The Photologic discrete components such as the OPL800 family utilize the best of the analog characteristics of the optoelectronic components and the signal processing capabilities of linear integrated circuits and combine the two on one chip.

High Speed Sortation systems are used when a fairly high flow of cases, parcels or items need to flow to different locations.

This application bulletin will compare the two packages and show how the better performance of the plastic part is obtained.

This bulletin is intended to clarify issues relating to laser safety requirements for products, manufacturers and users of Optek OPV Series VCSEL lasers.

This application bulletin addresses the history of these products as well as some of the precautions necessary in handling the hybrid devices developed by TT Electronics / OPTEK Technology.

The GaAs LED is still the workhorse of the industry and will continue to be used in steadily decreasing numbers for the next few years. It will eventually be replaced by GaAIAs as the industry standard.

The OPB720 series of reflective switches are designed for operation in areas that have a reasonable amount of ambient light.

The copper lead frame is an excellent material for both heat and electrical conductivity. This property provides benefits such as higher allowable forward currents (therefore higher output power), which are more easily formed and bent.

The purpose of this bulletin is to introduce these thermal parameters to the reader and provide a way to use them.

This understanding allows reliable system design that encompasses the dissipation rating of the optical semiconductor.

Accumulation Conveyors provide a way to transport packages on the conveyor until given a release signal.

Delivery Optic sensors utilize infrared technology to detect whether the vended product has dropped, guaranteeing that customers either receive their product, or get their money back.

The Dual Photologic discrete components such as the OPL600 family utilize the best of the analog characteristics of the optoelectronic components and the signal processing capabilities of linear integrated circuits and combine the two on one chip.

This bulletin discusses some of the aspects of soldering using an iron, a pot, or a flow bath. This will involve discussions of both hermetic or metal packaged parts and plastic encapsulated parts.

The data contained in this report serves to validate the reliability of these components and stands as Optek’s commitment to continuous product improvement.

Thermal transient testing is a non-destructive way to quickly verify the proper attachment of a two terminal semiconductor die, such as a visible or infrared emitting LED, to a mounting substrate or header.

This application bulletin will discuss many of the variables associated with single channel encoding. This will include design considerations for using booth non-aperture and aperture transistors or Photologic® output devices.

Designers are often faced with conditions that prevent reflective assemblies from being used as specified by the manufacturer.

This bulletin covers the basics of how to use the OPB350 fluid and bubble sensor.

The purpose of this application bulletin is to answer design questions about high-power visible light emitting diodes (LEDs).