value is traceable to the CIE127-2007 compliant national standards.
4. Excess driving current and/or operating temperature higher than recommended conditions may result in severe light degradation or
premature failure.
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g 1.0 .
. Ta=25 c
E
E
G 0.5
u
m
5
E o
g 450 500 550 600 650 700 750
wavelenglh x (mm)
RELATIVE \NTENSITY Vs. WAVELENGTH
20 2 5
n 4
< e="" 3="" 15="" e="" 2.0="" '="" .‘l="" e="" 12="" g;="" 1.5="" u="" s="" 5="" g="" 1.0="" e="" 5="" a="" e="" a="" g:="" 0.5="" h="" o="" is="" o="" 1.5="" 1.5="" 1.7="" 1.9="" 2.‘="" 23="" 3mm="" d="" a="" s="" ‘2="" ie="" 20="" forward="" vauumv)="" \r—menrd="" curran.="" (ma)="" ranwm:="" cumm="" vs.="" luminbus="" intensh’v="" vs.="" fdrward="" voltage="" forward="" curreny="" 50="" g="" 2,5="" e="" 40="" e="" 2-”="" g="" 30="" g="" 1.5="" t="" 2="" s="" 20="" e="" 1.0="" e="" io="" e="" 0.5="" l="" n="" 7",="" c="" 0="" 20="" ad="" 60="" 30="" m="" mo="" amman?="" yumpenflun="" ncc)="" forward="" current="" berat‘ng="" curve="" do="" 720="" o="" 20="" m="" so="" so="" amb‘enr="" vamp-raw"="" ncc)="" luminous="" intensitv="" vs.="" mam"="" temperature="">SPEC NO: DSAM8567 REV NO: V.2A DATE: MAR/20/2015 PAGE: 3 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: P.Cheng ERP: 1332000162
Hyper Red TA20-11SURKWA
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DUTSIDE LABEL
/ <2 ,[="" mwbe/box="" szupcs/aox="" instde="" label="" on="" iciluba="" mum".="" typefixzd-hxxx="" qwnsrcs="" couz:="" xx="" am.="" h="" xxxxxxxxrxxxx="" rahs="" cumnuam="" l="" numb-r="" or="" me="" ouiside="" labe‘="" 0n="" box="" —_\="" \h‘h‘hhhhhhhh="" main“,="" et"="" we="" ’numblr="" or="" da="" p="" .m="" 520="" cs="" xx="" «ax="" 77w.="" xx="" xx="" x="" r="" \“siw="" kw]="">SPEC NO: DSAM8567 REV NO: V.2A DATE: MAR/20/2015 PAGE: 4 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: P.Cheng ERP: 1332000162
PACKING & LABEL SPECIFICATIONS TA20-11SURKWA
Terms and conditions for the usage of this document
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without
notice. Before production usage customer should refer to the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental
and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible
for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has
special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with
Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes
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THROUGH HOLE DISPLAY MOUNTING METHOD
Lead Forming
Do not bend the component \eads by hand wtlnom proper toms
The beds should be bent by clincnmg the upper part or tne lead firm‘y such that Ihe bendmg tome
IS not exerted on the plasttc body
cnncn tne \ead |enmnal
wttn the hanging tool
m
V’Hoendtng stress)
/F(bendmg stress)
Not Recommended Recommended
Installation
1 Tne tnstauation process snoutd not apply stress to tne \ead temnnals
2 wnen msemng Vor assembty, ensure the termtnat ptten mamhes tne substrate board's note man to
prevent spreadmg or pinonmg the lead terminats
%| \WI
Not Recommended Recommended
, — ,
%I tWWtV/z \%
3.Tne component shau be ptaced atleast5mm1rorn edge owes to avmd damage caused
excessive heal during wave soldenng
>:5mm >:5mm
8“
Z
Not Recommended Recommended
SPEC NO: DSAM8567 REV NO: V.2A DATE: MAR/20/2015 PAGE: 5 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: P.Cheng ERP: 1332000162
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Recommended Wave Soldering Profiles:
(‘0) 300
250
N
o
c
or
o
'remperature
Tlme(sec)
Notes
t.Recommend preheat temperature or 105' c or less (as measured Witn a tnermocouple
attacned to tne LED pins) prior to immersion in tne solder wave vvitn a maximum
solder oatn temperature or zoo-c
2 Peak wave soldering temperature between 245's — 255'Clor 3sec (5 sec max)
3.Du not apply stress to the epoxy resin wnile the temperature is above we
4.Fixtures snould not incur stress on tne component wtren mounting and during soldering process.
5 SA!) 305 salder alloy is recommended
a No more men one wave soldering pass.
7 During wave soldering the PCB Ioprsuflace temperature should be kept below 105-0
Soldering General Notes:
1.Thruughshole displays are incompatible Witn reticw soldering
2 llcomponents Will undergo multiple soldering processes, orottierprocesses wtiere ttie components
may he sutziected to intense heat please ctreck vvitti Kingtrngnt tor compatibility.
CLEANING
i Mild "noeclean" lluxes are recommended loruse in soldering
2 it cleaning is required Kingbrigm recommends to wasn components witti wateronly
Do not use narsti organic solvents tor cleaning because ttiey may damage tne plastic pans
3.Tne cleaning process should take place at room temperature and the devices should not be wastied tor
more tnari one minute
4.wnen water is used in the cleaning process immediately remove excess moisture tromtne component Witti
lorced-air drying alterwards
CIRCUIT DESIGN NOTES
1 Protective current-limiting resistors may oe necessary to operate tne LEDs Witnin ttie specified range
2 LEDs mounted in parallel snould eacn be placed in series vvitri its own cunentelimiling resistor
Recommended Sel-up invalid Set-up
V5 "" v5
p GND
GND
3. Trie driving circuit snould be designed to protect trie LED against reverse voltages and transienlvollage
spikes wnen the circuit is powered up orsnutdown
A The safe operating current snould be cnosen alter considering the maximum ambient temperature of the
operating enVironment.
5 Prolonged reverse bias snould oe avoided as it could cause metal migration leading to an increase in
leakage current or causing a short circuit
SPEC NO: DSAM8567 REV NO: V.2A DATE: MAR/20/2015 PAGE: 6 OF 6
APPROVED: WYNEC CHECKED: Joe Lee DRAWN: P.Cheng ERP: 1332000162
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