MCP98244 Datasheet by Microchip Technology

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2012-2013 Microchip Technology Inc. DS22327C-page 1
MCP98244
Features
• Meets JEDEC Specification
- MCP98244 --> JC42.4-TSE2004B1
Temperature Sensor with 4 Kbit Serial
EEPROM for Serial Presence Detect (SPD)
•1MHz, 2-wire I
2C™ Interface
• Specified VDD Range: 1.7V to 3.6V
• Operating Current: 100 µA (typ., EEPROM Idle)
• Available Package: TDFN-8
Temperature Sensor Features
• Temperature-to-Digital Converter (°C)
• Sensor Accuracy (Grade B):
-±0.2°C/±1°C (typ./max.) +75°C to +95°C
- ±0.5°C/±2°C (typ./max.) +40°C to +125°C
- ±1°C/±3°C (typ./max.) -40°C to +125°C
Serial EEPROM Features
• Operating Current:
-Write 250 µA (typical) for 3 ms (typical)
- Read 100 µA (typical)
• Reversible Software Write Protect
• Software Write Protection for each 1 Kbit Block
• Organized as two banks of 256 x 8-bit (2 Kbit x 2)
Typical Applications
• DIMM Modules for Servers, PCs, and Laptops
• Temperature Sensing for Solid State Drive (SSD)
• General Purpose Temperature Datalog
Description
Microchip Technology Inc.’s MCP98244 digital
temperature sensor converts temperature from -40°C
and +125°C to a digital word. This sensor meets
JEDEC Specification JC42.4-TSE3000B1 Memory
Module Thermal Sensor Component. It provides an
accuracy of ±0.2°C/±1°C (typical/maximum) from
+75°C to +95°C with an operating voltage of 1.7V to
3.6V. In addition, MCP98244 has an integrated
EEPROM with two banks of 256 by 8 bit EEPROM (4k
Bit) which can be used to store memory module details
and vendor information.
The MCP98244 digital temperature sensor comes with
user-programmable registers that provide flexibility for
DIMM temperature-sensing applications. The registers
allow user-selectable settings such as Shutdown or
Low-Power modes and the specification of
temperature Event boundaries. When the temperature
changes beyond the specified Event boundary limits,
the MCP98244 outputs an Alert signal at the Event pin.
The user has the option of setting the temperature
Event output signal polarity as either an active-low or
active-high comparator output for thermostat operation,
or as a temperature Event interrupt output for
microprocessor-based systems.
The MCP98244 EEPROM is designed specifically for
DRAM DIMMs (Dual In-line Memory Modules) Serial
Presence Detect (SPD). It has four 128 Byte pages,
which can be Software Write Protected individually.
This allows DRAM vendor and product information to
be stored and write-protected.
This sensor has an industry standard I2C Fast Mode
Plus compatible 1 MHz serial interface.
Package Types
DIMM MODULE
MCP98244
8-Pin 2x3 TDFN*
* Includes Exposed Thermal Pad (EP); see Table 3- 1 .
SCL
Event
SDA
A1
A2
1
2
3
4
8
7
6
5
GND
A0 VDD
EP
9
DDR4 DIMM Temperature Sensor with EEPROM for SPD
MCP98244
DS22327C-page 2 2012-2013 Microchip Technology Inc.
NOTES:
2012-2013 Microchip Technology Inc. DS22327C-page 3
MCP98244
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD.................................................................................. 4.0V
Voltage at all Input/Output pins ............... GND – 0.3V to 4.0V
Pin A0 .......................................................GND – 0.3V to 11V
Storage temperature .....................................-65°C to +150°C
Ambient temp. with power applied ................-40°C to +125°C
Junction Temperature (TJ) .......................................... +150°C
ESD protection on all pins (HBM:MM) ................. (4 kV:200V)
Latch-Up Current at each pin (25°C) ....................... ±200 mA
†Notice: Stresses above those listed under “Maximum
ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
TEMPERATURE SENSOR DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 1.7V to 3.6V, GND = Ground,
and TA = -40°C to +125°C.
Parameters Sym Min Typ Max Unit Conditions
Temperature Sensor Accuracy
+75°C < TA +95°C TACY -1.0 ±0.2 +1.0 °C JC42.4 - TSE2004B1
Grade B Accuracy Specification
VDD = 1.7V to 3.6V
+40°C < TA +125°C -2.0 ±0.5 +2.0 °C
-40°C < TA +125°C -3.0 ±1 +3.0 °C
Temperature Conversion Time
0.5°C/bit tCONV —30 — ms
0.25°C/bit — 65 125 ms 15 s/sec (typical) (See Section 5.2.4)
0.125°C/bit — 130 — ms
0.0625°C/bit — 260 — ms
Power Supply
Specified Voltage Range VDD 1.7 — 3.6 V
Operating Current IDD_TS — 100 500 µA EEPROM Inactive
Shutdown Current ISHDN — 0.2 1 µA EEPROM Inactive, I2C Bus Inactive,
TA = 85°C
Power On Reset (POR) VPOR — 1.4 1.6 V Threshold for rising and falling VDD
Settling Time after POR tPOR — — 1 ms For warm and cold power cycles
Line Regulation °C — 0.2 — °C VDD = 1.7V to 3.6V
Event Output (Open-Drain output, external pull-up resistor required), see Section 5.2.3
High-Level Current (leakage) IOH —— 1 µAV
OH = VDD
Low-Level Voltage VOL —— 0.4 VI
OL= 3 mA (Active-Low, Pull-up
Resistor)
Thermal Response, from +25°C (Air) to +125°C (oil bath)
TDFN-8 tRES — 0.7 — s Time to 63% (89°C)
www.mxcrochxgcom/TmalEndurance
MCP98244
DS22327C-page 4 2012-2013 Microchip Technology Inc.
TEMPERATURE CHARACTERISTICS
MCP98244 EEPROM DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 1.7V to 3.6V, GND = Ground,
and TA = -40°C to +125°C.
Parameters Sym Min Typ Max Unit Conditions
Current, EEPROM write (for tWC)I
DD_EE — 250 2000 µA Sensor in Shutdown Mode
Current, EEPROM read IDD_EE — 100 500 µA
Write Cycle time (byte/page) tWC —3 5 ms
Endurance TA = +25°C — — 10k — cycles Write Cycles, VDD = 3.3V (Note 1, Note 2)
EEPROM Write Temperature EEWRITE 0— 85 °C
EEPROM Read Temperature EEREAD -40 — 125 °C For minimum read temperature, see Note 1
Write Protect Voltage
SWP and CWP Voltage VHV 7 — 10 V Applied at A0 pin
Note 1: Characterized but not production tested.
2: For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can
be obtained from Microchip’s web site at www.microchip.com/TotalEndurance.
INPUT/OUTPUT PIN DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 1.7V to 3.6V, GND = Ground and
TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Serial Input/Output (SCL, SDA, A0, A1, A2)
Input
High-Level Voltage VIH 0.7VDD ——V
Low-Level Voltage VIL — — 0.3VDD V
Input Current IIN — — ±5 µA SDA and SCL only
Input Impedance (A0, A1, A2) ZIN —1—MVIN > VIH
Input Impedance (A0, A1, A2) ZIN — 200 — kVIN < VIL
Output (SDA only)
Low-Level Voltage VOL ——0.4VI
OL= 3 mA
High-Level Current (leakage) IOH —— 1µAV
OH = VDD
Low-Level Current IOL 20 — — mA VOL = 0.4V; VDD ≥ 2.2V
6——mAV
OL = 0.6V
Capacitance CIN —5—pF
SDA and SCL Inputs
Hysteresis VHYST — 0.05VDD —V
Spike Suppression TSP — — 50 ns
Electrical Specifications: Unless otherwise indicated, VDD = 1.7V to 3.6V, GND = Ground,
and TA = -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 — +125 °C Note 1
Operating Temperature Range TA-40 — +125 °C
Storage Temperature Range TA-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 8L-TDFN JA —52.5— °C/W
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).
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2012-2013 Microchip Technology Inc. DS22327C-page 5
MCP98244
TIMING DIAGRAM
SERIAL INTERFACE TIMING SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, GND = Ground, TA = -40°C to +125°C, and CL = 80 pF
(Note 1).
VDD= 1.7V to 3.6V VDD= 2.2V to 3.6V
100 kHz 400 kHz 1000 KHz
Parameters Sym Min Max Min Max Min Max Units
2-Wire I2C Interface
Serial port frequency (Note 2,4)f
SCL 10 100 10 400 10 1000 kHz
Low Clock (Note 2)t
LOW 4700 — 1300 — 500 — ns
High Clock tHIGH 4000 — 600 — 260 — ns
Rise time (Note 5)t
R— 1000 20 300 — 120 ns
Fall time (Note 5)t
F20 300 20 300 — 120 ns
Data in Setup time (Note 3) tSU:DAT 250 — 100 —50—ns
Data in Hold time (Note 6)t
HD:DI 0— 0—0—ns
Data out Hold time (Note 4)t
HD:DO 200 900 200 900 0 350 ns
Start Condition Setup time tSU:STA 4700 — 600 — 260 — ns
Start Condition Hold time tHD:STA 4000 — 600 — 260 — ns
Stop Condition Setup time tSU:STO 4000 — 600 — 260 — ns
Bus Idle/Free tB-FREE 4700 — 1300 — 500 — ns
Time out tOUT 25 35 25 35 25 35 ms
Bus Capacitive load Cb—— —400 — 100 pf
Note 1: All values referred to VIL MAX and VIH MIN levels.
2: If tLOW > tOUT
, the temperature sensor I2C interface will time out. A Repeat Start command is required for
communication.
3: This device can be used in a Standard-mode I2C-bus system, but the requirement tSU:DAT 250 ns must
be met. This device does not stretch SCL Low period. It outputs the next data bit to the SDA line within
tRMAX
+ tSU:DAT MIN = 1000 ns + 250 ns = 1250 ns (according to the Standard-mode I2C-bus specification)
before the SCL line is released.
4: As a transmitter, the device provides internal minimum delay time tHD:DAT MIN to bridge the undefined
region (min. 200 ns) of the falling edge of SCL tF MAX to avoid unintended generation of Start or Stop
conditions.
5: Characterized but not production tested.
6: As a receiver, SDA should not be sampled at the falling edge of SCL. SDA can transition tHD:DI 0 ns after
SCL toggles Low.
tSU:STO
tSU:DI
tSU:DI
tSU:STO
tB:FREE
SCL
SDA
tHD:DI / tHD:DO
tHIGH
tLOW
tOUT
tR, tF
Start Condition Data Transmission Stop Condition
25% 025 25%
MCP98244
DS22327C-page 6 2012-2013 Microchip Technology Inc.
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VDD = 1.7V to 3.6V, GND = Ground, SDA/SCL pulled-up to VDD, and
TA = -40°C to +125°C.
FIGURE 2-1: Temperature Accuracy.
FIGURE 2-2: Temperature Accuracy
Histogram, TA = + 85 °C.
FIGURE 2-3: Temperature Accuracy
Histogram, TA = + 105 °C.
FIGURE 2-4: Supply Current Vs.
Temperature.
FIGURE 2-5: Shutdown Current Vs.
Temperature.
FIGURE 2-6: Power On Reset Threshold
Voltage Vs. Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
-1.0
0.0
1.0
2.0
3.0
e
rature Accuracy (°C)
VDD = 1.7 V to 3.6 V
16 units
Spec. Limits
+Std. Dev.
A
vera
e
-3.0
-2.0
-40 -20 0 20 40 60 80 100 120
Temp
e
TA(°C)
-Std. Dev.
25%
50%
75%
100%
Occurrences
TA= +85 °C
VDD = 1.7 V - 3.6 V
16 units
0%
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
Temperature Accuracy (°C)
25%
50%
75%
100%
Occurrences
TA= +25 °C
VDD = 1.7 V - 3.6 V
16 units
0%
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
Temperature Accuracy (°C)
150
200
250
300
IDD (µA)
EEPROM Write (Sensor in Shutdown Mode)
EEPROM Read (Sensor in Shutdown Mode)
50
100
-40 -20 0 20 40 60 80 100 120
TA(°C)
Sensor (EEPROM Inactive)
025
0.50
0.75
1.00
I
SHDN
(µA)
0.00
0
.
25
-40 -20 0 20 40 60 80 100 120
T
A
(°C )
1
1.2
1.4
1.6
1.8
V
POR
(V)
Falling VDD
Rising VDD
0.6
0.8
-40 -20 0 20 40 60 80 100 120
T
A
(°C)
.252 u 01 gm
2012-2013 Microchip Technology Inc. DS22327C-page 7
MCP98244
Note: Unless otherwise indicated, VDD = 1.7V to 3.6V, GND = Ground, SDA/SCL pulled-up to VDD, and
TA = -40°C to +125°C.
FIGURE 2-7: Event Output and SDA VOL
Vs. Temperature.
FIGURE 2-8: Temperature Conversion
Rate Vs. Temperature.
FIGURE 2-9: SDA IOL Vs. Temperature.
FIGURE 2-10: Line Regulation: Change in
Temperature Accuracy Vs. Change in VDD.
FIGURE 2-11: I2C Protocol Time-out Vs.
Temperature.
01
0.2
0.3
0.4
e
nt & SDA V
OL
(V)
SDA, IOL = 20 mA
VDD = 2.2 V to 3.6 V
0
0
.
1
-40 -20 0 20 40 60 80 100 120
Ev
e
T
A
(°C)
Event, IOL = 3 mA
50
75
100
125
150
175
200
t
CONV
(ms)
0.0625 °C/LSb
0.125 °C/LSb
0
25
50
-40 -20 0 20 40 60 80 100 120
T
A
(°C)
0.25 °C/LSb
0.5 °C/LSb
20
30
40
50
SDA I
OL
(mA)
VOL = 0.6V
10
20
-40 -20 0 20 40 60 80 100 120
T
A
(°C)
-1.0
0.0
1.0
2.0
3.0
l
ized Temp. Error (°C)
VDD = 1.7 V
VDD = 3.6 V
-3.0
-2.0
-40 -20 0 20 40 60 80 100 120
Norma
l
T
A
(°C)
30
35
C
Bus t
OUT
(ms)
25
-40 -20 0 20 40 60 80 100 120
I
2
C
T
A
(°C)
MCP98244
DS22327C-page 8 2012-2013 Microchip Technology Inc.
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1 .
TABLE 3-1: PIN FUNCTION TABLES
3.1 Address Pins (A0, A1, A2)
These pins are device address input pins.
The address pins correspond to the Least Significant
bits (LSb) of address bits. The Most Significant bits
(MSb) are (A6, A5, A4, A3). This is shown in Table 3-2.
The A0 Address pin is a multi-function pin. This input
pin is also used for high voltage input VHV to enable the
EEPROM Software Write Protect feature, for more
information see Section 5.3.3 “Bank or page selec-
tion for EEPROM Read/write operation”.
All address pin have an internal pull-down resistors.
3.2 Ground Pin (GND)
The GND pin is the system ground pin.
3.3 Serial Data Line (SDA)
SDA is a bidirectional input/output pin, used to serially
transmit data to/from the host controller. This pin
requires a pull-up resistor. (See Section 4.0 “Serial
Communication”).
3.4 Serial Clock Line (SCL)
The SCL is a clock input pin. All communication timing
is relative to the signal on this pin. The clock is gener-
ated by the host or master controller on the bus. (See
Section 4.0 “Serial Communication”).
3.5 Temperature Alert, Open-Drain
Output (Event)
The MCP98244 temperature Event output pin is an
open-drain output. The device outputs a signal when
the ambient temperature goes beyond the user-pro-
grammed temperature limit. (see Section 5.2.3 “Event
Output Configuration”).
3.6 Power Pin (VDD)
VDD is the power pin. The operating voltage range, as
specified in the DC electrical specification table, is
applied on this pin.
3.7 Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the GND pin; they can
be connected to the same potential on the Printed
Circuit Board (PCB). This provides better thermal
conduction from the PCB to the die.
MCP98244 Symbol Description
TDFN
1 A0 Slave Address and EEPROM Software Write Protect High Voltage Input (VHV)
2 A1 Slave Address
3 A2 Slave Address
4 GND Ground
5 SDA Serial Data Line
6 SCL Serial Clock Line
7 Event Temperature Alert Output
8V
DD Power Pin
9 EP Exposed Thermal Pad (EP); can be connected to GND.
TABLE 3-2: MCP98244 ADDRESS BYTE
Device Address Code Slave
Address
A6 A5 A4 A3 A2 A1 A0
Sensor 0011
X1X1X1
EEPROM 1010
EEPROM
Write Protect
0110—2—2—2
Note 1: User-selectable address is shown by X,
where X is 1 or 0 for VDD and GND,
respectively.
2: The address pins are ignored for all Write
Protect commands.
2012-2013 Microchip Technology Inc. DS22327C-page 9
MCP98244
4.0 SERIAL COMMUNICATION
4.1 2-Wire Standard Mode I2C™
Protocol-Compatible Interface
The MCP98244 serial clock input (SCL) and the
bidirectional serial data line (SDA) form a 2-wire
bidirectional Standard mode I2C-compatible
communication port (refer to the Input/Output Pin DC
Characteristics Table and Serial Interface Timing
Specifications Table).
The following bus protocol has been defined:
TABLE 4-1: MCP98244 SERIAL BUS
PROTOCOL DESCRIPTIONS
4.1.1 DATA TRANSFER
Data transfers are initiated by a Start condition
(START), followed by a 7-bit device address and a
read/write bit. An Acknowledge (ACK) from the slave
confirms the reception of each byte. Each access must
be terminated by a Stop condition (STOP).
Repeated communication is initiated after tB-FREE.
This device does not support sequential register read/
write. Each register needs to be addressed using the
Register Pointer.
This device supports the Receive Protocol. The
register can be specified using the pointer for the initial
read. Each repeated read or receive begins with a Start
condition and address byte. The MCP98244 retains the
previously selected register. Therefore, they output
data from the previously-specified register (repeated
pointer specification is not necessary).
4.1.2 MASTER/SLAVE
The bus is controlled by a master device (typically a
microcontroller) that controls the bus access and
generates the Start and Stop conditions. The
MCP98244 is a slave device and does not control other
devices in the bus. Both master and slave devices can
operate as either transmitter or receiver. However, the
master device determines which mode is activated.
4.1.3 START/STOP CONDITION
A high-to-low transition of the SDA line (while SCL is
high) is the Start condition. All data transfers must be
preceded by a Start condition from the master. A low-
to-high transition of the SDA line (while SCL is high)
signifies a Stop condition.
If a Start or Stop condition is introduced during data
transmission, the MCP98244 releases the bus. All data
transfers are ended by a Stop condition from the
master.
4.1.4 ADDRESS BYTE
Following the Start condition, the host must transmit an
8-bit address byte to the MCP98244. The address for
the MCP98244 Temperature Sensor is
‘0011,A2,A1,A0’ in binary, where the A2, A1 and A0
bits are set externally by connecting the corresponding
pins to VDD ‘1’ or GND ‘0’. The 7-bit address
transmitted in the serial bit stream must match the
selected address for the MCP98244 to respond with an
ACK. Bit 8 in the address byte is a read/write bit.
Setting this bit to ‘1’ commands a read operation, while
‘0’ commands a write operation (see Figure 4-1).
FIGURE 4-1: Device Addressing.
4.1.5 DATA VALID
After the Start condition, each bit of data in
transmission needs to be settled for a time specified by
tSU-DATA before SCL toggles from low-to-high (see
Serial Interface Timing Specifications table).
Term Description
Master The device that controls the serial bus,
typically a microcontroller.
Slave The device addressed by the master,
such as the MCP98244.
Transmitter Device sending data to the bus.
Receiver Device receiving data from the bus.
START A unique signal from master to initiate
serial interface with a slave.
STOP A unique signal from the master to
terminate serial interface from a slave.
Read/Write A read or write to the MCP98244
registers.
ACK A receiver Acknowledges (ACK) the
reception of each byte by polling the
bus.
NAK A receiver Not-Acknowledges (NAK) or
releases the bus to show End-of-Data
(EOD).
Busy Communication is not possible
because the bus is in use.
Not Busy The bus is in the idle state, both SDA
and SCL remain high.
Data Valid SDA must remain stable before SCL
becomes high in order for a data bit to
be considered valid. During normal
data transfers, SDA only changes state
while SCL is low.
123456789
SCL
SDA 0 0 1 1 A2 A1 A0
Start
Address Byte
Slave
Address R/W
MCP98244 Response
Code Address
A
C
K
MCP98244
DS22327C-page 10 2012-2013 Microchip Technology Inc.
4.1.6 ACKNOWLEDGE (ACK/NAK)
Each receiving device, when addressed, is obliged to
generate an ACK bit after the reception of each byte.
The master device must generate an extra clock pulse
for ACK to be recognized.
The acknowledging device pulls down the SDA line for
tSU-DATA before the low-to-high transition of SCL from
the master. SDA also needs to remain pulled down for
tH-DATA after a high-to-low transition of SCL.
During read, the master must signal an End-of-Data
(EOD) to the slave by not generating an ACK bit (NAK)
once the last bit has been clocked out of the slave. In
this case, the slave will leave the data line released to
enable the master to generate the Stop condition.
4.1.7 TIME OUT (TOUT)
If the SCL stays low or high for time specified by tOUT
,
the MCP98244 resets the serial interface. This dictates
the minimum clock speed as indicated in the
specification.
2012-2013 Microchip Technology Inc. DS22327C-page 11
MCP98244
5.0 FUNCTIONAL DESCRIPTION
The MCP98244 temperature sensors consists of a
band-gap type temperature sensor, a Delta-Sigma
Analog-to-Digital Converter ( ADC), user-program-
mable registers and a 2-wire I2C protocol compatible
serial interface. Figure 5-1 shows a block diagram of
the register structure.
FIGURE 5-1: Functional Block Diagram.
Clear Event
0.5°C/bit
0.25°C/bit
0.125°C/bit
0.0625°C/bit
Temperature
TUPPER
TLOWER
Configuration
 ADC
Band-Gap
Temperature
Sensor
Event Status
Output Control
Critical Event only
Event Polarity
Event Comp/Int
TCRIT
Capability
Temp. Range
Accuracy
Output Feature
Register
Pointer
Critical Trip Lock
Alarm Win. Lock Bit
Shutdown
Hysteresis
Manufacturer ID
Resolution
Device ID/Rev
Selected Resolution
Standard I2C
Interface
A0 A1 A2 Event SDA SCL VDD GND
I2C Bus Time-out
Accepts VHV
Shutdown Status
MCP98244 Temperature Sensor
MCP98244 EEPROM
Memory
Control
Logic XDEC
HV Generator
Software write
Write Protect
Circuitry
YDEC
SENSE AMP
R/W CONTROL
protected area
(00h-7Fh)
(7Fh-FFh)
Software write
protected area
(00h-7Fh)
(7Fh-FFh)
Software write
protected area
Software write
protected area
MCP98244
DS22327C-page 12 2012-2013 Microchip Technology Inc.
5.1 Registers
The MCP98244 device has several registers that are
user-accessible. These registers include the Capability
register, Configuration register, Event Temperature
Upper-Boundary and Lower-Boundary Trip registers,
Critical Temperature Trip register, Temperature
register, Manufacturer Identification register and
Device Identification register.
The Temperature register is read-only, used to access
the ambient temperature data. The data is loaded in
parallel to this register after tCONV. The Event
Temperature Upper-Boundary and Lower-Boundary
Trip registers are read/writes. If the ambient
temperature drifts beyond the user-specified limits, the
MCP98244 device outputs a signal using the Event pin
(refer to Section 5.2.3 “Event Output
Configuration”). In addition, the Critical Temperature
Trip register is used to provide an additional critical
temperature limit.
The Capability register is used to provide bits
describing the MCP98244’s capability in measurement
resolution, measurement range and device accuracy.
The device Configuration register provides access to
configure the MCP98244’s various features. These
registers are described in further detail in the following
sections.
The registers are accessed by sending a Register
Pointer to the MCP98244 using the serial interface.
This is an 8-bit write-only pointer, and Register 5-1
describes the pointer assignment.
REGISTER 5-1: REGISTER POINTER (WRITE ONLY)
W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0
— — — — Pointer Bits
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-4 Writable Bits: Write ‘0’
bit 3-0 Pointer Bits:
0000 = Capability register
0001 = Configuration register (CONFIG)
0010 = Event Temperature Upper-Boundary Trip register (TUPPER)
0011 = Event Temperature Lower-Boundary Trip register (TLOWER)
0100 = Critical Temperature Trip register (TCRIT)
0101 = Temperature register (TA)
0110 = Manufacturer ID register
0111 = Device ID/Revision register
1000 = TSE2004av Device ID and Vendor Silicon Revision Register
1001 = Resolution register
1XXX = Unused (The device will not acknowledge commands to other pointer locations.).
0x00
2012-2013 Microchip Technology Inc. DS22327C-page 13
MCP98244
TABLE 5-1: BIT ASSIGNMENT SUMMARY FOR ALL TEMPERATURE SENSOR REGISTERS
(SEE SECTION 5.4)
Register
Pointer
(Hex)
MSB/
LSB
Bit Assignment
76543210
0x00 MSB 00000000
LSB SHDN Status tOUT Range VHV Resolution Range Accuracy Event
0x01 MSB 00000Hysteresis SHDN
LSB Crt Loc Win Loc Int Clr Evt Stat Evt Cnt Evt Sel Evt Pol Evt Mod
0x02 MSB 000SIGN 27°C 26°C 25°C 24°C
LSB 23°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0
0x03 MSB 000SIGN 27°C 26°C 25°C 24°C
LSB 23°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0
0x04 MSB 000SIGN 27°C 26°C 25°C 24°C
LSB 23°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0
0x05 MSB TA TCRIT TA TUPPER TA TLOWER SIGN 27°C 26°C 25°C 24°C
LSB 23°C 22°C 21°C 20°C 2-1°C 2-2°C 2-3°C 2-4°C
0x06 MSB 00000000
LSB 01010100
0x07 MSB 00100010
LSB 00000001
0x08 MSB 00100010
LSB 00000001
0x09 MSB 00000000
LSB 000000Resolution
MCP98244
DS22327C-page 14 2012-2013 Microchip Technology Inc.
5.1.1 CAPABILITY REGISTER
This is a read-only register used to identify the
temperature sensor capability. The device capability bit
assignments are specified by TSE2004av, and this
device is factory configured to meet the default
conditions as described in Register 5-2 (these values
can not be changed).
For example, the MCP98244 device is capable of
providing temperature at 0.25°C resolution, measuring
temperature below and above 0°C, providing ±1°C and
±2°C accuracy over the active and monitor temperature
ranges (respectively) and providing user-
programmable temperature event boundary trip limits.
These functions are described in further detail in the
following sections.
REGISTER 5-2: CAPABILITY REGISTER (READ-ONLY) ADDRESS ‘0000 0000’b
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
————————
bit 15 bit 8
R-1 R-1 R-1 R-0 R-1 R-1 R-1 R-1
SHDN Status tOUT Range VHV Resolution Meas. Range Accuracy Temp Alarm
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7 Event output status during Shutdown (SHDN Status):
0 = Event output remains in previous state. If the output asserts before shutdown command, it
remains asserted during shutdown.
1 = Event output deasserts during shutdown. After shutdown, it takes tCONV to re-assert the Event
output (power-up default)
bit 6 I2C Bus time-out (tOUT Range):
0 = Bus time-out range is 10 ms to 60 ms
1 = Bus time-out range is 25 ms to 35 ms (power-up default)
bit 5 High Voltage Input
0 = Pin A0 does not accept High Voltage
1 = Pin A0 accepts High Voltage for the EEPROM Write Protect feature (power-up default)
bit 4-3 Resolution:
00 = 0.5°C
01 = 0.25°C (power up default)
10 = 0.125°C
11 = 0.0625°C
These bits reflect the selected resolution (see Section 5.2.4 “Temperature Resolution”)
bit 2 Temperature Measurement Range (Meas. Range):
0 =T
A 0 (decimal) for temperature below 0°C
1 = The part can measure temperature below 0°C (power-up default)
2012-2013 Microchip Technology Inc. DS22327C-page 15
MCP98244
FIGURE 5-2: Timing Diagram for Reading the Capability Register (See Section 4.0 “Serial
Communication”).
bit 1 Accuracy:
0 =Accuracy ±2°C from +75°C to +95°C (Active Range) and ±3°C from +40°C to +125°C
(Monitor Range)
1 =Accuracy ±1°C from +75°C to +95°C (Active Range) and ±2°C from +40°C to +125°C
(Monitor Range)
bit 0 Temperature Alarm:
0 = No defined function (This bit will never be cleared or set to ‘0.’)
1 = The part has temperature boundary trip limits (TUPPER/TLOWER/TCRIT registers) and a
temperature event output (JC 42.4 required feature)
REGISTER 5-2: CAPABILITY REGISTER (READ-ONLY) ADDRESS ‘0000 0000’b (CONTINUED)
SDA A
C
K
0011A
Capability Pointer
0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
A
C
K
0011A
MSB Data
A
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678 12345678
Address Byte LSB Data
R
MCP98244 MCP98244
MCP98244 Master Master
W
SDA
SCL
000
00000000 00001
111
THVST
MCP98244
DS22327C-page 16 2012-2013 Microchip Technology Inc.
5.1.2 SENSOR CONFIGURATION
REGISTER (CONFIG)
The MCP98244 device has a 16-bit Configuration reg-
ister (CONFIG) that allows the user to set various func-
tions for a robust temperature monitoring system. Bits
10 thru 0 are used to select Event output boundary
hysteresis, device Shutdown or Low-Power mode,
temperature boundary and critical temperature lock, or
temperature Event output enable/disable. In addition,
the user can select the Event output condition (output
set for TUPPER and TLOWER temperature boundary or
TCRIT only), read Event output status and set Event
output polarity and mode (Comparator Output or
Interrupt Output mode).
The temperature hysteresis bits 10 and 9 can be used
to prevent output chatter when the ambient
temperature gradually changes beyond the user-
specified temperature boundary (see Section 5.2.2
“Temperature Hysteresis (THYST)”. The Continuous
Conversion or Shutdown mode is selected using bit 8.
In Shutdown mode, the band gap temperature sensor
circuit stops converting temperature and the Ambient
Temperature register (TA) holds the previous
successfully converted temperature data (see
Section 5.2.1 “Shutdown Mode”). Bits 7 and 6 are
used to lock the user-specified boundaries TUPPER,
TLOWER and TCRIT to prevent an accidental rewrite.
Bits 5 thru 0 are used to configure the temperature
Event output pin. All functions are described in
Register 5-3 (see Section 5.2.3 “Event Output
Configuration”).
REGISTER 5-3: CONFIGURATION REGISTER (CONFIG) ADDRESS ‘0000 0001’b
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
————— T
HYST SHDN
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
Crit. Lock Win. Lock Int. Clear Event Stat. Event Cnt. Event Sel. Event Pol. Event Mod.
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-9 TUPPER and TLOWER Limit Hysteresis (THYST):
00 = 0°C (power-up default)
01 = 1.5°C
10 = 3.0°C
11 = 6.0°C
(Refer to Section 5.2.3 “Event Output Configuration”)
This bit can not be altered when either of the lock bits are set (bit 6 and bit 7).
This bit can be programmed in Shutdown mode.
bit 8 Shutdown Mode (SHDN):
0 = Continuous Conversion (power-up default)
1 = Shutdown (Low-Power mode)
In shutdown, all power-consuming activities are disabled, though all registers can be written to or read.
Event output will deassert.
This bit cannot be set ‘1’ when either of the lock bits is set (bit 6 and bit 7). However, it can be cleared
‘0’ for Continuous Conversion while locked (Refer to Section 5.2.1 “Shutdown Mode”).
2012-2013 Microchip Technology Inc. DS22327C-page 17
MCP98244
bit 7 TCRIT Lock Bit (Crit. Lock):
0 = Unlocked. TCRIT register can be written (power-up default)
1 =Locked. T
CRIT register can not be written
When enabled, this bit remains set ‘1’ or locked until cleared by internal reset (Section 5.4 “Summary
of Power-On Default”). This bit does not require a double-write.
This bit can be programmed in Shutdown mode.
bit 6 TUPPER and TLOWER Window Lock Bit (Win. Lock):
0 = Unlocked. TUPPER and TLOWER registers can be written (power-up default)
1 =Locked. T
UPPER and TLOWER registers can not be written
When enabled, this bit remains set ‘1’ or locked until cleared by power-on Respell (Section 5.4 “Sum-
mary of Power-On Default”). This bit does not require a double-write.
This bit can be programmed in Shutdown mode.
bit 5 Interrupt Clear (Int. Clear) Bit:
0 = No effect (power-up default)
1 = Clear interrupt output. When read this bit returns ‘0’
This bit clears the Interrupt flag which deasserts Event output. In shutdown mode, the Event output is
always deasserted. Therefore, setting this bit in Shutdown mode clears the interrupt after the device
returns to normal operation.
bit 4 Event Output Status (Event Stat.) Bit:
0 = Event output is not asserted by the device (power-up default)
1 = Event output is asserted as a comparator/Interrupt or critical temperature output
In shutdown mode this bit will clear because Event output is always deasserted in Shutdown mode.
bit 3 Event Output Control (Event Cnt.) Bit:
0 = Event output Disabled (power-up default)
1 = Event output Enabled
This bit can not be altered when either of the lock bits is set (bit 6 and bit 7).
This bit can be programmed in Shutdown mode, but Event output will remain deasserted.
bit 2 Event Output Select (Event Sel.) Bit:
0 = Event output for TUPPER, TLOWER and TCRIT (power-up default)
1 = TA ≥ TCRIT only. (TUPPER and TLOWER temperature boundaries are disabled.)
When the Alarm Window Lock bit is set, this bit cannot be altered until unlocked (bit 6).
This bit can be programmed in Shutdown mode, but Event output will remain deasserted.
bit 1 Event Output Polarity (Event Pol.) Bit:
0 = Active low (power-up default. Pull-up resistor required)
1 = Active-high
This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7).
This bit can be programmed in Shutdown mode, but Event output will remain deasserted, see
Section 5.2.3 “Event Output Configuration”
bit 0 Event Output Mode (Event Mod.) Bit:
0 = Comparator output (power-up default)
1 = Interrupt output
This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7).
This bit can be programmed in Shutdown mode, but Event output will remain deasserted.
REGISTER 5-3: CONFIGURATION REGISTER (CONFIG) ADDRESS ‘0000 0001’b
(CONTINUED)
A c K ‘ fl_/ H—j Configurafion Pointer 4 MCP98244
MCP98244
DS22327C-page 18 2012-2013 Microchip Technology Inc.
FIGURE 5-3: Timing Diagram for Writing to the Configuration Register (See Section 4.0 “Serial
Communication”.
• Writing to the CONFIG Register to Enable the Event Output pin <0000 0000 0000 1000>b.
SDA A
C
K
0011A0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
W
MCP98244 MCP98244
MSB Data
A
C
K
A
C
KP
12345678 12345678
LSB Data
Configuration Pointer
MCP98244 MCP98244
001
00000000 00001000
Note: this is an example routine:
i2c_start(); // send START command
i2c_write(AddressByte & 0xFE); //WRITE Command
//also, make sure bit 0 is cleared ‘0’
i2c_write(0x01); // Write CONFIG Register
i2c_write(0x00); // Write data
i2c_write(0x08); // Write data
i2c_stop(); // send STOP command
2012-2013 Microchip Technology Inc. DS22327C-page 19
MCP98244
FIGURE 5-4: Timing Diagram for Reading from the Configuration Register (See Section 4.0
“Serial Communication”).
SDA A
C
K
0011A
Configuration Pointer
0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
A
C
K
0011A
MSB Data
A
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678 12345678
Address Byte LSB Data
R
MCP98244 MCP98244
MCP98244 Master Master
W
SDA
SCL
001
00000000 00001
000
• Reading the CONFIG Register.
Note: It is not necessary to
select the register
pointer if it was set from
the previous read/write.
Note: this is an example routine:
i2c_start(); // send START command
i2c_write(AddressByte & 0xFE); //WRITE Command
//also, make sure bit 0 is cleared ‘0’
i2c_write(0x01); // Write CONFIG Register
i2c_start(); // send Repeat START command
i2c_write(AddressByte | 0x01); //READ Command
//also, make sure bit 0 is set ‘1’
UpperByte = i2c_read(ACK); // READ 8 bits
//and Send ACK bit
LowerByte = i2c_read(NAK); // READ 8 bits
//and Send NAK bit
i2c_stop(); // send STOP command
MCP98244
DS22327C-page 20 2012-2013 Microchip Technology Inc.
5.1.3 UPPER/LOWER/CRITICAL
TEMPERATURE LIMIT REGISTERS
(TUPPER/TLOWER/TCRIT)
The MCP98244 device has a 16-bit read/write Event
output Temperature Upper-Boundary Trip register
(TUPPER), a 16-bit Lower-Boundary Trip register
(TLOWER) and a 16-bit Critical Boundary Trip register
(TCRIT) that contains 11-bit data in two’s complement
format (0.25°C). This data represents the maximum
and minimum temperature boundary or temperature
window that can be used to monitor ambient
temperature. If this feature is enabled (Section 5.1.2
“Sensor Configuration Register (CONFIG)”) and the
ambient temperature exceeds the specified boundary
or window, the MCP98244 asserts an Event output.
(Refer to Section 5.2.3 “Event Output
Configuration”).
REGISTER 5-4: UPPER/LOWER/CRITICAL TEMPERATURE LIMIT REGISTER (TUPPER/TLOWER/
TCRIT) ADDRESS ‘0000 0010’b/‘0000 0011’b/‘0000 0100’b (Note 1)
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
———Sign2
7°C 26°C 25°C 24°C
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
23°C 22°C 21°C 20°C 2-1°C 2-2°C — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 Unimplemented: Read as ‘0’
bit 12 Sign:
0 =T
A 0°C
1 =T
A 0°C
bit 11-2 TUPPER/TLOWER/TCRIT:
Temperature boundary trip data in two’s complement format.
bit 1-0 Unimplemented: Read as ‘0’
Note 1: This table shows two 16-bit registers for TUPPER, TLOWER and TCRIT located at ‘0000 0010b’,
‘0000 0011b’ and ‘0000 0100b’, respectively.
ACK A‘ T TUPPER Pomler I MCP98244 44 / A c K
2012-2013 Microchip Technology Inc. DS22327C-page 21
MCP98244
FIGURE 5-5: Timing Diagram for Writing and Reading from the TUPPER Register (See Section 4.0
“Serial Communication”).
SDA A
C
K
0011A
TUPPER Pointer
0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
A
C
K
0011A
MSB Data
A
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678 12345678
Address Byte LSB Data
R
MCP98244 MCP98244
MCP98244 Master Master
W
SDA
SCL
010
00000101 10100000
• Reading from the TUPPER Register.
• Writing 90°C to the TUPPER Register <0000 0101 1010 0000>b.
SDA A
C
K
0011A0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
W
MCP98244 MCP98244
MSB Data
A
C
K
A
C
KP
12345678 12345678
LSB Data
TUPPER Pointer
MCP98244 MCP98244
010
00000101 10100
000
Note: It is not necessary to
select the register
pointer if it was set from
the previous read/write.
MCP98244
DS22327C-page 22 2012-2013 Microchip Technology Inc.
5.1.4 AMBIENT TEMPERATURE
REGISTER (TA)
The MCP98244 device uses a band gap temperature
sensor circuit to output analog voltage proportional to
absolute temperature. An internal  ADC is used to
convert the analog voltage to a digital word. The
converter resolution is set to 0.25°C + sign (11-bit
data). The digital word is loaded to a 16-bit read-only
Ambient Temperature register (TA) that contains 11-bit
temperature data in two’s complement format.
The TA register bits (bits 12 through 0) are double-buff-
ered. Therefore, the user can access the register while,
in the background, the MCP98244 performs an analog-
to-digital conversion. The temperature data from the 
ADC is loaded in parallel to the TA register at tCONV
refresh rate.
In addition, the TA register uses three bits (bits 15, 14
and 13) to reflect the Event pin state. This allows the
user to identify the cause of the Event output trigger
(see Section 5.2.3 “Event Output Configuration”);
bit 15 is set to ‘1’ if TA is greater than or equal to TCRIT
,
bit 14 is set to ‘1’ if TA is greater than TUPPER and bit 13
is set to ‘1’ if TA is less than TLOWER.
The TA register bit assignment and boundary
conditions are described in Register 5-5.
REGISTER 5-5: AMBIENT TEMPERATURE REGISTER (TA) ADDRESS ‘0000 0101’b (Note 1)
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
TA vs. TCRIT TA vs. TUPPER TA vs. TLOWER SIGN 27 °C 26 °C 25 °C 24 °C
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
23 °C 22 °C 21 °C 20 °C 2-1 °C 2-2 °C 2-3 °C 2-4 °C
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TA vs. TCRIT Bit: (Note 1)
0 =T
A TCRIT
1 =T
A TCRIT
bit 14 TA vs. TUPPER Bit (Note 1):
0 =T
A TUPPER
1 =T
A TUPPER
bit 13 TA vs. TLOWER Bit (Note 1):
0 =T
A TLOWER
1 =T
A TLOWER
bit 12 SIGN Bit:
0 =T
A 0°C
1 =T
A 0°C
bit 11-0 Ambient Temperature (TA) Bits: (Note 2)
12-bit Ambient Temperature data in two’s complement format.
Note 1: Bits 15, 14 and 13 are not affected by the status of the Event output configuration (bits 5 to 0 of CONFIG)
(Register 5-3).
2: Bits 2, 1, and 0 may remain clear '0' depending on the status of the resolution register. The Power-up
default is 0.25°C/bit, bits 1 and 0 remain clear '0'.
2012-2013 Microchip Technology Inc. DS22327C-page 23
MCP98244
5.1.4.1 TA bits to Temperature Conversion
To convert the TA bits to decimal temperature, the
upper three boundary bits (15, 14 and 13) must be
masked out. Then determine the sign bit (bit 12) to
check positive or negative temperature, shift the bits
accordingly and combine the upper and lower bytes of
the 16-bit register. The upper byte contains data for
temperatures greater than 32°C, while the lower byte
contains data for temperature less than 32°C, including
fractional data. When combining the upper and lower
bytes, the upper byte must be Right-shifted by 4 bits (or
multiply by 24) and the lower byte must be Left-shifted
by 4 bits (or multiply by 2-4). Adding the results of the
shifted values provides the temperature data in decimal
format; see Equation 5-1.
The temperature bits are in two’s complement format,
therefore, positive temperature data and negative tem-
perature data are computed differently. Equation 5-1
shows the temperature computation. The example
instruction code outlined in Figure 5-6 shows the
communication flow, also see Figure 5-7 for timing
diagram.
EQUATION 5-1: BYTES TO
TEMPERATURE
CONVERSION
FIGURE 5-6: Example Instruction Code.
Where:
TA= Ambient Temperature (°C)
UpperByte = TA bit 11 to bit 8
LowerByte = TA bit 7 to bit 0
Temperature 0°C (bit 12 or Sign bit = 0)
Temperature 0°C (bit 12 or Sign bit = 1)
TAUpperByte 24LowerByte 2 4–
+
=
TAUpperByte 24LowerByte 2 4–
+
256–=
i2c_start(); // send START command
i2c_write(AddressByte & 0xFE); //WRITE Command
//also, make sure bit 0 is cleared ‘0’
i2c_write(0x05); // Write TA Register Address
i2c_start(); //Repeat START
i2c_write(AddressByte | 0x01); // READ Command
//also, make sure bit 0 is Set ‘1’
UpperByte = i2c_read(ACK); // READ 8 bits
//and Send ACK bit
LowerByte = i2c_read(NAK); // READ 8 bits
//and Send NAK bit
i2c_stop(); // send STOP command
//Convert the temperature data
//First Check flag bits
if ((UpperByte & 0x80) == 0x80){ //TA TCRIT
}
if ((UpperByte & 0x40) == 0x40){ //TA TUPPER
}
if ((UpperByte & 0x20) == 0x20){ //TA TLOWER
}
UpperByte = UpperByte & 0x1F; //Clear flag bits
if ((UpperByte & 0x10) == 0x10){ //TA 0°C
UpperByte = UpperByte & 0x0F; //Clear SIGN
Temperature = 256 - (UpperByte x 16 + LowerByte / 16);
}else //TA 0°C
Temperature = (UpperByte x 16 + LowerByte / 16);
//Temperature = Ambient Temperature (°C)
This example routine assumes the variables and I2C communication subroutines are predefined:
MCP98244
DS22327C-page 24 2012-2013 Microchip Technology Inc.
FIGURE 5-7: Timing Diagram for Reading +25.25°C Temperature from the TA Register (See
Section 4.0 “Serial Communication”).
SDA A
C
K
0011A
TA Pointer
0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
A
C
K
0011A
MSB Data
A
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678 12345678
Address Byte LSB Data
R
MCP98244 MCP98244
MCP98244 Master Master
W
SDA
SCL
101
00000001 10010
100
Note: It is not necessary to
select the register
pointer if it was set from
the previous read/write.
2012-2013 Microchip Technology Inc. DS22327C-page 25
MCP98244
5.1.5 MANUFACTURER ID REGISTER
This register is used to identify the manufacturer of the
device in order to perform manufacturer specific
operation. The Manufacturer ID for the MCP98244 is
0x0054 (hexadecimal).
FIGURE 5-8: Timing Diagram for Reading the Manufacturer ID Register (See Section 4.0 “Serial
Communication”).
REGISTER 5-6: MANUFACTURER ID REGISTER (READ-ONLY) ADDRESS ‘0000 0110’b
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
Manufacturer ID
bit 15 bit 8
R-0 R-1 R-0 R-1 R-0 R-1 R-0 R-0
Manufacturer ID
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 Device Manufacturer Identification Number
.
SDA A
C
K
0011A
Manuf. ID Pointer
0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
A
C
K
0011A
MSB Data
A
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678 12345678
Address Byte LSB Data
R
MCP98244 MCP98244
MCP98244 Master Master
W
SDA
SCL
110
00000000 01010100
Note: It is not necessary to
select the register
pointer if it was set from
the previous read/write.
MCP98244
DS22327C-page 26 2012-2013 Microchip Technology Inc.
5.1.6 DEVICE ID AND REVISION
REGISTER
There are two Device ID and Revision ID registers.
Address pointer 0x07 is specific to TSE2004av devices
and it is used to identify compliant devices. Address
Pointer 0x08 is a Microchip-specific register and it is
used to identify Microchip devices. The upper byte of
these registers is used to specify the device identifica-
tion and the lower byte is used to specify device silicon
revision. The device ID for the MCP98244 is 0x22 (hex)
(same as TSE2004av).
The revision (Lower Byte) begins with 0x00 (hex) for
the first release, with the number being incremented as
revised versions are released.
REGISTER 5-7: TSE2004AV DEVICE ID AND DEVICE REVISION (READ-ONLY)
ADDRESS ‘0000 0111’b AND ‘0000 1000’b
R-0 R-0 R-1 R-0 R-0 R-0 R-1 R-0
Device ID
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-1
Device Revision
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Device ID: Bit 15 to bit 8 are used for device ID
bit 7-0 Device Revision: Bit 7 to bit 0 are used for device revision
2012-2013 Microchip Technology Inc. DS22327C-page 27
MCP98244
5.1.7 RESOLUTION REGISTER
This register allows the user to change the sensor
resolution (see Section 5.2.4 “Temperature
Resolution”). The POR default resolution is 0.25°C.
The selected resolution is also reflected in the
Capability register (see Register 5-2).
Note: In order to prevent accidentally writing the
resolution register to higher resolution and
exceeding the maximum temperature
conversion time of tCONV = 125 ms, a
Shutdown Command (using the CONFIG
register) is required to change the
resolution register. The device must be in
shutdown mode to change the resolution.
REGISTER 5-8: RESOLUTION REGISTER ‘0000 1001’b
R/W-1 U-0 U-0 U-0 U-0 U-0 U-0 U-0
—
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-1
Resolution
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘1’
bit 14-2 Unimplemented: Read as ‘0’
bit 1-0 Resolution:
00 = LSB = 0.5°C (tCONV = 23 ms typical)
01 = LSB = 0.25°C (power up default, tCONV = 46 ms typical)
10 = LSB = 0.125°C (tCONV = 75 ms typical)
11 = LSB = 0.0625°C (tCONV = 150 ms typical)
MCP98244
DS22327C-page 28 2012-2013 Microchip Technology Inc.
5.2 SENSOR FEATURE DESCRIPTION
5.2.1 SHUTDOWN MODE
Shutdown mode disables all power-consuming
activities (including temperature sampling operations)
while leaving the serial interface active. This mode is
selected by setting bit 8 of CONFIG to ‘1’. In this mode,
the device consumes ISHDN. It remains in this mode
until bit 8 is cleared ‘0’ to enable Continuous
Conversion mode, or until power is recycled.
The Shutdown bit (bit 8) cannot be set to ‘1’ while bits
6 and 7 of CONFIG (Lock bits) are set to ‘1’. However,
it can be cleared ‘0’ or returned to Continuous
Conversion while locked.
In Shutdown mode, all registers can be read or written.
However, the serial bus activity increases the shutdown
current.
If the device is shutdown while the Event pin is
asserted, then the Event output will be deasserted
during shutdown. It will remain deasserted until the
device is enabled for normal operation. Once the
device is enabled, it takes tCONV before the device
reasserts the Event output.
5.2.2 TEMPERATURE HYSTERESIS
(THYST)
A hysteresis of 0°C, 1.5°C, 3°C or 6°C can be selected
for the TUPPER, TLOWER and TCRIT temperate
boundaries using bits 10 and 9 of CONFIG. The
hysteresis applies for decreasing temperature only (hot
to cold), or as temperature drifts below the specified
limit.
The hysteresis bits can not be changed if either of the
lock bits, bits 6 and 7 of CONFIG, are set to ‘1’.
The TUPPER, TLOWER and TCRIT boundary conditions
are described graphically in Figure 5-9.
5.2.3 EVENT OUTPUT CONFIGURATION
The Event output can be enabled using bit 3 of
CONFIG (Event output control bit) and can be
configured as either a comparator output or as Interrupt
Output mode using bit 0 of CONFIG (Event mode). The
polarity can also be specified as an active-high or
active-low using bit 1 of CONFIG (Event polarity). The
Event output requires a pull-up resistor to function.
These configurations are designed to serve processors
with Low-to-High or High-to-Low edge triggered inputs.
With Active-High configuration, when the Event output
deasserts, power will be dissipated across the pull-up
resistor.
When the ambient temperature increases above the
critical temperature limit, the Event output is forced to a
comparator output (regardless of bit 0 of CONFIG).
When the temperature drifts below the critical
temperature limit minus hysteresis, the Event output
automatically returns to the state specified by bit 0 of
CONFIG.
The status of the Event output can be read using bit 4
of CONFIG (Event status). This bit can not be set to ‘1’
in shutdown mode.
Bits 7 and 6 of the CONFIG register can be used to lock
the TUPPER, TLOWER and TCRIT registers. The bits
prevent false triggers at the Event output due to an
accidental rewrite to these registers.
The Event output can also be used as a critical
temperature output using bit 2 of CONFIG (critical
output only). When this feature is selected, the Event
output becomes a comparator output. In this mode, the
interrupt output configuration (bit 0 of CONFIG) is
ignored.
2012-2013 Microchip Technology Inc. DS22327C-page 29
MCP98244
5.2.3.1 Comparator Mode
Comparator mode is selected using bit 0 of CONFIG. In
this mode, the Event output is asserted as active-high
or active-low using bit 1 of CONFIG. Figure 5-9 shows
the conditions that toggle the Event output.
If the device enters Shutdown mode with asserted
Event output, the output will deassert. It will remain
deasserted until the device enters Continuous Conver-
sion mode and after the first temperature conversion is
completed, tCONV
. After the initial temperature conver-
sion, TA must satisfy the TUPPER or TLOWER boundary
conditions in order for Event output to be asserted.
Comparator mode is useful for thermostat-type
applications, such as turning on a cooling fan or
triggering a system shutdown when the temperature
exceeds a safe operating range.
5.2.3.2 Interrupt Mode
In the Interrupt mode, the Event output is asserted as
active-high or active-low (depending on the polarity
configuration) when TA drifts above or below TUPPER
and TLOWER limits. The output is de asserted by setting
bit 5 (Interrupt Clear) of CONFIG. If the device enters
Shutdown mode with asserted Event output, the output
will deassert. It will remain deasserted until the device
enters Continuous Conversion mode and after the first
temperature conversion is completed, tCONV
. If the inter-
rupt clear bit (Bit 5) is never set, then the Event output will
reassert after the first temperature conversion.
In addition, if TA ≥ T
CRIT the Event output is forced as
Comparator mode and asserts until TA < TCRIT - THYST
.
While the Event output is asserted, the user must send
the Clear Interrupt command (bit 5 of CONFIG) for Event
output to deassert, when temperature drops below the
critical limit, TA < TCRIT - THYST
. Otherwise, Event output
remains asserted (see Figure 5-9 for a graphical descrip-
tion). Switching from Interrupt mode to Comparator mode
also deasserts Event output.
This mode is designed for interrupt-driven microcontrol-
ler-based systems. The microcontroller receiving the
interrupt will have to acknowledge the interrupt by setting
bit 5 of CONFIG register from the MCP98244.
5.2.4 TEMPERATURE RESOLUTION
The MCP98244 device is capable of providing tem-
perature data with 0.5°C to 0.0625°C resolution. The
Resolution can selected using the Resolution register
(Register 5-8) which is located in address
‘00001001’b. This address location is not specified in
JEDEC Standard JC42.4. However, it provides
additional flexibility while being functionally compatible
with JC42.4 and provides a 0.25°C resolution at
125 ms (max.). In order to prevent accidentally chang-
ing the resolution and exceeding the 125 ms conver-
sion time, the device must be in Shutdown mode to
change this register. The selected resolution can be
read by user using bit 4 and bit 3 of the Capability reg-
ister (Register 5-2). A 0.25°C resolution is set as POR
default by factory.
TABLE 5-2: TEMPERATURE
CONVERSION TIME
Resolution tCONV
(ms) Samples/sec
(typical)
0.5°C 30 33
0.25°C
(Power-up default)
65 15
0.125°C 130 8
0.0625°C 260 4
MCP98244
DS22327C-page 30 2012-2013 Microchip Technology Inc.
FIGURE 5-9: Event Output Condition.
TUPPER
TLOWER
Event Output
TCRIT
TA
TUPPER - THYST
(Active-Low)
Comparator
Interrupt
S/w Int. Clear
Critical Only
TCRIT - THYST
123457
TABLE 5-3: TEMPERATURE EVENT OUTPUT CONDITIONS
Note Output Boundary Conditions Comparator Interrupt Critical TA Bits
Output State (Active Low/High) 15 14 13
1T
A  TLOWER High/Low Low/High High/Low 0 0 0
2T
A TLOWER - THYST Low/High Low/High High/Low 0 0 1
3T
A  TUPPER Low/High Low/High High/Low 0 1 0
4 T
A TUPPER - THYST High/Low Low/High High/Low 0 0 0
5 T
A TCRIT Low/High Low/High Low/High 1 1 0
6 When TA  TCRIT the Event output is forced to Comparator Mode and bits 0 of CONFIG (Event
output mode) is ignored until TA TCRIT - THYST
. In the Interrupt Mode, if Interrupt is not cleared
(bits 5 of CONFIG) as shown in the diagram at Note 6, then Event will remain asserted at Note 7
until Interrupt is cleared by the controller.
7T
A TCRIT - THYST Low/High High/Low High/Low 0 1 0
TLOWER - THYST
TLOWER -THYST
TUPPER - THYST
1342
Note: 6
Event Output
(Active-High)
Comparator
Interrupt
S/w Int. Clear
Critical Only
2012-2013 Microchip Technology Inc. DS22327C-page 31
MCP98244
5.3 MCP98244 EEPROM FEATURE
DESCRIPTION
5.3.1 BYTE WRITE
To write a byte in the MCP98244 EEPROM, the master
has to specify the memory location or address. Once
the address byte is transmitted correctly followed by a
word address, the word address is stored in the
EEPROM address pointer. The following byte is data to
be stored in the specified memory location. Figure 5-10
shows the timing diagram.
FIGURE 5-10: Timing Diagram for Byte Write (See Section 4.0 “Serial Communication”).
SDA A
C
K
1010AA
C
K
S2
A
1
A
0
12345678 12345678
SCL
Address Byte
W
MCP98244 MCP98244
A
C
KP
12345678
Data
Word Address
MCP98244
XXXXXXX X X X XXX XXX
MCP98244
DS22327C-page 32 2012-2013 Microchip Technology Inc.
5.3.2 PAGE WRITE
The write Address Byte, word address and the first data
byte are transmitted to the MCP98244 in the same way
as in a byte write. Instead of generating a Stop
condition, the master transmits up to 15 additional data
bytes to the MCP98244, which are temporarily stored
in the on-chip page buffer and will be written into the
memory after the master has transmitted a Stop
condition. Upon receipt of each word, the four lower
order address pointer bits are internally incremented by
one. The higher order four bits of the word address
remain constant. If the master should transmit more
than 16 bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 5-11).
FIGURE 5-11: Timing Diagram for Page Write (See Section 4.0 “Serial Communication”).
Note: Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes actually
being written. Physical page boundaries
start at addresses that are integer
multiples of the page buffer size (or ‘page
size’) and end at addresses that are
integer multiples of [page size - 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
SDA A
C
K
1010AXXXX
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
X
Address Byte
W
MCP98244 MCP98244
Data at (n)
A
C
KP
12345678 12345678
Data at (n+1)
Word Address (n)
MCP98244 MCP98244
XXX
XXXXXXXX XXXXXXXX A
C
K
Data at (n+15)
MCP98244
XXX XXX
A
C
K
Note: n is the initial address for a page.
2012-2013 Microchip Technology Inc. DS22327C-page 33
MCP98244
5.3.3 BANK OR PAGE SELECTION FOR
EEPROM READ/WRITE OPERATION
There are two 256 byte banks or pages in this device
(512 bytes total). The pages are selected using I2C
Set Page Address (SPA) command byte of ‘0110
1100’ for bank/page 0 and ‘0110 1110’ for bank/page
1, see Ta b l e 5 - 5 .
The current page status can be read using the Read
Page Address (RPA) Command. If the device ACK or
NAK the command, then the current page is 0 or 1,
respectively.
TABLE 5-4: SELECTING 256 BYTE BANKS OR PAGES FOR EEPROM READ/WRITE
FIGURE 5-12: Timing Diagram for Bank/Page Selection (See Section 4.0 “Serial
Communication”)
EEPROM
Function Operation
Address Byte
A0 PIN Voltage MCP98244
output
Address
Code
Slave Address 1R/W
A2 A1 A0
Set Bank/Page Address 0 (SPA0) WRITE 0110 1 1 0 0 VDD, VSS, VHV ACK, Page 0 Set
Set Bank/Page Address 1 (SPA1) WRITE 0110 1 1 1 0 VDD, VSS, VHV ACK, Page 1 Set
Read Bank/Page Address (RPA) READ 0110 1 1 0 1 VDD, VSS, VHV ACK for Page 0
NAK for Page 1
Note 1: A0, A1, A2 address pin states are ignored.
SDA A
C
K
0110
A
C
K
S
12345678 12345678
SCL
Address Byte
W
MCP98244 MCP98244
A
C
KP
12345678
Data
Word Address
MCP98244
XXXXXXXX XXXXXXXX
11X
ACK A‘
MCP98244
DS22327C-page 34 2012-2013 Microchip Technology Inc.
5.3.4 WRITE PROTECTION
The MCP98244 has a Software Write-Protect (SWP)
feature that allows a 128-byte block to be write-pro-
tected. There are four 128-byte blocks. Each block is
write protected individually. The write-protected area
can be cleared by sending Clear Write Protect (CWP)
commands for each block.
To access write protection, the device address code of
the Address Byte is set to ‘0110’ instead of ‘1010’. In
this mode, the Slave Address pins are ignored. Once
the device is write protected it will not acknowledge any
write commands to the protected block. Table 5-5
shows the corresponding Address Bytes for the write-
protect feature.
5.3.4.1 SWP/RPS
The SWP (Software Write Protect) feature is invoked
by writing a command byte as shown on Tab l e 5 - 5. It
can be cleared using the CWP command. In this mode,
the Slave Address pins are ignored. A high voltage VHV
needs to be applied to the A0 pin. RPS (Read Protec-
tion Status) can be executed to read protection status.
5.3.4.2 CWP (Clear Write Protect)
The CWP feature is invoked by writing clear write-pro-
tect command. A high voltage VHV needs to be applied
to the A0 pin and once the command is executed bank/
Page 0 and bank/Page 1 are cleared. Tab le 5- 5 shows
the bit configuration.
TABLE 5-5: DEVICE SLAVE ADDRESS DURING WRITE PROTECTION (SWP/CWP)
FIGURE 5-13: Timing Diagram for Setting Software Write Protect (See Section 4.0 “Serial
Communication”).
EEPROM Function Operation
Address Byte 23
A0 PIN Voltage
Address
Code 2
Slave Address 1,2R/W
A2 A1 A0
SWP0/RPS0 — Bank/Page 0, Block 0
00h to 7Fh
SWP0 WRITE 0110 0 0 1 0 VHV
RPS0 READ 41VDD, VSS, VHV
SWP1/RPS1 — Bank/Page 0, Block 1
80h to FFh
SWP1 WRITE 0110 1 0 0 0 VHV
RPS1 READ 41VDD, VSS, VHV
SWP2/RPS2 — Bank/Page 1, Block 2
00h to 7Fh
SWP2 WRITE 0110 1 0 1 0 VHV
RPS2 READ 41VDD, VSS, VHV
SWP3/RPS3 — Bank/Page 1, Block 3
80h to FFh
SWP3 WRITE 0110 0 0 0 0 VHV
RPS3 READ 41VDD, VSS, VHV
CWP (Clear all Pages) WRITE 0110 0 1 1 0 VHV
Note 1: The slave address bits for each block are not binary increments for compatibility.
2: For Address Code <0110> the A0, A1, A2 states are ignored.
3: All address bytes, other than those indicated below, are ignored by the device.
4: The device will NAK if protected and ACK if it is unprotected.
SDA A
C
K
0110
A
C
K
S
12345678 12345678
SCL
Address Byte
W
MCP98244 MCP98244
A
C
KP
12345678
Data
Word Address
MCP98244
XXXXXXXX XXXXXXXX
XXX
2012-2013 Microchip Technology Inc. DS22327C-page 35
MCP98244
TABLE 5-6: DEVICE RESPONSE WHEN WRITING DATA OR ACCESSING SWPN/CWP/SPAN2
Status Command ACK Address ACK Data Byte ACK STOP
Cmd 3Write/Clear
Cycle
Not Protected SWPn/CWPACK————Yes Yes
SWPn/CWP ACK 0xXX1ACK——Yes Yes
SWPn/CWP ACK 0xXX ACK 0xXX ACK Yes Yes
Page/byte write ACK Address ACK Data ACK Yes Yes
Protected SWPnNAK 0xXX NAK 0xXX NAK — No
CWP ACK————Yes Yes
CWP ACK 0xXX ACK — — Yes Yes
CWP ACK 0xXX ACK 0xXX ACK Yes Yes
Page/byte write ACK Address ACK Data NAK Yes No
Protected or
Not protected
SPA0,1 ACK — — — — Yes/No 4No
SPA0,1 ACK 0xXX ACK — — No
SPA0,1 ACK 0xXX ACK 0xXX ACK No
Note 1: 0xXX is defined as ‘don’t care’ byte.
2: N or n = 1, 2, 3, and 4 which describes the EEPROM Block number as shown in Tab le 5- 5.
3: I2C stop command is necessary to execute the instructions.
4: The device responds SPA0,1 Commands with ACK, therefore STOP command is not necessary.
TABLE 5-7: DEVICE RESPONSE WHEN RPA/RPSN11
Status Command ACK Address ACK Data Byte ACK STOP Cmd 2
Not Protected RPSnACK 0xFF NAK 0xFF NAK Yes/No
Protected RPSnNAK 0xFF NAK 0xFF NAK Yes/No
Protected or
Not protected
RPA0ACK 0xFF NAK 0xFF NAK Yes/No
RPA1NAK 0xFF NAK 0xFF NAK Yes/No
Note 1: N or n = 1, 2, 3, and 4 which describes the EEPROM Block number as shown in Tab le 5- 5.
2: Since the responses to these read commands are output on the 9th bit, STOP command is not necessary.
E‘ E‘
MCP98244
DS22327C-page 36 2012-2013 Microchip Technology Inc.
5.3.5 READ OPERATION
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
5.3.5.1 Current Address Read
The MCP98244 contains an address counter that
maintains the address of the last word accessed,
internally incremented by ‘1’. Therefore, if the previous
access (either a read or write operation) was to
address n, the next current address read operation
would access data from address n+1. Upon receipt of
the slave address with R/W bit set to ‘1’, the MCP98244
issues an acknowledge and transmits the 8-bit data
word. The master will not acknowledge (NAK) the
transfer but does generate a Stop condition and the
MCP98244 discontinues transmission (Figure 5-14).
FIGURE 5-14: Reading Current Word Address (See Section 4.0 “Serial Communication”).
1010AA
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678
Address Byte Current Word Address
R
MCP98244 Master
SDA
SCL
00000000
Note: In this example, the current word address is the
previously accessed address location n plus 1.
2012-2013 Microchip Technology Inc. DS22327C-page 37
MCP98244
5.3.5.2 Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is done by sending the word address to the
MCP98244 as part of a write operation. Once the word
address is sent, the master generates a start condition
following the acknowledge. This terminates the write
operation, but not before the internal address pointer is
set. The master then issues the Address Byte again,
but with the R/W bit set to a ‘1’. The MCP98244 then
issues an acknowledge and transmits the 8-bit data
word. The master will not acknowledge the transfer but
does generate a stop condition and the MCP98244
discontinues transmission (Figure 5-15).
FIGURE 5-15: Timing Diagram for Random Read (See Section 4.0 “Serial Communication”).
SDA A
C
K
1010A
Word Address (n)
0000
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
0
Address Byte
MCP98244 MCP98244
W000
1010AA
C
K
N
A
K
S P
2
A
1
A
0
12345678 12345678
Address Byte Data at (n)
R
MCP98244 Master
SDA
SCL
XXXXXXXX
Note: In this example, ‘n’ is the current Address Word which ‘00’h and the data is the byte at address ‘n’.
MCP98244
DS22327C-page 38 2012-2013 Microchip Technology Inc.
5.3.5.3 Sequential Read
Sequential reads are initiated in the same way as a
random read, with the exception that after the
MCP98244 transmits the first data byte, the master
issues an acknowledge, as opposed to a stop condition
in a random read. This directs the MCP98244 to
transmit the next sequentially addressed 8-bit word
(Figure 5-16).
To provide sequential reads, the MCP98244 contains
an internal address pointer, which is incremented by
one at the completion of each operation. This address
pointer allows the entire memory contents to be serially
read during one operation.
FIGURE 5-16: Timing Diagram for Sequential Read (See Section 4.0 “Serial Communication”).
5.3.6 STANDBY MODE
The design will incorporate a low-power Standby mode
(ISHDN). Standby mode will be entered after a normal
termination of any operation and after all internal
functions are complete. This would include any error
conditions occurring, such as improper number of clock
cycles or improper instruction byte as defined
previously.
SDA A
C
K
1010AXXXX
A
C
K
S2
A
1
A
0
12345678 12345678
SCL
X
Address Byte
R
MCP98244 Master
Data at (n+1)
A
C
K
12345678 12345678
Data at (n+2)
Data (n)1
Master Master
XXX
XXXXXXXX XXXXXXXX
Data at (n+m)(1)
XXX XXX
A
C
K
Note 1: ‘n’ is the initial address location and ‘m’ is the final address location (‘n+m’ < 256)
N
A
KP
Master
UPPER
2012-2013 Microchip Technology Inc. DS22327C-page 39
MCP98244
5.4 Summary of Power-On Default
The MCP98244 has an internal Power-On Reset
(POR) circuit. If the power supply voltage VDD glitches
down to the VPOR_TS and VPOR_EE thresholds, the
device resets the registers to the power-on default
settings.
Table 5-8 shows the power-on default summary for the
temperature sensor. The EEPROM resets the address
pointer to 0x00 hex.
TABLE 5-8: MCP98244 TEMPERATURE SENSOR POWER-ON RESET DEFAULTS
Registers Default Register
Data (Hexadecimal) Power-Up Default
Register Description
Address
(Hexadecimal) Register Name
0x00 Capability 0x00EF Event output deasserts in Shutdown
I2C time out 25 ms to 35 ms
Accepts VHV at A0 pin
0.25°C Measurement Resolution
Measures temperature below 0°C
±1°C accuracy over active range
Temperature event output
0x01 CONFIG 0x0000 Comparator mode
Active-Low output
Event and critical output
Output disabled
Event not asserted
Interrupt cleared
Event limits unlocked
Critical limit unlocked
Continuous conversion
0°C Hysteresis
0x02 TUPPER 0x0000 0°C
0x03 TLOWER 0x0000 0°C
0x04 TCRIT 0x0000 0°C
0x05 TA0x0000 0°C
0x06 Manufacturer ID 0x0054 —
0x07 TSE2004av
Device ID/ Device Revision
0x2201 —
0x08 Microchip
Device ID/ Device Revision
0x2201 —
0x09 Resolution 0x0001 0.25°C Measurement Resolution
MCP98244
DS22327C-page 40 2012-2013 Microchip Technology Inc.
NOTES:
2012-2013 Microchip Technology Inc. DS22327C-page 41
MCP98244
6.0 APPLICATIONS INFORMATION
6.1 Layout Considerations
The MCP98244 device does not require any additional
components besides the master controller in order to
measure temperature. However, it is recommended
that a decoupling capacitor of 0.1 µF to 1 µF be used
between the VDD and GND pins. A high-frequency
ceramic capacitor is recommended. It is necessary for
the capacitor to be located as close as possible to the
power and ground pins of the device in order to provide
effective noise protection.
In addition, good PCB layout is key for better thermal
conduction from the PCB temperature to the sensor
die. For good temperature sensitivity, add a ground
layer under the device pins as shown in Figure 6-1.
6.2 Thermal Considerations
A potential for self-heating errors can exist if the
MCP98244 SDA, SCLK and Event lines are heavily
loaded with pull-ups (high current). Typically, the self-
heating error is negligible because of the relatively
small current consumption of the MCP98244. A
temperature accuracy error of approximately 0.5°C
could result from self-heating if the communication pins
sink/source the maximum current specified.
For example, if the Event output is loaded to maximum
IOL, Equation 6-1 can be used to determine the effect
of self-heating.
EQUATION 6-1: EFFECT OF SELF-
HEATING
At room temperature (TA = +25°C) with maximum
IDD = 500 µA and VDD = 3.6V, the self-heating due to
power dissipation T is 0.58°C for the TDFN-8 pack-
age.
FIGURE 6-1: DFN Package Layout.
T
JA VDD IDD VOL_Event IOL_Event VOL_SDA IOL_SDA
+
+
=
Where:
T=T
J - TA
TJ= Junction Temperature
TA= Ambient Temperature
JA = Package Thermal Resistance
VOL_Event, SDA = Event and SDA Output VOL
(0.4 Vmax)
IOL_Event, SDA = Event and SDA Output IOL
(3 mAmax and 20 mAmax,
respectively)
A0
A1
A2
GND
VDD
Event
SCL
SDA
EP9
MCP98244
DS22327C-page 42 2012-2013 Microchip Technology Inc.
NOTES:
LN N L» \le \le NNN
2012-2013 Microchip Technology Inc. DS22327C-page 43
MCP98244
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
Example:
8-Lead 2x3 TDFN
ABR
244
25
Part Number Code
MCP98244T-BE/MNY ABR
8-Lead Plastic Dual Flat, No Lead Package (MN) — 2x3x0.75mm Body [TDFN] <—|e—>>-I N I | NDTE1 {Rig i,,, \\\\ \ \' \\\\ \\\\\ 2x Q 0.15 c \\\\\\\\‘, 1 2 I 2X E- 6 TOP VIEW // 010 c A _ SEAT‘NG PLANE "—I—I—J—f F A3 SIDE VIEW D2 ,\ New o1o® CA‘BI o.05® C BOTTOM VIEW Micmcmp Technology Drawing No. 00471290 Sheet 1 of 2
MCP98244
DS22327C-page 44 2012-2013 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Dual Flat, No Lead Package (MN) — 2x3x0.75mm Body [TDFN] NOTEZ Units MILLIMETERS Dwmensmn Limits MIN 1 NOM | MAX Number of Plns N 8 Pitch e 0.50 BSC Overaii Hewght A 0 70 0 75 0 80 Standofi A1 0.00 0.02 0.05 Contaci Thickness A3 0.20 REF OveraH Length D 2.00 580 Overaii Wwdth E 3.00 BSC Exposed Pad Length D2 1 20 - 1 60 Exposed Pad Width E2 1.20 - 1.50 Contaci Wwdth b 0.20 0.25 0.30 Contact Length L 0.25 0.30 0.45 ContacHorExposed Pad K 0.20 . . Notes: 1. Pm 1 Visual index ieaiure may vary, bui must be located wwthm ihe hatched area. 2. Package may have one or more exposed tie bars at ends 3 Package is saw smguiaied 4 Dwmensiening and toieraneing per ASME v14 5M BSC: Baswc Dwmension TheoretwcaHy exact value shown wwthout tolerances. REF. Reference Dimension. usuaHy wxihout tolerance, for mformation purposes on‘y. Mlcrochwp Technology Drawmg No. 004-1290 Sheet 2 012
2012-2013 Microchip Technology Inc. DS22327C-page 45
MCP98244
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
W2 SILK SCREEN ———:L0000H » E b»! L ' RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MiN \ NOM \ MAX Contact Pitch E 0.50 Bsc Optionai Center Pad Width wz 1.46 Optionai Cenler Pad Length T2 1.36 Contact Pad Spacing Ci 3.00 Contact Pad Wiaih (x0) x1 0.30 Contact Pad Length (x5) Y1 0.75 Disianee Between Pads G 0 20 Notes: 1. Dimensiomng and toierancing per ASME Y14.5M BSC: Basic Dimension. Theoreticaiiy exact vaiue shown without tolerances. Microchip Tecnnuiogy Drawing No 004-21ng
MCP98244
DS22327C-page 46 2012-2013 Microchip Technology Inc.
 !""#$%&'
( !"#$%&"'""($)%
*++&&&!!+$
2012-2013 Microchip Technology Inc. DS22327C-page 47
MCP98244
APPENDIX A: REVISION HISTORY
Revision C (May 2013)
The following is the list of modifications:
1. Updated the operating voltage range from
VDD = 2.2V to 3.6V to VDD = 1.7V to 3.6V.
2. Updated the verbiage throughout the document
relevant to the change in VDD range.
3. Updated Figure 2-1 and Figure 2-4.
4. Incremented the silicon revision ID from 0x00 to
0x01.
Revision B (December 2012)
The following is the list of modification:
• Updated the temperature range in the Serial
Interface Timing Specifications table.
Revision A (December 2012)
• Original Release of this Document.
MCP98244
DS22327C-page 48 2012-2013 Microchip Technology Inc.
NOTES:
.x T 44x
2012-2013 Microchip Technology Inc. DS22327C-page 49
MCP98244
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP98244T: Temperature Sensor (Tape and Reel)
Temperature Range: E = -40°C to +125°C (Extended)
Package: MNY = Plastic Dual Flat, No Lead, (2x3 TDFN),
8-lead (TDFN)
PART NO. /XX
Package
Temperature
Range
Device
Examples:
a) MCP98244T-BE/MNY: Tape and Reel,
Extended Temp.,
8LD 2x3 TDFN package
X
Grade
-X
MCP98244
DS22327C-page 50 2012-2013 Microchip Technology Inc.
NOTES:
YSTEM <2>
2012-2013 Microchip Technology Inc. DS22327C-page 51
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2012-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-220-1
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ ‘MICRDCHIP
DS22327C-page 52 2012-2013 Microchip Technology Inc.
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11/29/12

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